Abstract: Grinding machine with a machine bed, with a tool carriage that is linearly movable on the machine bed in a Y-axis, with a tool spindle, which is mounted in the tool carriage so as to rotate around an X-axis that is perpendicular to the Y-axis, and which can be rotationally driven, with an X-carriage that is linearly movable on the machine bed in the X-axis, with a Z-carriage that is linearly movable on the X-carriage with a Z-axis that is perpendicular to the X-axis and the Y-axis, and with a work piece jig, which is arranged on the Z-carriage so as to pivot around a B-axis, which is parallel to the Y-axis, and which is capable of rotating around its A-axis, which is perpendicular to the B-axis.

Abstract: Chemical mechanical polishing (CMP) systems and methods are provided herein. One aspect of the present subject matter is a polishing system. One polishing system embodiment includes a platen adapted to receive a wafer, and a polishing pad drum that has a cylindrical, or generally cylindrical, shape with a length and an axis of rotation along the length. The polishing pad drum is adapted to rotate about the axis of rotation along the drum length. The polishing pad drum, the platen, or both the polishing pad drum and the platen are adapted to be linearly moved to polish the surface of the wafer using the rotating polishing pad drum. The polishing pad drum and the platen are adapted to be operably positioned a predetermined minimum distance from each other as the polishing pad drum and the platen pass each other due the linear motion.

Abstract: The invention relates to a method for grinding convex running surfaces and exact outside diameters on undulated workpieces. In a clamping, a first convex running surface is ground on a discoid partial section of an undulated workpiece during a first grinding operation while using a first grinding wheel that comprises at least one concave lateral surface. A second grinding wheel is used to grind a desired outside diameter on the discoid partial section as well as on other partial sections of the undulated workpiece during a second grinding operation.

Abstract: A rotation axis of a work spindle and a rotation axis of a spindle primary-axis portion are rotated relative to each other and feeding of a work-piece to a tool is accordingly adjusted, whereby warpage of the tool in accordance with a change in machining condition is corrected. A revolution volume of the relative rotation is compared and calculated in process based on data entered in advance, a result of measurement by a displacement sensor and information such as a machining position, and controlled in real time until the end of machining. The relative rotation is driven by an actuator such as a piezoelectric element, at a resolution even as fine as in seconds. The data entered in advance can be sequentially updated in accordance with monitoring of a processed product.

Abstract: A dicing apparatus is provided with a first position for feeding a workpiece before dicing, a movable machining table capable of retaining the workpiece, a second position for mounting the workpiece before dicing on the machining table, a third position for washing the diced workpieces, a fourth position for retaining the washed workpieces, a dicing mechanism provided at a dicing range spaced apart from the second position, for dicing the workpiece, and a transferring mechanism for transferring the workpiece from the first position to the second position, from the second position to the third position, from the third position to fourth position, respectively.

Abstract: A device for superfinishing of ground surfaces of workpieces has a finishing block, which can be displaced by means of a drive device in a plane which is orthogonal with respect to the surface to be worked and is pivotable in this plane. By means of this it is possible to create a device of relatively small structural size, by means of which any arbitrary surfaces of workpieces can be treated.

Abstract: A roll grinder system including a roll grinder bed of high dynamic stiffness, having a roll support and a grinding wheel support fixedly mounted to the roll grinder bed. The roll grinder bed is comprised of a monolithic epoxy granite block with a steel plate embedded in the top surface and a steel plate embedded in the bottom surface. The bed for the support for the roll being ground is rigidly affixed to the top plate. The bed for the traversing carriage of the grinding wheel head is also rigidly affixed to the top plate. A bed for the caliper is affixed to a lateral side of the block. The grinding wheel and the caliper traverse along the axis of the roll being ground. Vibration isolators are disposed below the bottom plate of the block.

Abstract: A universal grinding machine having a plurality of workpiece holders, each of which can be moved independently of each other or jointly, by a separate slide, in the longitudinal direction of the workpiece on a slide guide disposed on the machine bed, or which can be fixed independently of each other or jointly to the machine bed.

Abstract: A method and apparatus for finishing a workpiece surface using MR fluid is provided wherein the workpiece is positioned near a carrier surface such that a converging gap is defined between a portion of the workpiece surface and the carrier surface; a magnetic field is applied substantially at said gap; a flow of stiffened MR fluid is introduced into said converging gap such that a work zone is created in the MR fluid to form a sub-aperture transient finishing tool for engaging and causing material removal at the portion of the workpiece surface; and the workpiece or the work zone is moved relative to the other to expose different portions of the workpiece surface to the work zone for predetermined time periods to selectively finish said portions of said workpiece surface to predetermined degrees.

Abstract: Reconditioning a fiber for laser applications by cleaving off its tip and shaping the cleaved end into a conical or pyramidal shape with a grinder. The cleaved end is grasped in a fiber holder. The grinder is driven, e.g., to rotate. The fiber holder is moved relative to the grinder to bring it into contact with the moving grinder. The fiber holder may be rotated during the contact. Preferably, the axis of symmetry of the fiber is substantially parallel to the plane of rotation of the grinder to effect tangential grinding.

Abstract: A numerically controlled grinding machine for grinding workpieces, such as tools, and other metallic or ceramic elements, comprises a machine bed (1) having fixedly connected to it a rigid, distortion-free portal (9) which has a reinforcing rear wall (13) rigidly connected to the machine bed, two side stands (10) and a horizontal bridge (11) which extends at a distance above the machine bed (1). A double wheel grinding spindle carrier (20) is adjustably mounted on the portal (9) for positioning along at least one axis (-y). The machine bed (1) projects at one side from the portal (9). The machine bed (1) supports a workpiece carrier movable about a plurality of axes.

Abstract: A grinding machine has a machine frame and a grinding spindle support positioned on the machine frame. At least one grinding spindle is arranged with upwardly slanted axis at the grinding spindle support. A grinding wheel is connected to the grinding spindle. A workpiece holder is connected to the machine frame so as to extend parallel to the axis of the grinding spindle. The workpiece holder is displaceable in the axial direction of the grinding spindle and perpendicular to the axial direction of the grinding spindle. A housing is positioned at a slant parallel to the axis of the grinding spindle and encloses the workpiece holder and the grinding wheel. The housing has an outlet opening for a cooling liquid at the lowermost point of the housing. Drive devices for effecting a linear movement of the workpiece holder and a rotational movement of the grinding wheel and the workpiece are positioned exterior to the housing.

Abstract: A method and an apparatus, which enable mirror-polishing a peripheral chamfered portion of a semiconductor wafer effectively, are disclosed. Mirror-polishing a peripheral side surface of the chamfered portion of the wafer, beveled surfaces thereof, and rounded edges formed between the peripheral side surface and each of the beveled surfaces, are individually carried out.