Abstract: An organic light-emitting diode display device includes a substrate in which an emission area and a non-emission area are defined, a power line provided on the substrate, at least one insulation film covering the power line, a light-emitting element provided above the at least one insulation film, a connection electrode connected to the power line, and extending onto the at least one insulation film, and a passivation film including a contact area where a portion of the connection electrode is exposed in the non-emission area, wherein the light-emitting element includes a first electrode, an emission layer, and a second electrode that are stacked in order, and the second electrode is in direct contact with the connection electrode in the contact area.

Abstract: A light emitting package structure and a method of manufacturing the light emitting package structure are provided. The method includes: a preparation process: mounting a light emitting unit on a substrate; a dispensing process: coating a sealant on a first joint area of the substrate; a cover-enclosing process: disposing a cover element having a second joint area on the substrate, the first joint area and the second joint area joined to each other by the sealant; a vacuum process: reducing an ambient pressure to a first pressure lower than the original ambient pressure; a pressure-adjusting process: adjusting the ambient pressure around the package structure to a second pressure higher than the first pressure; and a curing process: curing the sealant.

Abstract: The present disclosure provides a display panel and a display device including the same. The display panel comprises a transparent substrate and a display structure arranged on the transparent substrate, the display structure comprises a pixel unit array and a lead metal layer, a laser barrier layer is arranged on the lead metal layer, and an orthogonal projection of the laser barrier layer on the transparent substrate partially covers that of the lead metal layer on the transparent substrate.

Abstract: A vacuum dryer including a chamber configured to provide an interior space, support pins in the interior space proximate to a bottom of the chamber, a power supply configured to supply power to the support pins, and a pump coupled to the interior space in the chamber.

Abstract: The present disclosure provides a display panel and a liquid crystal display device. The display panel includes an array substrate and a flexible thin film. The array substrate has a first surface, a second surface disposed opposite to and in parallel with the first surface, and a first side surface connected to the first surface and the second surface. The first surface of the array substrate is on a same side as a light-emitting surface of the array substrate, and the flexible thin film is disposed on a side of the second surface of the array substrate. The display panel and the liquid crystal display device have narrow frames.

Abstract: A polymeric film includes a plurality of tapered microcells containing a dispersion of a first group and a second group of charged particles. The first group and second group of charged particles having opposite charge polarities. The tapered microcells include a wall and at least a portion of the wall is configured to repel the first group of charged particles. Also provided is a method of making a laminate for an electrophoretic display comprising embossing a plurality of tapered microcells through a layer of polymeric film and into a release sheet to form an embossed film; laminating the embossed film to a layer of conductive material on a protective sheet to form a laminated film; removing the release sheet from the polymeric film to form an opening to an interior of each microcell of the laminated film; filling the microcells with a dispersion fluid; and sealing the microcells.

Abstract: An array substrate, a manufacturing method thereof, a display panel and an electronic device are disclosed. The array substrate includes: a base substrate, a first electrode and a second electrode. The first electrode is disposed on the base substrate; the second electrode is disposed on the first electrode and is at least partly opposite to the first electrode in a direction perpendicular to the base substrate; the first electrode and the second electrode are electrically insulated from each other; a capacitor structure is constituted by a region of the first electrode and a region of the second electrode which are opposite to each other; and the capacitor structure includes a portion which forms at least part of a first recess.

Abstract: A coating device includes an upper stage, a lower stage and a spraying part. The upper stage masks an upper surface of a display panel. The lower stage masks a lower surface of the display panel. The spraying part sprays ink to a side surface of the display panel. The side surface of the display panel is exposed between the upper stage and the lower stage. The coating device includes the upper stage and the lower stage, so that the coating device may form a coating layer of uniform thickness by precisely spraying ink. In addition, a cross-section of the coating layer may be precisely formed having specific shape such as an L or C shape. A display apparatus having high light usage efficiency and reduced light leakage may be provided by using the coating device.

Abstract: An image display device includes: a plurality of LED elements that are mounted on a drive circuit substrate and emit light source light; a wavelength conversion layer that is stacked on a side of the LED elements opposite to the drive circuit substrate, converts the light source light emitted by the LED elements into long wavelength light, and emits the long wavelength light to a side opposite to the drive circuit substrate; and a first functional layer that is disposed on a light emitting surface side of the long wavelength light of the wavelength conversion layer, reflects the light source light, and transmits the long wavelength light.

Abstract: A display device is provided. The display device includes a substrate; a light-emitting layer providing first light having a first wavelength; and a light converter disposed on the light-emitting layer, wherein the plurality of pixels include first, second, third, and fourth pixels which includes first and second subpixels, the light converter includes a first wavelength conversion layer and a second wavelength conversion layer disposed in the first pixel and the second pixel, respectively, a light-transmitting layer disposed in the third pixel, and a third wavelength conversion layer disposed in the first subpixel, the first wavelength conversion layer and the second wave length conversion layer include a first wavelength conversion material and a second wavelength conversion material which convert the first light into light having different wavelength, respectively, the third wavelength conversion layer includes the first and second wavelength conversion materials.

Abstract: Disclosed are an organic light emitting diode display panel and a manufacturing method thereof. The method includes: providing a flexible substrate, comprising a display area, a bonding area, and a bending area disposed between the display area and the bonding area; fabricating an organic light emitting diode element in the display area on a first surface of the flexible substrate; fabricating a first back plate located in the display area on a second surface of the flexible substrate opposite to the first surface; coating curing adhesive on a portion of the second surface in the bonding area, and curing the curing adhesive to form a second back plate. In the manufacturing method of the organic light emitting diode display panel, by forming a supporting back plate, the generation of bubbles on the edges of the supporting back plate in the bonding area caused by the roller attachment can be avoided.

Abstract: The disclosure discloses a manufacturing method of tempered vacuum glass. At least one glass substrate constituting the tempered vacuum glass is reserved with an extraction opening, and the manufacturing method comprises the following steps: (1) manufacturing metalized layers, and performing tempering or thermal enhancement on the glass substrates; (2) placing a metal solder on the metalized layers; (3) superposing the glass substrates; (4) heating the overall glass substrates to 60-150° C.; (5) hermetically sealing the glass substrates under the condition of ensuring the heating temperature; (6) heating; (7) vacuumizing; and (8) closing the extraction opening, thus accomplishing the manufacturing process. The manufacturing method in the present disclosure can greatly reduce the stress when the two glass substrates are sealed, improve the soldering strength and prolong the service life of the tempered vacuum glass.

Abstract: A method for manufacturing a display device includes preparing a target panel including a first substrate and a second substrate disposed on one surface of the first substrate, the target panel including a sealing area between the first substrate and the second substrate, making sealing light be incident in the sealing area and receiving at least a part of the sealing light reflected from the sealing area, generating first data including at least one parameter of intensity, energy, current, and voltage, and determining whether sealing is defective by comparing the first data and prestored second data.

Abstract: The present application discloses a display panel and a display apparatus. The display panel includes a first substrate including a first buckle portion, and a second substrate arranged opposite to the first substrate, where a second buckle portion matched with the first buckle portion in a buckle manner is disposed on the second substrate.

Abstract: A glass panel unit manufacturing method includes a bonding step, a pressure reducing step, and a sealing step. The bonding step includes bonding together a first substrate and a second substrate with a first sealant to create an inner space. The pressure reducing step includes producing a reduced pressure in the inner space through an exhaust port that the first substrate has. The sealing step includes irradiating a second sealant, inserted into the exhaust port, with an infrared ray through a region, where a low emissivity film is nonexistent, of the second substrate.

Abstract: The exemplary embodiments relate generally to a display device that may include: a first substrate and a second substrate, each including a transparent encapsulation area; an outer sealant along a side of the transparent encapsulation area; a pattern part disposed on the first substrate and extending in a direction parallel to the outer sealant; and a transparent sealant adjacent to the pattern part and extending in a direction parallel to the pattern part, and a manufacturing method thereof.

Abstract: The present disclosure provides a flexible organic light emitting diode display and a manufacturing method thereof. The manufacturing method includes: a polyimide film, a buffer layer, a switch array layer, as well as an organic light emitting display layer successively located below the polyimide film in that a starting material of the buffer layer is doped with a light absorbing material. A stripping laser is configured to separate the polyimide film from a glass substrate used during manufacturing, so as to obtain a flexible organic light emitting diode display.

Abstract: A method for manufacturing a display screen, including: preparing a first substrate and reserving at least one first hole region on the first substrate; preparing a second substrate and reserving at least one second hole region on the second substrate; adding liquid crystals onto the first substrate or the second substrate and aligning the first substrate with the second substrate such that the first hole region is aligned with the second hole region; and forming a hole penetrating the first substrate and the second substrate through the first hole region and the second hole region. The liquid crystals do not occupy the first hole region and the second hole region.

Abstract: A display device includes: a plurality of pixels arranged in a two-dimensional fashion, each of the pixels including a light emitting device; and a color filter layer having color filters, the color filters facing the plurality of pixels, each of the color filters corresponding to one of a plurality of colors. Of a plurality of color filters in the color filter layer, color filters disposed in a peripheral section within a display region are shifted from center locations of corresponding pixels, and have smaller thicknesses than thicknesses of color filters disposed in a central section within the display region.

Abstract: The present invention is to provide an attachment device of a display panel capable of, while solving enclosure of bubbles in an attachment surface at the time of attachment, reliably removing bubbles generated even after attachment, and remarkably lowering a defectiveness ratio of an attachment body to improve productivity of attachment tasks. A vacuum chamber unit 3 is formed by a chamber main body 10 and a chamber lid body 11. A fixed attachment base 12 including a dam jig 13 is provided in an interior of the chamber main body 10, and a movable attachment base 16 is provided in an interior of the chamber lid body 11.

Abstract: An array substrate and an organic light-emitting diode (OLED) display device are provided. The array substrate includes: a thin-film transistor (TFT) substrate and a plurality of driver integrated circuits (ICs), the TFT substrate includes a substrate and a plurality of pixel units disposed on one surface of the substrate; and the plurality of driver ICs are disposed on the other surface of the substrate and configured to transmit signals to the pixel units. In the array substrate, the driver ICs can have enough driving capability to drive the pixel units, so that the image brightness displayed by the OLED display device can become more uniform.

Abstract: An organ light-emitting diode (OLED) display panel manufacturing method and an OLED display panel manufacturing device, the device includes a chamber configured to accommodate and heating an OLED lamination plate, where he OLED lamination plate has a substrate and a packaging lid adhered by glass adhesive and UV adhesive; a transparent lamination plate located in the chamber and configured to laminate the OLED lamination plate; a laser head located in the chamber, located on a side of the packaging lid above the transparent lamination plate and utilizing the laser beam irradiate a protruding portion of a start point of the glass adhesive.

Abstract: A method of producing a display panel including substrates having an inner space therebetween surrounded by a sealing material and an outer space outside the inner space and one substrate includes an inner space structure part and an outer space structure part, the method includes a substrate deforming step of displacing a part of the outer space structure part toward another substrate to cause an end part of the inner space structure part near the part of the outer space structure part to be moved away from the other substrate, resulting in a part of the inner space structure part being warped to be away from the other substrate, a dividing step of dividing the substrates into portions configuring the inner space and the outer space, and a substrate bending step of bending the portion of the substrates configuring the inner space so that the one substrate projects outward.

Abstract: Related to is a liquid crystal display device, a motherboard of liquid crystal display panels, and a method for preparing the motherboard of liquid crystal display panels. The motherboard of liquid crystal display panels is manufactured by the following steps: providing a first substrate motherboard; providing a second substrate motherboard; forming a plurality of frame glue patterns on the first substrate motherboard or the second substrate motherboard, each of the plurality of frame glue patterns including a first frame, a second frame, and a third frame, wherein the second frame and the third frame have a same width which is twice a width of the first frame; dripping liquid crystals into the plurality of frame glue patterns; and aligning the first substrate motherboard with the second substrate motherboard, and gluing them together through the plurality of frame glue patterns. The motherboard of liquid crystal display panels manufactured through such a method has high utilization.

Abstract: An organic light-emitting diode (OLED) structure includes an organic light-emitting diode having a first electrode, one or more layers of organic material disposed on at least a portion of the first electrode, and a second electrode disposed on at least a portion of the one or more layers of organic material. At least a portion of a tether extending from a periphery of the organic light-emitting diode. The organic light-emitting diodes can be printable organic light-emitting diode structures that are micro transfer printed over a display substrate to form a display.

Abstract: A getter structure is provided, including a support; a first layer of getter material disposed on the support a second layer of getter material, the first layer of getter material being disposed between the support and the second layer of getter material; a first portion of material mechanically connecting a first face of the second layer of getter material to a first face of the first layer of getter material and forming at least one first space between the first faces of the first and second layers of getter material configured to allow a circulation of gas between the first faces of the first and second layers of getter material; and a first opening crossing through at least the second layer of getter material and emerging into the first space.

Abstract: A dual-sided OLED display includes a package shell includes n transparent square box and a package cavity formed inside the package shell. An open terminal, arranged on both opposite sides of the package shell The first light-emitting display portion and the second light-emitting display portion arranged in the package cavity firmly. The dual-sided OLED display package structure includes a shell with fewer sealed opens which is produced in advance. Such a design effectively reduces the area of the package adhesive for the OLED display to further lessen the water vapor. It takes shorter time to package the OLED display so the yield increases owing to simple package.

Abstract: A sealed body in which sealing is uniformly performed is provided. A light-emitting module in which sealing is uniformly performed is provided. A method of manufacturing the sealed body in which sealing is uniformly performed is provided. The sealed body comprises a first substrate alternately provided with a high-reflectivity region with respect to the energy ray and a low-reflectivity region with respect to the energy ray so as to overlap with a sealant surrounding a sealed object, and a second substrate capable of transmitting the energy ray. The sealed object is sealed between the first substrate and the second substrate by heating the sealant with irradiation with the energy ray through the second substrate.

Abstract: A method for manufacturing a liquid crystal display panel is provided. The method includes the following steps of: drop-filling liquid crystal molecules on a color film substrate having a seal frame, wherein the liquid crystal molecules are doped with thermal reactive monomers; and heat-curing a frame, and simultaneously making the thermal reactive monomers in the liquid crystal molecules into a polymer on the surface of the alignment film. The reliability of the alignment film is improved by the present invention.

Abstract: Provided is a method of manufacturing a display apparatus, including forming a display unit on a first substrate; applying a fit on an encapsulating substrate; melting at least a portion of the frit on the encapsulating substrate; arranging and bonding the first substrate and the encapsulating substrate after melting at least a portion of the frit on the encapsulating substrate, so that the frit is disposed between the first substrate and the encapsulating substrate; and completely melting the frit between the first substrate and the encapsulating substrate.

Abstract: An organic light-emitting diode display is provided. The organic light-emitting diode display includes a first substrate, a second substrate, a frit, a metal layer, and an insulating layer. The second substrate is arranged to be separated from the first substrate. The frit is located between the first and second substrates. The metal layer is disposed on the first substrate, and the frit is located on the metal layer. The metal layer includes at least one opening. The frit is located in the opening. The frit has a number of voids arranged to correspond to the opening.

Abstract: An organic light emitting display device and a fabricating method thereof are disclosed, in which an organic light emitting diode or a cathode electrode may be prevented from being damaged by outgassing generated due to water remaining in a planarization film. The organic light emitting display device includes a substrate; a thin film transistor layer provided on the lower substrate; a planarization film provided on the thin film transistor layer to planarize the thin film transistor layer; an anode line provided on the planarization film to partially expose the planarization film in a non-display area corresponding to a periphery area of a display area; and a water absorption organic film provided on the exposed portion of the planarization film to at least partially absorb outgassing from the planarization film.

Abstract: Provided are an organic light-emitting display device and method of manufacturing the same. An organic light-emitting display device includes: an organic light-emitting unit between two substrates, and an adhesive unit configured to fix the two substrates, the adhesive unit including: a plurality of additives, and at least two regions configured to: suppress infiltration of external moisture into the organic light-emitting unit, and decrease separation of at least one of the two substrates from the adhesive unit caused by the external moisture, and wherein the at least two regions have respective concentrations of the plurality of additives different from each other.

Abstract: A Wiring substrate includes a substrate body that is formed from ceramics, and that includes a front surface, a back surface, and side surfaces positioned between peripheral sides of the front surface and the back surface; a frame-shaped metalized layer (surface conductor portion) that is formed on the front surface of the substrate body, a surface of the frame-shaped metalized layer being covered with a metal plating film; and an electroplating conductor layer that is formed in the substrate body, an end of the electroplating conductor layer being electrically connected to the frame-shaped metalized layer, the other end of the electroplating conductor layer being formed at the front surface of the substrate body, the other end of the electroplating conductor layer being electrically independent of different conductor portions that differ from frame-shaped metalized layer, the electroplating conductor layer being separated from the side surfaces of the substrate body.

Abstract: A method of forming a semiconductor device includes forming a dielectric layer over a substrate, and curing the dielectric layer with a first curing process. The first curing process includes providing a first UV light source, filtering the first UV light source with a first filter, the first filter permitting a first electromagnetic radiation within a first pre-determined spectrum to pass through and blocking electromagnetic radiation outside the first pre-determined spectrum, and curing the dielectric layer with the first electromagnetic radiation of the first UV light source.

Abstract: Provided are a long-life light emitting device less likely to degrade luminescence properties over time, a method for manufacturing the same, and a cell for a light emitting device used for the same. A light emitting device 1 includes a cell 10 and a luminescent material encapsulated in the cell 10. The cell 10 includes a pair of glass sheets 12 and 13 and a glass-made fused part 14a. The pair of glass sheets 12 and 13 are disposed to face each other with a space therebetween. The fused part 14a is disposed between respective peripheral portions of the pair of glass sheets 12 and 13. The fused part 14a is fused to each of the pair of glass sheets 12 and 13.

Abstract: Disclosed is a flexible organic light emitting display panel in which an upper substrate is larger in size than a lower substrate including a pad area. The flexible organic light emitting display panel includes, for example, a lower substrate, including a flexible lower base film and an organic light emitting diode (OLED) included in the flexible lower base film, and an upper substrate including a flexible upper base film and a multi-buffer which is coated on the flexible upper base film for preventing penetration of water.

Abstract: A vacuum insulated glass (VIG) assembly is provided with a protective ring surrounding a portion of a glass pump-out tube extending beyond an outer surface of one of the glass substrates that form the vacuum insulated glass assembly. The vacuum insulated glass assembly may further include a laminated glass substrate in which a hole is formed to accommodate the protective ring and/or pump-out tube portion, wherein the protective ring protects the glass pump-out tube from damage during a lamination process. In addition, a cap may be provided over the laminated substrate to cover the hole in the laminated substrate and further cover the protective ring and sealed pump-out tube.

Abstract: A method includes depositing a thin film on a first surface of a first substrate and moving a second surface of a second substrate into contact with the thin film such that the thin film is located between the first and second surfaces. The method further includes generating electromagnetic (EM) radiation of a first wavelength, the first wavelength selected such that the thin film absorbs EM radiation at the first wavelength. Additionally, the method includes directing the EM radiation through one of the first and second substrates and onto a region of the thin film until the first and second substrates are fused in the region.

Abstract: In a light-emitting device, a 50%-area average diameter of primary particles of a Eu-activated ? SiAlON fluorescent material is 10 ?m or more, a scattering probability of scattering materials at a peak wavelength of excitation light emitted from an excitation light source is 0.1 mm?1 or more and 0.5 mm?1 or less, and the Eu-activated ? SiAlON fluorescent material is entrapped inside a transparent member in a dispersed state together with the scattering materials.

Abstract: Provided is a chemically and thermally stable phosphor having different light-emitting characteristics than a conventional phosphor and having high light-emitting intensity even when combined with an LED of 410 nm or lower. The phosphor comprises an inorganic compound in which an inorganic crystal including A element, D element, X element (A is one or more elements selected from Mg, Ca, Sr, and Ba; D is one or more elements selected from Si, Ge, Sn, Ti, Zr, and Hf; and X is one or more elements selected from O, N, and F), and, if necessary, E element (where E is one or more elements selected from B, Al, Ga, In, Sc, Y, and La) includes Li element and M element (where M is one or more elements selected from Mn, Ce, Pr, Nd, Sm, Eu, Tb, Dy, and Yb).

Abstract: There is provided a composite structure including: at least two substrates which are made of thermoplastic resin and which are bonded by thermocompression; and at least one member which is made of a material whose heat distortion temperature is higher than a heat distortion temperature of the thermoplastic resin and which is inserted into a space formed in at least one of the substrates. The member inserted in the space is fixed and held by wall surfaces which form the space of the substrates and which are thermally deformed by thermocompression.

Abstract: A microdevice encapsulation structure arranged in at least one cavity formed between a substrate and a cap rigidly attached to the substrate is provided, the cap including one layer of a first material, one face of which forms an inner wall of the cavity, and mechanical reinforcement portions rigidly attached at least to and partly covering said face, having gas absorption and/or adsorption properties, in which the Young's modulus of a second material of the mechanical reinforcement portions is higher than that of the first material, wherein each of said portions includes at least one first layer of the second material, and at least one second layer of a third metallic getter material such that the first layer of the second material is arranged between the layer of the first material and the second layer of the third material and/or is covered by the second layer of the third material.

Abstract: An encapsulation member for a display device is disclosed. In one aspect, the encapsulation layer includes a first layer, a second layer formed over the first layer, and a third layer formed over the second layer. The third layer is formed of the same material as that of the first layer. An end of at least one of the first to third layers has a curved shape.

Abstract: A method and an apparatus is capable of manufacturing a bonded member faster without a protrusion of the adhesive. An adhesive in an amount which becomes predetermined thickness when two rectangular members are bonded together is applied in advance on bonded surfaces of the two members, the applied adhesives of the two members are brought into contact with each other and one of the two members is made to slide along the bonded surface and the two members are overlapped, a portion of the adhesive which is likely to protrude from an end portion of the two overlapped members is cured before occurrence of a protrusion of the adhesive, and the two overlapped members are pressurized while the protrusion of the adhesive is prevented so as to manufacture a bonded member.

Abstract: A method of encapsulating a microelectronic device arranged on a substrate, comprising at least the following steps: a) formation of a portion of sacrificial material covering at least one part of the microelectronic device, the volume of which occupies a space intended to form at least one part of a cavity in which the device is intended to be encapsulated; b) deposition of a layer based on at least one getter material, covering at least one part of the portion of sacrificial material; c) formation of at least one orifice through at least the layer of getter material, forming an access to the portion of sacrificial material; d) elimination of the portion of sacrificial material via the orifice, forming the cavity in which the microelectronic device is encapsulated; and e) sealing of the cavity.

Abstract: A method of manufacturing a display apparatus includes forming a display device on a display area of a rear substrate, aligning the rear substrate and an encapsulation substrate, such that the display device is between the rear substrate and the encapsulation substrate, disposing a sealant between the rear substrate and the encapsulation substrate, such that the sealant is outside the display area and surrounds the display area; and rotating a laser beam along a closed curve while irradiating the laser beam onto an outer surface of the rear substrate or the encapsulation substrate, such that the rear substrate and the encapsulation substrate are sealed.

Abstract: An embodiment of the invention provides a manufacturing method of flexible display substrate (10) comprising: preparing a backing layer (2) on a carrier substrate (1); preparing a flexible base substrate (3) on the backing layer (2); preparing electronic components (4) on the flexible base substrate (3); and removing the backing layer (2) from the flexible base substrate (3) back to obtain a flexible display substrate (10).

Abstract: An organic light emitting display device includes a first electrode formed on a substrate, a second electrode facing the first electrode, a blue emission layer formed between the first and second electrodes, a capping layer formed on the second electrode, and a front sealing layer formed on the capping layer and comprising an inorganic barrier layer and an organic barrier layer alternately formed at least once, wherein a luminescent dopant included in the blue emission layer has a maximum photoluminescence wavelength of 465 nm or less, and blue light generated from the blue emission layer and emitted via the front sealing layer or the substrate has a Y color coordinate (CIEy) of 0.055 or less.

Abstract: To improve reliability of a lighting device using an electroluminescent material. In a lighting device which includes a light-emitting element containing an electroluminescence (EL) layer, a first housing is provided on a light emission surface of the light-emitting element, a metal plate and a second housing covering the metal plate are provided over a top surface of the light-emitting element, and the first housing is connected to both the metal plate and the second housing, whereby the light-emitting element is doubly sealed. Further, a depressed portion is provided for the first housing in a region in contact with the metal plate or a region in contact with the second housing through an adhesive layer; thus, adhesion between the housings is improved.