Abstract: The invention relates to a method and to a device for producing a robot with a robotic arm. Said method can be carried out using an assembly robot wherein first housing segments are arranged in an intended sequence for the robotic arm, drive units are inserted into the first housing segments and the respective complimentary second housing segments are placed on the first housing segments comprising the drive units.

Abstract: A machine featuring a treatment tool that grinds a surface to a desired profile, imparts a desired roughness to that surface, and removes contamination from the surface, the machine configured to control multiple independent input variables simultaneously, the controllable variables selected from the group consisting of (i) velocity, (ii) rotation, and (iii) dither of the treatment tool, and (iv) pressure of the treatment tool against the surface. The machine can move the treatment tool with six degrees of freedom.

Abstract: An oscillating power tool, including: a housing; an output shaft for installing a working head, the output shaft being installed in the housing and extending out of the housing; a transmission mechanism, installed in the housing, and the transmission mechanism being connected to the output shaft; and a motor, installed in the housing, the motor being connected to the transmission mechanism and driving the transmission mechanism to drive the output shaft to move, where an outer diameter of the motor is in a range of 40 mm to 50 mm.

Abstract: A method of forming a wedge-shaped fiber array and a bottom base according to a probing pad layout of a Si-Photonic device to enable optical, DC and RF mixed signal tests to be performed at the same time and the resulting device are provided. Embodiments include a bottom base; and a fiber array with sidewalls and a top surface having a first angle and a second angle, respectively, over the bottom base, wherein the fiber array is structured to expose bond pads of a Si-Photonic device during wafer level Si-Photonic testing.

Abstract: A polishing sheet capable of reducing recesses formed at the core of the end surface of an optical fiber, and a manufacturing method for an optical fiber connector using the polishing sheet are provided. The method includes a step of the final polishing of an optical fiber ferrule assembly in which an optical fiber protrudes from the end surface of a ferrule, the protruding optical fiber having a recess in the tip end core. During the final polishing step, the optical fiber having the recess in the core is inserted into a flocked portion of a flocked polishing sheet. The optical fiber ferrule assembly and the flocked polishing sheet are disposed opposite one another and moved relatively to each other in order to polish the optical fiber. Fibers constituting the flocked portion have silica particles with an average particle diameter from 0.01 ?m to 0.1 ?m adhered to the surface.

Abstract: A fiber optic connector fiber stub remover and method for automated fiber stub removal. The device has a top plate with a platen opening, and a platen with a well that carries a polishing film over the well. An air pocket is formed between the polishing film and the well. The platen is positioned with a top surface of the polishing film accessible via the platen opening. A fixture holds connector ends of fiber optic cables with fiber stubs extending therefrom, and a weight biases the fiber stubs into contact with the polishing film. A motor is controlled by a motor control unit to control a ramp up time and final speed of movement of the platen over a timespan. Each connector ends moves independently relative to the polishing film. The air pocket provides shock absorption of the polishing film so that an ideal pressure is exerted on each fiber stub during stub removal.

Abstract: An adaptive uniform polishing system is equipped with feedback control to apply localized adjustments during a polishing operation. The adaptive uniform polishing system disclosed has particular application to the semiconductor industry. Such an adaptive uniform polishing system includes a rotatable head that holds a semiconductor wafer, and a processing unit structured to be placed in contact with an exposed surface of the wafer. The processing unit includes a rotatable macro-pad and a plurality of rotatable micro-pads that can polish different portions of the exposed surface at different rotation speeds and pressures. Thus, uniformity across the exposed surface can be enhanced by applying customized treatments to different areas. Customized treatments can include the use of different pad materials and geometries. Parameters of the adaptive uniform polishing system are programmable, based on in-situ data or data from other operations in a fabrication process, using advanced process control.

Abstract: A polishing mechanism includes a support base, a pair of magnetic valves, a first polishing assembly and a second polishing assembly. The pair of magnetic valves are mounted in the support base. The first polishing assembly and the second polishing assembly are mounted on the support base and connected to the pair of magnetic valves respectively. The second polishing assembly is arranged perpendicular to the first polishing assembly. The first and the second polishing assemblies are respectively controlled by the pair of magnetic valves to polish one or more workpieces. The present disclosure further discloses a manipulator using the polishing mechanism.

Abstract: The invention concerns a grinding machine having displaceable grinding means for the processing of workpieces made from wood, wood composite materials, plastics, metals and similar materials. The invention further concerns a method of grinding a workpiece by means of the inventive grinding machine. The grinding aggregate comprises: at least one translational driving means configured to translate the grinding means (6) and at least one eccentric tappet configured to rotatingly move the grinding means (6). The inventive device is characterized in that the grinding aggregate comprises a suctioning device which suctions waste products of the processing, such as chips, through the grinding means. In this way, it is possible to achieve a qualitatively superior grinding result.

Abstract: A manipulator includes a controlling seat, a robot arm assembly and a polishing mechanism. The robot arm assembly is rotatably connected to the controlling seat; and the polishing mechanism is mounted on the robot arm assembly. The polishing mechanism includes a housing with a first mounting portion and a second mounting portion, a pair of magnetic valves mounted in the housing and electrically connected to the controlling seat, a first polishing assembly partially received in the first mounting portion, and a second polishing assembly partially received in the second mounting portion. The first polishing assembly and the second polishing assembly define an angle therebetween and are respectively connected to the pair of magnetic valves, such that the pair of magnetic valves controls the first and the second polishing assembly respectively to polish one or more workpiece. The present invention further discloses a polishing mechanism of the manipulator.

Abstract: A polishing mechanism includes a support base, a pair of magnetic valves, a first polishing assembly and a second polishing assembly. The pair of magnetic valves are mounted in the support base. The first polishing assembly and the second polishing assembly are mounted on the support base and connected to the pair of magnetic valves respectively. The second polishing assembly is arranged perpendicular to the first polishing assembly. The first and the second polishing assemblies are respectively controlled by the pair of magnetic valves to polish one or more workpieces. The present disclosure further discloses a manipulator using the polishing mechanism.

Abstract: The present invention comprises of a process for lapping a high-throughput of ultra-flat wafers by utilizing a lapping apparatus containing a rotary flat, grooved polishing platen, at least two rotating pressurized heads each having a polishing wafer carrier that is adapted to receive a plurality of mounted wafers, and a plurality of concentric conditioning rings surrounding each pressurized head. The rotating pressurized heads are counterbalanced throughout the inventive process, and the lapping platen is continuously conditioned by simultaneously rotating the concentric conditioning rings over the lapping platen. This process allows continuous and controllable planarization thus allowing for a high throughput of wafers, while at the same time it prevents distortions in the lapping platen which reduces maintenance by providing continuous conditioning of the lapping platen.

Abstract: A grinding head unit mountable in a planetary disk of a surface grinding machine generally including a housing mountable on the planetary disk, a holder supported on the housing and a surface grinding member detachably connectable to the holder wherein the holder is provided with a recess and the holder is provided with a portion receivable within such recess.

Abstract: A surface grinding machine generally consisting of a drive means provided with an output shaft; a planetary disk mounted on the shaft; and at least two grinding head units mounted on the planetary disk, each including a housing mounted on the planetary disk, a shaft having a flange portion, journaled in the unit housing, resilient means interposed between the housing and the flange portion of the unit shaft and a disk provided with a grit surface disposed on an outer side of the flange portion of the unit shaft.

Abstract: To provide a high-rigidity flat grinding device, a substrate flat grinding device has three fastening plate lifting-and-lowering mechanisms that have kinematic couplings and a cylinder rod that move the fastening plate upward or downward. Being a high-rigidity grinding device in which the load of the fastening plate 6 also is a load on the grindstone 14 that does the grinding, there is little deflection in the thickness distribution of the substrates that are obtained, even if they are semiconductor substrates having a large substrate diameter of 450 mm.

Abstract: The present invention provides a grinding member or connection to a drive connection member to form a grinding cup for grinding the hard metal inserts or working tips of drill bits (percussive or rotary), tunnel boring machine cutters (TBM) and raised bore machine cutters (RBM) to restore them to substantially their original profile, said grinding member having: a. a grinding section having top and bottom surfaces, a centrally disposed convex recess formed in the bottom surface of said grinding section having the desired profile to be ground; b. a support section adjacent the top surface of said grinding section; c. means to connect the grinding member to the drive connection member wherein the grinding member can be disconnected from the drive connection member when it becomes worn.

Abstract: A manually guided implement having a tool driven by an internal combustion engine, which draws combustion air in via an air filter disposed on an air filter base. The air filter is secured to the implement via a releasable securement device that includes a first securement element, and a second securement element that cooperates with the first securement element. The securement elements can be released from one another, or connected to one another, by means of a rotational movement about an axis of rotation. To achieve easy handling of the air filter, the first securement element is fixedly connected to the air filter.

Abstract: A dust collection container for power tool with suction capacity is described comprising a first pipe (15) for air inlet and at least one second pipe (20) for air outlet, i.e. connected to the external environment, the dust container (13) comprising a filtering element (22) placed inside an external casing (14). The container further comprising a bladed element (100) accommodated in the external casing (14) and being adapted to increase the air turbulence. The shape of the space comprised between the filtering element (22) and the external casing (14) determines a cyclonic type air motion.

Abstract: An embodiment of a planarization system for planarizing a substrate includes a planarizing surface and an encircling element formed to at least partially laterally enclose the substrate, wherein the planarizing system is configured to planarize the substrate with the substrate abutting the planarizing surface during a relative lateral movement between the substrate and the planarizing surface. The substrate is at least partially laterally enclosed by the encircling element. The encircling element abuts the planarizing surface.

Abstract: The present invention relates particularly to an oscillating grinding machine. The grinding machine comprises a driving motor (3) surrounded by a body (3), and a drive shaft (4) cooperating with the driving motor. The drive shaft comprises a grinding head (5) that constitutes a support for a grinding product (8). The drive shaft (4) is arranged in two pieces and comprises a main shaft (11) and an eccentric shaft (10) arranged rigidly thereto. The eccentric shaft comprises a centre line (12) that assumes an angle (?) against a corresponding centre line (13) of the main shaft, and thus the grinding head (5) will assume an eccentric placement in relation to the main shaft (11). Thus, the grinding head is arranged to oscillate in a substantially spherical plane provided by the rotation of the main shaft and the eccentricity and inclination of the eccentric shaft in relation to the main shaft.

Abstract: There is also provided a dust extraction module for use with a power tool, the dust extraction module having: a dust collection chamber (50) having an inlet (52) connectable in fluid communication with an outlet (44) of a dust-extracting duct (40) of the power tool, and having an outlet (54) in fluid communication with atmospheric air; and a filter (60) locatable in fluid flow between the outlet of the dust collection chamber and the atmospheric air; wherein the dust collection chamber (50) has a substantially circular cross section, the inlet (52) to the dust collection chamber is at the perimeter of the circle and the outlet (54) of the dust collection chamber is from the middle of the circle.

Abstract: A ferrule holder assembly for an optical-fiber-end-face grinding apparatus comprises a ferrule holder board supported to be moved upward and downward in parallel with a grinding board of the optical-fiber-end-face grinding apparatus, a ferrule sleeve provided at the ferrule holder board for receiving and supporting an optical fiber ferrule while putting the tip at the grinding board, an adapter for retaining the optical fiber ferrule or a connector for supporting the optical fiber ferrule in a state where the optical fiber ferrule is inserted into the ferrule sleeve, and an urging unit for urging the adapter in a direction opposite to the grinding board from the ferrule holder board.

Abstract: An improved dust collector for a power tool is employed. The dust collector includes a body portion, a neck portion and a head portion, wherein the body portion is disposable on the power tool so that during the cutting operation the body portion will receive and direct the air, dust, and debris to the head portion via the neck portion to either be exhausted out or to be collected in a dust collection volume. Preferably, the body portion has a series of openings to allow the user to view the cutting wheel during the cutting operation. The body portion may also have an internal directional member for efficiently directing the flow of air, dust, and debris. The head portion is preferably rotatably connected to the neck portion to allow the user to rotate the head portion to a desired position.

Abstract: A tip of a capillary used for microinjection is polished on a plurality of sides by using a polishing plate having a surface roughened by dry etching. A first side of the tip is placed on the polishing plate at a predetermined angle and with a predetermined amount of pressing. The polishing plate is repeatedly moved at a predetermined speed by a predetermined distance such that the first side is polished. The capillary is then rotated around an axis thereof to obtain a second side of the tip, and the process of polishing is repeated for the second side.

Abstract: The present invention is based on a hand-held power tool with a housing (12), an oscillating body (18) provided for oscillation relative to the housing (12), and connecting means (22) which fasten the oscillating body (18) to the housing (12). It is provided that the connecting means (22) include a receiving part (26) which can be installed in the housing (12) and an oscillating element (28) which is separate from the receiving part (26) and is provided for deformation.

Abstract: A sander-casing may include: a field housing to contain at least a motor, the field housing having an interface connectable to a random orbital sander (ROS) shroud and a quarter sheet sander (QSS) shroud. The ROS shroud can contain an ROS-type power transmission. The QSS shroud can contain a QSS-type power transmission.

Abstract: The present invention refers to a motorized tool with suction and dust collection capacity. The tool comprises: means for extracting dust suitable for producing a flow of air; means for collecting dust having a first duct for the entrance of the air, that can be connected separately to said tool, and at least one second duct for the air, connected to the outside environment; said means for collecting dust include a filtering element positioned between said first duct and said second duct. Said filtering element defines an internal space and an external space surrounding said internal space, one of which is in communication with said first duct and the other is in communication with said second duct.

Abstract: The present invention relates to an anti-vibration arrangement (10) for a power sander (1) which comprises a housing (2), a motor (4) arranged in the housing (2), a rotary drive shaft (11), a first outer or ring-shaped pad surface (16) for attaching a first sanding paper (8) and a second inner or circular pad surface (22) for attaching a second sanding paper (9). The anti-vibration arrangement (10) serves to transfer energy from the motor (4) to the pads (16, 22) with out-of-phase motions to dynamically compensate for inertial and friction forces. For this purpose, twin cams (18a, 18b) are fixed on the rotary drive shaft (11). The cams (18a, 18b) rotate the central axes (15, 21) of the pads (16, 22) about the rotary drive shaft axis (12) with a phase differential of typically 180°.

Abstract: The present invention relates to a two-way rotary multi-function polisher, which comprises an input shaft driven to rotate by a power resource, a first spur gear and a second spur gear engagably transmitted by the end of input shaft; wherein the first spur gear is in response to the second spur gear and fixed to an output shaft having an inner polishing disc at the end thereof, so as to rotate the inner polishing disc in the first direction, while the second spur gear is coupled to a sleeve having an outer polishing disc at the end thereof and disposed to the exterior of output shaft by a bearing, so as to rotate the outer polishing disc in the second direction; hence, while the input shaft rotating, the inner and the outer polishing disc can respectively rotate in the opposite direction, enabling the two-way polishing and grinding to be achieved.

Abstract: The small polishing apparatus is capable of simultaneously polishing both side faces of a work piece, and a lower polishing plate, an internal gear and a sun gear are respectively driven by direct drive (DD) motors. The polishing apparatus comprises: an upper and a lower polishing plates; a sun gear and an internal gear; and a carrier provided between the polishing plates and engaged with the gears. Both side faces of the work piece held by the carrier are simultaneously polished by the polishing plates. DD motors respectively rotate the lower polishing plate and the gears. Each DD motor has a ring-shaped output member. A first DD motor has the output member directly connected to a rotary holding member rotatably holding the lower polishing plate. A second DD motor is provided under the first DD motor.

Abstract: An optical connector machining apparatus (500) is comprised of an operation circuit box (1) containing a drive motor (9) and a battery (10) while serving as a grasping section, and a planetary gear mechanism box (2) having a drive mechanism (8) that rotatably holds a polishing table (4) with a polishing table retainer (3) while permitting rotation of the drive motor to be delivered to the polishing table retainer through a planetary gear mechanism, wherein a chuck mounting section (5) is fixedly secured to the planetary gear mechanism box through two pieces of columns (6, 6), and a chuck (43), slidably guiding a ferrule (A) with respect to the polishing table in a vertical direction, and a pressure-applying mechanism (7) for urging the ferrule to the polishing table in a vertical direction, are mounted to the chuck mounting section.

Abstract: An oscillatory drive comprising a rotating drive shaft is disclosed. The oscillatory drive is driven by an eccentric element that is coupled via a pivot element to a tool drive shaft arranged at an angle to the drive shaft for oscillatingly driving the tool drive shaft pivoting back and forth about its longitudinal axis. The eccentric element comprises a spherical outer ring which is guided within an at least partially cylindrical inner surface of the pivot element. By spring biasing the free end of the pivot element at both outer sides against the housing, efficiency is improved and vibrations are reduced.

Abstract: A method and apparatus for improving uniformity of the rate of removal of material from the surface of a workpiece, such as semiconductor substrate, by polishing. In accordance with the invention, the workpiece is subjected to a vibratory polishing method, and optionally at least one additional polishing motion selected from rotational, oscillating, sweeping, orbital and linear polishing motions. As a result, polished workpieces, such as semiconductor wafers, have reduced surface defects, improved planarity, and are polished more uniformly over a wider area.

Abstract: The polishing machine is capable of evenly applying a pressing force from an upper polishing plate to work pieces accommodated in through-holes of carriers. The polishing machine comprises: a plurality of the carriers provided around a center of gravity of an upper polishing plate and sandwiched between the polishing plates. Circular motion of the carriers, without revolving, are performed independently. Centers of gravity of the work pieces, which are held by the carriers, are simultaneously moved close to a center of gravity of the upper polishing plate and simultaneously moved away therefrom, and moving distances of the centers of gravity of the work pieces are equal.

Abstract: An end face polishing apparatus has a lapping board mounted to undergo rotation and revolving movement, a lapping member having a polishing surface and disposed on the lapping board for rotation and revolving movement therewith, a polishing fixture for supporting a workpiece having an end face, and a pressing member. During a polishing operation, preselected portion thereof to bring the end face of the workpiece into pressure contact with the polishing surface of the lapping member and to dispose the preselected portion at a position closer to the polishing surface than to a center of gravity of the polishing fixture to thereby polish the end face of the workpiece during rotation and revolving movement of the lapping board.

Abstract: The present discovery refers to a connecting foot for a machine constituted by a central cylinder of hard plastic material, possibly fitted with a hole, coaxial to said central cylinder, and by an external coating of rubber. Said rubber also fills the hole forming a rod that connects the two heads of the external coating. The external coating of the foot is constituted by a single piece that completely covers the internal cylinder. An orbital sanding machine is also described, comprising a machine body that supports a motor for the rotation of a vertical shaft, a rotative-orbital plate connected eccentrically to said shaft by means of an eccentric hub in relation to the axis of the shaft and elastic connecting feet between the operating plate and the machine body.

Abstract: A lapping method includes a step of moving a substantially bar-shaped workpiece in a radial direction of a surface of a rotary lapping plate while simultaneously oscillating the workpiece pivotally about a central point in a longitudinal direction of the workpiece in a plane parallel to the surface of the rotary lapping plate.

Abstract: A polishing apparatus includes a polishing pad rotated by a surface plate rotating shaft about a surface plate axis, a slurry conduit supplying slurry to an upper surface of the polishing pad, a substrate holding mechanism holding a substrate, a substrate rotating shaft rotating the substrate holding mechanism about a substrate axis, and a rotating mechanism rotating the substrate axis or the surface plate axis about an eccentric axis. The angular velocity of rotation about the eccentric axis is set larger than the angular velocity of rotation about the substrate axis or the surface plate axis. Thus, the effective contact area between a small area on the substrate and the polishing pad is increased, biased wear of abrasive grains on the polishing pad is prevented, clogging of the polishing pad is suppressed, and new abrasive grains and new chemicals can be supplied with high efficiency to each area of the substrate. Thus, the polishing rate is improved.

Abstract: The frame of a polishing machine has a disc-shaped polishing table mounted thereon for rotation coaxially about a vertical axis, the table having thereon an upper, generally planar polishing surface for removably supporting thereon a plurality of annular workpiece carriers for rotation therewith and for rotation about their repsective axes relative to the table. The outer peripheral surface of each carrier is disposed to be engaged at angularly spaced points thereabout by a pair of rollers mounted on the frame for rotation about spaced, vertical axes. The output of a single AC electric motor is connected to the table to effect rotation thereof about its vertical axis, and to one roller of each pair thereof to drive the one roller about its axis. The one roller of each such pair thereof is in driving, rolling engagement with the carrier engaged thereby, while the other roller of such pair is rotated by the engaged carrier.

Abstract: A method for producing, from a blank, restrictive tooling for use in an orbital polishing machine involves urging one of either the workpiece or the blank along a predetermined path against the other to physically impart a proportioned contour of the workpiece into the blank, thereby producing the restrictive tooling. Using this method, the same orbital polishing machine may be used to produce the restrictive tooling and to subsequently polish the workpiece.

Abstract: An orbital finishing sander for finishing coarsely sanded wood pieces includes a support frame and a conveyor belt movably mounted on the frame and extending generally horizontally thereon. An orbital sander support such as a plate is mounted on the frame and extends over and above the conveyor belt for supporting at least one orbital sander vertically movably mounted on the orbital sander support, the orbital sander being movable between a lowered engagement position and a raised non-engagement position. At least one orbital sander movement device such as a pneumatic ram would be operatively connected to each one orbital sander for moving the associated orbital sander between the lowered engagement position and the raised non-engagement position.

Abstract: An end face polishing apparatus has a jig plate for supporting at least one workpiece having an end face and a polishing member for polishing the end face of the workpiece. A support mechanism supports the jig plate to undergo movement in a direction toward the polishing member to bring the end face of the workpiece into pressure contact with the polishing member solely under the weight of the jig plate.

Abstract: An apparatus and method are provided for polishing end faces of optical connector ferrules, wherein control is performed to achieve uniform pressure of each ferrule with respect to a polishing plate of the apparatus, there by improving the precision of polishing the ferrule end faces. A polishing apparatus (100) for polishing end faces of ferrules to a convex spherical shape comprises a polishing plate (4), a polishing apparatus main unit (2) capable of freely moving the polishing plate (4) in the XY plane while rotating it, a cylinder block mechanism (3) with a plurality of pressure-applying mechanisms (13) arranged in a ring, and a height adjustment mechanism (5) of the cylinder block mechanism, the pressure-applying mechanism (13), having a piston shaft (16) which is pushed outward in a direction perpendicular to the polishing plate (4) by an air cylinder (17), the ferrule (10) being mounted to the end part of the pressure-applying mechanism (13) via a ferrule holding plate (20).

Abstract: An end face polishing apparatus that allows a rod-shaped member to be polished with improved precision and the polishing process to be simplified is provided. In an end face polishing apparatus that polishes a rod-shaped member mounted at a polishing fixture by pressing the rod-shaped member against a lapping member on a lapping board that is supported at the main body of the apparatus to rotate and rock, the polishing fixture is pressed through an abutting part against a supporting portion provided at the apparatus main body, and the abutting part is located more on the side of the lapping board than the center of gravity of the polishing fixture.

Abstract: A production type surface finishing apparatus for finishing the surfaces of workpieces such as cabinet doors and the like which include a plurality of relatively large, very lightweight finishing platens that are simultaneously movable in both a reciprocal and an orbital-like motion. The platen is moved in a reciprocal motion by a first motion-imparting mechanism and is simultaneously moved in a high-frequency, orbit-like motion by a second motion-imparting mechanism that includes shafts which are rotated at relatively high rates of speed. The shafts, and the motors which drive them, are mounted on platforms which are reciprocally movable relative to the main frame of the device. Connected to the rotating shafts by specially designed elastomeric sleeve-like members or yieldably deformable connector bands are specially configured, ring-like members. The rings are, in turn, connected to the platen assemblies by novel shaft and bearing assemblies.

Abstract: End face polishing apparatus and method that allow the eccentricity of curvature of an end face of a rod-shaped member to be reduced and the cost to be reduced by efficient use of a lapping sheet, so that the polishing efficiency is improved. In an end face polishing apparatus that polishes a rod-shaped member mounted at a polishing fixture by pressing the rod-shaped member against a lapping member mounted at a polishing plate rotatably and rock-ably supported at the main body of the apparatus, the polishing fixture is secured to a first virtual disk having a prescribed diameter and the lapping member is driven to move relative to the polishing fixture so that the first virtual disk moves along the circumference of a second virtual disk as it rotates, and the second virtual disk moves along the circumference of a third virtual disk as it rotates.

Abstract: Specific embodiments of the present invention provide a chemical-mechanical planarization apparatus for planarizing an object comprising a shaft having a shaft axis and being connected with a polishing head which is coupled to a polishing pad. The polishing pad has a smaller diameter than the object to be planarized. The shaft is rotatable to spin the polishing head and polishing pad around the shaft axis. An orbit housing has, spaced from an orbital axis, an eccentric hole through which the shaft is rotatably disposed. The orbit housing is rotatable to orbit the shaft, the polishing head, and the polishing pad around the orbital axis. In some embodiments, the object is rotated at an object rotational speed and the polishing pad is rotated around the orbital axis at an orbiting speed. A ratio of the greater of the object rotational speed and the orbiting speed to the lesser of the object rotational speed and the orbiting speed is a non-integer.

Abstract: A method and apparatus for improving uniformity of the rate of removal of material from the surface of a semiconductor substrate by chemical mechanical polishing. In accordance with the invention, the semiconductor substrate is subjected to a combination of polishing motions, including orbital motion, and at least one additional polishing motion selected from rotational, oscillating, sweeping, and linear polishing motions. The invention also provides an improved method for conditioning polishing pads to provide more uniform conditioning and to extend their useful life span.

Abstract: The present invention is floor conditioning system. The floor conditioning system improves the ease of use as compared to currently available sanding or polishing devices. Thereby, allowing the unsophisticated do-it-yourselfers to use a floor conditioning system. The floor conditioning system provides a random rotating orbital action which greatly improves the ability to control a floor conditioning system as well as providing a much nicer job of conditioning a floor. The floor conditioning system includes a main housing, wheel assembly, a handle assembly, a motor, a belt cover, a belt, a dust recovery system and orbital head assemblies.

Abstract: An apparatus that mass polishes a variety of fiber optic cable connectors simultaneously. The apparatus includes a plurality of polishing plates, each capable of holding its own polishing film and pad, and having a varying height. The apparatus further includes a plurality of connector fixtures that may receive a variety of connectors at varying angles. Each connector fixture communicates with a corresponding polishing pad. Thus, fiber optic cable connectors having a variety of polished end faces may be provided with the apparatus. The apparatus also eliminates the potential for contamination among polishing films, reduces polishing steps, and saves labor and maintenance costs.