Abstract: A burnishing tape apparatus includes pads that press the burnishing tape against the surfaces of the disk to be burnished. The pads are mounted on pad holders that are biased to press the pads against both sides of the disk. Tape guides are used to apply tension to the burnishing pad when the pads are moved away from the disk. When the pads are away from the disk tape guides hold the burnishing tape away from the pads so that the burnishing tape may be indexed without damaging or dislodging the pads. As the pads are moved into contact with the disk, the tape guides release the tension on the burnishing tape while the centering guides ensure that the burnishing tape is centered on the pads. By releasing tension on the burnishing tape, the pads are permitted to press the approximate center of the burnishing tape against the surfaces of the disk without deforming in an uncontrolled manner.

Abstract: Apparatus for removing random scratches formed during the polishing of magnetic recording media, and for disposing on the surface of the media a near-circumferential texture which increases the recording reliability of the media while simultaneously reducing its failure rate. The present invention teaches the application of a low unit load force to a pad and polishing tape combination in contact with a rotating and oscillating disk surface to completely remove the random scratches previously formed by a polishing step. The apparatus facilitates the application of a specially designed, extremely fine alumina slurry composition without producing similar size circumferential scratches at the high surface speeds.

Abstract: A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated polishing pad that is moved over a platen either between or during the planarization cycles, and a support pad that is moved along with the polishing pad. The support pad can be an elongated member that extends between a supply roller and a take-up roller, or can include a continuous member that extends around the spaced apart rollers. The platen can also be movable along with the support pad and can be supported by fluid jets, rollers, or a rotating bladder. Cleaning devices and/or milling devices can treat the surfaces of the polishing pad, the support pad and/or the platen to reduce the likelihood for contaminants to become caught between these components as they engage with each other.

Abstract: The wafer edge processing unit may be a stand alone unit or may be incorporated in existing grinding machines. The processing unit employs a plurality of tapes which are coated with differing grades of grit to sequentially polish the edge of a rotating wafer or to remove an edge bead from a processed wafer or the other substrate. The tapes are mounted on a backing block which is rotated to move the tapes from a line contact with the top bevel of the wafer to a line contact with the bottom bevel of the wafer. Fresh surfaces of the tapes are presented to successive wafers by rotating the spools on which the tapes are mounted. The wafer may be moved in small increments along a Y-axis and/or an X-axis relative to a tape during polishing to improve the polishing operation.

Abstract: It is an object of the invention to prevent a lapping member from being cut by an edge of a slider when the edge is chamfered by lapping it with the lapping member. A slider held by a slider holding jig according to the invention is put in contact with a diamond lapping sheet. A load applying portion moves weights provided in the form of a plurality of stages downward from a state in which the lower end of a shaft portion of the weight at the bottom stage is located above the slider holding jig without contacting the slider holding jig, thereby loading the slider holding jig with the weights sequentially from the bottom stage.

Abstract: A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated polishing pad that is moved over a platen either between or during the planarization cycles, and a support pad that is moved along with the polishing pad. The support pad can be an elongated member that extends between a supply roller and a take-up roller, or can include a continuous member that extends around the spaced apart rollers. The platen can also be movable along with the support pad and can be supported by fluid jets, rollers, or a rotating bladder. Cleaning devices and/or milling devices can treat the surfaces of the polishing pad, the support pad and/or the platen to reduce the likelihood for contaminants to become caught between these components as they engage with each other.

Abstract: A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated polishing pad that is moved over a platen either between or during the planarization cycles, and a support pad that is moved along with the polishing pad. The support pad can be an elongated member that extends between a supply roller and a take-up roller, or can include a continuous member that extends around the spaced apart rollers. The platen can also be movable along with the support pad and can be supported by fluid jets, rollers, or a rotating bladder. Cleaning devices and/or milling devices can treat the surfaces of the polishing pad, the support pad and/or the platen to reduce the likelihood for contaminants to become caught between these components as they engage with each other.

Abstract: A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated polishing pad that is moved over a platen either between or during the planarization cycles, and a support pad that is moved along with the polishing pad. The support pad can be an elongated member that extends between a supply roller and a take-up roller, or can include a continuous member that extends around the spaced apart rollers. The platen can also be movable along with the support pad and can be supported by fluid jets, rollers, or a rotating bladder. Cleaning devices and/or milling devices can treat the surfaces of the polishing pad, the support pad and/or the platen to reduce the likelihood for contaminants to become caught between these components as they engage with each other.

Abstract: A hand scaler sharpener unit adapted to sharpen a hand scaler with a grindstone for restoration of the hand scaler, including a base member having a base surface slanted at an angle to a level line, a grindstone mounting member for mounting a grindstone thereon, a grindstone driving means for reciprocatingly moving the grindstone mounting member along the base surface, as well as a hand scaler sharpening apparatus including this hand scaler sharpener unit and a hand scaler securing unit for securing a hand scaler generally vertically during operation of the sharpener unit.

Abstract: A micro-finishing apparatus for finishing the outer surface of small cylindrical workpieces with repeatability. The apparatus comprises a regulating mechanism rotating and feeding a workpiece against a micro-finishing spool drive mechanism. Planar extents of the regulating mechanism and micro-finishing spool drive mechanism form an opening having a distance that is no greater than the diameter of the workpiece. The workpiece is fed through the opening at an angle by a guide bar. The regulating mechanism rotates the workpiece against the abrasive of the micro-finishing spool drive mechanism and simultaneously feeds it through the apparatus.

Abstract: Magnetic recording media are provided having separately textured data and read/write head landing zones. Separating these zones on the recording surface allows independent optimization of the topology to maximize both recording characteristics and mechanical durability. The landing or contact start stop zone has an average surface roughness greater than that of the data zone. Preferably, a transition zone extends between the contact start stop zone and the data zone, the transition zone varying between the two in average surface roughness. Preferably, the contact start stop zone is textured first, followed by the data zone, thereby ensuring uniform stiction performance. Texture machines for producing such zone texturing and texturing methods are also provided.

Abstract: A method and apparatus for mechanically and/or chemical-mechanically planarizing and cleaning microelectronic substrates. In one embodiment, a processing medium for planarizing and finishing a microelectronic substrate has a planarizing section with a first body composed of a first material and a finishing section with a second body composed of a second material. The first body may have a relatively firm planarizing surface to engage the substrate, and the first body supports abrasive particles at the planarizing surface to remove material from the substrate during a planarizing cycle. The second body may have a relatively soft buffing or finishing surface clean the abrasive particles and other matter from the substrate during a finishing cycle. The planarizing and finishing sections may be fixedly attached to a backing film, or they may be attached to one another along abutting edges with or without the backing film.

Abstract: A substrate polishing scheme (apparatus and method) is described according to which a polishing surface of a polishing sheet is driven in a generally linear direction by a drive mechanism, a surface of a substrate is held against the polishing surface of the polishing sheet by a polishing head, and the substrate is probed through the polishing sheet by a monitoring system.

Abstract: A method and an apparatus are provided for processing a slider having a rail forming part of a medium facing surface of the slider which faces a medium, at least part of an outer side of the rail being located inside a side of the slider. The slider includes at least first edges each between the medium facing surface of the rail and the outer side of the rail and a second edge located closer to the side of the slider than the first edges. At least the first edges and the second edge are removed.

Abstract: Apparatus for removing random scratches formed during the polishing of magnetic recording media, and for disposing on the surface of the media a near-circumferential texture which increases the recording reliability of the media while simultaneously reducing its failure rate. The present invention teaches the application of a low unit load force to a pad and polishing tape combination in contact with a rotating and oscillating disk surface to completely remove the random scratches previously formed by a polishing step. The apparatus facilitates the application of a specially designed, extremely fine alumina slurry composition without producing similar size circumferential scratches at the high surface speeds.

Abstract: A method and apparatus for mechanically and/or chemical-mechanically planarizing microelectronic substrates. In one embodiment in accordance with the principles of the present invention, a microelectronic substrate is planarized or polished on a planarizing medium having a thin film and a plurality of micro-features on the film. The film may be an incompressible sheet or web substantially impervious to a planarizing solution, and the micro-features may be configured in a selected pattern on the film to restrain fluid flow of the planarizing solution across the surface of the film under the substrate. The micro-features, for example, may be configured in a selected pattern that has a plurality of support points and at least one cavity to entrap a substantially contiguous, uniform distribution of the solution under the substrate during planarization.

Abstract: Method for removing random scratches formed during the polishing of magnetic recording media, and for disposing on the surface of the media a near-circumferential texture which increases the recording reliability of the media while simultaneously reducing its failure rate. The present invention teaches the application of a low unit load force to a large surface pad and polishing tape combination while in contact with a rotating disk surface that is also moving in a circumferential direction to completely remove the random scratches previously formed by a polishing step. The scratches are removed with the aid of a specially designed, extremely fine alumina slurry composition which prevent producing similar size circumferential scratches at the high surface speeds. The methodology provides for a smoother disk surface than prior known super-polish/texture methodologies.

Abstract: An apparatus for finishing a surface of a camshaft extending along an axis with the surface offset from the axis has a drive for rotating the camshaft about the axis, a support displaceable radially of the axis, and a plurality of pusher heads on the support. The heads are movable independently of each other toward and away from the camshaft relative to the support along respective angularly offset pusher axes extending radially of the camshaft. All the pusher heads are biased along the respective pusher axes toward the camshaft axis with substantially the same force.

Abstract: A surface polishing method comprises allowing a holder to hold a flat sheet-like workpiece, placing a pad tape in a location opposite to the holder, the pad tape consisting of a tape substrate and grains bonded to the substrate surface, supplying free grains between the holder and the pad tape, and rotating the holder and/or a mechanism holding the tape, thereby causing the free grains to polish the workpiece. An apparatus for practicing the method comprises a holder capable of holding a flat sheet-like workpiece, a tape holding mechanism located opposite to the surface of the workpiece and carrying a pad tape which consists of a tape substrate and grains bonded to the substrate, a rotary mechanism for rotating the holder and/or the tape holding mechanism, and an abrasive supplying mechanism for supplying free grains between the surface of the workpiece and the pad tape.

Abstract: A tungsten carbide surface is finished to an RMS surface roughness of about 25 nm (1.0 microinch) or less by abrasion using diamond grit particles. The tungsten carbide surface is abraded by a sequence of grit particle-containing abrasive members, such as abrasive films, pastes, or slurries, at least one of the members having an average grit particle diameter of about 2 .mu.m or less. The finish is enhanced by oscillating the abrasive member back and forth over the tungsten carbide surface. A different speed is used for at least two consecutive films in the series, thereby generating scratches at different angles which can be distinguished. A superfinish, corresponding to a lack of visible scratches at 100X magnification, can be obtained by abrading the tungsten carbide surface with a diamond slurry or paste having grit particles with an average diameter of about 1 .mu.m or less.

Abstract: A panel sanding machine comprises an abrasive belt and a pad mounted by the machine in such a way that it rotates in orbital fashion around an axis transverse to the plane in which the panels lie and presses the abrasive belt against the panel being machined. The abrasive belt is supported by the pad in such a way that it can slide on the latter in a direction parallel to the panel being machined. The machine also includes a feature for alternately allowing and preventing the sliding of the abrasive belt relative to the pad in two working conditions, of which the first allows the belt to slide so as to change the part of it that is in contact with the panel being worked, and the second locks the belt to the pad so that the panels can be sanded.

Abstract: A polishing apparatus has a spindle disposed rotatably through an opening of a base plate, a pair of side walls attached to the spindle, a compression roller attached rotatably to an end part of and between the side walls for compressing a polishing tape onto a target object, a tape-supplying roller and a take-up roller which are both attached rotatably between and to the side walls between the spindle and the compression roller, and a tape-running roller attached rotatably between and to the side walls for causing the polishing tape to travel. The axis of rotation of the compression roller intersects that of the spindle perpendicularly and both the tape-supplying and take-up rollers are parallel to the compression roller and their axes of rotation intersect that of the spindle such that the center of gravity of the apparatus is always on the axis of rotation of the spindle.

Abstract: A process for polishing a workpiece. The process comprises the steps of:(a) placing a structured abrasive article bearing precisely shaped abrasive composites on at least one major surface thereof in contact with a surface of a workpiece having a surface having a scratch pattern having an initial Ra value thereon such that said composite bearing surface is in contact with said workpiece surface;(b) moving at least one of said workpiece or said structured abrasive article relative to the other in a first abrading direction, while simultaneously moving at least one of said workpiece or said structured abrasive article relative to the other in a second abrading direction not parallel to said first abrading direction such that said second abrading direction crosses said first abrading direction while contact is maintained between said composite bearing surface and said workpiece surface, whereby said initial Ra value is reduced.

Abstract: Apparatus and process for automated or semi-automated abrasive satin finishing of large machined annular parts such as aluminum vehicle wheels includes a loading area where the type of part and set-up position are verified, and a working area to which the verified part is transferred. When at the working area, the part is supported for rotation at an intermediate portion of the part to permit both sides of the part to be finished simultaneously while the part is being rotated.

Abstract: A disk texturing apparatus for texturing surfaces of a magnetic disk or the like with cross-pattern grooves. The texturing apparatus is basically constituted by a rotational drive having a spindle for supporting and rotating a disk, and a tape transport mechanism for moving a texturing tape across and in pressed with a texturing surface of said disk. The spindle of the rotational drive mechanism is arranged to hold a disk in an eccentrically deviated position off the rotational axis of the rotational drive. As a result, the disk is revolved along an eccentrically deflecting orbit around the rotational axis of said rotational drive while being rotated with the spindle, moving in and out in radial directions in a degree commensurate with the amount of deviation from said rotational axis to form cross-pattern grooves on the disk surface.

Abstract: A universally applicable device for guiding the cable of cable saw systems for sawing concrete, brickwork, natural stone, and other masonry products. A bearing plate supports (and attaches) the guide to a base. A support projects upwardly from the bearing plate. A transverse beam ca be fixed at any height on the support. The transverse beam has one or two free ends. A hollow end beam that can be stopped and rotated by 360.degree. around the longitudinal axis of the transverse beam is disposed on each free end of the transverse beam. The end beam carries deflection rollers on which the incoming and outgoing saw cable is guided to the workpiece and to the cable saw, respectively. Each of the rollers are borne in a roller housing that is rotatable by 360.degree. about the longitudinal axis of the end beam. Any cutting planes or flush cuts and all angles to the work piece can therefore be set, without having to perform any substantial changeover procedure for the cable saw between different cutting jobs.

Abstract: An apparatus for abrasive machining of a predetermined portion of a workpiece such that an abrasive tape and the workpiece are moved relative to each other while the tape is held in pressing contact with the predetermined portion of the workpiece, and such that the abrasive tape is fed in the longitudinal direction, the apparatus including a tape holding portion, and a tape cartridge removably held by the tape holding portion and carrying the abrasive tape, wherein the cartridge includes a housing, a tape supply portion disposed in the housing and accommodating an unused length of the tape such that a portion of the unused length is exposed outside the housing, a pressing member attached to the housing, for pressing the portion of the unused length outside the housing onto the predetermined portion of said workpiece, and a take-up portion disposed in the housing and accommodating a used length of the tape which has been used for abrasive machining of the predetermined portion of the workpiece in pressing cont

Abstract: A surface polishing machine for polishing a workpiece, the machine including a body member adapted to be positioned adjacent the workpiece and having first and second pivot means spaced apart from each other, a pair of polishing arms, each pivotable on a pivot means, each arm having a first end adapted to receive a surface grinding means for finishing the workpiece and a second end, an actuating means connected to the respective second ends of the first and second polishing arms for moving the arms about the first and second pivot means from respective treatment enabling positions adjacently spaced from the workpiece to respective treatment positions wherein the surface grinding means engages the workpiece, whereby the actuating means forces the respective second ends of the first and second polishing arms away from each other thereby producing a grinding pressure at the surface grinding means of each respective first and second polishing arms, a rolling support member for pivotably supporting and horizontall

Abstract: An improved chemical mechanical polishing (CMP) device for chemically and mechanically planarizing the surface of a semiconductor wafer includes a flat wafer stage for loading and affixation of the semiconductor wafer so that the surface of a material to be polished, i.e. the surface of the wafer, faces up, and a cylindrical polishing pad formed above the exposed surface of the wafer to be polished which is rotatable at high speed so that the contact point of the wafer and the pad moves linearly. The stage is constructed to support a wafer by a vacuum suction through vacuum holes. The cylindrical polishing pad has a rotating axis for transmitting rotation at the center, thereof, and a double layer polishing pad having different hardness on a peripheral surface of the rotating axis.

Abstract: An apparatus for polishing the notch of a wafer in an effective and efficient way, which comprises: a flexible tape carrying abrasive grains in the working face thereof; an infeed reel for feeding the tape stored thereon: a take-up reel for taking up the tape fed from the infeed reel; a motor for driving to rotate the take-up reel; a means for blowing a fluid to the backside surface to the edge portion of the notch to be in direct contact along the full periphery of the notch; and a means for oscillating the tape sideways.

Abstract: In a microfinishing machine for machining cylindrical inner or outer faces of a work piece, a grinding belt is pressed against it with a flexible machining shell. This has the advantage that the shell can move radially in sections and as a result, the grinding belt can press in the shape of a circle against the work piece.

Abstract: A device and process for the surface machining of workpieces with convex surfaces, the device including an abrasive belt, abrasive belt clamping devices, an abrasive belt tensioning device, and clamping tongs device with two clamping arms, one of which is rotatable relative to the other. A section of unused abrasive belt is drawn from a supply roll for the abrasive belt and a corresponding section of used abrasive belt is wound onto a wind-up roll for the abrasive belt so that machining proceeds with a new section of abrasive belt.

Abstract: In a magnetic tape surface treatment method and apparatus for rubbing together a magnetic tape and a lapping tape and thereby removing projections and adhered matter from the magnetic surface to the magnetic tape pressurized air is blown onto the tapes to prevent the formation of an air film between the contacting surfaces of the two tapes. This enhances the contact quality and improves the surface treatment efficiency.Also uniformity of the surface treatment effect is enhanced by simultaneously controlling the tensions in the magnetic tape before and after the two tapes make contact.

Abstract: A system and method for chemically and mechanically polishing a semiconductor wafer having a substrate and a surface film. A wafer mounting device, which may include a vacuum chuck, holds the semiconductor wafer without requiring that the wafer have a central aperture. The mounting device and wafer are moved with an orbit-within-an-orbit motion while a tape transport mechanism applies an abrasive polishing tape to the surface film of the moving wafer to polish one surface of the wafer to a flatness of less than two microns. The system determines the thickness of the wafer surface film during the polishing process with a real time measurement device such as an ellipsometer, or by determining a work-performed factor and calculating an estimated film thickness from the work-performed factor. Finally, the system automatically controls the polishing process to stop polishing the semiconductor wafer when the wafer surface film achieves a predefined planarization.

Abstract: An apparatus and method is disclosed for texturizing magnetic storage disks in which the vibration due to forces imparted by oscillating motion is greatly decreased. Typically, the oscillating motion is caused by an oscillating spindle assembly which is slidably mounted on a base. The disclosed apparatus and method utilizes a counter-balance slidably mounted to the base which is caused to move in an opposite direction to the oscillating assembly. The apparatus uses a mechanical linkage which includes a yoke attached to the oscillating assembly, and a pulley and cable arrangement, attached to the counter-balance.

Abstract: The present invention relates to a method and apparatus for abrading a workpiece. The apparatus includes an abrasive tape having a microstructured surface on the back face thereof, and a support shoe having a microstructured surface on an exposed pressure face. The two microstructured surfaces intermesh and resist displacement of the abrasive tape with respect to the pressure face as the workpiece is rotatively abraded.

Abstract: A polishing pad cluster for polishing a semiconductor wafer having multiple integrated circuit dies includes a pad support and multiple polishing pads. Each pad has a polishing area substantially smaller than the wafer but not substantially smaller than an individual one of the integrated circuit dies. Each polishing pad is mounted to a respective polishing pad mount, which is in turn supported by the support. Each mount includes a respective joint having at least two degrees of freedom to allow the associated polishing pad to articulate with respect to the support to conform to the wafer. Each mount is substantially rigid in a direction perpendicular to the pad toward the pad support, and in some cases the adjacent mounts are completely isolated from one another. A magnet is used to bias the polishing pad against the wafer.

Abstract: An apparatus for the surface machining of workpieces with convex surfaces uses a grinding belt (11). Fresh grinding belt (11) is brought to the surface of the workpiece for machining by a belt feed device (28). The belt feed device (28) for conveying the grinding belt (11) has a hydraulic drive (27) or pneumatic drive.

Abstract: A microfinishing machine particularly adapted for microfinishing external cylindrical surfaces such as found on internal combustion engine crankshaft bearing journal. The machine includes a microfinishing tool assembly which presses an abrasive coated film against the workpiece and a gaging tool assembly which enables in-process diameter measurements to be made. The microfinishing tool assembly features means for shifting the center of pressure exerted on the abrasive coated film along the axial surface of the cylindrical surface being machined. Such adjustment can be achieved by shifting the pivot axis of the tool or by exerting an external torsional load onto the tool. The microfinishing tool assembly according to this invention allows axial form errors such as tapering of journal surfaces to be corrected in the microfinishing operation.

Abstract: An apparatus for microfinishing an interior cylindrical surface. The apparatus includes a mechanism which holds and rotates the workpiece about an axis. A tool, having radially directed work areas, is positioned within the workpiece and causes a strip of abrasive sheet material, positioned over the work areas, to engage the rotating workpiece. With the abrasive sheet material engaging the rotating workpiece, the tool is axially oscillated.

Abstract: An apparatus has a polishing head for polishing an object such as a semiconductor wafer by using a polishing tape stretched between two guide rollers. The head can be rotated so as to change the angle of contact between the tape and the object and also undergo a reciprocating motion perpendicular to the direction of supply of the tape. For this purpose, the apparatus includes a first plate attached to the head and a second plate supported parallel to each other and in motion-communicating relationship by means of rods which are attached to the first plate and penetrate the second plate. The second plate is attached to the rotary shaft of a direct drive motor for causing oscillatory angular motion. This rotary shaft is tubular and an inner shaft for causing the oscillatory motion passes slidably therethrough.

Abstract: A two-stage machining process is carried out using control of a pair of levers upon which one pair of grinding tools is provided. The second stage of the machining process is effected by grinding tools, e.g. immobilized segment of a grinding belt or band of tongs whose arms are inserted between the levers.

Abstract: The present invention relates to a method and apparatus for abrading a workpiece. The apparatus includes an abrasive tape having a microstructured surface on the back face thereof, and a support shoe having a microstructured surface on an exposed pressure face. The two microstructured surfaces intermesh and resist displacement of the abrasive tape with respect to the pressure face as the workpiece is rotatively abraded.

Abstract: Apparatus for working the surface of a workpiece that includes a crankshaft having a shank and two offset arms for rotation about the shank. A sanding belt is connected between the arms and is arranged to move through a reciprocal path of travel as the crankshaft is rotated in one direction. The shank is secured in the chuck of a hand-held tool such as a drill which provides motive power to the crankshaft.

Abstract: An apparatus for polishing the periphery portion of a wafer, by which improvement on the polishing velocity may be effected and besides a more efficient spatial usage of the working layer of an abrasive tape is capable, comprising a tape holding fixed abrasive grains thereon; a feed reel for feeding the tape stored by winding itself; a take-up reel for taking up the tape by winding itself; a rotary drum inside of which both of the reels are equipped in such a manner that they are mountable or demountable, where a portion of the tape in the way from the feed reel to the take-up reel is adaptive to wind the rotary drum around the outer cylindrical surface thereof in close contact in the shape of a helicoid and one of the main faces of the wafer is positioned to be in a plane intersecting the central axis of the rotary drum at an angle.

Abstract: An automated machine is disclosed for grinding and polishing the terminated ends of the optical fibers in fiber optic cables. The machine utilizes abrasive material in strip form. The abrasive material is moved in a carriage along a linear path while the carriage is oscillated in a circle within a plane during polishing. There are three separate carriages operating concurrently, the first having a relatively course grade of abrasive while the others have finer grades. Fixtures holding the cables for polishing are held in fixture supports that are automatically fed toward the abrasive material during polishing and retracted after polishing is complete. The fixture engagement mechanism for the first carriage engages at a slower rate than do the mechanisms of the other carriages.