Abstract: The invention relates to a machining machine for lenses, which comprises a first workpiece drive, configured as the transport receptacle and having a workpiece spindle, a workpiece changer for exchanging workpieces between the workpiece drive and a workpiece stock, and a machining station for machining a workpiece. The workpiece spindle of the workpiece drive can be rotated about an axis of rotation (c1). The workpiece drive can be swiveled about a first swiveling axis (b1) which is arranged at a right angle to the axis of rotation (c1). The work piece drive can be rotated about an axis of rotation (k) which is arranged at a right angle to the first swiveling axis (b1). The machining machine according to the invention is characterized in that at least one further workpiece drive is provided and has a spindle that can be rotated about a respective axis of rotation (c1, c2).

Abstract: The polishing method of a disk-shaped substrate for polishing an outer circumference 13 of a disk-shaped substrate using slurry is provided with in this sequence: a first polishing process for polishing the outer circumference 13 using an abrasive-grain inclusion brush 50 made of a resin in which polishing abrasive grains are included; and a second polishing process for polishing the outer circumference 13 using a resin brush 60 made of a resin in which the polishing abrasive grains are not included.

Abstract: The grinding method of a disk-shaped substrate that grinds a disk-shaped substrate including a portion having a hole at the center thereof while rotating the disk-shaped substrate is provided with: grinding an inner circumference of the disk-shaped substrate while an inner circumference grinding device is fed in a radial direction toward an outer circumference of the disk-shaped substrate and grinding the outer circumference of the disk-shaped substrate while an outer circumference grinding device is fed in the radial direction toward the inner circumference of the disk-shaped substrate; and stopping the feedings of the inner circumference grinding device and the outer circumference grinding device at the same time.

Abstract: An apparatus for turning a hard and/or brittle material includes a precision workpiece spindle, a workpiece support, a hard and/or brittle workpiece rigidly coupled to the workpiece support, and a diamond tool blade rigidly coupled to a spin-turner mechanism. The diamond tool blade is formed to include a cutting edge arranged to confront the hard and/or brittle workpiece to remove material from the workpiece to form precision-turned components such as optical lenses, mirrors, and optical molds.

Abstract: A polishing pad for use in chemically mechanically polishing a semiconductor substrate enhances the uniformity of the rate at which material is removed from the surface of the semiconductor substrate, thereby ensuring the reproducibility of the chemical mechanical polishing process. The polishing pad has main grooves that divide an upper portion of the pad into a plurality of cells. At least one of the cells includes a land portion and a grooved portion substantially enclosed by the land portion. A respective slurry hole extends through the pad to the grooved portion such that slurry supplied through the slurry hole feeds into the grooved portion but is impeded by the land portion from flowing outwardly of the cell.

Abstract: A method facilitates fabricating a coupling including a first annular coupling member and a second annular coupling member. The method comprises coupling the first coupling member to a machine assembly that includes a plurality of grinding wheels coupled to a tool storage member, machining a plurality of troughs in the first coupling member using at least one of the plurality of grinding wheels, such that at least one projection is defined between adjacent troughs, coupling the second coupling member to the machine assembly, and machining a plurality of troughs in the second coupling member using at least one of the plurality of grinding wheels, such that the second coupling member is configured to rotatably couple to the first coupling member.

Abstract: A polishing disk for a tool for the fine machining of optically active surfaces on spectacle lenses in particular is disclosed, which comprises a support body, to which a foam layer is attached, wherein a polishing film bears against the foam layer. The polishing film is provided with at least one opening in a central region. During machining, the opening ensures pressure equalization and makes liquid polishing agent available from inside the foam layer, as a result of which better rinsing and cooling of otherwise disadvantaged regions of the polishing disk is achieved. As a result, a polishing disk of simple and cost-effective design is proposed, which is much more durable than the prior art while achieving high surface qualities.

Abstract: Methods and apparatus for chemical mechanical polishing are described. In one embodiment, an apparatus includes a table top and a transfer station and multiple polishing stations are mounted on the table top. The apparatus further includes multiple washing stations, where each washing station is located between either two polishing stations or between a polishing station and a transfer station. Multiple carrier heads are supported by a support member that is rotatable about an axis. The transfer station and the multiple polishing stations are arranged at approximately equal angular intervals about the axis.

Abstract: A polishing apparatus comprises a polishing tool having a polishing surface, and a holder device (top ring) for holding a semiconductor wafer (a substrate). The polishing apparatus further comprises a color CCD camera for taking a color image of a region on the polishing surface; an image processor for determining whether or not any foreign matter exists on the polishing surface based on a condition of a color in color image data acquired by the color CCD camera; and an apparatus operation control section which in response to determination of the image processing section, stops relative movement between the semiconductor wafer and the polishing surface and separates the top ring and the polishing surface from each other.

Abstract: A two part retaining ring is described that has a lower ring and an upper ring. The lower ring contacts a polishing surface during chemical mechanical polishing. The upper surface and the lower surface of the lower ring have matching grooves formed therein to increase the flexibility of the lower ring.

Abstract: A flexible membrane for a polishing head and a chemical mechanical polishing (CMP) apparatus having the same are provided. The flexible membrane for a polishing head includes a compressing plate having a first face and a second face opposite to the first face. The first face of the compressing plate holds a substrate with a vacuum provided thereto and compresses the substrate on a polishing pad. The second face of the compressing plate is combined with a supporter of the polishing head. The second face and the supporter define a space to which the vacuum for holding the substrate and a first pneumatic pressure for compressing the substrate are applied. A dividing member combined with the supporter is formed on the second face. The dividing member divides the space into at least two regions. A pneumatic pressure-introducing portion is formed at the dividing member. A second pneumatic pressure is provided to the compressing plate through the pneumatic pressure-introducing portion.

Abstract: A semiconductor manufacturing apparatus includes a wafer support having a grinding base on which a wafer is disposed, and a grinding assembly disposed above the grinding base. The grinding assembly includes a grinding plate having grinding projections at the bottom thereof and at least two fixing pins protruding at a the top thereof, and a grinding mount to which the grinding plate to which the grinding plate can be initially coupled and then secured to quickly. The grinding mount has first fixing grooves in a bottom surface thereof and in which the respective fixing pins are inserted and held. A vacuum system and/or mechanical fasteners are used to then secure the grinding plate to the grinding mount.

Abstract: An upper polishing plate is moved downward until facing a lower polishing plate to polish a work piece. The upper polishing plate is rotated in a horizontal plane together with a first elastic member, a second elastic member, an outer member and a connecting member. A pressure difference between a first pressing force pressing the outer member or an inner member upward and a second pressing force pressing the outer member or the inner member downward, which is produced in a first closed space by supplying a compressed fluid into and discharging the same from the first closed space, is adjusted, so that a third pressing force of the upper polishing plate, which presses a work piece, can be adjusted.

Abstract: An apparatus and method for re-surfacing compact discs. One method is a two-step method in which the disc to be re-surfaced is first placed on a shaft. A resilient pad supports an abrasive medium and is positioned so the abrasive medium overlaps only the protective layer of the CD. The disc and abrasive material are rotated in opposite directions at about the same speed to remove deeper blemishes in a wet operation. Subsequent polishing is accomplished in a similar manner using a polishing compound instead of an abrasive. The re-surfacing and polishing apparatus each have motor driven shafts which are parallel and spaced apart and support the CD and pad in a cabinet. A transparent cover extends across the top of the cabinet. In another embodiment, the resurfacing and polishing is accomplished in a one-step operation in which polishing fluid is applied to a non-abrasive medium is utilized and the fluid is continuously recycled.

Abstract: Systems and apparatus providing a carrier head for chemical mechanical polishing are described. The carrier head includes a base, a support structure attached to the base, a retaining structure attached to the base, and a connector attached to the base and the retaining structure. The support structure includes a receiving surface for contacting a substrate. The retaining structure prevents the substrate from moving along the receiving surface. The base and the retaining structure can thermally expand at different rates of expansion without causing distortion to one another.

Abstract: A polishing apparatus is used for chemical mechanical polishing a copper (Cu) layer formed on a substrate such as a semiconductor wafer and then cleaning the polished substrate. The polishing apparatus has a polishing section having a turntable with a polishing surface and a top ring for holding a substrate and pressing the substrate against the polishing surface to polish a surface having a semiconductor device thereon, and a cleaning section for cleaning the substrate which has been polished. The cleaning section has an electrolyzed water supply device for supplying electrolyzed water to the substrate to clean the polished surface of the substrate while supplying electrolyzed water to the substrate.

Abstract: An apparatus and associated methods for polishing semiconductor wafers and other workpieces that includes polishing surfaces located at multiple polishing stations. Multiple wafer heads, preferably at least one greater in number than the number of polishing stations, can be loaded with individual wafers. The wafer heads are suspended from a rotatable support, which provides circumferential positioning of the heads relative to the polishing surfaces, and the wafer heads move linearly with respect to the polishing surface, thus providing relative linear motion between the wafer and the polishing station. A load/unload station may be located at a position symmetric with the polishing surfaces. The rotatable support can simultaneously position one of the heads over the load/unload station while the remaining heads are located over polishing stations for wafer polishing so that loading and unloading of wafers can be performed concurrently with wafer polishing.

Abstract: A polished glass disk is prepared for a magnetically recordable coating by texturing the surfaces with a highly abrasive material being abrasively engaged with the surfaces as the disk is rotated, thereby creating a relatively coarse texture with the abrasions concentric with the axis of rotation of the disk. Thereafter, the roughness of the texturing is reduced by abrading the surface of the disk with a polishing pad and an etchant slurry of colloidal silica. The etchant component has the property of attacking or softening the glass disk during the fine polishing with the colloidal silica slurry. As both the texturing step and the fine polishing step deposit a plurality of concentric abrasions on a glass disk, these abrasions aid in retaining the magnetically recordable coating deposited thereon to complete a magnetically recordable disk for use as a data storage member.

Abstract: The present invention is directed, in general, to a chemical mechanical polishing pad comprising a polishing body and a backing material coupled to the polishing body. The polishing body comprising a compacted thermoplastic foam substrate, wherein the compacted thermoplastic foam substrate has a density that is as at least about 1.1 times greater than an uncompacted thermoplastic foam substrate density. Other aspects of the invention comprise a method for manufacturing the above-described chemical mechanical polishing pad and chemical mechanical polishing apparatus comprising the chemical mechanical polishing pad.

Abstract: A resilient pneumatic annular sealing bladder is coupled for fluid communication to a first pressurized pneumatic fluid to define a first pneumatic zone and is attached to a first surface of the wafer stop plate adjacent the retaining ring interior cylindrical surface to receive the wafer and to support the wafer at a peripheral edge. The resilient pneumatic annular sealing bladder defines a second pneumatic zone radially interior to the first pneumatic zone and extends between the first surface of the wafer stop plate and the wafer when the wafer is attached to the polishing head during a polishing operation and is coupled for fluid communication to a second pressurized pneumatic fluid. The wafer attachment stop plate is operative during non polishing periods to prevent the wafer from flexing excessively from an applied vacuum force used to hold the wafer to the polishing head during wafer loading and unloading operations.

Abstract: The small polishing apparatus is capable of simultaneously polishing both side faces of a work piece, and a lower polishing plate, an internal gear and a sun gear are respectively driven by direct drive (DD) motors. The polishing apparatus comprises: an upper and a lower polishing plates; a sun gear and an internal gear; and a carrier provided between the polishing plates and engaged with the gears. Both side faces of the work piece held by the carrier are simultaneously polished by the polishing plates. DD motors respectively rotate the lower polishing plate and the gears. Each DD motor has a ring-shaped output member. A first DD motor has the output member directly connected to a rotary holding member rotatably holding the lower polishing plate. A second DD motor is provided under the first DD motor.

Abstract: A carrier head for a chemical mechanical polishing apparatus includes a membrane with an exterior grooved surface for improved chemical mechanical polishing. The exterior grooved surface provides a path for the flow of air from the portion between the membrane and a substrate.

Abstract: The invention relates to a process for producing a semiconductor wafer by simultaneous polishing of a front surface and a back surface of the semiconductor wafer with a polishing fluid between rotating polishing plates during a polishing run which lasts for a polishing time, the semiconductor wafer being located in a cutout in a carrier having a defined carrier thickness and being held on a defined geometric path, the semiconductor wafer having a starting thickness prior to polishing and a final thickness after polishing. The polishing time for the polishing run is calculated from data which include the starting thickness of the semiconductor wafer and the carrier thickness as well as the starting thickness and final thickness and the flatness of a semiconductor wafer which was polished during a polishing run preceding the present polishing run.

Abstract: Embodiments of the invention abrade the information bearing surface of a compact disc (CD), DVD or other digital information bearing disk, in order to render it unreadable by standard consumer grade disk readers. This is accomplished via embodiments of the invention that are extremely lightweight, highly portable and inexpensive. Embodiments may or may not employ an outer case in order to retain the remnants of the abraded information layer of the disk. In order to operate one embodiment of the invention, the apparatus is opened and a compact disc is inserted with the face of the disk against the abrasive mechanism. After closing the apparatus, the outer housing of the apparatus is rotated with sufficient pressure against the abrasive mechanism in order to cause the substrate to be damaged sufficiently to render it unreadable by consumer based disk readers. The apparatus can be opened over a trash bin in order to empty both the disk and the particulate matter generated by the abrasive process.

Abstract: A triangular pad of the type shown in FIG. 5(a) which has circular tip ends is used as the polishing pad. This shape corresponds to the concept of partially cutting the outer edge of the polishing pad in order to shorten the contact time of the polishing pad and wafer at the outer circumference of the wafer regardless of the swing speed. As shown in the figure, a circular bored part with a diameter of 50 mm is provided in the center of such a polishing pad. By using this polishing pad and dividing the swing width into ten, it is possible to keep the product of the integrated value of the relative linear velocity, the integrated value of the pressure, and the integrated value of the contact time at various points within the wafer surface within ±30% of the mean value in each swing width under feasible swing conditions. Thus, the use of such a polishing pad makes it possible to perform uniform polishing.

Abstract: The present invention discloses a repair apparatus for compact disks comprising a casing unit having a top housing and a bottom housing openably fastened to the top housing; a transmission module disposed within the bottom housing, including a motor, a disk supporting pedestal for supporting the compact disk and being connected with the motor, and a repair base adjacent the disk supporting pedestal; a repair member disposed within the repair base, including a grinding element or a cleaning element at the upper surface thereof for operable rotational contact with the repair area; and a disk-depressing mechanism including an upper cover connected to the top housing, a disk-depressing member operably contacted with the compact disk, and a plurality of spherical bodies rotatably and movably disposed between the upper cover and the disk-depressing member.

Abstract: Embodiments of methods and apparatus in accordance with the present invention provide a chemical mechanical planarization (CMP) process that provides single or multiple polishing pads to have a different rotational velocity, applied pressure and oscillation frequency on the surface of the substrate to address and compensate for the WIW (with-in-substrate) and WID (with-in-die) non-uniformities in planarization ability. The velocity of each polishing pad is adjustable providing a closer match to the substrate surface velocity over a particular zone to yield a linear velocity on the surface of the substrate.

Abstract: A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane that applies a load to a substrate and a retaining ring. The friction coefficient of the lower surface of the flexible membrane is increased to prevent contact between the substrate and the retaining ring, thereby preventing slurry compaction and buildup and substrate deformation caused by such contact.

Abstract: A carrier head has a backing assembly with a substrate support surface, a housing connectable to a drive shaft to rotate with the drive shaft about a rotation axis, and a dampening material in a load path between the backing assembly and the housing. The dampening material reduces transmission of vibrations from the backing assembly to the housing.

Abstract: A structure for a polishing machine of an optical disk, which comprises a motor, a turntable unit integrated with a housing, at least two polishing wheel positioned on a cover which can cover up the housing, and a timer. When the cover is closed, the polishing wheel can polish the optical disk. The primary objective of this invention is to provide a structure for a polishing machine with a precise polishing effect and higher automation to increase the quality of polishing. The secondary objective of the present invention is to provide a structure for a polishing machine which is simplified in structure, miniaturize in volume and is easily stored and used.

Abstract: The present invention is directed, in general, to a method of polishing a surface on substrates, such as semiconductor wafers and, more specifically, to a polishing pad suitable for this purpose. The polishing pad comprises a polishing body that includes a cross-linked polymer material, and may be incorporated into a polishing apparatus. Polishing includes positioning the substrate containing at least one layer against the polishing body and polishing the layer.

Abstract: A device for polishing digital storage discs including a polishing plate rotatably driven about a vertical axis, the upper side of which has a polishing cloth, wherein the polishing cloth is interrupted by a ring-shaped recess concentric with the axis of the polishing plate, at least one circular load-applying plate from the planar lower side of which a projection centrally protrudes to appropriately engage the central hole of the storage disk, a roller holder which has at least one idling roller and one driven roller against which the circumference of said load-applying plate gets into engagement when said plate is carried along while lying on said polishing plate, a drive for said driven roller, and mechanism for feeding a polishing medium to said polishing cloth.

Abstract: An invention is provided for removal rate profile manipulation during a CMP process. An apparatus of the embodiments of the present invention includes an actuator capable of vertical movement perpendicular to a polishing surface of a polishing pad. The actuator is further capable of flexing the polishing pad independently of a pad support device. Also included in the apparatus is an actuator control mechanism that is in communication with the actuator. The actuator control mechanism is capable of controlling an amount of vertical movement of the actuator, allowing the actuator to provide local flexing of the polishing pad to achieve a particular removal rate profile. The actuator can also be capable of horizontal movement parallel to the polishing surface of the polishing pad.

Abstract: Vending apparatus for optical disk restoration has a housing for receiving the disk form a customer; a disk inspection device to determine whether the disk is correctly positioned for polishing and providing a signal indicative of disk position, a disk perforation detecting device providing a signal indicative of any perforation in a reflective layer of the disk; and a device for ejecting a perforated disk from the housing. A user interface requests and receives payment from a customer in response to a signal by the detecting device that the reflective layer is imperforate and provides a signal indicating receipt of correct payment. Polishing wheels polish, with slurry, an exposed light receiving surface of a data carrying protective layer of the disk to ameliorate scratches in response to a signal from the user interface of correct payment and a device ejects a polished disk from the housing to a customer.

Abstract: An apparatus and method for re-surfacing compact discs. The method is a two-step method in which the disc to be re-surfaced is first placed on a shaft. A resilient pad supports an abrasive medium and is positioned so the abrasive medium overlaps only the protective layer of the CD. The disc and abrasive material are rotated in opposite directions at about the same speed to remove deeper blemishes in a wet operation. Subsequent polishing is accomplished in a similar manner using a polishing compound instead of an abrasive. The re-surfacing and polishing apparatus each have motor driven shafts which are parallel and spaced apart and support the CD and pad in a cabinet. A transparent cover extends across the top of the cabinet.

Abstract: A chemical mechanical polishing (CMP) apparatus includes a polishing head that is composed of a carrier and a membrane, and is positioned on a polishing pad of a supporting part. The polishing head has a supporter installed at an internal center of the carrier, a chucking ring positioned between the carrier and the supporter, and means for moving the chucking ring up and down in a vertical direction. The supporter forms a sealed space together with the membrane, and the chucking ring chucks the wafer in vacuum.

Abstract: A tool for conditioning a wafer polishing pad includes a body having a recess in the upper surface thereof. A holder has a portion extending into the recess in the body. An elastomeric member between the holder and the body acts as a gimble permitting planar contact of the tool with the pad.

Abstract: A wafer carrier retaining ring includes a first annular surface that contacts a polishing surface during a polishing process and an inner diameter surface adjoining the first annular surface thereby forming a first annular corner. The first annular corner has a radius in the range of from no less than about 0.010 inches to less than a radius that would result in damage to a wafer being polished. In another embodiment of the invention, a wafer carrier retaining ring includes an inner diameter surface and a second annular surface adjoining said inner diameter surface thereby forming a second annular corner. The second annular corner has a radius of no less than 0.030 inches. In a further embodiment of the invention, a wafer carrier retaining ring is formed of a ceramic material and has a first annular surface having a surface finish of no greater than 2 microinches rms.

Abstract: A wafer polishing apparatus for polishing a semiconductor wafer. The polisher comprises a base, a turntable, a polishing pad and a head drive mechanism for driven rotation of a polishing head. The polishing head comprises a sealing ring adapted to hold at least one wafer for engaging a front surface of the wafer with a work surface of the polishing pad. The sealing ring allows for application of uniform air pressure over the rear surface of the wafer. The sealing ring is constructed so that the wafer itself defines a portion of a pressure cavity receiving pressurized air.

Abstract: A rotation force of a drive shaft is transmitted from a drive plate to an intermediate plate through a first pin, and a rotation force of the intermediate plate is transmitted to a carrier through a second pin. The rotation force of the drive shaft is transmitted to the carrier through an Oldham's coupling mechanism; thereby, a wafer polishing apparatus can always rotate the carrier in a stable condition even though a wafer receives a friction force in side directions from a polishing pad because no twisting force is applied to the drive shaft.

Abstract: This invention is related to an improved structure for a polishing machine of an optical disk, which comprises a motor, a turntable unit integrated with a housing, at least two polishing wheel positioned on a cover which can cover up the housing, and a timer. When the cover is closed, the polishing wheel can polish the optical disk. The primary objective of this invention is to provide a structure for a polishing machine with a precise polishing effect and higher automation to increase the quality of polishing. The secondary objective of the present invention is to provide a structure for a polishing machine which is simplified in structure, miniaturize in volume and easy to stored and used personally.

Abstract: A grinding machine includes at least a turntable, rotary chuck tables for holding workpieces to be machined, a first grinding device for grinding the workpiece held on the chuck table and a second grinding device for grinding the first-ground workpiece held on the chuck table. The first grinding device comprises at least a first grinding wheel having pieces of grindstone set so as to define together a first grinding plane, and a first spindle fixed to the first grinding wheel. Likewise, the second grinding device comprises a second grinding wheel having pieces of grindstone set so as to define together a second grinding plane and a second spindle fixed to the second grinding wheel.

Abstract: A rotary die cuter for a box making machine has an abrading cylinder mounted for rotation alongside the anvil for engaging and resurfacing the blanket of the anvil on a virtually continuous basis to smooth, level and even the surface of the blanket. This resurfacing occurs during normal operation of the rotary die cutter so no production is lost. The abrading cylinder has a sheet layer of abrasive material spirally wrapped on the surface of the cylinder and bonded thereto with adhesive material on the backside of the sheet layer. The abrading cylinder is movable towards or away from the anvil by a servo motor and gearbox. The position of the abrading cylinder relative to the anvil is determined by an encoder which sends the information to a computer or programmable controller which calculates the changing diameter of the blanket and the amount of speed change that must be imparted to the anvil to compensate for its changing diameter.

Abstract: A system for chemical mechanical planarization comprises a platen assembly for holding an object to be planarized and a polishing head comprising a puck holder assembly for coupling to a substrate for holding a polishing pad. The polishing pad is smaller in surface area than the object. The polishing head is movable from a first region overlying the platen assembly to a second region. The puck holder assembly comprises a backing surface for positioning the substrate, and a clamp ring positioned proximate to the backing surface for supplying mechanical force to the substrate to hold the substrate in place during a polishing operation. A spring mechanism is disposed in the housing for resiliently biasing the clamp ring toward the substrate.

Abstract: A chemical mechanical polishing system is provided having one more polishing stations. The polishing stations include a platen and pad mounted to an upper surface of the platen. The upper surface of the platen is patterned to define a raised area and a recessed area. The raised area provides a rigid mounting surface for the pad and the recessed area provides the pad a desired degree of flexibility and compliance of the pad when brought into contact with a substrate.

Abstract: There is disclosed a method for polishing a work wherein polishing liquid is supplied to a polishing pad, and a relative movement is carried out between the work and the polishing pad with pressing the work on the polishing pad, wherein the work of which press pressure was set to 0 to terminate polishing is released from the polishing pad within 45 seconds after the termination of polishing. When plural works are simultaneously polished, preferably only the work to which press pressure was set to 0 to terminate polishing is released from the polishing pad, and polishing of the other works is continued, which are released from the polishing pad after press pressure thereto is set 0 one by one.

Abstract: A carrier head for a chemical mechanical polishing system includes a flexible membrane with a substrate receiving surface, a sensor mechanism to determine if a substrate is properly attached to the carrier head, and means for preventing fluid that may be located between the substrate and the flexible membrane from interfering with the substrate detection mechanism.

Abstract: The disk burnishing process is conducted with a contact flying burnishing head wherein the leading edge of the burnishing head is disposed above the surface of the disk, while the trailing edge of the burnishing head makes contact with the surface of the disk. The contact flying configuration of the burnishing head is obtained by controlling the rotating disk RPM in conjunction with the burnishing head design characteristics. In the contact flying burnishing process, the burnishing edges of the several burnishing pads of the head are disposed at different heights relative to the disk surface, such that the leading burnishing pad edges are higher than the trailing burnishing pad edges. In this configuration, high asperities are trimmed by the burnishing pads while low asperities are not. Thus, a disk is properly burnished for subsequent hard disk drive performance with a minimum of surface debris being created by the burnishing process.

Abstract: A polishing apparatus comprises a polishing member that has a wide stable polishing range to perform effective polishing, even if a rotation axis moves away from the edge of a workpiece. A polishing member holder holds the polishing member, and a workpiece holder holds the workpiece to be polished. A drive device produces a relative sliding motion between the polishing member and the workpiece. At least one holder of either the polishing member holder or the workpiece holder is rotatable about a rotation axis and is tiltable with respect to other holder. Such one holder is provided with a pressing mechanism to stabilize orientation or desired posture of the one holder by applying an adjusting pressure to the one holder at a location away from the rotation axis.

Abstract: A pad refurbisher that provides in situ, real-time conditioning and/or cleaning of a polishing surface on a polishing pad used in chemical-mechanical polishing of a semiconductor wafer and other microelectronic substrates. The pad refurbisher has a body adapted for attachment to a wafer carrier of a chemical-mechanical polishing machine, and a refurbishing element connected to the body. The body has a distal face positioned proximate to a perimeter portion of the wafer carrier and facing generally toward the polishing surface of the polishing pad. The body travels with the wafer carrier as the wafer carrier moves over the polishing pad. The refurbishing element is connected to the distal face of the body so that the refurbishing element can operatively engage the polishing surface substantially adjacent to the perimeter of the wafer carrier.