Quinone Diazide Containing Layer Patents (Class 430/165)
  • Patent number: 10976662
    Abstract: The present application for patent relates to a light-sensitive positive working photosensitive composition especially useful for imaging thick films using a composition which gives very good film uniformity and promotes a good process latitude against feature pattern collapse in patterns created upon imaging and developing of these films.
    Type: Grant
    Filed: April 18, 2017
    Date of Patent: April 13, 2021
    Assignee: Merck Patent GmbH
    Inventors: Weihong Liu, PingHung Lu, Chunwei Chen, SookMee Lai, Yoshiharu Sakurai, Aritaka Hishida
  • Patent number: 10942449
    Abstract: The present invention relates to a photosensitive resin composition and to a cured film formed therefrom, wherein the photosensitive resin composition can improve the sensitivity by using an alcoholic solvent, along with a siloxane polymer and a quinone diazide compound conventionally used, which enhances the solubility in a developer through an interaction between the alcohol and the diazonaphthoquinone (DNQ) group in the quinone diazide compound, as well as can form a cure film having excellent film retention rate even after post-bake.
    Type: Grant
    Filed: October 5, 2017
    Date of Patent: March 9, 2021
    Assignee: Rohm and Haas Electronic Materials Korea Ltd.
    Inventors: Yeonok Kim, Geun Huh, Jong Han Yang, Jin Kwon, Jin Kyu Im
  • Patent number: 10746732
    Abstract: Disclosed herein are formulations, substrates, and arrays. Also disclosed herein are methods for manufacturing and using the formulations, substrates, and arrays. Also disclosed are methods for identifying peptide sequences useful for diagnosis and treatment of disorders, and methods for using the peptide sequences for diagnosis and treatment of disorders, e.g., celiac disorder. In certain embodiments, substrates and arrays comprise a porous layer for synthesis and attachment of polymers or biomolecules.
    Type: Grant
    Filed: May 11, 2018
    Date of Patent: August 18, 2020
    Assignee: Vibrant Holdings, LLC
    Inventors: John J. Rajasekaran, Vasanth Jayaraman, Tianhao Wang, Kang Bei, Hari Krishnan Krishnamurthy
  • Patent number: 10743420
    Abstract: Methods and composition sets for forming etch-resist masks on a metallic surface are provided. The method may include applying a composition comprising a first reactive component onto a metallic surface to form a primer layer; and image-wise printing by a nonimpact printing process on the primer layer another composition comprising a second reactive component to produce an etch-resist mask, wherein when droplets of the second composition contact the primer layer, the reactive components undergo a chemical reaction so as to immobilize the droplets. The set may include a first liquid composition comprising a fixating reactive component and a second liquid composition comprising an etch-resist reactive component, wherein the fixating reactive component and the fixating reactive component are capable undergoing a chemical reaction to form a bi-component material that is insoluble in water and in an acidic etch solution.
    Type: Grant
    Filed: June 2, 2016
    Date of Patent: August 11, 2020
    Assignee: Kateeva, Inc.
    Inventors: Moshe Frenkel, Nava Shpaisman
  • Patent number: 10635001
    Abstract: A photolithiographic method for fabricating bank structures with improved non-wetting properties to form well regions on a substrate using a photoresist composition comprising a cresol novolak resin, a photoactive diazonaphthoquinone sulfonic ester of a polyhydroxybenzophenone compound with at least one free hydroxyl group, and a non-ionic urethane polyglycol fluorosurfactant. Inkjet methods can be used to deposit active materials into the well areas. Color filter arrays and optoelectronic devices such as OLED devices can be made by this method.
    Type: Grant
    Filed: July 25, 2016
    Date of Patent: April 28, 2020
    Assignee: Merck Patent GmbH
    Inventors: Li Wei Tan, Pawel Miskiewicz, Graham Smith
  • Patent number: 10577449
    Abstract: There are provided a phenolic-hydroxyl-group-containing novolac resin and resist film that are excellent in developability, heat resistance, and conformability to substrates. The phenolic-hydroxyl-group-containing novolac resin is a polycondensate of which the essential reactive components are a phenolic-hydroxyl-group-containing compound (A) represented by Structural Formula (1) [where Ar is a structural part represented by Structural Formula (Ar-1) or (Ar-2), a phenolic-hydroxyl-group-containing compound (B) represented by Structural Formula (2) [where R3 is an aliphatic hydrocarbon group having 4 to 20 carbon atoms, and j is an integer from 1 to 3], and an aldehyde compound (C).
    Type: Grant
    Filed: April 21, 2016
    Date of Patent: March 3, 2020
    Assignee: DIC Corporation
    Inventors: Tomoyuki Imada, Yusuke Sato
  • Patent number: 10307752
    Abstract: A method for producing a polymer of the present invention includes the following steps (a) and (b): step (a): producing a polymer in the presence of an acid or base catalyst; and step (b): contacting a solution containing the polymer obtained in step (a) to a mixed resin of an anion-exchange resin and a cation-exchange resin.
    Type: Grant
    Filed: June 25, 2013
    Date of Patent: June 4, 2019
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Seiji Tsuchiya, Shinichi Maeda
  • Patent number: 10254645
    Abstract: There are provided a photosensitive resin composition having excellent chemical resistance, light resistance, and solubility in a solvent, a method for producing a cured film, a cured film, a liquid crystal display device, an organic electroluminescent display device, and a touch panel. The photosensitive resin composition contains a polybenzoxazole precursor, a photoacid generator which generates an acid having a pKa of 3 or less or a quinone diazide compound, and a solvent, in which the polybenzoxazole precursor contains a total of 70 mol % or more of a repeating unit represented by the following Formula (1) and a repeating unit represented by the following Formula (2) with respect to the total repeating units, and a ratio between the repeating unit represented by Formula (1) and the repeating unit represented by Formula (2) is 9:1 to 3:7 in a molar ratio. Y1 represents a cyclic aliphatic group having 3 to 15 carbon atoms, and Y2 represents a linear or branched aliphatic group having 4 to 20 carbon atoms.
    Type: Grant
    Filed: February 27, 2017
    Date of Patent: April 9, 2019
    Assignee: FUJIFILM Corporation
    Inventors: Kenta Yoshida, Takuma Amemiya, Satoru Yamada, Mikio Nakagawa
  • Patent number: 10054855
    Abstract: A photosensitive resin composition, a method of manufacturing a substrate with a template using the composition, and a method of manufacturing a plated article using the substrate with a template. The photosensitive resin composition may be used to form a plated article on a metal surface of a substrate The composition includes an acid generator that, when irradiated with an active ray or radiation, generates an acid, a resin that, under an action of an acid, undergoes an increase in solubility thereof in alkali, and a fluorene compound represented by the formula (1).
    Type: Grant
    Filed: March 18, 2016
    Date of Patent: August 21, 2018
    Assignee: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Shota Katayama, Aya Momozawa
  • Patent number: 10047186
    Abstract: The present invention provides a photosensitive composition having excellent heat resistance, low absorbance at the exposure light at wavelengths of g-line, h-line, and i-line, and satisfactory sensitivity even when the thickness of a resist film is increased, and also provides a resist material, a coating film thereof, a novolac phenol resin suitable for these applications, and a method for producing the phenol resin.
    Type: Grant
    Filed: October 8, 2015
    Date of Patent: August 14, 2018
    Assignee: DIC CORPORATION
    Inventors: Tomoyuki Imada, Yusuke Sato
  • Patent number: 9989850
    Abstract: A system and method for photoresists is provided. In an embodiment a cross-linking or coupling reagent is included within a photoresist composition. The cross-linking or coupling reagent will react with the polymer resin within the photoresist composition to cross-link or couple the polymers together, resulting in a polymer with a larger molecular weight. This larger molecular weight will cause the dissolution rate of the photoresist to decrease, leading to a better depth of focus for the line.
    Type: Grant
    Filed: December 3, 2014
    Date of Patent: June 5, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hau Wu, Ching-Yu Chang
  • Patent number: 9984891
    Abstract: The present invention provides a method for forming an organic film, including: forming a coating film by spin coating of an organic film-forming composition onto a substrate having an uneven pattern, and thereafter subjecting the substrate to a vibration treatment, and after or simultaneously with the vibration treatment, insolubilizing the coating film to an organic solvent to form the organic film. This provides a method for forming an organic film that can fill an uneven pattern on a substrate to highly flatten a substrate at low cost in a production step of a semiconductor apparatus, etc.
    Type: Grant
    Filed: March 7, 2017
    Date of Patent: May 29, 2018
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Tsutomu Ogihara, Rie Kikuchi
  • Patent number: 9983476
    Abstract: A resin composition includes a polymer including a repeating unit represented by Chemical Formula 1, wherein in Chemical Formula 1, each substituent is the same as defined in the specification, and a solvent and an organic film manufactured using the same is provided.
    Type: Grant
    Filed: June 2, 2016
    Date of Patent: May 29, 2018
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Sang Soo Kim, Jin Hee Kang, Hee Kyoung Kang, Chan Woo Kim, Bum Jin Lee, Sung Seo Cho
  • Patent number: 9963536
    Abstract: Disclosed are a phenolic hydroxyl group-containing resin which has excellent alkali developing properties and makes it possible to exhibit high heat resistance in a cured product obtained therefrom, a production method therefor, a photosensitive composition, a resist material, a coating film, a curable composition and a cured product thereof, and a resist underlayer film. A phenolic hydroxyl group-containing resin, including a compound (A) having a molecular structure represented by the following Structural Formula (1). (In the formula, R1 represents an alkyl group, an alkoxy group, or an aryl group, R2 represents a hydrogen atom, an alkyl group, or an aryl group, m is an integer of 1 to 3, and n is an integer of 2 to 15. In the case where m is 2 or more, plural R1's may be the same as or different from each other.
    Type: Grant
    Filed: May 28, 2015
    Date of Patent: May 8, 2018
    Assignee: DIC Corporation
    Inventors: Tomoyuki Imada, Seiji Kimoto, Shigenobu Kida
  • Patent number: 9932432
    Abstract: Various cycloolefinic/maleic anhydride/maleimide polymers and compositions thereof useful for forming self-imageable films encompassing such polymers are disclosed. Such polymers encompass norbornene-type repeating units, maleimide repeat units and maleic anhydride-type repeating units where at least some of such maleic anhydride-type repeating units have been ring-opened. The films formed from such polymer compositions provide self imageable, low-k, thermally stable layers for use in microelectronic and optoelectronic devices.
    Type: Grant
    Filed: May 6, 2016
    Date of Patent: April 3, 2018
    Assignee: PROMERUS, LLC
    Inventors: Edmund Elce, Royce Groff
  • Patent number: 9921476
    Abstract: This invention relates to a positive-type photosensitive resin composition which includes an alkali soluble polyimide resin, a diazide-based photosensitive compound and a sensitivity enhancer, and in which the use of a polyimide resin wherein the degree of imidization of imidized polyimide resin is 50˜75% exhibits a light transmittance of 95% or more in the visible light wavelength range (400˜650 nm) as well as high developability in a patterning process, and to an insulating film and an OLED formed using the same.
    Type: Grant
    Filed: September 24, 2012
    Date of Patent: March 20, 2018
    Assignee: KOLON INDUSTRIES, INC.
    Inventors: Se Hyung Park, Byoung Kee Kim
  • Patent number: 9791773
    Abstract: The present invention relates to a photosensitive resin composition for black matrix, as well as a color filter and a liquid crystal display (LCD) device formed by the composition. The aforementioned photosensitive resin composition comprises an alkali-soluble resin (A), a compound containing vinyl unsaturated group(s) (B), a photo initiator (C), quinonediazide sulfonic acid ester (D), a solvent (E) and black pigment (F). The alkali-soluble resin (A) includes epoxy resin having unsaturated group(s) (A-1), which is obtained by reacting an epoxy resin (i) having at least two epoxy groups with a compound (ii) having at least one vinyl unsaturated group and carboxyl group. The aforementioned photo initiator (C) includes an O-acyloxime compound (C-1).
    Type: Grant
    Filed: December 16, 2013
    Date of Patent: October 17, 2017
    Assignee: CHI MEI CORPORATION
    Inventors: Hao-Wei Liao, I-Chun Hsieh
  • Patent number: 9778582
    Abstract: An electrophotographic photosensitive member includes an undercoat layer that includes metal oxide particles and a compound having at least three hydroxyl groups and a carbonyl or dicarbonyl group.
    Type: Grant
    Filed: November 29, 2012
    Date of Patent: October 3, 2017
    Assignee: Canon Kabushiki Kaisha
    Inventors: Wataru Kitamura, Ryoichi Tokimitsu, Yuka Ishiduka, Mai Murakami, Kenichi Kaku
  • Patent number: 9740097
    Abstract: A resist composition contains: a resin having an acid-labile group, an acid generator, a compound having two or more phenolic-hydroxy groups and being other than a resin, and a solvent. The resist composition of the disclosure can provide a resist pattern showing excellent shape and detachability, therefore, the present resist composition can be used for semiconductor microfabrication with resist patterns showing excellent shape.
    Type: Grant
    Filed: March 30, 2016
    Date of Patent: August 22, 2017
    Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Masako Sugihara, Junji Nakanishi
  • Patent number: 9645495
    Abstract: Resist compositions for photosensitive chemically amplified resist processing, as well as methods for processing substrates using a photosensitive chemically amplified resist are disclosed for improved CD uniformity. A resist composition or layer generates photosensitizer when the resist is exposed to a first wavelength of light. A second wavelength of light is later used to amplify an acid reaction. The radiation-sensitive layer also includes a photo-active agent that, when exposed to a third light wavelength, modifies a concentration of photosensitizer in the radiation-sensitive layer. The third light wavelength can be projected as a pattern of radiation using a digital pixel-based projection system, with the projected pattern based on a critical dimension signature. In a subsequent exposure step, the resist layer is exposed to light of the second wavelength that induces or amplifies the acid concentration within the photoresist film.
    Type: Grant
    Filed: August 3, 2015
    Date of Patent: May 9, 2017
    Assignee: Tokyo Electron Limited
    Inventor: Anton J. deVilliers
  • Patent number: 9647008
    Abstract: The present application discloses a method of fabricating an array substrate comprising forming a via extending through a first insulating layer and a second insulating layer, the via comprising a first sub-via in the first insulating layer and the second sub-via in a second insulating layer; mobilizing a portion of first insulating layer material surrounding the first sub-via; and distributing the mobilized portion of the first insulating layer material over a sidewall of the second sub-via.
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: May 9, 2017
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventor: Jian Guo
  • Patent number: 9623439
    Abstract: Provided is a method of manufacturing a film, including: applying, onto a substrate, a photocurable composition containing a polymerizable monomer, a photopolymerization initiator, and a photosensitive gas generator that generates a gas through light stimulation to form an applied film; bringing a mold into contact with the applied film; irradiating the applied film with light through the mold to cure the applied film and to generate the gas in the applied film; and releasing the mold from the applied film after the irradiation of the applied film with the light to form a film (cured film) having a predetermined pattern shape on the substrate, in which in the irradiation of the applied film with the light, a reaction rate of a polymerization reaction of the polymerizable monomer in the applied film is higher than a reaction rate of a gas-generating reaction of the photosensitive gas generator in the applied film.
    Type: Grant
    Filed: October 19, 2012
    Date of Patent: April 18, 2017
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Toshiki Ito, Naoko Matsufuji, Kanae Kawahata
  • Patent number: 9607849
    Abstract: A pattern-forming method includes providing a resist underlayer film on a substrate using a resist underlayer film-forming composition. The resist underlayer film-forming composition includes a first polymer having a glass transition temperature of 0 to 180° C. A silicon-based oxide film is provided on a surface of the resist underlayer film. A resist pattern is provided on a surface of the silicon-based oxide film using a resist composition. The silicon-based oxide film and the resist underlayer film are sequentially dry-etched using the resist pattern as a mask. The substrate is dry-etched using the dry-etched resist underlayer film as a mask.
    Type: Grant
    Filed: April 10, 2014
    Date of Patent: March 28, 2017
    Assignee: JSR CORPORATION
    Inventors: Kazuhiko Koumura, Shinya Minegishi, Takashi Mori, Kyoyu Yasuda, Yoshio Takimoto, Shinya Nakafuji, Toru Kimura
  • Patent number: 9573888
    Abstract: The invention provides compounds of formula I: or a salt thereof as described herein. The invention also provides pharmaceutical compositions comprising a compound of formula I, processes for preparing compounds of formula I, intermediates useful for preparing compounds of formula I and therapeutic methods for treating cancer or treating autoimmune diseases or preventing transplant rejection using compounds of formula I.
    Type: Grant
    Filed: February 18, 2016
    Date of Patent: February 21, 2017
    Assignee: REGENTS OF THE UNIVERSITY OF MINNESOTA
    Inventors: Venkatram R. Mereddy, Lester R. Drewes, Mohammad Abrar Alam, Sravan K. Jonnalagadda, Shirisha Gurrapu
  • Patent number: 9562884
    Abstract: A method for manufacturing an NO2 gas sensor for detection at room temperature comprises: manufacturing a metal electrode on a surface of a flexible substrate; manufacturing an SWCNTs/SnO2 sensitive film; and bonding the SWCNTs/SnO2 sensitive film with a portion of the surface of the flexible substrate with the metal electrode, so as to form the NO2 gas sensor for detection at room temperature. The present disclosure solves the problems of the poor adhesion between the sensitive material and the flexible substrate, and a non-uniform distribution, and achieves the purposes of secure bonding between the sensitive material and the flexible substrate, and uniform distribution.
    Type: Grant
    Filed: June 5, 2013
    Date of Patent: February 7, 2017
    Assignee: Institute of Microelectronics, Chinese Academy of Sciences
    Inventors: Dongmei Li, Shuang Zhan, Shengfa Liang, Xin Chen, Changqing Xie, Ming Liu
  • Patent number: 9541832
    Abstract: The present invention relates to a photosensitive resin composition, a protective film and an element having the same. The aforementioned photosensitive resin composition includes a polysiloxane resin (A), an alkali-soluble resin (B), an ortho-naphthoquinone diazide sulfonic acid ester (C) and a solvent (D). The alkali-soluble resin (B) is copolymerized by an unsaturated carboxylic acid or unsaturated carboxylic anhydride compound (b1), a fluorene derivative having a double-bond group (b2) and an unsaturated compound having an acid-decomposable group (b3).
    Type: Grant
    Filed: June 9, 2015
    Date of Patent: January 10, 2017
    Assignee: CHI MEI CORPORATION
    Inventors: Ming-Ju Wu, Chun-An Shih
  • Patent number: 9527943
    Abstract: There is provided a polymer including a structural unit represented by the following Formula (1a), a structural unit represented by the following Formula (1b) and a structural unit represented by the following Formula (1c) (In Formula (1a), n represents 0, 1 or 2. Each of R1, R2, R3 and R4 independently represents a hydrogen atom or an organic group having 1 to 10 carbon atoms. In Formula (1c), R5 represents an organic group having 1 to 10 carbon atoms.
    Type: Grant
    Filed: March 6, 2015
    Date of Patent: December 27, 2016
    Assignees: SUMITOMO BAKELITE CO., LTD., PROMERUS, LLC
    Inventors: Osamu Onishi, Haruo Ikeda, Larry F. Rhodes, Pramod Kandanarachchi, Hugh Burgoon
  • Patent number: 9520451
    Abstract: An organic light-emitting diode display device includes a substrate, a light-absorption layer, an active array structure, and an organic light-emitting diode. The substrate has a first and a second surface opposite to each other. The light-absorption layer is disposed on the first surface, and has at least one opening exposing a portion of the first surface. The active array structure is positioned on the second surface, and includes at least one data line, at least one gate line, and at least one switching device electrically connected to the gate and data lines. The light-absorption layer overlaps at least one of the data line and the gate line when viewed in a direction perpendicular to the substrate. The organic light-emitting diode is electrically connected to the switching device, and the organic light-emitting diode overlaps the opening when viewed in the direction perpendicular to the substrate.
    Type: Grant
    Filed: August 20, 2014
    Date of Patent: December 13, 2016
    Assignee: E Ink Holdings Inc.
    Inventors: Wei-Chou Lan, Ted-Hong Shinn, Xue-Hung Tsai, Chi-Liang Wu, Chih-Hsiang Yang
  • Patent number: 9371497
    Abstract: A method for marking a petroleum hydrocarbon or a liquid biologically derived fuel. The method comprises adding to a petroleum hydrocarbon or a liquid biologically derived fuel at least one compound having formula (I), wherein R is C1-C12 alkyl, C3-C12 alkenyl or C7-C12 aralkyl; wherein each compound having formula (I) is present at a level from 0.01 ppm to 50 ppm.
    Type: Grant
    Filed: November 27, 2013
    Date of Patent: June 21, 2016
    Assignee: DOW GLOBAL TECHNOLOGIES LLC
    Inventor: Raymond J. Swedo
  • Patent number: 9343553
    Abstract: A photoresist composition, a method of forming a pattern, and a method of manufacturing a thin film transistor substrate, the composition including a solvent, a novolak resin, a diazide-based photo-sensitizer, an acryl compound represented by the following Chemical Formula 1:
    Type: Grant
    Filed: October 24, 2014
    Date of Patent: May 17, 2016
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Jung-Soo Lee, Jeong-Min Park, Sung-Kyun Park, Jun Chun, Ki-Hyun Cho, Ji-Hyun Kim, Dong-Min Kim, Seung-Ki Kim, Eun Jeagal
  • Patent number: 9323153
    Abstract: An actinic ray-sensitive or radiation-sensitive resin composition in the present invention contains a nitrogen-containing compound (N) which is represented by the following general formula (N1): wherein, in the general formula (N1), X represents a group including a hetero atom; L represents a single bond or an alkylene group; R2 represents a substituent, in the case where a plurality of R2's are present, they may be the same as or different from each other and a plurality of R2's may be bonded to each other to form a ring; R3 represents a hydrogen atom or a substituent; and n represents an integer of 0 to 4.
    Type: Grant
    Filed: September 5, 2014
    Date of Patent: April 26, 2016
    Assignee: FUJIFILM Corporation
    Inventors: Shuji Hirano, Hiroo Takizawa, Hideaki Tsubaki
  • Patent number: 9040213
    Abstract: Disclosed is a positive photosensitive resin composition that includes (A) an alkali soluble resin prepared by a phosphorous-containing diamine represented by the following Chemical Formula 1, (B) a photosensitive diazoquinone compound, and (C) a solvent. A photosensitive resin film prepared using the same and a semiconductor device including the photosensitive resin film are also disclosed. In Chemical Formula 1, each substituent is the same as defined in the detailed description.
    Type: Grant
    Filed: September 5, 2012
    Date of Patent: May 26, 2015
    Assignee: Cheil Industries Inc.
    Inventors: Hyun-Yong Cho, Sang-Soo Kim, Eun-Kyung Yoon, Jong-Hwa Lee, Jun-Ho Lee, Eun-Ha Hwang, Ji-Yun Kwon, Jin-Young Lee
  • Patent number: 9028965
    Abstract: Disclosed are heat storage microcapsules encapsulating a water-soluble heat storage material stably and certainly, heat storage microcapsules with high durability which prevent phase separation of an inorganic salt hydrate latent heat storage material, heat storage microcapsules which prevent supercooling of a latent heat storage material to exhibit stable heat history and a manufacturing method thereof. The heat storage microcapsules comprise a core covered with a shell, wherein the core contains (a) at least one water-soluble latent heat storage material selected from a salt hydrate and a sugar alcohol and (b) a polymer derived from a water-soluble monomer mixture of a water-soluble monofunctional monomer and a water-soluble multifunctional monomer, and the shell is composed of a hydrophobic resin.
    Type: Grant
    Filed: December 6, 2011
    Date of Patent: May 12, 2015
    Assignee: Konica Minolta Business Technologies, Inc.
    Inventors: Mikio Kouyama, Ken Ohmura
  • Patent number: 9023559
    Abstract: Disclosed is a positive photosensitive resin composition that includes (A) an alkali soluble resin; (B) a novolac resin including a repeating unit represented by Chemical Formula 6; (C) a photosensitive diazoquinone compound; (D) a silane compound; and (E) a solvent, a photosensitive resin film prepared by using the positive photosensitive resin composition, and a semiconductor device including the photosensitive resin film.
    Type: Grant
    Filed: November 23, 2011
    Date of Patent: May 5, 2015
    Assignee: Cheil Industries Inc.
    Inventors: Jong-Hwa Lee, Hyun-Yong Cho, Mi-Ra Im, Hwan-Sung Cheon, Min-Kook Chung, Ji-Young Jeong, Myoung-Hwan Cha
  • Patent number: 8936891
    Abstract: The invention relates to a photosensitive polysiloxane composition that has good thermal transmittance, good chemical resistance and good sensitivity and good refractivity. The invention also provides a method for forming a thin film on a substrate, a thin film on a substrate and an apparatus.
    Type: Grant
    Filed: December 18, 2013
    Date of Patent: January 20, 2015
    Assignee: Chi Mei Corporation
    Inventors: Ming-Ju Wu, Chun-An Shih
  • Patent number: 8921019
    Abstract: Disclosed are a positive photosensitive resin composition that includes (A) an alkali soluble resin including a polybenzoxazole precursor, a polyimide precursor, or a combination thereof, (B) a photosensitive diazoquinone compound, (C) a phenol compound, (D) at least one organic dye having an absorption wavelength of about 400 nm to about 700 nm, and (E) a solvent, wherein the organic dye (D) is included in an amount of about 1 to about 40 parts by weight based on about 100 parts by weight of the alkali soluble resin (A), and a photosensitive resin layer and a display device using the same.
    Type: Grant
    Filed: September 5, 2012
    Date of Patent: December 30, 2014
    Assignee: Cheil Industries Inc.
    Inventors: Ji-Yun Kwon, Jin-Hee Kang, Dae-Yun Kim, Sang-Kyeon Kim, Sang-Kyun Kim, Sang-Soo Kim, Kun-Bae Noh, Eun-Kyung Yoon, Jong-Hwa Lee, Jun-Ho Lee, Jin-Young Lee, Hwan-Sung Cheon, Hyun-Yong Cho, Chung-Beom Hong, Eun-Ha Hwang
  • Patent number: 8921024
    Abstract: A photosensitive polysiloxane composition for forming a protective film having superior sensitivity is disclosed. A protective film formed from the photosensitive polysiloxane composition and an element including the protective film are also disclosed. The photosensitive polysiloxane composition includes a polysiloxane, an o-naphthoquinonediazidesulfonic acid ester, a urethane(meth)acrylate compound having at least six (meth)acryloyl groups in a molecule, and a solvent.
    Type: Grant
    Filed: December 6, 2013
    Date of Patent: December 30, 2014
    Assignee: Chi Mei Corporation
    Inventors: Ming-Ju Wu, Chun-An Shih
  • Patent number: 8911926
    Abstract: A method of forming a metal pattern is disclosed. In the method, a metal layer is formed on a base substrate. A photoresist composition is coated on the metal layer to form a coating layer. The photoresist composition includes a binder resin, a photo-sensitizer, a mercaptopropionic acid compound and a solvent. The coating layer is exposed to a light. The coating layer is partially removed to form a photoresist pattern. The metal layer is patterned by using the photoresist pattern as a mask.
    Type: Grant
    Filed: April 5, 2013
    Date of Patent: December 16, 2014
    Assignee: Samsung Display Co., Ltd.
    Inventors: Jeong-Won Kim, Min Kang, Bong-Yeon Kim, Jin-Ho Ju, Dong-Min Kim, Tae-Gyun Kim, Joo-Kyoung Park, Chul-Won Park, Jun-Hyuk Woo, Won-Young Lee, Hyun-Joo Lee, Eun Jeagal
  • Patent number: 8883391
    Abstract: Disclosed is a positive-type photosensitive resin composition which has excellent storage stability, particularly excellent sensitivity stability, and can be formed into a cured film having excellent adhesion onto a substrate when heated at 350° C. or higher or heated in the air. The positive-type photosensitive resin composition comprises (a) a polymer having, as the main component, at least one structure selected from the group consisting of a polyimide precursor structure, a polybenzoxazole precursor structure, and a polyimide structure, (b) a quinonediazide compound, (c) a silane coupling agent having a styryl group, (d) a silane coupling agent having an epoxy group, an oxetanyl group, a methacryloxy group, an acryloxy group, an amino group, an amide group or mercapto group and an alkoxysilyl group, and (e) a solvent.
    Type: Grant
    Filed: December 7, 2010
    Date of Patent: November 11, 2014
    Assignee: Toray Industries, Inc.
    Inventors: Tomotsugu Miyabe, Yoji Fujita
  • Patent number: 8822123
    Abstract: Polymeric materials, methods for making the polymeric materials, and photoresist formulations utilizing the polymeric materials are disclosed. In one aspect, a polymeric material is provided including a condensation product of a reaction mixture comprising an aldehyde with a phenolic monomer composition comprising m-cresol, p-cresol, 3,5-dimethyl phenol, and 2,5-dimethyl phenol. The polymeric material may be further contacted with a photoactive compound and a solvent to form a photoresist formulation.
    Type: Grant
    Filed: July 13, 2012
    Date of Patent: September 2, 2014
    Assignee: Momentive Specialty Chemicals Inc.
    Inventors: Ashok T. Reddy, Joseph E. Wentworth
  • Patent number: 8815489
    Abstract: Disclosed are a positive photosensitive resin composition that includes (A) a polybenzoxazole precursor including a first polybenzoxazole precursor including a repeating unit represented by the following Chemical Formula 1 and a repeating unit represented by the following Chemical Formula 2, and having a thermally polymerizable functional group at at least one of the terminal end; (B) a dissolution controlling agent including a novolac resin including a repeating unit represented by the following Chemical Formula 4; (C) a photosensitive diazoquinone compound; (D) a silane compound; (E) an acid generator; and (F) a solvent, a photosensitive resin film prepared using the same, and a semiconductor device including the photosensitive resin film.
    Type: Grant
    Filed: August 21, 2012
    Date of Patent: August 26, 2014
    Assignee: Cheil Industries Inc.
    Inventors: Ji-Young Jeong, Jin-Young Lee, Jong-Hwa Lee, Hyun-Yong Cho, Sang-Soo Kim, Eun-Kyung Yoon, Jun-Ho Lee, Myoung-Hwan Cha, Eun-Ha Hwang
  • Patent number: 8785103
    Abstract: Disclosed is a photosensitive novolac resin including a structural unit represented by the following Chemical Formula 1 and structural unit represented by the following Chemical Formula 2, wherein R11, R12, R13, and R14 in Chemical Formulae 1 and 2 are the same as defined in the detailed description, a positive photosensitive resin composition including the same, a photosensitive resin film fabricated using the same, and a semiconductor device including the photosensitive resin composition.
    Type: Grant
    Filed: August 21, 2012
    Date of Patent: July 22, 2014
    Assignee: Cheil Industries Inc.
    Inventors: Jong-Hwa Lee, Hyun-Yong Cho, Min-Kook Chung, Ji-Young Jeong, Myoung-Hwan Cha
  • Patent number: 8652749
    Abstract: A photoresist composition is provided. The photoresist composition includes an alkali-soluble resin; a photosensitizer containing a first compound that contains a diazonaphthoquinone represented by Formula 1 and a second compound that contains a diazonaphthoquinone represented by Formula 2; and a solvent. and R1 is selected from the group consisting of a hydrogen atom, an alkyl group having 1 to 4 carbons, an alkenyl group having 2 to 4 carbons, a cycloalkyl group having 3 to 8 carbons, and an aryl group having 6 to 12 carbons, and R2 is selected from the group consisting of Cl, F, Br, and I.
    Type: Grant
    Filed: February 28, 2011
    Date of Patent: February 18, 2014
    Assignees: Samsung Display Co., Ltd., AZ Electronic Materials (Korea) Ltd.
    Inventors: Hi-Kuk Lee, Sang-Hyun Yun, Cha-Dong Kim, Jung-In Park, Deok-Man Kang, Youn-Suk Kim, Sae-Tae Oh
  • Patent number: 8568954
    Abstract: A positive photosensitive resin composition according to one embodiment of the present invention includes a polyamic acid or a polyamic acid ester compound including a repeating unit represented by Formula 1 defined in this specification, a photosensitive diazoquinone compound, a silane compound, a phenol compound, and a solvent. The positive photosensitive resin composition can be cured at a low temperature of 260° C. or less, and can have high sensitivity, resolution, residue removal, substrate adherence, and pattern-forming capabilities, and low film shrinkage.
    Type: Grant
    Filed: September 17, 2010
    Date of Patent: October 29, 2013
    Assignee: Cheil Industries Inc.
    Inventors: Doo-Young Jung, Ji-Young Jeong, Hyun-Yong Cho, Yong-Sik Yoo, Kil-Sung Lee, Myoung-Hwan Cha
  • Patent number: 8563214
    Abstract: The present invention relates to a radiation sensitive resin composition comprising [A] an alkali-soluble resin, [B] a 1,2-quinonediazide compound and [C] a radical trapping agent. The radiation sensitive resin composition can provide an interlayer insulating film which satisfies general requirements for an interlayer insulating film such as high light transmittance and has excellent heat-resistant dimensional stability, heat discoloration resistance and adhesion to a substrate along with the improvement of process efficiency for improving product yield at a high resolution and has excellent storage stability.
    Type: Grant
    Filed: October 14, 2010
    Date of Patent: October 22, 2013
    Assignees: Sharp Corporation, JSR Corporation
    Inventors: Katsuhiro Kikuchi, Kentaro Usui, Masakazu Shibasaki, Takashi Ochi, Tatsuro Kato, Kenichi Hamada, Masashi Arai, Megumi Murata, Hideaki Takase
  • Patent number: 8563215
    Abstract: The present invention provides novel diazonaphthoquinonesulfonic acid bisphenol derivatives. More particularly, the present invention relates to photo restive coating comprising alkali-soluble resin, a photoactive compound and a surfactant. The photoresist film prepared has less then one micron. The photoactive compound is soluble or swellable in aqueous alkaline solutions and is diazonaphthoquinonesulfonic bisphenol esters of the general formula (A), wherein DNQ represents a 2-Diazo-1-naphthoquinone-4-sulfonyl, 2-Diazo-1-naphthoquinone-5-sulfonyl, 1-Diazo-2-naphthoquinone-4-sulfonyl groups and R1 R1 represents an alkyl, aryl and substituted aryl groups. The invention also provides a process for coating and imaging the light-sensitive composition.
    Type: Grant
    Filed: March 20, 2008
    Date of Patent: October 22, 2013
    Assignee: Council of Scientific & Industrial Research
    Inventors: Vummadi Venkat Reddy, Vaidya Jayathirtha Rao, Mannepalli Lakshmi Kantam, Sunkara Sakunthala Madhavendra, Virendra Kumar Dwivedi
  • Patent number: 8530133
    Abstract: Embodiments in accordance with the present invention provide for norbornane-type ballast materials, norbornane-type photoactive compounds derived from such ballast materials and alkali-soluble positive-tone polymer compositions that encompass such norbornane-type photoactive compounds and one of a PBO or PNB resin.
    Type: Grant
    Filed: September 28, 2011
    Date of Patent: September 10, 2013
    Assignee: Promerus, LLC
    Inventors: Andrew Bell, Keitaro Seto, Hiroaki Makabe, Edmund Elce
  • Patent number: 8501375
    Abstract: Disclosed is a positive photosensitive resin composition that includes (A) a polybenzoxazole precursor including a repeating unit represented by the following Chemical Formula 1; (B) a photosensitive diazoquinone compound; (C) a silane compound; (D) a phenol compound; and (E) a solvent. In the above Chemical Formula 1, each substituent is the same as defined in the specification.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: August 6, 2013
    Assignee: Cheil Industries Inc.
    Inventors: Hyun-Yong Cho, Min-Kook Chung, Ji-Young Jeong, Jong-Hwa Lee, Yong-Sik Yoo, Jeong-Woo Lee, Hwan-Sung Cheon, Soo-Young Kim, Young-Ho Kim, Jae-Hyun Kim, Su-Min Park
  • Patent number: 8367283
    Abstract: The positive photosensitive resin composition of the present invention has a polyamide resin and a photosensitive agent, wherein the polyamide resin has a specific structure. The cured film of the present invention has a cured product of the positive photosensitive resin composition. The protecting film and insulating film of the present invention has the cured film each. The semiconductor device and display device of the present invention has the cured film each.
    Type: Grant
    Filed: July 16, 2009
    Date of Patent: February 5, 2013
    Assignee: Sumitomo Bakelite Company, Ltd.
    Inventor: Miki Terayama
  • Patent number: 8309280
    Abstract: A positive-type photosensitive resin composition includes (A) a polyamide resin that includes a structural unit shown by the following formula (1) and a structural unit shown by the following formula (2), and (B) a photosensitive compound, the polyamide resin (A) having a weight average molecular weight (Mw) of 5000 to 80,000, and a cured film obtained by curing the positive-type photosensitive resin composition at 250° C. having a tensile modulus of elasticity of 2.0 to 4.0 GPa and a tensile elongation of 10 to 100%. According to the present invention, a positive-type photosensitive resin composition that can be cured at a low temperature and a highly reliable semiconductor device including a cured film of the positive-type photosensitive resin composition can be provided.
    Type: Grant
    Filed: August 8, 2008
    Date of Patent: November 13, 2012
    Assignee: Sumitomo Bakelite Co., Ltd.
    Inventor: Toshio Banba