Abstract: A blade has an airfoil having a tip. The blade has a metallic substrate and a coating system atop the substrate at the tip. The coating system has: a first layer of at least 99.0% weight nickel; an abrasive layer having a matrix and an abrasive at least partially embedded in the matrix; and a second layer between the first layer and the matrix. The second layer is tougher or more ductile than at least one of the first layer and the matrix.

Abstract: The semiconductor device includes a first electrode, a second electrode electrically coupled to the first electrode, and a third electrodes electrically coupled to at least one of the first and the second electrode, a first plating deposition portion on the first electrode, a second and a third plating deposition portions formed on the second and the third electrode, respectively. The areas of the second and the third plating deposition portion are smaller than the area of the first plating deposition portion. The periphery length of the third plating deposition portion is longer than the periphery length of the second plating deposition portion.

Abstract: A wire comprising a wire core with a surface, the wire core having a coating layer superimposed on its surface, wherein the wire core itself consists of: (a) pure silver consisting of (a1) silver in an amount in the range of from 99.99 to 100 wt.-% and (a2) further components in a total amount of from 0 to 100 wt.-ppm or (b) doped silver consisting of (b1) silver in an amount in the range of from >99.49 to 99.997 wt.-%, (b2) at least one doping element selected from the group consisting of calcium, nickel, platinum, palladium, gold, copper, rhodium and ruthenium in a total amount of from 30 to <5000 wt.-ppm and (b3) further components in a total amount of from 0 to 100 wt.-ppm, or (c) a silver alloy consisting of (c1) silver in an amount in the range of from 89.99 to 99.5 wt.-%, (c2) at least one alloying element selected from the group consisting of nickel, platinum, palladium, gold, copper, rhodium and ruthenium in a total amount in the range of from 0.5 to 10 wt.

Abstract: A first separator constituting a separator member of a fuel cell stack is provided with a first rib that protrudes from the first separator at a portion between a first seal line and a load receiving portion toward a second separator located on the opposite side across an MEA and that extends in a line along the extending direction of the first seal line. An opening is formed in at least one end of the first rib in the extending direction thereof.

Abstract: Provided are conducting members for fuel cells obtained by applying a protective film forming agent to a surface-treated base material having a base material and at least one alloy plating layer formed on the base material in order to form a protective film on the alloy plating layer, and thereafter subjecting the surface-treated base material to an acid treatment. In the conducting members for fuel cells of the present invention, the protective film forming agent preferably contains a mixture of a compound having a thiol group and an azole-based compound, and/or an azole-based compound having a thiol group. In the conducting members for fuel cells of the present invention, the acid treatment is preferably a treatment using sulfuric acid or nitric acid.

Abstract: A method for producing a fuel cell separator capable of ensuring the working accuracy for a separator material. A surface of a mold is provided with grooves, each groove having a depth and width each equivalent to or larger than the thickness of a coating layer and equivalent to or smaller than the thickness of the separator material, the mold including an upper die having a projection/recess pressing surface on which projecting and recessed surfaces extending in a predetermined direction are alternately provided, and a lower die having a projection/recess pressing surface in a shape complementary to that of the pressing surface of the upper die.

Abstract: Provided are electrocatalysts, fuel cells, methods of making fuel cells, and methods of generating an electric current, each featuring a platinum (Pt)-containing substrate in contact with an aqueous solution comprising Pb2+. Electrocatalysts of the invention are formed via underpotential deposition (UPD) when a trace amount of Pb2+ is present in the electrolyte of a half anodic cell for oxidizing formic acid using Pt as the anode. Surprisingly, the UPD process dramatically enhances the activity of formic acid oxidation, at least as much as 10-fold compared with palladium (Pd) black. In an embodiment, the electrocatalyst comprises a Pt-containing substrate, a submonolayer of lead (Pb) adsorbed onto the Pt-containing substrate, and an aqueous solution comprising Pb2+, wherein the concentration of Pb2+ in the aqueous solution is 10 to 500 ?m.

Abstract: In accordance with one embodiment, an electrical contact has a mating end and a mounting end. The electrical contact includes an electrically conductive base, and a multi-layered coating disposed on an outer surface of the base at the mating end. The multi-layered coating can include a metallic layer of a noble metal or alloy thereat: a layer of anti-tarnish material disposed on the metallic layer, and a lubricant layer disposed on the layer of anti-tarnish material, the lubricant effective to seal at least some wear regions created in the layer of anti-tarnish material due to micromotion of the mating end in use.

Abstract: A solution for providing electroless deposition of a metal layer on a substrate is provided. A solvent is provided. A metal precursor is provided to the solvent. A first borane containing reducing agent is provided to the solvent. A second borane containing reducing agent is provided to the solvent, wherein the first borane containing reducing agent has a deposition rate of at least five times a deposition rate of the second borane containing reducing agent, and wherein the solution is free of nonborane reducing agents.

Abstract: To provide a metal separator for fuel cells that can equalize the wet environment of a membrane electrode assembly and a manufacturing method thereof. A metal separator for fuel cells and a manufacturing method thereof are characterized in that, a first separator (14) made of metal, which is layered in a membrane electrode assembly (12) to which a pair of electrodes is provided on both sides of a solid polymer electrolyte membrane (120), is formed into a corrugated sheet shape having convex parts and concaved parts, a noble metal thin film (147) is formed on a convex part (145) of the first separator (14), and holes (148) through which the first separator (14) is exposed are formed in the noble metal thin film (147).

Abstract: A solution for providing electroless deposition of a metal layer on a substrate is provided. A solvent is provided. A metal precursor is provided to the solvent. A first borane containing reducing agent is provided to the solvent. A second borane containing reducing agent is provided to the solvent, wherein the first borane containing reducing agent has a deposition rate of at least five times a deposition rate of the second borane containing reducing agent, and wherein the solution is free of nonborane reducing agents.

Abstract: An opto-electric hybrid board which is excellent in the mountability of an optical element and in flexibility is provided. The opto-electric hybrid board includes an electric circuit board, an optical waveguide, and metal layers. The electric circuit board includes an insulative layer having front and back surfaces, and optical element mounting pads formed on the front surface of the insulative layer. The optical waveguide includes a first cladding layer, and is formed on the back surface of the insulative layer of the electric circuit board in such a manner that the first cladding layer is in contact with the back surface of the insulative layer. The metal layers are provided between the insulative layer and the first cladding layer and disposed in corresponding relation to the optical element mounting pads.

Abstract: A fuel cell includes a first valve metal flow field plate. The first valve metal flow field plate has a first cooling channel adapted to receive an aqueous coolant and to contact the aqueous coolant at a position that inhibits the formation of shunt currents when the fuel cell is incorporated in a fuel cell stack. A field assembly includes a first metal flow field plate having a first cooling channel adapted to receive an aqueous coolant is also provided. A valve metal plate is disposed over the first metal flow field plate in the flow field assembly. Fuel cell stacks using the valve metal-containing flow field plates are also provided.

Abstract: The present invention relates to a method for electroless deposition of a bendable nickel-phosphorous alloy layer onto flexible substrates such as flexible printed circuit boards and the like. The nickel-phosphorous alloy layer is deposited from an aqueous plating bath comprising nickel ions, hypophosphite ions, at least one complexing agent and a grain refining additive selected from the group consisting of formaldehyde and formaldehyde precursors. The nickel-phosphorous alloy layers obtained have a columnar microstructure oriented perpendicular to the flexible substrate and are sufficiently bendable.

Abstract: An electrical component includes an interior layer that includes an exterior surface. The electrical component includes an intermediate layer that includes at least one platinum group metal (PGM). The intermediate layer extends on the exterior surface of the interior layer. The intermediate layer has an exterior PGM surface. The electrical component includes a silver layer that includes silver. The silver layer extends on the exterior PGM surface such that the intermediate layer extends between the interior layer and the silver layer.

Abstract: There is provided an electrode pad including: a connection terminal part; a first plating layer including palladium phosphorus (Pd—P) formed on the connection terminal part; and a second plating layer including palladium (Pd) formed on the first plating layer.

Abstract: An alloy wire made of a material selected from one of a group consisting of a silver-gold alloy, a silver-palladium alloy and a silver-gold-palladium alloy is provided. The alloy wire is with a polycrystalline structure of a face-centered cubic lattice and includes a plurality of grains. A central part of the alloy wire includes slender grains or equi-axial grains, and the other parts of the alloy wire consist of equi-axial grains. A quantity of the grains having annealing twins was 20 percent or more of the total quantity of the grains of the alloy wire.

Abstract: Aspects of the present disclosure are directed to electrochemical approaches for synthesis of platinum-iridium alloys with selected platinum-iridium ratio content and subsequently predetermined mechanical properties and electrochemical impedance properties. Such can provide a simple and cost-effective process for preparing these electrodes, as compared to conventional thin film processing techniques. A three-electrode electrochemical electrodeposition system is described including an electrochemical cell with a working electrode on which the electrodeposited film is deposited, a counter electrode to complete the electrochemical circuit and a reference electrode to measure and control surface potential. Mixed layers of platinum atoms and iridium atoms can be deposited from electrolyte solution onto the working electrode surface to create an electrically conductive surface with material properties related to the composition of the as-deposited film.

Abstract: Coated articles and methods for applying coatings including a rhodium layer are described. In some cases, the coating can exhibit desirable properties and characteristics such as durability, corrosion resistance, and high conductivity. The articles may be coated, for example, using an electrodeposition process.

Abstract: Provided is a substrate structure including: a base substrate on which a conductive pattern is formed; a first plating layer covering the conductive pattern; and a second plating layer covering the first plating layer, wherein the first plating layer includes an electroless reduction plating layer.

Abstract: A seed film and methods incorporating the seed film in semiconductor applications is provided. The seed film includes one or more noble metal layers, where each layer of the one or more noble metal layers is no greater than a monolayer. The seed film also includes either one or more conductive metal oxide layers or one or more silicon oxide layers, where either layer is no greater than a monolayer. The seed film can be used in plating, including electroplating, conductive layers, over at least a portion of the seed film. Conductive layers formed with the seed film can be used in fabricating an integrated circuit, including fabricating capacitor structures in the integrated circuit.

Abstract: The present invention relates generally to a coated jewelry article or a coated component of a jewelry article, comprising a jewelry article or a component of a jewelry article, a first metallic coating, and a second metallic coating.

Abstract: The present invention relates generally to jewelry articles comprising a substrate and a metallic, external coating.

Abstract: An article may include a substrate, a diffusion barrier layer formed on the substrate, and a protective layer formed on the diffusion barrier coating. The diffusion barrier layer may include iridium.

Abstract: There is provided an electrode pad including: a connection terminal part; a first plating layer including palladium phosphorus (Pd—P) formed on the connection terminal part; and a second plating layer including palladium (Pd) formed on the first plating layer.

Abstract: A mixed powder of an Ni—Al alloy and alumina is produced by heating a first mixed powder, which is prepared by mixing an Ni—Al mixed powder as prepared by mixing an Al powder with Ni in such a manner that Al therein could fall within a range of from 25 atomic % to 60 atomic %, and an alumina powder in a range of from 40% by mass to 60% by mass, in vacuum or in an inert gas atmosphere at a temperature falling within a range of from 600° C. to 1300° C. for at least 1 hour, and then grinding the resulting product.

Abstract: Coated articles and methods for applying coatings are described. In some cases, the coating can exhibit desirable properties and characteristics such as durability, corrosion resistance, and high conductivity. The articles may be coated, for example, using an electrodeposition process.

Abstract: A coated article is provided. A coated article includes a composite substrate made from carbon fiber and zirconium diboride. A chromium layer is deposited on the substrate. A chromium diffusing layer is formed between the substrate and the chromium layer. A chromium-nitrogen layer is deposited on the chromium layer. A iridium layer is deposited on the chromium-nitrogen layer opposite to the chromium layer, wherein the chromium-nitrogen layer includes a first chromium-nitrogen layer and a second chromium-nitrogen layer. The first chromium-nitrogen layer abuts the chromium layer. The second chromium-nitrogen layer abuts the iridium layer. The atomic nitrogen content in the first chromium-nitrogen layer gradually increases with the thickness of the first chromium-nitrogen layer. The atomic nitrogen content in the second chromium-nitrogen layer gradually decreases with the thickness of the second chromium-nitrogen layer.

Abstract: Coated articles and methods for applying coatings are described. The article may include a base material and a coating comprising silver formed thereon. In some embodiments, the coating comprises a silver-based alloy, such as a silver-tungsten alloy. The coating may, in some instances, include at least two layers. For example, the coating may include a first layer comprising a silver-based alloy and a second layer comprising a precious metal. The coating can exhibit desirable properties and characteristics such as durability (e.g., wear), hardness, corrosion resistance, and high conductivity, which may be beneficial, for example, in electrical and/or electronic applications. In some cases, the coating may be applied using an electrodeposition process.

Abstract: Embodiments of the current invention describe a method of plating platinum selectively on a copper film using a self-initiated electroless process. In particular, platinum films are plated onto very thin copper films having a thickness of less than 300 angstroms. The electroless plating solution and the resulting structure are also described. This process has applications in the semiconductor processing of logic devices, memory devices, and photovoltaic devices.

Abstract: An alloy wire made of a material selected from one of a group consisting of a silver-gold alloy, a silver-palladium alloy and a silver-gold-palladium alloy is provided. The alloy wire is with a polycrystalline structure of a face-centered cubic lattice and includes a plurality of grains. A central part of the alloy wire includes slender grains or equi-axial grains, and the other parts of the alloy wire consist of equi-axial grains. A quantity of the grains having annealing twins was 20 percent or more of the total quantity of the grains of the alloy wire.

Abstract: A new substrate makes it possible to modify surface properties relating to biocompatibility. Said substrate has an electron donating surface, characterized in having metal particles on said surface, said metal particles comprising palladium and at least one metal chosen from gold, ruthenium, rhodium, osmium, iridium, and platinum, wherein the amount of said metal particles is from about 0.001 to about 8 ?g/cm2. The substrate is suggested for different uses, such as for modifying the hydrophobicity, protein adsorption; tissue ingrowth, complement activation, inflammatory response, thrombogenicity, friction coefficient, and surface hardness.

Abstract: Coated articles and methods for applying coatings are described. The article may include a base material and a coating comprising silver formed thereon. In some embodiments, the coating comprises a silver-based alloy, such as a silver-tungsten alloy. The coating may, in some instances, include at least two layers. For example, the coating may include a first layer comprising a silver-based alloy and a second layer comprising a precious metal. The coating can exhibit desirable properties and characteristics such as durability (e.g., wear), hardness, corrosion resistance, and high conductivity, which may be beneficial, for example, in electrical and/or electronic applications. In some cases, the coating may be applied using an electrodeposition process.

Abstract: A seed film and methods incorporating the seed film in semiconductor applications is provided. The seed film includes one or more noble metal layers, where each layer of the one or more noble metal layers is no greater than a monolayer. The seed film also includes either one or more conductive metal oxide layers or one or more silicon oxide layers, where either layer is no greater than a monolayer. The seed film can be used in plating, including electroplating, conductive layers, over at least a portion of the seed film. Conductive layers formed with the seed film can be used in fabricating an integrated circuit, including fabricating capacitor structures in the integrated circuit.

Abstract: A plated article has an alloy thin film formed on a substrate and having a catalytically active metal (A) for electroless plating and a metal (B) capable of undergoing displacement plating with a metal ion contained in an electroless plating solution, and a metal thin film formed on the alloy thin film by electroless displacement and reduction plating. The alloy thin film of the catalytically active metal (A) and the metal (B) capable of displacement plating has a composition comprising 5 at % to 40 at % of the metal (A). The metal thin film formed by electroless displacement and reduction plating is a metal thin film having a thickness no greater than 10 nm and a resistivity no greater than 10 ??·cm. Preferably, the metal (B) has a barrier function with respect to a metal of the metal thin film.

Abstract: A platinum plating solution for immersion plating a continuous film of platinum on a metal structure. The immersion platinum plating solution is free of a reducing agent. The plating process does not require electricity (e.g., electrical current) and does not require electrodes (e.g., anode and/or cathode). The solution includes a platinum source and a complexing agent including Oxalic Acid. The solution enables immersion plating of platinum onto a metal surface, a metal substrate, or a structure of which at least a portion is a metal. The resulting platinum plating comprises a continuous thin film layer of platinum having a thickness not exceeding 300 ?. The solution can be used for plating articles including but not limited to jewelry, medical devices, electronic structures, microelectronics structures, MEMS structures, nano-sized or smaller structures, structures used for chemical and/or catalytic reactions (e.g., catalytic converters), and irregularly shaped metal surfaces.

Abstract: An alloy including: about 10 at % to about 30 at % of a Pt-group metal; less than about 23 at % Al; about 0.5 at % to about 2 at % of at least one reactive element selected from Hf, Y, La, Ce and Zr, and combinations thereof; a superalloy substrate constituent selected from the group consisting of Cr, Co, Mo, Ta, Re and combinations thereof; and Ni; wherein the Pt-group metal, Al, the reactive element and the superalloy substrate constituent are present in the alloy in a concentration to the extent that the alloy has a solely ??-Ni3Al phase constitution.

Abstract: A platinum plating solution for immersion plating a continuous film of platinum on a metal structure. The immersion platinum plating solution is free of a reducing agent. The plating process does not require electricity (e.g., electrical current) and does not require electrodes (e.g., anode and/or cathode). The solution includes a platinum source and a complexing agent including Oxalic Acid. The solution enables immersion plating of platinum onto a metal surface, a metal substrate, or a structure of which at least a portion is a metal. The resulting platinum plating comprises a continuous thin film layer of platinum having a thickness not exceeding 300 ?. The solution can be used for plating articles including but not limited to jewelry, medical devices, electronic structures, microelectronics structures, MEMS structures, nano-sized or smaller structures, structures used for chemical and/or catalytic reactions (e.g., catalytic converters), and irregularly shaped metal surfaces.

Abstract: A component assembly for use in living tissue comprises: a ceramic part; a metal part, e.g., a titanium metal; and a palladium (Pd) interlayer for bonding said ceramic part to the metal part. By applying sufficient heat to liquify a palladium-titanium interface, the Pd interlayer is used to braze the ceramic part to the titanium part to yield a hermetic seal.

Abstract: A flexible thin metal film thermal sensing system is provided. A thermally-conductive film made from a thermally-insulating material is doped with thermally-conductive material. At least one layer of electrically-conductive metal is deposited directly onto a surface of the thermally-conductive film. One or more devices are coupled to the layer(s) to measure an electrical characteristic associated therewith as an indication of temperature.

Abstract: Electronic assemblies including coreless substrates having a surface finish, and their manufacture, are described. One method includes electrolytically plating a first copper layer on a metal core in an opening in a patterned photoresist layer. A gold layer is electrolytically plated on the first copper layer in the opening. An electrolytically plated palladium layer is formed on the gold layer. A second copper layer is electrolytically plated on the palladium layer. After the electrolytically plating the second copper layer, the metal core and the first copper layer are removed, wherein a coreless substrate remains. Other embodiments are described and claimed.

Abstract: Coated articles and methods for applying coatings are described. The article may include a base material and a coating comprising silver formed thereon. In some embodiments, the coating comprises a silver-based alloy, such as a silver-tungsten alloy. The coating may, in some instances, include at least two layers. For example, the coating may include a first layer comprising a silver-based alloy and a second layer comprising a precious metal. The coating can exhibit desirable properties and characteristics such as durability (e.g., wear), hardness, corrosion resistance, and high conductivity, which may be beneficial, for example, in electrical and/or electronic applications. In some cases, the coating may be applied using an electrodeposition process.

Abstract: Palladium-seeded, dendritic platinum nanostructures that are useful as electrocatalysts and methods for preparing such nanostructures. The palladium-platinum nanostructures may be incorporated into fuel cell electrodes including fuel cells that include a proton exchange membrane (PEM).

Abstract: A laser diode comprising a first separate confinement heterostructure and an active region on the first separate confinement heterostructure. A second separate confinement heterostructure is on the active region and one or more epitaxial layers is on the second separate confinement heterostructure. A ridge is formed in the epitaxial layers with a first mesa around the ridge. The first mesa is 0.1 to 0.2 microns above the second confinement heterostructure.

Abstract: A metal member is manufactured that has a plating layer of precious metal on the surface of a bare metal portion formed of a predetermined metal. First, a surface layer of the bare metal portion is removed. Then, a plating of precious metal is applied to the portion where the surface layer of the bare metal portion was removed. Then, the metal member is heat treated in an inert atmosphere. As a result, a metal member can be manufactured that has less carbide and hydrogen near a boundary surface of the plating layer and the bare metal portion than it would if the removing step and the heat treating step were not performed. With a metal member manufactured in this way, the plating layer does not easily peel away.

Abstract: Orientation degree and smoothness of a substrate surface better than those of conventional ones are provided in a textured substrate for epitaxial thin film growth. The present invention is a textured substrate for epitaxial film formation, including a crystal orientation improving layer made of a metal thin film of 1 to 5000 nm in thickness on the surface of the textured substrate for epitaxial film formation having a textured metal layer at least on one surface, wherein differences between orientation degrees (?? and ??) in the textured metal layer surface and orientation degrees (?? and ??) in the crystal orientation improving layer surface are both 0.1 to 3.0°. Further, when another metal different from the metal constituting this textured substrate crystal orientation improving layer is added equivalent to a thin film which is 30 nm or less, and subsequently is subjected to heat treatment, the smoothness of that surface can be improved.

Abstract: The present invention is directed at a decorative article which has a particular noble metal-containing outer layer sequence. The invention further relates to a coating process suitable for this purpose. The layer sequence is characterized in that a palladium-containing bottom layer is followed by an electrolytically deposited alloy of ruthenium and an element of the group consisting of platinum and rhodium.

Abstract: An alloy including a Pt-group metal, Ni and Al in relative concentration to provide a ?-Ni+??-Ni3Al phase constitution, and a coating including the alloy.

Abstract: A contact pin includes a base material composed of a material having a conductive property and an outermost surface layer made of a material into which Sn is dissolved and diffused by applying heat.

Abstract: The invention relates to tuned multifunctional linker molecules for charge transport through organic-inorganic composite structures. The problem underlying the present invention is to provide multifunctional linker molecules for tuning the conductivity in nanoparticle-linker assemblies which can be used in the formation of electronic networks and circuits and thin films of nanoparticles. The problem is solved according to the invention by providing a multifunctional linker molecule of the general structure CON1-FUNC1-X-FUNC2-CON2 in which X is the central body of the molecule, FUNC1 and FUNC2 independently of each other are molecular groups introducing a dipole moment and/or capable of forming inter-molecular and/or intramolecular hydrogen bonding networks, and CON1 and CON2 independently of each other are molecular groups binding to nanostructured units comprising metal and semiconductor materials.