Abstract: An improved protected graphics assembly according to the invention comprises the following sequential layers: optionally, at least one adhesive layer; at least one graphics layer; and at least one outwardly exposed polymer layer that is essentially free of low surface energy materials and has a gloss value of greater than 90 when tested according to ASTM D2457-03 at a 60-degree angle. The assembly is beneficially applied to a variety of articles and used in a variety of related methods. In an exemplary embodiment, a race car comprises a protected graphics assembly that comprises: optionally, at least one adhesive layer; at least one outwardly exposed polymer layer that is essentially free of low surface energy materials; and at least one graphics layer substantially protected from exterior exposure by the polymer layer.

Abstract: The present invention realizes a card-use resin composition that exhibits beautiful colors and that has high laser-marking coloring properties, a card-use resin sheet formed with the card-use resin composition, and a card. The above problem has been solved by a card-use resin composition containing a laser coloring agent and a thermoplastic resin, wherein the thermoplastic resin contains a polycarbonate resin, and the laser coloring agent contains at least one type of black pigment, the primary particle diameter of the black pigment being 40 to 80 nm, and the amount of the black pigment with respect to the entire mass of the card-use resin composition being 20 to 40 mass ppm.

Abstract: The purpose is to provide an organic EL display device which has good sensitivity and is free from the occurrence of luminance decrease or pixel shrinkage, thereby having excellent long-term reliability. In order to achieve the above-described purpose, provided is the following configuration. Namely, an organic EL display device wherein an insulating layer formed on a first electrode is a cured film obtained by curing a photosensitive resin composition; and the residual amount of acid anhydrides contained in the cured film is from 0.003 to 0.04 (inclusive) when the residual amount of aromatic rings contained in the cured film is taken as 1 (the reference value).

Abstract: A portable hydropower module is provided for the generation of economical hydroelectric power at low-head sites, such as dams and weirs. More particularly, the portable hydropower modules are able to streamline the construction of power generation facilities and improve the economics of hydropower development for low-head sites. The portable hydropower modules may be produced off-site and then transported, such as by floating, to the designated low-head site. The portable hydropower modules may be specifically designed to efficiently facilitate the energy capabilities at the chosen low-head sites.

Abstract: A transfer film including a temporary support and a photosensitive transparent resin layer located on the temporary support, in which the photosensitive transparent resin layer includes (A) a binder polymer, (B) a photopolymerizable compound having an ethylenic unsaturated group, (C) a photopolymerization initiator, and (D) a rosin compound can be used to form electrode protective films for electrostatic capacitance-type input devices which have a low moisture permeability and are excellent in terms of heat and moisture resistance after the supply of saline water; an electrode protective film for an electrostatic capacitance-type input device; a laminate; a method for manufacturing the laminate; and an electrostatic capacitance-type input device.

Abstract: A system and method for depositing a photoresist and utilizing the photoresist are provided. In an embodiment a deposition chamber is utilized along with a first precursor material comprising carbon-carbon double bonds and a second precursor material comprising repeating units to deposit the photoresist onto a substrate. The first precursor material is turned into a plasma in a remote plasma chamber prior to being introduced into the deposition chamber. The resulting photoresist comprises a carbon backbone with carbon-carbon double bonds.

Abstract: Substrates suitable for use in a touch sensor are described. In some cases, the substrates include an inner layer and first and second heat-set polymeric outer layers. The first and second outer layers each have an in-plane birefringence of less than 0.1. The inner layer is substantially uniaxially birefringent and has an in-plane birefringence greater than 0.01. In some cases, a substrate includes a block copolymer which includes a first polyester and second polyester. The first polyester has a melting point greater than 200 ° C., and the second polyester having a melting point less than 200° C. The block copolymer includes the second polyester at 50 to 80 percent by weight. The substrate is substantially uniaxially birefringent and has an in-plane birefringence between 0.001 and 0.1.

Abstract: Printing layers and films for printing are disclosed. Methods for preparing such films also are disclosed.

Abstract: The present invention provides a method of forming a pattern that can form a precise pattern on a variety of media by using powders and provides a pattern-producing apparatus. The method of forming a pattern includes providing a liquid pattern on a surface of a medium, applying a powder to the liquid pattern so as to adhere to the liquid pattern, removing the powdery particles of the powder not adhered to the liquid pattern to give a pattern of the powder, and further applying another powder to the pattern of the powder.

Abstract: Provided is a textile printing paper for use in a paper printing method, the textile printing paper being excellent in color development on a printing substrate, transferred unevenness suppressing property and strike-through resistance while satisfying the requirements for adhesiveness of a printed paper to a printing substrate. The textile printing paper comprises a base paper and a glue layer on a surface of the base paper, the base paper having a sizing degree of 10 g/m2 to 40 g/m2 as measured according to JIS P 8140:1998.

Abstract: There is provided a composition, wherein when a film is formed to have a film thickness of 1 ?m, light transmittance in a thickness direction of the film has a maximum value of 20% or less at a wavelength in a range of 400 to 750 nm, and light transmittance in a thickness direction of the film has a minimum value of 90% or more at a wavelength in a range of 900 to 1,300 nm, and an infrared transmission filter formed with the composition, a method for manufacturing an infrared transmission filter, and an infrared sensor comprising the infrared transmission filter.

Abstract: A method of manufacturing a pattern includes providing a pattern of a first liquid on a medium, applying a powder material to the provided pattern, and providing a second liquid to the powder material applied to the first liquid.

Abstract: Provided is a colored photo-sensitive composition having a high sensitivity and a good developablity, even if the ratio of content of a pigment, relative to the total solids of the colored photo-sensitive composition, is 20% by mass or more. The colored photo-sensitive composition includes (A) a resin which is increased, by action of an acid, in solubility into an alkali developing solution; (B) a pigment; (C) a compound which produces an acid upon irradiated by active light or radial ray; and (D) a solvent, wherein the ratio of content of the (B) pigment, relative to the total solids of the colored photo-sensitive composition, is 20% by mass or more.

Abstract: Provided is a colored photo-sensitive composition having a high sensitivity and a good developablity, even if the ratio of content of a pigment, relative to the total solids of the colored photo-sensitive composition, is 20% by mass or more. The colored photo-sensitive composition includes (A) a resin which is increased, by action of an acid, in solubility into an alkali developing solution; (B) a pigment; (C) a compound which produces an acid upon irradiated by active light or radial ray; and (D) a solvent, wherein the ratio of content of the (B) pigment, relative to the total solids of the colored photo-sensitive composition, is 20% by mass or more.

Abstract: A release film for soft composite materials is provided. The release film contains a film with a closely packed self-assembled monolayer. A method of applying soft composite materials to a substrate without loss of the soft composite material to the release film is also provided. The method is useful in applications such as applying thermal pastes to semiconductor packaging.

Abstract: The present invention provides a two component geopolymer composition of wherein one component comprises a dry mix of an aluminosilicate, such as flyash, geopolymer precursor and one or more epoxy multilayer polymer particle redispersible polymer powder (RDP) having an epoxy resin core and an alkali soluble polymer shell, the epoxy resin having a calculated glass transition temperature (Tg) of from 7 to 45° C., and, wherein the other component, comprises one or more alkaline silicate geopolymer precursor, preferably in the form of an aqueous solution. The two-component compositions having from 1 to 20 wt. % of the RDP, based on solids, and provide greater formulation flexibility to make geopolymer compositions having improved tensile strength.

Abstract: The invention relates to a masking layer. The masking layer produced by coating a white-color photosensitive resin composition on a peripheral region of a transparent substrate, developing the white-color photosensitive resin composition to obtain a patterned composition layer, coating a gray-color photosensitive resin composition on the cured composition layer and developing the gray-color photosensitive resin composition, so that the gray-color photosensitive resin composition is cured to obtain the masking layer having an optical density (O.D.) of ?3.5. The masking layer is adapted for use on a touch panel or a flat panel display device. The masking layer shows a white color appearance when viewed from outside and serves as a white color decoration around the peripheral region of the device. The masking layer further comprises a gray colored sub-layer to mask the electrical circuitry disposed beneath the masking layer.

Abstract: A conductive pattern can be formed a reactive polymer comprising pendant tertiary alkyl ester groups, (b) a compound that provides an acid upon exposure to radiation, (c) a crosslinking agent that is capable of reacting in the presence of the acid, and (d) optionally, a photosensitizer. The polymeric layer is patternwise exposed to provide non-exposed regions and exposed regions comprising a polymer comprising carboxylic acid groups. Both the non-exposed regions and the exposed regions of the polymeric layer are contacted with a reducing agent, bleached to remove surface amounts of the reducing agent in both non-exposed and exposed regions of the polymeric layer, and contacted with electroless seed metal ions to oxidize the reducing agent and to form corresponding electroless seed metal nuclei in the exposed regions. The corresponding electroless seed metal nuclei are then electrolessly plated with a conductive metal.

Abstract: The photosensitive resin composition contains a (A) binder polymer, (B) cross-linked polymer particles, (C) thermosetting resin, (D) photo-polymerization initiator, and a (E) phosphoric flame retardant, in which a content of the (B) cross-linked polymer particles is 30 parts by weight to 100 parts by weight with respect to the 100 parts by weight of the (A) binder polymer, and an average particle diameter of the (B) cross-linked polymer particles is 1 ?m to 10 ?m. Therefore, the photosensitive resin composition (i) obtains an excellent tack-free property after being applied and dried, (ii) can be subjected to fine processing, (iii) is formed into a cured film having excellent flexibility, flame retardancy, and electrical insulation reliability, and (iv) causes a substrate to have a small warpage after being cured.

Abstract: A pattern is printed by forming a photoresist layer on a wafer, forming a protective film thereon, exposure, and development. The protective film is formed from a protective film-forming composition comprising a novolak resin of a bisphenol compound and a mixture of an alcohol solvent and an ether or aromatic solvent.

Abstract: A chemically amplified negative resist composition is provided comprising (A) a resin having a crosslinking group, (B) a crosslinker, (C) a photoacid generator capable of generating an acid upon exposure to light of wavelength 190-500 nm, (D) a solvent, and (E) an isocyanuric acid. The resist composition overcomes the stripping problem that the film is stripped from metal wirings of Cu or Al, electrodes, and SiN substrates.

Abstract: A pattern forming method contains: (i) a step of forming a bottom anti-reflective coating on a substrate by using a first resin composition (I), (ii) a step of forming a resist film on the bottom anti-reflective coating by using a second resin composition (II), (iii) a step of exposing a multi-layered film having the bottom anti-reflective coating and the resist film, and (iv) a step of developing the bottom anti-reflective coating and the resist film in the exposed multi-layered film by using an organic solvent-containing developer to form a negative pattern.

Abstract: A monomer has the Formula I: wherein R1, R2, and R3 are each independently a C1-30 monovalent organic group, and R1, R2, and R3 are each independently unsubstituted or include a halogen, nitrile, ether, ester, ketone, alcohol, or a combination comprising at least one of the foregoing functional groups; R4 includes H, F, C1-4 alkyl, or C1-4 fluoroalkyl; A is a single bond or a divalent linker group, wherein A is unsubstituted or substituted to include a halogen, nitrile, ether, ester, ketone, alcohol, or a combination comprising at least one of the foregoing functional groups; m and n are each independently an integer of 1 to 8; and x is 0 to 2n+2, and y is 0 to 2m+2.

Abstract: A coating including an oligomer is disclosed, the oligomer being the reaction product of an epoxy silane, a multifunctional (meth)acrylate; and a polymerizable fluorochemical. The polymerizable fluorochemical can be fluorinated (meth)acrylate or a polymerizable fluorinated urethane. Phototools having a layer of the coating on a substrate can be made. A method of making a printed assembly such as a printed circuit board is also disclosed.

Abstract: The present invention involves a method for making a relief image. A film that includes a carrier sheet and an imageable material is used to form a mask image that is opaque to a curing radiation. In one embodiment, the mask image is formed on the carrier sheet while in another embodiment, the mask image is formed on a receptor sheet. The mask image is then transferred to a photosensitive material, such as a flexographic printing plate precursor. The resulting assembly is exposed to the curing radiation resulting in exposed and unexposed areas of the photosensitive material. The carrier sheet or the receptor sheet may be removed from the mask image either before or after exposure to the curing radiation. Finally, the photosensitive material and mask image assembly is developed with a suitable developer to form a relief image.

Abstract: The present invention involves a method for making a relief image. A film that includes a carrier sheet and an imageable material is used to form a mask image that is opaque to a curing radiation. In one embodiment, the mask image is formed on the carrier sheet while in another embodiment, the mask image is formed on a receptor sheet. The mask image is then transferred to a photosensitive material, such as a flexographic printing plate precursor. The resulting assembly is exposed to the curing radiation resulting in exposed and unexposed areas of the photosensitive material. The carrier sheet or the receptor sheet may be removed from the mask image either before or after exposure to the curing radiation. Finally, the photosensitive material and mask image assembly is developed with a suitable developer to form a relief image.

Abstract: A resist underlayer composition, including a solvent, and an organosilane condensation polymerization product including about 10 to about 40 mol % of a structural unit represented by Chemical Formula 1:

Abstract: Present embodiments generally relate to a novel clear or colorless overcoat composition that may be used for overcoating, for example, ink based images and xerographic images. The overcoat composition, which may be used as a base for a clear solid ink, comprises one or more waxes. Also included in the present embodiments is methods for using and stabilizing the overcoat composition as a solid ink.

Abstract: According to one embodiment, there is provided a method of forming a pattern including forming a polymer layer on a substrate, the polymer layer including a first and second regions, selectively irradiating either of the first and second regions with energy rays or irradiating the first and second regions with energy rays under different conditions to cause a difference in surface free energy between the first and second regions, thereafter, forming a block copolymer layer on the polymer layer, and causing microphase separation in the block copolymer layer to simultaneously form first and second microphase-separated structures on the first and second regions, respectively.

Abstract: A mask-forming film has a transparent layer between the imageable layer and the carrier sheet, which transparent layer has a refractive index that is lower (by at least 0.04) than that of the carrier sheet or any immediately adjacent layer between it and the carrier sheet. This lower refractive index layer modifies the path of incident radiation during mask image transfer so as to provide steeper shoulder angles in the relief image solid areas. This mask film is used to form a relief image such as in a flexographic printing plate.

Abstract: A photoresist composition including an oxetane-containing compound represented by Formula 1 or 2, an oxirane-containing compound represented by Formula 3 or 4, a photoinitiator, and a solvent, a method of forming a pattern using the photoresist composition, and an inkjet print head including a polymerization product of the photoresist composition. The photoresist composition provides a polymerization product which resists formation of cracks due to an inner stress, and has excellent heat tolerance, excellent chemical resistance, excellent adhesiveness, and excellent durability.

Abstract: The present invention involves a method for making a relief image. A film that includes a carrier sheet and an imageable material is used to form a mask image that is opaque to a curing radiation. In one embodiment, the mask image is formed on the carrier sheet while in another embodiment, the mask image is formed on a receptor sheet. The mask image is then transferred to a photosensitive material, such as a flexographic printing plate precursor. The resulting assembly is exposed to the curing radiation resulting in exposed and unexposed areas of the photosensitive material. The carrier sheet or the receptor sheet may be removed from the mask image either before or after exposure to the curing radiation. Finally, the photosensitive material and mask image assembly is developed with a suitable developer to form a relief image.

Abstract: Organic coating composition are provided including antireflective coating compositions that can reduce reflection of exposing radiation from a substrate back into an overcoated photoresist layer and/or function as a planarizing or via-fill layer. Preferred compositions of the invention comprise contain a crosslinker component that is resistant to sublimination or other migration crosslinker from the composition coating layer during lithographic processing.

Abstract: An antireflective coating that contains at least two polymer components and comprises chromophore moieties and transparent moieties is provided. The antireflective coating is useful for providing a single-layer composite graded antireflective coating formed beneath a photoresist layer.

Abstract: Disclosed is a positive photosensitive resin composition containing (A) an alkali-soluble resin, (B) a diazoquinone compound, (d1) an activated silicon compound and (d2) an aluminum complex. Also disclosed is a positive photosensitive resin composition containing (A) an alkali-soluble resin, (B) a diazoquinone compound, (C) a compound having two or more oxetanyl groups in one molecule and (D) a catalyst for accelerating the ring-opening reaction of the oxetanyl groups of the compound (C).

Abstract: The intensity distribution of an optical image in a resist film is calculated (S1); the intensity distribution of the optical image is transformed through a Fourier transform in a periodic direction of the intensity distribution of the optical image (S2) and is transformed through a spectral transform in an aperiodic direction of the intensity distribution of the optical image by use of a base which satisfies a boundary condition (S3); a modulation function for modulating the intensity distribution of the optical image is transformed through a Fourier transform in the periodic direction (S4) and is transformed through a spectral transform in the aperiodic direction by use of the base satisfying the boundary direction (S5); a product of the post-transformed intensity distribution of the optical image and the post-transformed modulation function is computed (S6), is transformed through an inverse Fourier transform in the periodic direction (S7), and is transformed through an inverse spectral transform in the ap

Abstract: An ink formulation comprises a marking component, e.g. ammonium octamolybdate, and a metal salt that absorbs laser irradiation at 780-2500 nm, e.g. reduced indium tin oxide, and thereby causes the marking component to change colour.

Abstract: Mask patterns include a resist pattern and a gel layer on a surface of the resist pattern having a junction including hydrogen bonds between a proton donor polymer and a proton acceptor polymer. Methods of forming the mask patterns and methods of fabricating a semiconductor device using the mask patterns as etching masks are also provided.

Abstract: A heat resistant photosensitive resin composition having excellent film properties is provided by constituting a photosensitive resin composition containing (A) a polymer having an acid functional group and/or a substituent derived therefrom, (B) a compound having at least one substituent derived from an amine functional group, (C) a photoreactive compound, and (D) a solvent. Using this composition, a pattern with high resolution can be produced, and thus an electronic part having a high quality can be produced.

Abstract: The present invention relates to an aqueous coating composition for coating a photoresist pattern comprising a polymer containing a lactam group of structure (1) where R1 is independently selected hydrogen, C1-C4 alkyl, C1-C6 alkyl alcohol, hydroxy (OH), amine (NH2), carboxylic acid, and amide (CONH2), ?represents the attachment to the polymer, m=1-6, and n=1-4. The present invention also relates to a process for manufacturing a microelectronic device comprising providing a substrate with a photoresist pattern, coating the photoresist pattern with the novel coating material reacting a portion of the coating material in contact with the photoresist pattern, and removing a portion of the coating material which is not reacted with a removal solution.

Abstract: Methods of forming an integrated circuit device may include forming a resist pattern on a layer of an integrated circuit device with portions of the layer being exposed through openings of the resist pattern. An organic-inorganic hybrid siloxane network film may be formed on the resist pattern. Portions of the layer exposed through the resist pattern and the organic-inorganic hybrid siloxane network film may then be removed. Related structures are also discussed.

Abstract: Provided are a mask pattern including a silicon-containing self-assembled molecular layer, a method of forming the same, and a method of fabricating a semiconductor device. The mask pattern includes a resist pattern formed on a semiconductor substrate and the self-assembled molecular layer formed on the resist pattern. The self-assembled molecular layer has a silica network formed by a sol-gel reaction. To form the mask pattern, first, the resist pattern is formed with openings on an underlayer covering the substrate to expose the underlayer to a first width. Then, the self-assembled molecular layer is selectively formed only on a surface of the resist pattern to expose the underlayer to a second width smaller than the first width. The underlayer is etched by using the resist pattern and the self-assembled molecular layer as an etching mask to obtain a fine pattern.

Abstract: Disclosed is an improved method, system, and computer program product for preparing multiple levels of semiconductor substrates for three-dimensional IC integration. Some embodiments utilize the process and design models to check and fabricate the insulating dielectric layer (IDL) separating the first and the second film stacks on separate substrates and then prepare the surface of the IDL to receive an additional layer of semiconductor substrate for further fabrication of the chips. Yet some other embodiments further employ the design and process models to ensure the IDL and the semiconductor substrate are sufficiently flat, or are otherwise satisfactory, so the three-dimensional integrated circuits meet the reliability, manufacturability, yield, or performance requirements. Yet some other embodiments further employ design and process models to place the vias connecting the multiple film stacks.

Abstract: The present invention discloses printing plates comprising a substrate and a radiation-absorptive layer, wherein the radiation-absorptive layer comprises at least one modified pigment product. The modified pigment product comprises a pigment having attached at least one organic group and at least one amphiphilic counterion. Methods of imaging printing plates are also disclosed.

Abstract: The present invention relates to an aqueous coating composition for coating a photoresist pattern, comprising a polymer comprising at least one unit with an alkylamino group, where the unit has a structure (1), where, R1 to R5 are independently selected from hydrogen and C1 to C6 alkyl, and W is C1 to C6 alkyl. The invention also relates to a process for imaging a photoresist layer using the present composition.

Abstract: A photo acid generator (PAG) or an acid is used to reduce resist scumming and footing. Diffusion of acid from photoresist into neighbors causes a decreased acid level, and thus causes resist scumming. An increased acid layer beneath the resist prevents acid diffusion. In one embodiment, the increased acid layer is a layer of spun-on acid or PAG dissolved in aqueous solution. In another embodiment, the increased acid layer is a hard mask material with a PAG or an acid mixed into the material. The high acid content inhibits the diffusion of acid from the photoresist into neighboring layers, and thus substantially reduces photoresist scumming and footing.

Abstract: A conductive photolithographic film and method of forming a device using the conductive photolithographic film. The method includes depositing a conductive photolithographic film on a top surface of a substrate; and patterning the conductive photolithographic film to create a desired circuit pattern using a lithographic process. The conductive photolithographic film comprising about 50% to about 60% of a mixture of epoxy acrylate, a thermal curing agent, and a conductive polymer; about 20% to about 30% of a lithographic reactive component; about 10% to about 15% of a photo-active material; and about 3% to about 5% of additives that enhance conductivity of the conductive photolithographic polymer.

Abstract: A pattern creation method, including laying out data of a most extreme end pattern of integrated circuit patterns on a first layer and laying out data of the integrated circuit patterns excluding the most extreme end pattern on a second layer, extracting data of a first most proximate pattern being most proximate to the most extreme end pattern from the second layer and converting the extracted data to a third layer, generating data of a contacting pattern which contacts both the first most proximate pattern and the most extreme end pattern in a fourth layer, generating data of a non-overlapping pattern of the contacting pattern excluding overlapping portions with the most extreme end pattern and the first most proximate pattern in a fifth layer, extracting data of a second most proximate pattern being most proximate to the non-overlapping pattern and converting the extracted data to the first layer.

Abstract: Optimization of illumination for a full-chip layer is disclosed. A pitch frequency of the full-chip layer is determined so as to generate a pitch frequency histogram of the full-chip layer. The pitch frequency indicates how often a given pitch occurs in the full-chip layer. The pitch frequency histogram is equated to be the first eigenfunction from the sum of coherent system representation of a transformation cross coefficient. An integral equation for the first eigenfunction of the transformation cross coefficient is solved so as to define the optimal illumination for imaging the full-chip layer.

Abstract: A mask pattern for semiconductor device fabrication comprises a resist pattern formed on a semiconductor substrate, and an interpolymer complex film formed on the resist pattern, wherein the interpolymer complex film includes a network formed by a hydrogen bond between a proton donor polymer and a proton acceptor polymer.