Dual Inline Package (dip) Patents (Class 439/70)
  • Patent number: 10346735
    Abstract: An assembling buckle structure for memory circuit board includes: a base, two sides thereof are respectively formed with an elastic lateral plate having at least a buckle part, two ends of the lateral plate is formed with at least an outer mounting convex and a fasten post, the rear end of the base is formed with a tail plate having at least a buckle part; a memory circuit board disposed in the base, the front end thereof is formed with a connection seat; and a cover, covered and engaged with the base, the front end thereof is formed with a penetrated hole, two inner ends thereof are formed with at least an inner mounting concave; accordingly, the memory circuit board, the base and the cover are able to be stably buckled and combined in any direction without using any screw.
    Type: Grant
    Filed: September 29, 2018
    Date of Patent: July 9, 2019
    Inventor: Wen-Yi Lee
  • Patent number: 10292272
    Abstract: A device for orienting contact terminals on an electrical component such that they fit to a circuit board of an electric circuit is disclosed. In an embodiment the device includes a carrier element configured to receive the electrical component and a plurality of bending elements, wherein the carrier element has a plurality of holes, each hole penetrating the carrier element from an upper side to an underside, wherein a respective section of the bending elements is secured to the carrier element and a respective end of the bending elements projects into a respective hole of the carrier element, and wherein the bending elements are configured such that the respective end of the bending elements, upon insertion of a respective contact terminal of the electrical component into the respective hole from the upper side of the carrier element, is bent within the hole and clamps the respective contact terminal.
    Type: Grant
    Filed: April 20, 2016
    Date of Patent: May 14, 2019
    Assignee: EPCOS AG
    Inventors: Florian Velden, Guenter Feist
  • Patent number: 10257952
    Abstract: Disclosed is a socket apparatus for ball grid array (BGA) balls, including a base member of electrically insulative material, a plurality of electrical contact members disposed in row and column configuration attached to the electrically insulative material, a plate member extending in a row direction, and a plurality of extension members connected to the plate member and configured to press BGA balls of a mounted BGA into the plurality of electrical contact members when the plate member is pulled in a first direction.
    Type: Grant
    Filed: November 22, 2017
    Date of Patent: April 9, 2019
    Assignee: ALCATEL LUCENT
    Inventors: Paul J. Brown, Alex L. Chan
  • Patent number: 10230178
    Abstract: A connector, such as a cable connector, with terminal contacts including two parallel resilient contact beams and a third resilient beam. Tips of the two parallel resilient beams are forced apart by the third resilient beam. The third beam can also be a resilient contact beam, e.g., extending into a direction opposite to the direction of the other two contact beams.
    Type: Grant
    Filed: June 7, 2013
    Date of Patent: March 12, 2019
    Assignee: Amphenol FCI Asia Pte Ltd
    Inventors: Gert Droesbeke, Gerard Marie Leon Pequignot
  • Patent number: 10199748
    Abstract: An electrical connector, used for electrically connecting a chip module to a circuit board, comprising: an insulating body, provided with a plurality of accommodating openings; and a plurality of terminals, correspondingly accommodated in the accommodating openings respectively, wherein each terminal has a connection portion, two sides of the connection portion bend and extend to form a first clamping arm and a second clamping arm, respectively, the first clamping arm and the second clamping arm together clamp a solder material, the first clamping arm has a first upper edge and a first lower edge arranged opposite to each other, and the length of the first upper edge is not equal to the length of the first lower edge. Under conditions of not increasing the length of a metal billet, the length of the first upper edge is increased, and the length of the first lower edge is decreased.
    Type: Grant
    Filed: January 11, 2018
    Date of Patent: February 5, 2019
    Assignee: LOTES CO., LTD
    Inventor: Ted Ju
  • Patent number: 10109568
    Abstract: The present invention is directed to improve reliability of a semiconductor device. A semiconductor device manufacturing method includes: (a) a step of attaching a BGA having a solder ball to a socket for a burn-in test; and (b) a step of performing a burn-in test of the BGA by sandwiching the solder ball by conductive contact pins in the socket. The contact pin in the socket has a first projection part which is conductive and extends along an attachment direction of the BGA and a second projection part which is conductive, provided along a direction crossing the extension direction of the first projection part, and placed so as to face the surface on the attachment side of the BGA of the solder ball. In the step (b), a burn-in test of the BGA is performed in a state where the first projection parts in the contact pins are in contact with the solder ball.
    Type: Grant
    Filed: August 10, 2017
    Date of Patent: October 23, 2018
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Jun Matsuhashi, Naohiro Makihira, Hidekazu Iwasaki, Toshitsugu Ishii
  • Patent number: 10084252
    Abstract: An electrical connector includes: an insulating body; multiple terminals, each terminal having a contact portion and at least one clamping portion forming a clamping space; and multiple solder posts, each being correspondingly placed in the clamping space. The solder post has a foundation post and a protruding portion extending upward from the foundation post. The clamping portion clamps the foundation post in the clamping space. A width of the protruding portion is smaller than a width of the foundation post. The foundation post is cylindrical. A height of the solder post is greater than a diameter of the foundation post. The solder posts are arranged more densely on the insulating body. When the electrical connector and a circuit board are together placed into a reflow oven, hot gas flows around the protruding portion more easily, and a contact area between the hot gas and the protruding portion is larger.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: September 25, 2018
    Assignee: LOTES CO., LTD
    Inventors: Ted Ju, Zuo Feng Jin
  • Patent number: 10062982
    Abstract: An electrical connector for electrically connecting a chip module to a circuit board includes an insulating body having stopping portions, terminals and solder balls. Each stopping portion is located above the solder balls, and has a bottom surface coated with an adhesive. Each terminal includes a connecting portion and two clamping portions extending and bending from two opposite sides of the connecting portion along a horizontal direction. The solder balls are in contact with the terminals and the circuit board, and each corresponds to one of the stopping portions, is adhered to the stopping portion via the adhesive, and is clamped by the two clamping portions and the connecting portion, or by the two clamping portions and the insulating body.
    Type: Grant
    Filed: September 7, 2017
    Date of Patent: August 28, 2018
    Assignee: LOTES CO., LTD
    Inventor: Ted Ju
  • Patent number: 10009582
    Abstract: A pipe inspection system includes a cable storage drum and a housing configured to removably receive and rotatably support the cable storage drum. A push-cable with a plurality of conductors is stored in the cable storage drum. A camera head is connected to a distal end of the push-cable. A slip-ring assembly has first and second mating portions that when mated provide conductive paths between the plurality of conductors at a proximal end of the push-capable and a display device. The first portion of the slip-ring assembly is mounted on the housing and the second portion of the slip-ring assembly is mounted on the removable cable storage drum. The system connection cable joining the inspection system with a display unit is removable and may be replaced with cables compatible with various alternate image display systems.
    Type: Grant
    Filed: February 12, 2010
    Date of Patent: June 26, 2018
    Assignee: SEESOON, INC.
    Inventors: Mark S. Olsson, Eric M. Chapman, Dawn E. Shaffer, Loni M. Canepa, James F. Kleyn, Lisa E. Latimer
  • Patent number: 9933589
    Abstract: A lens assembly includes a lens holder and a lens barrel that are coaxial and integrated in a unity, a cavity is defined therein to receive at least one lens, at least three guiding legs are extended from a bottom of the lens holder, and the guiding legs define a plane that is parallel to an installation plane of the lens. It can achieve an accurate optical axis alignment between the lens and the image sensor, reduce total assembly tolerances of the camera module thereby improving imaging quality, and reduce manufacturing cost to benefit the popularization in industries.
    Type: Grant
    Filed: August 16, 2016
    Date of Patent: April 3, 2018
    Assignee: SAE MAGNETICS (H.K.) LTD.
    Inventors: Chi Wai Lo, Sidney Shen Kuang Chou, Yiu Sing Ho, Fen Yan Li, Xin Tao Lang, Gui Ming Wei
  • Patent number: 9921672
    Abstract: A first electronic device includes a display unit, a first conductive unit and a processing circuit. The first conductive unit is configured for transmitting a first signal to a second conductive unit of a second electronic device when the first conductive unit is in proximity with the second conductive unit. The processing circuit is configured for providing the first signal to the conductive unit. The first conductive unit includes a transmitting electrode and a receiving electrode.
    Type: Grant
    Filed: October 31, 2014
    Date of Patent: March 20, 2018
    Assignee: MEDIATEK INC.
    Inventor: Yu-Han Lin
  • Patent number: 9591766
    Abstract: A device interconnection system uses an indexed carrier to locate an array of contacts on an array of solder pads on a printed circuit board. In an embodiment, the PCB is indexed to a device housing in the same manner that it is indexed to the carrier, allowing the array of contacts to match and protrude through an array of holes in the housing. In a further embodiment, the housing is substantially metallic, and the array of holes in the housing are located in an insulating plate formed in the housing.
    Type: Grant
    Filed: February 24, 2015
    Date of Patent: March 7, 2017
    Assignee: Motorola Mobility LLC
    Inventors: Michael J Lombardi, Joseph L Allore, Natalie J Stevens
  • Patent number: 9332659
    Abstract: An electronic component case includes a lower case including a bottom plate, a aide wall having a protruding portion, an engaging projection formed on an outer face of the side wall, and a screw hole formed in the side wall in a region where the protruding portion is provided, and an upper case including a top plate, a side wall in which an engaging hole is formed, and a notched hole forced in the side wall on the top plate side. The protruding portion of the lower case is engaged to the notched hole of the upper case, and the screw hole is exposed in the notched hole. The engaging projection of the lower case is engaged in the engaging hole of the upper case.
    Type: Grant
    Filed: September 4, 2014
    Date of Patent: May 3, 2016
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Minshong Tan, Syuzo Aoki, Takuya Oda
  • Patent number: 9282649
    Abstract: An apparatus may be provided. The apparatus may comprise a substrate and a circuit board. A ball grid array structure may be disposed between the substrate and the circuit board. In addition, a stand-off structure may be disposed between the substrate and the circuit board. The stand-off structure may be adjacent to the ball grid array structure.
    Type: Grant
    Filed: October 8, 2013
    Date of Patent: March 8, 2016
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Shih Fung Perng, Weidong Xie, Nguyet-Anh Nguyen
  • Patent number: 9265170
    Abstract: Embodiments related to integrated circuit (IC) connectors are described. In some embodiments, an IC assembly may include an IC package substrate, an intermediate member, and a male connector. The IC package substrate may have first signal contacts on a top or bottom surface, and the bottom surface may have second signal contacts for coupling with a socket on a circuit board. The intermediate member may have a first end coupled to the first signal contacts and a second end extending beyond the side surface. The male connector may be disposed at the second end of the intermediate member, and may have signal contacts coupled to the signal contacts of the intermediate member. The male connector may be mateable with a female connector when the female connector is brought into engagement in a direction parallel to the axis of the intermediate member. Other embodiments may be disclosed and/or claimed.
    Type: Grant
    Filed: October 28, 2013
    Date of Patent: February 16, 2016
    Assignee: Intel Corporation
    Inventors: Rajasekaran Swaminathan, Ram S. Viswanath, Sanka Ganesan, Gaurav Chawla, Joshua D. Heppner, Jeffory L. Smalley, Vijaykumar Krithivasan, David J. Llapitan, Neal E. Ulen, Donald T. Tran
  • Patent number: 8998623
    Abstract: An electrical connector assembly includes an insulating housing having a number of housing segments, a number of contacts received in the housing segments, a number of caps covering on the housing segments respectively and a number of clips assembled on the caps. Each of the caps includes a retaining mechanism defining an arm for operating by a user and a latch engaging the housing segment. Each of the clips is assembled on the arms of at least two caps so as to operate two caps together.
    Type: Grant
    Filed: October 16, 2013
    Date of Patent: April 7, 2015
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Shuo-Hsiu Hsu
  • Patent number: 8956191
    Abstract: Provided is a connector comprising a plurality of rows of contacts and minimized in a front-rear direction. A first contact 30 positioned in an upper-row has a special shape constituted by a held portion 32 held by a housing 20, a connection portion 33 extending in a width direction from a rear end of the held portion 32, a first bent portion 35 extending from a front end of the connection portion 33 and being bent downward, and a first contact portion 36 extending downward from the first bent portion 35. A second contact 40 positioned in a lower-row has an L-shape. A second contact portion 44 of the second contact 40 is positioned obliquely rearward of the first contact portion 36 of the first contact 30.
    Type: Grant
    Filed: May 6, 2013
    Date of Patent: February 17, 2015
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventors: Toshihiro Oka, Nobuhiro Ogawa, Shigeyasu Kitamura
  • Patent number: 8915746
    Abstract: A connector component for operably coupling a removable integrated circuit component such as a Micro SIMâ„¢, to a host PCB is provided. The connector component is configured to fit within an aperture formed within the host PCB and houses the removable integrated circuit component within an internal cavity. The connector component includes a coupling portion configured for coupling to the top face of the host PCB, and a port for insertion and removal of the removable integrated circuit component which is exposed within the bottom face of the host PCB. The connector component may be made flush with the bottom face of the host PCB, and the host PCB may optionally be populated on one side only.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: December 23, 2014
    Assignee: Sierra Wireless
    Inventors: Bruce Richard John Samuels, Edwin Sy Liu
  • Patent number: 8880917
    Abstract: Methods, systems, and devices are disclosed for producing and delivering packetized power within a DC computing environment. Within the DC computing environment a power requirement or request is communicated to a power router. The power router then determines a power source capable of fulfilling the power requirement and then causes the power to be delivered in packetized form. The packetized power is appended to a message header which allows the power packet to be received by the requesting device.
    Type: Grant
    Filed: August 27, 2013
    Date of Patent: November 4, 2014
    Assignee: AT&T Intellectual Property I, L.P.
    Inventors: Barrett Kreiner, Jonathan Reeves
  • Patent number: 8879260
    Abstract: The memory module comprises a circuit board with a first and a second side, wherein memory chips are arranged at least on the first side. A longitudinally extending module heat conductor is arranged on the first side. The module heat conductor comprises a contact surface configured to contact a heat transfer system.
    Type: Grant
    Filed: August 7, 2012
    Date of Patent: November 4, 2014
    Assignee: Qimonda AG
    Inventors: Sven Kalms, Christian Weiss
  • Patent number: 8837162
    Abstract: Various circuit board sockets and methods of manufacturing and using the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a socket that is operable to receive a circuit board. The socket includes a surface for seating a first portion of a circuit board, a floor and a first support structure projecting away from the floor to support a second portion of the circuit board. The support structure includes a plurality of nested frames.
    Type: Grant
    Filed: May 6, 2010
    Date of Patent: September 16, 2014
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Stephen Heng, Mahesh S. Hardikar
  • Patent number: 8834184
    Abstract: In some embodiments an Integrated Circuit package includes a plurality of system functional pins, at least one system functional pin depopulation zone, and at least one non-system functional pin located in the at least one functional pin depopulation zone. Other embodiments are described and claimed.
    Type: Grant
    Filed: May 10, 2012
    Date of Patent: September 16, 2014
    Assignee: Intel Corporation
    Inventors: Mark B. Trobough, Christopher S. Baldwin
  • Patent number: 8747123
    Abstract: An apparatus is described for burn-in and/or functional testing of microelectronic circuits of unsingulated wafers. A large number of power, ground, and signal connections can be made to a large number of contacts on a wafer. The apparatus has a cartridge that allows for fanning-in of electric paths. A distribution board has a plurality of interfaces that are strategically positioned to provide a dense configuration. The interfaces are connected through flexible attachments to an array of first connector modules. Each one of the first connector modules can be independently connected to a respective one of a plurality of second connector modules, thereby reducing stresses on a frame of the apparatus. Further features include for example a piston that allows for tight control of forces exerted by terminals onto contacts of a wafer.
    Type: Grant
    Filed: December 5, 2013
    Date of Patent: June 10, 2014
    Assignee: Aehr Test Systems
    Inventors: Donald P. Richmond, II, Kenneth W. Deboe, Frank O. Uher, Jovan Jovanovic, Scott E. Lindsey, Thomas T. Maenner, Patrick M. Shepherd, Jeffrey L. Tyson, Mark C. Carbone, Paul W. Burke, Doan D. Cao, James F. Tomic, Long V. Vu
  • Patent number: 8710858
    Abstract: Methods and structures for testing a microelectronic packaging structure/device are described. Those methods may include placing a device in a floating carrier, wherein the floating carrier is coupled to a socket housing by pin dowels disposed in four corners of the socket housing, and wherein at least two actuating motors are disposed within the socket housing, and micro adjusting the device by utilizing a capacitive coupled or a fiber optic alignment system wherein a maximum measured capacitance or maximum measured intensity between alignment structures disposed in the socket housing and alignment package balls disposed within the device indicate optimal alignment of the device. Methods further include methods for active co-planarity detection through the use of a capacitive-coupled techniques.
    Type: Grant
    Filed: September 23, 2010
    Date of Patent: April 29, 2014
    Assignee: Intel Corporation
    Inventors: Abram M Detofsky, Todd P Albertson, David Shia
  • Patent number: 8698305
    Abstract: A multi-configuration interface device for coupling different types of GPUs (graphics processor units) to a PCB (printed circuit board). The interface device comprises a GPU interface for a connection to the GPU and a PCB interface for a connection to the PCB. The GPU interface is implemented using a customizable attachment footprint for effectuating a connection to differing GPU types while maintaining the PCB interface for the connection to the PCB. The ball array for different GPUs can be configured to respectively support them. The interface device maintains a consistent PCB interface. Thus, as GPU characteristics change and evolve, or as different GPU versions are implemented, a consistent connection can be maintained for the PCB.
    Type: Grant
    Filed: August 4, 2004
    Date of Patent: April 15, 2014
    Assignee: Nvidia Corporation
    Inventors: Thomas E. Dewey, James K. Dobbins, Joseph S. Minacapelli, Simon A. Thomas
  • Patent number: 8628336
    Abstract: An apparatus is described for burn-in and/or functional testing of microelectronic circuits of unsingulated wafers. A large number of power, ground, and signal connections can be made to a large number of contacts on a wafer. The apparatus has a cartridge that allows for fanning-in of electric paths. A distribution board has a plurality of interfaces that are strategically positioned to provide a dense configuration. The interfaces are connected through flexible attachments to an array of first connector modules. Each one of the first connector modules can be independently connected to a respective one of a plurality of second connector modules, thereby reducing stresses on a frame of the apparatus. Further features include for example a piston that allows for tight control of forces exerted by terminals onto contacts of a wafer.
    Type: Grant
    Filed: July 11, 2013
    Date of Patent: January 14, 2014
    Assignee: Aehr Test Systems
    Inventors: Donald P. Richmond, II, Kenneth W. Deboe, Frank O. Uher, Jovan Jovanovic, Scott E. Lindsey, Thomas T. Maenner, Patrick M. Shepherd, Jeffrey L. Tyson, Mark C. Carbone, Paul W. Burke, Doan D. Cao, James F. Tomic, Long V. Vu
  • Patent number: 8587947
    Abstract: According to one aspect of the present invention, there is provided a heat spreader to be mounted on an IC package, the IC package including: a circuit board; an IC chip mounted on one surface of the circuit board; and a plurality of connection terminals formed on the other surface of the circuit board, the heat spreader including: a top wall formed into a rectangular shape; a circumferential wall formed continuously from the top wall, the circumferential wall and the top wall defining a block-like cavity for enclosing the IC chip when the heat spreader is mounted on the IC package; and ear portions formed at lengthwise central portions of a facing pair of side walls of the circumferential wall so to extend outwardly from bottom edges of the facing pair of side walls, respectively.
    Type: Grant
    Filed: November 2, 2011
    Date of Patent: November 19, 2013
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventor: Masahiro Yonemochi
  • Publication number: 20130288492
    Abstract: Sockets that provide easy access for users to change cards while allowing the use of thinner device enclosures. One example provides a socket having two positions. When the socket is in an open state, the card may be oriented in a direction substantially away from the main logic board. When the socket is in a closed state, the card moves such that it is oriented at least closer to being in parallel to the main logic board.
    Type: Application
    Filed: October 22, 2012
    Publication date: October 31, 2013
    Inventors: Paul J. Hack, Joshua Funamura, George V. Anastas, Zheng Gao, Gregory A. Springer, Erik James Shahoian
  • Patent number: 8522057
    Abstract: Methods, systems, and devices are disclosed for producing and delivering packetized power within a DC computing environment. Within the DC computing environment a power requirement or request is communicated to a power router. The power router then determines a power source capable of fulfilling the power requirement and then causes the power to be delivered in packetized form. The packetized power is appended to a message header which allows the power packet to be received by the requesting device.
    Type: Grant
    Filed: September 7, 2012
    Date of Patent: August 27, 2013
    Assignee: AT&T Intellectual Property I, L.P.
    Inventors: Barrett Kreiner, Jonathan Reeves
  • Publication number: 20130171843
    Abstract: A bus bar distributes power to a plurality of electronic components supported on a printed circuit board. One embodiment of the bus bar comprises a plurality of compressible contact pads made from an electronically conductive polymer, spaced along the bus bar for contacting conductive contacts that are coupled to a power domain or individual electronic component. The pads may be secured to the bus bar and the conductive traces using an electronically conductive epoxy adhesive. Rivets may then be used to secure the bus bar to the printed circuit board and compress the pads, which conform to the printed circuit board to make a reliable electrical connection with the conductive traces. The bus bar further comprises a plurality of current sense points disposed adjacent to the pads for measuring the amount of current provided to each power domain.
    Type: Application
    Filed: December 30, 2011
    Publication date: July 4, 2013
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Jamaica L. Barnette, Raymond M. Clemo
  • Patent number: 8449306
    Abstract: The present invention relates to a contact terminal unit and a socket connector incorporated with the same contact terminal units. The contact terminal units each comprises a bottom piece and a top piece. The bottom pieces comprise a base portion and a number of clips extending upwardly from the base portion and the top piece is clamped by the clips such that upward movement of the top piece is limited by the bottom piece. The socket connector is incorporated with a plurality of the same contact terminal units.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: May 28, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Alex Lon An
  • Patent number: 8441275
    Abstract: An electronic device test fixture deploys a plurality of contact elements in a dielectric housing. The plumb arrangement of contact elements each include an armature or transversal configured to first depress and then slide laterally when urged downward by the external contacts of a device under test. The rotary movement of the transversal is optimized via the configuration of a surrounding forked regulator such that surface oxide deposition on the external device under test terminal is disrupted to reliably minimize contact resistance without damaging or unduly stressing the electrical junction of the device under test.
    Type: Grant
    Filed: January 13, 2011
    Date of Patent: May 14, 2013
    Assignee: Tapt Interconnect, LLC
    Inventor: Patrick J Alladio
  • Patent number: 8388365
    Abstract: Provided is a socket which protects an upper surface of a semiconductor device from being scratched due to contact, by using a latch plate. A socket (10) includes a base member (20), a cover member (30) that reciprocates in a direction to be close to or separated from the base member (20), a plurality of contacts (40), an adaptor (50) that moves in a direction to be close to or separated from the base member and provides a surface for placing a semiconductor package, a latch member (60) that rotationally shifts with reciprocation of the cover member (30), and a latch plate (70) connected to the latch member (60). The latch plate (70) prevents the leading edge of the latch member (60) from being directly brought into contact with a Ball Grid Array (BGA), and presses down the BGA placed on the adaptor (50) in the vertical direction.
    Type: Grant
    Filed: November 18, 2008
    Date of Patent: March 5, 2013
    Inventors: Hideyuki Takahashi, Kiyokazu Ikeya
  • Patent number: 8388357
    Abstract: An apparatus is described for burn-in and/or functional testing of microelectronic circuits of unsingulated wafers. A large number of power, ground, and signal connections can be made to a large number of contacts on a wafer. The apparatus has a cartridge that allows for fanning-in of electric paths. A distribution board has a plurality of interfaces that are strategically positioned to provide a dense configuration. The interfaces are connected through flexible attachments to an array of first connector modules. Each one of the first connector modules can be independently connected to a respective one of a plurality of second connector modules, thereby reducing stresses on a frame of the apparatus. Further features include for example a piston that allows for tight control of forces exerted by terminals onto contacts of a wafer.
    Type: Grant
    Filed: January 18, 2012
    Date of Patent: March 5, 2013
    Assignee: Aehr Test Systems
    Inventors: Donald P. Richmond, II, Kenneth W. Deboe, Frank O. Uher, Jovan Jovanovic, Scott E. Lindsey, Thomas T. Maenner, Patrick M. Shepherd, Jeffrey L. Tyson, Mark C. Carbone, Paul W. Burke, Doan D. Cao, James F. Tomic, Long V. Vu
  • Patent number: 8366453
    Abstract: An electrical contact used in an electrical connector adapted for electrically connecting with an integrated circuit (IC) package and a printed circuit board is provided. Each contact comprises a base section, an upper resilient arm and a lower elastic arm extending from two opposite ends of the base section, respectively. The electrical connector comprises an insulative housing and a plurality of contacts retained in the insulative housing. The insulative housing includes a mating surface, a mounting surface, and a plurality of contact passageways passing through the mating surface and the mounting surface. The lower elastic arm of the contact at least partially projects below the mounting surface of the insulative housing. The lower elastic arm includes a first resisting portion for guiding the contact to be inserted into a via of the printed circuit board and resisting against inner wall of the via of the printed circuit board.
    Type: Grant
    Filed: November 12, 2010
    Date of Patent: February 5, 2013
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Yen-Chih Chang, Ke-Hao Chen, Jia-Hau Liu
  • Patent number: 8297986
    Abstract: Various sockets for packaged integrated circuits and methods of making the same are provided. In one aspect, a method of mounting a semiconductor chip is provided that includes providing a package that has a base substrate with a first side and a second side opposite the first side. The second side has a central region. The package includes a semiconductor chip and a lid coupled to the first side. A socket is provided for receiving the base substrate. The socket includes a mound that projects toward the second side of the base substrate when the base substrate is seated in the socket to provide support for the central region of the base substrate. The package is mounted in the socket. The mound provides support for the central region of the base substrate.
    Type: Grant
    Filed: March 16, 2007
    Date of Patent: October 30, 2012
    Assignee: GLOBALFOUNDRIES Inc.
    Inventors: Seah Sun Too, Raj N. Master, Jacquana Diep, Mohammad Khan
  • Patent number: 8286006
    Abstract: Methods, systems, and devices are disclosed for producing and delivering packetized power within a DC computing environment. Within the DC computing environment a power requirement or request is communicated to a power router. The power router then determines a power source capable of fulfilling the power requirement and then causes the power to be delivered in packetized form. The packetized power is appended to a message header which allows the power packet to be received by the requesting device.
    Type: Grant
    Filed: January 29, 2008
    Date of Patent: October 9, 2012
    Assignee: AT&T Intellectual Property I, LP
    Inventors: Barrett Kreiner, Jonathan Reeves
  • Patent number: 8263879
    Abstract: A contact structure and assembly and a method for manufacturing the same for a microelectronics device includes first and second electrically conductive contacts being helically shaped. A carrier element is attached to and positioned between the first and second contacts. The first and second contacts are in electrical communication with each other, and the first and second contacts are in a mirror image relationship with each other. A pair of insulating substrates each include electrically conductive members. A contact point on each of the first and second contacts is attached and electrically communicating to respective electrically conductive members such that the first and second electrically conductive contacts between the pair of insulating substrates form an electrically conductive package. A metal layer on the carrier element provides electrical conductivity through a first opening defined by the carrier element between the first and second portions of the helix shaped contact.
    Type: Grant
    Filed: November 6, 2009
    Date of Patent: September 11, 2012
    Assignee: International Business Machines Corporation
    Inventors: Gareth Hougham, Gerard McVicker, Xiaoxiong Gu, Sung K. Kang, Frank R. Libsch, Xiao H. Liu
  • Patent number: 8238101
    Abstract: The memory module comprises a circuit board with a first and a second side, wherein memory chips are arranged at least on the first side. A longitudinally extending module heat conductor is arranged on the first side. The module heat conductor comprises a contact surface configured to contact a heat transfer system.
    Type: Grant
    Filed: August 29, 2008
    Date of Patent: August 7, 2012
    Assignee: Qimonda AG
    Inventors: Sven Kalms, Christian Weiss
  • Patent number: 8202101
    Abstract: An electrical connector includes an insulative housing, at lease one contact mounted to the insulative housing and a fusible element mounted to the contact. The contact includes a body portion and a mounting portion extending from the body portion. The mounting portion includes a support portion and first and second tails bent from the support portion along opposite directions in order to form a discrete receiving slot. The first and the second tails are substantially perpendicular to the body portion. The fusible element is received in the receiving slot and is in line with the body portion of the contact for reliable fixation.
    Type: Grant
    Filed: August 5, 2010
    Date of Patent: June 19, 2012
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Terrence B Zimmerman, David W Clark
  • Patent number: 8199519
    Abstract: A chip adapter used to install a chip on a first chip arranging area of a circuit board includes a board. The size of the board has the same size as the first chip arranging area of the circuit board. Edges of the chip adapter define a number of gaps corresponding to first pads of the circuit board. A second chip arranging area of the same size as the chip is arranged in a center of the chip adapter. A number of second pads are arranged around the second chip arranging area of the chip adapter corresponding to pins of the chip. Each second pad is electrically connected to a sidewall of the corresponding gap of the chip adapter.
    Type: Grant
    Filed: April 30, 2010
    Date of Patent: June 12, 2012
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Ming-Chih Hsieh, Heng-Chen Kuo
  • Patent number: 8172581
    Abstract: An electrical connector for electrically connecting a circuit processing unit (CPU) with a number of soldering balls to a print circuit board (PCB) comprises a first body having a plurality of bottom holes, a second body mounted on the first body and having a plurality of upper holes, a plurality of terminals located between the first body and the second body, and a number of fusible members holed by the terminals. Each terminal includes a planar horizontal base portion, a plurality of upper hands and lower legs respectively bent upwardly and downwardly from the base portion, and a plurality of holding portions extending from the base portion in a horizontal direction. The upper hands received in the upper holes can hold the soldering balls. The lower legs received in the bottom holes can hold the fusible members and be soldered to the PCB through the fusible members.
    Type: Grant
    Filed: September 29, 2010
    Date of Patent: May 8, 2012
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Cheng-Chi Yeh
  • Patent number: 8118603
    Abstract: An electrical connector includes an insulting main body having a plurality of receiving holes, and a plurality of pins located in the receiving holes. Each pin has a base portion, a welding portion and a flexible arm. The flexible arm has a first bend portion bent and extended upwards from the base portion, a second bend portion bended from the first bend portion, a first yield space above the second bend portion, a third bend portion bent slantedly and extended upwards from the second bend portion and a second yield space below the third bend portion. A contact portion is located at the end of the flexible arm. Due to the pin structure with the first yield space and the second yield space, the two flexible arms will not easily contact each other to prevent the short circuit problem or the interference problem from occurring.
    Type: Grant
    Filed: March 11, 2010
    Date of Patent: February 21, 2012
    Assignee: Lotes Co., Ltd.
    Inventor: Chien Chih Ho
  • Patent number: 8118604
    Abstract: A socket connector (100) adapted for electrically connecting an integrated circuit (IC) package comprises an insulative housing (1) comprising a plurality of passageways (101) extending therethrough, a plurality of terminal units (2) received in the passageways (101), the terminal units (2) each comprises an insulated elastomer (21) acting as a resilient portion and an electrical element (22) received in the insulated elastomer (21), the electrical element (22) comprises a first contact portion (221) and a second contact portion (222) extending out of the insulated elastomer (21) and sandwiching the insulated elastomer (21) therebetween.
    Type: Grant
    Filed: May 6, 2010
    Date of Patent: February 21, 2012
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Hao-Yun Ma
  • Patent number: 8105093
    Abstract: An exemplary socket assembly includes a circuit plate and a socket mounted on the circuit plate for fixing an IC. The socket includes a first fixing member and a second fixing member. The first fixing member includes installed portions, elastic connecting portions, and a first buckling portion, the elastic connecting portions interconnects the electric portions and the first buckling portion. The second fixing member includes electric portions, elastic connecting portions, and a second buckling portion, and the elastic connecting portions interconnect the electric portions and the second buckling portion.
    Type: Grant
    Filed: November 19, 2010
    Date of Patent: January 31, 2012
    Assignees: Innocom Technology (Shenzhen) Co., Ltd., Chimei Innolux Corporation
    Inventors: Xue-Feng Zhang, Feng-Hao Ku, Yu-Feng Xia
  • Patent number: 8092231
    Abstract: A socket for an electric component provided with a plurality of contact pins in a socket body. The contact pin each have a lower contact part that is electrically conductive with a contact point on a substrate, an upper contact part that contacts the terminal of the electric component when pressure is applied, and an upper spring part that is located between the lower contact part and the upper contact part, that is elastically deformed when pressure is applied, and that, by its elasticity, presses the upper contact part against the terminal. The contact pins are each formed in such a shape that the location of the contact point with respect to the terminal does not change when pressure is applied and the upper contact part is rotated about the contact point (contact projection) of the upper contact part and the terminal.
    Type: Grant
    Filed: September 28, 2010
    Date of Patent: January 10, 2012
    Assignee: Enplas Corporation
    Inventor: Satoru Suzuki
  • Patent number: 8079849
    Abstract: A socket connector assembly includes a housing, signal terminals, and a power module subassembly. The housing is mounted to a circuit board and includes opposing walls having internal surfaces. The signal terminals are joined to the internal surfaces of the walls and engage conductive members disposed along side edges of an electronic package that is received into the housing between the walls. The power module subassembly is coupled to the circuit board between the walls of the housing. The power module subassembly includes a power contact configured to engage a current carrying conductor disposed on a surface of the electronic package that extends between the side edges of the electronic package.
    Type: Grant
    Filed: May 11, 2010
    Date of Patent: December 20, 2011
    Assignee: Tyco Electronics Corporation
    Inventors: Alan Robert MacDougall, Robert Daniel Hilty
  • Patent number: 8052452
    Abstract: An electrical socket comprises an insulative housing, a stiffener defined around the insulative housing, a load plate and a load lever. The housing defines two supporting portions at two opposite sides, each of said supporting portions defining a mounting portion in a middle portion thereof. The stiffener comprises a first side, a second side opposite to the first side, a third side and a fourth side opposite to the third side, the third, fourth sides defined corresponding to the two supporting portions of the housing respectively and with an engaging portion engageable with the mounting portion, each of said third, fourth sides formed with an upwardly curved configuration at a middle portion thereof for supporting the supporting portion. The two supporting portions seat on the third, fourth sides respectively, thus making a gap formed between the supporting portions and opposite end of corresponding sides respectively.
    Type: Grant
    Filed: November 25, 2009
    Date of Patent: November 8, 2011
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Cheng-Chi Yeh, Jia-Hau Liu
  • Publication number: 20110223781
    Abstract: An electrical connector includes an insulting main body having a plurality of receiving holes, and a plurality of pins located in the receiving holes. Each pin has a base portion, a welding portion and a flexible arm. The flexible arm has a first bend portion bent and extended upwards from the base portion, a second bend portion bended from the first bend portion, a first yield space above the second bend portion, a third bend portion bent slantedly and extended upwards from the second bend portion and a second yield space below the third bend portion. A contact portion is located at the end of the flexible arm. Due to the pin structure with the first yield space and the second yield space, the two flexible arms will not easily contact each other to prevent the short circuit problem or the interference problem from occurring.
    Type: Application
    Filed: March 11, 2010
    Publication date: September 15, 2011
    Inventor: CHIEN CHIH HO
  • Patent number: 8009437
    Abstract: The present disclosure generally pertains to wireless communication modules that can be used for enabling wireless communication in various applications. A wireless communication module in accordance with one embodiment may be interfaced with other devices, such as nodes of a wireless sensor network (WSN). The module has rows of male integrated circuit (IC) pins that may be interfaced with female pin receptacles of another device. The module receives wireless signals and provides the data of such wireless signals to the other device. The module also receives data from the other devices and packetizes such data for wireless communication.
    Type: Grant
    Filed: May 2, 2008
    Date of Patent: August 30, 2011
    Assignee: Synapse Wireless, Inc.
    Inventors: Gary W. Shelton, Terry G. Phillips, Thomas J. Watson