Abstract: A display panel and a display device.

Abstract: The present invention relates to a polyimide film showing a low stress change rate on a silicon wafer. The present invention can minimize cracks which are formed due to the stress change of polyimide, in a process for depositing an inorganic film on a polyimide substrate at a high temperature, and thus can reduce electrical property degradation such as a recoverable residual image and decrease in current of a flexible display.

Abstract: According to one embodiment, an original plate for imprint lithography has a first surface side having a patterned portion thereon. The patterned portion includes a groove having a bottom surface recessed from a first surface to a first depth, and a columnar portion on the bottom surface and protruding from the bottom surface to extend beyond the first surface. The original plate may be used to form replica templates by imprint lithography processes. The replica templates can be used in semiconductor device manufacturing processes or the like.

Abstract: A display panel includes: a substrate comprising a first display area and a second display area surrounded by the first display area; an insulating layer including an organic insulating material; a plurality of first light-emitting elements in the first display area; a plurality of second light-emitting elements in the second display area, the second light-emitting elements comprising light-emitting elements separated from one another to define transmission areas; and a photorefractive portion in each of the transmission areas.

Abstract: A method for manufacturing a cured product pattern of a curable composition includes the steps of, in sequence, depositing a droplet of the curable composition onto a substrate; bringing a mold having an uneven pattern formed in a surface thereof into contact with the curable composition; curing the curable composition; and releasing a cured product of the curable composition from the mold. The mold has a recess having a bottom surface and a stair structure arranged to form an opening surface that becomes wider from the bottom surface toward the surface of the mold. In the contact step, the curable composition comes into contact with the stair portion after a top of the droplet comes into contact with the bottom surface.

Abstract: A representative method includes forming a photo-sensitive material over a substrate, and forming a cap layer over the photo-sensitive material, and patterning the cap layer. Using the patterned cap layer, a first portion of the photo-sensitive material is selectively exposed to a pre-selected light wavelength to change at least one material property of the first portion of the photo-sensitive material, while preventing a second portion of the photo-sensitive material from being exposed to the pre-selected light wavelength. One, but not both of the following steps is then conducted: removing the first portion of the photo-sensitive material and forming in its place a conductive element at least partially surrounded by the second portion of the photo-sensitive material, or removing the second portion of the photo-sensitive material and forming from the first portion of the photo-sensitive material a conductive element electrically connecting two or more portions of a circuit.

Abstract: A semiconductor device of an embodiment includes first and second structures arranged in a first hierarchy, in which the first and second structures are repeatedly arranged in a first direction along a plane of the first hierarchy, and a distance between geometric centers of the first and second structures in a minimum unit of repetition of the first and second structures differs between a first position and a second position in the first direction.

Abstract: A packaging semiconductor device, such as a fan-out Wafer-Level Packaging (FOWLP) device, is fabricated by providing a semiconductor device (20) having conductive patterns (22) disposed on a first surface and then forming, on the conductive patterns, photoresist islands (24) having a first predetermined shape defined by a first critical width dimension and a minimum height dimension so that a subsequently-formed dielectric polymer layer (26) surrounds but does not cover each photoresist island (24), thereby allowing each photoresist island to be selectively removed from the one or more conductive patterns to form one or more via openings (28) in the dielectric polymer layer such that each via opening has a second predetermined shape which matches at least part of the first predetermined shape of the photoresist islands.

Abstract: A touch panel including a liquid crystal panel, a first polarizer, touch units, and a second polarizer is provided. The liquid crystal panel includes a first substrate, a second substrate, an active array, and a liquid crystal layer. Each of the touch units includes a first electrode extending along a first extending direction and a second electrode extending along a second extending direction. The first electrode includes two of first touch electrodes electrically connected to each other. Each of the first touch electrodes has a first deviation amount in the second extending direction. The second electrode includes two of second touch electrodes electrically connected to each other. Each of the second touch electrodes has a second deviation amount in the first extending direction. The two of the second touch electrodes and the two of the first touch electrodes have four overlapping points.

Abstract: An optical waveguide includes a core extending in a transmission direction of light, a clad covering the core along the transmission direction, and a mixing layer containing a material for the core and a material for the clad on the interface between the core and the clad, and the mixing layer includes a plurality of regions each having a different thickness in the transmission direction.

Abstract: The invention provides: a composition for forming an organic film, the composition having high filterability and enabling formation of an organic film which has high pattern-curving resistance, and which prevents a high-aspect line pattern particularly finer than 40 nm from line collapse and twisting after dry etching; a method for forming an organic film and a patterning process which use the composition; and a substrate for manufacturing a semiconductor device, including the organic film formed on the substrate. The composition for forming an organic film includes a condensate (A), which is a condensation product of dihydroxynaphthalene shown by the following formula (1) and a condensation agent, or a derivative of the condensate (A). A sulfur content among constituent elements contained in the condensate (A) or the derivative of the condensate (A) is 100 ppm or less in terms of mass.

Abstract: An exposure apparatus that scans and exposes each of a plurality of areas on a glass substrate, by irradiating the substrate with an illumination light via a projection optical system and relatively driving the substrate with respect to the illumination light, is equipped with: a substrate holder that levitates and supports a first area of the substrate; a substrate carrier that holds the glass substrate levitated and supported by the substrate holder; an X coarse movement stage that drives the substrate holder; an X voice coil motor that drives the substrate carrier; and a controller that controls the X coarse movement stage and the X voice coil motor so that the substrate holder and the substrate carrier are driven, respectively, in scanning exposure. Accordingly, an exposure apparatus with improved position controllability of an object can be provided.

Abstract: Disclosed herein are coated copper particles formed of copper cores that are surface coated with a coating composition comprising one or more conductive oxides. Further disclosed herein are electrically conductive adhesives (ECA) comprising: (a) organic binder, (b) surface coated copper particles, and optional (c) solvent.

Abstract: Optical control modules for integrated circuit device patterning and reticles and methods including the same. The methods include exposing, via a reticle, initial and subsequent reticle exposure fields on a surface of a semiconductor substrate. The initial and subsequent reticle exposure fields pattern corresponding array regions and margin regions on the semiconductor substrate. The initial and subsequent reticle exposure fields partially overlap such that an initial optical control module (OCM), which is patterned during exposure of the initial reticle exposure field, and a subsequent OCM, which is patterned during exposure of the subsequent reticle exposure field, both are positioned within a single control module die. The reticles include reticles that can be utilized during the methods or that can form the integrated circuit devices. The integrated circuit devices include integrated circuit devices formed utilizing the methods or the reticles.

Abstract: A composition for forming a resist underlayer film that has a high dry etching rate, functions as an anti-reflective coating during exposure, and fills a recess having a narrow space and a high aspect ratio. A composition for forming a resist underlayer film has a copolymer having a structural unit of following formula (1), a cross-linkable compound, a cross-linking catalyst, and a solvent: wherein R1 and R2 are each independently a C1-3 alkylene group or a single bond, Z is an —O— group, a —S— group, or a —S—S— group, and Ar is an arylene group. The copolymer is synthesized by a reaction of a carboxyl group of a dicarboxylic acid compound having an —O— group, a —S— group, or a —S—S— group with an epoxy group of a diglycidyl ether compound having an arylene group.

Abstract: A radiation-sensitive resin composition includes a first compound represented by formula (1), a first polymer comprising an acid-labile group, and a radiation-sensitive acid generator other than the first compound. The radiation-sensitive acid generator includes an onium salt compound. In the formula (1), n is 2 or 3; m is 1 or 2; Y+ represents a monovalent radiation-sensitive onium cation; and L represents a single bond or an organic group having a valency of n. L includes linking moieties each linking two of the carboxylate groups in formula (1). Number of atom(s) included in a linking moiety having a minimum number of bonds among the linking moieties is 0 to 10. In a case where L represents a single bond, n is 2, and in a case where n is 2, m is 1.

Abstract: Multiple model functions may be calculated by detecting alignment marks on a semiconductor wafer structure. The model functions may be combined to determine a combined model function by using a weight function that assigns a different weight to each of basis functions of the model functions. Thus, even when asymmetry of alignment marks or overlay marks has high dependency on a horizontal location on a wafer, reliability of exposure process is insured.

Abstract: Some embodiments include provision of a mass of semiconductor material having a first region and a second region. A first pattern set is formed to extend across the first region, and a third pattern set is formed to extend across the second region. The first pattern set includes first lines and first trenches between the first lines. The third pattern set includes alignment marks. The first trenches are utilized to form rails from the semiconductor material within the first region. The alignment marks are parallel to the rails. A second pattern set is formed to extend across the first region, and a fourth pattern set is formed to extend across the second region. The second pattern set includes first openings, and the fourth pattern set includes second openings. The first openings are utilized to subdivide the rails into pillars. The second openings transform the alignment marks into an overlay pattern.

Abstract: A semiconductor structure is provided that contains a non-volatile battery which controls gate bias and has increased output voltage retention and voltage resolution. The semiconductor structure may include a semiconductor substrate including at least one channel region that is positioned between source/drain regions. A gate dielectric material is located on the channel region of the semiconductor substrate. A battery stack is located on the gate dielectric material. The battery stack includes, a cathode current collector located on the gate dielectric material, a cathode material located on the cathode current collector, a first ion diffusion barrier material located on the cathode material, an electrolyte located on the first ion diffusion barrier material, a second ion diffusion barrier material located on the electrolyte, an anode region located on the second ion diffusion barrier material, and an anode current collector located on the anode region.

Abstract: Techniques are disclosed for realizing a two-dimensional target lithography feature/pattern by decomposing (splitting) it into multiple unidirectional target features that, when aggregated, substantially (e.g., fully) represent the original target feature without leaving an unrepresented remainder (e.g., a whole-number quantity of unidirectional target features). The unidirectional target features may be arbitrarily grouped such that, within a grouping, all unidirectional target features share a common target width value. Where multiple such groupings are provided, individual groupings may or may not have the same common target width value. In some cases, a series of reticles is provided, each reticle having a mask pattern correlating to a grouping of unidirectional target features. Exposure of a photoresist material via the aggregated series of reticles substantially (e.g., fully) produces the original target feature/pattern.

Abstract: A touch substrate manufactured by three-dimensional printing and a method for manufacturing the same are disclosed. The method for manufacturing the touch substrate works together with a three-dimensional printer. The three-dimensional printer includes a first nozzle, a second nozzle, and a light source. The method includes the steps of: jetting a photocuring material by the first nozzle and exposing the photocuring material to the light source to form a base layer; jetting a conductive material on the base layer by the second nozzle and exposing the conductive material to the light source to form a touch electrode layer; and jetting the photocuring material on the base layer and the touch electrode layer by the first nozzle and exposing the photocuring material to the light source to form a protective layer. The touch electrode layer is embedded between the base layer and the protective layer.

Abstract: The present application relates to a method for examining at least one element of a photolithographic mask for an extreme ultraviolet (EUV) wavelength range, wherein the method includes the steps of: (a) examining the at least one element with light in the EUV wavelength range; and (b) determining the behavior of the at least one element in the EUV wavelength range.

Abstract: A manufacturing method of a circuit substrate is provided. A substrate is provided. A positive photoresist layer is coated on the substrate. Once exposure process is performed on the positive photoresist layer disposed on the substrate so as to simultaneously form concaves with at least two different depths.

Abstract: The present invention provides an overlay mark, including a substrate and plural sets of first pattern block and second pattern block. A first direction and a second direction are defined on the substrate, wherein the first direction and the second direction are perpendicular to each other. In each set, the first pattern block is rotational symmetrical to the second pattern block. Each first pattern block includes a big frame and plural small frame. Each second pattern block includes a big frame and plural small frame. The width of the big frame is greater than three times of the width of the small frame. The present invention further provides a method for evaluating the stability of a semiconductor manufacturing process.

Abstract: Provided are a photocurable composition for imprints, having good releasability and temporal stability of the releasability, a pattern forming method, and a method for manufacturing a device. This photocurable composition for imprints includes a monofunctional chained aliphatic (meth)acrylate (A1) not containing a fluorine atom, a bifunctional or higher polyfunctional (meth)acrylate (A2) not containing a fluorine atom, a monofunctional (meth)acrylate (B) containing a fluorine atom, a photopolymerization initiator (C), and a non-polymerizable compound (D) having a polyoxyalkylene structure in a proportion of 1% to 5% by mass, in which the monofunctional chained aliphatic (meth)acrylate (A1) not containing a fluorine atom has a boiling point of 100° C. to 200° C. at a pressure of 0.67 kPa, and the monofunctional (meth)acrylate (B) containing a fluorine atom has a boiling point of 100° C. to 200° C. at a pressure of 0.67 kPa.

Abstract: An organic light-emitting diode (OLED) touch-control substrate is provided. The organic light-emitting diode (OLED) touch-control substrate comprises a plurality of OLEDs, each of the OLEDs having a first electrode, a second electrode and a light-emitting layer between the first electrode and the second electrode; a plurality of first touch-control electrodes disposed in a same layer with the first electrodes and insulated from the first electrode lines; and a plurality of second touch-control electrodes disposed in a same layer with the second electrodes and insulated from the second electrode lines and the first touch-control electrodes.

Abstract: An optimization method for overlay error compensation is disclosed.

Abstract: A battery built-in board includes a battery component comprising a battery and an insulation part covering the battery, a first insulation layer in which the battery component is placed, and a second insulation layer formed on the first insulation layer and covering the battery component. Rigidity of the insulation part is lower than that of the first insulation layer and the second insulation layer.

Abstract: A silicon carbide based MOS integrated circuit is monolithically integrated with a suspended piezoelectric aluminum nitride member to form a high-temperature-capable hybrid MEMS-over-MOS structure. In the integrated structure, a post-MOS passivation layer of silicon carbide is deposited over the MOS passivation and overlain by a structural layer of the MEMS device. Electrical contact to refractory metal conductors of the MOS integrated circuit is provided by tungsten vias that are formed so as to pass vertically through the structural layer and the post-MOS passivation layer.

Abstract: In an aspect of the disclosure, a method, a computer-readable medium, and an apparatus for assigning feature colors for a multiple patterning process are provided. The apparatus receives integrated circuit layout information including a set of features and an assigned color of a plurality of colors for each feature of a first subset of features of the set of features. In addition, the apparatus performs color decomposition on a second subset of features to assign colors to features in the second subset of features. The second subset of features includes features in the set of features that are not included in the first subset of features with an assigned color.

Abstract: An in-cell touch display panel, a driving method thereof and a display device are provided. The display panel includes a common electrode layer and a plurality of touch sensing electrodes. The common electrode layer comprises a plurality of first touch driving electrodes and a plurality of second touch driving electrodes that are configured for loading of common electrode signals in a display period and for loading of touch signals in a touch period. The second touch driving electrodes include a plurality of second touch driving sub-electrodes. Projections of the touch sensing electrodes on an array substrate are at gaps of the second touch driving sub-electrodes that are adjacent within the second touch driving electrodes. With this display panel, the touch sensitivity can be enhanced.

Abstract: An NTC component comprising a first electrode (1) and a second electrode (2) is specified. The NTC component further comprises an NTC element (3) disposed between the first electrode (1) and the second electrode (2), wherein the NTC element (3) comprises a ceramic having the general composition AB2O4, and where A and B each comprise one or more of the materials Mn, Ni, Co and Cu, and B additionally comprises one or more of the materials Fe, Y, Pr, Al, In, Ga and Sb.

Abstract: A light guide grid can include a grid structure having a plurality of intersecting grid lines, each grid line having a width w, and a plurality of openings for photosensor elements between intersecting grid lines. The grid structure has a diagonal grid width between two adjacent ones of the plurality of openings in a diagonal direction. The diagonal grid width has a value exceeding approximately ?3 w. An image sensor can include a light guide grid having a grid structure as described above and further include a micro-lens such as a sinking micro-lens and a color filter. A method of fabricating a light guide grid can include forming a grid above at least one photo sensor, the grid having intersecting grid lines of width w and a diagonal grid width in a diagonal direction having a value exceeding approximately ?3 w.

Abstract: The present invention provides a resist under layer film composition containing a novolak resin having a repeating unit shown by the formula (1), wherein R represents a group containing one or more fluorine atoms. There is provided a resist under layer film composition that is excellent in filling property, generates little outgas, and has excellent dry etching resistance and heat resistance.

Abstract: A lithography stepper alignment and control method, comprising: providing a test template having a plurality of field sizes, and deriving a set of overlay values for each field size (S1); calculating a set of compensation amounts for the overlay value of each field size (S2); and, comparing a set of estimated alignment compensation values for a product with each compensation amount for each field size, selecting as the product alignment compensation values the set of compensation amounts of a field size closest to the set of estimated alignment compensation values, and, using the product alignment compensation values to perform alignment compensation on said product (S3).

Abstract: A processing apparatus for processing a substrate chucked by a chuck installed on a stage includes: a conveying unit configured to convey the substrate to the chuck; a robot configured to selectively convey, to the stage, a pressing member capable of pressing the substrate to reduce a warp of the substrate chucked by the chuck and a cleaning member capable of cleaning a chuck surface; and a controller configured to cause the robot holding the pressing member to execute pressing processing for correcting the warp of the substrate and cause the robot holding the cleaning member to execute cleaning processing of the chuck surface.

Abstract: In a method of decomposing a layout of a semiconductor device, a polygon, which includes a plurality of intersections at each of which at least two lines are crossed, among polygons included in the layout of the semiconductor device may be determined as a complex polygon. A first stitch may be inserted between the plurality of intersections on the complex polygon. A plurality of decomposed patterns may be generated by performing a pattern dividing operation on the layout.

Abstract: A photosensitive conductive paste contains conductive particles (A), a photosensitive organic compound (B), an epoxy resin (C) and an ion adsorbent (D) that is selected from the group consisting of hydrotalcite, magnesium oxide, aluminum oxide, aluminum hydroxide, magnesium hydroxide, magnesium carbonate, zirconium oxide, magnesium silicate, silicon dioxide, zeolite and a carbon-based powder.

Abstract: A method of fabricating a thin film battery may comprise: depositing a first stack of blanket layers on a substrate, the first stack comprising a cathode current collector, a cathode, an electrolyte, an anode and an anode current collector; laser die patterning the first stack to form one or more second stacks, each second stack forming the core of a separate thin film battery; blanket depositing an encapsulation layer over the one or more second stacks; laser patterning the encapsulation layer to open up contact areas to the anode current collectors on each of the one or more second stacks; blanket depositing a metal pad layer over the encapsulation layer and the contact areas; and laser patterning the metal pad layer to electrically isolate the anode current collectors of each of the one or more thin film batteries. For electrically non-conductive substrates, cathode contact areas are opened-up through the substrate.

Abstract: The plurality of thin film transistors are provided corresponding to intersections between a plurality of gate wires and a plurality of source wires, respectively. The pixel electrodes are connected to the thin film transistors. The counter electrodes face the pixel electrodes. The leading line is provided outside a display area and connected to one of gate wires. The conversion portion is provided in the vicinity of the display area, at which the leading line is connected to another wiring layer. The insulating film is provided on the conversion portion at a side of the counter substrate. The conductive layer faces the conversion portion with the insulating film interposed therebetween and has transparency. To the conductive layer together with the counter electrodes, applied is a common potential.

Abstract: A touch panel and a method of fabricating the same are provided. The touch panel may include: a substrate; first sensing electrodes disposed on a first surface and arranged along a first direction and second sensing electrodes arranged along a second direction; at least one first connector connecting the first sensing electrodes in the first direction; a first insulating layer pattern disposed on the first connector; at least one second connector disposed on the first insulating layer pattern, intersecting the first connector, and connecting the second sensing electrodes in the second direction; and wires disposed on the first surface of the substrate in the peripheral area and electrically connected to the first sensing electrodes and the second sensing electrodes. The first connector includes a first light-transmitting conductive pattern disposed on the first surface of the substrate and a first light-blocking conductive pattern disposed on the first light-transmitting conductive pattern.

Abstract: A method of fabricating a semiconductor device is disclosed. The method includes forming mandrels over a material layer and forming spacers along sidewalls of mandrels, forming a patterned hard mask to cover a first region, depositing a filling layer in a second region while the patterned hard mask covers the first region. A space between two adjacent spacers in the second region is filled in by the filling layer. The method also includes recessing the filling layer to form a filling block in the space between two adjacent spacers in the second region, removing the patterned hard mask, removing mandrels and etching the material layer by using spacers and the filling block as an etch mask to form material features in the first region and the second region, respectively.

Abstract: According to one embodiment, there is provided a mask set including a first mask and a second mask. The first mask includes a first device pattern and a first mark pattern. The first mark pattern is used for an inspection of a position of the first device pattern on a surface of the first mask. The second mask is used to perform multiple exposure on a substrate together with the first mask. The second mask includes a second device pattern and a second mark pattern. The second mark pattern is used for an inspection of a position of the second device pattern on a surface of the second mask. The second mark pattern includes a pattern corresponding to a pattern obtained by inverting the first mark pattern.

Abstract: An object of the present invention is to provide a negative resin composition which can produce a pattern with high sensitivity, high resolution and low line edge roughness in pattern formation by exposure to electron beams or EUV, a method for producing a relief pattern and an electronic component using the negative resist composition. Disclosed is a negative resist composition comprising a phenolic compound (A) which has: two or more phenolic hydroxyl groups per molecule; one or more substituents of one or more kinds selected from the group consisting of a hydroxymethyl group and an alkoxymethyl group per molecule in the ortho-position of any of the phenolic hydroxyl groups; and a molecular weight of 400 to 2,500, wherein the content of the phenolic compound (A) is 70% by weight or more of the total solid content of the negative resist composition.

Abstract: A composition that includes a high-valent compound of copper, silver or indium; a linear, branched or cyclic C1-18 alcohol; and a Group VIII metal catalyst forms a metal film of copper, silver or indium on a substrate when the composition is coated on the substrate and heated to reduce the high-valent compound. The composition may alternatively include metal particles of silver, copper or indium in which the surface layer of the particle includes a high-valent compound of copper, silver or indium. A metal film of copper, silver or indium may also be formed on a substrate by coating a substrate with the composition including the metal particles, and heating to reduce the high-valent compound in the same manner as above.

Abstract: A method of forming a layout design is disclosed. The method includes placing a first set of layout patterns in a first layout layer and placing a second set of layout patterns in a second layout layer. The first set of layout patterns is aligned with one or more grid lines of a first set of grid lines. The first set of grid lines extends along a first direction, where two grid lines of the first set of grid lines overlap two cell boundaries of a standard cell layout. The second set of layout patterns is aligned with one or more grid lines of a second set of grid lines. The second set of grid lines extends along the first direction and has at least two different line pitches, where two grid lines of the second set of grid lines overlap two cell boundaries of the standard cell layout.

Abstract: Disclosed is a touch panel. The touch panel includes a plurality of sensing electrode patterns spaced apart from each other on a substrate; and a bridge electrically connecting the sensing electrode patterns to each other, wherein an end portion of the bridge is perpendicular to a surface of the substrate or is inclined within a predetermined angle with respect to a perpendicular line of the surface of the substrate.

Abstract: A power storage device having a small thickness is manufactured. A manufacturing method of the power storage device includes: forming a first layer and a second layer over a first substrate; forming a first insulating layer, a positive electrode and a negative electrode over the second layer; forming a solid electrolyte layer over the first insulating layer, the positive electrode, and the negative electrode; forming a sealing layer to cover the solid electrolyte layer; forming a planarization film and a support over the sealing layer; separating the first layer and the second layer from each other so that the second layer, the positive electrode, the negative electrode, the solid electrolyte layer, the sealing layer, the planarization film, and the support are separated from the first substrate; attaching the separated structure to a second substrate which is flexible; and separating the support from the planarization film.

Abstract: In the method for forming a protective coat on an electrode for a touch panel according to the invention, a photosensitive layer comprising a photosensitive resin composition containing a binder polymer having a carboxyl group and an acid value of 30 to 120 mgKOH/g, a photopolymerizable compound having at least three ethylenic unsaturated groups, and a photopolymerization initiator, is formed on a base material having an electrode for a touch panel, prescribed sections of the photosensitive layer are cured by irradiation with active light rays and then the sections other than the prescribed sections are removed, to form a protective coat comprising the cured sections of the photosensitive resin composition covering all or a portion of the electrode.

Abstract: A touchpad apparatus extends, without having to be covered by a cover, up to an outer housing edge of an operating device. In two possible cases, not only touchpads and connections between the touchpads in the touchpad area are formed by patterns of conductive strips which cannot be resolved by the human eye, but also contact connection lines which connect contact elements to each other at two sides of the touchpad area.