Abstract: The present invention provides exemplary methods, systems and apparatus that provide improved substrate characteristics after grinding operations by avoiding or reducing overgrind damage to the wafers. In one embodiment, a grinding apparatus (100) includes a first spindle (110) having an eccentric-shaped abrasive matrix (112) coupled thereto and a second spindle (116) adapted to hold a substrate (118) to be ground. The second spindle is offset from said first spindle such that the abrasive matrix passes through the substrate surface center (134) for only a portion of the time during grinding operations.

Abstract: The abrasive system of the present invention is capable of automatically and efficiently feeding and discharging work pieces. In the abrasive system, an upper abrasive plate and a lower abrasive plate pinch the work pieces, which are provided in through-holes of a carrier and abrade both faces of each work piece. A carrier driving mechanism moves the carrier, along a circular orbit, without spinning, together with the work pieces. Stopping means stops the movement of the carrier at a predetermined position. The feeding-and-discharging means includes: an arm robot having a work holding unit, which is provided to a front end and capable of holding and releasing the work piece; and an image processing unit for recognizing shapes and positions of the through-holes of the carrier and the work pieces.

Abstract: Method and apparatus for chemically mechanically polishing semiconductor substrates with enhanced durability, reliability and polishing effectiveness. In the method of the present invention, the substrate and the pad respectively orbits to guarantee uniform polishing across the substrate in principle. The apparatus of the present invention employing the above method is mechanically stable to enhance process reliability.

Abstract: A random orbital finishing apparatus for finishing the surfaces of solid material including wood, plastic, metal and composites, but most particularly plastic solid surface materials. The apparatus includes a conveyor for transporting such unfinished material pass a uniquely mounted random orbital sander where it is subsequently finished thereby. A plurality of random orbitals may be mounted and in a side-by-side position. The apparatus may further include a system of proximity sensors and air cylinders which enable the random orbitals to automatically adjust their position onto the surface to be finished when the material is passed thereby and subsequently return back to a starting position after the material passes.

Abstract: An end face polishing apparatus comprises a polishing board and a jig board for supporting workpieces. A polishing member is detachably arranged on the polishing board and has a polishing film for polishing end faces of the workpieces while the workpieces are supported by the jig board. A first holding device holdings unused polishing members each having a new polishing film preliminarily attached thereto. At least one second holding device holds used polishing members which have been removed from the polishing board. A polishing member exchanging device is mounted for linear movement in horizontal and vertical directions for exchanging a used polishing member arranged on the polishing board with an unused polishing member by seizing the used polishing member from the polishing board and conveying the used polishing member to the second holding device, and by taking an unused polishing member from the first holding device and placing the unused polishing member on the polishing board.

Abstract: An end face polishing apparatus is provided in which polishing may be carried out with a constant load on a ferrule when polishing the end face of the ferrule. The end face polishing apparatus in which a rod-shaped member mounted on a jig plate by a polishing member mounted on the polishing plate which is rotatably and swingably supported to the apparatus body is polished in which the jig plate is supported in a state where rotation is restricted, and is provided with at least the mounting portion of the rod-shaped member movable in the vertical and lateral direction and is supported to the jig plate by the tip end of the rod-shaped member.

Abstract: An orbiting head is rotatably mounted in the housing. The orbiting head has an axial end with a grinding surface for contact with the workpiece having its surface finished. The orbiting head defines a fluid passage with one end having an opening at the grinding surface. A spindle arbor is connected to the orbiting head and rotates with the orbiting head. The spindle arbor also defines a passage having one end connected to the passage of the orbiting head, and having another end connected to a fluid source. A drive is connected to the spindle arbor for driving the spindle arbor and the orbiting head in rotation. The orbiting head is rotated, and the grinding surface is placed into contact with the surface of the workpiece, and in relative rotation to the surface of the workpiece. Fluid is then moved through the passages from the fluid source to the opening in the grinding surface, and from the opening to an area between the grinding surface and the workpiece.

Abstract: Surface polishing system adapted to polish, lap or grind a surface of a workpiece in a plane such that the workpiece is held in sliding contact with a polishing face of a rotating polishing plate, wherein the workpiece is rotated by a work rotating device about an autorotation axis thereof which is parallel to an axis of rotation of the polishing plate and which lies within the surface of the workpiece, and the autorotation axis of the workpiece is revolved by a work revolving device about a revolving axis which is parallel to the axis of rotation of the polishing plate and which lies within a circumscribed circle of the surface of the workpiece.

Abstract: An end face polishing apparatus comprises a jig plate for supporting a workpiece, a polishing member for polishing an end face of the workpiece, and a movable lever connected to the jig plate. A pressurizing section presses the lever to bring the end face of the workpiece into pressure contact with the polishing member. The pressurizing section has a first spring member for biasing the lever in a first direction, a pressurizing head for biasing the lever in a second direction opposite to the first direction, a second spring member for biasing the pressurizing head in the second direction, and a pressure sensor disposed between the pressurizing head and the lever for detecting a pressure applied by the end face of the ferrule onto the polishing member when the lever is pressed by the pressurizing section. A pressurization control section controls the pressure applied by the end face of the workpiece onto the polishing member when the lever is pressed by the pressurizing section.

Abstract: A random orbital finishing apparatus for finishing the surfaces of solid material including wood, plastic, metal and composites, but most particularly plastic solid surface materials. The apparatus includes a conveyor for transporting such unfinished material pass a uniquely mounted random orbital sander where it is subsequently finished thereby. The random orbitals may be dually mounted and in an offset position. The apparatus may further include a system of proximity sensors and air cylinders which enable the random orbitals to automatically adjust their position onto the surface to be finished when the material is passed thereby and subsequently return back to a starting position after the material passes.

Abstract: A sizing lapping apparatus includes a rotatably provided disk-shaped lap plate for supplying a lapping liquid thereto; at least one holding portion for holding a workpiece, the at least one holding portion being used to press the workpiece against the lap plate; a support shaft, provided in an erected state with respect to the lap plate, for supporting the at least one holding portion; an oscillating mechanism for causing the support shaft to undergo oscillatory rotational motion around an axis thereof; a base for supporting the support shaft so that the support shaft freely rotates around the axis thereof; and a base rocking mechanism for reciprocating the base in a diametrical direction of the lap plate or in a direction substantially parallel to the diametrical direction. The sizing lapping apparatus can carry out lapping operations with very high precision. This is made possible by partly adjusting the amount by which the workpiece is lapped, in accordance with the lapping state of the workpiece.

Abstract: An eccentric orbit abrading apparatus includes a housing having a base for supporting the abrading apparatus on a surface. A workpiece support member is mounted on the housing and provides a surface for supporting the workpiece thereon. A motor is mounted in the housing and includes a motor shaft that may selectively rotate about a first rotational axis. A transmission transmits the rotational motion of the motor shaft to a platen so that as the motor shaft rotates, the platen is caused to rotate about a second rotational axis that is offset from and orbits about the first rotational axis.

Abstract: A lapping assembly for lapping a group of workpieces including a pair of lapping discs and a cassette for positioning the workpieces between the lapping discs. The lapping discs are provided with two-component translational oscillations at the appropriate cutting speed, parallel to their working planes. This motion is effected using crank pins rotating about a coaxially positioned axis and elastic members (or swivel-supporting) members coupled to the body of the lapping machine to prevent the lapping discs from rotating. The cassette has an opening having a curvilinear shape for holding the workpieces, and protrusions which extend into the opening. The cassette is mounted on a support element and equipped with a drive to rotate it about a stationary axis. Alternatively, the cassette can be fixed during treatment and the lapping discs can be rotated at a speed less than the cutting speed.

Abstract: A production type surface finishing apparatus for finishing the surfaces of work-pieces such as cabinet doors and the like which include a plurality of relatively large, very lightweight finishing platens that are simultaneously movable in both a reciprocal and an orbital-like motion. The platen is moved in a reciprocal motion by a first motion-imparting mechanism and is simultaneously moved in a high-frequency, orbit-like motion by a second motion-imparting mechanism that includes shafts which are rotated at relatively high rates of speed. The shafts, and the motors which drive them, are mounted on platforms which are reciprocally movable relative to the main frame of the device. Connected to the rotating shafts by specially designed elastomeric sleeve-like members are specially configured, ring-like member which are provided with a plurality of circumferentially spaced apertures along one edge of the ring. The rings are, in turn, connected to the platen assemblies by novel shaft and bearing assemblies.

Abstract: Employed is a crown forming method of forming a crown on a floating type magnetic head which includes the steps of placing an approximately rectangular-prism-shaped bar, which has magnetic head elements of not less than 1 formed on a side wall thereof in a row, on the convex surface of a jig whose radius of curvature is R.sub.1 through an elastic sheet while facing the upper surface (surface to be processed) of the bar to a lapping surface plate having a concave processing surface whose radius of curvature is R.sub.2 with the relationship between the radius of curvatures set to R.sub.1 .gtoreq.R.sub.2, deforming the bar to an arc shape along the longitudinal direction thereof and bonding it on the convex surface together with the elastic sheet, and lapping the upper surface (surface to be processed) by abutting it against the processing surface and moving the upper surface (surface to be processed) relative to a processing surface.

Abstract: The face of a ferrule and ferrule assembly is polished in the present invention so a portion of optical fibers extending therethrough protrude beyond the front face of the ferrules. The ferrules are secured in a polisher and polished with a fibrous material that preferentially etches the ferrule relative to the optical fibers. The front face of the ferrule assembly is polished with a fibrous material having abrasive materials attached thereto, without the need for a slurry.

Abstract: A polishing apparatus prevents uneven wear of the platen and improves the operating rate of the apparatus. The polishing apparatus provided with a platen 1 divided into an inner peripheral platen portion 11 and an outer peripheral platen portion 13 and with a carrier 5, wherein by making the inner peripheral platen portion 11 and the outer peripheral platen portion 13 rotate in opposite directions and setting the rotational speeds of the inner peripheral platen portion 11 and the outer peripheral platen portion 13 so that the mean relative speed of a wafer 200 and the inner peripheral platen portion 11 and the mean relative speed of the wafer 200 and the outer peripheral platen portion 13 become substantially equal, it becomes possible to make the amount of wear of the polishing pad 11a of the inner peripheral platen portion 11 and the amount of wear of the polishing pad 13a of the outer peripheral platen portion 13 substantially equal.

Abstract: A polishing system and a method of control of the same enabling reliable transfer of the workpieces into and out of the system while maintaining the precision of polishing of the workpieces. Provision is made of a polishing apparatus 1, a first transfer apparatus 2, a second transfer apparatus 3, and a control apparatus 4. In the polishing apparatus 1, workpieces W held in m number of holding holes 14 formed in n number of carriers 14 are polished on their two surfaces by a lower platen 10 and an upper platen 19. The control apparatus 4 finds the revolution angle of the carriers 14 when the workpieces reach the desired thickness, makes the carriers revolve until the revolution angle of a whole multiple of 360.degree./n closest to the revolution angle found, and then makes the polishing apparatus 1 stop.

Abstract: A wafer is rotated on its axis, which is biased with regard to an axis of a grinding wheel, and revolves around an axis which is biased with regard to the axis of the wafer and the axis of the grinding wheel. In this state, the grinding wheel is abutted against the surface of the wafer. Thus, all abrasive grains on the grinding wheel can act on the whole surface of the wafer.

Abstract: A grinding cup includes a wear part having a cavity at its front end, the cavity configured for grinding a button of a rock drill bit. A flush channel extends forwardly through the wear part and terminates at the cavity for conducting a flushing medium thereto. The flush channel is spaced from a center axis of rotation of the grinding cup by a distance greater than 2% and less than 30% of a largest diameter of the cavity.

Abstract: A device is disclosed for removing the information bearing surface and the data carried thereby from the substrate layer of a compact disc. The device includes a housing having an upper portion defining a top surface and a central cavity and a lower portion having interior and exterior surfaces. The lower portion is selectively attachable to the upper portion to enclose the lower portion interior surface within the cavity, the interior surface being sized and shaped for selectively carrying a compact disc. A mechanism is disposed within the cavity for physically removing the information bearing surface of a compact disc positioned on the lower portion interior surface. A member is provided for continuously biasing the physical removal mechanism against the information bearing surface of a compact disc positioned on the interior surface as the information bearing surface is being removed. Finally, an element is provided for actuating the physical removal mechanism.

Abstract: A chemical mechanical polishing apparatus polishes the surface of a substrate to remove material therefrom, The apparatus includes a carrier, which positions the substrate against the rotating polishing pad. The carrier includes an integral loading member therein, which controls the load force of the substrate against the polishing pad. Multiple substrates may be simultaneously polished on a single rotating polishing pad, and the polishing pad may be rotationally oscillated to reduce the likelihood that any contaminants are transferred from one substrate to another along the polishing pad. A multi-lobed groove in the polishing pad may be used, in conjunction with a moving substrate, to polish the surface of the substrate.

Abstract: The method and associated apparatus of the present invention polishes the front face of a ferrule with first and second slurries such that an end portion of each optical fiber which extends through and is held by the ferrule protrudes beyond the preferentially etched front face of the ferrule by a preselected length. In order to preferentially etch the front face of ferrule as desired, the front face of the ferrule is polished with a first slurry having a plurality of suspended particulates of a first predetermined size on average which initiates the preferential etch of the ferrule relative to the optical fibers. Thereafter, the front face of the ferrule is polished with a second slurry having a plurality of suspended particles of a second predetermined size on average.

Abstract: A polishing machine for polishing a single side (e.g. a circuit side) of a workpiece (e.g. a semiconductor wafer) includes two platens. A first platen can be a workpiece-holding platen having slots or other structure for holding wafers or other workpieces. The second platen is a polishing platen and is covered with a polishing pad or other material used for polishing, e.g. glass or metal polishing. The two platens have laterally spaced axes of rotation such that, from a top view, the right side of one platen overlaps the left side of the other platen or vice versa. The two platens are both rotated at the same angular velocity i.e. at the same revolutions per minute (RPM) and both clockwise or both counterclockwise, and the two platens overlap such that the differences in velocity (i.e., relative velocity) between overlapping points on the two platens across a workpiece held on the first platen is constant.

Abstract: A dressing apparatus is used to resurface a polishing surface of a polish cloth used to polish semiconductor wafers. A dressing brush which spins on its own axis is also coupled to a drive shaft of a main drive of the dressing apparatus through a planetary gear mechanism so that the brush will rotate or orbit about the drive shaft. Therefore, the dressing brush traces a complex path and its dressing action is spread over a wide surface area of the polishing cloth to produce thorough resurfacing of the polishing surface. The service life of the cloth is significantly increased and contributes to improving the overall efficiency of preparing high quality polished semiconductor wafers. For economy, the dressing apparatus can be mounted easily on a conventional polishing apparatus having a dressing facility.

Abstract: The present invention relates to improvements in devices for use as grinding cups for grinding the hard metal pins or working tips of drill bits and more specifically, but not exclusively, for grinding the tungsten carbide cutting teeth or buttons of a drilling head and the means for detachably connecting the grinding cups to the grinding machine. The grinding cups consisting of a bottom grinding section and a top body section having top and bottom surfaces. The grinding section is formed from a material capable of grinding the tungsten carbide button bits such as a metal and diamond matrix. The peripheral edge in the bottom surface may be bevelled to facilitate the removal of steel from the face of the bit around the base of the button during grinding. A centrally disposed convex recess is formed in the bottom surface having the desired profile for the button to be ground. The body section has a centrally disposed cavity formed in the top surface of the grinding cup.

Abstract: A process for polishing substrates includes a carrier which receives a substrate and positions it against a slowly rotating polishing pad. The carrier orbits the pad on the rotating pad, at a speed significantly greater than the rotational speed of the polishing pad, to ensure that the movement of the polishing pad is a very small increment of the cumulative motion between the pad and substrate.

Abstract: A tool for fining/polishing an opthalmic lens has a spindle and a pliant casing containing a conformable filler connected to the spindle for rotation therewith. A pliant pad adhered to the casing has a plurality of slots extending from its perimeter toward its center defining a plurality of fingers which are contoured to the surface of the lens by the filler.Preferably, the lens is rotated about a vertical fixed axis substantially transverse to the lens and the tool is rotated about a fixed axis intersecting the lens and substantially normal to a surface of the lens to be fined/polished with the tool disposed above the lens. The axis of the horizontal displacement of the tool can be selectively varied in relation to the lens axis. The angular disposition of the tool axis in relation to the lens axis can be selectively varied.

Abstract: An optical connector tip polisher which comprises a stationary block for supporting a wheel spindle stock, a manual slider for supporting an optical connector and a cam mechanism. The stationary block has a base for mounting the wheel spindle. The base has a guide space and a guide opening. The manual slider has a horizontal stock, a post and is a holder. The horizontal stock is fitted in the guide space of the base and restricted against movement in the vertical direction while being movable along a horizontal plane. The post is embedded in the horizontal stock and is movable in unison therewith. The post extends upright through the guide opening of the base. An idling wheel is provided between the inner periphery of the guide opening and the outer periphery of the post to guide the post along the inner periphery. The holder is secured to the post at an intermediate position thereof and holds an optical connector to perpendicularly press the tip of the optical connector against the wheel spindle stock.