Abstract: This patent relates to an imaging member comprising a vacuous polymer base having adhered thereto an image formed on a transparent polymer sheet, wherein said vacuous polymer base has a density of less than 0.7 grams/cc and a modulus to density ratio of between 1500 and 4000 and wherein said image is in contact with said vacuous polymer base.

Abstract: A process for the production of a multi-color image is described. Preferably a transfer film is used which has a laser-sensitive layer (4). The laser-sensitive layer (4) comprises a three-component mixture. The components are coloring agents which are bleachable with laser radiation, in particular pigments, for example cyan pigment, magenta pigment and yellow pigment.

Abstract: The invention relates to an imaging element comprising at least one image layer and a base wherein said base comprises an upper polymer sheet having an elastic modulus of between 500 and 6,000 MPa said upper sheet being adhered to a textile having a roughness of between 0.8 and 8.0 micrometers, and a lower polymer sheet adhered to said textile.

Abstract: A thermally imageable layer comprising an aqueous dispersion containing an immiscible compound, typically a near infrared absorber, and a dispersant, typically an acrylic polymer, which layer is useful in laser induced colorant transfer processes.

Abstract: A semiconductor substrate etching masking layer onto which the pattern to be etched can be transferred by photolithography at extreme ultraviolet light wavelengths from 10 to 100 nm and which is resistant to plasma etching. An ultraviolet light semiconductor integrated circuit photolithography process and the use for fabricating a double masking layer for semiconductor substrate etching of a photo-ablation layer sensitive to extreme ultraviolet light and resistant to deep ultraviolet light and/or ultraviolet light coupled to a polymer resin layer resistant to extreme ultraviolet light and to plasma etching when the resin has been developed and sensitive to deep ultraviolet light and/or to ultraviolet light.

Abstract: A process for patterning thick film electrically functional patterns using a photosensitive polymer layer. A tacky photosensitive layer is applied onto a substrate surface. The photosensitive layer is imaged with a pattern using actinic radiation, the exposed areas of the photosensitive layer become hardened and non-tacky. A subsequent application of a thick film composition sheet will cause the thick film to adhere to the remaining tacky areas. Upon peeling the sheet, a thick film print pattern will be produced. This step is followed by a processing profile prescribed by the thick film composition used which results in a pattern having electrically functional properties. The invention also extends to a process wherein a thick film composition is recovered from a used sheet.

Abstract: There is provided a thermal transfer image-receiving sheet which has dyeability high enough to realize high-speed printing and low-energy printing, permits a protective layer to be thermally transferred onto an image formed on the thermal transfer image-receiving sheet, is free from heat fusing to a thermal transfer sheet at the time of image formation on the thermal transfer image-receiving sheet, and has satisfactory separability from the thermal transfer sheet.

Abstract: An IC-mounted card substrate comprising a first sheet member having at least a first support, a second sheet member having at least a second support and an electronic part fixing layer having therein an IC-module and provided between the first sheet member and the second sheet member, wherein the second sheet member has a cushion layer comprising an actinic ray-cured resin on the second support, and a displacement value of needle penetration of the cushion layer obtained by a thermo-mechanical analysis (TMA) apparatus is not more than 30% at temperature of 100° C. and not less than 30% at a temperature of 150° C. based on the thickness of the cushion layer.

Abstract: The present invention provides an organic electroluminescence device including a base structure and at least an organic electroluminescence device structure over the base structure, wherein the base structure includes a substrate made of a plastic material, and at least a heat radiation layer which is higher in heat conductivity than the substrate.

Abstract: Disclosed are a thermally transferable image protective sheet and a method for protective layer formation that can provide a protective layer which can protect an image of a record produced by a nonsilver photographic color hard copy recording method, can impart lightfastness and other properties to the record, and can realize a record having a glossy impression comparable to silver salt photographs. The thermally transferable image protective sheet comprises a support and a thermally transferable resin layer having a single-layer or multilayer structure stacked on the support so as to be separable from the support.

Abstract: A polyimide having a repeating unit of the general formula (I) and a polyamic acid having a repeating unit of the formula (IV): (wherein, R1 and R2 represent H or a C1 to C20 alkyl group, and Z represents a condensed polycyclic aromatic group or an group of the following formulae: Herein, X represents —CO— or —C(═N2)—, Y represents a direct bond, —CH2—, —O—, —SO2—, —S—, —CO— or —C(═N2)—, and W represents a direct bond, —CH2—, —C(CH3)2—, —C(CF3)2—, —S—, —SO—, —SO2— or —O—, b, m and n are 0 or 1; r is a C1 to 4 alkyl group, halogen group or phenyl group; a is 0 or 1 to 3).

Abstract: The invention relates to a photographic element comprising nacreous pigment.

Abstract: This invention relates to a photographic element comprising at least one layer comprising nacreous pigment above the image.

Abstract: A method for fabricating circuitized substrates which reduces the formation of shorts, and which does not require a bake step to drive off solvent before photoimaging, is provided. The method employs an essentially solventless photoimageable dielectric film, having a solvent content typically less than about 5%, preferably less than about 2% and a glass transition temperature, when cured, which is greater than about 110° C. The method for fabricating circuitized structures comprises the following steps: providing a photoimagable dielectric film, which film comprises: from about 95% to about 100% solids, comprising: from 0% to about 30% by weight of the solids, of a particulate rheology modifier; from about 70% to about 100% by weight of the solids of an epoxy resin system comprising: from about 85% to about 99.9% epoxy resins; and from about 0.1 to 15 parts by weight of the total resin weight, a cationic photo-initiator; from 0 to about 0.

Abstract: The present invention alleviates the operational problems in production of flip chips and provides a semiconductor device superior in various reliabilities. The preset invention lies in an encapsulated semiconductor device comprising: (a) a polybenzoxazole resin film for chip protection, obtained by coating, on a circuit-formed chip, a positive photosensitive resin composition comprising 100 parts by weight of a polyamide and 1 to 100 parts by weight of a photosensitive diazoquinone compound, and subjecting the coated composition to patterning and curing, and (b) a bump electrode.

Abstract: The invention relates to a packaging label comprising in order an environmental protection layer, an image formed by means of silver halide, a base, an adhesive, and a peelable back wherein said environmental protection layer comprises a mixture of vinyl polymer and urethane polymer wherein said urethane polymer has an indentation modulus less than 0.6 GPa and wherein said environmental protection layer is less than 10 micrometers in thickness.

Abstract: Improved processes and products for laser thermal imaging are described. These improved processes and products utlilize an image rigidification element and significantly reduce halftone dot movement, swath boundary cracking and banding.

Abstract: This invention relates to an imaging element comprising at least one layer of oriented polyester and nacreous pigment.

Abstract: A pellicle comprises a pellicle frame, a pellicle film and at least two liners. The pellicle frame has one end face and the other end face and is provided at its central portion with an opening. The other end face of the pellicle frame is provided with an adhesion layer. The pellicle film is stretched over and attached to the one end face of the pellicle frame. The at least two liners are adhered on the adhesion layer. The at least two liners can be respectively peeled off from the adhesion layer, and when the at least two liners are respectively peeled off from the adhesion layer, a portion of the adhesion layer to which each of the liners was adhered is exposed.

Abstract: The invention provides a coated metal substrate comprising a metal substrate having an outer surface, a maskant film adhered to at least a portion of the outer surface of the metal substrate, the maskant film having a pattern of scribed lines therein, and a line sealant composition applied to the scribed lines in a maskant film. Both the maskant film and the line sealant composition are preferably radiation cured and substantially solvent-free. The invention also provides a method of protecting a metal substrate from chemical exposure by utilizing the radiation-cured maskant film and line sealant composition.

Abstract: The present invention provides a method, article of manufacture and system for fabricating an article using photo-activatable building material. The method includes the steps of applying a layer of the photo-activatable building material to a preselected surface, scanning the layer using a plurality of light-emitting centers to photo-activate the layer of photo-activatable building material in accordance with a predetermined photo-initiation process to obtain polymerization of the building material, wherein scanning is accomplished at a predetermined distance using a predetermined light intensity, and repeating the steps of applying the layer, with each layer being applied to an immediately previous layer, and scanning the layer with the plurality of light-emitting centers to polymerize the building material until the article is fabricated.

Abstract: A printed circuit board comprises a base substrate including a conductive circuit pattern on a top surface thereof, and at least one photosensitive resin layer positioned on the base substrate. The resin layer exposure is performed through a photomask having light-shielding and exposure amount adjusting portions as part thereof to accommodate for varying resin layer thicknesses.

Abstract: Disclosed is a photosensitive resin composition which can be developed using a dilute aqueous alkaline solution after ultraviolet ray exposure, is excellent in pot life, capable of preventing deposits from being generated in a cured coated film, capable of widening heat control tolerance, and is excellent in sensitivity, in heat resistance, in chemical resistance and in electric insulating properties, thereby rendering the composition suitable for use as a solder resist for producing a printed wiring board. This photosensitive resin composition comprises (A) an active energy ray-curable resin having at least two ethylenic unsaturated linkages per molecule thereof, (B) at least one kind material selected from acid salts of N-substituted melamine compound and acid salts of guanamine compound, (C) a photopolymerization initiator, (D) a diluent, and (E) a thermosetting compound. There is also disclosed a printed wiring board where this photosensitive resin composition is employed.

Abstract: The invention relates to an imaging element comprising at least one layer comprising nacreous pigment and polymer.

Abstract: A mouldable photographic material is made up from a thermoplastic base sheet, and a primer coating which provides the key for a photographic emulsion layer. Following exposure and development, a thermoplastic foil is laid over the emulsion layer and bonded in place using an optical quality adhesive.

Abstract: Disclosed is a photosensitive resin composition for use as a solder resist, which is free from anti-tackiness and excellent in flexibility, adhesiveness and heat resistance without other film properties being sacrificed, and can be easily designed so as to obtain properties in conformity with the end use thereof.

Abstract: Improved processes and products for laser thermal imaging are described. These improved processes and products utlilize an image rigidification element and significantly reduce halftone dot movement, swath boundary cracking and banding.

Abstract: A method for forming insulating spacers for separating conducting layers in semiconductor wafer fabrication. The spacers are formed by removing portions of a protective photoresist layer through photolithography, and then through etching of exposed portions of the insulating layer. The spacers allow for fabrication of components that are smaller in size than are obtainable through conventional photolithography methods.

Abstract: An improved method for applying organic antireflective coatings to substrate surfaces and the resulting precursor structures are provided. Broadly, the methods comprise chemical vapor depositing (CVD) an antireflective compound on the substrate surface. In one embodiment, the compound is highly strained (e.g., having a strain energy of at least about 10 kcal/mol) and comprises two cyclic moieties joined to one another via a linkage group. The most preferred monomers are [2.2](1,4)-naphthalenophane and [2.2](9,10)-anthracenophane. The CVD processes comprise heating the antireflective compound so as to vaporize it, and then pyrolizing the vaporized compound to form stable diradicals which are subsequently polymerized on a substrate surface in a deposition chamber. The inventive methods are useful for providing highly conformal antireflective coatings on large substrate surfaces having super submicron (0.25 &mgr;m or smaller) features.

Abstract: A method for fabricating circuitized substrates which reduces shorts, and does not require baking and resulting film. The method employs a photoimageable dielectric film, having a solvent content less than about 5%, and a glass transition temperature, when cured, which is greater than about 110° C. A photoimageable dielectric film is provided having from about 95% to about 100% solids, and comprising: from 0% to about 30% of the solids, of a particulate rheology modifier; from about 70% to about 100% of the solids of an epoxy resin system (liquid at 20° C.) comprising: from about 85% to about 99.9% epoxy resins; and from about 0.1 to 15 parts of the total resin weight, a cationic photoinitiator; from 0 to about 5% solvent; applying the photoimageable dielectric film to a circuitized substrate; and exposing the film to actinic radiation.

Abstract: A color filter including a transparent substrate, a colored layer on the substrate, and a protective layer on the colored layer. The protective layer is the product formed by exposing, developing, and heating a coating containing an epoxy-containing copolymer resin having 0 to 55% by mole of formula (1), 5 to 95% by mole of formula (2), and 5 to 95% by mole of formula (3), the formula (1) units having been partially reacted, through carboxyl groups, with a (meth)acryloylalkyl isocyanate compound, the formula (2) units having been partially reacted, through hydroxyl groups, with a (meth)acryloylalkyl isocyanate compound, the copolymer resin containing 5 to 95% by mole of (meth)acryloyl groups, an acid value of 0 to 400 mg KOH/g, and a weight average molecular weight of 5,000 to 1,000,000.

Abstract: This invention relates to new photoacid generator compounds and photoresist compositions that comprise such compounds. In particular, the invention relates to photoacid generator compounds that generate an &agr;,&agr;-difluoroalkyl sulfonic acid upon exposure to activating radiation. Positive- and negative-acting chemically amplified resists that contain such PAGs are particularly preferred.

Abstract: The invention relates to an image element comprising at least one image layer, a base, a gelatin layer below said base and a pressure sensitive adhesive below said gelatin layer, wherein said base has a stiffness of less than 20 mN.

Abstract: A positive-type, heat-resistant photosensitive polymer composition comprising (a) a polyimide precursor or a polyimide which is soluble in an aqueous alkaline solution, (b) a compound capable of generating an acid when exposed to light, and (c) a compound having a phenolic hydroxyl group; a method of forming a relief pattern comprising a step of applying the composition onto a substrate and drying it thereon, a step of exposing it, a step of developing it, and a step of heating it; and an electronic part having as a surface-protecting film or an interlayer insulating film.

Abstract: The present invention relates to imaged photographic elements comprising an overcoat layer of a water-dispersible, hydrophobic polyester resin having the following general formula: In—P—Am wherein I is an ionic group; n is an integer from 1-3; P is a polyester backbone; A is an Asiatic group comprising a straight or branched chain fatty acid or triglyceride thereof having from about 6 to about 24 carbon atoms; and m is an integer from 3-8. Such a protective overcoat provides excellent stain resistance for an imaged photographic element.

Abstract: Antihalation compositions and methods for reducing the reflection of exposure radiation of a photoresist overcoated said compositions. The antihalation compositions of the invention comprise a resin binder and material capable of causing a thermally induced crosslinking reaction of the resin binder.

Abstract: A substrate for forming a resist pattern comprising a resist film of the chemical amplification type and a coating film which is formed on the resist film, comprises an amorphous polyolefin or a polymer having an aromatic ring and has the same thickness as that of the resist film or smaller; and a process for forming a resist pattern of the chemical amplification type, which comprises steps of forming a pattern of a latent image in the resist film by irradiation with an ionizing radiation and converting the pattern of a latent image into a pattern of a visible image by a development treatment.

Abstract: The invention provides a lithographic printing for precursor having an imagable coating on an aluminum support, wherein the imagable coating comprises a polymeric substance comprising colorant groups, and wherein the aluminum support on which the coating is provided is anodized but not subsequently modified by means of a post-anodic treatment compound, and the coating does not comprise a colorant dye. The polymeric substance may also comprise pendent infra-red or developer dissolution inhibiting groups, and these groups may also be the colorant groups themselves.

Abstract: The invention provides new light absorbing crosslinking compositions suitable for use as an antireflective composition (ARC), particularly suitable for short wavelength imaging applications such as 193 nm. The ARCs of the invention are preferably used with an overcoated resist layer (i.e. bottom layer ARCs) and in general comprise novel ARC resin binders that can effectively absorb reflected sub-200 nm exposure radiation.

Abstract: A lithographic photoresist composition is provided that can be used as a chemical amplification photoresist. In a preferred embodiment, the composition is substantially transparent to deep ultraviolet radiation, i.e., radiation of a wavelength less than 250 nm, including 157 nm, 193 nm and 248 nm radiation, and has improved sensitivity and resolution. The composition comprises a fluorinated vinylic polymer, particularly a fluorinated methacrylate, a fluorinated methacrylonitrile, or a fluorinated methacrylic acid, and a photoacid generator. The polymer may be a homopolymer or a copolymer. A process for using the composition to generate resist images on a substrate is also provided, i.e., in the manufacture of integrated circuits or the like.

Abstract: A multilayer resist structure is irradiated more than one time with ultraviolet rays through a photomask. Each time the structure is irradiated, ultraviolet rays of a little greater quantity of light than those used in the last irradiation are used. Also, with each exposure, a photomask which has a larger lightproof section than that used in the last irradiation is used. Next, the multilayer resist structure is developed, and the exposed area of each photoresist is removed with a developing solution. Also, in amorphous silicon layers, the areas under the removed photoresist are easily removed with the developing solution. A resist structure having desired steps is thus completed. Using the resist structure, a three-dimensional microstructure can be formed.

Abstract: A moldable photographic material (1) is made up from a thermoplastic base sheet (2), a primer coating (3) which provides the key for a photographic emulsion layer (5). Following exposure and developing, a thermoplastic foil (6) is laid over the emulsion layer (5) and bonded in place using an optical quality adhesive.

Abstract: The present invention is an imaged photographic element having a protective overcoat thereon. The protective overcoat is formed by providing a photographic element having at least one silver halide light-sensitive emulsion layer. A first coating of hydrophobic polymer particles having an average size of 0.01 to 1 microns, a melting temperature of from 55 to 200 ° C. at a weight percent of 30 to 95, and one or more hydrophilic polymers at a total weight percent of 5 to 70 is applied to form a first layer over the silver halide light-sensitive emulsion layer. A second coating of abrasion resistant particles having an average size of from 0.01 to 1 microns is applied to form a second layer over the first layer. The coatings are dried at temperatures not exceeding the melting point of the particles used in the first coating, or of the glass transition temperature of the abrasion resistant particles used in the second coating, whichever is the lowest.

Abstract: An overcoat composition for imaging products containing: 30-95 weight %, based on the dry laydown of the overcoat, of a hydrophobic polymer, said hydrophobic polymer being homopolymers or copolymers containing at least 30% by weight, based on the total weight of monomers, of the monomer described in structurel; and 5 to 70 weight %, based on the dry laydown of the overcoat, of gelatin: wherein: R is H, CH3, C2H5, and C3H7; and X1, X2, X3, X4 and X5 are H, F, Cl, Br, I, CN, CH3O, C2H5O, C3H7O, C4H9O, CH3, C2H5, C3H7, n-C4H9, sec-C4H9, tert-C4H9, CF3, C2F5, C3F7, iso-C3F7, n-C4F9, sec-C4F9, tert-C4F9, CH3NH, (CH3)2N, n-C5H11, C4H9, n-C6H13, n-C7H15, n-C8H17, n-C9H19, n-C10H21, or n-C12H25.

Abstract: Negative photoimageable compositions are disclosed which contain a radiation sensitive component for producing an acid when subjected to radiation at wavelengths of 320 to 420 nanometers, a resin binder and a reactive oligomer. The compositions are useful in constructing printed circuits and integrated circuit packages.

Abstract: A high capacitance storage node structure is created in a substrate by patterning a hybrid resist (12) to produce both negative tone (16) and positive tone (18) areas in the exposed region (14). After removal of the positive tone areas (18), the substrate (12) is etched using the unexposed hybrid resist (12) and negative tone area (16) as a mask. This produces a trench (22) in the substrate (12) with a centrally located, upwardly projecting protrusion (24). The capacitor (26) is then created by coating the sidewalls of the trench (22) and protrusion (24) with dielectric (28) and filling the trench with conductive material (30) such as polysilicon.

Abstract: Compositions suitable for forming planarizing underlayers for multilayer lithographic processes are characterized by the presence of (A) a polymer containing: (i) cyclic ether moieties, (ii) saturated polycyclic moieties, and (iii) aromatic moieties for compositions not requiring a separate crosslinker, or (B) a polymer containing: (i) saturated polycyclic moieties, and (ii) aromatic moieties for compositions requiring a separate crosslinker. The compositions provide outstanding optical, mechanical and etch selectivity properties. The compositions are especially useful in lithographic processes using radiation less than 200 nm in wavelength to configure underlying material layers.

Abstract: An electrophotographic OHP sheet comprising a transparent support and a toner-receiving layer formed on one side of the support, with the toner-receiving layer having suitability for toner fixation at a temperature in the neighborhood of 160° C. to 200° C. and comprising (a) a resin having a softening point of from 180° C. to about 190° C., (b) a resin having a softening point of from 110° C. to 140° C. and (c) a plasticizer having a plasticizing efficiency of 1.1 or below.

Abstract: The present invention is directed to an imaged element that includes a support, at least image-receiving layer superposed on the support and a water-resistant protective overcoat overlying the image-receiving layer that is water-resistance. The present invention is also directed to a method of making a print by application of a UV-curable water-dispersible latex.

Abstract: Improved processes and products for laser thermal imaging are described. These improved processes and products utlilize an image rigidification element and significantly reduce halftone dot movement, swath boundary cracking and banding.