Abstract: A fiber optic polishing apparatus including a support system, a polishing sub-assembly coupled to the support system including a plurality of pads, and a fixture to hold a plurality of fiber optic connectors. The fixture is positioned adjacent to the plurality of pads so that an end surface of each of the plurality of fiber optic connectors is held in contact with a corresponding pad. A drive mechanism is coupled to the support system to move the fixture to polish the end surface of each of the plurality of fiber optic connectors. Each of the plurality of pads may travel independently in a vertical direction. The polishing sub-assembly may further include a web polishing film, a fluid injection module configured to direct water onto the film, and a rinsing module to rub against a face of each of the plurality of fiber optic connectors to remove debris.

Abstract: A process and device for machining by abrasive belt, on a part 1 with an axis of rotation, of a non-cylindrical bearing surface 2, two portions of the same running abrasive belt 14, which are spaced apart from each other in the longitudinal direction of the belt, using two independent support components 12, preferably activated by two jacks 8 mounted on a common carrier 4, along two contact zones spaced apart angularly around the axis of rotation of the part, are applied against the bearing surface 2. The application is particularly suited for cam surfaces of cam shafts.

Abstract: The present invention describes a chemical mechanical polishing apparatus and method that uses a portion of a polishing pad that is disposed under tension between a supply spool and a receive spool, with a motor providing the tension to either the supply spool or the receive spool and the other spool being locked during processing. If a new section of the polishing pad is needed, the same motor that provided the tension is used to advance the polishing pad a determined amount. Further, during processing, a feedback mechanism is used to ensure that the tension of the polishing pad is consistently maintained.

Abstract: A chemical mechanical polishing (CMP) apparatus is provided. The CMP apparatus includes a first roller situated at a first point and a second roller situated at a second point. The first point is separate from the second point. Also included in the apparatus is a polishing pad strip having a first end secured to the first roller and a second end secured to the second roller. The first roller and the second roller are configured to reciprocate so that the polishing pad strip oscillates at least partially between the first point and the second point.

Abstract: Apparatus and methods are disclosed that promote greater polishing uniformity in linear CMP systems by introducing a relative lateral motion between a CMP belt and a rotating polish head securing a wafer. A belt polish module comprises a linear CMP belt forming a loop around an idle roller and a drive roller, first and second pistons engaging, respectively, first and second ends of the idle roller, and a controller configured to vary the forces applied by the first and second pistons to the ends of the idle roller in order to laterally translate the linear CMP belt. A method for linear CMP comprises rotating a wafer about a vertical axis, contacting the rotating wafer against a linear CMP belt moving in a longitudinal direction, and causing a relative lateral motion between the rotating wafer and the linear CMP belt.

Abstract: A device for grinding and polishing optical fiber ends. The device includes a holder and an elastic grinding surface. The holder is used to hold equidistantly a set of optical fibers such that the ends of the optical fibers are in contact with the elastic grinding surface capable of only eccentric rotation, to enable the grinding speed and the grinding direction of each of the optical fiber ends to be the same. The grinding direction is uniformly changed along with the change in time and the grinding angles in all direction are substantially the same.

Abstract: Device for grinding an external sleeve surface on a rotationally symmetrical body comprises a support frame displaceable along the external sleeve surface of the body and to which a driven belt grinder is fixed, and pivoted running rollers spaced in the circumferential direction of the body and resting on the external sleeve surface of the body, whereby a rapid and positionally exact grinding of the body is achieved.

Abstract: An abrasive tape is supplied to a tape head by a tape supply unit and taken up from the tape head by a tape take-up unit. The tape head presses the abrasive tape against a surface of an object under polish, which is rotated by a rotating unit. A tape head pressuring unit utilizes a vice voice coil motor, for example. Since the tape head pressuring unit generates a pressuring force for pressuring the tape head using the electromagnetic force, it is able to set a minute pressuring force by controlling a drive signal, and to obtain the fine adjustment of the pressuring force easily by controlling the electric signal. Therefore, it becomes possible to press the abrasive tape against the surface of the object under polish with a desired low pressure.

Abstract: A system for conditioning a pad is provided. The system includes a pad conditioning media, a feed-roll containing a supply of the pad conditioning media, and a take-up roll for receiving an end of the pad conditioning media. Further included in the system is a pressure application member defined between the feed-roll and the take-up roll. The pressure application member is designed to apply pressure onto the pad conditioning media as the pad conditioning media is applied against the pad to cause a conditioning of a surface of the pad.

Abstract: A polishing article for chemical mechanical polishing. The polishing article includes a generally elongated polishing sheet with a polishing surface. The polishing article is formed from a material that is substantially opaque, and has a discrete region extending substantially the length of the polishing sheet that is at least semi-transparent.

Abstract: An apparatus for chemically mechanically planarizing a semiconductor wafer is disclosed having a continuous polishing strip with first side having a fixed abrasive surface and a second side opposite the first side. In one embodiment, a first drive roller holds a first end of the polishing strip, a second drive roller holds a second end of the polishing strip, and a pair of support rollers contacts the second side of the polishing strip on either end of a polishing strip support. A drive motor is operably connected to the first and second drive rollers for moving the polishing strip in a linear, bi-directional manner.

Abstract: Methods and apparatuses for planarizing a microelectronic substrate. In one embodiment, a planarizing pad for mechanical or chemical-mechanical planarization includes a base section and a plurality of embedded sections. The base section has a planarizing surface, and the base section is composed of a first material. The embedded sections are arranged in a desired pattern of voids, and each embedded section has a top surface below the planarizing surface to define a plurality of voids in the base section. The embedded sections are composed of a second material that is selectively removable from the first material. A planarizing pad in accordance with an embodiment of the invention can be made by constructing the embedded sections in the base section and then removing a portion of the embedded sections from the base section. By removing only a portion of the embedded sections, this procedure creates the plurality of voids in the base section and leaves the remaining portions of the embedded sections.

Abstract: A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated, non-continuous polishing pad oriented at an angle relative to the horizontal to allow planarizing liquids and materials removed from the microelectronic substrate to flow off the polishing pad under the force of gravity. Two such polishing pads can be positioned opposite each other in a vertical orientation and can share either a common platen or a common substrate carrier. The polishing pads can be pre-attached to both a supply roll and a take-up roll to form a cartridge which can be easily removed from the apparatus and replaced with another cartridge.

Abstract: In the tape head polishing method of the present invention the tape head is moved orthogonally to the polishing medium (such as diamond polishing tape) direction of motion during polishing. The polishing medium motion is synchronized with the tape head motion, such that the polishing medium is held stationary when the tape head motion is stationary, and the polishing medium is moved when the tape head motion is approximately at a maximum velocity. The tape head velocity VH and the polishing medium velocity VT during the tape motion are generally related by the equation VT≦VH Tan &phgr;, where Tan &phgr;=W/L, where W is the width of an insulation layer fabricated between a magnetic shield and a tape head read sensor element, and L is the length of a read sensor element.

Abstract: A sand-belt finishing machine having a reciprocal movement mechanism includes a main body, a swingable support rack, a finishing device, and an eccentric device. Thus, the eccentric unit of the eccentric device produces a driving force to pull and push the first roller of the finishing device, so that the first roller is oscillated successively and produces a vibration or shock force on the sand belt of the finishing device, so as to remove and clear the powder chips attached on the surface of the sand belt.

Abstract: A thermal head lapping apparatus includes a pallet for holding at least one thermal head, a transport device for transporting the thermal head held on the pallet successively to a specified processing position, and a lapping device for forcing a lapping material being moved onto the thermal head that has been transported to said processing position. As a result, the apparatus is capable of advantageously performing lapping treatment with a good efficiency on surfaces to be coated with protective layers or the formed protective layers in a process of fabricating a thermal head, thereby improving the production efficiency of the thermal head and fabricating with a good productivity the suitably lapped thermal head of high quality that ensures high quality image recording.

Abstract: A linear polisher for polishing a substrate that always provides a fresh abrasive surface for polishing and a method for linear polishing a substrate are described. In the linear polisher, a length of a polishing pad is supported on a pair of rollers which are driven by a motor means for either intermittently or continuously advancing the pad during a polishing process. A vibration generator which is connected to the polishing pad through an adaptor provides lateral, or vibration in a transverse direction of the pad throughout the polishing process. The present invention novel linear polisher enables substantially constant removal rate to be achieved throughout the pad life of a polishing pad without deterioration such as that normally seen in a conventional rotary or linear CMP apparatus. Optionally, a rotatable substrate holder is utilized to further improve the polishing uniformity of the linear polishing apparatus.

Abstract: Described is a method and apparatus for producing bi-directional linear polishing that uses a flexible pad. In one aspect, a horizontal drive assembly moves a horizontal slide member that is horizontally moveable over rails attached to a single casting. Openings within the casting exist for the inclusion of the supply spool, the receive spool and the pad path rollers. A drive assembly translates the rotational movement of a motor into the horizontal bi-directional linear movement of the horizontal slide member. With the polishing pad properly locked in position, preferably being attached between a supply spool and the receive spool, horizontal bi-directional linear movement of the horizontal slide member creates a corresponding horizontal bi-directional linear movement of a portion of the polishing pad.

Abstract: An apparatus for simultaneously polishing wafers including at least a first and a second web of polishing media. At least two polishing heads are provided on a carrier coupled to a drive system such that one polishing head positions a wafer against the first web and a second polishing head positions a second wafer against the second web. The drive system imparts a programmed polishing motion or pattern to the polishing heads.

Abstract: A method of producing a chemical mechanical planarization (CMP) polishing belt structure is disclosed that includes forming a strip of substantially rigid material into a support belt having an interior surface and an exterior surface. At least a portion of the exterior surface of the support belt is altered to form a plurality of gripping members integral with the exterior surface of the support belt. An interior surface of a seamless CMP belt is applied to the exterior surface of the support belt such that the plurality of gripping members engage the interior surface of the seamless CMP belt in a non-slip grip.

Abstract: An invention is disclosed for improved performance in a CMP process using a pressurized membrane as a replacement for a platen air bearing. In one embodiment, a platen for improving performance in CMP applications is disclosed. The platen includes a membrane disposed above the platen, and a plurality of annular bladders disposed below the membrane, wherein the annular bladders are capable of exerting force on the membrane. In this manner, zonal control is provided during the CMP process.

Abstract: The present invention includes a polishing pad or belt secured to a mechanism that allows the pad or belt to move in a reciprocating manner, i.e. in both forward and reverse directions, at high speeds. The constant bidirectional movement of the polishing pad or belt as it polishes the wafer provides superior planarity and uniformity across the wafer surface. When a fresh portion of the pad is required, the pad is moved through a drive system containing rollers, such that the rollers only touch a back side of the pad, thereby minimizing sources of friction other than the wafer that is being polished from the polishing side of the pad, and maximizing the lifetime of the polishing pad.

Abstract: A lens (L) with an aspheric surface (10) is held by a vacuum lens holder (12). A lap wall (42) is moved towards the lens surface (10) while in a plastic state. A polishing fabric (PF) is positioned between the lens surface (10) and the lap wall (42) before they are moved together. Fluid pressure in a chamber (44) behind the lap wall (42) is used to move the lap wall (42) and the polishing fabric (PF) against the lens surface (10). This causes the lap wall (42) to take a shape corresponding to the shape of the lens surface (10). Then, the lap wall material (42) is caused or allowed to become a solid. When the lap wall (42) is solid, the polishing fabric (PF) is caused to move relative to the lens (L) and the lap (32). The lap wall (42) holds the polishing fabric (PF) against the lens surface (10) while the polishing fabric (PF) moves across the lens surface (10) and polishes it.

Abstract: The present invention describes a chemical mechanical polishing apparatus and method that uses a portion of a polishing pad that is disposed under tension between a supply spool and a receive spool, with a motor providing the tension to either the supply spool or the receive spool and the other spool being locked during processing. If a new section of the polishing pad is needed, the same motor that provided the tension is used to advance the polishing pad a determined amount. Further, during processing, a feedback mechanism is used to ensure that the tension of the polishing pad is consistently maintained.

Abstract: A substrate polishing scheme (apparatus and method) is described according to which a polishing surface of a polishing sheet is driven in a generally linear direction by a drive mechanism, a surface of a substrate is held against the polishing surface of the polishing sheet by a polishing head, and the substrate is probed through the polishing sheet by a monitoring system.

Abstract: Machine for machining using abrasive belts circular workpieces supported by at least one pair of parallel rollers. To pass the workpieces under the machining station(s) 6, the support rollers 16 driven in rotation are moved in translation parallel to their axes. The rollers 16 are preferably mounted on a table 13 mobile in translation which can also carry means 19 for positioning the workpieces to be machined.

Abstract: A thermal head lapping apparatus includes a pallet for holding at least one thermal head, a transport device for transporting the thermal head held on the pallet successively to a specified processing position, and a lapping device for forcing a lapping material being moved onto the thermal head that has been transported to said processing position. As a result, the apparatus is capable of advantageously performing lapping treatment with a good efficiency on surfaces to be coated with protective layers or the formed protective layers in a process of fabricating a thermal head, thereby improving the production efficiency of the thermal head and fabricating with a food productivity the suitably lapped thermal head of high quality that ensures high quality image recording.

Abstract: Described is a method and apparatus for producing bi-directional linear polishing that uses a flexible pad. In one aspect, a horizontal drive assembly moves a horizontal slide member that is horizontally moveable over rails attached to a single casting. Openings within the casting exist for the inclusion of the supply spool, the receive spool and the pad path rollers. A drive assembly translates the rotational movement of a motor into the horizontal bi-directional linear movement of the horizontal slide member. With the polishing pad properly locked in position, preferably being attached between a supply spool and the receive spool, horizontal bi-directional linear movement of the horizontal slide member creates a corresponding horizontal bi-directional linear movement of a portion of the polishing pad.

Abstract: A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated, non-continuous polishing pad oriented at an angle relative to the horizontal to allow planarizing liquids and materials removed from the microelectronic substrate to flow off the polishing pad under the force of gravity. Two such polishing pads can be positioned opposite each other in a vertical orientation and can share either a common platen or a common substrate carrier. The polishing pads can be pre-attached to both a supply roll and a take-up roll to form a cartridge which can be easily removed from the apparatus and replaced with another cartridge.

Abstract: A quick change insert system for a microfinishing machine comprising an insert body having a connection side and a finishing side, the connection side including a keyway defined by a central wall and a pair of oppositely disposed sidewalls, the finishing side including at least one finishing support surface; and a finishing arm having an extending key including a central shoulder and a pair of oppositely disposed side walls wherein the insert body keyway and finishing key are correspondingly matingly shaped in a press fit relationship whereby the insert body is retained on the finishing arm during finishing.

Abstract: Generally, a method and apparatus for supporting a web of polishing material. In one embodiment, the apparatus includes a platen adapted to support the web, a frame assembly, and one or more flexures coupled between the platen and the frame assembly. The flexure allows the frame assembly to be moved in relation to the platen. When the frame assembly is in an extended position relative to the platen, the web is placed in a spaced-apart relation to the platen.

Abstract: An apparatus (46) for reconditioning a protective surface (30) of an optically-read digital recording disc (20) includes a turntable (48) configured to receive a center hole (24) of the disc (20) and a first motor (52), coupled to the turntable (48), for rotating the turntable (48) and the disc (20) at a first rotational speed. The apparatus further includes a buffing element (50) for removing an amount of material from the protective surface (30) as the turntable rotates the disc (20) and a second motor (54), coupled to the buffing element (50) for rotating the buffing element (50) at a second rotational speed. A timing element (56) synchronizes the first and second motors (52, 54) to substantially simultaneously cease rotation of the turntable (48) and the buffing element (50) following removal of an amount of material from the disc (20).

Abstract: An apparatus is provided for polishing balls that comprises a cradle that is supported for rotation about a first axis. The cradle is shaped to support a spherical object and includes a ball spinner positioned and adapted to spin the spherical object in the cradle about a second axis that is oriented at an angle to the first axis. The apparatus also comprises a first drive operably connected to the cradle for rotating the cradle about the first axis at a first speed of rotation, and a second drive connected to the ball spinner to spin the spherical object about the second axis at a second speed of rotation.

Abstract: A driven roller is mounted with an eccentric-swinging device which has the function of swinging, and the eccentric-swinging device comprises a floating frame, a transmission structure, and a flat plate mounted onto the machine body of the device, and the center section of the floating frame is mounted with a shaft seat, and the bottom surface within a support frame is mounted with corresponding bearings such that the shaft seat holds the bearings formed into a rotating support for the floating frame, and in between the floating frame and the flat plate, a spring which can be pulled downward is mounted, and the transmission structure is attached to the floating frame, corresponding to one lateral side of the flat plate, the transmission structure is synchronously driven by the shaft rod of the driven roller, and the flat plate is mounted with a rotatable shaft center, wherein a free end of the shaft center forms into an eccentric post, and a bearing urging the top face of the flat plate is mounted onto the ecc

Abstract: The present invention is directed to methods and apparatus for polishing a surface of a semiconductor wafer using a pad or belt moveable in both forward and reverse directions. In both VLSI and ULSI applications, polishing the wafer surface to complete flatness is highly desirable. The forward and reverse movement of the polishing pad or belt provides superior planarity and uniformity to the surface of the wafer. The wafer surface is pressed against the polishing pad or belt as the pad or belt moves in both forward and reverse directions while polishing the wafer surface. During polishing, the wafer is supported by a wafer housing having novel wafer loading and unloading methods.

Abstract: An adjustable platen is provided. The adjustable platen includes a platen body having a top region and a bottom region. The platen body is oriented under a linear polishing pad of a CMP system. An air bearing is integrated with the platen body at the top region, and the air bearing is configured to apply an air pressure to an underside of the linear polishing pad. A set of bearings are connected to the bottom region of the platen body to enable controlled vertical movement of the top region of the platen body closer or further from the underside of the linear polishing pad depending on the applied air pressure. The applied air pressure is configured to exert a controllable force to the underside of the linear polishing pad. The force is controlled to meet a desired process parameters, while the carrier simply moves the wafer into position over the linear polishing pad.

Abstract: An apparatus for chemically mechanically planarizing a semiconductor wafer is disclosed having a continuous polishing strip with first side having a fixed abrasive surface and a second side opposite the first side. In one embodiment, a first drive roller holds a first end of the polishing strip, a second drive roller holds a second end of the polishing strip, and a pair of support rollers contacts the second side of the polishing strip on either end of a polishing strip support. A drive motor is operably connected to the first and second drive rollers for moving the polishing strip in a linear, bi-directional manner.

Abstract: A substrate polishing system includes two hollow drums and motors for driving the drums in a reciprocating manner. An abrasive tape wound on supply and takeup rollers is introduced, with the supply roller mounted inside one of the drums and the takeup roller mounted inside the other drum. The abrasive tape exits the interior of each drum through a slot in the surface of the drum. Between the drums the abrasive tape passes over a platen having a bearing surface. A substrate is mounted in a carrier and forced against the abrasive tape where it overlies the bearing surface. The drums are rotated reciprocally, thereby causing the abrasive tape to move back and forth over the platen and polishing the substrate. After a substrate has been polished the tape is advanced a selected distance by indexing motors that are connected to the supply and takeup rollers.

Abstract: A method and apparatus are disclosed for chemically-mechanically polishing and planarizing semiconductors. An apparatus includes first and second rollers connected by a tension belt. A polishing member is releasably attached to the first and second rollers. A method includes clamping a first portion of a continuous strip of polishing member to a first roller, clamping a second portion of the continuous strip to a second roller, applying a tension to the continuous strip and rotationally reciprocating the rollers while pressing a semiconductor wafer against the continuous strip.

Abstract: A method and apparatus for mechanically and/or chemical-mechanically planarizing microelectronic substrates. In one embodiment in accordance with the principles of the present invention, a microelectronic substrate is planarized or polished on a planarizing medium having a thin film and a plurality of micro-features on the film. The film may be an incompressible sheet or web substantially impervious to a planarizing solution, and the micro-features may be configured in a selected pattern on the film to restrain fluid flow of the planarizing solution across the surface of the film under the substrate. The micro-features, for example, may be configured in a selected pattern that has a plurality of support points and at least one cavity to entrap a substantially contiguous, uniform distribution of the solution under the substrate during planarization.

Abstract: A method and apparatus for mechanically and/or chemical-mechanically planarizing microelectronic substrates. In one embodiment in accordance with the principles of the present invention, a microelectronic substrate is planarized or polished on a planarizing medium having a thin film and a plurality of micro-features on the film. The film may be an incompressible sheet or web substantially impervious to a planarizing solution, and the micro-features may be configured in a selected pattern on the film to restrain fluid flow of the planarizing solution across the surface of the film under the substrate. The micro-features, for example, may be configured in a selected pattern that has a plurality of support points and at least one cavity to entrap a substantially contiguous, uniform distribution of the solution under the substrate during planarization.

Abstract: A method and apparatus for mechanically and/or chemical-mechanically planarizing and cleaning microelectronic substrates. In one embodiment, a processing medium for planarizing and finishing a microelectronic substrate has a planarizing section with a first body composed of a first material and a finishing section with a second body composed of a second material. The first body may have a relatively firm planarizing surface to engage the substrate, and the first body supports abrasive particles at the planarizing surface to remove material from the substrate during a planarizing cycle. The second body may have a relatively soft buffing or, finishing surface clean the abrasive particles and other matter from the substrate during a finishing cycle. The planarizing and finishing sections may be fixedly attached to a backing film, or they may be attached to one another along abutting edges with or without the backing film.

Abstract: A method and apparatus for mechanically and/or chemical-mechanically planarizing and cleaning microelectronic substrates. In one embodiment, a processing medium for planarizing and finishing a microelectronic substrate has a planarizing section with a first body composed of a first material and a finishing section with a second body composed of a second material. The first body may have a relatively firm planarizing surface to engage the substrate, and the first body supports abrasive particles at the planarizing surface to remove material from the substrate during a planarizing cycle. The second body may have a relatively soft buffing or finishing surface clean the abrasive particles and other matter from the substrate during a finishing cycle. The planarizing and finishing sections may be fixedly attached to a backing film or they may be attached to one another along abutting edges with or without the backing film.

Abstract: It is an object of the invention to prevent a lapping member from being cut by an edge of a slider when the edge is chamfered by lapping it with the lapping member. A slider held by a slider holding jig according to the invention is put in contact with a diamond lapping sheet. A load applying portion moves weights provided in the form of a plurality of stages downward from a state in which the lower end of a shaft portion of the weight at the bottom stage is located above the slider holding jig without contacting the slider holding jig, thereby loading the slider holding jig with the weights sequentially from the bottom stage.

Abstract: A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated polishing pad that is moved over a platen either between or during the planarization cycles, and a support pad that is moved along with the polishing pad. The support pad can be an elongated member that extends between a supply roller and a take-up roller, or can include a continuous member that extends around the spaced apart rollers. The platen can also be movable along with the support pad and can be supported by fluid jets, rollers, or a rotating bladder. Cleaning devices and/or milling devices can treat the surfaces of the polishing pad, the support pad and/or the platen to reduce the likelihood for contaminants to become caught between these components as they engage with each other.

Abstract: A sander includes a roller rotatably secured to a support, a bracket rotatably supported on the support at a pivot pin, another roller rotatably secured to the bracket, a sander belt engaged around the rollers. One of the rollers is rotated about the support for twisting the sander belt and for removing some of the dust from the sander belt. An actuator includes a rod engaged with the bracket for rotating the bracket about the support. A valve is coupled to the actuator for selectively supplying the air to the actuator via a rotatable spindle and a lever.

Abstract: Disclosed is a chemical mechanical polishing(“CMP”) apparatus. The present invention provides a CMP apparatus having a rotatable wafer holder in which a wafer is fixed. At a bottom of the wafer holder, a pair of driving roller is arranged and the respective rollers are rotated by motors. A polishing wire is winded between the respective driving rollers, the polishing wire is stuck to the wafer fixed at the wafer holder and the polishing wire moves in a linear reciprocal movement. Meanwhile, guide-rollers for providing tension with the polishing wire are arranged at outer portions of the respective driving rollers thereby winding both ends of the polishing wire at the respective guide-rollers. Further, a height adjusting member for is arranged at bottom portions of the polishing wire thereby adjusting the height of the polishing wire owing to a rise of the height adjusting member.

Abstract: Polishing pads are provided for a linear chemical mechanical polishing apparatus used in manufacturing integrated circuits. The polishing pads, which are attached to a polishing belt, are grooved in patterns to advantageously transport slurry from the point of introduction to the point at which semiconductor wafers are polished. The patterns include at least one set of multiple parallel grooves extending across the polishing pads. The grooves form an angle with the direction of travel of the belt that is unequal to zero.

Abstract: A polishing media magazine for improved polishing. The polishing media magazine may include a conditioning element for rapid, uniform conditioning and cleaning of the polishing media. The polishing media magazine may include polishing media having sections of raised elevation to contain the fluid and may include a polishing support platen having features adapted to urge the edges of the polishing media upwards. The polishing media may be roll fed from a supply roll across a support platen and onto a take-up roll.

Abstract: An endless belt for a belt type polishing machine comprises a support fabric and a polymer layer of relatively low hardness. The polymer layer is formed with drainage grooves. The support fabric may comprise a non woven or woven material, or a membrane with oriented reinforcing yarns. A further version comprises a spiral-link fabric supporting a woven or non woven layer carrying the polymer layer. The polymer layer may be a double layer, the upper of which is either harder or softer than the lower layer.