Abstract: A method of forming a structure comprises forming a pattern of self-assembled nucleic acids over a material. The pattern of self-assembled nucleic acids is exposed to at least one repair enzyme to repair defects in the pattern. The repaired pattern of self-assembled nucleic acids is transferred to the material to form features therein. A method of decreasing defect density in self-assembled nucleic acids is also disclosed. Self-assembled nucleic acids exhibiting an initial defect density are formed over at least a portion of a material and the self-assembled nucleic acids are exposed to at least one repair enzyme to repair defects in the self-assembled nucleic acids. Additional methods are also disclosed.

Abstract: Provided are an actinic ray-sensitive or radiation-sensitive resin composition, used for forming an actinic ray-sensitive or radiation-sensitive film having a film thickness of 1 ?m or more, and for being exposed to actinic rays having a wavelength of 200 to 300 nm or radiation, in which the transmittance, with respect to light at a wavelength of 248 nm, of an actinic ray-sensitive or radiation-sensitive film having a film thickness of 12 ?m, which is formed using the actinic ray-sensitive or radiation-sensitive resin composition, is 5% or more, and a pattern having an excellent sensitivity as well as an excellent cross-sectional shape can be formed by the actinic ray-sensitive or radiation-sensitive resin composition in a case where an actinic ray-sensitive or radiation-sensitive film having a film thickness of 1 ?m or more is exposed to light at a wavelength of 200 to 300 nm.

Abstract: In one embodiment, a method of manufacturing an RFID label includes providing a web structure comprising a dielectric layer and a metal layer; depositing a non-removable resist on the metal layer, the deposition of the non-removable resist defining an antenna; depositing a removable resist on the metal layer, the deposition of the removable resist defining connection pads for connecting an integrated circuit (IC) to the antenna; etching the metal layer to form the antenna and the connection pads; removing the removable resist from the metal layer to expose the connection pads; and attaching the IC to the connection pads.

Abstract: An allyl-containing resin is provided. The allyl-containing resin comprises a repeating unit comprising a structural unit represented by the following formula (I): wherein, R1 to R3 in formula (I) are as defined in the specification; the Fourier transform infrared spectrum of the allyl-containing resin has a signal intensity “a” from 1650 cm?1 to 1630 cm?1 and a signal intensity “b” from 1620 cm?1 to 1560 cm?1, and 0<a/b?1.20; and the quantitative 1H-NMR spectrum of the allyl-containing resin has a signal intensity “c” from 3.2 ppm to 6.2 ppm and a signal intensity “d” from 6.6 ppm to 7.4 ppm, and 0<c/d?1.20.

Abstract: The present invention employs a compound represented by the following formula (0): wherein RY is a linear, branched, or cyclic alkyl group of 1 to 30 carbon atoms or an aryl group of 6 to 30 carbon atoms; RZ is an N-valent group of 1 to 60 carbon atoms or a single bond; each RT is independently an alkyl group of 1 to 30 carbon atoms optionally having a substituent, an aryl group of 6 to 40 carbon atoms optionally having a substituent, an alkenyl group of 2 to 30 carbon atoms optionally having a substituent, an alkoxy group of 1 to 30 carbon atoms optionally having a substituent, a halogen atom, a nitro group, an amino group, a cyano group, a thiol group, a hydroxy group, or a group in which a hydrogen atom of a hydroxy group is replaced with an acid dissociation group, wherein the alkyl group, the alkenyl group, and the aryl group each optionally contain an ether bond, a ketone bond, or an ester bond, wherein at least one RT is a hydroxy group or a group in which a hydrogen atom of a hydroxy group is

Abstract: The present application for patent relates to a light-sensitive positive working photosensitive composition especially useful for imaging thick films using a composition which gives very good film uniformity and promotes a good process latitude against feature pattern collapse in patterns created upon imaging and developing of these films.

Abstract: The present invention relates to a photosensitive resin composition and to a cured film formed therefrom, wherein the photosensitive resin composition can improve the sensitivity by using an alcoholic solvent, along with a siloxane polymer and a quinone diazide compound conventionally used, which enhances the solubility in a developer through an interaction between the alcohol and the diazonaphthoquinone (DNQ) group in the quinone diazide compound, as well as can form a cure film having excellent film retention rate even after post-bake.

Abstract: Disclosed herein are formulations, substrates, and arrays. Also disclosed herein are methods for manufacturing and using the formulations, substrates, and arrays. Also disclosed are methods for identifying peptide sequences useful for diagnosis and treatment of disorders, and methods for using the peptide sequences for diagnosis and treatment of disorders, e.g., celiac disorder. In certain embodiments, substrates and arrays comprise a porous layer for synthesis and attachment of polymers or biomolecules.

Abstract: Methods and composition sets for forming etch-resist masks on a metallic surface are provided. The method may include applying a composition comprising a first reactive component onto a metallic surface to form a primer layer; and image-wise printing by a nonimpact printing process on the primer layer another composition comprising a second reactive component to produce an etch-resist mask, wherein when droplets of the second composition contact the primer layer, the reactive components undergo a chemical reaction so as to immobilize the droplets. The set may include a first liquid composition comprising a fixating reactive component and a second liquid composition comprising an etch-resist reactive component, wherein the fixating reactive component and the fixating reactive component are capable undergoing a chemical reaction to form a bi-component material that is insoluble in water and in an acidic etch solution.

Abstract: A photolithiographic method for fabricating bank structures with improved non-wetting properties to form well regions on a substrate using a photoresist composition comprising a cresol novolak resin, a photoactive diazonaphthoquinone sulfonic ester of a polyhydroxybenzophenone compound with at least one free hydroxyl group, and a non-ionic urethane polyglycol fluorosurfactant. Inkjet methods can be used to deposit active materials into the well areas. Color filter arrays and optoelectronic devices such as OLED devices can be made by this method.

Abstract: There are provided a phenolic-hydroxyl-group-containing novolac resin and resist film that are excellent in developability, heat resistance, and conformability to substrates. The phenolic-hydroxyl-group-containing novolac resin is a polycondensate of which the essential reactive components are a phenolic-hydroxyl-group-containing compound (A) represented by Structural Formula (1) [where Ar is a structural part represented by Structural Formula (Ar-1) or (Ar-2), a phenolic-hydroxyl-group-containing compound (B) represented by Structural Formula (2) [where R3 is an aliphatic hydrocarbon group having 4 to 20 carbon atoms, and j is an integer from 1 to 3], and an aldehyde compound (C).

Abstract: A method for producing a polymer of the present invention includes the following steps (a) and (b): step (a): producing a polymer in the presence of an acid or base catalyst; and step (b): contacting a solution containing the polymer obtained in step (a) to a mixed resin of an anion-exchange resin and a cation-exchange resin.

Abstract: There are provided a photosensitive resin composition having excellent chemical resistance, light resistance, and solubility in a solvent, a method for producing a cured film, a cured film, a liquid crystal display device, an organic electroluminescent display device, and a touch panel. The photosensitive resin composition contains a polybenzoxazole precursor, a photoacid generator which generates an acid having a pKa of 3 or less or a quinone diazide compound, and a solvent, in which the polybenzoxazole precursor contains a total of 70 mol % or more of a repeating unit represented by the following Formula (1) and a repeating unit represented by the following Formula (2) with respect to the total repeating units, and a ratio between the repeating unit represented by Formula (1) and the repeating unit represented by Formula (2) is 9:1 to 3:7 in a molar ratio. Y1 represents a cyclic aliphatic group having 3 to 15 carbon atoms, and Y2 represents a linear or branched aliphatic group having 4 to 20 carbon atoms.

Abstract: A photosensitive resin composition, a method of manufacturing a substrate with a template using the composition, and a method of manufacturing a plated article using the substrate with a template. The photosensitive resin composition may be used to form a plated article on a metal surface of a substrate The composition includes an acid generator that, when irradiated with an active ray or radiation, generates an acid, a resin that, under an action of an acid, undergoes an increase in solubility thereof in alkali, and a fluorene compound represented by the formula (1).

Abstract: The present invention provides a photosensitive composition having excellent heat resistance, low absorbance at the exposure light at wavelengths of g-line, h-line, and i-line, and satisfactory sensitivity even when the thickness of a resist film is increased, and also provides a resist material, a coating film thereof, a novolac phenol resin suitable for these applications, and a method for producing the phenol resin.

Abstract: A system and method for photoresists is provided. In an embodiment a cross-linking or coupling reagent is included within a photoresist composition. The cross-linking or coupling reagent will react with the polymer resin within the photoresist composition to cross-link or couple the polymers together, resulting in a polymer with a larger molecular weight. This larger molecular weight will cause the dissolution rate of the photoresist to decrease, leading to a better depth of focus for the line.

Abstract: The present invention provides a method for forming an organic film, including: forming a coating film by spin coating of an organic film-forming composition onto a substrate having an uneven pattern, and thereafter subjecting the substrate to a vibration treatment, and after or simultaneously with the vibration treatment, insolubilizing the coating film to an organic solvent to form the organic film. This provides a method for forming an organic film that can fill an uneven pattern on a substrate to highly flatten a substrate at low cost in a production step of a semiconductor apparatus, etc.

Abstract: A resin composition includes a polymer including a repeating unit represented by Chemical Formula 1, wherein in Chemical Formula 1, each substituent is the same as defined in the specification, and a solvent and an organic film manufactured using the same is provided.

Abstract: Disclosed are a phenolic hydroxyl group-containing resin which has excellent alkali developing properties and makes it possible to exhibit high heat resistance in a cured product obtained therefrom, a production method therefor, a photosensitive composition, a resist material, a coating film, a curable composition and a cured product thereof, and a resist underlayer film. A phenolic hydroxyl group-containing resin, including a compound (A) having a molecular structure represented by the following Structural Formula (1). (In the formula, R1 represents an alkyl group, an alkoxy group, or an aryl group, R2 represents a hydrogen atom, an alkyl group, or an aryl group, m is an integer of 1 to 3, and n is an integer of 2 to 15. In the case where m is 2 or more, plural R1's may be the same as or different from each other.

Abstract: Various cycloolefinic/maleic anhydride/maleimide polymers and compositions thereof useful for forming self-imageable films encompassing such polymers are disclosed. Such polymers encompass norbornene-type repeating units, maleimide repeat units and maleic anhydride-type repeating units where at least some of such maleic anhydride-type repeating units have been ring-opened. The films formed from such polymer compositions provide self imageable, low-k, thermally stable layers for use in microelectronic and optoelectronic devices.

Abstract: This invention relates to a positive-type photosensitive resin composition which includes an alkali soluble polyimide resin, a diazide-based photosensitive compound and a sensitivity enhancer, and in which the use of a polyimide resin wherein the degree of imidization of imidized polyimide resin is 50˜75% exhibits a light transmittance of 95% or more in the visible light wavelength range (400˜650 nm) as well as high developability in a patterning process, and to an insulating film and an OLED formed using the same.

Abstract: The present invention relates to a photosensitive resin composition for black matrix, as well as a color filter and a liquid crystal display (LCD) device formed by the composition. The aforementioned photosensitive resin composition comprises an alkali-soluble resin (A), a compound containing vinyl unsaturated group(s) (B), a photo initiator (C), quinonediazide sulfonic acid ester (D), a solvent (E) and black pigment (F). The alkali-soluble resin (A) includes epoxy resin having unsaturated group(s) (A-1), which is obtained by reacting an epoxy resin (i) having at least two epoxy groups with a compound (ii) having at least one vinyl unsaturated group and carboxyl group. The aforementioned photo initiator (C) includes an O-acyloxime compound (C-1).

Abstract: An electrophotographic photosensitive member includes an undercoat layer that includes metal oxide particles and a compound having at least three hydroxyl groups and a carbonyl or dicarbonyl group.

Abstract: A resist composition contains: a resin having an acid-labile group, an acid generator, a compound having two or more phenolic-hydroxy groups and being other than a resin, and a solvent. The resist composition of the disclosure can provide a resist pattern showing excellent shape and detachability, therefore, the present resist composition can be used for semiconductor microfabrication with resist patterns showing excellent shape.

Abstract: The present application discloses a method of fabricating an array substrate comprising forming a via extending through a first insulating layer and a second insulating layer, the via comprising a first sub-via in the first insulating layer and the second sub-via in a second insulating layer; mobilizing a portion of first insulating layer material surrounding the first sub-via; and distributing the mobilized portion of the first insulating layer material over a sidewall of the second sub-via.

Abstract: Resist compositions for photosensitive chemically amplified resist processing, as well as methods for processing substrates using a photosensitive chemically amplified resist are disclosed for improved CD uniformity. A resist composition or layer generates photosensitizer when the resist is exposed to a first wavelength of light. A second wavelength of light is later used to amplify an acid reaction. The radiation-sensitive layer also includes a photo-active agent that, when exposed to a third light wavelength, modifies a concentration of photosensitizer in the radiation-sensitive layer. The third light wavelength can be projected as a pattern of radiation using a digital pixel-based projection system, with the projected pattern based on a critical dimension signature. In a subsequent exposure step, the resist layer is exposed to light of the second wavelength that induces or amplifies the acid concentration within the photoresist film.

Abstract: Provided is a method of manufacturing a film, including: applying, onto a substrate, a photocurable composition containing a polymerizable monomer, a photopolymerization initiator, and a photosensitive gas generator that generates a gas through light stimulation to form an applied film; bringing a mold into contact with the applied film; irradiating the applied film with light through the mold to cure the applied film and to generate the gas in the applied film; and releasing the mold from the applied film after the irradiation of the applied film with the light to form a film (cured film) having a predetermined pattern shape on the substrate, in which in the irradiation of the applied film with the light, a reaction rate of a polymerization reaction of the polymerizable monomer in the applied film is higher than a reaction rate of a gas-generating reaction of the photosensitive gas generator in the applied film.

Abstract: A pattern-forming method includes providing a resist underlayer film on a substrate using a resist underlayer film-forming composition. The resist underlayer film-forming composition includes a first polymer having a glass transition temperature of 0 to 180° C. A silicon-based oxide film is provided on a surface of the resist underlayer film. A resist pattern is provided on a surface of the silicon-based oxide film using a resist composition. The silicon-based oxide film and the resist underlayer film are sequentially dry-etched using the resist pattern as a mask. The substrate is dry-etched using the dry-etched resist underlayer film as a mask.

Abstract: The invention provides compounds of formula I: or a salt thereof as described herein. The invention also provides pharmaceutical compositions comprising a compound of formula I, processes for preparing compounds of formula I, intermediates useful for preparing compounds of formula I and therapeutic methods for treating cancer or treating autoimmune diseases or preventing transplant rejection using compounds of formula I.

Abstract: A method for manufacturing an NO2 gas sensor for detection at room temperature comprises: manufacturing a metal electrode on a surface of a flexible substrate; manufacturing an SWCNTs/SnO2 sensitive film; and bonding the SWCNTs/SnO2 sensitive film with a portion of the surface of the flexible substrate with the metal electrode, so as to form the NO2 gas sensor for detection at room temperature. The present disclosure solves the problems of the poor adhesion between the sensitive material and the flexible substrate, and a non-uniform distribution, and achieves the purposes of secure bonding between the sensitive material and the flexible substrate, and uniform distribution.

Abstract: The present invention relates to a photosensitive resin composition, a protective film and an element having the same. The aforementioned photosensitive resin composition includes a polysiloxane resin (A), an alkali-soluble resin (B), an ortho-naphthoquinone diazide sulfonic acid ester (C) and a solvent (D). The alkali-soluble resin (B) is copolymerized by an unsaturated carboxylic acid or unsaturated carboxylic anhydride compound (b1), a fluorene derivative having a double-bond group (b2) and an unsaturated compound having an acid-decomposable group (b3).

Abstract: There is provided a polymer including a structural unit represented by the following Formula (1a), a structural unit represented by the following Formula (1b) and a structural unit represented by the following Formula (1c) (In Formula (1a), n represents 0, 1 or 2. Each of R1, R2, R3 and R4 independently represents a hydrogen atom or an organic group having 1 to 10 carbon atoms. In Formula (1c), R5 represents an organic group having 1 to 10 carbon atoms.

Abstract: An organic light-emitting diode display device includes a substrate, a light-absorption layer, an active array structure, and an organic light-emitting diode. The substrate has a first and a second surface opposite to each other. The light-absorption layer is disposed on the first surface, and has at least one opening exposing a portion of the first surface. The active array structure is positioned on the second surface, and includes at least one data line, at least one gate line, and at least one switching device electrically connected to the gate and data lines. The light-absorption layer overlaps at least one of the data line and the gate line when viewed in a direction perpendicular to the substrate. The organic light-emitting diode is electrically connected to the switching device, and the organic light-emitting diode overlaps the opening when viewed in the direction perpendicular to the substrate.

Abstract: A method for marking a petroleum hydrocarbon or a liquid biologically derived fuel. The method comprises adding to a petroleum hydrocarbon or a liquid biologically derived fuel at least one compound having formula (I), wherein R is C1-C12 alkyl, C3-C12 alkenyl or C7-C12 aralkyl; wherein each compound having formula (I) is present at a level from 0.01 ppm to 50 ppm.

Abstract: A photoresist composition, a method of forming a pattern, and a method of manufacturing a thin film transistor substrate, the composition including a solvent, a novolak resin, a diazide-based photo-sensitizer, an acryl compound represented by the following Chemical Formula 1:

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition in the present invention contains a nitrogen-containing compound (N) which is represented by the following general formula (N1): wherein, in the general formula (N1), X represents a group including a hetero atom; L represents a single bond or an alkylene group; R2 represents a substituent, in the case where a plurality of R2's are present, they may be the same as or different from each other and a plurality of R2's may be bonded to each other to form a ring; R3 represents a hydrogen atom or a substituent; and n represents an integer of 0 to 4.

Abstract: Disclosed is a positive photosensitive resin composition that includes (A) an alkali soluble resin prepared by a phosphorous-containing diamine represented by the following Chemical Formula 1, (B) a photosensitive diazoquinone compound, and (C) a solvent. A photosensitive resin film prepared using the same and a semiconductor device including the photosensitive resin film are also disclosed. In Chemical Formula 1, each substituent is the same as defined in the detailed description.

Abstract: Disclosed are heat storage microcapsules encapsulating a water-soluble heat storage material stably and certainly, heat storage microcapsules with high durability which prevent phase separation of an inorganic salt hydrate latent heat storage material, heat storage microcapsules which prevent supercooling of a latent heat storage material to exhibit stable heat history and a manufacturing method thereof. The heat storage microcapsules comprise a core covered with a shell, wherein the core contains (a) at least one water-soluble latent heat storage material selected from a salt hydrate and a sugar alcohol and (b) a polymer derived from a water-soluble monomer mixture of a water-soluble monofunctional monomer and a water-soluble multifunctional monomer, and the shell is composed of a hydrophobic resin.

Abstract: Disclosed is a positive photosensitive resin composition that includes (A) an alkali soluble resin; (B) a novolac resin including a repeating unit represented by Chemical Formula 6; (C) a photosensitive diazoquinone compound; (D) a silane compound; and (E) a solvent, a photosensitive resin film prepared by using the positive photosensitive resin composition, and a semiconductor device including the photosensitive resin film.

Abstract: The invention relates to a photosensitive polysiloxane composition that has good thermal transmittance, good chemical resistance and good sensitivity and good refractivity. The invention also provides a method for forming a thin film on a substrate, a thin film on a substrate and an apparatus.

Abstract: A photosensitive polysiloxane composition for forming a protective film having superior sensitivity is disclosed. A protective film formed from the photosensitive polysiloxane composition and an element including the protective film are also disclosed. The photosensitive polysiloxane composition includes a polysiloxane, an o-naphthoquinonediazidesulfonic acid ester, a urethane(meth)acrylate compound having at least six (meth)acryloyl groups in a molecule, and a solvent.

Abstract: Disclosed are a positive photosensitive resin composition that includes (A) an alkali soluble resin including a polybenzoxazole precursor, a polyimide precursor, or a combination thereof, (B) a photosensitive diazoquinone compound, (C) a phenol compound, (D) at least one organic dye having an absorption wavelength of about 400 nm to about 700 nm, and (E) a solvent, wherein the organic dye (D) is included in an amount of about 1 to about 40 parts by weight based on about 100 parts by weight of the alkali soluble resin (A), and a photosensitive resin layer and a display device using the same.

Abstract: A method of forming a metal pattern is disclosed. In the method, a metal layer is formed on a base substrate. A photoresist composition is coated on the metal layer to form a coating layer. The photoresist composition includes a binder resin, a photo-sensitizer, a mercaptopropionic acid compound and a solvent. The coating layer is exposed to a light. The coating layer is partially removed to form a photoresist pattern. The metal layer is patterned by using the photoresist pattern as a mask.

Abstract: Disclosed is a positive-type photosensitive resin composition which has excellent storage stability, particularly excellent sensitivity stability, and can be formed into a cured film having excellent adhesion onto a substrate when heated at 350° C. or higher or heated in the air. The positive-type photosensitive resin composition comprises (a) a polymer having, as the main component, at least one structure selected from the group consisting of a polyimide precursor structure, a polybenzoxazole precursor structure, and a polyimide structure, (b) a quinonediazide compound, (c) a silane coupling agent having a styryl group, (d) a silane coupling agent having an epoxy group, an oxetanyl group, a methacryloxy group, an acryloxy group, an amino group, an amide group or mercapto group and an alkoxysilyl group, and (e) a solvent.

Abstract: Polymeric materials, methods for making the polymeric materials, and photoresist formulations utilizing the polymeric materials are disclosed. In one aspect, a polymeric material is provided including a condensation product of a reaction mixture comprising an aldehyde with a phenolic monomer composition comprising m-cresol, p-cresol, 3,5-dimethyl phenol, and 2,5-dimethyl phenol. The polymeric material may be further contacted with a photoactive compound and a solvent to form a photoresist formulation.

Abstract: Disclosed are a positive photosensitive resin composition that includes (A) a polybenzoxazole precursor including a first polybenzoxazole precursor including a repeating unit represented by the following Chemical Formula 1 and a repeating unit represented by the following Chemical Formula 2, and having a thermally polymerizable functional group at at least one of the terminal end; (B) a dissolution controlling agent including a novolac resin including a repeating unit represented by the following Chemical Formula 4; (C) a photosensitive diazoquinone compound; (D) a silane compound; (E) an acid generator; and (F) a solvent, a photosensitive resin film prepared using the same, and a semiconductor device including the photosensitive resin film.

Abstract: Disclosed is a photosensitive novolac resin including a structural unit represented by the following Chemical Formula 1 and structural unit represented by the following Chemical Formula 2, wherein R11, R12, R13, and R14 in Chemical Formulae 1 and 2 are the same as defined in the detailed description, a positive photosensitive resin composition including the same, a photosensitive resin film fabricated using the same, and a semiconductor device including the photosensitive resin composition.

Abstract: A photoresist composition is provided. The photoresist composition includes an alkali-soluble resin; a photosensitizer containing a first compound that contains a diazonaphthoquinone represented by Formula 1 and a second compound that contains a diazonaphthoquinone represented by Formula 2; and a solvent. and R1 is selected from the group consisting of a hydrogen atom, an alkyl group having 1 to 4 carbons, an alkenyl group having 2 to 4 carbons, a cycloalkyl group having 3 to 8 carbons, and an aryl group having 6 to 12 carbons, and R2 is selected from the group consisting of Cl, F, Br, and I.

Abstract: A positive photosensitive resin composition according to one embodiment of the present invention includes a polyamic acid or a polyamic acid ester compound including a repeating unit represented by Formula 1 defined in this specification, a photosensitive diazoquinone compound, a silane compound, a phenol compound, and a solvent. The positive photosensitive resin composition can be cured at a low temperature of 260° C. or less, and can have high sensitivity, resolution, residue removal, substrate adherence, and pattern-forming capabilities, and low film shrinkage.

Abstract: The present invention relates to a radiation sensitive resin composition comprising [A] an alkali-soluble resin, [B] a 1,2-quinonediazide compound and [C] a radical trapping agent. The radiation sensitive resin composition can provide an interlayer insulating film which satisfies general requirements for an interlayer insulating film such as high light transmittance and has excellent heat-resistant dimensional stability, heat discoloration resistance and adhesion to a substrate along with the improvement of process efficiency for improving product yield at a high resolution and has excellent storage stability.