Abstract: An electrical connector assembly is provided for releasable electrical connection of a high density memory module to a circuit board. An electrical connector assembly includes a base having an array of apertures extending therethrough for registration with both the contact pads of the memory module and of the circuit board. Resilient terminal assemblies are mounted in each of the apertures of the base. Each terminal assembly includes an electrically conductive terminal exposed at both ends of the terminal assembly and with a connection extending therebetween. The contacts and the connection of the terminal may be stamped and formed from a unitary strip of conductive metal. The terminal is insert molded in elastomeric material dimensioned to be frictionally retained in a corresponding aperture of the base.

Abstract: The contacts extending from the four sides of a flat-pack are releasably held against corresponding contacts extending from the sides of a socket for the flat-pack, by means of a cover comprising four arms pivotally mounted on the socket each near one of its four corners; by pivoting the arms downwardly against the tops of the flat-pack contacts, these contacts are pressed against, and held in positive contact with, the underlying socket contacts, and by pivoting the arms upwardly, the flat-pack can be released for removal and subsequent replacement. In addition, the cover is usefully mounted in position on the flat-pack even when the flat-pack is free of the socket, in which use it serves to protect the leads of the flat-pack in handling and during storage, for example.

Abstract: A socket for mounting an electrical part 30 in a freely detachable manner in which the electrical part 30 has a plurality of terminal leads 30a of a prescribed pitch P between the leads 30a has socket terminals 52 fixed in the socket and flexible electroconductive parts 38 corresponding to the pitch of the terminal leads on an insulating substrate 40 for making electrical contact with the terminal leads 30a of the electrical part 30 and the fixed socket terminals 52.

Abstract: An IC socket includes a socket board having a plurality of contacts, and an IC platform vertically movably disposed on the socket board and adapted to support thereon an IC having a plurality of leads projecting sidewards from a body thereof so as to be contacted with the contacts. Inclined wall surfaces are formed at both ends of a row of the contacts and are adapted to guide the leads onto vertical wall surfaces formed at lower ends of the inclined wall surfaces. To this end, the contacts at the ends of the row are guided onto the vertical wall surfaces by the inclined wall surfaces when the IC platform with the IC body supported thereon is lowered, so that the leads are brought into contact with the contacts.

Abstract: There is provided a mounting arrangement for an integrated circuit chip carrier 7. The carrier 7 is retained in a holder 5 using the lateral forces created by the interference between leads 12 of the carrier and the walls 17 of the holder 5. A lid 6 is applied to the carrier 5 and leaf springs 3 are disposed in between. The lid 6 clips on to a circuit board 8 by virtue of barbed legs 4 and holes 11. The springs 3 urge the leads 12 against contact pads 9 on the circuit board 8.

Abstract: A concave portion is formed on a surface of a connector body, and each end of first contact terminals and each end of second contact terminals are extended respectively to mutually opposite walls of the concave portion. When a countermeasure against EMI is necessary, an array which contains filters is fitted to the concave portion to insert the filters between the first contact terminals and the second contact terminals. When the countermeasure against EMI is not necessary, a conductive array which contains conductive lines is fitted to the concave portion instead of the filter array.

Abstract: A test socket for testing of semiconductor devices. The socket includes a plurality of electrical contacts mounted within a housing, a cover, and a pressure applicator which serve to prolong test life of the contacts. The pressure applicator is mounted to the cover by use of an elastomeric element which compliantly holds the applicator to the cover. The socket construction, thereby, serves to prevent damage to leads of an integrated circuit device held by the socket.

Abstract: An IC socket comprising a plurality of partition walls disposed along an IC platform and contacts which are to be brought into pressure contact with leads of an IC package mounted on the IC platform, the contacts being inserted into corresponding slits formed between adjacent the partition walls so that the contacts are orderly arranged with respect to the leads of the IC package, a foremost end face of each of the leads of the IC package being restricted by wall surfaces of a pair of adjacent partition walls for isolating the slits so that the leads are correctly positioned.

Abstract: A semiconductor chip test jig for testing a chip 10 with "gull-wing" leads 11 comprises a body 20 and a cover 30. The body 20 has sets of fins or combs 23 which engage with the leads 11 to locate the chip 10 in the horizontal plane; the cover 30 has a set of "knife-edge" lead supports 35 formed to match a trim and form jig in the region of the leads 11 from where they emerge from the encapsulation of the chip 10 to their first bends; and the body 20 has a set of spring-loaded pins 24 which contact the leads opposite the lead supports.

Abstract: A contact pin having a thin wall construction that makes good electrical connection with an IC socket without insulation due to oxide film forming on the surface of the lead and which does not easily break due to plastic deformation. An IC socket has a feature to prevent an IC device position from deviating and deforming its leads which can automatically position the IC device for secure contact with contact pins of an IC frame having leads by limited positioning of the IC device on a stage.

Abstract: The invention relates to an IC socket, and more particularly an IC socket comprising a socket base plate having contacts on which the IC lead wires of the mounted IC are mounted and contacted, a pushing cover to be closed against the socket base plate through IC, and a pushing member for pressing the IC lead wires against the contacts in response to the closing operation of the pushing cover. Means for making a positive prevention of the displacements of the pushing positions of the IC lead wires by the pushing member is provided, that is, the pushing cover is rotatably supported on the socket base plate, the pushing member is supported on the socket base plate separate from the pushing cover and the pivoting shaft is supported in a longitudinal hole extending in a vertical direction and the pushing cover can be rotated and moved up and down vertically.

Abstract: In a connector having a group of contacts arrayed at narrow pitches on a base member, a contact fixture device is formed separately from the base member forming a connector body. The contact fixture device is provided with retaining claws adapted to secure the fixture device to the base member. The contact fixture device is further provided with a presser portion disposed across a group of seat elements of the group of contacts. The presser portion is laid across the group of seat elements to urge the group of seat elements against a surface of the base member when the fixture device is secured to the base member with the retaining claws. In this manner, the group of contacts can be arrayed on the base member.

Abstract: An improved contact for use in a high density chip carrier socket mounted on a circuit member which utilizes a cover which to wedge the leads of the chip carrier into electrical engagement with a respective contact. A tool receiving recess is incorporated into the contact so that the forces exerted on the socket while pressing the cover into place can be opposed, minimizing the forces exerted on the connection between the socket and the circuit member, typically a solder joint. Providing a tool, that operates from one side of the circuit member, in order to press the cover into place while engaging the contact recess to oppose the insertion related forces, which can also pull the cover from the contacts, without exerting significant forces on the connection, by engaging a lip in the cover while pressing on the carrier.

Abstract: An insulating layer is formed on at least one side surface of a spring portion of a contact, and a contacting portion formed on the spring portion is made narrower than the thickness of the spring portion, and a contacting surface of the contacting portion spaced from an edge portion of the insulating layer inwardly of the side surfaces of the spring portion.

Abstract: An apparatus and method for facilitating the installation and removal of standard surface mount clock oscillator modules. A clock oscillator module socket is disclosed which can be mounted on a printed circuit board in the standard recommended land pattern for surface mount clock modules which will provide for easy installation of the clock module and easy removal of the module either for maintenance or for general replacement by a clock of different speed.

Abstract: An IC socket which can be used commonly in IC packages whose outer leads are different from each other. A receiving base having a stepped bottom surface on which an IC package is placed is movably disposed in a first hole of a main body portion of the IC socket. A sliding member having a stepped top surface is brought into abutment with the stepped bottom surface of the receiving base and is movably disposed in a second hole of the main body portion. By sliding the sliding member, the height of the receiving base can be changed in steps in accordance with the stepped bottom surface, making it possible to change the height of the receiving base according to the shape of the outer leads of an IC package placed on the receiving base.

Abstract: A contact of an electric part socket has a first spring portion, a second spring portion spaced apart from the first spring portion but connected to it at both basal and distal ends thereof, a terminal portion leading to the connecting portion between the basal ends and adapted to be brought into contact with a wiring board or the like, and a contact portion formed on the connecting portion between the distal ends and adapted to be brought into contact with a terminal of an electric part to be engaged on it. The first and second spring portions are flexed about the connecting portion between the basal ends in order to displace the contact portion downward. The contact portion is pressure contacted with the terminal of the electric part mounted on it by reaction of the first and second spring portions.

Abstract: Insulating sheets 7 are interposed between adjacent electric contactors 1, and the electric contactors 1 group are integrally formed by being covered with an insulating block 6. A contact portion 2a of each electric contactor 1 is exposed from the insulating block 6.

Abstract: A Demountable Tape-Automated Bonding System for providing connections to a chip is disclosed. The chip is attached to or is held in place on a TAB frame that includes a generally flexible dielectric film which bears a pattern of conductive traces. A multitude of closely-spaced contacts which protrude downward from the chip contact the conductive traces on the TAB frame. The chip may be maintained in its proper location on the TAB frame by either a bonding agent or by compressive forces supplied by a cap which is fastened to the TAB frame and to a substrate, such as a printed circuit board, below the TAB frame. The substrate carries an array of conductive traces around the edges of the substrate. These traces match the traces on the TAB frame. The conductor traces on the TAB frame and on the substrate are held in contact with each other by compressive forces supplied by the cap which is fastened to the TAB frame and to the substrate.

Abstract: A burn-in socket for integrated circuit chips has a clamping means actuated by a thermally-reactive resilient means, operative during the burn-in cycle itself, such that the chip frames are retained and good electrical contact with the chip leads is maintained during burn-in.

Abstract: A lead frame for mounting a circuit component includes plural terminal legs for connection with a circuit. At least two of the terminal legs have pads for connection with the circuit component which has wire leads. The lead frame pads and wire leads are of materials which are incompatible for welding. A rivet of a material compatible for welding with the component lead wires is mounted in the pad of each terminal leg for connection with the circuit element. A weld secures each component lead wire with one of the rivets.

Abstract: A one-piece electronic module assembly is formed from a substantially rectangular baseplate on which an insulating film is mounted to carry circuit components. An enclosed assembly is completed by initially providing a pair of major bend axes across the baseplate, and forming inwardly extending notches at selected locations along lengthwise edges of the baseplate. The baseplate is bent at the notches to form a front wall, a pair of sidewalls and tabs that overlap the sidewalls. The baseplate is then bent over on itself along the major bend axes and sealed, if necessary, to form a completed assembly.

Abstract: A system for protecting a gull-wing IC providing a carrier (5) that mates to a programming socket (21) and to a development socket (40). The IC need not be removed from carrier throughout the handling, test/burn-in, programming, and final assembly on the PC board. Moreover, the footprint of the output electrical contacts on the development socket match the footprint of the IC leads, so that the etched PC board pads will accept the IC leads or the development socket output contacts, wherein the assembler may mount the IC using the carrier and the SMT socket or not.

Abstract: An electrical socket includes a base having a generally central reception area which can receive an electronic device having leads extending to a peripheral region of the reception area. Multiple pressure members are fixed with respect to the base in a manner permitting movement between open and closed positions. Each of the pressure members has a pressure applying portion which is disposed in the peripheral region when the pressure member is in the closed position and is disposed outwardly of the peripheral region when the pressure member is in the open position. A circuit carrying member having conductive traces extends to within the peripheral region. Springs engage the pressure members when in the closed position and bias the pressure applying portions toward the traces, whereby the electrical leads can extend under the pressure applying portions and be urged by biasing forces against the traces.

Abstract: Each contactor 5 is implanted in an insulating substrate 1 at an inclination angle, and its contacting portion 6 is diagonally moved along the inclined axis of movement to accumulate a contacting pressure with respect to an electric part terminal 4.

Abstract: Contacting nose portions (5) and positioning knob portions (7) are formed side by side on contacting elements (4) of contacts (2) respectively. A positioning member (8) is disposed across the contacting elements (4) group. By inserting the positioning knob portions (7) into the positioning holes 9 formed in the positioning member (8) respectively, the adjacent contacting elements (4) and the adjacent contacting nose portions (5) can be isolated, and relative position can be obtained.

Abstract: An IC card connector is provided for connecting an IC card having a terminal array to external equipment. The connector includes a base member having a plurality of electrically conductive contacts exposed on one side of the base member for engaging the terminal array of the IC card. A cover is hinged to the base member for movement toward and away from the one side of the base member. The cover has a receptacle for securing the IC card thereon for movement therewith, whereby closing of the cover onto the base member effects engagement of the IC card terminal array with the contacts on the cover.

Abstract: A pivot shaft member 8 is disposed at a central portion of an IC platform 2, and a pivotal operation portion disposed at a head portion of the shaft member 8 is exposed on an upper surface side of the IC platform 2. The shaft member 8 and the IC platform 2 or a socket board 1 are connected with each other by cam means. The IC platform 2 is guided between a higher position and a lower position by a pivotal operation of the pivot shaft member 8 in order to adjust an IC supporting height.

Abstract: A mount-to-contact type contact has a stationary terminal 1, a swinging contact element 3 swingably supported by the stationary terminal 1, and a spring 10 adapted to resiliently hold one swinging end 7 of the swinging contact element 3, the other swinging end 8 serving as a contact end on which a terminal 9 of an electric part 6 is to be mounted to achieve a contact relation.

Abstract: An IC socket structure suitable for supporting a surface-mount type of IC (integrated circuit) package includes an IC socket having electrical contacts disposed in corresponding relation to pins of the IC package, the electrical contacts being elastically held, a printed board on which a peripheral circuit associated with the IC package is disposed, the printed board having lands disposed in locations corresponding to the respective pins of the IC package and electrically connected to the peripheral circuit, and a lid having a projection and covering the IC socket. The lid fixes the IC package in such a manner that the printed board and the pins of the IC package are pressed in contact with each other between the electrical contacts of the IC socket and the projection of the lid with the pins of the IC package maintained in electrical contact with the lands of the printed board.

Abstract: A device for controlling transmittance of light therethrough includes first and second transparent substrates which are spaced from each other. The first substrate has at an end portion thereof a notch. First and second transparent electrode layers are respectively coated on inner surfaces of the first and second substrates for defining a space therebetween. The first layer is partially cut off so as to conform to a periphery of said notch. An electro-optically responsive material substantially fills up the space. The material is made so as to allow transmittance of light therethrough to change in response to voltages applied between the first and second layers. A terminal is received in said notch and said space, and is sized so as to be biased against the first substrate and the second layer so as to ensure an electrical contact between the terminal and the second layer.

Abstract: A radial lead type electronic component includes a couple of plate-type lead terminals projecting from a protective resin member in the same direction. These lead terminals are provided with inclined edges, which make the body portions gradually narrowed toward leg portions, in leg-side edges of body portions. Among inclined edges, inclinations .theta..sub.1 of the outer ones with respect to the leg-projecting direction are greater than inclinations .theta..sub.2 of the inner ones with respect to the same direction. Thus, the electronic component is relieved from stresses which are applied thereto upon insertion in a printed circuit board or a cut-and-clinch operation.

Abstract: An electronic module assembly (31) is provided by assembling components (17) to a planar polyimide flex circuit film (14) laminated to an aluminum rigidizer plate (11). The flex circuit film and rigidizer are then bent by a sheet metal bending process such that the rigidizer plate forms an exterior protective housing and the components are provided in an interior space (30). Connector pins (23) provide external electrical access to the components and circuit patterns (15, 16, 19) on the film (14). Structures (24, 25, 29) mate with the bent plate and substantially enclose the interior space. Module cost is reduced since the existing flex circuit rigidizer plate is used to form part of the module housing, and economical planar component assembly techniques are utilized while eliminating the step of mounting the flex circuit rigidizer plate to an external module housing. Two techniques for using a mandrel shaft (26, 35) to bend the plate (11) without stressing the film (14) are disclosed.

Abstract: A hybrid printed circuit board that has at least one circuit device thereon and has leads mounted on at least one outside edge of the board. The hybrid printed circuit board also has a lead-free area within the lead disposing outside edge of the board that reduces the mounting space necessary for the board.

Abstract: An IC socket has an IC supporting platform upwardly resiliently held on a socket body for vertical movement and adapted to contact with contacts held by the socket body, and an anchoring member for anchoring the IC supporting platform to the socket body against the resiliently holding force. The anchoring member is loosely engaged with the supporting platform at a central portion of the IC supporting platform. The IC supporting platform is playably anchored at the loosely engaging portion.

Abstract: An adapter is interposed between a device having a pattern of pins projecting therefrom and a PCB having contacts connected to various components. The body of the adapter is made of platable dielectric material and is formed with holes corresponding to the pattern of pins of the device and also along one or more edges with pads corresponding in number to the holes. The holes are plated with conductive material which may be used to establish electrical contact with the pins; however, preferably clips are installed in each hole and in electrical contact therewith, the clips having converging fingers which frictionally engage the pins and also electrically contact the same. Electrically conductive traces are located on the body, each having a first end connected to the plating of a hole and a second end leading to one of the pads. The traces may be formed by a plate and etch process similar to that used in PCB fabrication.

Abstract: A socket comprises a housing member having a recess for receiving an electronic package therein, the housing member supporting a plurality of contact members for making contact with respective leads of the electronic package. A cover is pivotally mounted on the housing member for covering the electronic package received in the recess and for holding the electronic package therein under pressure. An adapter is provided for receipt in the housing member, the adapter having means for receiving and aligning the leads of the electronic package in a preferred pattern. The adapter has an opening therein arranged to communicate with the electronic package in assembly. The cover is made of aluminum or other good thermally conductive material and includes a recessed portion projecting inwardly through the adapter opening for making contact with the electronic package. As such, in assembly, heat generated by the electronic package is effectively released through the cover.

Abstract: An IC socket including a socket board having a plurality of contacts on which an IC is to be placed, an IC pressing cover open- and closeably pivotally connected to the socket board, and an IC loading table with the IC loaded thereon, the table being disposed on the socket board and adapted to facilitate a proper contact between the IC and the contacts, the IC socket further including a positioning projection of a generally V-shape formed on the side of the IC pressing cover and a positioning valley of a generally V-shape formed on the side of the IC loading table, the projection and valley being disposed in such a manner as to be corresponded to each other, the generally V-shaped positioning projection being held into the generally V-shaped valley when the IC pressing cover is closed, so that a relative position of the IC pressing cover can be maintained with respect to the IC loading table and IC.

Abstract: A modular socket for an integrated circuit package, wherein a single base is adapted to receive a plurality of replaceable contact modules having a variety of conductive lead counts. The modularity permits tooling of a single base to accommodate a variety of integrated circuit packages.The socket includes a lid pivotally connected to the base by a hinge and hinge pin. The hinge pin defines a pivot axis which is in a plane with the bottom surface of the lid to limit lateral movement on the contacts carried by the module.

Abstract: A contact pin aligned in an IC socket body can be made by stamping, the pin comprising a base, a connecting terminal, a first contacting piece provided at the corresponding position to said connecting terminal and having a slanted or vertical contacting face, a second contacting piece connected to said base through a spring part, and a contacting face to make a conductive contact with the other face. The second contacting face can instead be angular to make a linear contact.

Abstract: A contact module and method for making a connector for socketing an IC chip carrier is disclosed. The contact module comprised a relatively short body containing a plurality of contacts arranged on a standard center to center spacing, and a locking member. A positioning plate is fabricated having features, such as holes, along its edges for receiving other features, such as projections, formed in the contact modules. A number of the contact modules are assembled to the positioning plate to correspond to a particular chip carrier configuration. The plate and contact modules are then aligned with the pads of a substrate and terminal portions of the contacts are then soldered to the pads. The positioning plate is then removed. The chip carrier is then placed in the connector formed by the contact modules and a locking member inserted into each contact module for contacting the chip carrier leads.

Abstract: A contact has a contact nose adapted to contact a terminal of an electric part, and a resilient supporting element adapted to elastically support the contact nose. The nose and supporting element are continuously formed with a predetermined angle defined therebetween such that a continuously formed portion between the nose and supporting element serves as a pressure contact portion for contacting with a conductive member of another electric part under pressure. The supporting element is displaced with the pressure contact portion serving as a supporting point and the contact nose is resiliently displaced.

Abstract: A patterned structure including a plurality of patterned sheet members which have respective configurations and which are partially superposed on each other and which cooperate with each other to define a plurality of voids. At least one of the sheet members includes a thin-walled portion whose thickness is smaller than a thickness of the other portion. The thin-walled portion is formed by etching the appropriate sheet member or members. The thin-walled portion of one sheet member engages the corresponding thin-walled portion or the other portion of the other sheet member or members.

Abstract: A contact equipped with a bypass element has a contact portion element at one end of a warped element and a male terminal at the other end thereof. The contact comprises a bypass element disposed within the warped element. One end of the bypass element is formed of a rigid portion element and the other end thereof is formed of an elastic portion element. An area at a connecting portion between the rigid portion element and the elastic portion element and a free end of the rigid portion element are contacted with the inner surface between one end and the other end of the warped element to short the circuit between the contact portion element and the male terminal. A free end of the elastic portion element is abutted against an inner surface on the warped side of the warped element in order to elastically support the rigid portion element.

Abstract: A high density probe for probing an integrated circuit package in situ on a circuit board has a probe body with a skirt that has alignment surfaces for mating with the package to provide an initial alignment. An alignment plate is elastically mounted within the probe housing internal of the skirt. The alignment plate has serrations between pin holes, the pin holes corresponding to probe pins elastically mounted on the probe housing in a pattern matching the leads of the integrated circuit package. When the probe is pressed down over the integrated circuit package the alignment surfaces within the skirt align the probe to the package, and the serrations mesh with the leads to align the probe pins with the leads, the probe pins extending through the pin holes and maintaining positive contact due to the elastic mounting of the pins.

Abstract: An apparatus for surface mounting an integrated circuit package onto a printed circuit board. Cantilever beams from a housing member extend inwardly toward a central opening and reside upon portion of the lead making contact to the printed circuit board. A tightening of the housing member onto the circuit board by retaining means causes the cantilever beam to provide a downward force to maintain lead contact to the electrical contact, as well as a sideward force for retaining the integrated circuit stationary.

Abstract: A contact has a leg portion at one end and a resilient contact element at the other end. The resilient contact element is provided with a mother contact nose, on which an external terminal of an electronic part is to be placed, formed on its free end. A child contact nose is loosely engaged with an outer surface of the mother contact nose so that the child contact nose can be idly moved, and the child contact nose has a contacting surface larger than that of the mother contact nose.

Abstract: Test and burn-in sockets with many mechanical contacts require increased support strength, and with the increase in the number of contacts it is beneficial that the contacts are inserted before assembly, the contacts in the support comb are supported to restrict movement of the contact other than in the path of movement of the IC device, and the registration and movement of the IC device is sufficient to obtain good electrical contact and maintain electrical contact during temperature cycling.

Abstract: An IC socket has a socket board having a plurality of contacts for contacting IC leads, and IC accommodating portion formed in a central portion thereof, and an IC supporting platform adapted to support an IC package thereon and disposed in the accommodating portion so as to be movable in an upward and downward direction. The contacts are formed in parallel along opposing sides of the supporting platform. A plurality of grooves for positioning the contacts are formed in parallel in opposing sides of the IC supporting platform. Contacting portions of resilient contacting pieces of the contacts are received in the positioning grooves. The resilient contacting pieces are regulated by partition walls defining the positioning grooves. The IC socket is characterized in that among the partition wall groups formed on four sides, one portion of partition wall groups of at least two opposite sides are interconnected at free ends of the partition walls.

Abstract: Measuring system constituted by a radiation detection circuit (3) welded to a reading circuit (2) by metal members (4), which is itself welded to a grooved cover (9) by other metal members (19). The cover (9) is placed on a cryostat cold finger (1) and a cavity (6, 10) contains the two circuits (2, 3). This arrangement obviates the need for bonding and welding electrical connection wires and therefore simplifies assembly, alignment and parallelism of the different parts.