Fluid Growth From Liquid Combined With Preceding Diverse Operation Patents (Class 438/497)
  • Patent number: 6190937
    Abstract: To accomplish both higher performance of a crystal and lower cost in a semiconductor member, and to produce a solar cell having a high efficiency and a flexible shape at low cost, the semiconductor member is produced by the following steps, (a) forming a porous layer in the surface region of a substrate, (b) immersing the porous layer into a melting solution in which elements for forming a semiconductor layer to be grown is dissolved, under a reducing atmosphere at a high temperature, to grow a crystal semiconductor layer on the surface of the porous layer, (c) bonding another substrate onto the surface of the substrate on which the porous layer and the semiconductor layer are formed and (d) separating the substrate from the another substrate at the porous layer.
    Type: Grant
    Filed: December 29, 1997
    Date of Patent: February 20, 2001
    Assignee: Canon Kabushiki Kaisha
    Inventors: Katsumi Nakagawa, Takao Yonehara, Shoji Nishida, Kiyofumi Sakaguchi
  • Patent number: 6089548
    Abstract: In a method and an apparatus for converting a liquid flow into a gas flow, a liquid flow is introduced into an evaporation volume, the liquid flow is dispersed so as to enlarge the surface of the liquid, the dispersion being not caused by a change of pressure and taking place without admixture of a medium, and the evaporated liquid flow is conducted out of the evaporation volume.
    Type: Grant
    Filed: October 23, 1997
    Date of Patent: July 18, 2000
    Inventors: Lothar Pfitzner, Heiner Ryssel, Piotr Strzyzewski, Georg Roeder
  • Patent number: 6083812
    Abstract: A method for heteroepitaxial growth and the device wherein a single crystal ceramic substrate, preferably Y stabilized zirconia, MgAl.sub.2 O.sub.4, A1.sub.2 O.sub.3, 3C--SiC, 6H--SiC or MgO is cut and polished at from about 1.0 to about 10 degrees off axis to produce a substantially flat surface. The atoms on the surface are redistributed on the surface to produce surface steps of at least three lattice spacings. An optional epitaxially grown ceramic buffer layer, preferably AlN or GaN, is then formed on the substrate. Then a layer of semiconductor, preferably SiC, AlN when the buffer layer is used and is not AlN or GaN is grown over the substrate and buffer layer, if used.
    Type: Grant
    Filed: February 2, 1993
    Date of Patent: July 4, 2000
    Assignee: Texas Instruments Incorporated
    Inventor: Scott R. Summerfelt
  • Patent number: 6060366
    Abstract: A method for forming a DRAM capacitor comprising the steps of first depositing conductive material over a dielectric layer and into a contact opening already formed in the dielectric layer, then patterning the conductive layer using a photoresist layer. Next, a portion of the photoresist layer is removed to expose a peripheral strip on the upper surface of the conductive layer. Then, a liquid-phase deposition method is used to deposit a silicon oxide layer over the conductive layer and the dielectric layer. Due to the selectivity of liquid-phase deposition method, none of the silicon oxide layer is deposited over the photoresist layer. Hence, after the removal of the photoresist layer, the silicon oxide layer can be used as a mask for patterning the conductive layer again. The patterned conductive layer then becomes the cylindrical-shaped storage electrode of a DRAM capacitor.
    Type: Grant
    Filed: April 10, 1998
    Date of Patent: May 9, 2000
    Assignee: United Semiconductor Corp.
    Inventor: Gary Hong
  • Patent number: 5998304
    Abstract: A liquid phase deposition method involves the use of a supersaturated hydrofluosilicic acid aqueous solution for growing a silicon dioxide film at low temperature (30.degree. C.-50.degree. C.) on a III-V semiconductor, such as a gallium arsenide substrate. The silicon dioxide film may be used in a bipolar transistor or as a field oxide of MOS (metal oxide semiconductor). The III-V semiconductor substrate is chemically treated with an alkaline aqueous solution such as ammonium hydroxide so that the surface of the III-V semiconductor substrate is modified to facilitate the growth of the silicon dioxide film by liquid phase deposition. The growth rate of the silicon dioxide film is as fast as 1265 .ANG./hr. The silicon dioxide film has a refractive index ranging between 1.372 and 1.41.
    Type: Grant
    Filed: September 2, 1997
    Date of Patent: December 7, 1999
    Assignee: National Science Council
    Inventors: Mau-Phon Houng, Yeong-Her Wang, Chien-Jung Huang
  • Patent number: 4204259
    Abstract: There is disclosed an apparatus including a calculating circuit for automatic determination of the boron concentration with the Li-ion concentration of the primary cooling water in a pressurized water atomic power plant. The conductivity of a sample of the cooling water is measured before and after the sample water is mixed with a mannitol solution; the Li-ion concentration is calculated from the measurement obtained and the correct boron concentration is calculated with correction based on the Li-ion concentration.
    Type: Grant
    Filed: April 11, 1978
    Date of Patent: May 20, 1980
    Assignee: Nikkiso Co., Ltd.
    Inventor: Ikuo Yabe