Abstract: A separable electrical connection may be provided with a landside pad on one of two electrical components to be joined. The landside pad may be made up of two parts, including a flat portion and a raised edge formed on the flat portion. In some embodiments, the raised edge may have a closed geometric shape. Then, a socket contact engaging the junction between the flat portion and the raised edge is prevented from sliding off of the landside pad by the raised edge. In addition, dual areas of electrical connection can be established between both the flat portion and raised edge of the landside pad and the correspondingly shaped pair of portions on the socket. This increases the electrical efficiency of the connection and its security.

Abstract: An electrical connector (100) used to transmit electric and optical signal from a module to a circuit substrate comprises an insulative housing (1), a plurality of contacts (2) received in the insulative housing (1) and a cover (3) being assembled on the insulative housing (1) and can move between an opened position to a closed position, the insulative housing (1) comprises a bottom wall (141) and a plurality of sidewalls (142) extending upwardly from the bottom wall (141), each of the sidewalls (142) each defines a plurality of datum blocks (145) and the inner surface of the datum (145) on one sidewall (142) are located in one plane, the datum blocks (145) together formed a space (14) to receive the module.

Abstract: An electrical element is revealed. At least one receiving hole disposes on an insulating body. A conductive layer disposes on surfaces of the receiving hole. At least one soldering body mounts in the receiving hole correspondingly and contacts with the conductive layer. Part of the soldering body exposes outside a surface of the insulating body to form a soldering part. The electrical element is further arranged with at least one conductive terminal mounted in the corresponding receiving hole movably and slantingly, the conductive terminal contacts with the conductive layer. Each conductive terminal includes a head part exposed outside the surface of the insulating body for being pressed and contacted. By electrical connection of the conductive layer, the assembly between the soldering body and the terminal is replaced and errors of the assembly between the soldering body and the terminal are eliminated. Therefore, the soldering quality is improved greatly.

Abstract: An electrical connector for electrically coupling an electronic module and an electrical component. The connector includes a substrate that has first and second surfaces separated by a thickness. The substrate includes interconnects that extend through the substrate and are arranged in an array. The interconnects are configured to engage the module along the first surface and engage the electrical component along the second surface. The connector also includes alignment members that extend through openings in the substrate. The alignment members include heads that project beyond and away from the first surface. The heads are located about the substrate relative to each other to collectively form a module reception area therebetween to hold the module in a predetermined position and orientation with respect to the first surface and with respect to the interconnects.

Abstract: An electrical connector comprises an upper housing, a lower housing and a plurality of contacts which each have a top contact received in the upper housing and a bottom contact received in the lower housing. The top contact is formed with a keeping portion and a lower mating end downwardly; the bottom contact has a pair of mating beams extending vertically for engaging with the lower mating end of the top contact. The pair of mating beams of the bottom contact mechanically and electrically engage with the lower mating end of the top contact when the top contact approaches the bottom contact two mating beams in a top-to-bottom direction under a pressed force. The contact has a simple structure adapted to a high-density connector while still maintaining performance of the connector.

Abstract: A burn-in socket includes a base, a plurality of terminals received in the base, a self-centering supporting bracket mounted above the base in a floating manner and a plurality of elastic elements mounted between the base and the supporting bracket. The supporting bracket defines a receiving cavity for receiving an IC package, and the receiving cavity has a number of oblique surfaces for leading and supporting the IC package so as to precisely position the IC package in the burn-in socket.

Abstract: One embodiment includes the provision of a novel insert-and-rotate connection for a daughter card, such as in a blade computer system. The daughter card has both a card edge with a plurality of card edge contacts and a mezzanine connector spaced from the card edge. An interposer mounted on the motherboard has a card edge connector and a midplane connector in communication with the card edge connector. The card edge connector includes a socket for receiving the card edge of the daughter card with the daughter card at an acute angle to the motherboard, to avoid interference between the mezzanine connector on the daughter card and a corresponding mezzanine connector on the motherboard. Once the card edge is inserted into the socket of the card edge connector, the socket allows for rotation of the daughter card about the received card edge. The mezzanine connectors are aligned for connection in response to rotation of the daughter card about the received card edge.

Abstract: An apparatus for connecting a multi-conductor cable of a first device to a pin grid array connector of a second device, wherein said apparatus comprises a first printed circuit board (PCB) for terminating the conductors of the cable, which are connected to a first PCB surface mounted connector mounted on the first PCB. The first PCB surface mounted connector is mated with a second PCB surface mounted connector mounted on a second PCB, on which a PCB surface mounted socket grid array is also mounted for mating to the pin grid array connector of the second device. This apparatus allows the same (i.e., standardized) multi-conductor cable with the same first PCB and the same first PCB surface mounted connector to be used regardless of what style connector is used by the second device.

Abstract: An electrical connecting device for electrically connecting between two contacted articles, comprising a push member, a lock member, which holds one of the contacted articles in a predetermined mount position through the push member, a base member, to which the two contacted articles are mounted, an elastic member held on the base member, and a plurality of contacts held on the elastic member, and wherein the base member includes an upper base member and a lower base member, each including an accommodating recess, which accommodates the elastic member, the elastic member includes slits, respectively, holding the plurality of contacts, the plurality of contacts, respectively, include at least an upper contact arm having an upper contact portion and a lower contact arm having a lower contact portion, and the upper and lower contact portions of each of the plurality of contacts are structured to enable abutting against the elastic member.

Abstract: A clamping mechanism (18) for an IC socket (14) is disclosed having two moveable arms (36) which are spaced apart on opposite sides of the IC socket (14), with first ends pivotally secured to a fixed shaft (34) at moveable arm pivot points for moving from a lifted position to a lowered position, extending across the IC socket (14). Two clamp arms (38) are spaced apart on opposite sides of the IC socket (14), and have formed ends (40) pivotally secured to the second ends (166) of the moveable arms (36) at latch pivot points. The clamp arms (38) are configured such that, when the moveable arms (36) are disposed in the lowered positions and the clamp arms (38) are disposed in the clamping positions, a hooking shaft (32) is disposed in the self-locking positions in openings (156) in the clamp arms (38) such that upward forces applied to the moveable arms (36) will engage the hooking shaft (32) against the clamp arms (38) and urge the clamp arms (38) into the latched position.

Abstract: An electrical connector (1) for connecting a land grid array (LGA) chip with a printed circuit board (PCB) includes a housing (10), and terminals (11) received in passageways (104) of the housing. The housing has a base (100) and sidewalls (12, 14), the base and the sidewalls cooperatively defining a space therebetween for retaining the LGA chip. The base has a multiplicity of walls respectively between every two adjacent passageways along a length thereof, and four raised portions (102) extending upwardly around the base. A multiplicity of protrusions (106) is respectively extended upwardly from the walls. When a force is exerted down the LGA chip to make the LGA chip engage with the terminals, the protrusions and the four raised portions can support the force for separate the force without making the LGA chip deforming downwardly. This ensures that engagement between the connector and the LGA chip is accurate and reliable.

Abstract: A low-profile module socket includes a socket housing, which is open at a module insertion surface and at an opposing surface, and includes peripheral wall parts and a plurality of contacts. Each contact connects at one end to a module on the inside of the socket housing and at another end to an electronic circuit substrate on the outside of the socket housing. Module securing members are formed from a metal plate and configured to contact and electrically ground a camera module provided in the socket housing. The module securing members latch at least to the pair of peripheral wall parts that oppose shield side wall parts arranged along an inner surface of the peripheral wall parts. A bottom surface plate part is formed in a single body with a pair of module securing members such that the module securing members mutually interlock at the module insertion opposing surface side.

Abstract: An apparatus, includes a plurality of pins which include a longitudinal axis, each of the pins to be respectively electronically contacted with each of a plurality of terminals of an electronic component by pressing each of the terminals onto each of the pins from a direction corresponding to the longitudinal axis, and an adjusting unit which adjusts a position of the electronic component so that each of the terminals corresponds to each of the pins respectively.

Abstract: A socket connector includes an insulative housing (13), a number of contacts (12) received in the insulative housing and a cover (10) moveable with respect to the insulative housing. The cover has a mating surface (104) facing the insulative housing, a coupling surface (103) opposite to the mating surface, rows of slots (102) extending through the mating surface and the coupling surface, and at least one block (101) on the mating surface. The at least one block is located between two adjacent slots.

Abstract: An electrical contact (3) includes a body section (30), a contacting arm (31) extending upward from the body section (30), a soldering section (32) formed by cutting out from the body section and then extending outwardly. The soldering section (32) comprising a first extending arm (321) connected to the body section (30), a second extending arm (322) bent downwardly from the first extending arm (321), and a soldering pad (323) extending from the second extending arm (322) toward the body section (30). An opening (300) is defined after the soldering section (30) is cut out from the body section.

Abstract: An interposer frame assembly includes a static frame and a biasing frame. The static and biasing frames include legs joined with and oriented at an angle with respect to one another. The legs include mounting surfaces and opposite upper surfaces that are interconnected by an inner side. The mounting surfaces have outwardly protruding posts and the inner sides have protrusions extending away from the legs. The posts are received in openings of an interposer assembly such that the static frame and the biasing frame are aligned on opposite sides of a contact field of the interposer assembly. The protrusions of the static frame and the biasing members of the biasing frame guide and retain a circuit board with contacts into a mated relationship with corresponding contacts in the contact field of the interposer assembly.

Abstract: A cast grid array (CGA) package comprises shaped solder posts which may be reflowed and connected directly to a circuit board, such as mother board, or remain in a solid state with the shape allowing them to be secured within a CGA socket which, in turn, may be connected to the a board. Embodiments of the CGA allows for a lower cost socket and package combination by using solder post to interface the socket and not requiring a loading mechanism on every socket.

Abstract: A socket connector for receiving an electronic device includes an insulative housing having a base and a pair of sidewalls located at opposite sides of the base, a plurality of contacts retained in the base, and at least one positioning member attached to the sidewall. The base and the sidewalls jointly define a receiving space for the electronic device. The positioning member includes a soldering section capable of being soldered onto a printed circuit board on which the insulative housing is mounted, and a positioning section protruding into the receiving space and capable of positioning the electronic device.

Abstract: An apparatus and method of providing an electrical component interface is disclosed. For one embodiment, the electrical component interface includes an electrical component adapter. The electrical component adapter includes an electronic component solder pattern for receiving and allowing attachment of an electrical component. An adhesive backing is adjacent a surface of the electrical component adapter. The adhesive backing provides attachment of the electrical component adapter to a second surface.

Abstract: A socket connector (1) for electrically connecting a Central Processing Unit (CPU) with a Printed Circuit Board (PCB), includes a base (10), a cover (20) and a shaft (30) attached to the cover and pivotally driving the cover to move on the base. The base has a plurality of conductive contacts received therein and defines a plurality of apertures (104) in the middle thereof. The cover forms a plurality of pillars (208) extending through the apertures and forward a lower surface of the base. The pillars are moveable in the apertures along with the cover.

Abstract: An electrical socket connector (100) includes an insulative housing (1) having a general flat base (11) with a mating surface (11a) adapted to face a chip package (3), and a mounting surface (11b) adapted to face a printed circuit board. The base includes a peripheral wall (102) extending from edges thereof. A plurality of passageways (12) extends from the mating interface toward the mounting interface, with a plurality of terminals each inserted into the passageways from the mating interface to the mounting interface. A detachable aligning key (2) is assembled to the insulative housing.

Abstract: An LGA socket includes an insulative housing and a plurality of electrical contacts secured on the insulative housing. The insulative housing defines a top face and a bottom face opposite to each other. The insulative housing has a number of alignment posts at corners and the alignment posts together form a receiving space. The alignment post is provided with two crash ribs for positioning an integral module received in the receiving space.

Abstract: A test jig is for testing electrical characteristics of a high frequency semiconductor device in a package having a ground electrode and a high frequency signal electrode. The test jig includes a test circuit substrate with a microstrip line structure, a grounding block and a high frequency signal contact pin. The test circuit substrate includes an insulating substrate, a ground conductor on a bottom surface of the insulating substrate and high frequency signal wiring on a top surface of the insulating substrate. The grounding block is disposed on the top surface of the insulating substrate and connected to the ground conductor. The high frequency signal contact pin is disposed on the top surface of the insulating substrate and connected to the high frequency signal wiring. The high frequency signal contact pin is spaced from the grounding block.

Abstract: Disclosed is a piston reset apparatus for a multichip module that includes a base with multiple projections and two unit associating pegs extending from opposite ends of the base, a hat disposed upwardly of the base and including multiple adjustable pistons vertically adjustable within the hat, each of the plurality of adjustable pistons being disposed in alignment with one of the multiple projections, a mass equivalent plate disposed upwardly of the hat and being configured to hold a spring loaded sleeve, the spring loaded sleeve including a plurality of springs, each of the springs being aligned with and configured to apply pressure upon one of the multiple pistons, a spring loaded clamp disposed upwardly of the plate and including a spring loaded portion and a retaining portion, the retaining portion defining two cavities configured to fixedly associate with an associating groove defined by each of the unit associating pegs.

Abstract: A land grid array (LGA) connector, for electrically connecting an IC (Integrated Circuit) package to a printed circuit board, comprises a retaining frame, a plurality of sections mounted on the retaining frame and a plurality of contacts received in the sections. Each contact having a contacting portion extending beyond the top surface of the section to contact with the IC package, and the contacting portions of the contacts received in a same section have two opposed extending direction to evenly and elastically support the IC package when the IC package is pressed toward the contacts.

Abstract: An LGA socket includes an insulative housing, a number of conductive terminals received retained in the housing, a stiffener surrounding the insulative housing, a load plate and a load lever pivotally assembled to the stiffener, and a locking mechanism. The locking mechanism includes a screw attached to the stiffener in a horizontal direction and a washer attached to the support plate in a vertical direction. The locking mechanism is attached to the stiffener before the LGA socket mounting to a printed circuit board.

Abstract: A shielded connector (1) for electrically connecting a camera module to a printed circuit board at least comprises a metal housing (10) configured by a base and four sidewalls and a spring (20) against with the base of the housing. And one of the sidewall includes a fixed portion and a flexible portion. Said flexible portion defines a latchable portion against with the camera module, which extends from an adjacent sidewall to said sidewall towards the opposite sidewall to said adjacent sidewall. Therefore, the elastic of the flexible portion is improved and a better electrical connection is provided between the camera module and a circuit board.

Abstract: A burn-in socket for electrical connecting with package having solder balls, includes a base and a number of contacts received in the base. Each contact has a spring section movable in the base, a contact section extending upwardly from the spring section and a retention section extending downwardly from the spring section. The contact section includes three tips at a top end thereof for contacting with the solder balls of the package thereby supporting the solder balls.

Abstract: An electrical connector for electrically connecting a chip module to a printed circuit board includes an insulative housing with a number of contacts, a metal stiffener surrounding the insulative housing, a metal clip pivotally assembled to one end of the metal stiffener; and a lever pivotally assembled to the other end of the metal stiffener. The metal clip has a main portion, an engaging tab extending angularly from the main portion, and a pair of hooks mounting to the metal stiffener. The metal stiffener includes a block portion engaging with the main portion to avoid the tab disengaging from the lever.

Abstract: An electrical connector assembly (100) comprises an insulative housing (5) with a plurality of contacts (6) received therein, a lock member (3) assembled on the circuit board (2) and a load plate (1) for pressing the electronic package toward the insulative housing (5). The lock member (3) defines a lock portion (31), the load plate comprises a body portion (12), a first tongue portion (14) and a second tongue portion (15) extending from the body portion (12), the first tongue portion (14) and the second tongue portion (15) can move away from each other to make the first tongue portion (14) and the second tongue portion (15) move to the lower surface of the lock portion (31) to interlock with the lock portion (31).

Abstract: An IC socket is provided with first and second contact pins and a socket body supporting said first and second contact pins. The first contact pin is used to establish a connection with a first terminal of a semiconductor package, while the second contact pin is used to establish a connection with a second terminal of said semiconductor package. The first and second terminals have different heights from a mount face of the semiconductor package.

Abstract: A circuit includes a first plurality of contacts configured to be in electrical communication with a plurality of electronic devices. The circuit card further includes a flexible portion including a dielectric layer, a second plurality of contacts, and a plurality of electrical conduits extending across a region of the flexible portion and in electrical communication with one or more contacts of the first plurality of contacts and with the second plurality of contacts. The flexible portion further includes an electrically conductive layer extending across the region of the flexible portion. The electrically conductive layer is superposed with the plurality of electrical conduits with the dielectric layer therebetween. The electrically conductive layer does not overlay one or more portions of the dielectric layer in the region of the flexible portion.

Abstract: An electrical connector (1) for interconnecting integrated circuits (ICs) to a circuit board, includes an insulative housing (2, 3) defining a plurality of passageways extending therethrough, and a plurality of contacts received respectively in each of the passageways of the insulative housing. The insulative housing has a first base (2) adapted to connecting an IC to a circuit board and a second base (3) which is capable of cooperating with said first base when the connector is used to connecting another IC having a different size to the circuit board.

Abstract: An electrical connector comprises an insulative housing defining a plurality of passageways, the passageways each defining an upper section, a lower section of a diameter larger than that of the upper section, and a plurality of contact sets respectively disposed in the passageways. Each of the contacts sets includes an upper contact loosely captured within the upper section and a lower contact retained in the lower section. The upper contact defines a lower end extending in the lower section and is able to abut against an interface between the two sections, so as to retrain upward movement of the upper contact. The upper contact is movable relating to the lower contact under condition that one of said upper contact and the lower contact is deformed to provide a restored force to ensure electrical connection between the two contacts when the upper contact is moved toward said lower contact.

Abstract: An LGA socket for receiving substrate packages of various sizes and a method of fabricating the socket. In an embodiment, the socket has a planar surface for seating a substrate package. Socket contacts are disposed on the planar surface in a layout common to the layout of interconnects formed on the bottom of substrate packages the socket is designed to receive. A plurality of socket locating features is formed on the socket body to prevent lateral displacement of a reference substrate package. A corresponding number of package locating features are formed on the substrate body of packages larger than the reference substrate package. Each of the socket locating features meshes with the corresponding package locating feature of the larger package.

Abstract: A socket adapted for electrically connecting a semiconductor package to a printed circuit board, comprises an insulating body and a plurality of position clump. The insulating body has a plurality of sidewalls, which define a plurality of assembling slots. The position clumps are movably assembled to the assembling slots of the insulating housing, each of the position clump has a position block and a spring member disposed between the position block and the insulating housing, the position block has a supporting face for supporting the IC package and is able to downwardly move toward the mating face of insulating housing.

Abstract: Modification of the connections between a die package and a system board is described. In one example a pattern redistribution module is used in a socket. The module has a first array of contacts on one side of the module. The contacts have a first configuration to connect to the socket. A second array of contacts is on another side of the module opposite the first array of contacts and has a second configuration to connect to a package containing a die. A board is between the first and the second array of contacts to interconnect contacts of the first array of contacts to contacts of the second array of contacts.

Abstract: A connector assembly includes a PCB, an insulative housing mounted on the PCB with a plurality of contacts received therein, a retention module mounted on the PCB and surrounding the insulative housing, and a backplate mounted below the PCB for reinforcing the retention module. The backplate includes a base plate having an upper surface toward a backside surface of the PCB and an insulative coating deposited on the upper surface to prevent the backplate from short-circuiting electrical components of mounted on the backside surface of the PCB.

Abstract: The present invention provides an electrical connector comprising an insulative housing having a plurality of passageways, and a plurality of contacts received in the passageways, respectively. The passageways each defines two inner walls opposite to each other, the two inner walls each having at least one first retention device. The contacts each include a base, an upper arm extending from one side of the base and a lower arm extending from another side. The upper arm further defines two protrusions on opposite sides thereof and the lower arm defines two protrusions on opposite sides thereof. In assembly, protrusions on upper arm are located above the first retention device of the passageways, and protrusions on the lower arm are located below the first retention device of the passageways such that movement of the contact in the passageway along length axis of the passageway is limited in a predetermined distance.

Abstract: A simple structure socket 10 for connecting a ball grid array integrated circuit device to a test circuit has a base 14, contacts 26 arranged corresponding to the ball grid array, a nest assembly 16 of two comb structures 70 and a lever assembly 18 for spacing opposed tip portions of each contact away from each other to define a gap for receiving a ball. The lever assembly has two rectangular frames 86 each made of a distal cross piece 94, a proximal cross piece and two side pieces connecting the distal and proximal cross pieces. The two rectangular frames are arranged so that the side pieces are intersected at substantially mid portions thereof. This allows that, by depressing the proximal cross pieces toward the base, the distal cross pieces forces the comb structures toward each other.

Abstract: A heat transfer member which is capable of enhancing efficiency of heat dissipation, and a connector including the heat transfer member. On the surface of an elastic body arranged between an LED and a heat sink, a heat conduction metal thin film that transfers heat generated in the LED to the heat sink is formed. The member may also include an electrical conduction metal film, whereby the member may serve as both a heat transfer member and as an electrical connector.

Abstract: A socket connector (10) utilizes contacts (41) that have a shape similar to an inverted ohm sign and which have two flexible contact arms (43) located at one end thereof for contacting elements such as solder balls (62). The other end of the contact have a closed end and the contacts may be slotted in increase their flexibility or they may be solid.

Abstract: The electrical connecting apparatus comprises: a wiring base plate having a first surface provided with a plurality of first conductive portions; a probe base plate having a second surface provided with a plurality of second conductive portions with its second surface opposed to the lower surface; a plurality of screws for removably coupling the wiring base plate and the probe base plate; and a connecting device for electrically connecting the first and second conductive portions.

Abstract: A socket connector comprises an insulative housing defining a plurality of passageways and a receiving cavity for receiving an electrical package, and a plurality of contact respectively disposed in said passageways. The receiving cavity comprises a first cavity, and a second cavity smaller than the first cavity. The second cavity is in communication with the first cavity and outer space, the second cavity defining standoffs for positioning the electrical package when the electrical package is inserted into the receiving cavity.

Abstract: An electrical connecting apparatus uses a plurality of contacts each of which includes: a principal portion having an outer face curved and directed to a conductive portion of a base plate and received in a recess and a slit of a housing; a front end portion continuous to the front end side of the principal portion and projected upward from the slit so as to be relatively pressed against an electrode of a device under test; and a rear end portion continuous to the rear end side of the principal portion and located in the recess. The front end portion of each contact is projected upward from the slit by the dimension of the thickness of the front end portion or more than that and has an arc-shaped front end face extend in the longitudinal direction of the slit.

Abstract: An aspect of the present invention inheres in an IC socket includes a plate-like socket base body which includes through hole forming portions having a plurality of contact housing holes formed so as to penetrate the plate-like socket base in a front-to-back direction, and having through holes formed around the respective contact housing holes so as to penetrate the plate-like socket base in the front-to-back direction, and a plated layer formed continuously on an inner wall of the through hole, on the front and back surfaces of the through hole forming portion, and on a surface of the contact piece.

Abstract: An LGA socket includes an insulative housing and a plurality of electrical contacts secured on the insulative housing. The insulative housing defines a top face and a bottom face opposite to each other. The insulative housing has a number of alignment posts at corners and the alignment posts together form a receiving space. The alignment post is provided with two crash ribs for positioning an integral module received in the receiving space.

Abstract: An apparatus for testing electric characteristics of a test object including first connection terminals on a bottom surface and second connection terminals on a top surface, the apparatus comprises a test board comprising first pads on a predetermined surface; a socket configured to electrically connect the test object to the test board; and a handler configured to transport the test object to the socket. The socket comprises a first connection unit configured to be electrically connected to the first connection terminals of the test object and a second connection unit configured to be electrically connected to the second connection terminals of the test object.

Abstract: An electric connector is disclosed to include an electrically insulative housing, which has solder ball receiving portions, terminals respectively mounted in the housing corresponding to the solder ball receiving portions, each terminal having an endpiece, which defines with the sidewall of each of the solder ball receiving portions a respective receiving chamber, and solder balls respectively movably accommodated in the receiving chambers defined by the endpieces of the terminals and the sidewalls of the solder ball receiving portions.

Abstract: An electrical connector (1) includes four pieces of insulative housing segments (21) having a number of electrical contacts (3) received therein. Each insulative housing segment includes two engaging edges (213) for attaching with another adjacent two insulative housing segments, the at least one engaging edge having at least one connect portion (215) formed thereon. At least one joining member (4) connects the connect portions of the at least two insulative housing segments.