Abstract: A contactor assembly for a testing system is disclosed. The assembly includes a contact having a contact tail and a housing having a top surface and a bottom surface. A slot extends through the housing from the top surface to the bottom surface and defines a first inner side wall of the housing and a first inner end wall. The contact is receivable in the slot. The contact tail includes a sloped terminus. A retainer is disposed on the first inner side wall. When the sloped terminus is engaged with the first inner end wall, at least a portion of the retainer overlaps with the contact forming at an overlapping area in a cross-sectional view, thereby preventing removal of the contact from the top side of the housing.

Abstract: A storage device attachment and detachment structure comprising a holding member configured to hold a storage device with a storage medium, and a pressure member including a biasing portion that has an end portion connected to the holding member, the biasing portion being configured to contact the storage device to press the storage device in a biasing direction toward the holding member, the pressure member being movable to a pressure release position in which the pressure member is separated from the storage device in an opposite direction of the biasing direction to release pressure relative to the storage device.

Abstract: A test carrier carried in a state of accommodating a device under test (DUT) includes: a carrier body that holds the DUT; and a lid member that covers the DUT and is attached to the carrier body. The carrier body has contactors provided to correspond to terminals of the DUT, external terminals electrically connected to the contactors, and a first through-hole for positioning that is provided to face the DUT. The first through-hole penetrates the carrier body so that a part of the DUT is seen from an outside through the first through-hole.

Abstract: An electrical contactor includes: an installing portion; a base end portion extending continuously toward the installing portion; a plurality of arm portions extending from the base end portion in a longitudinal direction; a coupling portion coupled to the tip of each of the arm portions; a pedestal portion provided continuously toward the coupling portion; and a contact portion provided at a lower end of the pedestal portion, wherein each of the plurality of arm portions elastically supports the contact portion in contact with a first contact target, and a curved portion is provided on the coupling portion side or the base end portion side of a closest-to-contact-portion arm portion that is the closest to the contact portion among the plurality of arm portions.

Abstract: An object of the present disclosure is to make it possible to improve electrical inspection of an object to be inspected by making the conduction characteristics of the electrical signal flowing through an electrical contactor better. An electrical contactor according to the present disclosure includes: a pedestal portion having, at a lower end thereof, a contact portion that comes into contact with a first contact target of an object to be inspected; a base end portion extending continuously toward an installing portion that comes into contact with a second contact target of a substrate electrically connected to an inspection device side; and at least three or more arm portions provided between the base end portion and the pedestal portion, each of the at least three or more arm portions having one end supported by the base end portion and another end coupled to the pedestal portion to elastically support the contact portion.

Abstract: The present invention provides a semiconductor element test device comprising a base whereon a semiconductor element for testing is to be placed and having a cover pivot shaft on one side thereof, a cover in which one side is coupled to the cover pivot shaft so as to be capable of hinge rotation, a movable latch installed on the other side of the base, and a cover latch installed on the other side of the cover so that a portion of the cover latch is coupled to the movable latch to allow the cover to be in a closed state, wherein the cover latch has a step formed on the coupling portion with the movable latch to adjust a gap between the cover and the base in a state where the cover is closed, thereby enabling the test of semiconductor elements having different heights.

Abstract: A connector connecting a main circuit board and a sub circuit board has two bases, two electrical contacting sets, two resilient bar sets and two mounting brackets. The bases are mounted on the main circuit board. The electrical contacting sets are mounted respectively in the bases and each electrical contacting set has multiple electrical contacting elements. The resilient bar sets are mounted respectively on the bases. The mounting brackets are mounted respectively on the bases and cover the electrical contacting sets and the resilient bar sets. Circuit-board-receiving channels are defined between the bases and the mounting brackets for receiving the sub circuit board such that combination of the main circuit board and the sub circuit board are parallel and flat.

Abstract: A probe conducts testing of a circuit. The probe includes a base coupled to a substrate. The probe also includes a cantilever attached to the base at a first end, the cantilever deflecting from a first position to a second position in which a second end opposite the first end is in contact with the substrate and to move between the second position and the first position based on movement of a compliant bump of the circuit, and a probe tip attached to the cantilever at the second end, the probe tip maintaining contact with the compliant bump of the circuit.

Abstract: A random access memory (RAM) memory module has a compact form factor and is removable from a corresponding socket assembly to allow easy replacement of the memory module or reconfiguration of the memory module during development of an electronic device that includes the memory module.

Abstract: A lightweight radio/CD player for vehicular application includes a case and frontal interface formed of polymer based material molded to provide details to accept audio devices and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips.

Abstract: Provided is a connector comprising a plurality of rows of contacts and minimized in a front-rear direction. A first contact 30 positioned in an upper-row has a special shape constituted by a held portion 32 held by a housing 20, a connection portion 33 extending in a width direction from a rear end of the held portion 32, a first bent portion 35 extending from a front end of the connection portion 33 and being bent downward, and a first contact portion 36 extending downward from the first bent portion 35. A second contact 40 positioned in a lower-row has an L-shape. A second contact portion 44 of the second contact 40 is positioned obliquely rearward of the first contact portion 36 of the first contact 30.

Abstract: An electronic device test fixture deploys a plurality of contact elements in a dielectric housing. The plumb arrangement of contact elements each include an armature or transversal configured to first depress and then slide laterally when urged downward by the external contacts of a device under test. The rotary movement of the transversal is optimized via the configuration of a surrounding forked regulator such that surface oxide deposition on the external device under test terminal is disrupted to reliably minimize contact resistance without damaging or unduly stressing the electrical junction of the device under test.

Abstract: The present description relates to the field of microelectronic device retention mechanisms and, more particularly, to a quick release retention mechanism including a base plate, a load plate and a biasing mechanism adapted to apply a desired load and to allow rapid insertion and extraction of microelectronic devices from sockets.

Abstract: A circuit board includes a foil circuit provided on a synthetic resin plate formed by injection molding, made of a copper foil, and having a pattern different for the circuit board. Anchor pins projecting upward are provided on the resin plate and passed through pinholes made in the foil circuit. The foil circuit is positioned and secured to the resin plate. In a required portion of the resin plate, a terminal insertion hole is provided, and a receiving terminal is secured to the required portion of the terminal insertion hole and connected to the foil circuit.

Abstract: An electrical connection includes a first electrical contact made of electrically conductive material. The first electrical contact is formed with a depression therein. Also included are a deformable pad, having a Young's modulus of less than 1,000,000 psi, which bears on the first contact; and a second electrical contact, made of electrically conductive material, which contacts the first electrical contact and is at least partially received into the depression. The deformable pad at least partially causes at least one lateral force on the first electrical contact, so as to induce the first electrical contact to make an electrical connection with the second electrical contact. An array of such contacts is also contemplated, as is an array of cantilevered contacts, which may or may not have depressions, and which are supported by at least one elastomeric pad, having a Young's modulus of less 72,500 psi.

Abstract: An electrical connector (100) electrically connects a chip of a first width. The electrical connector includes an insulative housing (2), a number of contacts (3), a connecting member (4), and an actuator (5) mounted on the insulative housing. The connecting member has a connecting region electrically connectable with the chip. The connecting region has a second width not less than the first width. The actuator is formed with a pair of first side walls (51) and a pair of restricting portions (514) respectively protruding inwardly from the pair of first side walls. The pair of restricting portions are spaced a distance substantially equal to the second width to guidingly restrict the chip in the connecting region.

Abstract: A connection base assembly for an IC testing apparatus has a base, a top cap and a conductive assembly. The base has a bottom board and an outer frame provided with multiple grooves. The grooves are defined in the top of and extend to the bottom of the outer frame to form multiple through holes in the bottom of the outer frame. The conductive assembly is mounted between the base and the top cap and has multiple conductive elements, multiple top resilient elements and multiple bottom resilient elements. The conductive elements are mounted respectively in the grooves in the outer frame of the base, and each conductive element has a contacting segment and a connecting segment. The top resilient elements and the bottom resilient elements are respectively mounted on and abut with the tops and the bottoms of the conductive elements.

Abstract: A circuit board with a simple structure is manufactured. A circuit board 19 has thereon a foil circuit 21 provided on a synthetic resin plate 20 formed by injection molding, made of a copper foil, and having a pattern different for circuit board 19. Anchor pins 20a projecting upward are provided on the resin plate 20 and passed through pinholes made in the foil circuit 21. The foil circuit 21 are positioned and secured to the resin plate 20. In a required portion of the resin plate 20, a terminal insertion hole 20c is provided, and receiving terminal 22 is secured to the required portion of the terminal insertion hole 20c and connected to the foil circuit 21.

Abstract: An IC socket for receiving an IC package comprises a socket body for carrying the IC package. A plurality of contacts are received in the socket body for electrical connection with the IC package. A driving member is mounted upon the socket body and able to operate between an upper position and a lower position. At least one latch device comprises an upper section, a lower section parallel to the upper section and a regulator. The regular links the upper section and the lower section and force the lower section to move relative to the upper section.

Abstract: An electrical connecting apparatus comprises a housing having a first recess extending in a first direction in a horizontal plane, opened downward, and having at least a backside inward surface and a plurality of slits spaced in the first direction and extending in a second direction intersecting the first direction in the horizontal plane, a plurality of contacts each arranged in the housing in a state of extending inside the slit from within the first recess and electrically connecting a conductive portion provided on a board to an electrode of a device under test, and a probe holder arranged in the first recess. The backside inward surface of the first recess includes an inclined portion inclined to both the horizontal plane and a vertical plane vertical to it in a state of being further to the front side towards the upper side, and each contact abuts on the inclined portion at least at part of the back end. Thus, slip of the contact against the conductive portion is reduced.

Abstract: A contact and a connecting apparatus are provided to enable miniaturization and shortening and cost reduction in response to further miniaturization and finer pitch of inspection objects. The contact is one electrically for contacting a terminal of a wire and includes a one-side plunger portion, an other-side plunger portion, and an elastic deformation portion provided between the plunger portions. The elastic deformation portion is made of an annular and conductive elastic member integrally connected to the one-side plunger portion and the other-side plunger portion. The plurally arranged elastic deformation portions are disposed in a zigzag shape in the up-down direction with their adjacent heights different from each other. The connecting apparatus includes the plurality of contacts electrically contacting terminals disposed on an inspection object and a contact plate for integrally supporting the respective contacts to make the contacts contact with the respective terminals of the inspection object.

Abstract: An improved test socket for use in testing integrated circuits. The test socket includes a housing having one or more slots formed therein. Contacts can be received within respective slots and maintained therein with rear ends of the contacts in engagement with traces on a load board. Mounting is accomplished by means of a pair of elastomers, and the elastomers maintain each contact such that, when the front end of a contact is engaged by the lead or pad of the device to be tested and urged into its corresponding slot, an arcuate surface at a rear end of each contact rolls across its corresponding trace with virtually no translational or rotational sliding.

Abstract: A socket can be used for testing an integrated circuit package having a plurality of rows of leads. The socket includes a base that is aligned with a circuit board having a plurality of contact pads. A plurality of rows of contact fingers are electrically coupled to the plurality of contact pads, each of the plurality of rows of contact fingers for engaging a corresponding one of the plurality of rows of leads in response to a retention force applied to the integrated circuit package. Each of the contact finger has a cantilevered end that is supported by a supporting force generated by an elastic contact in response to the retention force.

Abstract: An IC socket for receiving an IC package comprises a socket body for carrying the IC package. A plurality of contacts are received in the socket body for electrical connection with the IC package. A driving member is mounted upon the socket body and able to operate between an upper position and a lower position. At least one latch device comprises an upper section, a lower section parallel to the upper section and a regulator. The regular links the upper section and the lower section and force the lower section to move relative to the upper section.

Abstract: A socket for mounting an electronic component that can connect an electronic component always in a correct orientation is provided. Socket-side engaging parts (9) are provided at a plurality of places of a peripheral wall (3) of a socket housing (5) having an electronic component accommodating part (4) that is surrounded by the peripheral wall (3) raised from the four side parts of a quadrangle-shape bottom plate (2). The socket-side engaging parts (9) include elastic fixing pieces whose fixing protrusions (9a) at the tip ends are locked in the bottom parts of respective locking recessed parts of the peripheral wall of the electronic component (6). An electronic component is held in the electronic component accommodating part (4) by these socket-side engaging parts (9).

Abstract: An electrical connector, for electrically connecting an IC package to a printed circuit board, includes an insulative housing and a number of terminals received in the insulative housing. The insulative housing has a base portion and four peripheral walls extending upwardly from the base portion. The insulative housing has four corners and three of the four corners have a latching portion extending inwardly from a top end of corresponding corner, respectively, and the rest one corner is formed with an indentation. The latching portion guides and resists the IC package in the insulative housing. Thus, the latching portions of the connector are molded easily.

Abstract: An improved test socket for use in testing integrated circuits. The test socket includes a housing having one or more slots formed therein. Contacts can be received within respective slots and maintained therein with rear ends of the contacts in engagement with traces on a load board. Mounting is accomplished by means of a pair of elastomers, and the elastomers maintain each contact such that, when the front end of a contact is engaged by the lead or pad of the device to be tested and urged into its corresponding slot, an arcuate surface at a rear end of each contact rolls across its corresponding trace with virtually no translational or rotational sliding.

Abstract: A mounting device for a heat sink includes a basis and a pair of operating bodies. Two pair of supporting members are provided on opposite sides of the basis. The operating body includes a pole connecting the supporting members, a pivot member pivotably attached to the pole, and at least a spring member encircling the pole. The pivot member includes a pressing portion adapted for pressing the heat sink. One end of the spring member is fixed on one of the supporting members, and the other end of the spring member is secured with the pivot member. The pivot member is pivotable from a first position to a second position under action of a force and returns back to the first position from the second position under action of the spring member after withdrawing the force.

Abstract: An electrical connector includes a socket and a plug. In the socket, plural first connectors are provided in parallel, and substantially U-shaped press-fitting portions are assembled so as to cross over opening edge portions of a socket body. In the plug, plural second connectors are provided in parallel, and substantially U-shaped press-fitting portions are assembled so as to cross over opening edge portions of a plug body. The plug body has a planar shape which can be fitted in the opening edge portions of the socket body. Particularly, a free end portion of the press-fitting portion of the second connector located in the opening edge portion of the plug body is engaged with a position regulating recess formed in a bottom surface of the plug body.

Abstract: An improved test socket for use in testing integrated circuits. The test socket includes a housing having one or more slots formed therein. Contacts can be received within respective slots and maintained therein with rear ends of the contacts in engagement with traces on a load board. Mounting is accomplished by means of a pair of elastomers, and the elastomers maintain each contact such that, when the front end of a contact is engaged by the lead or pad of the device to be tested and urged into its corresponding slot, an arcuate surface at a rear end of each contact rolls across its corresponding trace with virtually no translational or rotational sliding.

Abstract: A manufacture process of a connector includes six steps of: (1) providing an insulating body; (2) providing a shelter with at least one slot; (3) the shelter being covered on the insulating body; (4) a metal pellet passing through the slot being plated with the insulating body to form a metal layer with a specific shape by a method of a physical plating membrane; (5) putting the insulating body into chemical liquid so that the metal layer of the insulating body being plated with at least one metal layer for protecting; and (6) taking the shelter off. Comparing to the prior art, the manufacture process of the connector uses a method of plating membrane to form a metal layer having the same function as a conductive terminal. By the method, the elastic contact portion can be installed on the two ends of the pressing contact connector.

Abstract: A socket connector (100) includes an insulative housing (1) and a frame (3). The housing defines a mating interface (101), a mounting interface (102) opposite to the mating interface and periphery faces between the mating interface and the mounting interface. The frame has an opening (31) therein to accommodate the housing. At least one retaining device (11) includes a stopper portion (111) and a resilient claw portion (113) unitarily formed on the periphery face of the housing. One face of the frame is supported by the stopper portion and the opposite face is abutted against by the resilient claw potion while the housing is assembled in the opening of the frame.

Abstract: A test assembly for testing electrical performance of microcircuits contained in leadless packages has Kelvin contacts. Slider contacts in a plurality of contact assemblies slide compliantly to accommodate lack of coplanarity in terminals on the package. A resilient elastomeric block may be inserted through interior spaces of the contact assembly and in interfering relation with features of a housing that supports and aligns the contact assemblies, to apply force to the slider contacts to force them against the microcircuit terminals.

Abstract: A two-point contact type socket makes an electric contact with a terminal of an electronic component. A first contact piece is to be brought into contact with a first side of the terminal of the electronic component. A second contract piece is to be brought into contact with a second side opposite to the first side of the terminal of the electronic component. The second contact piece is formed of a linear conductor. The first contact piece has a portion to be brought into contact with the second contact piece when the second contact piece is in contact with the terminal of the electronic component.

Abstract: A socket for an electric component is provided with a socket main body having a part for accommodating an electric component and a plurality of first contact pins, and a socket covering vertically movably mounted to the socket main body. A second contact pin is attached to the socket main body, and a pressing member provided for the socket main body. A retaining part extends from a lower end part of a contacting part and an elastic part extends in a direction opposite to the retaining part. The retaining part is subjected to application of a pressing force exerted by a pressing member.

Abstract: A load board for packaged IC testing. The load board with predetermined testing circuit thereon has bonding pad areas on its surface. A plurality of bonding pads is formed on the bonding pad areas, each of which is disposed corresponding to a lead of a packaged IC for testing connection, such as a quad flat packaged IC (QFP), a dual inline packaged IC (DIP) or a small outline packaged IC (SOP). The bonding pads on the load board connect the leads of the testing IC directly during IC testing, thus the conventional test socket between a conventional load board and a packaged IC is omitted.

Abstract: The present invention provides a module connector including a housing having four sidewalls that define a chamber for receiving a module therein. Each sidewall defines a plurality of contact recesses. A plurality of contacts is accommodated in the contact recesses and electrically contact with the module. A pivotal cover has a top pressing cover, at least a pivotal arm and at least a locking claw extending downwardly from the top pressing cover. The pivotal arm pivotally mounts the pivotal cover on the housing to enable the pivotal cover to pivot between an open position to enable the module to be inserted in the chamber and a closed position with the top pressing cover pressing downwardly on the top of the module to prevent the module from being pulled out. The locking claw latches the pivotal cover in the closed position.

Abstract: A test assembly for testing electrical performance of microcircuits contained in leadless packages has Kelvin contacts. Slider contacts in a plurality of contact assemblies slide compliantly to accommodate lack of coplanarity in terminals on the package. A resilient elastomeric block may be inserted through interior spaces of the contact assembly and in interfering relation with features of a housing that supports and aligns the contact assemblies, to apply force to the slider contacts to force them against the microcircuit terminals.

Abstract: A method for connecting electronic components, such as, an integrated circuit die and a package substrate, is described. According to one aspect of the invention, a contact pad protective material is applied on one or more of the contact pads on an integrated circuit die. The underfill material is applied to the surface of the die not covered by the contact pad protective material and the underfill material is partially cured in a curing oven. The contact pad material is removed leaving openings over the respective surface of the contact pad. A one or more contacts on a package substrate is inserted into the openings, electronically connecting the contacts to the contact pads.

Abstract: An electronic part-mounting socket includes a socket housing, and contacts The socket housing has contact receiving grooves formed at a bottom plate portion of an electronic part-receiving portion. The contact of an integral construction includes a fixing piece portion, a terminal piece portion laterally bent at a lower end of the fixing piece portion, a first bent-back portion formed by bending back a distal end portion of the terminal piece portion into a U-shape, an intermediate spring piece portion extending laterally from the first bent-back portion, a second bent-back portion formed by bending back a distal end portion of the intermediate spring piece portion into a U-shape, and a resilient contact piece portion extending continuously from the second bent-back portion in an upwardly-slanting manner. The fixing piece portions are inserted respectively in contact fixing holes, formed in the socket housing in an upward-downward direction, and are fixed thereto.

Abstract: An electrical contact is provided that includes a body configured to be held on a circuit board. The body of the contact is movable relative to the circuit board along at least a first axis of motion. The contact includes a contact portion joined with the body that is configured to engage an electrical component. The contact portion may include one or more contact beams. The contact further includes a termination lead joined to the body and having an outer end that is configured to be soldered to the circuit board. The termination lead extends from the body at an acute or right angle to the first axis of motion. The termination lead flexes about an arcuate path as the body of the contact shifts along the first axis of motion with respect to the circuit board.

Abstract: A socket (1) for accommodating and testing a component (2) having several electrical connectors (3) is disclosed, which socket comprises a substantially rectangular frame (4) surrounding a space (5), which frame (4) includes a first row (6) and a second row (7) of electric conductors (8) which are arranged opposite one another, which conductors (8) have first section (9) with a terminal (10) extending into space (5) for contacting an electric connector (3) of the component (2), and a second section (11) projecting from the frame (4). The spacing (12) between the terminals (10) in each row (6, 7) is adjustable. In the method of testing a component (2) in the socket (1), the spacing (12) between the terminals (10) in each row (6, 7) is adjusted to establish electrical contact between the electrical connectors (3) of the component (2) and its corresponding terminal (10) by placing the component (2) in the socket (1).

Abstract: A socket for testing integrated circuit has opposite cantilever probing pads hinged at the far ends of the cantilevers to a circuit board. The leads of the IC are pressed over the free nearer ends of the cantilevers. Cushions are inserted under the two free nearer ends of the cantilevers to absorb in the pressure of the IC leads. For in-line lead IC packages, a common cushion can be used for each line of leads. Metallic pedestals can be mounted on the between the nearer ends of the cantilever and touching the IC under test for heat sinking and common ground. The pedestals can be inserted through the circuit board from a base plate at the bottom of the circuit board.

Abstract: A discrete circuit component having an up-right circuit die with lateral electrical connections. The component comprises a substrate having a pair of electrically conductive traces, and a circuit die is planted between the pair of consecutive traces, wherein one electrode of the circuit die on the surface thereof vertical to the substrate is electrically bonded to one of the conductive trace immediately next thereto, while the other electrode of the circuit die on the opposite surface thereof vertical to the substrate is electrically bonded to the other of the pair of conductive traces immediately next thereto. A body of electrical insulation material hermetically seals the circuit die, and a pair of surface electrodes formed on the surface of the body of insulation material are each electrically connected to the corresponding one of the pair of electrically conductive traces extending from the circuit die.

Abstract: The present invention provides bumpless ultrasonic bonding of flexible wiring board pieces. A metal coating 26 is formed on the surface of a contact region 181 of a metal wiring 28 of each of two flexible wiring board pieces 10, 30 and ultrasonic wave is individually applied by an ultrasonic resonator 45 to the contact regions 181 in contact with each other. The metal coatings 26 are bonded to form a multilayer flexible wiring board 50. The bumpless process eliminates any plating step for forming bumps without being influenced by non-uniformity bump height. A thermoplastic resin film 33 may be formed on the surface of one flexible wiring board piece 30 to bond flexible wiring board pieces 10, 30 by the adhesion of the resin film 33.

Abstract: A multifunctional electronic instrument includes a body of the electronic instrument, an operation display unit movably provided on the body of the electronic instrument, and a ground structure as an electric contact structure, which includes a parallel part and a contact spring piece. The parallel part includes an electrically conductive base material and an electrically insulating surface layer formed on surfaces of both sides of the base material, and is attached to a movable member that moves together with the operation display unit. The parallel part is provided with a projection. At an end of the projection, the base material is exposed in a ruptured part where the surface layer is ruptured. The ruptured part is provided with an electric contact. The contact spring piece comes in contact with the electric contact. The base material of the parallel part and the contact spring piece are electrically connected to each other.

Abstract: A socket for testing integrated circuit has opposite cantilever probing pads hinged at the far ends of the cantilevers to a circuit board. The leads of the IC are pressed over the free nearer ends of the cantilevers. Cushions are inserted under the two free nearer ends of the cantilevers to absorb in the pressure of the IC leads. For in-line lead IC packages, a common cushion can be used for each line of leads. Metallic pedestals can be mounted on the between the nearer ends of the cantilever and touching the IC under test for heat sinking and common ground. The pedestals can be inserted through the circuit board from a base plate at the bottom of the circuit board.

Abstract: An apparatus for mounting a semiconductor device to a circuit board for testing is disclosed. The semiconductor device includes semiconductor circuitry and leads to connect the semiconductor circuitry to the circuit board. Additionally, the semiconductor device is decapped so that at least a portion of the semiconductor circuitry is exposed. The apparatus includes a frame and a fastener. The frame is adapted to mate with the semiconductor device, and forms an opening for accessing the semiconductor circuitry and an edge surface for receiving the semiconductor device. The fastener is connected with the frame for removably connecting the frame to the circuit board. By using a frame instead of a socket, the distance to the semiconductor device once the device is mounted to the circuit board, and particularly the top side of the semiconductor device, can be reduced so that the device may be tested using a probe.

Abstract: The present invention provides a land grid array (LGA) connector that is formed from a plurality of sections. Specifically, each LGA section includes at least one set of fingers. Each set of fingers interconnects with a set of fingers of another section to form the LGA connector. By forming the LGA connector in this manner a maximum quantity of input/output (I/O) contacts can be provided.

Abstract: An integrated circuit socket includes one or more cavities formed in a top surface of the socket, where the one or more cavities are formed in a region over which an integrated circuit can be placed. Multiple conductive contacts are attached to the socket, where each contact includes a first member that extends into one of the cavities, and a second member that provides at least part of a conductive path between the first member and the socket. The first member at least partially holds in place a discrete device inserted into the cavity. An integrated circuit package or interposer attached to the top surface over the cavity also can at least partially hold the discrete device in place. The first member makes electrical contact with the discrete device, thus completing a conductive path between the discrete device and the integrated circuit.