Abstract: A maintenance device includes a wiper, a wiper carriage, a supporting frame, a wiper moving mechanism, and a unit ascending/descending mechanism. The wiper moving mechanism includes a rack supported to the wiper carriage so as to be movable in an up-down direction, a wiper driving motor provided in the supporting frame, a rack driving gear that transmits a driving force of the wiper driving motor to the rack, a sliding member that is rotatably supported to the wiper carriage and comes into contact with the supporting frame, and a gear pitch retention member that maintains constant a positional relationship in the up-down direction between the rack and the rack driving gear during reciprocation of the wiper carriage.

Abstract: A device for polishing of a multi-surface workpiece is described. The device includes a base and a vertical motion platform that moves along two support rods, which carries a motor that drives a rotating shaft. The support rods extend from the base. A polishing tool is attached to the motor shaft. The workpiece being polished is placed on a linear motion stage during the polishing process.

Abstract: A grinding apparatus has a spindle, a first wheel mount fixed to the lower end of the spindle, and a first grinding wheel mounted on the first wheel mount. The first grinding wheel has a first base and first abrasive members arranged annularly along the outer circumference of the first base in the form of a ring. A second wheel mount inside the first wheel mount is vertically movable. A second grinding wheel is mounted on the second wheel mount in concentric relationship with the first grinding wheel. The second grinding wheel includes a second base having an outer diameter smaller than the inner diameter of the ring formed by the first abrasive members. A plurality of second abrasive members are arranged annularly along the outer circumference of the second base in the form of a ring. The second wheel mount moves forward and away from a chuck table.

Abstract: A method of finishing glass sheets includes forming a stack comprising alternating layers of unfinished glass sheets and spacer pads. The stack is such that there is no physical contact between any two adjacent unfinished glass sheets and outer edges of the spacer pads are recessed relative to outer edges of the unfinished glass sheets. The stack is secured by clamping the unfinished glass sheets and spacer pads together and then supported on a working surface. The unfinished glass sheets of the stack are finished simultaneously while the stack is supported on the working surface. After the finishing, the stack comprises alternating layers of finished glass sheets and spacer pads.

Abstract: An apparatus for decoating a solar module includes a rotatable scraper, which is connected to a drive-shaft for driving in rotation and pressing with a pressure-force the scraper onto a surface of the solar module, wherein the rotatable scraper has prongs or teeth with side-faces and end-faces, and wherein the end-faces are embodied as polishing surfaces.

Abstract: A polishing method, a polishing pad, and a polishing system are described. The polishing pad with a plurality of grooves is provided. The width of each groove is W and the pitch between two adjacent grooves is P. An oscillatory movement distance of a workpiece on the polishing pad is set. The oscillatory movement distance enables any particular point on the workpiece to cross the same number of grooves, when a direction between the particular point and the center of the workpiece is perpendicular to a tangential direction of the grooves. The workpiece is then polished with the oscillatory movement distance, so as to achieve a better polishing uniformity for the surface of the workpiece.

Abstract: A slider lapping texture for implementation in a lapping environment. The slider lapping texture includes a lapping texture structure for utilization in a lapping process performed on a slider. The structure also includes a first surface having a base elevation. The structure further includes a second surface at an elevation higher than the base elevation. The second surface is for lapping the slider. The structure additionally includes an opening for expelling residue associated with a lapping process. The slider lapping texture is configured to generate an attractive force when the slider is motioned thereupon in a substantially unidirectional manner.

Abstract: A system and method for producing micro-texture on a slider substrate using chemical & mechanical polishing techniques is described. In certain embodiments of the present invention, this is accomplished by a method comprising formulating an abrasive slurry solution of predetermined acidity (or pH value), treating a chemical mechanical polishing pad with the abrasive slurry, disposing magnetic heads on the chemical mechanical polishing pad and lapping and grinding the magnetic heads for a predetermined period of time. In certain embodiment of the present invention the lapping and grinding of the magnetic heads are accomplished using an apparatus comprising an abrasive slurry solution of predetermined acidity (pH value), a chemical mechanical polishing pad treated with the abrasive slurry solution, wherein the magnetic heads are attached to a fixture capable of disposing the heads on the chemical mechanical polishing pad.

Abstract: A machine is provided for cutting tiles and similar objects of various materials. The tile cutting machine includes a tub having at least one sidewall and a bottom for holding water. A holding mat is received within the tub that includes a number of nubs extending upwardly therefrom for supporting a tile to be cut using the tile cutting machine. A cutting head assembly movable relative to the tub includes a blade and a motor for powering the blade. The blade is positionable to a depth that allows full penetration through the tile and into contact with water received within the tub, thereby providing lubrication, cooling, and dust control while the tile is being cut.

Abstract: A method facilitates fabricating a coupling including a first annular coupling member and a second annular coupling member. The method comprises coupling the first coupling member to a machine assembly that includes a plurality of grinding wheels coupled to a tool storage member, machining a plurality of troughs in the first coupling member using at least one of the plurality of grinding wheels, such that at least one projection is defined between adjacent troughs, coupling the second coupling member to the machine assembly, and machining a plurality of troughs in the second coupling member using at least one of the plurality of grinding wheels, such that the second coupling member is configured to rotatably couple to the first coupling member.

Abstract: A polishing wheel including a lower polishing surface and defining a different color from a secondary portion of the polishing wheel, so as to indicate wear of the polishing surface. The polishing surface includes a plurality of main radial flutes extending from a central passage to an outer edge. A reduced profile for the main radial flutes is provided adjacent to the outer edge. A plurality of secondary radial flutes is provided extending from the outer edge, but not in communication with either the central passage or the main radial flutes.

Abstract: A device for polishing having a polishing wheel for mounting an arbor to which a film can be secured. The wheel is either manually or motor driven. A ferrule holder is on a carrier also driven by the drive shaft at a predetermined indexed rate. The polishing procedure may be acoustically monitored.

Abstract: An apparatus for resurfacing a pair of guide plugs includes a turntable rotatably mounted on a frame having cutting tools Interacting with resurfaceable guide plugs mounted on a reciprocating slide assembly which includes a guide support block adapted for reciprocating motion with respect to the cutting tools. The block has a pair of saw guides selectively attached thereto so as to be parallel to each other so that parallelism is maintained during the resurfacing process.

Abstract: A machine tool, particularly for grinding workpieces, has a single rotatable spindle (2) carrying a fixed cup-shaped inner grinding wheel (8) and an axially slidable cup-shaped outer grinding wheel (22). A T-shaped annular piston (14) engages in a recess with the spindle to form front and rear annular chambers to each of which hydraulic oil is alternately connectable. The piston has an outer part (18) on which is mounted the grinding wheel (22), being preferably the coarser of the two wheels for use in rough grinding. A tooth-shaped location device (32) at each side of the piston (14) engages with a respective device (34) on the spindle to prevent relative rotation of the wheel (22) and to provide a driving torque when it is advanced to its working position beyond the inner wheel (8).

Abstract: A reciprocating friction-type mirror finishing machine which has a simple construction and performs easily adjustable feeding mode under micrometer scale is disclosed. This machine includes a driving device for generating a driving force in response to a swing motion thereof, and a friction device connected with the driving device for performing alternately clockwise and counterclockwise rotation relative to a work stand in contact therewith to generate a linearly reciprocating frictional force in response to the driving force. The frictional force allows a work piece held by the work stand to be fed in a linearly reciprocating motion to be ground.

Abstract: A process for fabricating a semiconductor wafer and an apparatus for chamfering a semiconductor ingot are provided to precisely perform the chamfering together and reduce significantly the cutting and chamfering time. The semiconductor ingot 2 is rotated with respect to the central axis C while the circumferential surface 21 of the rotating ingot 2 is brought in contact with the uneven surface 11 of a grindstone 1. The circumferential surface of the ingot is chamfered in accordance with the uneven surface 11 of the grindstone 1. A wiresaw is used to cut the semiconductor ingot 2 to obtain the sliced wafers 3.

Abstract: An apparatus for polishing the end faces of bare optical fibers or connector terminated fibers so that their shape is either convex or angled. The base structure of the apparatus utilizes several rotating disks upon which deformable pads are mounted. Attached to each pad are polishing films with progressively finer grades of abrasive action. A connector ferrule containing a protruding fiber is mounted in an exchangeable work fixture. Depending upon the selected work fixture, the fiber face is pressed against the coarsest rotating polishing film at a predetermined angle. A carriage linearly traverses the work fixture across the radius of the polishing film resulting in the removal of fiber end face material. Once the circumference of the film is reached the work fixture is repositioned so that radial movement can commence across the adjacent finer grade polishing film.

Abstract: Means for producing reciprocatory movement of a vice carrier (18) across a guideway (17) mounted on a body moulding (11, 16), which partly shrouds a rotatably driven grinding wheel (14), comprise a rack moulding (57) having upper and lower racks (61, 62) which are alternately engaged by a pinion (44) driven from the grinding wheel drive, in use. Rack moulding movement is transmitted to the vice carrier and spring means (67, 68) move the rack moulding to change the pinion engagement from the lower rack to the upper rack and vice versa at the ends of the racks, thereby reversing the rack moulding movement. A guide peg (56) of the body moulding alternately engages in upper and lower slots (65a, 65b) of the rack moulding to maintain the pinion in engagement with its appropriate associated rack while it is between the ends thereof. The arrangement is intended for use as part of a releasable adapter for a powered grinding tool incorporating said grinding wheel.