Abstract: A probe whose characteristic impedance can be accurately adjusted to a desired value with the production of a small number of prototypes. The probe includes a first line with a signal terminal to be connected to a signal electrode of a circuit to be measured and at least one first region connected to the signal terminal and to which one end of a chip capacitor is connected, a second line connected to a terminal of the first line and a junction to be connected to a measuring instrument at the remaining terminal, and an impedance matched to a characteristic impedance of the measuring instrument, a ground connector with a ground terminal to be connected to the ground electrode of the circuit to be measured, and at least one second region connected to the ground terminal and on which the remaining terminal of the chip capacitor is mounted in one-to-one correspondence with the first region.

Abstract: A cartridge system includes a main probing head body with electronics positioned therein. Further, the cartridge system includes a probing tip cartridge having a probing tip. An electrical contact mechanism electrically couples the electronics to the probing tip when the probing tip cartridge is in mating relationship with the main probing head body. The types may be, for example, a pointed tip, a socket tip, or a grabber tip.

Abstract: An electric signal taking-out method and a device therefor capable of taking out electric signals for measurement easily from opposite ends of an arbitrary chip part soldered to a circuit board. A pair of contact elements having sharp distal ends and bent obliquely inward are arranged so that the distal ends thereof face each other. The contact elements are shifted inward by a holding member so that the distal ends bite into solder joints by which the chip part is soldered to the circuit board. The contact elements are held in the biting state so that electric signals are taken out independently from the respective contact elements.

Abstract: An electrical contact technique for use in the semiconductor device inspection equipment is disclosed. There are used one or more pyramid-shaped contactors projecting toward an objective semiconductor device to be tested. The contactor is brought into contact with the projection electrode of the objective semiconductor device through the edge line or the slant surface thereof. Accordingly, only the side portion of the projection electrode is pressed by the edge line or the slant surface of the contactor, thus the projection electrode being prevented from being damaged at the tip portion thereof.

Abstract: A lead connector arrangement includes a non-cylindrically shaped connector pin coupled to a lead conductor and a connector sleeve assembly for receiving the non-cylindrically shaped connector pin. The connector sleeve assembly includes an insert with an axial bore formed therein that complements the shape of the non-cylindrical connector pin. According to one embodiment, the non-cylindrical connector pin may be provided in the form of a triangular, square, rectangular, or hexagonal shape. The axial bore has a complimentary shape to receive the connector pin. When the connector pin is threaded through the connector sleeve assembly using a pull-wire device, the pull-wire device may be unscrewed from the connector pin without causing axial rotation of the lead conductor when the connector pin is fully inserted within the axial bore.

Abstract: A spring probe block assembly includes an insulative housing. A probe connector having a signal probe, an insulative layer, and a conductive shell is positioned within the housing. At least one ground probe is also positioned within the housing. The ground probe and the conductive shell of the probe connector are electrically connected by a grounding element. The grounding element is configured to elastically deform the ground probe in such a manner as to create spring energy in the ground probe. The spring energy generates a normal force between the ground probe and the grounding element which maintains the ground probe in its position. Also, a method for retaining a spring probe in a housing by elastically deforming the spring probe to maintain a spring force between the spring probe and the housing.

Abstract: Electrical connection of a measuring socket to an IC package, to measure electrical characteristics of the IC package, is realized by bringing a measuring pin of a measuring arm of the measuring socket into contact with an end surface of a distal end of a lead of the IC package. Accordingly, a problem of solder plated to the lead becoming attached to and deposited on an upper side of a socket pin and shaved off by the distal end of the lead, and thereby producing solder residue, is solved. This problem occurs when electrical connection to an IC package is conventionally realized by bringing the distal end of the lead of the IC package into contact with a distal end of the socket pin.

Abstract: A self scrubbing buckling beam contactor for contacting an array of pads positioned on a device under test is described. The contactor consists of three insulating dies: a top, an offset and a lower die separated from each other by an insulated spacer of variable thickness. Each die is provided with holes. The buckling beam has an array of flexible wires positioned substantially perpendicular to the dies, each of the flexible wires crossing a corresponding hole in each of the top, offset and lower dies to allow each wire respectively contact a pad of the device under test. By shifting the center of the hole of the lower die relative to the center of the offset die, the tip of the wire exits from the lower die at an angle with respect to the plane formed by the pads of the device under test.

Abstract: A testing head for microstructures is presented. The testing head includes a top guide plate and bottom guide plate, separated by an air gap. Each of the plates include respective guide holes for accommodating a contact probe having a contact tip that is arranged to mechanically and electrically contact a contact pads on a device under test. The contacting tip of the testing head has a non-zero pitch angle (&agr;OUT) relative to the contact pad, and “scrubs” the pad as the device under test is drawn against the contacting tip, causing the contact probe to bend within the air gap.

Abstract: A probe structure for testing a to-be-tested object having at least one to-be-tested device. The probe is inserted into a pin hole formed on a pin board and contacts the to-be-tested device. The probe includes a probe body and a resilient member. The probe body has an insertion portion and a head contacting the to-be-tested device. The resilient member is placed within the pin hole of the pin board and has a top end and a bottom end. The top end is formed with a support portion contacting the insertion portion of the probe body when the probe body is inserted into the pin hole. Thus, the probe body can be elastically restored and properly guided.

Abstract: A contact structure is formed of a contact substrate and a plurality of contractors. The contactor is uniformly formed of conductive material and has an intermediate portion which is inserted in the through hole provided on the contact substrate in a vertical direction, a contact portion which is connected to the intermediate portion and positioned at one end of the contactor to function as a contact point for electrical connection with a contact target, and a base portion which is provided at other end of the contactor, and a spring portion which is substantially straight and upwardly inclined relative to the surface of the surface of the contact substrate and provided between the base portion and the intermediate portion. The intermediate portion is staright and a portion of which is reduced in width or thickness.

Abstract: A spring probe block assembly includes an insulative housing. A probe connector having a signal probe, an insulative layer, and a conductive shell is positioned within the housing. At least one ground probe is also positioned within the housing. The ground probe and the conductive shell of the probe connector are electrically connected by a grounding element. The grounding element is configured to elastically deform the ground probe in such a manner as to create spring energy in the ground probe. The spring energy generates a normal force between the ground probe and the grounding element which maintains the ground probe in its position. Also, a method for retaining a spring probe in a housing by elastically deforming the spring probe to maintain a spring force between the spring probe and the housing.

Abstract: An electrical connector (1) includes an insulative housing (2) and a number of compressive conductive contacts (3). The insulative housing has a top surface (20), a bottom surface (22) opposite to the top surface and a number of passageways (24) extending through the top and bottom surfaces. Each compressive conductive contact includes a rigid contacting portion (30) partially and movably protruding beyond the top surface, a rigid mounting portion (32) retained to the insulative housing and a compressive transitional portion (34) located between and electrically connecting the rigid contacting and mounting portions.

Abstract: A spring probe block assembly includes an insulative housing. A probe connector having a signal probe, an insulative layer, and a conductive shell is positioned within the housing. At least one ground probe is also positioned within the housing. The ground probe and the conductive shell of the probe connector are electrically connected by a grounding element. The grounding element is configured to elastically deform the ground probe in such a manner as to create spring energy in the ground probe. The spring energy generates a normal force between the ground probe and the grounding element which maintains the ground probe in its position. Also, a method for retaining a spring probe in a housing by elastically deforming the spring probe to maintain a spring force between the spring probe and the housing.

Abstract: A socket for an electrical part comprises a socket body and a contact pin through which an electrical part having a terminal and a printed circuit board are electrically connected. The socket body is provided with a lower plate to be mounted to the printed circuit board and an upper plate which is disposed above the lower plate and on which the electrical part is mounted. The upper plate is exchanged with one having a seating portion of different height. A contact portion of the contact pin is also exchangeable with one having different shape or type.

Abstract: A telecommunication apparatus comprising an external plastics casing containing a conductive path for a telecommunications signal. The casing includes an aperture providing access to the test contact member using a typical crocodile clip. The conduction path may take various forms. One such example is a contiguous path adjacent the test contact member (26) but not in contact with the test contact member except when in a test position. This enables an engineer to test a telephone line by simply clipping a crocodile clip onto the test contact member and a wall member. A second form of the apparatus provides for a pair of conductors not in mutual contact but each in contact with the test contact member when the latter is in the rest position. When the test contactor is in a test position, only one of the pair of conductors is in contact with the test contact member.

Abstract: A probe tip adapter with easily interchangeable termination. It includes an empty circuit substrate with which the user may construct a probe adapter circuit designed specifically for almost any measurement situation. Also, several standard termination circuits may be easily interchanged by the user to allow the same probe tip adapter to work with transmission lines of different impedance.

Abstract: A variable spacing probe tip adapter for a differential measurement probe has a measurement probe head with first and second probe tips extending from the probe head. Ribs and grooves formed in the probe head that extend radially from around each of the probe tips. Each of first and second first probing tips have an electrically conductive shaft that has a bore formed in one end for engaging the probe tips of the measurement probe. Each shaft has ribs and grooves formed therein that extend radially from the bore for engaging the corresponding grooves and ribs in the probe head. The other end of the conductive shaft tapers to a probing point with and a portion of the shaft toward the tapered end of the shaft being angled such that the probing tips. The conductive shafts are rotatable on measurement probe tips and locked into position by the engagement of the ribs and grooves in the probe head and the probing tips.

Abstract: A socket pin and a socket for electrical testing of a semiconductor package suppress electrical open/short defects due to contact failure and reduce manufacturing costs. The socket pin includes: an upper portion that connects to a lead of the semiconductor package, for exchanging a signal between the semiconductor package and a tester; a body connected to the upper portion, for buffering at two points, a downward force applied by the lead of the semiconductor package to the upper portion; a lower portion connected to the body of the socket pin, the lower portion being elastically durable to the force from the upper portion and the body; and a lower socket pin connected to the lower portion, which acts as a path for transmitting or receiving an electrical signal.

Abstract: A spring contact includes a free portion having a tip. The free portion includes a contact surface and side surfaces. In some embodiments, a wear resistant material is formed on only selected portions of the tip. In other embodiments, the wear resistant material is formed on the contact surface and on the side surfaces. The wear resistant material increases the wear resistance of the spring contact. The spring contacts can be used in probes.

Abstract: An integrated circuit device having a first type of pads with a probing portion and a bonding portion. The integrated circuit device includes a memory cell array, a logic circuit, and a plurality of the first type of pads and a plurality of a second type of pads. The second type of pads are electrically connected to the logic circuit. The first type of pads are electrically connected to the memory cell array and the logic circuit. Only the probing portion of the first type of pads is contacted by probes during testing of the memory cell array, and the bonding portion is used exclusively for attachment of a bond wire to permit connection to an external system.

Abstract: A double-ended, coaxial contact assembly has a center probe rod (12) mounted in the bore of a dielectric center spacer bushing (16) and mounts a probe contact assembly on each end of the center probe rod. The center probe rod is received in a ground sleeve (19) with the probe contact assemblies maintained in coaxial relationship with the ground sleeve by a dielectric outer spacer bushing (17). In certain embodiments a movable ground plunger (18g,22) is slidably received in each end of the ground sleeves and biased outwardly by respective ground plunger coil springs (25). In one such embodiment the center spacer bushing (16′) is provided with an axially extending sleeve disposed between the respective probe contact assembly and the ground sleeve.

Abstract: A bridge clip for testing electrical connections includes a body and at least one test lead having a first end connected to the body, and a second end having a dimple formed thereon. In a second embodiment, a bridge clip for testing electrical connections includes a body, a test lead connected to the body having a free end, and a latch formed with the body, the latch including a first deflection beam formed on one side of the body and a second deflection beam formed on an opposite side of the body.

Abstract: An electromechanical apparatus for testing IC-chips 12c includes a sliding springy mechanism 15a-15g which squeezes a chip holding subassembly 12a-12d between a temperature regulating subassembly 14a-14d and a power converter subassembly 13a-13c. Vertically moveable actuators 16a, with slots 16a-1, impart motion to joints 15e within the sliding springy mechanism 15a-15g. The joints 15e slide on a rail 15a to thereby open and close arms 15a, 15b; and that causes the substrates 14c, 12c to be lowered and raised, respectively. When the substrates 14c, 12c are raised, temperature regulating components 12c engage IC-chips 12c, and electrical contacts 12d engage electrical contacts 13b, with a force that is nearly constant despite the presence of several dimensional tolerances.

Abstract: A continuity sensing pin movable forward and backward has one end for contacting a terminal of a connector. An insertion inspecting pin has one end insertable into a deflection space of a flexible locking arm that locks the terminal in a housing of the connector. An electrically conductive slide is resiliently urged toward the terminal of the connector. The continuity sensing pin has an opposing end contacting a circuit conductor via a resilient member. The circuit conductor can contact the slide. The insertion inspecting pin has an opposing end that can abut against the slide. When the slide is energized by an external power source and the one end of the insertion inspecting pin abuts against the flexible locking arm, the opposing end of the insertion inspecting pin pushes the slide to disengage the slide from the circuit conductor. The circuit conductor is arranged on a circuit board. The circuit board has a through hole passing the opposing end of the insertion inspecting pin.

Abstract: This invention pertains to a high density interconnection test connector intended especially for verification of integrated circuits, including a plate supporting a multiplicity of conductive pins one of the ends of which forms a contact zone with the electronic circuit to be tested and the other end forms a contact zone with a connecting plate that has a connection means with the test equipment, with the conductive pins presenting a form that is capable of ensuring flexibility and including a longitudinal component, characterized in that the pins present a succession of at least three arc-shaped sections (4, 5, 6) in alternating directions extended on both sides by rectilinear segments that are mobile according to one degree of freedom in axial translation, with the pins being inserted in the front plates.

Abstract: An insulation displacement connector may have wire insertion holes, a cap pivotally mounted on a top section, and terminals that have a retention channel for latching to a test lead of a bridge clip. The bridge clip may have resilient latch arms for retention of the bridge clip to the insulation displacement connector. The latch arms may be movable from a closed (latched) position to an open (unlatched) position.

Abstract: An electrical contact technique for use in the semiconductor device inspection equipment is disclosed. There are used one or more pyramid-shaped contactors projecting toward an objective semiconductor device to be tested. The contactor is brought into contact with the projection electrode of the objective semiconductor device through the edge line or the slant surface thereof. Accordingly, only the side portion of the projection electrode is pressed by the edge line or the slant surface of the contactor, thus the projection electrode being prevented from being damaged at the tip portion thereof.

Abstract: An extended length, high frequency contactor block has a plurality of signal conductors, each having a contact element formed at its end. Each signal conductor has an inductance which is an inherent material property. The signal conductors are disposed within a plurality of layers configured to form a capacitor with each signal conductor. The plurality of layers is further configured to provide a capacitance which has a controlled relationship to the inductance of the signal conductors. The relationship may be controlled such that the impedance of each signal conductor is minimized. Because impedance is independent of length, the contactor block can be made to any length desired. A method of manufacturing a contactor block is also disclosed.

Abstract: A monitor method for testing probe pins is described in this invention. In accordance with the method of the present invention, a particular probe pin with short, deformity or unstable contact is identified.

Abstract: A connector testing system includes a bridge clip having a body and a test lead connected thereto, a connector having a top portion and a housing having a test channel formed therein, an electrically conductive terminal strip disposed within the connector, and a stop connected to the top portion and positioned to abut the body of the bridge clip to prevent the test lead from being overinserted into the test channel. A connector testing system may include a bridge clip having a body and a test lead with a tip, the test lead being connected to the bridge clip, and a connector including a housing that has a side wall, a front wall, a rear wall, and a bottom wall substantially perpendicular to the side wall, the front wall and the rear wall and extending therebetween. A test channel having an upper section and a lower section is formed by the side wall, the front wall, the rear wall and the bottom wall. A portion of a terminal strip is disposed within the test channel.

Abstract: An insulative caliper type pivotal mounting pivotally secures two elongate arms that at their free ends mount a pair of electrically conductive pointed contacts. Electrical conductors connected to the contacts extend through each of the insulative elongate arms and through the elastic pivotal mounting from which they exit as a coaxial cable. On the distal end of the coaxial cable is positioned a quick connect-disconnect jack adapted for mounting onto a complementary jack in an electronic test instrument. The separation between the pointed ends of the contacts is infinitely adjustable by means of a thumb screw having reversed threaded studs extending from the opposed sides of the center thereof into threaded pivotal mountings on each of the elongate arms. The dual point test probe may be infinitely adjusted, maintained in the predetermined separation and may be manually manipulatable by the single hand of a user when testing current, voltage drop, capacitance, inductance or the like between the contact points.

Abstract: A coaxial contact assembly (100,100′,100″) is shown in which the outer cylindrical barrel (102,102′,102′″) is adapted to be fixedly mounted in a support and with a ground plunger (104,104″) telescopically and slidably received therein and with an interface ductor member (106,106″) in turn telescopically and slidably received within the bore of the ground plunger. The interface member is fixedly attached to and in electrical engagement with the braid layer of a coaxial cable (1) and is formed with a plurality of elongated, longitudinally extending fingers (106b) which extend radially outwardly a selected amount so that when received in the bore of the ground plunger they are biased into intimate electrical engagement therewith. An inverse electrical connection between the ductor member and the ground plunger is shown with fingers (104b′) of ground plunger (104′) biased into electrical engagement with a solid tubular inductor member (106b′).

Abstract: A probe for measuring signals with a narrow contact pitch comprises an end section having a main tip member and a sub-tip member, each of which passes through one of two holes in a housing. The sub-tip member is electrically connected to the housing and the main-tip member is insulated from the housing by an insulation member. The sub-tip member is pivotally connected to the housing. The subtip member is asymmetric with respect to the pivot and therefore, its sharpened end can trace a circular orbit when the sub-tip member turns on its pivot. The distance between the two end sections of these tip members (that is, the contact pitch) can be set to a desired length by positioning sub-tip sharpened end section to any point on this orbit.

Abstract: In a high-frequency probe having a detachable end according to the present invention, parts relating to replacement of an end unit are three parts, that is, an end unit, a probe body, and a pressure block. The end unit comprises a coaxial cable, two slender plate-like ground plates. The coaxial cable is linear in the direction of the end of the high-frequency probe. The ground plates sandwich the coaxial cable. The probe body has an end unit support surface, a circuit board, an end unit arrangement surface and an end part guide. The end unit support surface forms a perpendicular surface used for fixing the end unit to a predetermined position in the end side of the central block in a central part of a surface of the body block. The circuit board connects the end unit to a coaxial connector. The end unit arrangement surface forms a plane in an end side of the body block. And further the guide groove positions and fixes the ground plate in the end part.

Abstract: A connector of electromagnetically insulative material includes a shaft section on a drive shaft end and a matching probe section on an eddy current probe mating to the shaft section with face to face contact surfaces to prevent electromagnetic fields from propagating along the surfaces. The connector includes upper and lower portions with power line connecting pins and matching sockets in the upper portions of the sections and communication line connecting pins and matching sockets in the lower portions of the sections. The pins and sockets are fitted within electrically nonconductive inserts within probe and shaft section bores, the inserts having magnetic permeabilities less than those of the probe and shaft sections.

Abstract: A vertical probe for use in testing multiple chips carried on a wafer comprises a body of dielectric material having a testing surface and an output surface spaced from the testing surface. The dielectric body includes at least one chamber defining an opening in the output surface, and the rim of the opening is formed by a lip of the dielectric material. The device also includes multiple contacts which pass through the testing surface and which are snap fit in holes in the rim. A unibody construction for the dielectric body is described.

Abstract: An electrical contactor assembly (10) has a conductive body (11) with an external thread (12). An electrical contact (14) is electrically coupled via a conductive spring (25) to body (11). A housing (16) is attached to body (11) and has an opening (27) to allow protrusion of an elongate cylindrical conductor (24) of electrical contact (14) having a contact surface (15). An abutment (26) of elongate cylindrical conductor (24) abuts housing (16) for captive location therein and to retain electrical contact (14) in a bore (31) in body (11) against the biasing influence of spring (25). External thread (12) is self-tapping and can be self-drilling.

Abstract: An electric contact apparatus has a flexible contact sheet 13. A plurality of conductive elements 14 are provided on a front side of the flexible contact sheet 13 and are arranged in parallel with each other along the direction of arrangement of electrodes 4 arranged on an insulating substrate 2 of a liquid crystal display panel 1 so as to be brought into contact with the electrodes 4, respectively. An internally sealed elastic tube 17 is supported in a groove 18 formed on one side of a pressing plate 11 and extends along the direction of arrangement of the conductive elements 14 so as to press a part of each contact region between the conductive elements 14 and the electrodes 4.

Abstract: A probe card, used for testing the electric characteristics of semiconductor devices, is disclosed. The probe card has main and subsidiary cards. The main card has a main circuit used for testing the electric characteristics of semiconductor devices. The subsidiary card carries a test tip and is detachably attached to the main card into a module when it is necessary to test the electric characteristics of semiconductor devices. A package card in place of the sub-card may be used with the main card. The package card is used for testing the electric characteristics of semiconductor packages having semiconductor chips tested by the subsidiary card. Therefore, it is possible for the probe card to effectively compare test data of the semiconductor chips of a wafer to test data of finally bonded and molded semiconductor packages having the above chips.

Abstract: A method and apparatus for testing an integrated circuit die including a probe card (10) having a plurality of surface mount pads (45) arranged in a pattern (50) substantially corresponding to an area array pattern of die bumps (25) on the IC die. The pads and the die bumps are respectively electrically connected to each other with conductive probes (30). A plurality of test contacts (55) located around the periphery of the probe card (10) are in electrical contact to each surface mount pad (45) with electrical traces (65). An integrated circuit tester (60) having a plurality of test channels is electrically connected to a selected test contact (55) of the probe card (10), thereby forming a continuous conductive path between the integrated circuit tester (60) and the die bumps (25) on the IC die.

Abstract: A connector testing system includes a bridge clip having a body and at least one test lead having a fixed end connected to the body and a free end having a projection formed thereon, and a connector having a top portion and a housing having at least one test channel therein. At least one terminal strip is disposed within the connector and a portion of the terminal strip is disposed within the at least one test channel. A flap is connected to the housing for sealing the at least one test channel when the flap is in a first position and for sealing the at least one test channel and securing the bridge clip to the connector at a second position.

Abstract: An improved structure of a terminal includes a horseshoe-shaped contact portion with a smooth contact surface. The terminal is formed on a substrate by punching. It has a fixing portion on which a plurality of tenons are formed so as to be fixed in the housing of a connector. The lower end of the terminal is a pin portion bent to be orthogonal to the flat surface of the fixing portion. A raster spring with an upper protruded part is formed above the fixing portion. A horseshoe-shaped contact portion is connected to the upper protruded part of the raster spring. The contact portion has a smooth surface for providing high quality and low noise electrical contact.

Abstract: A coaxial contact assembly (10,10', 10") has a cylindrical ground plunger (30) which is fixedly attached to the ground conductor (1b) of a coaxial cable (1,1') through a ground sleeve (28) and mounted in a test head support (4) for sliding movement therein. An inner contact plunger barrel (18) is fixedly attached to the signal conductor (1a) of the coaxial cable either through a signal sleeve (16) for a replaceable inner contact assembly, or directly for a dedicated unit. An inner contact plunger (20) received in the plunger barrel has a contact portion (20c) biased outwardly to extend a selected amount beyond the ground plunger (30) in a given direction by a first spring member (24) while a second spring (36) biases the ground plunger outwardly in the given direction to a preset location.

Abstract: A tool is described for shunting a multi-tap for an RF cable system by connecting a low-pass filter between an unused input port and an unused output port of the multi-tap. The components of the filter are such as not to interfere with the circuits of the multi-tap when both are in the circuit. A light is provided for indicating when the tool is in operative position.

Abstract: A dual contact probe tip is provided within a flying probe circuit tester to make separate electrical contacts with a circuit under test at two closely-spaced test points. The tip includes a mounting block having an attachment section attached to a carriage of the tester and a pair of flexible cantilever sections, with a probe pin extending from a distal end of each of these cantilever sections to make contact with the circuit. One electrical path is established through the conductive mounting block and one of the probe pins. The other probe pin is coated with an insulating material except for its point and for a surface to which a wire is soldered, so that the other electrical path is established through this other probe pin and the attached wire. Each probe pin is tapered toward its point, and the probe pins extend from the mounting block at an oblique angle toward one another.

Abstract: An end capsule for a cable probe which is easy to assemble, has a low number of sealing points, has a small external diameter and can be reduced to a desired length by the user is specified. This capsule comprises a cup (1), a cover (2), an insert (3) in which the cable is fixed, a sealing element (6) and a plug (7). The sealing element (6) has a first outwardly conical portion (62), which bears by an inner annular face against the cable in a sealing manner, and a second inwardly conical portion (63), which bears by an outer annular face (66) against an inner annular face of the cup (1) in a sealing manner. The cover (2) is pressed by an end face (24) against an annular face (74), facing away from the sealing element, of the plug (7) and the cable is led through the cover (2), the plug (7) and the sealing element (6) and into the insert (3).

Abstract: A fixture for carrying a neural probe. The fixture has a base with opposite forward and rear ends, the rear end having an engagement feature for engaging a micropositioner and the forward end having a receiving feature for receiving the semiconductor substrate base of the probe.

Abstract: There are provided a test probe for a measuring instrument, and a tester incorporating the test probe. The test probe includes a probe, a lead wire, a grip and a lead wire-holding piece. A probe for being brought into contact with a measuring object has a proximal end. A lead wire has one end thereof connected to a main unit of the measuring instrument and the other end thereof connected to the probe. A grip protects a portion connecting the probe and the lead wire. The grip is engaged with the proximal end of the probe. A lead wire-holding piece fixedly holds a distal end of the covered portion of the lead. The grip has a retaining portion engaged with the lead wire-holding piece for preventing the lead wire from being drawn out from the grip. In another form, the test probe has a crimp contact for connecting the proximal end of the probe and an uncovered portion of the lead wire. The grip protects a portion connecting the probe and the lead wire, including the crimp contact.

Abstract: The hand held circuit tester includes a hollow handle. A probe extends from one end of the handle. First and second leads extend from the other. An LED carrying circuit board is situated within the handle. One end of the circuit board is connected to the probe by a spring. The other end is connected to the leads. A "U" shaped collar is received within slots in the circuit board in a position perpendicular to the plane of the circuit board. The collar edge abuts the edge of one of the handle parts to stabilize the circuit board relative to the handle.