Abstract: A method of dispersing semiconductor chips from a wafer of semiconductor chips onto a substrate while preserving the neighboring relationship of each chip to each adjacent chip is disclosed. The method includes dispersing the wafer into sequential columns of semiconductor chips with a first pitch between columns while preserving the neighboring relationship and sequentially dispersing the columns of semiconductor chips into rows of individual chips with a second pitch between rows onto a substrate while preserving the neighboring relationship.

Abstract: A bifacial solar cell module includes solar cells that are protected by front side packaging components and backside packaging components. The front side packaging components include a transparent top cover on a front portion of the solar cell module. The backside packaging components have a transparent portion that allows light coming from a back portion of the solar cell module to reach the solar cells, and a reflective portion that reflects light coming from the front portion of the solar cell module. The transparent and reflective portions may be integrated with a backsheet, e.g., by printing colored pigments on the backsheet. The reflective portion may also be on a reflective component that is separate from the backsheet. In that case, the reflective component may be placed over a clear backsheet before or after packaging.

Abstract: A microelectronic unit includes a semiconductor element having a front surface to which a packaging layer is attached, and a rear surface remote from the front surface. The element includes a light detector including a plurality of light detector element arranged in an array disposed adjacent to the front surface and arranged to receive light through the rear surface. The semiconductor element also includes an electrically conductive contact at the front surface connected to the light detector. The conductive contact includes a thin region and a thicker region which is thicker than the thin region. A conductive interconnect extends through the packaging layer to the thin region of the conductive contact, and a portion of the conductive interconnect is exposed at a surface of the microelectronic unit.

Abstract: To provide a process for manufacturing a solar cell module capable of preventing a backside colored sealing film from wrapping around to the light-receiving side of photovoltaic elements. The process for manufacturing a solar cell module of the present invention includes superposing a light-receiving side transparent protection material 11, a light-receiving side sealing film 13A, photovoltaic elements 14, a backside colored sealing film 13B and a backside protection material 12 in this order to give a stack 10, and applying heat and pressure to the stack 10 to integrate it, wherein the light-receiving side sealing film 13A has a thickness less than that of the backside colored sealing film 13B.

Abstract: The performances and durability of a diaphragm sheet of a solar cell laminator are enhanced, and a favorable lamination work is stably performed over a long period of time. In addition, by stably performing sufficient and uniform lamination over a long period of time, a high-quality module is stably manufactured over a long period of time. A solar cell module is manufactured by using a diaphragm sheet formed of a composition containing an ethylene-propylene-diene rubber (EPDM), which is low in creep deformation and high in durability against an organic peroxide and a silane coupling agent.

Abstract: A solar cell includes; a substrate; a first electrode disposed on the substrate, and including a first groove formed therein, a semiconductor layer disposed on the first electrode, and including a second groove formed therein, and a second electrode disposed on the semiconductor layer and connected to the first electrode via the second groove, wherein a third groove passing through the first electrode, the semiconductor layer, and the second electrode is formed in a first region, a fourth groove passing through only the semiconductor layer and the second electrode is formed in a second region, and the first region and the second region are alternately disposed along a direction of extension of the third groove.

Abstract: A solar module (and its fabrication method) is presented where a supporting substrate comprises a network of finger traces connected to bus bars. Photo-active layer portions and upper electrode layer portions are deposited on the substrate thereby forming a network of cells. The cells are connected in series by connecting the bus bar of one cell to the upper electrode layer of the adjacent cell, and the bus bars of two adjacent cells are coupled through a bypass element for protecting the cell array.

Abstract: A solid-state image pickup device includes a plurality of photoelectric conversion units, a plurality of signal read-out circuits, and a test terminal for testing the photoelectric conversion units. Each of the photoelectric conversion units includes a pixel electrode film, an opposing electrode film opposing the pixel electrode film and a light receiving layer disposed between the pixel electrode film and the opposing electrode film. The photoelectric conversion units are arranged in a two-dimensional array above a semiconductor substrate. Each of the signal read-out circuits are configured to read out a signal corresponding to an amount of electrical charges generated in the light receiving layer and transferred to the pixel electrode film. The test terminal is disposed outside of an area where the photoelectric conversion units are disposed, disposed on the same plane as the pixel electrode film, and made of the same material as the pixel electrode film.

Abstract: Methods for forming backside illuminated (BSI) image sensors having metal redistribution layers (RDL) and solder bumps for high performance connection to external circuitry are provided. In one embodiment, a BSI image sensor with RDL and solder bumps may be formed using a temporary carrier during manufacture that is removed prior to completion of the BSI image sensor. In another embodiment, a BSI image sensor with RDL and solder bumps may be formed using a permanent carrier during manufacture that partially remains in the completed BSI image sensor. A BSI image sensor may be formed before formation of a redistribution layer on the front side of the BSI image sensor. A redistribution layer may, alternatively, be formed on the front side of an image wafer before formation of BSI components such as microlenses and color filters on the back side of the image wafer.

Abstract: A removable cover system for protecting solar cells from exposure to moisture during fabrication processes. The cover system includes a cover having a configuration that complements the configuration of a solar cell substrate to be processed in an apparatus where moisture is present. A resiliently deformable seal member attached to the cover is positionable with the cover to engage and seal the top surface of the substrate. In one embodiment, the cover is dimensioned and arranged so that the seal member engages the peripheral angled edges and corners of the substrate for preventing the ingress of moisture beneath the cover. An apparatus for fabricating a solar cell using the cover and associated method are also disclosed.

Abstract: A wiring board with a built-in imaging element includes a substrate having an accommodation portion and a first surface and a second surface on the opposite side of the first surface, an imaging device having a light receiver and positioned in the accommodation portion of the substrate such that the light receiver faces the first surface of the substrate, and a buildup structure formed on the first surface of the substrate and having insulation layers and conductive layers. The buildup structure has an opening portion formed such that the light receiver of the imaging device is exposed from the opening portion of the buildup structure, and the insulation layers in the buildup structure include a first insulation layer formed on the first surface of the substrate.

Abstract: A photovoltaic module including a transparent upper plate and a lower plate, electrically insulating and sealed to each other to define a tight package; photovoltaic cells pressed between the upper and lower plates; at least two electric contacts arranged on at least a surface of each cell, at least one electric contact being in the form of a strip; and elements electrically connecting the contacts of each cell with the contacts of at least one adjacent cell. At least one strip of each cell is housed in a groove made in the plate in front or it, the groove is defined by: a depth between one quarter and three quarters of the thickness of the strip in a uncompressed state; a width greater than or equal to the width of the strip at 85° C.; and a length greater than or equal to the length of the strip at 85° C.

Abstract: A semiconductor device includes a semiconductor circuit on an insulated metal substrate, which includes an anodized film formed on at least one side of an Al substrate, wherein the Al substrate has a potential higher than an average potential of the semiconductor circuit when the semiconductor circuit is driven.

Abstract: A photovoltaic assembly includes a flexible photovoltaic module, a flexible back barrier layer, and electrically conductive first and second flexible bus bars. The photovoltaic module includes opposing front and back outer surfaces and first and second electrical contacts on the front outer surface. The photovoltaic module is adapted to generate an electrical potential difference between the first and second electrical contacts in response to light incident on the front outer surface. The flexible back barrier layer is disposed on the back outer surface of the photovoltaic module. The electrically conductive first and second flexible bus bars are electrically coupled to the first and second electrical contacts, respectively, and the first and second flexible bus bars wrap around the flexible photovoltaic module and extend through the back barrier layer.

Abstract: A semiconductor device includes a carrier substrate having at least one conductor track, at least one converter element structured at least partly from a further semiconductor substrate, and conductive structures formed on a respective converter element. The at least one converter element is electrically linked to the at least one conductor track via at least one at least partly conductive supporting element arranged between a contact side of the carrier substrate and an inner side of the converter element. The inner side is oriented toward the carrier substrate. The at least one converter element is arranged on the contact side of the carrier substrate such that the inner side of the converter element is kept spaced apart from the contact side of the carrier substrate. The at least one converter element and the conductive structures formed thereon are completely embedded into at least one insulating material.

Abstract: A solar cell module according to the present invention includes photoelectric converting cells, interconnect wiring, and a bus bar, wherein the interconnect wiring is attached by a conductive adhesive layer, and the bus bar is attached by an insulating adhesive layer. A method for manufacturing the solar cell module includes attaching the interconnect wiring and the bus bar by the conductive adhesive layer and the insulating adhesive layer, and according to the method, a solar cell module with excellent characteristics can be manufactured through a simple and inexpensive method.

Abstract: Provided is a highly reliable solar module. The solar module (1) includes a sealing member (14), a plurality of solar cells (10), a wiring member (11), and a resin adhesive (15). The solar cells (10) are arranged in the sealing member (14). The wiring member (11) connects the solar cells (10) electrically. The resin adhesive (15) bonds the wiring member (11) and the solar cells (10). A portion of the sealing member (14) in contact with at least one main surface of the solar cells (10) contains a non-crosslinked resin. The glass transition temperature of the resin adhesive (15) is higher than the melting point of the resin portion of the sealing member (14) containing the non-crosslinked resin.

Abstract: A camera module includes an image sensor chip including a substrate having first and second opposite surfaces and a ground pad on the first surface, a housing surrounding the sides of the image sensor chip but which leaves the second surface of the image sensor chip exposed, an electromagnetic wave-shielding film united with the housing, and an electrical conductor electrically connected to the ground pad. The camera module also has an optical unit disposed on the first surface of the image sensor chip in the housing to guide light from an object to the image sensor chip. The electrical conductor extends through a side of the housing. The conductor also contacts the electromagnetic wave-shielding film to electrically connect the ground pad and the electromagnetic wave-shielding film.

Abstract: Apparatuses and assembly methods are provided for a monolithic solar cell panel assembly. The assembly comprises an array of solar cells having front electrical contacts and back electrical contacts, wherein a first set of the solar cells in the array are aligned to be electrically connected in series through a back circuit sheet having an array of back metal contacts connected to corresponding back electrical contacts on the first set of solar cells, and through a front circuit sheet having an array of front metal contacts connected to corresponding front electrical contacts on the first set of solar cells. Electrical connections may be made in a lamination step, in which an encapsulant polymer flows into gaps and an interconnect material connects the circuits to form the monolithic solar cell panel assembly.

Abstract: The present invention provides a photovoltaic module with bypass diodes that has a high electricity generating capacity per unit area and high productivity. This photovoltaic module includes a photovoltaic cell assembly in which a plurality of photovoltaic cells are electrically connected in series, and a diode assembly in which a plurality of diodes are formed on a substrate in the arrangement that is consistent with the arrangement of the photovoltaic cells to which the diodes are to be attached. The diode assembly is disposed on a non-light receiving side of the photovoltaic cells, and the diodes are electrically connected to the photovoltaic cells. The photovoltaic cell assembly and the diode assembly are sealed and united by a sealant.

Abstract: A solar cell assembly and method are disclosed. The solar cell assembly comprises a substrate having a front surface and a back surface, wherein the substrate has a p-n junction providing reverse bias protection, and wherein the substrate functions as a bypass diode. The solar cell assembly further comprises a multijunction solar cell having a plurality of solar cell layers, wherein the multijunction solar cell has a first surface and a second surface, the first surface being attached to the front surface of the substrate. The solar cell assembly further comprises an electrical connector element positioned adjacent the front surface of the substrate and the first surface of the multijunction solar cell, a first contact coupled to the back surface of the substrate, and at least one second contact coupled to a portion of the second surface of the multijunction solar cell.

Abstract: In one embodiment, semiconductor die are singulated from a semiconductor wafer having a backmetal layer by placing the semiconductor wafer onto a carrier tape with the backmetal layer adjacent the carrier tape, forming singulation lines through the semiconductor wafer to expose the backmetal layer within the singulation lines, and fluid machining the semiconductor wafer to remove the backmetal layer from the singulation lines.

Abstract: A superstrate, such as a sheet of polymer film, is used as a transport during metallization of solar cells. The back sides of the solar cells are attached to the sheet of polymer film. Contact holes are formed through the sheet of polymer film to expose doped regions of the solar cells. Metals are formed in the contact holes to electrically connect to the exposed doped regions of the solar cells. The metals are electroplated to form metal contacts of the solar cell. Subsequently, the solar cells are separated from other solar cells that were metallized while supported by the same sheet of polymer film to form strings of solar cells or individual solar cells.

Abstract: A thin film solar cell and a method of manufacturing the same are discussed. The method of manufacturing the thin film solar cell includes forming a masking jig in a first region of a substrate, forming a first electrode in a second region of the substrate, forming a photoelectric conversion unit on the first electrode formed in the second region of the substrate to produce electricity using light incident on the photoelectric conversion unit, and forming a second electrode on the photoelectric conversion unit formed in the second region of the substrate.

Abstract: This photodiode array module includes a first semiconductor substrate 2 having a first photodiode array that is sensitive to light of a first wavelength band, a second semiconductor substrate 2? having a second photodiode array that is sensitive to light of a second wavelength band, and a third semiconductor substrate 3 which is formed with a plurality of amplifiers AMP and on which the first and second semiconductor substrates 2, 2? are placed side by side without overlapping, and which connects each photodiode to the amplifier AMP via a bump. In adjacent end portions of the first semiconductor substrate 2 and the second semiconductor substrate 2?, stepped portions are formed, which thus allows performing measurement with low noise even when respective pixels are aligned successively over both substrates.

Abstract: There is provided a solid-state imaging device including an imaging unit including a plurality of image sensors, and an analog to digital (AD) conversion unit including a plurality of AD converters arranged in a row direction, each AD converter performing AD conversion of an electrical signal output by the image sensor. Each of the AD converters includes a comparator having a differential pair at an input stage, the differential pair including a first transistor and a second transistor, the first and second transistors are each divided into an equal number of a plurality of division transistors, and an arrangement pattern of the plurality of division transistors constituting the comparator in a predetermined column and an arrangement pattern of the plurality of division transistors constituting the comparator in an adjacent column adjacent to the predetermined column are different from each other.

Abstract: An object is to prevent a reduction of definition (or resolution) (a peripheral blur) caused when reflected light enters a photoelectric conversion element arranged at a periphery of a photoelectric conversion element arranged at a predetermined address. A semiconductor device is manufactured through the steps of: forming a structure having a first light-transmitting substrate, a plurality of photoelectric conversion elements over the first light-transmitting substrate, a second light-transmitting substrate provided so as to face the plurality of photoelectric conversion elements, a sealant arranged so as to bond the first light-transmitting substrate and the second light-transmitting substrate and surround the plurality of photoelectric conversion elements; and thinning the first light-transmitting substrate by wet etching.

Abstract: A photovoltaic cell module is formed with the use of a cell press. The cell press has a longitudinal axis, two surfaces disposed opposite each other along the longitudinal axis, and a fluidic mechanism for moving at least one of the two surfaces towards the other of the two surfaces along the longitudinal axis. A method includes the step of disposing a substrate, photovoltaic cell, tie layer or precursor thereof, and superstrate between the two surfaces and spaced from one of the two surfaces. The method also includes the step of moving at least one of the two surfaces along the longitudinal axis towards the other of the two surfaces using the fluidic mechanism to compress the substrate, photovoltaic cell, tie layer or precursor thereof, and superstrate and form the photovoltaic cell module. The precursor has a viscosity of less than about 1,500 cPs measured at 25° C. before curing.

Abstract: A device includes a metal pad at a surface of an image sensor chip, wherein the image sensor chip includes an image sensor. A stud bump is disposed over, and electrically connected to, the metal pad. The stud bump includes a bump region, and a tail region connected to the bump region. The tail region includes a metal wire portion substantially perpendicular to a top surface of the metal pad. The tail region is short enough to support itself against gravity.

Abstract: Methods exploiting a Self Aligned Cell (SAC) architecture for doping purposes, use the architecture to direct the deposition and application of either a dopant or a diffusion retarder. Doping is provided in regions that will become metallization for conducting fingers. Dopant may be treated directly into metallization grooves. Or, diffusion retarder may be provided in non-groove locations, and dopant may be provided over some or all of the entire wafer surface. Dopant and metal automatically go where desired, and in register with each other. The SAC architecture also includes concave surfaces for light absorbing regions of a cell, to reduce reflection of light energy, which regions may also be treated with dopant in the concavities, to result in semi-conductor emitter lines. Alternatively, diffusion retarder may be treated into the concavities, leaving upper tips of ridges between the concavities exposed, thereby subject to deeper doping.

Abstract: A wafer-level packaged optical subassembly includes: a substrate element, the substrate element including a top layer and a base layer being bonded with the top layer; a top window cover being bonded with the top layer of the substrate element; and a plurality of active optoelectronic elements disposed within the substrate element. At least one primary cavity is defined in the substrate element by the top layer and the base layer, and configured for accommodating the active optoelectronic elements. A plurality of peripheral cavities are defined around the at least one primary cavity as alignment features for external opto-mechanical parts.

Abstract: The fabrication and characterization of large scale inverted organic solar array fabricated using all-spray process is disclosed. Solar illumination has been demonstrated to improve transparent solar photovoltaic devices. The technology using SAM has potential to revolute current silicon-based photovoltaic technology by providing a complete solution processable manufacturing process. The semi-transparent property of the solar module allows for applications on windows and windshields. The inventive arrays are more efficient than silicon solar cells in artificial light environments, permitting use of the arrays in powering microelectromechanical systems and in integration with microelectromechanical systems.

Abstract: An apparatus, system, and method are disclosed for providing optical power to a semiconductor chip. An active semiconductor layer of the semiconductor chip is disposed toward a front side of the semiconductor chip. The active semiconductor layer comprises one or more integrated circuit devices. A photovoltaic semiconductor layer of the semiconductor chip is disposed between the active semiconductor layer and a back side of the semiconductor chip. The back side of the semiconductor chip is opposite the front side of the semiconductor chip. The photovoltaic semiconductor layer converts electromagnetic radiation to electric power. One or more conductive pathways between the photovoltaic semiconductor layer and the active semiconductor layer provide the electric power from the photovoltaic semiconductor layer to the one or more integrated circuit devices of the active semiconductor layer.

Abstract: A microelectronic assembly for packaging/encapsulating IC devices, which includes a crystalline substrate handler having opposing first and second surfaces and a cavity formed into the first surface, a first IC device disposed in the cavity and a second IC device mounted to the second surface, and a plurality of interconnects formed through the crystalline substrate handler. Each of the interconnects includes a hole formed through the crystalline substrate handler from the first surface to the second surface, a compliant dielectric material disposed along the hole's sidewall, and a conductive material disposed along the compliant dielectric material and extending between the first and second surfaces. The compliant dielectric material insulates the conductive material from the sidewall. The second IC device, which can be an image sensor, is electrically coupled to the conductive materials of the plurality of interconnects. The first IC can be a processor for processing the signals from the image sensor.

Abstract: A method for encapsulating photovoltaic cells into single functional units is described. These units share the mechanical and electric properties of the encapsulation layers and allow for flexible module architecture to be implemented at the cell level. This enables cost reduction and improved performance of photovoltaic power generation.

Abstract: A solar cell assembly, a solar cell array, and a method for manufacturing the same are provided. The solar cell assembly may include a solar cell and an interconnection member, the interconnection member comprising a first portion and a second portion attached to the first portion with an angle formed therebetween. The solar cell array may comprise at least two said solar cell assemblies. In an embodiment, the top surfaces of the first solar cell and the second solar cell are arranged such that the second portion of the first interconnect member and the second portion of the second interconnection member are adjacent to each other, and at least the end portion of the second portion of the first interconnection member is bended together with at least the end portion of the second portion of the second interconnection member.

Abstract: A back-sheet for a photovoltaic module is provided. A process for forming a back-sheet for a photovoltaic module includes the steps of providing a fluoropolymer film, providing a polymer melt comprising 20 to 95 weight percent ethylene propylene diene terpolymer, 5 to 70 weight percent of inorganic particulates, and 0 to 50 weight percent of adhesive selected from thermoplastic polymer adhesives and tackifiers, and depositing the polymer melt directly on the fluoropolymer film and pressing the fluoropolymer film and polymer melt together and cooling the polymer melt to form a first polymer layer adhered to the fluoropolymer film.

Abstract: Some embodiments include methods of forming semiconductor constructions in which a semiconductor material sidewall is along an opening, a protective organic material is over at least one semiconductor material surface, and the semiconductor material sidewall and protective organic material are both exposed to an etch utilizing at least one fluorine-containing composition. The etch is selective for the semiconductor material relative to the organic material, and reduces sharpness of at least one projection along the semiconductor material sidewall. In some embodiments, the opening is a through wafer opening, and subsequent processing forms one or more materials within such through wafer opening to form a through wafer interconnect. In some embodiments, the opening extends to a sensor array, and the protective organic material is comprised by a microlens system over the sensor array. Subsequent processing may form a macrolens structure across the opening.

Abstract: The invention relates to a method for producing an electrical terminal support for an optoelectronic semiconductor body, comprising the following steps: providing a carrier assembly (1), which comprises a carrier body (11), an intermediate layer (12) arranged on an outer surface (111) of the carrier body (11), and a use layer (13) arranged on the intermediate layer (12); introducing at least two openings (4), which are mutually spaced in the lateral direction (L), in the use layer (13) via an outer surface (131) of the use layer (13), wherein the openings extend completely through the use layer (13) in the vertical direction (V); electrically insulating lateral surfaces (41) of the openings (4) and of the outer face (131) of the use layer (13); arranging electrically conductive material (6) at least in the openings (4), wherein after completion of the terminal carrier (100), the electrically conductive material (6) has an interruption (U) in the progression thereof along the outer surface (131) of the use lay

Abstract: A method of forming a window cap wafer (WCW) structure for semiconductor devices includes machining a plurality of cavities into a front side of a first substrate; bonding the first substrate to a second substrate, at the front side of the first substrate; removing a back side of the first substrate so as to expose the plurality of cavities, thereby defining the WCW structure comprising the second substrate and a plurality of vertical supports comprised of material of the first substrate.

Abstract: Provided is a method of manufacturing a solar cell module including: a step (A) of applying a conductive adhesive composition comprising conductive particles having metal, or the like; a step (B) of disposing wiring members so as to face with electrodes of the solar battery cells with the applied conductive adhesive composition interposed therebetween; a step (C) of heating the solar battery cells with the wiring members obtained in the step (B); and a step (D) of laminating sealing resins onto both surfaces of the solar battery cells with the wiring members obtained in the step (C), laminating protection glass onto a light-receiving surface of the solar battery cell and a protection film onto a rear surface of the solar battery cell, and performing heating, in which a melting point of the metal in the conductive particles is or lower than the heating temperature in the step (C).

Abstract: Optoelectronic devices (e.g., optical proximity sensors), methods for fabricating optoelectronic devices, and systems including optoelectronic devices, are described herein. An optoelectronic device includes a light detector die that includes a light detector sensor area. A light source die is attached to a portion of the light detector die that does not include the light detector sensor area. An opaque barrier is formed between the light detector sensor area and the light source die, and a light transmissive material encapsulates the light detector sensor area and the light source die. Rather than requiring a separate base substrate (e.g., a PCB substrate) to which are connected a light source die and a light detector die, the light source die is connected to the light detector die, such that the light detector die acts as the base for the finished optoelectronic device. This provides for cost reductions and reduces the total package footprint.

Abstract: Provided is a conductive adhesive composition including: conductive particles (A) containing metal having a melting point of equal to or lower than 210° C.; a resin (B) having a softening point of equal to or lower than the melting point of the metal of the conductive particles and being solid at a room temperature; a flux activator (C); and a solvent (D).

Abstract: Fabrication of a single crystal silicon solar cell with an insitu epitaxially deposited very highly doped p-type silicon back surface field obviates the need for the conventional aluminum screen printing step, thus enabling a thinner silicon solar cell because of no aluminum induced bow in the cell. Furthermore, fabrication of a single crystal silicon solar cell with insitu epitaxial p-n junction formation and very highly doped n-type silicon front surface field completely avoids the conventional dopant diffusion step and one screen printing step, thus enabling a cheaper manufacturing process.

Abstract: The present invention provides a solar cell module which keeps backing film from being scratched and prevents the occurrence of scratches. The solar cell module (10) of the present invention is provided with a surface protecting member (12), backing film (13), a plurality of solar cells (11) arranged between the surface protecting member (12) and the backing film (13) and electrically connected by means of wiring members (16), a filler material (14) for sealing the solar cells (11) between the surface protecting member (12) and the backing film (13), and transition wiring (20) electrically connected with the wiring members (16). Here, at least the end portion of transition wiring (20) positioned in a corner portion of the solar cell module is arranged so as to be positioned closer to the surface protecting member (12) than other portions of the transition wiring (20).

Abstract: Provided is a conductive adhesive composition which contains conductive particles (A) containing metal having a melting point of equal to or lower than 210° C., a thermosetting resin (B), and a flux activator (C), in which viscosity of the conductive adhesive composition is 5 to 30 Pa·s, and a content of the conductive particles (A) is 70 to 90% by mass with respect to the total amount of the conductive adhesive composition.

Abstract: System, devices and methods are presented that provide an imaging array fabrication process method, comprising fabricating an array of semiconductor imaging elements, interconnecting the elements with stretchable interconnections, and transfer printing the array with a pre-strained elastomeric stamp to a secondary non-planar surface.

Abstract: A device includes a Backside Illumination (BSI) image sensor chip, which includes an image sensor disposed on a front side of a first semiconductor substrate, and a first interconnect structure including a plurality of metal layers on the front side of the first semiconductor substrate. A device chip is bonded to the image sensor chip. The device chip includes an active device on a front side of a second semiconductor substrate, and a second interconnect structure including a plurality of metal layers on the front side of the second semiconductor substrate. A first via penetrates through the BSI image sensor chip to connect to a first metal pad in the second interconnect structure. A second via penetrates through a dielectric layer in the first interconnect structure to connect to a second metal pad in the first interconnect structure, wherein the first via and the second via are electrically connected.

Abstract: A photovoltaic cell including: (a) a housing including an at least partially transparent cell wall having an interior surface; (b) an electrolyte, disposed within the cell wall, and containing an iodide based species; (c) a transparent electrically conductive coating disposed on the interior surface; (d) an anode disposed on the conductive coating, the anode including: (i) a porous film containing titania, the porous film adapted to make intimate contact with the iodide based species, and (ii) a dye, absorbed on a surface of the porous film, the dye and the porous film adapted to convert photons to electrons; (e) a cathode disposed on an interior surface of the housing, and disposed substantially opposite the anode; (f) electrically-conductive metallic wires, disposed at least partially within the cell, the wires electrically contacting the anode and the electrically conductive coating, and (g) a second electrically conductive coating including an inorganic binder and an inorganic electrically conductive fill

Abstract: A method for fabricating a solar cell module comprises: dispersing carbon nanotubes into a soldering flux; spraying the soldering flux including the carbon nanotubes, onto connection parts between solar cell devices and an interconnector; and connecting the solar cell devices with the interconnector using the soldering flux.