Test Probe Patents (Class 439/482)
  • Patent number: 10958212
    Abstract: An assembly to electrically attach equipment is provided. The assembly may include a junction box and the equipment may include solar panels. The junction box may include a housing with side openings through which interconnecting conductors may pass through and into an inner cavity within the box. The housing also may include bottom openings through which conductors from the solar panel may pass through and into the inner cavity within the box. Within the cavity, the junction box may include flat conductive plates to which the ends of the conductors are electrically connected. In this way, a set of junction boxes may be used to electrically connect a group of solar panels in series. Each junction box may also include a diode configured between its flat conductive plates.
    Type: Grant
    Filed: June 5, 2018
    Date of Patent: March 23, 2021
    Inventor: Frank C Pao
  • Patent number: 10777928
    Abstract: An electrical connector with extension terminals includes an insulating housing, a movable terminal, a spring and a conductive reed terminal. The insulating housing has terminal axial holes each having a ridge. The insulating housing has reed sockets arranged around and communicated with the terminal axial holes. The movable terminal accommodates therein a spring. The movable terminal has a groove. The movable terminal is such inserted into the terminal axial hole of the insulating housing that the groove fittingly receives the ridge, thereby limiting the movable terminal to move in the terminal axial hole but preventing the movable terminal from leaving from and rotating in the terminal axial hole. The conductive reed terminal has inserts and a weld leg. The insert has a reed. When the insert is inserted into the reed socket, the reed abuts against the movable terminal, thereby establishing conductivity therebetween.
    Type: Grant
    Filed: October 8, 2019
    Date of Patent: September 15, 2020
    Inventor: Hsu Li Yen
  • Patent number: 10411386
    Abstract: A conductive connection terminal is extensible and compressible in a longitudinal direction, and includes: a first contact member including a first tip portion configured to contact with one electrode of a contact target, and a first base end portion; a second contact member including a second tip portion configured to contact with another electrode of the contact target, and a plurality of tongue parts configured to contact with the first base end portion; an elastic member configured to extend and compress the first contact member and the second contact member in the longitudinal direction; and a load applying unit configured to apply a load to the tongue parts in a direction bringing the tongue parts into contact with an outer circumference of the first base end portion.
    Type: Grant
    Filed: August 7, 2015
    Date of Patent: September 10, 2019
    Assignee: NHK Spring Co., Ltd.
    Inventors: Toshio Kazama, Kazuya Souma
  • Patent number: 10371759
    Abstract: A magnetic field detection sensor includes a first magneto-impedance element and a second magneto-impedance element each having a magnetic material, a bias coil applying a bias magnetic field to the magnetic body of the first magneto-impedance element, a high-frequency oscillation circuit supplying high-frequency current to the magnetic bodies of the first magneto-impedance element and the second magneto-impedance element, an AC bias circuit supplying AC bias current to the bias coil, a first detection circuit generating a first detection signal based on an impedance change of the first magneto-impedance element in a state of being applied with the bias magnetic field and an external magnetic field, and a second detection circuit which generates a second detection signal based on an impedance change of the second magneto-impedance element in a state of being applied with the external magnetic field and without the bias magnetic field.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: August 6, 2019
    Assignee: Yazaki Corporation
    Inventors: Junya Tanigawa, Hiroki Sugiyama, Makoto Ishii, Takahiro Syouda
  • Patent number: 9983230
    Abstract: A probe pin according to an embodiment of the present invention has a two-piece structure consisting of a pogo pin part and a barrel part, in which the pogo pin part includes an upper plunger having an outside contact point at an upper end, a lower plunger having an outside contact point at a lower end, and a spring portion composed of one or more springs and connected to a lower end of the upper plunger and an upper end of the lower plunger; and the barrel part has a cylindrical shape surrounding a portion of the pogo pin part and has a barrel-fixing spring portion protruding on an outer side of the barrel part to apply elasticity outward.
    Type: Grant
    Filed: February 23, 2016
    Date of Patent: May 29, 2018
    Inventors: Seon Young Choi, Yurie Nakamura
  • Patent number: 9742090
    Abstract: A contact includes a first terminal including a plurality of arms; a second terminal; a spring connecting the arms to the second terminal; and a casing covering the spring, wherein the arms outwardly protrude from one end of the casing, wherein an interval between the arms increases from a side of the casing to front edges of the arms, wherein when the arms are pushed toward the casing the arms are retracted into the casing and contact an inner side of the casing so that the interval between the arms decreases.
    Type: Grant
    Filed: June 1, 2016
    Date of Patent: August 22, 2017
    Assignee: FUJITSU COMPONENT LIMITED
    Inventors: Tetsugaku Tanaka, Takahiro Kondo, Koki Sato, Mitsuru Kobayashi
  • Patent number: 9726693
    Abstract: Provided is a probe member for a pogo pin, which is used for testing a semiconductor device, and at least a portion of which is inserted into a cylindrical body to be supported by an elastic member and an upper end of which contacts a terminal of the semiconductor device.
    Type: Grant
    Filed: April 18, 2014
    Date of Patent: August 8, 2017
    Assignee: ISC CO., LTD.
    Inventor: Jae-Hak Lee
  • Patent number: 9590359
    Abstract: A coaxial electrical interconnect is disclosed. The coaxial electrical interconnect can include an inner conductor including an electrically conductive spring probe. The coaxial electrical interconnect can also include an outer conductor including a plurality of electrically conductive spring probes disposed about the inner conductor. Each spring probe can have a barrel and a plunger biased out of the barrel. The plunger can have a first plunger portion external to the barrel and a second plunger portion disposed partially in the barrel. The first and second plunger portions can have different diameters. A barrel of the spring probe of the inner conductor can be located proximate a plunger of at least one of the spring probes of the outer conductor.
    Type: Grant
    Filed: September 30, 2015
    Date of Patent: March 7, 2017
    Assignee: Raytheon Company
    Inventors: Chad Patterson, Duke Quach, Ethan S. Heinrich, Michael M. Fitzgibbon
  • Patent number: 9502844
    Abstract: A battery connector includes an insulation housing and conductive terminals. The insulation housing has slots, and the conductive terminals are held in the slots. Each conductive terminal includes an elastic connecting portion, a contact portion, and a fastening portion. The elastic connecting portion includes elastic arms parallel and substantially aligned along a transversal direction and connecting portions formed at two ends of each of the elastic arms. The contact portion includes a bendable contact portion extended forwardly from the elastic connecting portion and then folded and extended backwardly and an active contact arm formed at an end portion of the bendable contact portion. The fastening portion includes a bent portion extended backwardly from the elastic connecting portion and then folded and extended forwardly and a passive contact arm formed at an end portion of a bent portion and aligned with the active contact arm.
    Type: Grant
    Filed: February 2, 2016
    Date of Patent: November 22, 2016
    Assignee: ADVANCED-CONNECTEK INC.
    Inventors: Ching-Tien Chen, Shu-Lin Duan, Wei Wan, Ping-Chung Chu, Xiao-Juan Qi
  • Patent number: 9329205
    Abstract: A high precision semiconductor probing system includes a probe head, a circuit board positioned above the probe head, and an optical microscope, wherein the probe head has a plurality of vertical probes and at least one cantilever probe having a vertical body positioned therein. The cantilever probe is disposed close to an edge of the probe head and extends laterally out from the probe head, in order to facilitate the visual alignment viewing from top of the probing apparatus. The optical microscope is positioned on top of the probing apparatus and is configured to have a line of sight directed to the tip of the cantilever probe.
    Type: Grant
    Filed: March 20, 2012
    Date of Patent: May 3, 2016
    Assignee: STAR TECHNOLOGIES INC.
    Inventors: Choon Leong Lou, Ho Yeh Chen, Hsiao Ting Tseng
  • Patent number: 9301852
    Abstract: The instrument has a collet (19) that has at least two clamping jaws (18, 18?) for engaging an engaging means (4) on an implant body (1). The collet is received in a sleeve portion (20), the free end (21) of which has a support portion (22) that can be supported on the surface of the implant. A tension element (23) that engages the collet is used as an actuating means for actuating the collet. The outer faces of the clamping jaws interact with the inner face of the sleeve portion such that the collet can be closed and moved relative to the free end of the sleeve portion by pulling the tension element.
    Type: Grant
    Filed: April 23, 2012
    Date of Patent: April 5, 2016
    Assignee: Jossi Holding AG
    Inventors: Andreas Meyenhofer, Christian Gugler
  • Patent number: 9301853
    Abstract: Disclosed is an implant holder for an implant device comprising a locking mechanism that in a first position causes a clamp coupled to an implant device to lock such that the clamp cannot be decoupled from the implant device, and in a second position causes the clamp to unlock the implant device such that the clamp remains coupled to the implant device in the absence of a sufficient decoupling force but is decoupled from the implant device in the presence of a sufficient decoupling force. Also disclosed are methods of implanting an implant device using an implant holder by coupling the implant device to the implant holder, locking the implant device and the implant holder, emplacing the implant device utilizing the implant holder, unlocking the implant device and the implant holder such that the implant device is still coupled to the implant holder but can be decoupled with sufficient force.
    Type: Grant
    Filed: April 7, 2011
    Date of Patent: April 5, 2016
    Assignee: DePuy Synthes Products, Inc.
    Inventors: Joern Richter, Roger Berger, Rudolf Bertagnoli
  • Patent number: 9172160
    Abstract: An apparatus includes a plurality of contact elements to provide electrical continuity between an integrated circuit and an electronic subassembly, wherein a contact element includes a spring element and a separate lead element, wherein the spring element is arranged to be substantially vertically slidable over at least a portion of the lead element in response to a force applied to the contact element.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: October 27, 2015
    Assignee: Intel Corporation
    Inventors: Joshua D Heppner, Sriram Srinivasan
  • Patent number: 9157929
    Abstract: A method of forming an apparatus for probing die electricity, which determines a reinforcement structure according to features of a converting plate, and combines the converting plate, reinforcement structure and a substrate for forming the apparatus for probing die electricity. In an embodiment, the apparatus for probing die electricity further comprises a substrate, a converting plate, a needle module and a reinforcement structure. The converting plate comprises two opposite surfaces respectively having a plurality of first and second conductive elements. The needle module comprises a plurality of needles respectively and electrically connected to the plurality second conductive elements. The reinforcement structure is disposed between the converting plate and the substrate.
    Type: Grant
    Filed: December 6, 2012
    Date of Patent: October 13, 2015
    Assignee: MPI CORPORATION
    Inventors: Chung-Tse Lee, Chien-Chou Wu, Yi-Ming Chan
  • Patent number: 9095267
    Abstract: An implanted neural micro interface device is provided. The device comprises microfilaments of various materials and forms embedded within a body. The microfilaments form interaction sites with surrounding neural tissue at their exit points from the implantable body. The body and filaments are configurable in a multitude of positions to provide increased engagement of a given neural tissue section as well as interaction and closed loop feedback between the microfilament sites. Such configurations allow for a range of recording, stimulating, and treatment modalities for the device within research and clinical settings.
    Type: Grant
    Filed: December 21, 2012
    Date of Patent: August 4, 2015
    Assignee: Modular Bionics Inc.
    Inventors: Ian Loren Halpern, Mark William Merlo
  • Patent number: 9011184
    Abstract: A pogo pin connector includes an insulating housing, a plurality of pogo pins and contact terminals assembled forward in the insulating housing respectively. Front ends of the pogo pins retractably project beyond a front face of the insulating housing. A rear end of each of the pogo pins protrudes outward to form a riveted flange. Each of the contact terminals has a fastening plate placed levelly, an elastic contact arm curvedly extending upward from a front end of the fastening plate to elastically project beyond a top face of the insulating housing, and a fixing strip extending downward from a rear end of the fastening plate with a through hole being opened in a bottom end thereof. The rear ends of the pogo pins pass through the through holes of the contact terminals respectively to make the riveted flanges and the corresponding fixing strips riveted together.
    Type: Grant
    Filed: August 23, 2013
    Date of Patent: April 21, 2015
    Assignee: Cheng Uei Precision Industry Co., Ltd.
    Inventors: Yung Yi Chen, Ming Chun Lai
  • Patent number: 8926376
    Abstract: A contact terminal having a main body case and a plunger pin received in an elongate hole formed in the main body case is provided. The plunger pin is a round bar provided with a step and includes a small diameter portion including the protrusion end portion and a large diameter portion that slides on a surface of the hole to freely move in a longitudinal direction thereof. A cut space is formed to extend from an end of the large diameter portion so as to leave at least a part of a side surface portion of the large diameter portion and the cut space receives an insulation ball including at least an insulation surface. A coil spring is arranged between the hole and the insulation ball to press the protrusion end portion of the plunger pin such that the protrusion end portion protrudes from the main body case.
    Type: Grant
    Filed: June 13, 2012
    Date of Patent: January 6, 2015
    Assignee: Shimano Manufacturing Co., Ltd.
    Inventor: Shuhi Mori
  • Patent number: 8922234
    Abstract: A probe card for conducting an electrical test on a test subject includes a substrate body including a first surface, which faces toward the test subject, and a second surface, which is opposite to the first surface. A through electrode extends through the substrate body between the first surface and the second surface. A contact bump is formed in correspondence with the electrode pad and electrically connected to the through electrode. An elastic body is filled in an accommodating portion, which is formed in the substrate body extending from the first surface toward the second surface. The contact bump is formed on the elastic body.
    Type: Grant
    Filed: October 30, 2013
    Date of Patent: December 30, 2014
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Akinori Shiraishi, Hideaki Sakaguchi, Mitsutoshi Higashi
  • Patent number: 8905795
    Abstract: Spring-loaded contacts having an improved reliability. One example may provide spring-loaded contacts having a reduced likelihood of entanglement between a spring and a plunger. For example, a piston may be placed between a plunger and a spring. The piston may have a head portion that is wider than the diameter of the spring and located between the spring and the plunger to isolate the spring and the plunger. In these and other examples, an additional object, such as a sphere, may be placed between the plunger and spring. In another example, two additional objects, such as two spheres, may be placed between a plunger and piston.
    Type: Grant
    Filed: June 10, 2012
    Date of Patent: December 9, 2014
    Assignee: Apple Inc.
    Inventors: Min Chul Kim, John DiFonzo, Nathan N. Ng, Chris Ligtenberg, Bradley Hamel, Rian Leichter, Sridhar Sundaram, Josh Pong, Vince Duperron, Zheng Gao
  • Patent number: 8836362
    Abstract: A switch probe for use in a substrate inspection device to inspect a substrate includes a first tubular element, a first rod element partially accommodated in the first tubular element, and pressed into the first tubular element when the certain part is mounted for substrate inspection, a second tubular element fixed in the first tubular element, a second rod element partially accommodated in the second tubular element which is inside the first tubular element, and contacting with the first rod element when the first rod element is pressed into the first tubular element, and a fixing mechanism configured to temporarily fix the second rod element in a position so that the second rod element does not contact with the first rod element even when the first rod element is pressed into the first tubular element.
    Type: Grant
    Filed: May 31, 2011
    Date of Patent: September 16, 2014
    Assignee: Ricoh Company, Ltd.
    Inventor: Tohru Hasegawa
  • Patent number: 8734189
    Abstract: Spring-loaded contacts having an improved reliability. One example may provide spring-loaded contacts having a reduced likelihood of entanglement between a spring and a plunger. For example, a piston may be placed between a plunger and a spring. The piston may have a head portion that is wider than the diameter of the spring and located between the spring and the plunger to isolate the spring and the plunger. Another example may have a reduced likelihood of spring damage caused by excess current flow. For example, a plunger may have an eccentrically-tapered back. This eccentrically-tapered back may contact the head portion of the piston. The eccentricity may help to ensure that the plunger tilts at an angle such that the plunger or the piston, or both, contact a barrel of the spring-loaded contact, thereby avoiding current flow and resulting damage to the spring.
    Type: Grant
    Filed: October 12, 2011
    Date of Patent: May 27, 2014
    Assignee: Apple Inc.
    Inventor: Min Chul Kim
  • Patent number: 8714988
    Abstract: A connector has a housing with an aperture formed therein having one portion larger than the other portion. The housing is mounted on the device under test with the housing positioned over a plurality of electrical contacts. An electrical load is positioned within the larger aperture of the housing and has a plurality of resistors disposed adjacent to an electrical contact assembly. A resilient member is positioned between the electrical load and the device under test such that a force directed on the electrical load compresses the resilient member to allow contact between a plurality of electrical contacts of the electrical contact assembly and the plurality of the electrical contacts on the device under test. Removing the force decompresses the resilient member and disconnects the plurality of contacts of the electrical contact assembly from the plurality of electrical contacts of the device under test.
    Type: Grant
    Filed: October 26, 2012
    Date of Patent: May 6, 2014
    Assignee: Tektronix, Inc.
    Inventors: Karl A. Rinder, Neil C. Clayton, Richard A. Booman
  • Patent number: 8710856
    Abstract: A terminal end for a flat test probe having tapered cam surfaces providing a lead-in angle on the tail of the terminal end which extend to a sharp rear angle to engage detents or projections within a receptacle. The tapered cam surfaces and shape rear angles allow the probe to be inserted into the receptacle with minimal force to retain the flat test probe within the receptacle.
    Type: Grant
    Filed: December 14, 2010
    Date of Patent: April 29, 2014
    Assignee: LTX Credence Corporation
    Inventors: Mark A. Swart, Kenneth R. Snyder
  • Patent number: 8506307
    Abstract: An electrical connector and method of forming the same are provided, where the method can include affixing at least one layer to a core such that the layer is isomorphic to at least a portion of on an external surface of the core, press fitting the core with the layer into a socket cavity in a socket body, and removing the core from the socket cavity while leaving at least a portion of the layer so that the layer forms a shell layer affixed to an internal surface of the socket cavity. The method can further include inserting at least one plunger and a biasing device into a shell cavity so that a tail of the plunger is slidably received in the shell cavity and the biasing device biases a tip of the plunger away from an internal surface of the shell cavity.
    Type: Grant
    Filed: December 2, 2010
    Date of Patent: August 13, 2013
    Assignee: Interconnect Devices, Inc.
    Inventors: David Henry, Jiachun Zhou, Kanapathipillai Prabakaran, Yingdong Ji
  • Patent number: 8493086
    Abstract: An electrical signal connector which may be used for testing narrow-pitched chips or multi-chips, and causes no faulty connections between probes and pads or between probes and a circuit board even in a high temperature environment such as in a burn-in test is provided. The electrical signal connector has a probe unit in which a plurality of resin-made film probes, corresponding to one or more pads on a semiconductor chip to be tested, are supported in parallel on a plurality of support plates; a first probe holder of grid structure provided with a plurality of openings; and a second probe holder of the same configuration as that of the first probe holder, the second probe holder having projections at intersection points in the grid structure. The first and second probe holders are fastened to the circuit board with the projections of the second probe holder inserted in corresponding holes of the circuit board and the first probe holder being fastened to the circuit board with screws.
    Type: Grant
    Filed: June 4, 2009
    Date of Patent: July 23, 2013
    Inventor: Gunsei Kimoto
  • Publication number: 20130157498
    Abstract: In exemplary implementations of this invention, electrical connections are fabricated between two orthogonal surfaces by electroplating. The two surfaces are separated (except for the electrical connections) by a gap of not more than 100 micrometers. Multiple electrical connections may be fabricated across the gap. In preparatory steps, conductive pads on the two surfaces may be separately electroplated to build up “bumps” that make it easier to bridge the remainder of the gap in a final plating step. Alternately, electroless deposition may be used instead of electroplating. In exemplary implementations, a 3D probe array may be assembled by inserting array structures into an orthogonal base plate. The array structures may be aligned and held in place, relative to the base plate, by mechanical means, including side hooks, stabilizers, bottom hooks, alignment parts and a back plate.
    Type: Application
    Filed: November 12, 2012
    Publication date: June 20, 2013
    Applicant: Massachusetts Institute of Technology
    Inventors: Jorg Scholvin, Anthony Zorzos, Clifton Fonstad, Edward Boyden
  • Patent number: 8366477
    Abstract: An electrical connecting apparatus 10 comprises: a base plate 16 provided on its underside 14 with a plurality of pedestals 12 at intervals in a front-back direction; and multiple contact groups, each of which has a first contact 18 and a second contact 19. Each first contact 18 includes a needle body portion 24 having a rear end portion 20 supported on the pedestal 12 and a front end portion 22 which is a free end and extending leftward. Each second contact 19 includes a needle body portion 25 having a rear end portion 21 supported on the pedestal 12 and a front end portion 23 which is a free end and extending rightward. When the first contact 18 is broken, the second contacts 19 can be used.
    Type: Grant
    Filed: December 13, 2007
    Date of Patent: February 5, 2013
    Assignee: Kabushiki Kaisha Nihon Micronics
    Inventors: Satoshi Narita, Kenji Sasaki
  • Patent number: 8318362
    Abstract: A fuel cell 12 has a liquid electrolyte 20, a cathode electrode 28, and an anode electrode 26. The fuel cell includes an electrolyte condensation zone 58 extending from an edge 56 of a first catalyst layer 36 on the cathode electrode to an outer edge 48 of an edge seals 52 and 49. An anode electrode has an anode catalyst layer 30 with an end substantially coinciding with an inner edge 53 of the edge seals. The acid condensation zone is located near the reactant exit, so that electrolyte that has evaporated into the reactant stream can condense out before leaving the fuel cell for re-absorption back into the fuel cell.
    Type: Grant
    Filed: May 16, 2007
    Date of Patent: November 27, 2012
    Assignee: UTC Power Corporation
    Inventors: Richard D. Breault, Robert R. Fredley
  • Patent number: 8313341
    Abstract: Guide element (3) for a connector device (1), which element has a first and a second end (3a, 3b). The element (3) is adapted to be attached to a PCB (printed circuit board) (2) of the connector device. Further, the guide element comprises a first bevel (33) at the first end (3a), the surface of which is provided with a plurality of recesses (36), which recesses are adapted to receive a plurality of conductive connector tongues (4) of the connector device (1). Further, a connector device (1) for establishing a connection between a test device and a test system, a connector arrangement (11) for test procedures comprising at least one connector device (1) and a method of manufacturing a connector device (1) is comprised as well.
    Type: Grant
    Filed: May 30, 2011
    Date of Patent: November 20, 2012
    Assignee: Telefonaktiebolaget LM Ericsson (publ)
    Inventor: Björn Falk
  • Patent number: 8206186
    Abstract: A test lead assembly is provided for an electrical connector assembly, such as a terminal board. The terminal board includes a generally planar member and a number of fasteners, such as terminal screws, which are structured to fasten and electrically connect electrical conductors to the generally planar member. The test lead assembly includes an extension member having first and second opposing ends, and an intermediate portion extending therebetween. The first end is fastened to the enlarged head of a corresponding one of the terminal screws. A connection element is disposed at or about the second end of the extension member. In one embodiment the connection element is a thumb screw that electrically connects a test element to the extension member. The test lead assembly enables the terminal board to be tested, without loosening or otherwise disturbing the electrical connections of the terminal board. An associated method is also disclosed.
    Type: Grant
    Filed: December 10, 2009
    Date of Patent: June 26, 2012
    Assignee: Westinghouse Electric Co. LLC
    Inventors: James A. Kisic, Samuel C. McCaslin
  • Patent number: 8113853
    Abstract: A junction box for a photovoltaic system includes a housing having a base and a cover removably attached thereto, and a plurality of guide channels extending from an exterior surface of the housing to an interior portion thereof. The guide channels are sized and shaped to receive a plurality of conductive foil strips from a solar panel array. When the strips are fed into the guide channels, they are guided to and properly positioned within corresponding receptacles. Each receptacle is sized and shaped to receive a buss bar, and each strip is connected to a corresponding buss bar by a low insertion connector. When the cover is fully engaged with the base, bosses extending from the cover press against the connectors, creating a spring tension and pinch and retain the associated strip. As a result, a reliable physical and electrical connection between the strips and the buss bars is achieved. A heat sink having a plurality of fins protrude outwardly from the housing to dissipate heat externally.
    Type: Grant
    Filed: August 27, 2009
    Date of Patent: February 14, 2012
    Assignee: Heyco, Inc.
    Inventors: William J. Coyle, Jr., Vincent Giglio, Michael Jerome, Thomas A. Jerome
  • Patent number: 8062078
    Abstract: A press-contact pogo pin connector is provided which has a machining cost lower than those of conventional connectors, can be easily reduced in height, and does not cause instantaneous interruption. A molded insulating housing has a cylinder hole. A pin installed inside the cylinder hole is urged by a coil spring installed inside the cylinder hole so as to protrude from the housing. A flange portion on the rear side of the pin urged by the coil spring abuts against the peripheral portion of the front opening of the cylinder hole on the front side of the housing so that the pin is prevented from falling off. A contact integrally includes a substrate connection terminal portion and a contact spring portion that extends inside the cylinder hole and is brought into press-contact with the pin at all times. The contact is secured to the housing.
    Type: Grant
    Filed: August 26, 2010
    Date of Patent: November 22, 2011
    Assignee: SMK Corporation
    Inventors: Kiyoshi Asai, Manabu Dobashi
  • Patent number: 8063651
    Abstract: A contact for an electrical test comprises a first area to be bonded to a board, a second area extending in the right-left direction from the lower end portion of the first area, a third area projecting downward from the tip end portion of the second area, and a low light reflective film having lower light reflectance than that of the first area. The third area has a probe tip to be contacted an electrode of an electronic device. The low light reflective film is formed on a surface of at least the bonding part of the first area to the board and its proximity.
    Type: Grant
    Filed: April 3, 2009
    Date of Patent: November 22, 2011
    Assignee: Kabushiki Kaisha Nihon Micronics
    Inventors: Shoji Kamata, Tomoya Sato, Toshinaga Takeya, Takayuki Hayashizaki
  • Patent number: 8021201
    Abstract: An electrical contact configuration having a test contact point and a contacting element belonging to a testing device for manually touch-contacting the test contact point. The test contact point is a recess, and the contacting element has a contact region producing at least one line contact with the recess.
    Type: Grant
    Filed: October 31, 2007
    Date of Patent: September 20, 2011
    Assignee: Robert Bosch GmbH
    Inventors: Christian Lang, Daniel Huber, Achim Silberbauer, Jochen Kircher, Adolf Dillmann
  • Publication number: 20110143578
    Abstract: A test lead assembly is provided for an electrical connector assembly, such as a terminal board. The terminal board includes a generally planar member and a number of fasteners, such as terminal screws, which are structured to fasten and electrically connect electrical conductors to the generally planar member. The test lead assembly includes an extension member having first and second opposing ends, and an intermediate portion extending therebetween. The first end is fastened to the enlarged head of a corresponding one of the terminal screws. A connection element is disposed at or about the second end of the extension member. In one embodiment the connection element is a thumb screw that electrically connects a test element to the extension member. The test lead assembly enables the terminal board to be tested, without loosening or otherwise disturbing the electrical connections of the terminal board. An associated method is also disclosed.
    Type: Application
    Filed: December 10, 2009
    Publication date: June 16, 2011
    Applicant: Westinghouse Electric Company LLC
    Inventors: James A. Kisic, Samuel C. McCaslin
  • Patent number: 7955140
    Abstract: A spring connector includes a barrel made by stamping a metal foil to form with a top opening, a first receiving space, a bottom opening and a cover being capable of being positioned to cover the bottom opening and to space from the bottom opening, a plunger inserted in the barrel from the bottom opening and formed with a head portion exposed outside the barrel, a sliding portion received in the first receiving space, and a second receiving space connected to the first receiving space, a spring insert in the first receiving space and the second receiving space from the bottom opening, of which a bottom portion connects to the cover. Because the cover is made by stamping a metal foil, it is easy to coat a uniform coating layer for improving the conducting quality, and the fabricating time and the cost of the spring connector is reduced.
    Type: Grant
    Filed: March 8, 2010
    Date of Patent: June 7, 2011
    Assignee: Cheng Uei Precision Industry Co., Ltd.
    Inventors: Jui-Pin Lin, Yung-Yi Chen
  • Patent number: 7955122
    Abstract: A conductive contact unit includes a conductive contact holder, a conductive contact, and an aligning unit. The conductive contact holder includes a first guiding grooves and a second guiding groove opposite to the first guiding groove, each slidably engaging one edge of the conductive contact. The conductive contact has a plate-like shape, and includes a first contacting element and a second contacting element that are brought into contact with different circuitries, a resilient element that is expandable and contractible in a longitudinal direction between the first contacting element and the second contacting element, a first connecting element that connects the resilient element and the first contacting element, and a second connecting element that connects the resilient element and the second contacting element. The aligning unit aligns the conductive contacts.
    Type: Grant
    Filed: March 1, 2007
    Date of Patent: June 7, 2011
    Assignee: NHK Spring Co., Ltd.
    Inventors: Jun Tominaga, Koji Ishikawa, Taiichi Rikimaru
  • Patent number: 7934945
    Abstract: An embodiment of an electrical connecting apparatus comprises a support board, a plate spring arranged on the support board, an attachment device attaching the plate spring to the support board, a block having an attachment surface directing downward, and a flexible circuit board in which a plurality of contactors are arranged. As for the block, the attachment surface for attaching the circuit board is protruded further to the lower side than the support board. The plate spring receives initial load to bring a state where at least a center area for attaching the block is biased toward the upper side. Thus, a good electrical contacting state can be obtained without increasing the overdriving amount.
    Type: Grant
    Filed: August 6, 2007
    Date of Patent: May 3, 2011
    Assignee: Kabushiki Kaisha Nihon Micronics
    Inventors: Hisao Narita, Nobuyuki Yamaguchi
  • Patent number: 7934944
    Abstract: An embodiment of an electrical connecting apparatus comprises a support board having an upper surface and a lower surface, a block having an attachment surface directing downward and attached to the support board in a state where at least the attachment surface is located below the support board, a flexible circuit board having a contactor area in which a plurality of contactors are arranged and an outside area around the contactor area and attached at part of the outside area to the lower surface of the support board in a state where at least the contactor area is opposed to the attachment surface of the block, and a reference mark member having a lower end surface and a reference mark for positioning provided on the lower end surface and attached to the block in a state where the lower end surface is exposed to the lower side of the circuit board. Accordingly, the measurement accuracy of the probe tip position is heightened.
    Type: Grant
    Filed: March 22, 2007
    Date of Patent: May 3, 2011
    Assignee: Kabushiki Kaisha Nihon Micronics
    Inventors: Kazuhito Hamada, Takashi Akiniwa, Satoshi Narita
  • Patent number: 7928738
    Abstract: A detecting system for detecting the connection of two connectors includes a number of first and second linking lines. The detecting system includes a number of first detection switches, a number of pull-down resistors, a number of second detection switches, a number of pull-up resistors, and a detection module. Each first linking line is grounded via each first detection switch and each pull-down resistor in series. The terminals of the pull-down resistors connected to the first detection switches are defined as first detecting ends. Each second linking line is electrically coupled to a high potential via each second detection switch and each pull-up resistors in series. The detection module with a threshold value preset is configured for comparing the voltage value at the first detecting ends with the threshold value, and outputting a result to determine whether the first linking lines are electrically connected to the second linking lines respectively.
    Type: Grant
    Filed: May 20, 2009
    Date of Patent: April 19, 2011
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Kim-Yeung Sip
  • Publication number: 20110008995
    Abstract: An electrical contact device for controlling operation of an aluminum processing bath includes an electrically insulating body and a first bore having a first diameter. The first bore opens into a through second bore having a second diameter smaller than the first diameter. The second bore opens into a third bore having a third diameter greater than the first and second diameters. A fastener received in the body includes a shank having a male threaded portion and a male threaded head. A conductive biasing element has a connecting end engaged with the male threaded head. The connecting end and the male threaded head are slidably received in the first bore, and the shank is slidably received in the second bore. The male threaded portion extends into the third bore. A nut positioned in the third bore engages the male threaded portion coupling the fastener and tubular body.
    Type: Application
    Filed: September 20, 2010
    Publication date: January 13, 2011
    Applicant: MAC Valves, Inc.
    Inventor: Gilles Beaulieu
  • Patent number: 7825674
    Abstract: A mechanical support configuration for a probe card of a wafer test system is provided to increase support for a very low flexural strength substrate that supports spring probes. Increased mechanical support is provided by: (1) a frame around the periphery of the substrate having an increased sized horizontal extension over the surface of the substrate; (2) leaf springs with a bend enabling the leaf springs to extend vertically and engage the inner frame closer to the spring probes; (3) an insulating flexible membrane, or load support member machined into the inner frame, to engage the low flexural strength substrate farther away from its edge; (4) a support structure, such as support pins, added to provide support to counteract probe loading near the center of the space transformer substrate; and/or (5) a highly rigid interface tile provided between the probes and a lower flexural strength space transformer substrate.
    Type: Grant
    Filed: June 30, 2006
    Date of Patent: November 2, 2010
    Assignee: FormFactor, Inc.
    Inventors: Makarand S. Shinde, Richard A. Larder, Timothy E. Cooper, Ravindra V. Shenoy, Benjamin N. Eldridge
  • Patent number: 7821283
    Abstract: Disclosed herein are a circuit board device for wafer inspection having high connection reliability, and a probe card and a wafer inspection apparatus, which are equipped with this circuit board device for wafer inspection.
    Type: Grant
    Filed: December 20, 2006
    Date of Patent: October 26, 2010
    Assignee: JSR Corporation
    Inventors: Daisuke Yamada, Kiyoshi Kimura, Fujio Hara
  • Patent number: 7815474
    Abstract: A probe connector includes an insulating housing and a probe pin assembly. The insulating housing has a base defining a front surface. The front surface has an inserting hole extending frontward and rearwards. A mounting platform is integrally surrounded a rear surface and two lateral surfaces of the base, with a top thereof lower than a top of the base. The mounting platform has a groove in alignment with and communicating with the corresponding inserting hole. The probe pin assembly mounted to the inserting hole comprises a cylindraceous barrel, an elastic element received in the barrel, and a plunger mounted to the barrel and exposing from an open end of the barrel. A closed end of the barrel is integrally formed with a soldering portion protruding opposite to the plunger and received in the groove for being soldered to a printed circuited board (PCB) when the PCB is mounted to the mounting platform.
    Type: Grant
    Filed: August 28, 2009
    Date of Patent: October 19, 2010
    Assignee: Cheng Uei Precision Industry Co., Ltd.
    Inventors: Ming-Han Lin, Te-Hung Yin
  • Patent number: 7804313
    Abstract: Provided is a semiconductor device, in which: patterns for detecting displacement at probing are formed of a plurality of minute conductors formed below a protective film; each of the plurality of minute conductors formed below the protective film is electrically insulated and formed to be smaller than a bottom surface of a tip of a probing needle used for carrying out an electrical measurement of IC chips; and the patterns for detecting displacement at probing are provided in a pair for each of the IC chips.
    Type: Grant
    Filed: January 15, 2009
    Date of Patent: September 28, 2010
    Assignee: Seiko Instruments, Inc.
    Inventors: Hiroaki Takasu, Sukehiro Yamamoto
  • Patent number: 7749032
    Abstract: A probe connector has an insulating housing having at least one inserting hole and an installing groove adjacent to the inserting hole for communicating with thereof. At least one probe pin assembly mounted to the inserting hole comprises a cylindraceous barrel, an elastic element received in the barrel, and a plunger mounted to the barrel and exposing from an end of the barrel. The barrel has a main body, with an opening formed thereon and facing the installing groove. A fixing element fixed in the installing groove has an elastic arm which is formed with a resting portion projecting into a chamber surrounded by the main body through the opening. The resting portion resiliently rests against a side of the plunger when the plunger is pressed downwards to deflect to contact an inner surface of the main body by an opposite side thereof.
    Type: Grant
    Filed: June 25, 2009
    Date of Patent: July 6, 2010
    Assignee: Cheng Uei Precision Industry Co., Ltd.
    Inventors: Te-Hung Yin, Yung-Yi Chen, Shu-Fang Li, Jui-Pin Lin
  • Patent number: 7727004
    Abstract: An apparatus and associated method for analyzing a communications link between two components on a common PCB. The communications link has a pair of through-board conductors connected by a first conductive etching on one side of the PCB. The communications link further has second etchings on an opposite side of the PCB respectively connecting each of the through-board conductors to one of the components. The first conductive etching can operably be open-circuited and connectors of an analyzer can be fitted to the through-board conductors to test the communications link between the components.
    Type: Grant
    Filed: June 30, 2006
    Date of Patent: June 1, 2010
    Assignee: Seagate Technology LLC
    Inventors: David Louis Spengler, Bill A. Pagano
  • Patent number: 7663387
    Abstract: A support block has a first face, a second face opposed to the first face, and first and second through holes communicating between the first face and the second face, and is formed with resin material. The first face, the second face, and the first and second through holes are covered with an electrically conductive plated coating. First and second probes are electrically connected to terminals of a device to be tested provided on a side of the first face and to terminals connected to a testing apparatus provided on a side of the second face. The first probe is provided in the first through hole and is electrically connected to the plated coating on the first through hole, the second probe is provided in the second through hole and is electrically connected to the plated coating on the second through hole.
    Type: Grant
    Filed: September 27, 2007
    Date of Patent: February 16, 2010
    Assignee: Yokowo Co., Ltd.
    Inventors: Takuto Yoshida, Alvy V. Padiyil
  • Patent number: 7642793
    Abstract: A system and a method of testing a semiconductor die is provided. An embodiment comprises a plurality of metal tips that are connected to a redistribution layer that fans out the pitch from the tips to metal plugs located in the substrate. The metal tips could be formed using semiconductor processes and either adding smaller layers of metal to larger layers of metal or else removing portions of one piece of metal to form the tips. The metal plugs are connected to a space transformation layer. The space transformation layer is electrically connected to a printed circuit board using, for example, a spring loaded connection such as a pogo pin. The space transformation layer is aligned onto the printed circuit board by a series of guidance mechanisms such as smooth fixtures, and the planarity of the tips is adjusted by adjusting a series of screws.
    Type: Grant
    Filed: June 25, 2007
    Date of Patent: January 5, 2010
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsu Ming Cheng, Frank Hwang, Clinton Chao
  • Patent number: 7639026
    Abstract: A contact for use in a test set which can be mounted to a load board of a tester apparatus. The contact, which serves to electrically connect at least one lead of a device being tested with a corresponding metallic trace on the load board, has a first end defining multiple contact points. As the contact is rotated about an axis generally perpendicular to a plane defined by the contact, successive contact points are sequentially engaged by a lead of the device being tested.
    Type: Grant
    Filed: February 22, 2007
    Date of Patent: December 29, 2009
    Assignee: Johnstech International Corporation
    Inventors: Dennis B. Shell, Mathew L. Gilk, Jose E. Lopez