Abstract: A circuit board includes a board body and pair of connection portions disposed at both ends of the board body. Each of the pair of connection portions is inserted into a connector. Each of the pair of connection portions includes a connection terminal electrically connected to the connector, and at least one of the pair of connection portions includes an extending portion extending from the connection terminal to an insertion leading end of the at least one of the pair of connection portion. The extending portion is disposed at a position to avoid a virtual line extending in an insertion direction through a position where the connector and the connection terminal are electrically connected.

Abstract: A backing plate, a corresponding electrical connector for mating with the backing plate, an electrical header, and an assembly thereof are described herein. The backing plate has an inner portion having a first thickness and an outer portion having a second thickness that is greater than the first thickness. The outer portion surrounds a perimeter of the inner portion and forms a cavity within the backing plate for acceptance of the electrical header. The backing plate also contains a connector attachment portion configured to attach the backing plate to the electrical connector and an intermediate surface attachment portion configured to attach the backing plate to the intermediate surface.

Abstract: A method of making a semiconductor device includes separating a conductive structure of a leadframe into interior conductive leads using an etching process. The method includes forming a first molded structure by applying a first molding compound to a leadframe having a conductive structure, separating the conductive structure into at least two interior contact portions, attaching a semiconductor die to at least one of the interior contact portions, the at least two interior contact portions being supported by the first molding compound, and forming a second molded structure by applying a second molding compound to at least part of the semiconductor die and at least two interior contact portions.

Abstract: An electrical connector includes an insulating body, and multiple terminals and a base plate insert-molded with the insulating body. The insulating body has an outer side edge. Multiple grooves are concavely provided inward from the outer side edge. Two protruding blocks protrude toward each other and inward each of the grooves from two opposite sides of each of the grooves. The base plate has multiple strip connecting portions. Prior to the insert-molding, the strip connecting portions are integrally connected to a same strip. After the insert-molding, the strip connecting portions are broken from the strip, each strip connecting portion is located in a corresponding groove, and upper and lower surfaces of each strip connecting portion are exposed in the corresponding groove. The strip connecting portions do not exceed outward beyond the outer side edge. Two opposite sides of each strip connecting portion abut the two protruding blocks.

Abstract: An electrical connector includes an insulating body, multiple lower terminals, a conductive plate, and multiple upper terminals. Each lower terminal has a base portion. The lower terminals include lower signal terminals connected to the plate and lower ground terminals separated from the plate. The upper terminals include upper signal terminals and upper ground terminals. Each upper terminal has a fixing portion and an elastic arm. The fixing portion is located above and fixed to the base portion. A metal sheet exists between two adjacent fixing portions of the upper terminals in the left-right direction and separated from the upper signal terminals. The sheet is integrally connected with the upper ground terminals adjacent thereto in the left-right direction and is separated in the front-rear direction. The sheet is located above and fixed to the plate. The elastic arm is located right above the front upper terminal adjacent thereto or the sheet.

Abstract: A heat dissipation structure and an electronic apparatus having the heat dissipation structure are provided. The electronic apparatus includes a printed circuit board, a high thermal-resisting housing, a thermal pad and a metal bracket. Heat is transferred between the thermal pad and an electronic component mounted on the printed circuit board. The high thermal-resisting housing defines an inner space for accommodating the printed circuit board. A columnar space is formed in the high thermal-resisting housing, and a metal layer is arranged outside the columnar space. The thermal conductivity of the high thermal-resisting housing is not greater than 1 W/m·K. The metal bracket and the printed circuit board are disposed at two opposite sides of the high thermal-resisting housing, respectively. A fastening member penetrates through the metal bracket and is inserted into the columnar space to urge the metal bracket to be in contact with the metal layer.

Abstract: A board-like connector, a single-arm bridge of a board-like connector, and a wafer testing assembly are provided. The board-like connector includes a plurality of single-arm bridges spaced apart from each other and an insulating layer. Each of the single-arm bridges includes a carrier, a cantilever extending from and being coplanar with the carrier, an abutting column, and an abutting end portion, the latter two of which extend from the cantilever and are respectively arranged at two opposite sides of the cantilever. The insulating layer connects the carriers of the single-arm bridges, and the abutting column of each of the single-arm bridges protrudes from the insulating layer. The abutting column and the abutting end portion of each of the single-arm bridges are configured to abut against two boards, respectively.

Abstract: Systems for processing a fluid sample to facilitate analysis with a semiconductor detection chip are provided herein. Such systems can include a sample processing cartridge coupleable with a chip carrier device configured for transport of the processed fluid sample from the sample cartridge. The chip carrier device can include one or more fluid channels extending between fluid-tight couplings attachable to transfer ports of the sample processing cartridge. The chip carrier device can include multiple portions or adapters, including a fluid sample portion, a flowcell portion and a chip carrier. Also provided are methods of preparing and transporting a fluid sample from a sample cartridge into a chip carrier device for analysis with a semiconductor detection chip carried within the chip carrier device.

Abstract: The present application discloses a chip socket for testing a semiconductor chip. The chip socket includes a pedestal and a fastener. The pedestal accommodates a chip to be tested. The fastener includes a top body and a base body. The top body includes a probing window, wherein a first opening area of the probing window at an outer surface of the top body is larger than a second opening area of the probing window at an inner surface of the top body. The base body is attached to the pedestal and locked to the top body when the top body covers the base body and clamps the chip. When the top body covers the base body, the probing window reveals a surface of the chip, allowing a probe to contact the surface of the chip through the probing window.

Abstract: A high density thin walled test device testing chips/ICs is disclosed. A housing includes a slot for a contact pin and a pair of elastomers. The pin has an arcuate recess to receive part of the elastomer. Likewise the housing includes a channel to receive part of the elastomer. The recess and channel together partially surround the elastomer but not completely to allow shear forces and expansion space for the elastomer as it is compressed by the channel and recess. In addition, a front channel extends from the top surface of the housing toward the bottom surface but leaving a floor to support the elastomer so that it does not warp the housing when compressed. Further, the channel or the recess may include retainers which prevent the elastomer from moving out of position when the pin is in an uncompressed state.

Abstract: In one embodiment, an apparatus includes a heat sink for attachment to an optical module cage configured for receiving an optical module, a thermal interface material attached to a surface of the heat sink for thermal contact with the optical module, and a plurality of lifting elements extending from the surface of the heat sink. The lifting elements are configured to create a gap between the thermal interface material and the optical module during insertion of the optical module into the optical module cage or removal of the optical module from the optical module cage, the plurality of lifting elements positioned for insertion into aligned recesses in the optical module when the optical module is fully inserted into the optical module cage to eliminate the gap and provide contact between the optical module and the thermal interface material.

Abstract: An integrated circuit (IC) socket comprising a housing with a land side, an opposing die side, and sidewalls around a perimeter of the housing. The housing comprises a first dielectric. A plurality of socket pins extends from the land side of the housing through socket pin holes in the housing over the die side of the housing. A second dielectric is within the interstitial regions between the socket pins and sidewalls of the socket pin holes. A frame structure extends around at least a portion of the perimeter of the housing, and a mesh structure is embedded within the first dielectric. The mesh structure has plurality of mesh filaments extending between the plurality of socket pin holes and coupled to the frame structure.

Abstract: A slim type tactile feedback device is disclosed, including: a substrate, at least an overlapping plate, a support frame, a plurality of cushions and a vibration source; the overlapping plate being fixed to the substrate in a cantilever manner; the support frame including a frame, a void area, and at least a protruding support, the protruding support being a partial segment of the frame; the cushions being fixed between the substrate and the frame; the vibration source including a magnet set and a coil set, the magnet set and the coil set being fixed between the protruding support and the overlapping plate and located at outer side the substrate; the coil set and the magnet set being positioned correspondingly to each other and separated by a gap, the gap increasing when the substrate being pressed by finger, and the substrate moving back-and-forth through linkage motion of the vibration source.

Abstract: A spring clip includes a first beam and a second beam connected to the first beam and resiliently deflectable toward the first beam from a relaxed position distal from the first beam to a compressed position proximal to the first beam. The second beam has a spring latch extending toward the first beam. The spring latch engages the first beam to secure the second beam in the compressed position. The clip may be positioned in a housing having a rotatable cover formed to compress the clip against a conductor when moved to a closed position.

Abstract: The present disclosure discloses a test socket according to the present disclosure including an inelastic electro-conductive housing formed of an inelastic electro-conductive material and provided with a plurality of housing holes passing therethrough in the thickness direction, each housing hole being formed at a position corresponding to each terminal of a device under test; and an electro-conductive part formed to have a configuration in which a plurality of electro-conductive particles are oriented in the thickness direction in an elastic insulating material, and comprising an electro-conductive part for grounding, an electro-conductive part for signal, and an electro-conductive part for power disposed in the housing holes, respectively, the electro-conductive part for signal and the electro-conductive part for power being insulated by an insulating layer.

Abstract: Communication device board and a communication device are provided. A connector of the communication device board includes a fixed position and a contact position. The fixed position and the contact position; have different levels. The fixed position is fixedly connected one end of an inner side of a conductive resilient sheet. An outer side of the conductive sheet is provided with an insulating coating. When the fixed position fixedly connected to the end of the inner side of the conductive resilient sheet, and a mating gap between the connector of the communication device board and a corresponding communication device connector is smaller than a preset threshold range, A second end of the inner side of the conductive resilient sheet is in contact with the contact position (12).

Abstract: In an embodiment, a driving device includes a housing and a base. The housing has an axial direction and is polygonal in outer shape. The housing includes an outer peripheral side wall and a top wall connected to the front side of the outer peripheral side wall. The top wall is provided with an opening to allow light to pass through. The housing includes a step portion at each corner portion thereof, and the step portion includes a step horizontal wall extending in a direction intersecting with the axial direction. The base has a protruding table that protrudes forward from the front side. The table surface of the protruding table is stuck to a rear side surface of the step horizontal wall.

Abstract: A surgical handpiece includes a shell, an energy applicator, a transmission component, a lid, a latch and a data tag. The shell defines a void for receiving a power module and an opening through which the power module is inserted into and removed from the void. The energy applicator is attached to the shell. The energy applicator, when actuated, outputs energy for application to a tissue to perform a medical/surgical task. The transmission component is disposed in the shell for transmitting energy output by the power module to the energy applicator. The lid moveably is mountable to the shell to cover the shell opening. The latch is moveably attached to the shell or the lid for holding the lid in a latched state. The data tag is mounted to the latch so as to move with the latch, the data element including data identifying the handpiece.

Abstract: A clamping assembly for use in a pick and place assembly process includes a fixture and a carrier. The fixture includes at least one retaining feature configured to releasably secure to the carrier such that a part and a substrate are clamped together between the fixture and the carrier.

Abstract: A connector includes a flat-plate housing made of insulating resin and a contact held on a housing by press-fitting. The housing includes a press-fitting space and a solder connection checking hole. The contact includes a press-fit part to be press-fit into the press-fitting space, and a soldering part that extends from the press-fit part and is connected by soldering to a pad of an input-output board. The solder connection checking hole is formed to penetrate the housing in the vertical direction and allow a solder fillet, which is formed when the soldering part is soldered to the pad of the input-output board, to be checked through the solder connection checking hole. The housing includes a separating wall that separates the press-fitting space from the solder connection checking hole.

Abstract: An electrical connector includes a body having an opening running vertically therethrough. The opening has a first side wall. The body further includes a recess concavely formed on the first side wall. At least one conductive terminal includes a base fixed to the body, a conducting portion connected to the base to be electrically connected to a second mating member, and an elastic arm connected to the base in the recess. The elastic arm includes a connecting section located in the recess and an extending section connected to the connecting section. Both the conducting portion and the extending section protrude from the first side wall toward the opening. The extending section has a contact portion electrically connected to a first mating member. In a top view, a first central line of the extending section and a second central line of the conducting portion are parallel to each other.

Abstract: The terminals of a device under test (DUT) are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are protected against damage from balls on a DUT by a protective ball guide which includes recesses for receiving part of the ball but prevents the ball from driving the pins beyond a limited range. The ball guide provides fine alignment horizontally and vertically enabling stable electrical performance.

Abstract: A contact includes a thin plate member having elasticity and conductivity, is disposed between a first member and a second member, and electrically connects the first member and the second member via the thin plate member, and the contact includes a base portion and a movable portion. The base portion has a bonding surface to be bonded to the first member by soldering. The movable portion includes: a contact portion that contacts with the second member; and a connecting portion that connects to the base portion, and is configured to be elastically deformable with respect to the base portion. The connecting portion is gradually separated from the first member. A predetermined range from a connecting position of the connecting portion with the base portion is lower in solder wettability than the bonding surface.

Abstract: An electrical connector includes an insulative housing with a plurality of passageways and a plurality of contacts received therein. The contact includes an upstanding section retained in the passageway with a spring arm extending from an upper region of the upstanding plate and above the mating surface, and a mounting leg extending from a lower region of the upstanding plate around the mounting surface. The spring arm forms a contacting section around a free end thereof. The contact further includes an extension extending from the upstanding section and optimally above the mating surface so as to be located between the spring arm and the mating surface in the vertical direction. The extension and the spring arm are partially overlapped in the vertical direction and results in the capacitance effect therebetween, thus lowering impedance.

Abstract: Semiconductor packages and methods of forming the same are disclosed. One of the semiconductor packages includes a circuit board structure, a first redistribution layer structure, a plurality of first bonding elements, a package structure and a plurality of second bonding elements. The first redistribution layer structure is disposed over and electrically connected to the circuit board structure. The first bonding elements are disposed between and electrically connected to the first redistribution layer structure and the circuit board structure. The package structure is disposed over and electrically connected to the first redistribution layer structure. The second bonding elements are disposed between and electrically connected to the first redistribution layer structure and the package structure.

Abstract: An electrical contact includes a main body, a supporting arm extending upwardly from an upper edge thereof, and a spring arm extending curvedly and upwardly from a lower edge thereof with a contacting region at a free end. The spring arm will contact the supporting arm when the spring arm is downwardly pressed by the CPU. A solder part is sidewardly connected to a downward extension formed on a lower portion of the main body and located beside the spring arm, and includes a vertical section extending from the side edge of the downward extension, a horizontal solder pad extending from a lower edge of the vertical direction wherein a curved joint is formed between the downward extension and the vertical section for easy adjusting the angle formed between the downward extension and the vertical section, thus being adapted to fit different CPUs and PCBs.

Abstract: A high density thin walled test device testing chips/ICs is disclosed. A housing includes a slot for a contact pin and a pair of elastomers. The pin has an arcuate recess to receive part of the elastomer. Likewise the housing includes a channel to receive part of the elastomer. The recess and channel together partially surround the elastomer but not completely to allow shear forces and expansion space for the elastomer as it is compressed by the channel and recess. In addition, a front channel extends from the top surface of the housing toward the bottom surface but leaving a floor to support the elastomer so that it does not warp the housing when compressed. Further, the channel or the recess may include retainers which prevent the elastomer from moving out of position when the pin is in an uncompressed state.

Abstract: An electronic interconnect may include a substrate. The substrate may include a passageway in the substrate. The passageway may extend from a first surface of the substrate toward a second surface of the substrate. The passageway may be closed at an end of the passageway. The electronic interconnect may include a plated through hole socket coupled to the passageway. The electronic interconnect may include a contact. The contact may include a pin. The pin may be configured to engage with the plated through hole socket. The electronic interconnect may include a solder ball. The solder ball may be coupled to the plated through hole socket.

Abstract: A connector assembly, for example, employed in an extension of an implantable medical electrical system, may be contained in a flexible insulative sleeve so that a bore thereof extends along a longitudinal axis of the sleeve with an opening being formed by a distal terminal end of the sleeve. The assembly includes a plurality of isolation ring components interspersed among a plurality of contact ring components, wherein each of a plurality of conductor components has a first end coupled to a corresponding contact ring component, and a curvature formed along a length thereof, which length extends proximally from the coupled first end and into a proximal portion of the sleeve. To facilitate routing of the conductor component lengths, either each isolation ring component may include at least one guide, or a flexible inner insulative sleeve of the assembly may have longitudinally extending channels formed in an outer surface thereof.

Abstract: A wiring structure includes a dielectric layer and a first patterned conductive layer on the dielectric layer. The dielectric layer has a first region and a second region. The first patterned conductive layer includes a number of fine conductive lines and a number of dummy conductive structures. The number of conductive lines include a first number of conductive lines on the first region and a second number of conductive lines on the second region, and the number of dummy conductive structures include a first number of dummy conductive structures on the second region. The first number of conductive lines occupy a first area on the first region, and the second number of conductive lines and the first number of dummy conductive structures occupy a second area on the second region. A ratio of the second area to the first area is greater than or equal to about 80%.

Abstract: A method of fabricating a surface-emitting laser includes the steps of fabricating a substrate product including device sections, a pad electrode, and a conductor, each of the device sections including a surface-emitting laser having an electrode, the conductor connecting the pad electrode to the electrode across a boundary of the device sections; attaching a connection device to the substrate product, the connection device including a probe device having a probe and a probe support base having an opening; performing a burn-in test of the surface-emitting lasers by applying electric power to the pad electrode through the probe at a high temperature; and after the burn-in test, separating the substrate product into semiconductor chips. The burn-in test includes a step of monitoring light emitted by the surface-emitting laser through the opening during the burn-in test, and a step of selecting the surface-emitting lasers based on a monitoring result.

Abstract: An electrical connector for electrically connecting a chip module, including an insulating body provided with multiple accommodating grooves in multiple rows and vertically passing through the insulating body. Each two adjacent accommodating grooves are provided with a partition or a space above the partition. The insulating body is concavely provided downward with at least one groove correspondingly located on the partition or in the space above the partition. The groove has a bottom surface and a side surface being closed and formed by extending upward from a periphery of the bottom surface, and the groove is configured for a pushing pin to push and eject the insulating body from a mold. The insulating body is protrudingly provided upward with a plurality of protruding blocks, configured to support the chip module. The groove and all the protruding blocks are not located on the same partition.

Abstract: A support structure located at a bottom of a ball grid array (BGA) is provided. The support structure includes a printed circuit board (PCB) having first positioning pin holes, an interface plate having second positioning pin holes which correspond to the first positioning pin holes arranged on the PCB, a support film arranged on the PCB and having support portions, and positioning components penetrating the first positioning pin holes and the second positioning pin holes corresponding to the first positioning pin holes to assemble the support film on the PCB and the interface plate.

Abstract: Embodiments herein relate to port frames and connectors for direct connections to integrated circuit packages. In various embodiments, a port frame to receive a connector and maintain a connection between the connector and a computer processor package may include a protrusion to provide stable attachment of the port frame to a bolster frame, a first wall, a second wall opposite the first wall, a first detent in the first wall, and a second detent in the second wall where the connector is to be received between the first wall and the second wall, and where the first detent is to receive a first locking protrusion extending from the connector and the second detent is to receive a second locking protrusion extending from the connector. Other embodiments may be described and/or claimed.

Abstract: A lead arrangement includes a plurality of proximal leads, a distal lead, and a junction electrically and mechanically coupling the plurality of proximal leads to the at least one distal lead. Each proximal lead has a proximal end and a distal end and includes conductive contacts disposed along the proximal end and conductive wires coupled to the conductive contacts and extending to the distal end of the proximal lead. Each distal lead has a proximal end and a distal end and includes electrodes disposed along the distal end and conductive wires coupled to the electrodes and extending to the proximal end of the distal lead. The junction includes conductive tabs and a non-conductive material encapsulating the conductive tabs. The conductive wires of the at least one distal lead and the conductive wires of the plurality of proximal leads are attached to the conductive tabs of the junction.

Abstract: An electrical connector for electrically connecting a chip module to a circuit board includes an insulating body with receiving holes running through the insulating body, terminals correspondingly received in the receiving holes, and metal members not in contact with the chip module. Each metal member and the terminal corresponding to the metal member are received in the same receiving hole. Each metal member has a connecting portion disposed at a side of a soldering portion of a terminal, and a clamping portion extending and bending from the connecting portion to bypass the soldering portion and extend along a direction from the side to another opposite side of the soldering portion, so that the clamping and soldering portions jointly clamp a solder ball with a reduced distance between the terminals on a strip and without the terminals being inserted into the same row of receiving holes at intervals for multiple times.

Abstract: A heat sink comprises a base and a fin support larger in area than the base and supporting fins that may be positioned in a plurality of orientations relative to the base. The base is adapted for being connected to a heat-generating electronic component on a circuit board, and the heat sink dissipates heat generated by the heat-generating electronic device and conducted through the base and the fin support to the fins supported thereon. The heat sink dissipates heat from the heat-generating electronic device in a first operable position and in a second operable position. The heat sink may be moved from the first to the second operable position to facilitate access to electrical contacts proximal the heat-generating electronic component.

Abstract: An electrical connector includes an insulating body having a bottom plate with receiving slots and multiple terminals received in the receiving slots. Each receiving slot has two opposite first side walls, and a second and third side walls connecting the first side walls. A protruding block protrudes from the second side wall toward the third side wall. Each terminal has a plate portion, an elastic arm and a material connecting portion extending upward from the plate portion, a contact portion at a top end of the elastic arm to urge a chip module, and two clamping portions bending and extending from two opposite sides of the plate portion horizontally. The plate portion and the material connecting portion are limited between the protruding block and the third side wall. Tin balls are fixed between the clamping portions, and soldered to a circuit board. The tin balls are below the protruding block.

Abstract: A push plate that includes springs in the form of cantilever flexures and an inspection window is disclosed. The push plate provides a known, uniform, down force and minimal torque to a package to be tested. The cantilevers have a known, calculable down force producing stiffness. The window provides for viewing of the package during testing.

Abstract: A head gimbal assembly (HGA) for a disk drive includes a load beam, a laminated flexure attached to the load beam, and a head attached to the laminated flexure. The laminated flexure includes a tail for electrical connection between the head and a flex cable of a head stack assembly. The laminated flexure tail may include a plurality of conductive traces, a structural layer, and a dielectric layer there between, and may be disposed partially within a slot of an actuator arm. A first insulative cover layer is disposed on the plurality of conductive traces. A plurality of stand-off islands is disposed on the first insulative cover layer, and over at least one of the plurality of conductive traces (e.g. the writer traces). At least one of the plurality of stand-off islands is at least partially disposed between the first insulative cover layer and the inner slot surface.

Abstract: In a circuit board for mounting electronic components, in which electronic components are to be mounted on its two surfaces by a reflow soldering process, the sizes of lands on the primary and secondary surfaces of the circuit board are set different from each other when chips having the same shape are to be mounted on both the primary and secondary surfaces of the circuit board.

Abstract: While it is necessary for an electronic component housing package to be provided with numerous wiring conductors, phase differences of signals caused by differences in signal transmission distance among the wiring conductors, is a problem. An electronic component housing package based on one embodiment includes a substrate having a dielectric region and an electronic component placement region, a frame body surrounding the dielectric region and the placement region, and wiring conductors disposed on the dielectric region of the substrate. The wiring conductors have a first wiring conductor and a second wiring conductor which is longer in signal transmission distance than the first wiring conductor, which are disposed so as to extend from a location immediately below the frame body to the dielectric region. The frame body made of a dielectric material has a projection protruding from its inner periphery, which covers at least part of the first wiring conductor.

Abstract: A semiconductor module assembly is provided. The semiconductor module assembly includes a motherboard, a socket, and a semiconductor module. The motherboard includes an opening for receiving the semiconductor module, the opening including at least three sides. The socket is disposed in the opening along at least a first side, second side, and third side of the at least three sides. The semiconductor module is disposed in the socket. The semiconductor module includes at least one semiconductor device mounted on a module board. The socket includes at least a first side along the first side of the opening, and a second side along the second side of the opening, and the semiconductor module electrically connects to the motherboard through at least the first and second sides of the socket.

Abstract: A surface mount electrical interconnect to provide an interface between a PCB and contacts on an integrated circuit device. The electrical interconnect includes a substrate with a plurality of recesses arranged along a first surface to correspond to the contacts on the integrated circuit device. Contact members are located in a plurality of the recess. The contact members include contact tips adapted to electrically couple with the contacts on the integrated circuit device. An electrical interface including at least one circuit trace electrically couples the contact member to metalized pads located along a second surface of the substrate at a location offset from a corresponding contact member. A solder ball is attached to a plurality of the metalized pads.

Abstract: An adapter apparatus for receiving a packaged device having a plurality of contact elements disposed on a surface thereof may include a conductive elastomer interconnect. The conductive elastomer interconnect may include a carrier having a plurality of openings defined therethrough from a first side to a second side thereof (e.g., the plurality of openings being arranged to align with the plurality of contact elements of the packaged device) and conductive elastomer suspended in each of the plurality of openings to contact a contact element of a plurality of contact elements of a packaged device when positioned adjacent the second side of the carrier. Further, the adapter apparatus may include one or more adapter wall members used with the conductive elastomer interconnect to define a socket cavity adapted to receive the packaged device.

Abstract: A power supply apparatus receives a voltage from power rails on a circuit board. The power supply apparatus comprises a frame and arms connected to the frame. Each of the arms comprises a contact end. The frame positions the contact end of each of the arms to contact the power rails of the circuit board. The contact end is biased towards the power rails to maintain the contact end in contact with the power rails. The contact end comprises a curved planar surface having a first edge and a second edge that terminates at an end edge. The first edge and the second edge follow a curved line, while the end edge follows a straight line. The contact end comprises a non-linear slot extending from the end edge along the curved planar surface and is positioned equally between the first edge and the second edge.

Abstract: An electrical connector includes an insulating housing, a plurality of contacts retained in the insulating housing and an alignment key assembled the insulating housing. The insulating housing includes an accommodating portion defining a plurality of through holes. The alignment key is assembled on the accommodating portion. The alignment key includes a post and an extending portion extending downwardly from the post. The extending portion extends into the through holes optionally.

Abstract: A camera module according to exemplary embodiments of the present disclosure includes a PCB (Printed Circuit Board) mounted with an image sensor, a base arranged at an upper surface of the PCB, a lens holder arranged at an upper surface of the base to support plural sheets of lenses, a shield can configured to protect the lens holder by being coupled to the upper surface of the base to expose a lateral surface of the base, and a conductive layer formed at the exposed lateral surface of the base.

Abstract: An interconnect device includes a contact assembly having a carrier holding an array of conductors. Each of the conductors have opposite first and second ends configured to engage corresponding first and second electrical components. The conductors define conductive paths between the first and second ends to electrically interconnect the first and second electrical components. The interconnect device includes a frame defining a receiving space configured to receive the first electrical component therein. The frame includes corner frames having metal spring fingers configured to engage different side edges of the first electrical component to locate the first electrical component in the receiving space. The spring fingers are deflectable and are configured to be spring biased against corresponding side edges of the first electrical component.

Abstract: A land grid array socket assembly comprises a plurality of cells, with each cell comprising an insulative body having a top surface, and contact conductor that has a first portion that extends from a board contact point up to and beyond the top surface to a contact bend, and a second portion that extends from the contact bend to terminate below the top surface and within the insulative body.