Leadless Patents (Class 439/71)
  • Patent number: 10416227
    Abstract: A method of fabricating a surface-emitting laser includes the steps of fabricating a substrate product including device sections, a pad electrode, and a conductor, each of the device sections including a surface-emitting laser having an electrode, the conductor connecting the pad electrode to the electrode across a boundary of the device sections; attaching a connection device to the substrate product, the connection device including a probe device having a probe and a probe support base having an opening; performing a burn-in test of the surface-emitting lasers by applying electric power to the pad electrode through the probe at a high temperature; and after the burn-in test, separating the substrate product into semiconductor chips. The burn-in test includes a step of monitoring light emitted by the surface-emitting laser through the opening during the burn-in test, and a step of selecting the surface-emitting lasers based on a monitoring result.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: September 17, 2019
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventor: Ryosuke Kubota
  • Patent number: 10172249
    Abstract: An electrical connector for electrically connecting a chip module, including an insulating body provided with multiple accommodating grooves in multiple rows and vertically passing through the insulating body. Each two adjacent accommodating grooves are provided with a partition or a space above the partition. The insulating body is concavely provided downward with at least one groove correspondingly located on the partition or in the space above the partition. The groove has a bottom surface and a side surface being closed and formed by extending upward from a periphery of the bottom surface, and the groove is configured for a pushing pin to push and eject the insulating body from a mold. The insulating body is protrudingly provided upward with a plurality of protruding blocks, configured to support the chip module. The groove and all the protruding blocks are not located on the same partition.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: January 1, 2019
    Assignee: LOTES CO., LTD
    Inventors: Ted Ju, Zuo Feng Jin
  • Patent number: 10149384
    Abstract: A support structure located at a bottom of a ball grid array (BGA) is provided. The support structure includes a printed circuit board (PCB) having first positioning pin holes, an interface plate having second positioning pin holes which correspond to the first positioning pin holes arranged on the PCB, a support film arranged on the PCB and having support portions, and positioning components penetrating the first positioning pin holes and the second positioning pin holes corresponding to the first positioning pin holes to assemble the support film on the PCB and the interface plate.
    Type: Grant
    Filed: July 4, 2018
    Date of Patent: December 4, 2018
    Assignee: CHUNGHWA PRECISION TEST TECH. CO., LTD.
    Inventors: Yung-Tai Su, Ching-Fang Cheng, Ti-Chiang Chiu
  • Patent number: 10109940
    Abstract: Embodiments herein relate to port frames and connectors for direct connections to integrated circuit packages. In various embodiments, a port frame to receive a connector and maintain a connection between the connector and a computer processor package may include a protrusion to provide stable attachment of the port frame to a bolster frame, a first wall, a second wall opposite the first wall, a first detent in the first wall, and a second detent in the second wall where the connector is to be received between the first wall and the second wall, and where the first detent is to receive a first locking protrusion extending from the connector and the second detent is to receive a second locking protrusion extending from the connector. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: December 13, 2016
    Date of Patent: October 23, 2018
    Assignee: Intel Corporation
    Inventors: Thomas A. Boyd, Feifei Cheng, Donald T. Tran, Russell S. Aoki, Karumbu Meyyappan
  • Patent number: 9993637
    Abstract: A lead arrangement includes a plurality of proximal leads, a distal lead, and a junction electrically and mechanically coupling the plurality of proximal leads to the at least one distal lead. Each proximal lead has a proximal end and a distal end and includes conductive contacts disposed along the proximal end and conductive wires coupled to the conductive contacts and extending to the distal end of the proximal lead. Each distal lead has a proximal end and a distal end and includes electrodes disposed along the distal end and conductive wires coupled to the electrodes and extending to the proximal end of the distal lead. The junction includes conductive tabs and a non-conductive material encapsulating the conductive tabs. The conductive wires of the at least one distal lead and the conductive wires of the plurality of proximal leads are attached to the conductive tabs of the junction.
    Type: Grant
    Filed: August 21, 2013
    Date of Patent: June 12, 2018
    Assignee: Boston Scientific Neuromodulation Corporation
    Inventor: Jacob B. Leven
  • Patent number: 9954312
    Abstract: An electrical connector for electrically connecting a chip module to a circuit board includes an insulating body with receiving holes running through the insulating body, terminals correspondingly received in the receiving holes, and metal members not in contact with the chip module. Each metal member and the terminal corresponding to the metal member are received in the same receiving hole. Each metal member has a connecting portion disposed at a side of a soldering portion of a terminal, and a clamping portion extending and bending from the connecting portion to bypass the soldering portion and extend along a direction from the side to another opposite side of the soldering portion, so that the clamping and soldering portions jointly clamp a solder ball with a reduced distance between the terminals on a strip and without the terminals being inserted into the same row of receiving holes at intervals for multiple times.
    Type: Grant
    Filed: July 14, 2017
    Date of Patent: April 24, 2018
    Assignee: LOTES CO., LTD
    Inventor: Ted Ju
  • Patent number: 9917033
    Abstract: A heat sink comprises a base and a fin support larger in area than the base and supporting fins that may be positioned in a plurality of orientations relative to the base. The base is adapted for being connected to a heat-generating electronic component on a circuit board, and the heat sink dissipates heat generated by the heat-generating electronic device and conducted through the base and the fin support to the fins supported thereon. The heat sink dissipates heat from the heat-generating electronic device in a first operable position and in a second operable position. The heat sink may be moved from the first to the second operable position to facilitate access to electrical contacts proximal the heat-generating electronic component.
    Type: Grant
    Filed: June 26, 2012
    Date of Patent: March 13, 2018
    Assignee: Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
    Inventors: William M. Megarity, Jr., Luke D. Remis, Gregory D. Sellman
  • Patent number: 9806444
    Abstract: An electrical connector includes an insulating body having a bottom plate with receiving slots and multiple terminals received in the receiving slots. Each receiving slot has two opposite first side walls, and a second and third side walls connecting the first side walls. A protruding block protrudes from the second side wall toward the third side wall. Each terminal has a plate portion, an elastic arm and a material connecting portion extending upward from the plate portion, a contact portion at a top end of the elastic arm to urge a chip module, and two clamping portions bending and extending from two opposite sides of the plate portion horizontally. The plate portion and the material connecting portion are limited between the protruding block and the third side wall. Tin balls are fixed between the clamping portions, and soldered to a circuit board. The tin balls are below the protruding block.
    Type: Grant
    Filed: February 16, 2017
    Date of Patent: October 31, 2017
    Assignee: LOTES CO., LTD
    Inventor: Ted Ju
  • Patent number: 9653230
    Abstract: A push plate that includes springs in the form of cantilever flexures and an inspection window is disclosed. The push plate provides a known, uniform, down force and minimal torque to a package to be tested. The cantilevers have a known, calculable down force producing stiffness. The window provides for viewing of the package during testing.
    Type: Grant
    Filed: February 14, 2013
    Date of Patent: May 16, 2017
    Assignee: Sandia Corporation
    Inventors: Mark R. Vaughn, Stephen Montague
  • Patent number: 9564156
    Abstract: A head gimbal assembly (HGA) for a disk drive includes a load beam, a laminated flexure attached to the load beam, and a head attached to the laminated flexure. The laminated flexure includes a tail for electrical connection between the head and a flex cable of a head stack assembly. The laminated flexure tail may include a plurality of conductive traces, a structural layer, and a dielectric layer there between, and may be disposed partially within a slot of an actuator arm. A first insulative cover layer is disposed on the plurality of conductive traces. A plurality of stand-off islands is disposed on the first insulative cover layer, and over at least one of the plurality of conductive traces (e.g. the writer traces). At least one of the plurality of stand-off islands is at least partially disposed between the first insulative cover layer and the inner slot surface.
    Type: Grant
    Filed: January 27, 2016
    Date of Patent: February 7, 2017
    Assignee: Western Digital Technologies, Inc.
    Inventors: Wing Chun Shum, Yanning Liu, John E. Scura
  • Patent number: 9414488
    Abstract: In a circuit board for mounting electronic components, in which electronic components are to be mounted on its two surfaces by a reflow soldering process, the sizes of lands on the primary and secondary surfaces of the circuit board are set different from each other when chips having the same shape are to be mounted on both the primary and secondary surfaces of the circuit board.
    Type: Grant
    Filed: January 24, 2013
    Date of Patent: August 9, 2016
    Assignee: CANON KABUSHIKI KAISHA
    Inventor: Yuichi Hagiwara
  • Patent number: 9386687
    Abstract: While it is necessary for an electronic component housing package to be provided with numerous wiring conductors, phase differences of signals caused by differences in signal transmission distance among the wiring conductors, is a problem. An electronic component housing package based on one embodiment includes a substrate having a dielectric region and an electronic component placement region, a frame body surrounding the dielectric region and the placement region, and wiring conductors disposed on the dielectric region of the substrate. The wiring conductors have a first wiring conductor and a second wiring conductor which is longer in signal transmission distance than the first wiring conductor, which are disposed so as to extend from a location immediately below the frame body to the dielectric region. The frame body made of a dielectric material has a projection protruding from its inner periphery, which covers at least part of the first wiring conductor.
    Type: Grant
    Filed: December 20, 2012
    Date of Patent: July 5, 2016
    Assignee: KYOCERA CORPORATION
    Inventors: Mahiro Tsujino, Yoshiki Kawazu
  • Patent number: 9320147
    Abstract: A semiconductor module assembly is provided. The semiconductor module assembly includes a motherboard, a socket, and a semiconductor module. The motherboard includes an opening for receiving the semiconductor module, the opening including at least three sides. The socket is disposed in the opening along at least a first side, second side, and third side of the at least three sides. The semiconductor module is disposed in the socket. The semiconductor module includes at least one semiconductor device mounted on a module board. The socket includes at least a first side along the first side of the opening, and a second side along the second side of the opening, and the semiconductor module electrically connects to the motherboard through at least the first and second sides of the socket.
    Type: Grant
    Filed: January 31, 2013
    Date of Patent: April 19, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jeong-Hyeon Cho, Jae-Jun Lee, Jung-Joon Lee, Baek Kyu Choi, Seung-Jin Seo
  • Patent number: 9276336
    Abstract: A surface mount electrical interconnect to provide an interface between a PCB and contacts on an integrated circuit device. The electrical interconnect includes a substrate with a plurality of recesses arranged along a first surface to correspond to the contacts on the integrated circuit device. Contact members are located in a plurality of the recess. The contact members include contact tips adapted to electrically couple with the contacts on the integrated circuit device. An electrical interface including at least one circuit trace electrically couples the contact member to metalized pads located along a second surface of the substrate at a location offset from a corresponding contact member. A solder ball is attached to a plurality of the metalized pads.
    Type: Grant
    Filed: March 2, 2012
    Date of Patent: March 1, 2016
    Assignee: HSIO TECHNOLOGIES, LLC
    Inventor: James Rathburn
  • Patent number: 9263817
    Abstract: An adapter apparatus for receiving a packaged device having a plurality of contact elements disposed on a surface thereof may include a conductive elastomer interconnect. The conductive elastomer interconnect may include a carrier having a plurality of openings defined therethrough from a first side to a second side thereof (e.g., the plurality of openings being arranged to align with the plurality of contact elements of the packaged device) and conductive elastomer suspended in each of the plurality of openings to contact a contact element of a plurality of contact elements of a packaged device when positioned adjacent the second side of the carrier. Further, the adapter apparatus may include one or more adapter wall members used with the conductive elastomer interconnect to define a socket cavity adapted to receive the packaged device.
    Type: Grant
    Filed: June 12, 2013
    Date of Patent: February 16, 2016
    Assignee: IRONWOOD ELECTRONICS, INC.
    Inventors: Ilavarasan M. Palaniappa, Sue Min Huang
  • Patent number: 9236677
    Abstract: A power supply apparatus receives a voltage from power rails on a circuit board. The power supply apparatus comprises a frame and arms connected to the frame. Each of the arms comprises a contact end. The frame positions the contact end of each of the arms to contact the power rails of the circuit board. The contact end is biased towards the power rails to maintain the contact end in contact with the power rails. The contact end comprises a curved planar surface having a first edge and a second edge that terminates at an end edge. The first edge and the second edge follow a curved line, while the end edge follows a straight line. The contact end comprises a non-linear slot extending from the end edge along the curved planar surface and is positioned equally between the first edge and the second edge.
    Type: Grant
    Filed: April 9, 2014
    Date of Patent: January 12, 2016
    Assignee: Xerox Corporation
    Inventors: David R. Cole, Allan D. McIver, Ian Burdon, Christopher N. Hancox
  • Patent number: 9214764
    Abstract: An electrical connector includes an insulating housing, a plurality of contacts retained in the insulating housing and an alignment key assembled the insulating housing. The insulating housing includes an accommodating portion defining a plurality of through holes. The alignment key is assembled on the accommodating portion. The alignment key includes a post and an extending portion extending downwardly from the post. The extending portion extends into the through holes optionally.
    Type: Grant
    Filed: June 5, 2014
    Date of Patent: December 15, 2015
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: Shuo-Hsiu Hsu
  • Patent number: 9185280
    Abstract: A camera module according to exemplary embodiments of the present disclosure includes a PCB (Printed Circuit Board) mounted with an image sensor, a base arranged at an upper surface of the PCB, a lens holder arranged at an upper surface of the base to support plural sheets of lenses, a shield can configured to protect the lens holder by being coupled to the upper surface of the base to expose a lateral surface of the base, and a conductive layer formed at the exposed lateral surface of the base.
    Type: Grant
    Filed: November 27, 2013
    Date of Patent: November 10, 2015
    Assignee: LG INNOTEK CO., LTD.
    Inventor: Sun Joo Kim
  • Patent number: 9112317
    Abstract: An interconnect device includes a contact assembly having a carrier holding an array of conductors. Each of the conductors have opposite first and second ends configured to engage corresponding first and second electrical components. The conductors define conductive paths between the first and second ends to electrically interconnect the first and second electrical components. The interconnect device includes a frame defining a receiving space configured to receive the first electrical component therein. The frame includes corner frames having metal spring fingers configured to engage different side edges of the first electrical component to locate the first electrical component in the receiving space. The spring fingers are deflectable and are configured to be spring biased against corresponding side edges of the first electrical component.
    Type: Grant
    Filed: June 11, 2012
    Date of Patent: August 18, 2015
    Assignee: Tyco Electronics Corporation
    Inventors: Jeffery Walter Mason, Wayne Stewart Alden, III, William Brian Murphy
  • Patent number: 9060436
    Abstract: A land grid array socket assembly comprises a plurality of cells, with each cell comprising an insulative body having a top surface, and contact conductor that has a first portion that extends from a board contact point up to and beyond the top surface to a contact bend, and a second portion that extends from the contact bend to terminate below the top surface and within the insulative body.
    Type: Grant
    Filed: October 28, 2010
    Date of Patent: June 16, 2015
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Brandon Rubenstein, Roger Nattkemper, Eric R. Daniel
  • Patent number: 9025343
    Abstract: A telecommunication distribution box includes a housing and an electrical component mounted in the housing. A cover plate is movably connected to the housing and is movable between open and closed positions. A lip extends outwardly from the cover plate. The lip covers the electrical component when the cover plate is in the closed position to prevent accessing and removing the electrical component.
    Type: Grant
    Filed: February 14, 2013
    Date of Patent: May 5, 2015
    Assignee: Hubbell Incorporated
    Inventors: Stephen Kent Lebo, David Owen Corp
  • Patent number: 9022791
    Abstract: An electrical connector for electrically connecting an IC package to a printed circuit board includes an insulating housing, a number of contacts received in the insulating housing and at least one sleeve assembled on the insulating housing. The insulating housing includes a bottom wall and a number of side walls extending upwardly from the bottom wall. The bottom wall and the side walls define a cavity for accommodating the IC package. The sleeve is assembled on the side wall and defines a supporting portion towards the cavity. The supporting portion includes a pair of abutting walls perpendicular to each other.
    Type: Grant
    Filed: September 16, 2013
    Date of Patent: May 5, 2015
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Fang-Jwu Liao, Shuo-Hsiu Hsu
  • Patent number: 9007783
    Abstract: A random access memory (RAM) memory module has a compact form factor and is removable from a corresponding socket assembly to allow easy replacement of the memory module or reconfiguration of the memory module during development of an electronic device that includes the memory module.
    Type: Grant
    Filed: July 6, 2011
    Date of Patent: April 14, 2015
    Assignees: Sony Corporation, Sony Mobile Communications AB
    Inventors: Wladyslaw Bolanowski, Peter Aberg
  • Patent number: 8936473
    Abstract: A connector capable of improving the contact stability. Linear cores of contact members and wires of an insulating holder are weaved to thereby form a net. Conductive path portions of the contact members are disposed such that they extend through a mesh.
    Type: Grant
    Filed: May 22, 2013
    Date of Patent: January 20, 2015
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventors: Takeshi Takahashi, Yu Tatebe
  • Patent number: 8888502
    Abstract: An electrical connector includes an insulative housing having a plurality of passageways and a number of contacts restricted in the insulative housing. Each contact includes an upper contact half sliding in the passageways and a lower contact half supporting the upper contact half. The upper contact half has three curve sections and the lower contact half has two curve sections. When a force is applied to the upper contact half, the upper and lower contact halves are wiping each other and both are deflectable in vertical and transverse directions.
    Type: Grant
    Filed: November 15, 2012
    Date of Patent: November 18, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Albert Harvey Terhune, IV
  • Patent number: 8876536
    Abstract: A method of manufacture of an integrated circuit socket system includes: forming a retainer plate having a pinhole extending through the retainer plate; forming a base plate having a connector hole extending through the base plate, the connector hole aligned with the pinhole; inserting a compressible pin having a lower probe end through the connector hole and the pinhole below the connector hole, a portion of the compressible pin in the base plate; forming a device plate having a cavity hole extending through the device plate and aligned with the an upper probe end of the compressible pin exposed in the cavity hole; and mounting a removable fastener through the device plate, the base plate, and into the retainer plate, the device plate over the base plate directly on the retainer plate and attached to one another by the removable fastener.
    Type: Grant
    Filed: February 29, 2012
    Date of Patent: November 4, 2014
    Assignee: Data I/O Corporation
    Inventors: Jaswant Sandhu, Robert S. Francis
  • Patent number: 8864500
    Abstract: An electronic module for a computer system comprises a first circuit board having a plurality of edge connectors configured to releasably connect to electrical contacts of a computer system socket, a second circuit board having a plurality of contacts configured to connect with a plurality of electrical components, and a flexible portion having electrical conduits to provide electrical connection between the plurality of edge connectors and the plurality of contacts. The flexible portion further includes an electrically conductive layer extending across a region of the flexible portion. The electrically conductive layer is superposed with the electrical conduits and separated from electrical conduits by a dielectric layer.
    Type: Grant
    Filed: October 16, 2012
    Date of Patent: October 21, 2014
    Assignee: Netlist, Inc.
    Inventors: Jayesh R. Bhakta, Enchao Yu, Chi She Chen, Richard E. Flaig
  • Patent number: 8851904
    Abstract: An electrical connector for electrically connecting a chip module with a printed circuit board includes an insulative housing and a number of contacts fixed in the insulative housing. The insulative housing includes an upper component and a lower component cooperated with the upper component. The upper component has a protruding portion and the lower component has a hole cooperated with the protruding portion. The protruding portion is in touch with the hole and the contacting area is plated with a metal fillings. It is easy to assemble and it has better shielding effects.
    Type: Grant
    Filed: January 30, 2013
    Date of Patent: October 7, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Yen-Chih Chang, Ke-Hao Chen
  • Patent number: 8808009
    Abstract: An interconnect device for electrically connecting first and second electrical components together along a connection axis includes a contact assembly having an insulative carrier and electrical contacts held by the insulative carrier. The electrical contacts include mounting segments and mating segments. The mating segments are configured to be compressed along the connection axis. A frame includes a central opening and at least one perimeter segment that defines a boundary of the central opening. The contact assembly is held within the central opening. The frame includes a compression stop having a stop surface that is configured to engage the second electrical component to limit an amount of compression of the mating segments along the connection axis. The stop surface is aligned with a mating side surface of the perimeter segment.
    Type: Grant
    Filed: April 2, 2012
    Date of Patent: August 19, 2014
    Assignee: Tyco Electronics Corporation
    Inventors: Jeffery W. Mason, Wayne Alden, III
  • Patent number: 8801440
    Abstract: An electrical connector includes a contact carrier receiving a plurality of contacts with solder balls, respectively. A socket frame has an opening formed by a number of sidewalls, the contact carrier is disposed in the opening and lower than the sidewalls. A bottom support has a thin board located below and supported the contact carrier and the socket frame, and an aperture is formed by the thin board to allow the solder balls passing through thereof. The thin board of the bottom support at least attaches with the socket frame.
    Type: Grant
    Filed: October 8, 2012
    Date of Patent: August 12, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Hao-Yun Ma
  • Patent number: 8801439
    Abstract: The Present Disclosure is a module socket for mounting a module on a mounting member, in which the module socket has a first connector including a flat housing, a first conductive pattern arranged on the mating side surface of the housing, and a male terminal protruding from a surface of the first conductive pattern, and a flat second connector formed from plate-shaped metal and including a female terminal elastically interposing the male terminal, and in which either the first conductor or the second conductor is attached to the module and the other is attached to the mounting member.
    Type: Grant
    Filed: April 20, 2012
    Date of Patent: August 12, 2014
    Assignee: Molex Incorporated
    Inventors: Eriko Sato, Toshihiro Niitsu, Hirokazu Suzuki, Akihiro Tezuka, Hideo Nagasawa
  • Patent number: 8784118
    Abstract: A connection terminal structure includes a support member including a first surface and an opening part formed in the first surface, and at least one connection terminal formed on the first surface, the connection terminal including a fixing part, a connection part configured to connect to a connection object, and a spring part communicating between the fixing part and the connection part. The spring part and the connection part are bent upward together with the support member and project toward the connection object. A portion of the fixing part is exposed in the opening part.
    Type: Grant
    Filed: July 20, 2012
    Date of Patent: July 22, 2014
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventor: Yoshihiro Ihara
  • Patent number: 8770987
    Abstract: A connecting terminal structure includes a plurality of connecting terminals, each including a connecting part to be in contact with an object to be connected at an end of the connecting terminal and a plate-like fixing part at another end of the connecting terminal, a first face of the plate-like fixing part being configured to be electrically connectable; and electronic components, each including at least two electrode terminals, wherein the two electrode terminals of the electronic components are mounted on faces opposite to the first faces of the fixing parts of the connecting terminals.
    Type: Grant
    Filed: October 31, 2011
    Date of Patent: July 8, 2014
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventor: Yasuyoshi Horikawa
  • Patent number: 8727792
    Abstract: In a contact block comprising a contact holder having multiple through-holes arranged in a position adjustment direction, two positioning pins are inserted via the through-holes to two through-holes selected from multiple through-holes formed in a contact block accommodation portion in the position adjustment direction, and thereby the relative positions of contact portions of contact terminals held by the contact holder can be adjusted with respect to terminals of a semiconductor device.
    Type: Grant
    Filed: October 8, 2010
    Date of Patent: May 20, 2014
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventors: Takahiro Ishibashi, Katunori Takahashi, Noriyuki Matsuoka
  • Patent number: 8708711
    Abstract: A connecting terminal structure includes a supporting body; a plurality of first electrode pads provided on a first side of the supporting body; a plurality of second electrode pads provided on a second side of the supporting body; a flexible substrate configured to electrically connect the first electrode pads to the second electrode pads; and a plurality of connecting terminals joined to at least one of the first electrode pads and the second electrode pads.
    Type: Grant
    Filed: March 29, 2012
    Date of Patent: April 29, 2014
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventor: Yasuyoshi Horikawa
  • Patent number: 8708713
    Abstract: A connecting terminal structure includes a plurality of connecting terminals, each including a connecting part to be in contact with an object to be connected at an end of the connecting terminal and a plate-like fixing part at another end of the connecting terminal, a first face of the plate-like fixing part being configured to be electrically connectable; and electronic components, each including at least two electrode terminals, wherein the two electrode terminals of the electronic components are mounted on faces opposite to the first faces of the fixing parts of the connecting terminals.
    Type: Grant
    Filed: October 31, 2011
    Date of Patent: April 29, 2014
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventor: Yasuyoshi Horikawa
  • Patent number: 8710858
    Abstract: Methods and structures for testing a microelectronic packaging structure/device are described. Those methods may include placing a device in a floating carrier, wherein the floating carrier is coupled to a socket housing by pin dowels disposed in four corners of the socket housing, and wherein at least two actuating motors are disposed within the socket housing, and micro adjusting the device by utilizing a capacitive coupled or a fiber optic alignment system wherein a maximum measured capacitance or maximum measured intensity between alignment structures disposed in the socket housing and alignment package balls disposed within the device indicate optimal alignment of the device. Methods further include methods for active co-planarity detection through the use of a capacitive-coupled techniques.
    Type: Grant
    Filed: September 23, 2010
    Date of Patent: April 29, 2014
    Assignee: Intel Corporation
    Inventors: Abram M Detofsky, Todd P Albertson, David Shia
  • Patent number: 8698305
    Abstract: A multi-configuration interface device for coupling different types of GPUs (graphics processor units) to a PCB (printed circuit board). The interface device comprises a GPU interface for a connection to the GPU and a PCB interface for a connection to the PCB. The GPU interface is implemented using a customizable attachment footprint for effectuating a connection to differing GPU types while maintaining the PCB interface for the connection to the PCB. The ball array for different GPUs can be configured to respectively support them. The interface device maintains a consistent PCB interface. Thus, as GPU characteristics change and evolve, or as different GPU versions are implemented, a consistent connection can be maintained for the PCB.
    Type: Grant
    Filed: August 4, 2004
    Date of Patent: April 15, 2014
    Assignee: Nvidia Corporation
    Inventors: Thomas E. Dewey, James K. Dobbins, Joseph S. Minacapelli, Simon A. Thomas
  • Patent number: 8689436
    Abstract: An align fixture for aligning an electronic component having a receptacle adapted to receive the electronic component and having a first abutting section and a second abutting section, the align fixture further having a first elastic unit and a second elastic unit, the first abutting section is flexibly mounted via the first elastic unit, and the second abutting section is flexibly mounted via the second elastic unit, and the first abutting section and the second abutting section are together adapted to floatingly engage the electronic component.
    Type: Grant
    Filed: August 17, 2010
    Date of Patent: April 8, 2014
    Assignee: Multitest Elektronische Systeme GmbH
    Inventors: Thomas Hofmann, Helmut Scheibenzuber
  • Patent number: 8668502
    Abstract: An electrical assembly used for connecting an IC package, includes at least an upper and a lower layer stacked with each other, wherein the upper layer is formed with an opening for receiving a socket connector. The socket connector has contacts electrically connected to conductive traces respectively provided on the upper and the lower layer.
    Type: Grant
    Filed: September 14, 2011
    Date of Patent: March 11, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Yen-Chih Chang, Chih-Pi Cheng
  • Patent number: 8581599
    Abstract: A conduction check apparatus including an inspection part (4) having a main body (22) having a surface (23a), inspection pins (21) protruded from the surface (23a), a guide pin (8) provided on the surface (23a); and a protection board 6 sliding along the guide pin (8) from a first position to a second position and having a plurality of holes (28). At the first position, the protection board (6) covers a tip of each of the inspection pins (21) and, at the second position, each of the inspection pins (21) jut out from the respective one of the holes (28). The conduction check apparatus includes a connector setting part (3) relatively moving toward the inspection part (4). The protection board (6) moves between the first and the second position during the relative movement.
    Type: Grant
    Filed: December 26, 2008
    Date of Patent: November 12, 2013
    Assignee: Yazaki Corporation
    Inventor: Hideyuki Katoh
  • Patent number: 8568150
    Abstract: A socket for a central processing unit (CPU) includes a housing, a bottom base, a slide base, and a number of resilient members. The bottom base is received in and fastened to a lower portion of the housing. The bottom base defines a number of accommodating holes which are slanted. A number of slanting pins extends up from a top of the bottom base. The slide base is slidably received in the housing and above the bottom base. The slide base defines a number of through holes, which are also slanted, for receiving the pins. The slide base includes a number of slanting protrusions for engaging in the accommodating holes. A receiving hole is defined in a bottom surface of each protrusion. Each resilient member is received in the receiving hole and accommodating hole.
    Type: Grant
    Filed: June 20, 2012
    Date of Patent: October 29, 2013
    Assignees: Hong Fu Jin Precision Industry (WuHan) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Wen-Ting Peng
  • Patent number: 8537559
    Abstract: A compliant insert is provided to support electronic assemblies to mitigate the effects of external loading. The insert comprises a polymer material having a durometer of between 10 and 90 on the Shore A scale and a 3-D negative relief on the surface of the polymer material. The 3-D negative relief is the negative of the 3-D positive relief of a specified geometric design of an electronics assembly. The compliant insert is mated with an instance of the electronics assembly such that the 3-D negative relief of the polymer material engages the 3-D positive relief of the assembly's PCB and electronic components. The polymer material is compliant enough to absorb the vertical and lateral spacing tolerances of the electronic components and stiff enough to mitigate deflections under loading.
    Type: Grant
    Filed: January 26, 2011
    Date of Patent: September 17, 2013
    Assignee: Raytheon Company
    Inventor: Nate B. Herse
  • Patent number: 8491315
    Abstract: A micro via adapter socket (12) is provided by a printed circuit board (30) having an upper layer (32), a lower layer (40) and intermediate interconnect layers (34, 36 and 38). The lower layer (32) has an array of mini vias (60) formed therein for receiving respective ones of mini-springs (62). A top plate (42) is secured above the upper layer (32). The top plate (42) has a plurality of micro-pin recesses (54) spaced apart for registering with respective ones of the micro vias (48) and receiving micro-pins (52). A bottom plate (44) is secured beneath the lower layer (40). The bottom plate (44) has a plurality of mini-pin recesses (66) for removably receiving respective ones of the mini-pins (64). The intermediate interconnect layers (34, 36 and 38) have conductive tracks (76) which electrically connect between the micro vias (48) and the mini vias (60).
    Type: Grant
    Filed: November 29, 2011
    Date of Patent: July 23, 2013
    Assignee: Plastronics Socket Partners, Ltd.
    Inventors: James M. Ramsey, Jose L. Ortega
  • Patent number: 8441275
    Abstract: An electronic device test fixture deploys a plurality of contact elements in a dielectric housing. The plumb arrangement of contact elements each include an armature or transversal configured to first depress and then slide laterally when urged downward by the external contacts of a device under test. The rotary movement of the transversal is optimized via the configuration of a surrounding forked regulator such that surface oxide deposition on the external device under test terminal is disrupted to reliably minimize contact resistance without damaging or unduly stressing the electrical junction of the device under test.
    Type: Grant
    Filed: January 13, 2011
    Date of Patent: May 14, 2013
    Assignee: Tapt Interconnect, LLC
    Inventor: Patrick J Alladio
  • Patent number: 8435046
    Abstract: An electrical device for electrically connection an electronic component, comprises a substrate, and a plurality of contact units mounted on the substrate. The contact units each comprises a lower contact positioned on the substrate and an upper contact coupled to the lower contact. The upper contact is floatably received in a receiving space defined by the lower contact and upward and downward movement of the upper contact relative to the lower contact are limited by the lower contact.
    Type: Grant
    Filed: August 8, 2011
    Date of Patent: May 7, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Andrew David Gattuso
  • Patent number: 8419442
    Abstract: A socket detachably connects a connecting item to a substrate via connecting terminals. The socket includes a support member with first and second surfaces to fix the connecting terminals, and penetrating holes formed in the support member. Each connecting terminal includes first and second connecting parts formed on opposite ends thereof. Each connecting terminal is inserted into a corresponding penetrating hole in a state in which the first connecting part is fixed to the first surface and the second connecting part projects from the second surface of the support member.
    Type: Grant
    Filed: July 15, 2011
    Date of Patent: April 16, 2013
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Yasuyoshi Horikawa, Yoshihiro Ihara, Kenji Mochizuki, Masato Tanaka
  • Patent number: 8414309
    Abstract: A protective socket is provided for use with a parallel optical transceiver module. When the parallel optical transceiver module is seated within a receptacle of the protective socket, the side walls and bottom that define the receptacle of the protective socket protect the internal components of the parallel optical transceiver module from dirt, dust, gases, and other airborne matter.
    Type: Grant
    Filed: May 3, 2010
    Date of Patent: April 9, 2013
    Assignee: Avago Technologies Fiber IP (Singapore) Pte. Ltd
    Inventors: David J. K. Meadowcroft, Seng-Kum Chan
  • Patent number: 8398410
    Abstract: A socket connector includes a housing having a base and a plurality of sidewalls extending upwardly from the base. The base and the sidewalls define a receiving cavity for receiving an electronic package. A plurality of carbon nanotube contacts for signal transmission and a plurality of metallic contacts for power transmission are mounted within the housing respectively.
    Type: Grant
    Filed: August 16, 2011
    Date of Patent: March 19, 2013
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Cheng-Chi Yeh, Andrew Cheng
  • Patent number: 8292634
    Abstract: A socket connector includes a socket body having a recess adapted to receive therein a connection object such as a semiconductor module, contact members disposed at a bottom surface portion of the recess, and a spring member disposed on one side of the recess. The spring member has an engaging portion adapted to engage the connection object in a detaching direction for provisionally holding it in a first stage of an attaching operation of the connection object and a pressing portion adapted to press the connection object parallel to the bottom surface portion and inward of the recess for positioning the connection object at a predetermined position of the recess.
    Type: Grant
    Filed: December 8, 2010
    Date of Patent: October 23, 2012
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventor: Takeshi Takahashi