Abstract: An end face polishing device has a first revolution shaft mounted for undergoing revolving movement about a first axis, a rotational shaft mounted for undergoing rotation about a second axis eccentric from the first axis, and a second revolution shaft mounted for undergoing revolving movement about a third axis eccentric from the second axis. A polishing disc is connected to the second revolution shaft for revolving movement therewith.

Abstract: An end face polishing machine has a jig plate for supporting at least one workpiece. A polishing plate is mounted to undergo rotation and revolving movement. A polishing sheet is disposed over the polishing plate for rotation and revolving movement therewith. An elastic member having a hardness that varies with temperature is disposed between the polishing sheet and the polishing plate. A pressing unit presses the end face of the workpiece against a surface of the polishing sheet during rotation and revolving movement of the polishing plate to thereby polish the end face of the workpiece during a polishing operation. A temperature control unit controls the temperature of the elastic member during the polishing operation to thereby polish the end face of the workpiece into a spherical surface during the polishing operation.

Abstract: The center of a turntable 30 moves around the central axial line of an autoroation disk 20 along the circular orbit C of a smaller diameter than that of an autorotation disk 20. Thus, the turntable 30 revolves both around a center point O and on its own axis in accordance with an autorotation of the autorotation disk 20. A polishing holder 60 holds a connector of an optical fiber polished by a polishing film 41 arranged on the upper plane of the turntable 30. An optical fiber end face polishing machine provided with a memory 85 for storing a control program which allows a control device 80 to execute predetermined polishing steps, the control device 80 being for controlling an autorotation motor 16 of the turntable 30 and a revolution motor 14 thereof.

Abstract: A ferrule end-surface polishing apparatus for polishing an end-surface of a ferrule for an optical fiber is provided. The apparatus includes a ferrule holder having a holder block capable of sandwiching a cylindrical portion of a ferrule, and a guide block for guiding the ferrule to the holder block; a polisher having a rotatable polishing board for polishing an axial end-surface of the ferrule held by the ferrule holder; and a ferrule transfer device for transferring and loading the ferrule into the ferrule holder, and for removing the ferrule therefrom after polishing. With this configuration, the ferrule polishing operation is automated.

Abstract: The frame of a polishing machine has a disc-shaped polishing table mounted thereon for rotation coaxially about a vertical axis, the table having thereon an upper, generally planar polishing surface for removably supporting thereon a plurality of annular workpiece carriers for rotation therewith and for rotation about their repsective axes relative to the table. The outer peripheral surface of each carrier is disposed to be engaged at angularly spaced points thereabout by a pair of rollers mounted on the frame for rotation about spaced, vertical axes. The output of a single AC electric motor is connected to the table to effect rotation thereof about its vertical axis, and to one roller of each pair thereof to drive the one roller about its axis. The one roller of each such pair thereof is in driving, rolling engagement with the carrier engaged thereby, while the other roller of such pair is rotated by the engaged carrier.

Abstract: A supporting device for a plurality of adapter chucks for the precision grinding or polishing of optical components comprises a spindle shaft having a central bore for supplying one of a gas and a vacuum, at least one arm adjustably supported by a head of the spindle shaft and having a seating for an adapter chuck, and a flexible vacuum/gas line provided between the seating and the spindle shaft. The arm is adjustable as to its angle of inclination relative to an axis of the spindle shaft.

Abstract: The polishing machine for stone materials comprises: a conveyor belt for the slabs or strips to be polished, a beam made to oscillate on at least two transverse, fixed frames above the said conveyor, at least one oscillating mechanism, a number of polishing heads, aligned on the said beam and oscillating with it, a device for detecting the shape and/or dimensions of the slabs or strips, positioned upstream of the working area, a process and control calculator for the polishing machine, and has, positioned parallel to the said first beam a second beam, also equipped with a number of polishing heads aligned transversely with the polishing heads of the said first beam, and made to oscillate synchronously with it, by means of adjustable coupling devices, that enable the distance between the rows of polishing heads on the said first beam and second beam to be varied.

Abstract: A worktool comprises a principal drive shaft with a sun gear attached thereto. At least two planetary gears are distributed about the circumference of the sun gear at substantially equal angular separation. A carriage constrains the planetary gears such that they maintain their angular separation about the axis of the principal drive shaft. Each planetary gear has an eccentric axis in addition to its rotational axis constrained by the carriage, such that each planetary gear can drive, in use, a rotating work-piece engaging surface around the respective eccentric axis. There may be a phase difference of 2&pgr;/n radians (n being an integer equal to the number of planetary gears) between any two eccentric axes.

Abstract: Specific embodiments of the present invention provide a chemical-mechanical planarization apparatus for planarizing an object comprising a shaft having a shaft axis and being connected with a polishing head which is coupled to a polishing pad. The polishing pad has a smaller diameter than the object to be planarized. The shaft is rotatable to spin the polishing head and polishing pad around the shaft axis. An orbit housing has, spaced from an orbital axis, an eccentric hole through which the shaft is rotatably disposed. The orbit housing is rotatable to orbit the shaft, the polishing head, and the polishing pad around the orbital axis. In some embodiments, the object is rotated at an object rotational speed and the polishing pad is rotated around the orbital axis at an orbiting speed. A ratio of the greater of the object rotational speed and the orbiting speed to the lesser of the object rotational speed and the orbiting speed is a non-integer.

Abstract: In a grinding apparatus with a rotor device driving an eccentrically mounted carrier device in which a shaft is mounted provided at one end with a head to which a supporting face for abrasive paper is fastened, facilitated grinding of curved surfaces by hand is obtained by the features that the supporting face is of curved design and has upper and lower sides with the same radius of curvature and is fastened to the head via an elastic element, and at least two guide devices are provided which cause the supporting face to be guided by the head reciprocatingly along a curved surface with the same radius of curvature as the supporting face.

Abstract: An end surface polishing drive mechanism has a first rotational shaft mounted for undergoing rotation about a first axis and for undergoing revolving movement about a second axis. The first rotational shaft has a first end for connection to a polishing device to undergo rotation therewith and a second end. A second rotational shaft undergoes rotation about the second axis. A drive mechanism produces a driving force to rotationally drive the first and second rotational shafts and to revolve the first rotational shaft. A first gear is connected to the first rotational shaft for undergoing rotation and revolving movement therewith. A second gear is rotatably mounted on the second rotational shaft and is connected to the first gear for transmitting a drive force of the drive means to the first rotational shaft.

Abstract: An end face polishing apparatus in which whereas a jig board mounted with a rod-like member is supported by an apparatus main body by a supporting mechanism, a polishing board mounted with a polishing member for polishing the rod-like member is supported by the apparatus main body rotatably and pivotably by a drive mechanism for polishing the rod-like member mounted to the jig board by the supporting mechanism by pressing the rod-like member to the rotating and pivoting polishing board, wherein the polishing member is mounted to the polishing board attachably thereto and detachably therefrom, further comprising an automatic interchanging device for interchanging the polishing member which is mounted to the polishing board and which has been used with the polishing member which is stored at a predetermined position and which is to be used by which the operational performance is promoted.

Abstract: A chemical mechanical polishing apparatus and method can polish a surface of an object very precisely at a high speed irrespective of the presence of a local defect on the surface to be polished. By using a multiplex ring-shaped polishing pad, an effective surface to be polished is increased, and very precise and uniform polishing can be performed at a high speed. By using a plurality of polishing pads, having different diameters smaller than the diameter of the surface to be polished, provided with an interval on the same revolution radius on a revolution table, or by using a plurality of polishing pads, having the same diameter smaller than the diameter of the surface to be polished, provided at positions having different revolution radii on a revolution table, very precise and uniform polishing can be performed.

Abstract: A mass production polisher includes a polisher base, a polishing element, a rotary arm, a fixture, a force-cushioning means and a force-applying means. The polishing element is provided in the polisher base. The rotary arm is rotatably provided on the polisher base. The fixture is connected to the rotary arm for holding at least one object. The force-cushioning means is provided on the rotary arm. The force-applying means is also provided on the rotary arm for applying force through the force-cushioning means to the fixture so that the object pushes against the polishing element.

Abstract: An end face polishing apparatus comprises a polishing board and a jig board for supporting workpieces. A polishing member is detachably arranged on the polishing board and has a polishing film for polishing end faces of the workpieces while the workpieces are supported by the jig board. A first holding device holdings unused polishing members each having a new polishing film preliminarily attached thereto. At least one second holding device holds used polishing members which have been removed from the polishing board. A polishing member exchanging device is mounted for linear movement in horizontal and vertical directions for exchanging a used polishing member arranged on the polishing board with an unused polishing member by seizing the used polishing member from the polishing board and conveying the used polishing member to the second holding device, and by taking an unused polishing member from the first holding device and placing the unused polishing member on the polishing board.

Abstract: A polishing apparatus includes a holder for holding a polished body with a polished surface thereof facing upwardly, and a polishing head for holding a polishing pad having a polishing surface having an area smaller than an area of the polished surface while contacting the polishing pad with the polished surface and for rotating the polishing pad around its rotation axis. The polishing head is provided with a driver for revolving the polishing pad around a revolution axis, and the revolution axis and the rotation axis are positioned so that a distance between the revolution axis and the rotation axis becomes smaller than a radius of the polishing pad.

Abstract: A non-circular workpiece carrier, which includes a wheel-like carrier body, and at least one carriage, wherein the wheel-like carrier body has a transmission unit disposed around the periphery thereof, which receives a transmission power for causing the wheel-like carrier body to turn round, and at least one carrier unit; the at least one carriage is respectively disposed in the at least one carrier unit to hold non-circular workpiece, and forced to gyrate in the at least one carrier unit relative to the wheel-like carrier body, enabling loaded non-circular workpiece to be surface-processed (ground, polished, etc.) more evenly. Different carriages are alternatively used with the carrier body subject to the shapes of workpiece to be processed.

Abstract: An orbiting head is rotatably mounted in the housing. The orbiting head has an axial end with a grinding surface for contact with the workpiece having its surface finished. The orbiting head defines a fluid passage with one end having an opening at the grinding surface. A spindle arbor is connected to the orbiting head and rotates with the orbiting head. The spindle arbor also defines a passage having one end connected to the passage of the orbiting head, and having another end connected to a fluid source. A drive is connected to the spindle arbor for driving the spindle arbor and the orbiting head in rotation. The orbiting head is rotated, and the grinding surface is placed into contact with the surface of the workpiece, and in relative rotation to the surface of the workpiece. Fluid is then moved through the passages from the fluid source to the opening in the grinding surface, and from the opening to an area between the grinding surface and the workpiece.

Abstract: Surface polishing system adapted to polish, lap or grind a surface of a workpiece in a plane such that the workpiece is held in sliding contact with a polishing face of a rotating polishing plate, wherein the workpiece is rotated by a work rotating device about an autorotation axis thereof which is parallel to an axis of rotation of the polishing plate and which lies within the surface of the workpiece, and the autorotation axis of the workpiece is revolved by a work revolving device about a revolving axis which is parallel to the axis of rotation of the polishing plate and which lies within a circumscribed circle of the surface of the workpiece.

Abstract: An end face polishing apparatus comprises a jig plate for supporting a workpiece, a polishing member for polishing an end face of the workpiece, and a movable lever connected to the jig plate. A pressurizing section presses the lever to bring the end face of the workpiece into pressure contact with the polishing member. The pressurizing section has a first spring member for biasing the lever in a first direction, a pressurizing head for biasing the lever in a second direction opposite to the first direction, a second spring member for biasing the pressurizing head in the second direction, and a pressure sensor disposed between the pressurizing head and the lever for detecting a pressure applied by the end face of the ferrule onto the polishing member when the lever is pressed by the pressurizing section. A pressurization control section controls the pressure applied by the end face of the workpiece onto the polishing member when the lever is pressed by the pressurizing section.

Abstract: A device for grinding an end face at an edge of a workpiece bore of a workpiece has a driven grinding tool and a guide pin, connected to the grinding tool, for insertion into the workpiece. The guide pin is dimensioned so as to precisely match the workpiece bore. The guide pin has a central axis. The grinding tool has a grinding surface extending angularly to the central axis. The grinding tool is periodically displaceable transverse to the central axis.

Abstract: A multidisc floor grinder is constructed as a wheeled device that may be moved about the floor by means of a handle. The chassis of the floor grinder supports a bearing housing on gimbals that allow the bearing housing to vary in orientation as the device is moved across an uneven floor. The gimbals are aligned to allow rotation of the bearing housing about a bearing housing axis that is parallel to the floor. The bearing housing supports a main drive shaft which extends downwardly from the bearing housing. The main drive shaft is rotatable relative to the bearing housing within its bearings. A grinder mounting frame is rotatably mounted about the main drive shaft and is supported therefrom. The grinder mounting frame is driven in rotation about the main drive shaft at a greatly reduced speed relative to the rotation of the main drive shaft.

Abstract: A lapping assembly for lapping a group of workpieces including a pair of lapping discs and a cassette for positioning the workpieces between the lapping discs. The lapping discs are provided with two-component translational oscillations at the appropriate cutting speed, parallel to their working planes. This motion is effected using crank pins rotating about a coaxially positioned axis and elastic members (or swivel-supporting) members coupled to the body of the lapping machine to prevent the lapping discs from rotating. The cassette has an opening having a curvilinear shape for holding the workpieces, and protrusions which extend into the opening. The cassette is mounted on a support element and equipped with a drive to rotate it about a stationary axis. Alternatively, the cassette can be fixed during treatment and the lapping discs can be rotated at a speed less than the cutting speed.

Abstract: The invention encompasses polishing systems for polishing semiconductive material substrates, and encompasses methods of cleaning polishing slurry from semiconductive substrate surfaces. In one aspect, the invention includes a method of cleaning a polishing slurry from a substrate surface comprising: a) providing a substrate surface having a polishing slurry in contact therewith; b) providing a liquid; c) injecting a gas into the liquid to increase a total dissolved gas concentration in the liquid; and d) after the injecting, providing the liquid against the substrate surface to displace the polishing slurry from the substrate surface.

Abstract: A chemical mechanical polishing apparatus and method can polish a surface of an object very precisely at a high speed irrespective of the presence of a local defect on the surface to be polished. By using a multiplex ring-shaped polishing pad, an effective surface to be polished is increased, and very precise and uniform polishing can be performed at a high speed. By using a plurality of polishing pads, having different diameters smaller than the diameter of the surface to be polished, provided with an interval on the same revolution radius on a revolution table, or by using a plurality of polishing pads, having the same diameter smaller than the diameter of the surface to be polished, provided at positions having different revolution radii on a revolution table, very precise and uniform polishing can be performed.

Abstract: A bristle carrier for leaning a polishing apparatus comprises a number of radial slots into which sub-frames carrying bristles can be releasably mounted. The bristle carrier is used in place of a component carrier used during normal polishing, and is driven in planetary fashion over clothed polishing surfaces to clean those surfaces. The same carrier can be used, even when the bristles have to be replaced due to wear, by replacing the sub-frames having new bristles.

Abstract: A polishing apparatus for polishing optical fibers includes a polishing pad and a polishing arm arranged above the polishing pad and which is selectively brought into contact with the polishing pad. A leveling device is magnetically attached to a lower end of the polishing arm. The leveling device has a plurality of optical fiber ends extending downwardly from a lower surface thereof to contact the polishing pad. The polishing arm also contains a pressure transducer for measuring a pressure applied by the polishing arm when the polishing arm contacts the polishing pad. The magnetic attachment between the polishing arm and leveling device may be carried out using a permanent magnet or electromagnet.

Abstract: An improved gear or pin cleaning assembly for polishing or grinding machines having a rotating plate is presented. One or more nozzle members are positioned within the rotating plate and a source of fluid, such as deionized water, is connected to the nozzle or nozzles to emit a pressurized stream of fluid which rinses off the gear assembly as the plate rotates. The rotating plate may contain a channel for delivering the fluid from the exterior or interior of the plate to the nozzle(s).

Abstract: The present invention provides a polishing apparatus for optical fiber end surface making it possible to freely adjust the contact pressure between a polishing plane and the distal end face of a ferrule and capable of preventing a defective product from being produced under polishing. A control circuit drives a vertically driving mechanism to allow a ferrule holding plate to move from a preparation state to a ferrule polishing starting state and by compressing a spring it then allows the ferrule holding plate to lower further beyond the starting state to complete the polishing.

Abstract: A wafer is rotated on its axis, which is biased with regard to an axis of a grinding wheel, and revolves around an axis which is biased with regard to the axis of the wafer and the axis of the grinding wheel. In this state, the grinding wheel is abutted against the surface of the wafer. Thus, all abrasive grains on the grinding wheel can act on the whole surface of the wafer.

Abstract: A device is disclosed for removing the information bearing surface and the data carried thereby from the substrate layer of a compact disc. The device includes a housing which has a first portion having an inner surface defining a first chamber. A second housing portion is selectively securable to the first housing portion to enclose the first chamber. A mechanism is provided for selectively mounting a compact disc within the first chamber. An apparatus is disposed within the chamber for removing the information bearing surface from the substrate layer of a compact disc positioned on the mounting mechanism by physically converting the information bearing surface to particulate material. The removal apparatus is biased against the information-bearing surface of a compact disc positioned on the mounting mechanism as the information-bearing surface is reduced to particulate material. Finally, a mechanism is provided for selectively actuating the physical removal apparatus within the first chamber.

Abstract: A wafer is rotated on its axis, which is biased with regard to an axis of a grinding wheel, and revolves around an axis which is biased with regard to the axis of the wafer and the axis of the grinding wheel. In this state, the grinding wheel is abutted against the surface of the wafer. Thus, all abrasive grains on the grinding wheel can act on the whole surface of the wafer.

Abstract: A device and method to convert ordinary rotary motion of input frequency .OMEGA. into a composite motion with the same primary frequency .OMEGA. plus an eccentric motion at a higher frequency .omega. enables a low speed rotary input to drive a higher-speed eccentric motion. A preferred embodiment enables an existing rotary motion machine to be easily adapted to provide compound rotary and eccentric motion.

Abstract: A plate stabilizing apparatus is provided which comprises a lateral support structure conflgured to adjust plate alignment which engages vertical rails secured to a polishing machine housing. thus effectively stabilizing the polishing plate while allowing vertical movement of the plate assembly. In a preferred embodiment, a plate stabilizing apparatus includes an alignment plate secured to a subcylinder close to and axially aligned with the polishing plate universal joint. Adjustment screws are provided for lateral adjustment of the polishing plate which is secured to a substantially rigid lateral support structure. The lateral support structure rides within vertical rails secured to the inner housing walls of the polishing apparatus thus allowing vertical movement of the polishing plate during operation.

Abstract: A head for a floor cleaning machine has a plate rotatable about an upright plate axis and formed offset therefrom with a plurality of downwardly open pockets, respective bearings seated in the pockets, and respective rods rotatable in the bearings about respective tool axes intersecting and forming a very small acute angle with the plate axis. Respective mounting sleeves fixed on the rods are each formed with a plurality of axially downwardly extending and radially deflectable retaining fingers each in turn having an outwardly directed barb and respective tool elements each have an upper side turned toward the plate and an opposite lower side and are each formed with a central throughgoing hole in turn formed with a downwardly directed shoulder and receiving the respective mounting sleeve with the respective barbs engaged over the shoulder and retaining the respective element on the respective mounting sleeve. Respective seal assemblies on the plate and elements annularly surround each rod.

Abstract: A tool grinding machine has a moveable tool receiving member and a support rotatable about a vertical axis. The support includes a solid disk having a great mass allowing a vibration-free grinding at great output. Grinding spindles are arranged vertically on the disk for grinding a tool received in the tool receiving member. The grinding spindles have a vertical extension above the disk. The disk has a vertical thickness matching at least the vertical length of the grinding spindles.

Abstract: A device is disclosed for removing the information bearing surface and the data carried thereby from the substrate layer of a compact disc. The device includes a housing having an upper portion defining a top surface and a central cavity and a lower portion having interior and exterior surfaces. The lower portion is selectively attachable to the upper portion to enclose the lower portion interior surface within the cavity, the interior surface being sized and shaped for selectively carrying a compact disc. A mechanism is disposed within the cavity for physically removing the information bearing surface of a compact disc positioned on the lower portion interior surface. A member is provided for continuously biasing the physical removal mechanism against the information bearing surface of a compact disc positioned on the interior surface as the information bearing surface is being removed. Finally, an element is provided for actuating the physical removal mechanism.

Abstract: A chemical mechanical polishing apparatus includes a rotating plate on which a substrate is received, and a polishing pad which moves across the substrate as it rotates on the plate to polish the substrate. The load of the pad against the substrate, and the rotary speed of the plate, may be varied to control the rate of material removed by the pad.

Abstract: A chemical mechanical polishing apparatus is provided which is capable of polishing an essentially non-streaked mirrored surface in a highly efficient manner, and which is capable of achieving a degree of flatness of +/-0.1 mm or less.

Abstract: A chemical mechanical polishing apparatus polishes the surface of a substrate to remove material therefrom, The apparatus includes a carrier, which positions the substrate against the rotating polishing pad. The carrier includes an integral loading member therein, which controls the load force of the substrate against the polishing pad. Multiple substrates may be simultaneously polished on a single rotating polishing pad, and the polishing pad may be rotationally oscillated to reduce the likelihood that any contaminants are transferred from one substrate to another along the polishing pad. A multi-lobed groove in the polishing pad may be used, in conjunction with a moving substrate, to polish the surface of the substrate.

Abstract: A polishing machine of the present invention is capable of uniformly polishing a member to be polished with high flatness, and polishing cloth, which is employed in the polishing machine, is uniformly abraded. In the polishing machine, a polishing plate is capable of rotating. A supporting table rotatably supports the polishing plate. A rotary driving mechanism is mounted on the supporting table, and it rotates the polishing plate. A base supports the supporting table. An orbital driving mechanism moves the supporting table along a circular orbit without spinning about its own axis.

Abstract: A floor sanding or polishing device includes a housing that can be guided across a floor. The housing carries a motor which rotates a plate in a first direction about a vertical axis. The plate carries a plurality of sanding or polishing discs that are rotatable in the same second directions which are opposite to the first direction of rotation of the plate. The discs are displaceable radially relative to the plate by centrifugal force to bring a gear of the disc into engagement with a ring gear affixed to the housing, whereby the discs are rotated about their respective axes in response to rotation of the plate.

Abstract: A disc streak pattern forming method and apparatus are provided which are capable of not only forming fine streak patterns on a disc in a single step, but also arbitrarily adjusting an angle of intersection of streak patterns in a precise manner to thereby reduce the cost of production facilities and the cost of manufacture as well as to improve the magnetic property and the finishing accuracy of the disc. The disc streak pattern forming apparatus is equipped with a drum 2, a pad rotating member 3, a first motor 5 and a second motor 6. Polishing pads 4 mounted on the pad rotating member 3 are placed in sliding contact with the disc in the form of a magnetic disc 200 with an information storage surface 201 thereof being disposed within a central bore 40 in each polishing pad 4.

Abstract: A wafer is rotated on its axis, which is biased with regard to an axis of a grinding wheel, and revolves around an axis which is biased with regard to the axis of the wafer and the axis of the grinding wheel. In this state, the grinding wheel is abutted against the surface of the wafer. Thus, all abrasive grains on the grinding wheel can act on the whole surface of the wafer.

Abstract: The method and associated apparatus of the present invention polishes the front face of a ferrule with first and second slurries such that an end portion of each optical fiber which extends through and is held by the ferrule protrudes beyond the preferentially etched front face of the ferrule by a preselected length. In order to preferentially etch the front face of ferrule as desired, the front face of the ferrule is polished with a first slurry having a plurality of suspended particulates of a first predetermined size on average which initiates the preferential etch of the ferrule relative to the optical fibers. Thereafter, the front face of the ferrule is polished with a second slurry having a plurality of suspended particles of a second predetermined size on average.

Abstract: In a device for microfinishing both sides of disklike workpieces with plane and/or spherical surface, two tool spindles with two tools are provided on two orbit spindles; the two tools engage the two face-end surfaces of the workpiece. The tool spindles revolve, spaced apart by a certain distance, around the axes of the two orbit spindles. In this way, excellent micrographs and excellent grinding results are attained.

Abstract: A disc streak pattern forming method and apparatus are provided which are capable of not only forming fine streak patterns on a disc in a single step, but also arbitrarily adjusting an angle of intersection of streak patterns in a precise manner to thereby reduce the cost of production facilities and the cost of manufacture as well as to improve the magnetic property and the finishing accuracy of the disc. The disc streak pattern forming apparatus is equipped with a drum 2, a pad rotating member 3, a first motor 5 and a second motor 6. Polishing pads 4 mounted on the pad rotating member 3 are placed in sliding contact with the disc in the form of a magnetic disc 200 with an information storage surface 201 thereof being disposed within a central bore 40 in each polishing pad 4.

Abstract: A machine for simultaneously milling and grinding a workpiece comprises milling and grinding wheels rotatable about respective first and second parallel axes, the second axis being offset radially with respect to the first axis. A single motor drives the milling and grinding wheels at different relative speeds. The grinding wheel is mounted to a hub which includes an axially flexible portion to enable the grinding surface to be axially adjusted. The milling wheel includes an array of milling cutters with a large gap formed between leading and trailing ones of the milling cutters to accommodate the offset grinding wheel. The radial spacing of the milling cutters from the axis of rotation of the milling wheel progressively increases from the leading milling cutter to the trailing milling cutter.

Abstract: A dressing apparatus is used to resurface a polishing surface of a polish cloth used to polish semiconductor wafers. A dressing brush which spins on its own axis is also coupled to a drive shaft of a main drive of the dressing apparatus through a planetary gear mechanism so that the brush will rotate or orbit about the drive shaft. Therefore, the dressing brush traces a complex path and its dressing action is spread over a wide surface area of the polishing cloth to produce thorough resurfacing of the polishing surface. The service life of the cloth is significantly increased and contributes to improving the overall efficiency of preparing high quality polished semiconductor wafers. For economy, the dressing apparatus can be mounted easily on a conventional polishing apparatus having a dressing facility.

Abstract: An optical fiber ferrule holding plate for an optical fiber end polishing apparatus for simultaneously polishing the end surfaces of a plurality of ferrules with optical fibers has an improved durability and workability. The optical fiber ferrule holding plate includes a ferrule outer periphery supporting member which is made of a hard burned ceramic member, and which includes, at the center thereof, an inserting hole for receiving the end outer periphery of the ferrule with an optical fiber and which receives and supports a plurality of ferrules with optical fibers. A holding plate main unit which has a plurality of through holes for receiving a plurality of ferrule outer periphery supporting members is provided, which receives, fixes, and supports the ferrules with optical fibers in the through holes.