Abstract: The automated test equipment is configured to establish communication, e.g. by uploading a program to the DUT using a first interface, such as a debug interface or a generic interface having access to the processing unit for external control. A typical use case of the first interface is debug access to the DUT, which typically requires limited data rates. In the case of the invention the first interface is an ATE access for test execution. The first interface configures the DUT to open a second interface running at much higher data rate, which is higher than the first interface, for additional communication. Additionally, the second interface may have extended capabilities compared to the first interface, such as presenting its own memory to the processing unit of the DUT as a normal system memory.

Abstract: A printed circuit board connecting device (1) for connecting printed circuit boards (3, 5) includes a non-conductive plate (21) having a top side and a bottom side, and a plurality of interface connections (23) which are arranged in the plate (21) so as to be spaced apart from one another. Each interface connection (23) has grouped-together conductors (41) which extend through the plate (21) and which are laterally enclosed by the plate material and the end regions of which protruding on the top side and lower side from the plate (21) can be fixed to interfaces (13) of two printed circuit boards (3, 5) to be connected. Therefore, the conductors (41) form both a mechanical and an electrical connection between the interfaces (13) of the printed circuit boards (3, 5).

Abstract: A fastening system comprises two interconnecting components for fastening electronic components which can be joined by snap-fit when a fastener component is pressed against a retainer. The fastening system consists of a fastener stud with a planar base at the bottom and an upwardly extending shank with a neck portion of reduced diameter adjacent the base. The stud has a spherical ball portion with a flat planar top surface at a distal top end. The fastener stud mates with a retainer having a planar base and affixed opposing resilient arms extending orthogonally from the base centered about a rotational axis. The arms preferably have compound shaped inner surfaces symmetrical about the axis. These surfaces comprise a cylindrical portion adjacent the base and a spherical portion adjacent the distal ends of the arms.

Abstract: The present disclosure relates to the field of printed circuit board technologies. A printed circuit board with good heat dissipation performance is provided and includes a substrate serving as a board body of the printed circuit board, a heating component embedded in the substrate, and a cooling liquid channel disposed in the substrate. The cooling liquid channel is disposed in the printed circuit board, and passes around the heating component to exchange heat with the heating component, so that a heat dissipation path is shortened and heat dissipation efficiency is improved, thereby quickening heat dissipation of the printed circuit board, and prolonging a service life of the printed circuit board.

Abstract: An adapter for retaining a wafer has a back side intended to be placed on, and to extend over, a first suction channel and a second suction channel disposed on a main face of a support. The adapter has a shallow recess disposed on the front side to receive the wafer, the shallow recess being shaped to the wafer size and having a flat base to contact a surface of the wafer. The adapter also includes a vacuum network extending through the adapter and comprising at least one through-passage connecting the adapter back side and the adapter front side, the through-passage opening out, on the front side, in the shallow recess. The through-passage intercepts, on the back side, the first suction channel of the support but not the second suction channel.

Abstract: A job-site gear in one aspect of the present disclosure includes a circuit board, at least one electronic component, and a resin member. A first surface of the circuit board includes a first area, a second area, and a third area. The third area is located in a boundary between the first area and the second area. A second surface of the circuit board includes a fourth area, a fifth area, and a sixth area located behind the first area, the second area, and the third area, respectively. The third area and the sixth area include at least one slit penetrating through the circuit board. The resin member is integrally molded so as to (i) penetrate through the at least one slit and (ii) cover the first area, the fourth area, and a part of the at least one electronic component on the first area.

Abstract: The positions at which electrode pads are arranged can be made more flexible, and electrical interconnects to be installed can be reduced. In addition, the degree of integration of a chip increases, making it possible to realize a large-scale device (optical switch etc.). In an optical module of the present invention, an interposer (an electrical connection intermediary component with electrode pins attached onto upper and lower faces in an array) is laid over a chip that includes a device configured by using a planar lightwave circuit (PLC) fixed onto a fixing metal plate, and a control substrate for driving the device is laid over the interposer. These components are mechanically fixed by a fixing screw or the like, and the electrode pads of the chip and the control substrate are connected to each other via the interposer.

Abstract: An optical system is provided. The optical system includes a first movable portion, a fixed portion, a first driving assembly, and a first sensing assembly. The first movable portion is used for connecting to an optical assembly having a main axis. The first movable portion is movable relative to the fixed portion. The first driving assembly is used for driving the first movable portion to move relative to the fixed portion. The first sensing assembly is used for sensing the movement of the first movable portion relative to the fixed portion.

Abstract: A semiconductor device includes a conductive board, a contact component having a cylindrical through hole and including a main body portion with first and second open ends, and an external connection terminal inserted in the through hole of the contact component, having four outer surfaces extending in an insertion direction to form a quadrangular prism shape, and having four corner portions along an insertion direction pressed by an inner circumferential surface of the through hole of the contact component. The external connection terminal has protrusions, each of which is disposed on a respective one of at least one pair of opposite outer surfaces among the four outer surfaces, and being pressed by the inner circumferential surface of the through hole.

Abstract: A connector assembly includes multiple terminals. Each terminal includes a conductive portion. The terminals include first and second high speed signal terminals and a low speed signal terminal. The conductive portions of the first and second high speed signal terminals and the low speed signal terminal are correspondingly defined as first, second and third conductive portions. An adapter board is located above a circuit board to be conductively connected to a cable directly or indirectly. The adapter board includes first and second signal circuit layers located at different heights. The first signal circuit layer includes a first high speed signal circuit conductively connecting the first conductive portion and a conductive wire of the cable. The second signal circuit layer includes a second high speed signal circuit conductively connecting the second conductive portion and another conductive wire of the cable. The third conductive portion is conductively connected to the circuit board.

Abstract: A MEMS package and a method for forming a MEMS package are provided. The MEMS package includes a package substrate, a housing structure, an image sensor structure, a MEMS structure and a composite damper. The housing structure includes a stopper. The image sensor structure and the MEMS structure are between the package substrate and the housing structure. An interconnect wire electrically connects the MEMS structure to the image sensor structure. The composite damper is between the package substrate and the housing structure. The composite damper is configured to control a gap between the interconnect wire and the stopper.

Abstract: An electric pump is provided. The electric pump includes a PCB board, where the PCB board is formed with a power input port. The electric pump further includes a common mode filter, where the common-mode filter includes a common mode inductor, and the common mode inductor is arranged close to the power input port; and in a direction perpendicular to a plane on which the PCB is located, no wiring is provided at the common mode inductor corresponding to a wiring film layer in the PCB.

Abstract: An electrical connector includes an insulation housing, a plurality of rows of terminals, and a plurality of corresponding fixing parts. The plurality of rows of terminals are sequentially and fixedly arranged in parallel on the insulation housing. The plurality of fixing parts are assembled to the insulation housing for structurally constraining the corresponding rows of terminals. An electrical connector manufacturing method includes fixing a plurality of first terminals on an insulation housing in a row, assembling a first fixing part to the insulation housing to structurally constrain the row of first terminals, fixing a plurality of second terminals on the insulation housing in a row, assembling a second fixing part to the insulation housing to structurally constrain the row of second terminals, and so on, so as to obtain one like the above electrical connector. The electrical connector can provide data transmission in compliance with PCIe 4.0 standard.

Abstract: A contact assembly for an electrical connector signal contacts arranged in pairs and ground contacts are interspersed with the pairs of the signal contacts. Each signal contact includes a signal contact body having first and second sides extending between a signal mating end and a signal terminating end. Each ground contact includes a ground contact body having first and second sides extending between a ground mating end and a ground terminating end. The contact assembly includes a ground shield assembly including a ground shield spanning across the contacts and ground connective elements electrically connected to the ground shield and the corresponding ground contacts. The ground connective elements are compressible.

Abstract: A contact structure causing a first electric device to be electrically connected to a second electric device includes first terminals and second terminals. The second terminals include contact projections to be electrically connected to the first terminals, and cleaning projections located closer to an opening side of a fitting part of the second electric device than the contact projections to be brought into contact with the first terminals. The contact structure is configured such that the contact projections are not in contact with a surface of an outer case of the first electric device or surfaces of the first terminals before the cleaning projections climb over the first terminals. The contact structure is also configured such that the contact projections are brought into contact with the surfaces of the first terminals after the cleaning projections climb over the first terminals.

Abstract: A preformed solder-in-pin system for use with electrical connectors. The preformed solder-in-pin system generally includes a connector pin having an open cavity at one end, into which a preformed solder member can be first inserted and then pressed, rather than melted, in place, such that voids and air spaces within the cavity are eliminated. The preformed solder-in-pin system can be assembled in high quantities, where the preformed solder members are placed in a fixture and the fixture is placed on a shaker table, so that large numbers of connector pins, pre-installed in connector grommets, can be inserted largely simultaneously.

Abstract: In one example in accordance with the present disclosure, a fluidic ejection controller is described. The fluidic ejection controller includes a firing board to pass electrical control signals for ejecting fluid from a fluidic ejection device. An ejection board of the fluidic ejection controller is electrically coupled to, and selectively removable from, the firing board to pass the electrical control signals to the fluidic ejection device. Electrical pins are disposed on the ejection board in a pattern that matches a pattern of electrical pads on the fluidic ejection device. The electrical pins interface with corresponding electrical pads to pass the electrical control signals from the ejection board to the fluidic ejection device.

Abstract: A method includes disposing a terminal pin on an electronic substrate with a base region of the terminal pin in contact with a circuit trace on an electronic substrate, and ultrasonically coupling the base region of the terminal pin to the circuit trace.

Abstract: A socket configured to electrically connect a first electric component and a second electric component, the socket including: a base part including a top surface and a bottom surface; a contact pin provided to extend through the base part and including a pin lower end exposed from the bottom surface; and an abutment part provided in the base part, and including an abutment lower end, the abutment lower end being exposed from the bottom surface to abut on the second electric component and configured to be movable in a vertical direction, the abutment part being configured such that the abutment lower end abuts on the second electric component approaching, in a process of attaching the second electric component, the base part from below to adjust a posture of the base part with respect to the second electric component.

Abstract: Systems, apparatus, and/or processes directed to applying pressure to a socket to alter a shape of the socket to improve a connection between the socket and a substrate, printed circuit board, or other component. The socket may receive one or more chips, may be an interconnect, or may be some other structure that is part of a package. The shape of the socket may be flattened so that a side of the socket may form a high-quality physical and electrical coupling with the substrate.

Abstract: A connector assembly includes: a housing having a first side at which a plurality of accommodating grooves configured to receive a plurality of terminals are formed, and having a second side open; a plurality of connection terminals extending in a direction parallel to a direction from the first side of the housing toward the second side of the housing, and fixed in the housing; a circuit board inserted into the second side of the housing that is open, fixed to the housing, and electrically connected to the plurality of connection terminals; and noise filters configured to filter out electromagnetic interference and coupled to the circuit board.

Abstract: A circuit system includes a first circuit, a second circuit, and a comparator. The second circuit and the first circuit have substantially identical structures. In a testing mode, the circuit system controls the first circuit and the second circuit to perform the same testing operation synchronously. During the process of the testing operation, the comparator keeps compares a first intermediate signal internally generated by the first circuit and a second intermediate signal corresponding to the first intermediate signal that is internally generated by the second circuit. When the first intermediate signal is different from the second intermediate signal, the circuit system controls the first circuit and the second circuit to stop the testing operation and controls the first circuit and the second circuit to perform a scan dump operation in order to record signals transmitting by the first circuit and signals transmitting by the second circuit.

Abstract: An electronic system includes two integrated circuit (IC) packages that are connected by a package to package (PP) connector. The PP connector may include cabling between a first cabling connector and a second cabling connector. The first cabling connector may be seated to a first carrier connector upon a first IC device carrier of the first IC device package. The second cabling connector may be seated to a second carrier connector upon a second IC device carrier of the second IC device package. The electronic system may further include a heat sink connected to the IC packages, to the first cabling connector, and to the second cabling connector. An IC device may route I/O data through the PP connector, effectively increasing the number of I/O routes.

Abstract: The present disclosure provides a method of fabricating a semiconductor device. The method can include bonding a first die and a second die face to face, the first die including a substrate, transistors formed on a face side of the first die over a semiconductor layer with an insulating layer between the substrate and the semiconductor layer, and a first contact structure on the face side of the first die extending through the insulating layer. The method can also include exposing the first contact structure from the back side of the first die, forming, from the back side of the first die, a contact hole in the insulating layer to expose the semiconductor layer, and forming, on the back side of the first die, a first pad-out structure connected with the first contact structure and a second pad-out structure, on the contact hole, conductively connected with the semiconductor layer.

Abstract: An opening/closing mechanism that allows a cover member to be biased according with the degree of opening. A solution is that an opening/closing mechanism of an opening/closing body, comprises: a cover member 15 opening and closing around a shaft center of a third shaft 33 and disposed on a base portion 23, and an opening/closing body 10 in which the cover member 15 is biased toward an opening direction by a biasing force of a spring member 21 wherein a spring support portion 35 is provided on the base portion 23, and a spring receiver 37 is provided on the cover member 15, and in accordance with more opening of the cover member 15, a distance from the spring base portion 41b of the spring member 21 to an abutting position in the spring extending portion 41a with the spring receiver 37 becomes longer and the biasing force decreases.

Abstract: Embodiments include a transmission line-land grid array (TL-LGA) socket assembly, a TL-LGA socket, and a package substrate. The TL-LGA socket assembly includes a TL-LGA socket having an interconnect in a housing body, the interconnect includes a vertical portion and a horizontal portion. The housing body has a top surface and a bottom surface, where the top surface is a conductive layer. The TL-LGA socket assembly also includes a package substrate having a base layer having a signal pad and a ground strip. The base layer is above the conductive layer of the housing body of the TL-LGA socket. The ground strip is above the horizontal portion of the interconnect and adjacent to the signal pad. The horizontal portion is coupled to the signal pad on the base layer. The package substrate may have a pad with a reduced pad area.

Abstract: One embodiment relates to a camera module comprising: a housing; a first printed circuit board having an image sensor mounted thereon, and loaded in the housing such that the image sensor is accommodated in the housing; a second printed circuit board and a third printed circuit board sequentially arranged on the lower part of the first printed circuit board in the vertical direction; a support unit arranged in the housing while accommodating the first printed circuit board therein, and having a stepped portion including a first loading portion at which the second printed circuit board is placed and a second loading portion at which the third printed circuit board is placed; and a fixing unit coupled to the housing by penetrating through a first groove portion and a second groove portion, which are respectively formed at the edge parts of the second printed circuit board and the third printed circuit board, and through a third groove portion formed at the edge part of the support unit.

Abstract: An inspection equipment is used for inspecting an antenna, and includes a testing device having a first circuit structure, a carrier, a supporting part and a second circuit structure detachably stacked on one another sequentially. Therefore, the carrier, the first circuit structure, the second circuit structure or the supporting part can be detached when different devices under test are inspected, without replacing the whole testing device, thereby achieving effects of modular replacing and cost saving.

Abstract: An electrical connector includes an insulating body and multiple terminals accommodated in the insulating body. Each terminal has a base portion, a strip connecting portion extending upward from the base portion to be connected to a strip, and an elastic arm extending from the base portion. The elastic arm has a first tearing edge torn from the strip connecting portion, a second tearing edge torn from the strip, and a blanking edge blanked from the strip. The second tearing edge or the blanking edge has a dividing point. When each terminal is connected to the strip and expanded in a same vertical plane, the dividing point and a top point of the first tearing edge are vertically aligned. After the elastic arm is formed by bending, the dividing point and the first tearing edge are both located at a back side of the strip connecting portion.

Abstract: A preformed solder-in-pin system for use with electrical connectors. The preformed solder-in-pin system generally includes a connector pin having an open cavity at one end, into which a preformed solder member can be first inserted and then pressed, rather than melted, in place, such that voids and air spaces within the cavity are eliminated. The preformed solder-in-pin system can be assembled in high quantities, where the preformed solder members are placed in a fixture and the fixture is placed on a shaker table, so that large numbers of connector pins, pre-installed in connector grommets, can be inserted largely simultaneously.

Abstract: A connection terminal includes an insertion end portion, a tail portion, and a connection block. The insertion end portion includes at least two first terminals configured apart from each other. The first terminal includes a first pin and a second pin, and a length of the first pin is greater than the length of the second pin. Fixing ends of the first pin and the second pin contact each other and pass through the connection block to connect with the tail portion. Free ends of the first pin and the second pin are separated from each other, and are both bent and protruded toward an inner side of the insertion end portion, so as to form a first contact point and a second contact point at the free ends of the first pin and the second pin, respectively.

Abstract: Microelectromechanical system are disclosed that include at least one electrode, microelectrode or combination thereof, wherein the at least one electrode comprises a carbon material, a glassy carbon material or a combination thereof. Contemplated systems are suitable for ?-ECoG arrays. Additional microelectromechanical systems are disclosed that include at least one electrode, microelectrode or combination thereof, wherein the at least one electrode comprises a carbon material, a glassy carbon material or a combination thereof; at least one substrate, surface, layer or a combination thereof, wherein the at least one electrode, microelectrode or combination thereof is disposed on, coupled with or otherwise layered on the at least one substrate, surface, layer or a combination thereof; and at least one bump pad, wherein the at least one electrode, microelectrode or combination thereof is coupled with the at least one bump pad via at least one conductive metal.

Abstract: A connector mateable with a mating connector includes at least one contact and a contact-holding member. The contact has resiliently deformable first and second support, first and second contact, and a coupling portions. The first and second contact portions, movable in an up-down direction perpendicular to a front-rear direction, are supported by the first and second support portions, respectively. The first support portion has first and second edges in a width direction perpendicular to the front-rear and up-down directions, the edges facing first and second orientations, respectively, which are opposite to each other of the width direction. The coupling portion couples the first and second support portions, and has upper main and bent portions. The upper main portion has upper front wide, fixed to the holding member to be immovable in the width direction, front narrow and base portions.

Abstract: An electrical contact forms opposite top surface and bottom surface. A guiding groove is formed in the top surface. A mounting section is formed at an end of the contact. In the mounting section, a securing hole extends downwardly from the guiding groove and through the bottom surface. A solder unit is received within the securing hole and reaches a conductive pad, under the contact, to which the contact is soldered by reflowing the solder unit. The guiding groove extends from an oblique section of the contact so as to assure the socket unit can be smoothly dropped into the securing hole. The solder unit can be temporarily retained within the securing hole before reflowing.

Abstract: A contact assembly includes a contact array having contacts with transition portions between mating and terminating portions with contact tails extending to tips. The contact assembly has a dielectric contact holder holding the transition portions. The contact assembly has a solder ball module defining a board interface to a host circuit board. The solder ball module has a gathering housing with contact channels extending between a top and a bottom receiving contact tails of corresponding contacts. The gathering housing has solder balls arranged at the bottom at each contact channel being electrically connected to the tips of the contact tails and being configured to be reflow soldered to circuits of the host circuit board to electrically connect the contacts to the host circuit board.

Abstract: According to the present invention, a semiconductor apparatus includes a semiconductor device, a case surrounding the semiconductor device, a spring terminal including a first connection portion extending to a top surface of the case, and a second connection portion provided on the top surface of the case and a control substrate provided on the second connection portion, wherein the first connection portion is connected to the semiconductor device, the second connection portion includes a first end connected to an end of the first connection portion, and a second end opposite to the first end, the second connection portion being a flat plate and having an elastic force using the first end as a supporting point, the second end contacts the control substrate with an elastic force, and the second connection portion has a constriction structure having a notch formed in a side surface along a longitudinal direction.

Abstract: An assembling buckle structure for memory circuit board includes: a base, two sides thereof are respectively formed with an elastic lateral plate having at least a buckle part, two ends of the lateral plate is formed with at least an outer mounting convex and a fasten post, the rear end of the base is formed with a tail plate having at least a buckle part; a memory circuit board disposed in the base, the front end thereof is formed with a connection seat; and a cover, covered and engaged with the base, the front end thereof is formed with a penetrated hole, two inner ends thereof are formed with at least an inner mounting concave; accordingly, the memory circuit board, the base and the cover are able to be stably buckled and combined in any direction without using any screw.

Abstract: A device for orienting contact terminals on an electrical component such that they fit to a circuit board of an electric circuit is disclosed. In an embodiment the device includes a carrier element configured to receive the electrical component and a plurality of bending elements, wherein the carrier element has a plurality of holes, each hole penetrating the carrier element from an upper side to an underside, wherein a respective section of the bending elements is secured to the carrier element and a respective end of the bending elements projects into a respective hole of the carrier element, and wherein the bending elements are configured such that the respective end of the bending elements, upon insertion of a respective contact terminal of the electrical component into the respective hole from the upper side of the carrier element, is bent within the hole and clamps the respective contact terminal.

Abstract: Disclosed is a socket apparatus for ball grid array (BGA) balls, including a base member of electrically insulative material, a plurality of electrical contact members disposed in row and column configuration attached to the electrically insulative material, a plate member extending in a row direction, and a plurality of extension members connected to the plate member and configured to press BGA balls of a mounted BGA into the plurality of electrical contact members when the plate member is pulled in a first direction.

Abstract: A connector, such as a cable connector, with terminal contacts including two parallel resilient contact beams and a third resilient beam. Tips of the two parallel resilient beams are forced apart by the third resilient beam. The third beam can also be a resilient contact beam, e.g., extending into a direction opposite to the direction of the other two contact beams.

Abstract: An electrical connector, used for electrically connecting a chip module to a circuit board, comprising: an insulating body, provided with a plurality of accommodating openings; and a plurality of terminals, correspondingly accommodated in the accommodating openings respectively, wherein each terminal has a connection portion, two sides of the connection portion bend and extend to form a first clamping arm and a second clamping arm, respectively, the first clamping arm and the second clamping arm together clamp a solder material, the first clamping arm has a first upper edge and a first lower edge arranged opposite to each other, and the length of the first upper edge is not equal to the length of the first lower edge. Under conditions of not increasing the length of a metal billet, the length of the first upper edge is increased, and the length of the first lower edge is decreased.

Abstract: The present invention is directed to improve reliability of a semiconductor device. A semiconductor device manufacturing method includes: (a) a step of attaching a BGA having a solder ball to a socket for a burn-in test; and (b) a step of performing a burn-in test of the BGA by sandwiching the solder ball by conductive contact pins in the socket. The contact pin in the socket has a first projection part which is conductive and extends along an attachment direction of the BGA and a second projection part which is conductive, provided along a direction crossing the extension direction of the first projection part, and placed so as to face the surface on the attachment side of the BGA of the solder ball. In the step (b), a burn-in test of the BGA is performed in a state where the first projection parts in the contact pins are in contact with the solder ball.

Abstract: An electrical connector includes: an insulating body; multiple terminals, each terminal having a contact portion and at least one clamping portion forming a clamping space; and multiple solder posts, each being correspondingly placed in the clamping space. The solder post has a foundation post and a protruding portion extending upward from the foundation post. The clamping portion clamps the foundation post in the clamping space. A width of the protruding portion is smaller than a width of the foundation post. The foundation post is cylindrical. A height of the solder post is greater than a diameter of the foundation post. The solder posts are arranged more densely on the insulating body. When the electrical connector and a circuit board are together placed into a reflow oven, hot gas flows around the protruding portion more easily, and a contact area between the hot gas and the protruding portion is larger.

Abstract: An electrical connector for electrically connecting a chip module to a circuit board includes an insulating body having stopping portions, terminals and solder balls. Each stopping portion is located above the solder balls, and has a bottom surface coated with an adhesive. Each terminal includes a connecting portion and two clamping portions extending and bending from two opposite sides of the connecting portion along a horizontal direction. The solder balls are in contact with the terminals and the circuit board, and each corresponds to one of the stopping portions, is adhered to the stopping portion via the adhesive, and is clamped by the two clamping portions and the connecting portion, or by the two clamping portions and the insulating body.

Abstract: A pipe inspection system includes a cable storage drum and a housing configured to removably receive and rotatably support the cable storage drum. A push-cable with a plurality of conductors is stored in the cable storage drum. A camera head is connected to a distal end of the push-cable. A slip-ring assembly has first and second mating portions that when mated provide conductive paths between the plurality of conductors at a proximal end of the push-capable and a display device. The first portion of the slip-ring assembly is mounted on the housing and the second portion of the slip-ring assembly is mounted on the removable cable storage drum. The system connection cable joining the inspection system with a display unit is removable and may be replaced with cables compatible with various alternate image display systems.

Abstract: A lens assembly includes a lens holder and a lens barrel that are coaxial and integrated in a unity, a cavity is defined therein to receive at least one lens, at least three guiding legs are extended from a bottom of the lens holder, and the guiding legs define a plane that is parallel to an installation plane of the lens. It can achieve an accurate optical axis alignment between the lens and the image sensor, reduce total assembly tolerances of the camera module thereby improving imaging quality, and reduce manufacturing cost to benefit the popularization in industries.

Abstract: A first electronic device includes a display unit, a first conductive unit and a processing circuit. The first conductive unit is configured for transmitting a first signal to a second conductive unit of a second electronic device when the first conductive unit is in proximity with the second conductive unit. The processing circuit is configured for providing the first signal to the conductive unit. The first conductive unit includes a transmitting electrode and a receiving electrode.

Abstract: A device interconnection system uses an indexed carrier to locate an array of contacts on an array of solder pads on a printed circuit board. In an embodiment, the PCB is indexed to a device housing in the same manner that it is indexed to the carrier, allowing the array of contacts to match and protrude through an array of holes in the housing. In a further embodiment, the housing is substantially metallic, and the array of holes in the housing are located in an insulating plate formed in the housing.

Abstract: An electronic component case includes a lower case including a bottom plate, a aide wall having a protruding portion, an engaging projection formed on an outer face of the side wall, and a screw hole formed in the side wall in a region where the protruding portion is provided, and an upper case including a top plate, a side wall in which an engaging hole is formed, and a notched hole forced in the side wall on the top plate side. The protruding portion of the lower case is engaged to the notched hole of the upper case, and the screw hole is exposed in the notched hole. The engaging projection of the lower case is engaged in the engaging hole of the upper case.

Abstract: An apparatus may be provided. The apparatus may comprise a substrate and a circuit board. A ball grid array structure may be disposed between the substrate and the circuit board. In addition, a stand-off structure may be disposed between the substrate and the circuit board. The stand-off structure may be adjacent to the ball grid array structure.