Abstract: A method for removing a flaw on a treated, finally painted surface by grinding involves, after the flaw has been detected, moving a flexible abrasive sheet to the surface and pressing it against the flaw to be machined in such a way that the flaw is detected by a sensor system, which is operatively connected to a robotic arm carrying the grinding plate. The abrasive sheet, which is designed as an abrasive belt, is fed to the grinding plate and the abrasive sheet being pressed against the flaw.

Abstract: The disclosure discloses a double-station wheel deburring device consisting of two major systems. One is a wheel double-station exchange system responsible for feeding and discharging of two wheels, switching between a first working table and a second working table, switching between an upper station and a lower station, and rotation of the wheels. The other is a cutter feeding system responsible for feeding of a rim deburring blade, a riser deburring blade and brushes. The device can simultaneously remove burrs on outer rims, risers and valve holes of two wheels. Through the interactive double-station working tables, the feeding and discharging operation and the deburring operation are simultaneously carried out at separate stations. The device can be applied to deburring of wheels of different specifications. The disclosure also discloses a double-station wheel deburring method.

Abstract: The polishing apparatus has a polishing unit capable of polishing a peripheral portion of the substrate to form a right-angled cross section. The polishing apparatus includes: a substrate holder that holds and rotates the substrate; guide rollers that support a polishing tape; and a polishing head having a pressing member that presses an edge of the polishing tape against the peripheral portion of the substrate from above. The guide rollers are arranged such that the polishing tape extends parallel to a tangential direction of the substrate and a polishing surface of the polishing tape is parallel to a surface of the substrate. The substrate holder includes: a holding stage that holds the substrate; and a supporting stage that supports a lower surface of the peripheral portion of the substrate in its entirety. The supporting stage rotates in unison with the holding stage.

Abstract: A polishing pad includes and upper portion and one or more lower portions. The upper portion has an upper surface for attachment to a pad carrier and a first lateral dimension. The one or more lower portions project downward from the upper portion. A bottom surface of the one or more lower portions provide a contact surface to contact a substrate during chemical mechanical polishing. Each lower portion has a second lateral dimension that is less than the first lateral dimension. A total surface area of the contact surface from the one or more lower portions is no more than 10% of a surface area of the upper surface.

Abstract: A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.

Abstract: An object of the invention is to provide a calibration apparatus which enables the pressing force of the polishing pad to be adjusted by a simple method without the need of removing a stage on which a substrate can be placed. One embodiment of the invention provides a calibration apparatus for a bevel polishing system for polishing a bevel portion of a substrate, comprising: a load measuring device capable of measuring a pressing load from a polishing pad of the bevel polishing system; and a base plate capable of having the load measuring device placed thereon, wherein the base plate is capable of being fixed on a vacuum suction table which is capable of having a substrate placed thereon.

Abstract: A polisher head of a polishing apparatus includes a membrane and a first local pressure nodule and a second local pressure nodule physically contacting the membrane. The first local pressure nodule is configured to apply a first local force to the membrane and the second local pressure nodule is configured to apply a second local force to the membrane. The first local pressure nodule and the second local pressure nodule are independently controllable.

Abstract: A belt-finishing device including a frame. A pressing arm is configured to pivotally mount on the frame. A pressing element, which is used to press a finishing belt against a workpiece surface to be treated, is arranged on the pressing arm. The device is provided with a position detection system for detecting a pressing-arm actual position that deviates from a desired position of the pressing arm. A malfunction or defect of the pressing element is detected by means of the pressing arm actual position that deviates from the desired position of the pressing arm.

Abstract: According to an embodiment, a polishing device includes a stage, a polishing unit, and a strain measuring unit. The stage is rotatable together with a semiconductor wafer. The polishing unit polishes the rear surface of the semiconductor wafer mounted on the stage beside the stage. The strain measuring unit measures a first strain that is a radial-direction strain of the semiconductor wafer and a second strain that is a circumferential-direction strain of the semiconductor wafer during the polishing.

Abstract: A polishing apparatus including a chuck for supporting a wafer while exposing a peripheral portion of the wafer, a polishing head for polishing the peripheral portion of the wafer, and a polishing solution supplying assembly provided above the chuck and configured to spray a polishing solution on the wafer and to form a liquid curtain on the chuck to protect the wafer when the wafer is polished may be provided.

Abstract: A substrate processing apparatus capable of accurately aligning a center of a substrate, such as a wafer, with an axis of a substrate stage and capable of processing the substrate without bending the substrate is disclosed. The substrate processing apparatus includes a first substrate stage having a first substrate-holding surface configured to hold a first region in a lower surface of the substrate, a second substrate stage having a second substrate-holding surface configured to hold a second region in the lower surface of the substrate, a stage elevator configured to move the first substrate-holding surface between an elevated position higher than the second substrate-holding surface and a lowered position lower than the second substrate-holding surface, and an aligner configured to measure an amount of eccentricity of a center of the substrate from the axis of the second substrate stage and align the center of the substrate with the axis of the second substrate stage.

Abstract: The polishing apparatus has a polishing unit capable of polishing a peripheral portion of the substrate to form a right-angled cross section. The polishing apparatus includes: a substrate holder that holds and rotates the substrate; guide rollers that support a polishing tape; and a polishing head having a pressing member that presses an edge of the polishing tape against the peripheral portion of the substrate from above. The guide rollers are arranged such that the polishing tape extends parallel to a tangential direction of the substrate and a polishing surface of the polishing tape is parallel to a surface of the substrate. The substrate holder includes: a holding stage that holds the substrate; and a supporting stage that supports a lower surface of the peripheral portion of the substrate in its entirety. The supporting stage rotates in unison with the holding stage.

Abstract: A system for machining a bevel on a disk shaped part including a grinding device having an abrasive, a device for securing the part including a support to which the part is fitted and which is integral with an axis of rotation. The securing device further includes a system for orienting the axis of rotation to define the angle of the bevel and a system for moving the support closer to the abrasive in order to machining the part under stress. The invention concerns the field of crystals for timepieces.

Abstract: The present invention relates a grinding device 1 for the machine-based grinding of rotor blades 100 for wind energy systems, comprising a belt grinding unit 10 with a circulating grinding belt 12.

Abstract: The present invention provides a wire saw which cuts a workpiece using a cutting wire and is capable of adjusting wire tension with high responsiveness. The wire saw includes first and second workpiece cutting units 1A and 1B. Each of the workpiece cutting units 1A and 1B includes a pair of guide rollers 10a and 10b around which a wire W is wound to form a workpiece-cutting wire group. The wire saw further includes a tension detector 18 which detects tension in the wire W between the workpiece cutting units 1A and 1B, and a control device 50. The control device 50 changes a rotational speed of the guide rollers 10a and 10b of at least one of the workpiece cutting units based on the tension detected by the tension detector 18 so as to keep the tension within an acceptable range.

Abstract: A method for manufacturing a magnetic disk is provided that includes the steps: forming a layer of a lubricant material on a surface of a magnetic storage medium, the layer of lubricant material also being located on an interior and/or exterior edge of the medium; and removing at least some of the lubricant material from the edge 160 of the medium.

Abstract: The invention relates to an adjustable belt sander, comprising a continuous sanding belt (11) and a sanding module (4), which supports the sanding belt in the sanding region and has a profiled guide surface which faces the sanding belt back and represents a rounding radius to be sanded, wherein the sanding module has a disk shape, is mounted centrally rotatably about a pivot pin (5) on a main body (3) arranged transversely to the sanding direction and at the peripheral profile has at least two quadrant circle contours having different radii, which determine the respective guide surface for the sanding belt.

Abstract: A polishing apparatus can effectively prevent abrasive particles from falling off a polishing tape during polishing. The polishing apparatus includes: a polishing head for polishing a peripheral portion of a substrate by pressing a surface of a polishing tape, having abrasive particles fixed on the surface, against the peripheral portion of the substrate while allowing the polishing tape to travel in one direction; and a conditioning apparatus, disposed upstream of the polishing head in the traveling direction of the polishing tape, for conditioning the surface of the polishing tape in advance in order to prevent the abrasive particles from falling off the surface of the polishing tape during polishing.

Abstract: A method and a device for machining the leading edge of a turbine engine blade by a machining center for which parameters are set is disclosed. The method includes: acquiring a 3D profile of the leading edge of the blade; calculating at least one characteristic of the leading edge from the 3D profile; comparing the value of the calculated characteristic with a known theoretical value of the characteristic to obtain an elementary difference for the characteristic; calculating at least one undulation of the leading edge between at least two consecutive elementary sections from the 3D profile; optimizing the elementary differences obtained as a function of the undulation; setting the parameters of the machining center as a function of the optimized elementary differences for the elementary sections to define machining passes over the leading edge; and machining the leading edge of the blade with the machining center with parameters set.

Abstract: The invention concerns a grinding machine having displaceable grinding means for the processing of workpieces made from wood, wood composite materials, plastics, metals and similar materials. The invention further concerns a method of grinding a workpiece by means of the inventive grinding machine. The grinding aggregate comprises: at least one translational driving means configured to translate the grinding means (6) and at least one eccentric tappet configured to rotatingly move the grinding means (6). The inventive device is characterized in that the grinding aggregate comprises a suctioning device which suctions waste products of the processing, such as chips, through the grinding means. In this way, it is possible to achieve a qualitatively superior grinding result.

Abstract: A glass edge finishing system, a belt assembly and a method are described herein for finishing an edge of a glass sheet. The glass edge finishing system comprises: (a) a base; and (b) one or more belt assemblies located on the base, where each belt assembly includes: (i) a support frame; (ii) a motor; (iii) a pair of pulleys rotatably mounted on the support frame and driven by the motor; (iv) a belt engaged to and driven by the pair of pulleys, where the belt contacts and finishes the edge of the glass sheet; (v) a belt cleaning device that removes glass debris from the belt as the belt moves past the belt cleaning device; and (vi) a cleaning containment enclosure within which there is located the belt cleaning device, where the cleaning containment enclosure contains the glass debris removed from the belt by the belt cleaning device.

Abstract: A method capable of quickly polishing an angular portion formed by a grinded back surface and a circumferential surface of a substrate without causing damages on the thin substrate is provided. The method includes rotating the substrate about its center, and pressing a polishing tape against the angular portion formed by the back surface and the circumferential surface of the substrate to polish the angular portion.

Abstract: A pressing device (50) for pressing cutting means onto circumferential surfaces (12) of substantially cylindrical workpiece portions (13) during a finishing operation is provided for pressing the cutting means onto a circumferential surface with a pressing force over a contact angle. The pressing device is steplessly adaptable for the machining of workpiece portions of differing diameters that have a diameter difference of at least 0.1 mm.

Abstract: A polishing apparatus includes a substrate holder configured to hold and rotate a substrate, a press pad configured to press a polishing tape having a polishing surface against a bevel portion of the substrate held by the substrate holder, and a feeding mechanism configured to cause the polishing tape to travel in its longitudinal direction. The press pad includes a hard member having a pressing surface for pressing the bevel portion of the substrate through the polishing tape, and at least one elastic member for pressing the hard member against the bevel portion of the substrate through the belt-shaped polishing tool.

Abstract: A grinding machine includes a machine frame with a work piece support surface on which a work piece may be transporter through the machine. A grinding bar arrangement including two grinding shoes positioned in parallel is arranged transversely with respect to a work piece feeding direction across the width of the work piece support surface. The two grinding shoes carry a grinding medium on their surfaces facing the work piece support surface and are suspended via an eccentric drive. The two grinding shoes perform rotary movements in a plane parallel to the work piece support surface achieving a high quality grinding result.

Abstract: The disclosure relates to a finishing apparatus for finish machining of rotationally symmetric workpiece surfaces having a finish belt guide which has a guiding body for guiding the finish belt, wherein the guiding body comprises a shell-like guiding surface along which the finish belt can be guided or is guided between an insertion end of the finish belt and a withdrawal end of the finish belt, wherein the guiding surface is mounted in a resiliently elastic manner in the radial direction, wherein, when seen in the circumferential direction, the guiding surface extends in a continuous manner between the insertion end of the finish belt and the withdrawal end of the finish belt over at least a part of the width of said guiding surface and is mounted in a resiliently elastic manner.

Abstract: A polishing apparatus polishes a periphery (a bevel portion, a notch portion, an edge-cut portion) of a substrate by bringing a polishing tool into sliding contact with the periphery of the substrate. The polishing apparatus includes a substrate holder configured to hold the substrate, and a polishing head configured to polish the periphery of the substrate held by the substrate holder using the polishing tool. The polishing head includes a press pad for pressing the polishing tool against the periphery of the substrate, and a linear motor configured to reciprocate the press pad.

Abstract: A method, according to one embodiment, includes forming a lubricant film on a magnetic disk having at least a magnetic recording film above a substrate, and a protective film above the magnetic recording film, and wiping the lubricant film while rotating the substrate, e.g., at about 3.0 m/s to about 3.5 m/s by pressing a pad against a wiping cloth e.g., at a loading speed of about 12 mm/min to about 36 mm/min e.g., under a pressure of about 3 gf/mm2 to about 9 gf/mm2. The pad has a convexly curved surface in contact with the wiping cloth, and the wiping cloth is disposed so as to oppose the lubricant film. The method also includes pressing a cleaning tape which includes abrasive grains against the substrate on which the protective film and lubricant film are formed while rotating the substrate to remove protrusions. Apparatuses and forming the layers are also described.

Abstract: Disclosed herein is a wafer polishing device including: an abrasive member driving device adapted to run a belt-like abrasive member in a direction crossing an outer circumferential end-edge of a wafer which is a wafer to be polished while bringing a belt-like abrasive member into contact with outer circumferential end-edge of the wafer, the abrasive member having non-abrasive sections disposed on both sides of an abrasive grain section; and a guide member having two guide surfaces shaped to conform to the outer circumferential end-edge of the wafer, the two guide surface being adapted to press, from rear sides of the non-abrasive sections, the respective non-abrasive sections of the abrasive member run by the abrasive member driving device.

Abstract: A small test piece polishing apparatus is provided which is less likely to bend or damage a small test piece, which is superior in working efficiency, and which ensures uniform quality for the small test pieces produced. The small test piece polishing apparatus 1 for polishing a surface of a small test piece 3 having a circular cross section using a string-type member 13 includes string-type member delivery/recovery means 10, abrasive applying means 20, holding/rotating means 30, and pressing/scanning means 40. The abrasive applying means 20 applies an abrasive to the string-type member delivered by the string-type member delivery/recovery means 10. Thereafter, the pressing/scanning means 40 presses the string-type member 13 applied with the abrasive against the small test piece 3 held and rotated by the holding/rotating means 30 to perform scanning, to thereby polish the small test piece 3.

Abstract: A polishing system and associated methods are described for polishing a magnetic disk used in a disk drive system. The polishing system includes a polishing film that is used to polish the magnetic disk. The polishing system also includes an actuator operable to move the polishing film across a surface of the magnetic disk to polish the magnetic disk. The polishing system also includes a pad having at least one protrusion extending from a surface of the pad. The protrusion is configured to contact the polishing film and press the polishing film against the magnetic disk. The protrusion is operable to compress to about the surface of the pad when in contact with the polishing film. Once polishing is complete, the pad retracts from the polishing film and the protrusion extends from the pad, reducing the adhesion force between the pad and the polishing film.

Abstract: A substrate treating method includes rotating a substrate in a circumferential direction and polishing a peripheral portion of the substrate by pressing a polishing member to it using a pressing mechanism having a pressing pad. An angle of at least a part of the pressing pad with respect to an axial direction, in which the pressing mechanism makes the pressing pad press the peripheral portion of the substrate, is changed by an angle displacement mechanism which actively displaces the angle so that the polishing is performed depending on a surface to be polished in the peripheral portion.

Abstract: Apparatus and methods are provided to polish an edge of a substrate. The invention includes a polishing head adapted to retain a backing pad having a selected contour, wherein the polishing head is adapted to press the backing pad against an edge of a substrate. Numerous other aspects are provided.

Abstract: The present invention provides a reciprocating lifting motion of abrasive band grinding machine, wherein two control boxes are arranged correspondingly at lower part of the grinding mechanism of the grinding machine; the grinding mechanism is driven by the drive axle of the control box; a motor is coupled below the control box, and the control box is provided with a lifting mechanism, which is adapted with the cam via a main drive axle with worm gear; based on the eccentric rotation characteristic of the cam, the main drive axle could generate reciprocating lifting motion, driving the continuous operation of the grinding mechanism for uniform grinding of the abrasive band surface.

Abstract: The present invention relates to a polishing apparatus for removing surface roughness produced at a peripheral portion of a substrate, or for removing a film formed on a peripheral portion of a substrate. The polishing apparatus includes a housing for forming a polishing chamber therein, a rotational table for holding and rotating a substrate, a polishing tape supply mechanism for supplying a polishing tape into the polishing chamber and taking up the polishing tape which has been supplied to the polishing chamber, a polishing head for pressing the polishing tape against a bevel portion of the substrate, a liquid supply for supplying a liquid to a front surface and a rear surface of the substrate, and a regulation mechanism for making an internal pressure of the polishing chamber being set to be lower than an external pressure of the polishing chamber.

Abstract: The present invention relates to a polishing apparatus for removing surface roughness produced at a peripheral portion of a substrate, or for removing a film formed on a peripheral portion of a substrate. The polishing apparatus includes a housing for forming a polishing chamber therein, a rotational table for holding and rotating a substrate, a polishing tape supply mechanism for supplying a polishing tape into the polishing chamber and taking up the polishing tape which has been supplied to the polishing chamber, a polishing head for pressing the polishing tape against a bevel portion of the substrate, a liquid supply for supplying a liquid to a front surface and a rear surface of the substrate, and a regulation mechanism for making an internal pressure of the polishing chamber being set to be lower than an external pressure of the polishing chamber.

Abstract: The invention concerns a grinding machine having displaceable grinding means for the processing of workpieces made from wood, wood composite materials, plastics, metals and similar materials. The invention further concerns a method of grinding a workpiece by means of the inventive grinding machine. The grinding aggregate comprises: at least one translational driving means configured to translate the grinding means (6) and at least one eccentric tappet configured to rotatingly move the grinding means (6). The inventive device is characterized in that the grinding aggregate comprises a suctioning device which suctions waste products of the processing, such as chips, through the grinding means. In this way, it is possible to achieve a qualitatively superior grinding result.

Abstract: A method for manufacturing a lapping board having abrasive grains fixed on its surface, which is performed by the steps of: preparing a rotatable metal board having a surface of soft metal, an abrasive slurry-supplying tool arranged over the surface of the metal board, an abrasive-pressing tool which is placed on the metal board and has a hard surface, and a ultrasonic oscillation-generating tool attached to either or both of the abrasive-pressing tool and the metal board; rotating the metal board while supplying an abrasive slurry onto the surface of the metal board and while supplying electric power to the ultrasonic oscillation-generating tool to generate and apply ultrasonic oscillation to either or both of the abrasive-pressing tool and the metal board, whereby introducing the supplied abrasive slurry between the metal board and the abrasive-pressing tool and partly embedding some abrasive grains onto the metal board; and removing unfixed abrasive grains from the metal board.

Abstract: Disclosed herein is a polishing method for polishing the end surface of a wafer by using a polishing tape, wherein the end surface of the wafer is polished in the condition where a polishing liquid containing an oxidizing agent is supplied to the end surface of the wafer.

Abstract: A substrate processing apparatus has a polishing tape and a polishing head for pressing the polishing tape against a peripheral portion of a semiconductor wafer. The substrate processing apparatus polishes the wafer due to sliding contact of the polishing tape and the wafer. The polishing head has an elastic body for supporting the polishing tape. The substrate processing apparatus has an air cylinder for pressing the polishing head so that the elastic body of the polishing head presses the polishing tape against the predetermined portion of the wafer under a constant force.

Abstract: A device for abrading a wooden barrel (13) includes a robot having elements (11, 17, 23) for loading a barrel (13), elements (29a, 29b, 33a, 33b) for gripping and rotating the barrel (13) around the axis thereof, elements (43a, 43b) for extracting and re-positioning the two bilge hoops of the barrel, elements (53) for abrading the barrel, and elements (69) for removing the barrel (13).

Abstract: Disclosed is a grinding machine comprising oscillating driving means (3, 4) for setting grinding means (1) into an oscillating grinding motion and an actuation device (7) that is provided with a plurality of actuation areas (8) which can be triggered such that different zones of the grinding means (1) are alternately actuated independently of the oscillating grinding motion.

Abstract: A system and method are disclosed for edge blending hard drive head sliders by oscillating abrasive lapping tape across the edges of multiple sliders simultaneously. Lapping tape is inserted between each of a number of head sliders bonded to a edge blending jig of an edge blending assembly. The edge blending assembly is adjusted to cause the lapping tape to partially wrap an edge of each slider. The head sliders are edge blended by the relative movement between the sliders and the lapping tape.

Abstract: Disclosed is a grinding tool for a grinder comprising a rotary oscillating drive, the output shaft of which is driven so as to oscillate back and forth about its longitudinal axis and is configured for securing the grinding tool thereon. The grinding tool comprises a grinding pad which is made of a resilient material and encompasses at least one grinding surface that runs straight in one direction of extension and parallel to a tangent to the output shaft of the rotary oscillating drive.

Abstract: A linear chemical mechanical planarization (CMP) belt pad includes a first portion comprised of a first pad material, e.g., polyurethane, and a second portion comprised of a second pad material, e.g., porous rubber. The first portion has a first end and a second end. The second portion is situated between the first and second ends of the first portion and extends substantially across a width of the belt pad. Alternatively, the second portion may be embedded in the first portion such that a peripheral surface of the second portion is surrounded by a surface of the first portion. A linear CMP system and a method for planarizing a wafer in a single linear CMP module also are described.

Abstract: A substrate processing apparatus polishes a to-be-polished portion of a semiconductor substrate with a polishing tape. Part of the polishing tape is heated in advance. Part of the polishing tape is deformed conforming to a shape of the to-be-polished portion. Part of the deformed polishing tape is brought into contact with the to-be-polished portion of the substrate. The substrate and polishing tape are moved relative to each other.

Abstract: In the tape head polishing method of the present invention the tape head is moved orthogonally to the polishing medium (such as diamond polishing tape) direction of motion during polishing. The polishing medium motion is synchronized with the tape head motion, such that the polishing medium is held stationary when the tape head motion is stationary, and the polishing medium is moved when the tape head motion is approximately at a maximum velocity. The tape head velocity VH and the polishing medium velocity VT during the tape motion are generally related by the equation VT?VH Tan ?, where Tan ?=W/L, where W is the width of an insulation layer fabricated between a magnetic shield and a tape head read sensor element, and L is the length of a read sensor element.

Abstract: A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated, non-continuous polishing pad oriented at an angle relative to the horizontal to allow planarizing liquids and materials removed from the microelectronic substrate to flow off the polishing pad under the force of gravity. Two such polishing pads can be positioned opposite each other in a vertical orientation and can share either a common platen or a common substrate carrier. The polishing pads can be pre-attached to both a supply roll and a take-up roll to form a cartridge which can be easily removed from the apparatus and replaced with another cartridge.

Abstract: Generally, a method and apparatus for supporting a web of polishing material. In one embodiment, the apparatus includes a platen adapted to support the web, a frame assembly, and one or more flexures coupled between the platen and the frame assembly. The flexure allows the frame assembly to be moved in relation to the platen. When the frame assembly is in an extended position relative to the platen, the web is placed in a spaced-apart relation to the platen.

Abstract: A fluid bearing polishing apparatus for carrying a polishing member for chemical mechanical polishing includes a fluid supply and a fluid dispensing structure to support the polishing member. A method of polishing a workpiece includes supporting a polishing member on a fluid bearing between a first end of the polishing member and a second end of the polishing member and moving the polishing member to polish the workpiece. The fluid bearing has a curved portion at which plane of travel of the polishing member changes from a first plane to a second plane. Advantages of the invention include smooth belt motion in all desired directions of movement.