Work Rotating Patents (Class 451/283)
  • Patent number: 10513003
    Abstract: The precision lapping and polishing device for external cylindrical surface of disk part and its taper error adjustment method. The device composes a circular baseplate, slant rails, baffles, pressure plates, copper blocks, a washer blanket; blanket plates, a set of bead shafting, a friction driving wheel, a DC motor, a mobile power supply, a LED lamp and a cover body. By adopting the working principle that the generatrix rotates around the fixed axis to form the cylindrical surface, the ultra-precision machining of the cylindrical surface of disk part is realized. The radial-continuous-automatic-micro feeding of the disk part is realized by thinning the thickness of the circular baseplate which is internally tangent to the generatrix of the circular baseplate during the process of lapping and polishing. The device has the advantages of operating simply, adjusting conveniently, low cost and is of important value for popularization and application.
    Type: Grant
    Filed: June 13, 2017
    Date of Patent: December 24, 2019
    Assignee: DALIAN UNIVERSITY OF TECHNOLOGY
    Inventors: Siying Ling, Kun Wang, Baodi Yu, Xiaodong Wang, Liding Wang
  • Patent number: 10464185
    Abstract: According to one embodiment, a substrate polishing method includes: conveying a substrate to a position above a polishing pad by sucking the substrate by a first region of an elastic film; polishing the substrate while bringing the substrate into contact with the polishing pad; and lifting off the substrate by sucking the substrate by a second region of the elastic film, the second region being larger than the first region.
    Type: Grant
    Filed: March 14, 2017
    Date of Patent: November 5, 2019
    Assignee: EBARA CORPORATION
    Inventors: Shintaro Isono, Hozumi Yasuda, Keisuke Namiki, Osamu Nabeya, Makoto Fukushima, Shingo Togashi, Satoru Yamaki
  • Patent number: 10279311
    Abstract: A chemical mechanical polishing (CMP) chamber is disclosed. The CMP chamber includes a chamber body, a door mounted on the chamber body and a chamber substructure being one selected from a group consisting of a moisture separator separating a moisture generated in the CMP chamber, a supplementary exhaust port, a transparent window mounted on the door, a sampling port mounted on the door, a sealing material including a metal frame, an o-ring for sealing the door and a combination thereof.
    Type: Grant
    Filed: August 21, 2012
    Date of Patent: May 7, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-I Peng, Hsiang-Pi Chang, Cary Chia-Chiung Lo, Teng-Chun Tsai, Kuo-Yin Lin, Chih-Yuan Yang
  • Patent number: 10213894
    Abstract: A polishing pad includes a polishing layer stack that has a polishing surface, a bottom surface, and an aperture from the polishing surface to the bottom surface. The polishing layer stack includes a polishing layer that has the polishing surface. A fluid-impermeable layer spans the aperture and the polishing pad. A first adhesive layer of a first adhesive material is in contact with and secures the bottom surface of the polishing layer to the fluid-impermeable layer. The first adhesive layer spans the aperture and the polishing pad. The light-transmitting body is positioned in the aperture and has a lower surface in contact with, is secured to the first adhesive layer, and is spaced apart from a side-wall of the aperture by a gap. An adhesive sealant of a different second material is disposed in and laterally fills the gap.
    Type: Grant
    Filed: February 26, 2016
    Date of Patent: February 26, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Yongqi Hu, Kadthala Ramaya Narendrnath, Thomas Lawrence Terry
  • Patent number: 10016871
    Abstract: A polishing apparatus according to one embodiment includes: a turn table on which a polishing pad for polishing a substrate is provided; a turn table rotation mechanism configured to rotate the turn table; a dresser configured to dress the polishing pad by cutting a surface of the polishing pad; a pressing mechanism configured to press the dresser onto the polishing pad; a dresser rotation mechanism configured to rotate the dresser; a swinging mechanism configured to swing the dresser on the polishing pad; and a controller configured to control the pressing mechanism, the turn table rotation mechanism or the dresser rotation mechanism based on a position and a swinging direction of the dresser.
    Type: Grant
    Filed: December 21, 2015
    Date of Patent: July 10, 2018
    Assignee: EBARA CORPORATION
    Inventor: Hiroyuki Shinozaki
  • Patent number: 9868185
    Abstract: Polishing pads having a foundation layer and a window attached to the foundation layer, and methods of fabricating such polishing pads, are described. In an example, a polishing pad for polishing a substrate includes a foundation layer having a first modulus. A polishing layer is attached to the foundation layer and has a second modulus less than the first modulus. A first opening is through the polishing layer and a second opening is through the foundation layer. The first opening exposes at least a portion of the second opening and exposes a portion of the foundation layer. A window is disposed in the first opening and is attached to the exposed portion of the foundation layer.
    Type: Grant
    Filed: November 3, 2015
    Date of Patent: January 16, 2018
    Assignee: Cabot Microelectronics Corporation
    Inventors: Paul Andre Lefevre, William C. Allison, Diane Scott, Jose Arno
  • Patent number: 9630292
    Abstract: Apparatus polishing one side of a wafer to accurately realize the desired wafer edge shape without dependence on the period of use of a polishing cloth is provided. In the apparatus of the present invention, a wafer fixed to a head is brought into contact with a polishing cloth provided on a surface of a surface plate, and the head and the surface plate are rotated, thereby polishing one side of the wafer. The contact angle of the polishing cloth (S1) is measured; the rotation speed of the head and the surface plate is determined based on the measured contact angle of the polishing cloth (S4). One side of the wafer is polished by rotating the head and the surface plate at the determined rotation speed (S5, S6).
    Type: Grant
    Filed: February 19, 2016
    Date of Patent: April 25, 2017
    Assignee: SUMCO Corporation
    Inventor: Tomonori Kawasaki
  • Patent number: 9592583
    Abstract: A polishing brush includes: a brush body that includes a cylindrical base section and linear abrasive materials extending from a bottom surface of one side of the base section along a direction of a center of an axis of the base section, and removes burrs and performs polishing on a surface of a workpiece metal by relatively moving the abrasive materials and the workpiece metal while tips of the abrasive materials come into contact with a surface of the workpiece metal; a brush guide that is coaxial with the center of the axis and is disposed on the outside of the brush body in a radial direction so that the tips of the abrasive materials protrude from an end portion; and a displacement mechanism that changes protruding lengths of the abrasive materials from the end portion.
    Type: Grant
    Filed: December 4, 2014
    Date of Patent: March 14, 2017
    Assignee: AISIN SEIKI KABUSHIKI KAISHA
    Inventors: Shinya Ishikawa, Michihiro Yamamoto, Satoru Shibata, Takamichi Hirasawa
  • Patent number: 9475168
    Abstract: The polishing pad is suitable for polishing or planarizing at least one of semiconductor, optical and magnetic substrates. The polishing pad has a polishing surface, an opening through the polishing pad and a transparent window within the opening in the polishing pad. The transparent window has a concave surface with a depth that increases with use of the polishing pad. A signal region slopes downward into the central region for facilitating debris removal and a debris drainage groove extending through the central region into the polishing pad. Rotating the polishing pad with polishing fluid in the debris drainage groove sends debris from the central region into the polishing pad through the debris drainage groove.
    Type: Grant
    Filed: March 26, 2015
    Date of Patent: October 25, 2016
    Inventors: Bainian Qian, Ethan Scott Simon, George C. Jacob
  • Publication number: 20140364038
    Abstract: The described embodiments relate generally to lapping operations and related systems and apparatuses. Various embodiments of lapping tables are described for applying a lapping operation to a non-planar surface of a workpiece. For example, methods and apparatus are described which allow a lapping operation to be applied to a curved outer surface portion of a cylindrical workpiece. Lapping of non-planar outer surfaces of workpieces is conducted by rotating the workpieces during the lapping operations.
    Type: Application
    Filed: February 20, 2014
    Publication date: December 11, 2014
    Applicant: Apple Inc.
    Inventors: Simon Regis Louis Lancaster-Larocque, Collin D. Chan
  • Patent number: 8888558
    Abstract: A probe pin having a bent portion at its tip end portion is used for a probe card, the probe pin is configured such that an angle constituted by a direction of work groove generated at a time of machine-working of a tip end portion of the probe pin and a longitudinal direction of a metal wire is set to 45 degree or less, or both directions are set to be almost parallel to each other. Due to above configuration, even if the tip end portion of the probe pin is subjected to a bending work and a worked surface is formed with recessed portion, a breakage of the probe pin caused by the recessed portion existing on the worked surface and functioning as a starting point of the breakage can be effectively prevented whereby a lowering of a production yield of the probe pin can be greatly suppressed.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: November 18, 2014
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Materials Co., Ltd.
    Inventor: Fumihiko Yoshimura
  • Publication number: 20130324012
    Abstract: A polishing apparatus polishes a substrate by bringing the substrate into sliding contact with a polishing surface. The polishing apparatus includes: a substrate holder having a substrate holding surface configured to press the substrate against the polishing surface, a retaining ring coupled to the substrate holding surface and configured to surround the substrate, wherein the retaining ring is brought into contact with the polishing surface during operation of the polishing apparatus, the retaining ring being configured to be tiltable independently of the substrate holding surface; a rotating mechanism configured to rotate the substrate holder about its own axis; and at least one local load exerting mechanism configured to exert a local load on a part of the retaining ring in a direction perpendicular to the polishing surface, the at least one local load exerting mechanism being arranged so as not to move in accordance with the substrate holder.
    Type: Application
    Filed: May 30, 2013
    Publication date: December 5, 2013
    Inventors: Makoto FUKUSHIMA, Hozumi YASUDA, Keisuke NAMIKI, Osamu NABEYA, Shingo TOGASHI, Satoru YAMAKI
  • Patent number: 8579679
    Abstract: The present invention provides an apparatus capable of uniformly grinding an polishing pad. Further, the present invention provides a method of grinding an polishing pad by using the grinding apparatus.
    Type: Grant
    Filed: September 13, 2010
    Date of Patent: November 12, 2013
    Assignee: Sumco Corporation
    Inventors: Hiroto Fukushima, Tomonori Miura, Yasuhiko Tsukanaka, Takeshi Ezaki
  • Patent number: 8460063
    Abstract: A polishing apparatus for polishing an end edge of a work piece by bringing a bristle tip of a polishing brush into contact with the end edge of the work piece as the bristle tip passes the end edge of the work piece includes a support plate having a through hole into which the polishing brush is inserted and a suppression portion that is provided at the support plate and suppresses a deformation of the bristle tip of the polishing brush when the work piece is polished.
    Type: Grant
    Filed: February 4, 2009
    Date of Patent: June 11, 2013
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventor: Yuji Suzuki
  • Patent number: 8398878
    Abstract: Semiconductor wafers are polished by a material-removing polishing process A, on both sides of the wafer, using an abrasive-free polishing pad, and a polishing agent which contains abrasive; and a material-removing polishing process B, on at least one side of the wafer, using a polishing pad with a microstructured surface containing no materials which contact the wafer which are harder than the semiconductor material, and a polishing agent is added which has a pH? to 10 and contains no substances with abrasive action. Preferred is a method for producing a semiconductor wafer, comprising the following ordered steps: separating a semiconductor single crystal into wafers; simultaneously processing both sides of the wafer by chip-removing processing; polishing the wafer, comprising a polishing process A and a polishing process B; and CMP of one side of the wafer, removing <1 ?m.
    Type: Grant
    Filed: April 6, 2010
    Date of Patent: March 19, 2013
    Assignee: Siltronic AG
    Inventor: Georg Pietsch
  • Publication number: 20120309271
    Abstract: A method for dressing a tool of a gear grinding machine, including a workpiece holder and a tool holder, is provided. The tool holder, arranged on a machining head, is rotatable about a first axis of rotation, and is linearly movable via a first linear axis of movement, wherein a workpiece clamped in the workpiece holder can be machined by a tool clamped in the tool holder. The machine furthermore includes a dressing unit with a dressing tool holder rotatable about a second axis of rotation, wherein a dressing tool accommodated in the dressing tool holder is used for dressing the tool clamped in the tool holder. During the dressing operation the machining head is pivoted about the swivel axis in dependence on a tool profile and is linearly moved with the first linear axis of movement.
    Type: Application
    Filed: May 30, 2012
    Publication date: December 6, 2012
    Applicant: Liebherr-Verzahntechnik GmbH
    Inventor: Hansjoerg Geiser
  • Patent number: 8298040
    Abstract: A process and an apparatus for optimising tyres after vulcanization, in order to improve the dynamic behavior of the tyre itself. The process includes first of all the stages of measuring the curve of the radial force of the tyre, calculating the first harmonic of this radial force and identifying on the tyre a point corresponding to the maximum of the first harmonic. Subsequently, material is removed from the tread over an arc subtending a principal angle positioned either side of the maximum point of the first harmonic. The removal stage is performed by removing discrete circumferential portions of the arc with differentiated depths of removal, increasing from opposite ends of this arc toward the maximum point of the first harmonic.
    Type: Grant
    Filed: August 9, 2007
    Date of Patent: October 30, 2012
    Assignee: Pirelli Tyre S.p.A.
    Inventor: Stefano De Gradi
  • Patent number: 8177605
    Abstract: A bowling ball surface treatment device for abrading, polishing or cleansing a bowling ball includes a housing, a ball displacing unit movably mounted to the housing for holding the bowling ball in a rotatable manner and for reciprocatingly displacing the bowling ball between a temporary waiting region and a surface treatment region, a surface treatment disc for supporting and spinning the bowling ball in the surface treatment region, the surface treatment disc having a surface treatment element for making frictional contact with the bowling ball, a temporary support disc for temporarily supporting the bowling ball in the temporary waiting region when the bowling ball is moved out of the surface treatment region, and a disc drive unit for rotatingly driving the surface treatment disc and the temporary support disc.
    Type: Grant
    Filed: December 13, 2006
    Date of Patent: May 15, 2012
    Inventor: Sang-Bae Shim
  • Publication number: 20120052775
    Abstract: A blade sharpening system is provided that includes a sharpening assembly including a sharpener configured to engage a generally circular agricultural implement blade while mounted on the agricultural implement. The blade sharpening system also includes a rail configured to support the sharpening assembly and to facilitate movement of the sharpening assembly along the rail. The blade sharpening system further includes a mounting feature coupled to the rail and configured to engage a structural member of the agricultural implement to support the rail and sharpening assembly.
    Type: Application
    Filed: August 31, 2010
    Publication date: March 1, 2012
    Applicant: CNH America LLC
    Inventors: Tracey D. Meiners, Ross L. Gingrich, Ben G. Zimmerman, Alan R. Martin, Paul Hurtis
  • Patent number: 8113919
    Abstract: A bowling ball surface treatment apparatus is designed to uniformly abrade and polish a bowling ball. The apparatus includes a housing and a ball movement guider provided inside the housing for guiding movement of a bowling ball and confining the bowling ball within a limited surface treatment area, and a surface treatment disc arranged below the ball movement guider for supporting, rotating and revolving the bowling ball. The surface treatment disc has a disc shaft and a surface treatment element for abrading or polishing the bowling ball. The apparatus further includes a disc rotating device for rotating the surface treatment disc about a disc center axis and a disc revolving device for rotatably holding the disc shaft of the surface treatment disc and for causing the surface treatment disc to make revolving movement around a sun axis offset from the disc center axis.
    Type: Grant
    Filed: June 2, 2008
    Date of Patent: February 14, 2012
    Inventor: Sang-Bae Shim
  • Patent number: 8083570
    Abstract: A multilayer chemical mechanical polishing pad is provided, having a polishing layer with a polishing surface, a polishing layer interfacial region parallel to the polishing surface and an outer perimeter; a porous subpad layer with a bottom surface, a porous subpad layer interfacial region parallel to the bottom surface and an outer perimeter; a pressure sensitive adhesive layer; and, a light transmissive window element; wherein the polishing layer interfacial region and the porous subpad layer interfacial region form a coextensive region; wherein the coextensive region secures the polishing layer to the porous subpad layer without the use of a laminating adhesive; wherein the pressure sensitive adhesive layer is applied to the bottom surface of the porous subpad layer; wherein an internal opening extends through the multilayer chemical mechanical polishing pad from the bottom surface to the polishing surface and is bounded by an internal peripheral edge of the porous subpad layer.
    Type: Grant
    Filed: October 17, 2008
    Date of Patent: December 27, 2011
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Darrell String, Jon William Turley
  • Patent number: 8057284
    Abstract: A tool for polishing and fine-grinding optically active surfaces in precision optics has a main body which can be attached in a rotationally fixed manner to a tool spindle of a machining machine. A guide element is arranged concentrically in the main body and is mounted such that it can be displaced axially therein. A machining disk is replaceably attached to the outer end of the guide element. The main body is rigidly connected in a rotationally fixed manner, over the full displacement travel, to the guide element mounted such that it can be displaced axially therein, and in that the machining disk is rigidly fixed in a non-tiltable manner on the guide element.
    Type: Grant
    Filed: April 22, 2009
    Date of Patent: November 15, 2011
    Assignee: Satisloh GmbH
    Inventor: Christian Leonhardt
  • Patent number: 8047897
    Abstract: To provide a high-rigidity flat grinding device, a substrate flat grinding device has three fastening plate lifting-and-lowering mechanisms that have kinematic couplings and a cylinder rod that move the fastening plate upward or downward. Being a high-rigidity grinding device in which the load of the fastening plate 6 also is a load on the grindstone 14 that does the grinding, there is little deflection in the thickness distribution of the substrates that are obtained, even if they are semiconductor substrates having a large substrate diameter of 450 mm.
    Type: Grant
    Filed: January 21, 2009
    Date of Patent: November 1, 2011
    Assignee: Okamoto Machine Tool Works, Ltd.
    Inventors: Moriyuki Kashiwa, Etsuo Fujita, Kazuo Kobayashi, Tomio Kubo
  • Patent number: 8016646
    Abstract: A saw blade sharpening assembly includes a sharpening disk, a blade support panel disposed generally adjacent to the sharpening disk and a generally sloped blade support base carried by the blade support panel.
    Type: Grant
    Filed: December 23, 2008
    Date of Patent: September 13, 2011
    Inventors: Kenneth L. Bailey, Beverly J. Bailey
  • Patent number: 7910157
    Abstract: In the present invention, an insulating material is applied onto a substrate in a coating treatment unit to form a coating insulating film. The substrate is heated in the heating processing unit, whereby the coating insulating film is hardened partway. A brush is then pressed against the front surface of the coating insulating film in a planarization unit and moved along the front surface of the coating insulating film, thereby planarizing the coating insulating film. The substrate is then heated to completely harden the coating insulating film. According to the present invention, the coating film can be planarized without using the CMP technology.
    Type: Grant
    Filed: December 15, 2006
    Date of Patent: March 22, 2011
    Assignee: Tokyo Electron Limited
    Inventors: Shouichi Terada, Tsuyoshi Mizuno, Takeshi Uehara
  • Publication number: 20100190415
    Abstract: A method for polishing lens surfaces, in which a) prior to the polishing process, for the purpose of determining an abrasion profile, at least one point of a workpiece is polished by means of a polishing tool to be used, using at least one pre-defined parameter; b) the polishing abrasion thus achieved on the workpiece side is determined by measuring; c) on the basis of the abrasion profile, at least one parameter is set for a subsequent polishing process, and the polishing process is completed at least partially. A method for polishing lens surfaces, in which the polishing point is places at least outside of the workpiece centre at a distance a from a plane which is tensioned by the tool spindle axis and the workpiece spindle axis.
    Type: Application
    Filed: January 13, 2010
    Publication date: July 29, 2010
    Applicant: SCHNEIDER GMBH & CO. KG
    Inventors: Gunter Schneider, Helwig Buchenauer, Stephan Huttenhuis, Frank Flesch
  • Publication number: 20100159803
    Abstract: Apparatus comprising a tool (2) for forming an aspherical surface on a material (14), and a support for supporting the material (12) for rotation about an axis, the arrangement being such that the tool (2) is restricted to movement with respect to the material (14) in two substantially linear axes transverse to each other. The apparatus may be a high-performance machine comprising a measuring arrangement (18) mounted so as to extend substantially across the surface of the material (14) and serving to measure the distance between the tool (2) and a referencing region (32) of the measuring arrangement (18) which can be in the form of a symmetrical metrology device (18), the metrology device being structurally unloaded. The apparatus is substantially symmetrical in two substantially vertical planes substantially perpendicular to and intersecting each other.
    Type: Application
    Filed: May 2, 2006
    Publication date: June 24, 2010
    Inventors: Paul Raymond Shore, Paul Howard Morantz
  • Publication number: 20100151773
    Abstract: A tool for polishing and fine-grinding optically active surfaces in precision optics has a main body which can be attached in a rotationally fixed manner to a tool spindle of a machining machine. A guide element is arranged concentrically in the main body and is mounted such that it can be displaced axially therein. A machining disk is replaceably attached to the outer end of the guide element. The main body is rigidly connected in a rotationally fixed manner, over the full displacement travel, to the guide element mounted such that it can be displaced axially therein, and in that the machining disk is rigidly fixed in a non-tiltable manner on the guide element.
    Type: Application
    Filed: April 22, 2009
    Publication date: June 17, 2010
    Inventor: Christian Leonhardt
  • Publication number: 20100144243
    Abstract: A process and an apparatus for optimising tyres after vulcanization, in order to improve the dynamic behavior of the tyre itself. The process includes first of all the stages of measuring the curve of the radial force of the tyre, calculating the first harmonic of this radial force and identifying on the tyre a point corresponding to the maximum of the first harmonic. Subsequently, material is removed from the tread over an arc subtending a principal angle positioned either side of the maximum point of the first harmonic. The removal stage is performed by removing discrete circumferential portions of the arc with differentiated depths of removal, increasing from opposite ends of this arc toward the maximum point of the first harmonic.
    Type: Application
    Filed: August 9, 2007
    Publication date: June 10, 2010
    Inventor: Stefano De Gradi
  • Publication number: 20090280721
    Abstract: A lapping or polishing machine includes a material having a first finishing surface to process a surface of a work item, a measuring tool to measure a contour of the first finishing surface, and a conditioning tool having a second finishing surface to process the first finishing surface to reduce a difference between the measured contour and a desired contour of the first finishing surface.
    Type: Application
    Filed: May 7, 2009
    Publication date: November 12, 2009
    Inventor: Douglas Martin Hoon
  • Patent number: 7585203
    Abstract: A bowling ball surface treatment machine includes a housing and a ball movement guider provided inside the housing for guiding movement of a bowling ball, the ball movement guider having a guider center axis and an inner circumferential surface. A surface treatment disc with a surface treatment is arranged below the ball movement guider for supporting and rotating the bowling ball. The surface treatment disc has a disc center axis deviating from the guider center axis. The machine further includes a disc driving motor for rotating the surface treatment disc about the disc center axis and a controller for allowing the disc driving motor to repeatedly accelerate the surface treatment disc to a target rotation speed, rotate the surface treatment disc in a surface treatment position at the target rotation speed for a predetermined running time and then decelerate the surface treatment disc toward a zero speed.
    Type: Grant
    Filed: June 24, 2008
    Date of Patent: September 8, 2009
    Inventor: Sang-Bae Shim
  • Publication number: 20090203296
    Abstract: The invention relates to a device (10) for truing a machining wheel (20), in particular grinding or eroding wheel, by means of a rotating truing tool (30), comprising: a first rotating spindle (18), which can be driven so as to rotate about a first axis of rotation (22), for attaching the machining wheel (20) and a second rotating spindle (28), which can be driven so as to rotate about a second axis of rotation (32), for attaching the truing tool (30), wherein, in order to true the machining wheel (20), the truing tool (30) rotatably driven by the second rotating spindle (28) can be brought into material-removing contact with the machining wheel (20) rotatably driven by the first rotating spindle (18). In this respect, in order to obtain uniform truing results, the first axis of rotation (22) is directed substantially orthogonally to the second axis of rotation (32) during the entire truing process.
    Type: Application
    Filed: January 20, 2009
    Publication date: August 13, 2009
    Applicant: Vollmer Werke Maschinenfabrik GmbH
    Inventors: Rainer Braig, Norbert Bailer, Manfred Saegemueller
  • Patent number: 7500905
    Abstract: A grinding apparatus and a grinding system capable of efficient and superior grinding performance prevent the falling of a belt during the grinding of an edge surface thereof. The apparatus includes two rotating bodies 31 and 32 each having segment brushes 4, 4, . . . attached in the circumferential direction at the edge thereof. The rotating bodies 31 and 32 are rotated in the same direction. The tip of the segment brushes 4, 4, . . . is opposed to one edge surface of a belt b stretched between a driving roller 21 and a driven roller 22. The segment brushes 4 of the two rotating bodies enter toward the belt b at appropriate locations on the one edge surface, such that the falling of the belt can be prevented. A grinding apparatus 1 includes a grinder 3 consisting of the rotating bodies 31 and 32, and a holder consisting of the rollers 21 and 22 and a casing 23 by which the rollers are rotatably supported.
    Type: Grant
    Filed: February 15, 2006
    Date of Patent: March 10, 2009
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventor: Kiyoshi Iga
  • Publication number: 20090047880
    Abstract: A grinding machine enabling the easy maintenance and inspections of mechanisms arranged therein, an increase in visibility when the states of a workpiece and a grinding wheel are confirmed, and the easy loading/unloading of the workpiece and the easy replacement of the grinding wheel. The grinding machine comprises a workpiece supporting/driving device, a wheel work head, a wheel head feeder, a coolant supply unit, a cover covering internal devices such as the workpiece supporting/driving device, the wheel work head, the wheel head feeder, and the coolant supply unit, and an open/close door formed at a part of the working space side upper surface of the cover and allowing at least the loading/unloading of the workpiece and the replacement of the grinding wheel.
    Type: Application
    Filed: October 25, 2005
    Publication date: February 19, 2009
    Applicant: Jtekt Corporation
    Inventor: Yoshio Wakazono
  • Publication number: 20090036036
    Abstract: Apparatus and methods for conditioning a polishing pad are provided. An apparatus includes a base, an arm adapted to support a conditioning disk; and a drive mechanism coupled between the arm and the conditioning disk, wherein the drive mechanism is adapted to directly rotate the conditioning disk relative to the arm. Numerous other aspects are disclosed.
    Type: Application
    Filed: October 5, 2008
    Publication date: February 5, 2009
    Inventors: Roy C. Nangoy, Shou-Sung Chang, Donald J.K. Olgado, Hung Chih Chen, Gerald John Alonzo
  • Publication number: 20090011684
    Abstract: A polishing machine for optical elements, comprising:—a spindle arranged to rotationally drive an optical element;—a polishing tool mobile relative to the spindle; wherein the polishing machine further comprises a platform mounted on top of a work chamber, the work chamber comprising the spindle, and the platform holding a body on which is mounted the polishing tool.
    Type: Application
    Filed: December 26, 2006
    Publication date: January 8, 2009
    Applicant: ESSILOR INTERNATIONAL (Compagnie Generale d'Optique)
    Inventors: James W. Drain, John Roderick Keller, Steven L. Reid, Joseph K. Bond, Maggy Perrier, Laurent Marcepoil, Eric Comte
  • Publication number: 20080076336
    Abstract: Damage of a surface plate used in a CMP apparatus due to troubles generated in repair or replacement of the surface plate, operation of the CMP apparatus, etc. is prevented. In order to solve the problem, the present invention provides a surface plate protecting device in the CMP apparatus, which is a surface plate 2 used in the CMP apparatus, wherein a polishing pad 16 is replaceably bonded with the upper surface of a sheet 8, and the lower surface of the sheet 8 is bonded with the upper surface of the surface plate 2 by an adhesive agent 9 having adhesive force larger than the adhesive force of the polishing pad 16, so that damage or the like of the surface of the surface plate 2 generated due to troubles, etc. in polishing of a wafer can be blocked by the sheet 8.
    Type: Application
    Filed: September 21, 2007
    Publication date: March 27, 2008
    Inventors: Akihiko Saito, Shin-ichi Tsujimura
  • Patent number: 7241203
    Abstract: The present invention relates to an apparatus and method for polishing semiconductor substrates with improved throughput and reduced foot print. One embodiment of the present invention provides an apparatus for polishing a substrate. The apparatus comprises a base, four polishing stations disposed on the base, two load cups disposed on the base, a first wash station disposed on the base adjacent to the first of the four polishing station, and a carousel rotatable about a carousel axis and supported by the base, wherein the carousel comprises six substrate heads alignable to any of the four polishing stations, the two load cups and the first wash station.
    Type: Grant
    Filed: December 8, 2006
    Date of Patent: July 10, 2007
    Assignee: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Simon Yavelberg
  • Patent number: 7238092
    Abstract: The present invention relates to semiconductor integrated circuit technology and discloses an electrochemical mechanical processing system for uniformly distributing an applied force to a workpiece surface. The system includes a workpiece carrier for positioning or holding the workpiece surface and a workpiece-surface-influencing-device (WSID). The WSID is used to uniformly distribute the applied force to the workpiece surface and includes various layers that are used to process and apply a uniform and global force to the workpiece surface.
    Type: Grant
    Filed: May 23, 2002
    Date of Patent: July 3, 2007
    Assignee: Novellus Systems, Inc.
    Inventors: Bulent M. Basol, Cyprian E. Uzoh, Jeffrey A. Bogart
  • Patent number: 7226344
    Abstract: A method of processing an antifriction bearing unit for a wheel, the antifriction bearing unit including an outer race, an inner race, a plurality of rolling elements and a flange portion for directly or indirectly mounting a brake disk provided to one of the outer and inner races, the method includes: assembling the outer and inner races and the rolling element together; after assembling, placing the one of the outer and inner race in position incapably of circumferential rotation; grinding the flange portion by bring the flange portion into contact with a grindstone which is rotated while the other of the outer and inner race is left free.
    Type: Grant
    Filed: June 16, 2006
    Date of Patent: June 5, 2007
    Assignee: Koyo Seiko Co., Ltd.
    Inventors: Takeshi Fukao, Toshihiro Nakano
  • Patent number: 7217176
    Abstract: The invention refers to a polishing tool for optical lenses with at least one polishing pad adaptable at least partially to the shape of a lens surface of said lenses and drivable by means of a drive shaft, said polishing pad having a membrane, wherein said polishing pad can transmit a bearing force of said membrane at least in an orthogonal direction relative to a lens surface. Moreover, the polishing tool comprises a reinforcing member connectable to said membrane, said reinforcing member being dimensionally stable in a parallel direction relative to a surface of said membrane and being flexible and/or pliable in an orthogonal direction relative to the surface of said membrane, wherein at least one pressure pad with a pressure membrane is arranged within said polishing pad, wherein said pressure membrane can be made to bear and/or can be prestressed against said membrane or said reinforcing member in an indirect or in a direct manner.
    Type: Grant
    Filed: October 20, 2005
    Date of Patent: May 15, 2007
    Assignee: Schneider GmbH & Co. KG
    Inventors: Gunter Schneider, Helwig Buchenauer, Ulf Börner, Klaus Krämer
  • Patent number: 7166016
    Abstract: The present invention relates to an apparatus and method for polishing semiconductor substrates with improved throughput and reduced foot print. One embodiment of the present invention provides an apparatus for polishing a substrate. The apparatus comprises a base, four polishing stations disposed on the base, two load cups disposed on the base and a carousel supported by the base. The carousel comprises six substrate heads and is rotatable about a carousel axis. Each of the six substrate heads is configured to align with any one of the four polishing stations and the two load cups.
    Type: Grant
    Filed: May 18, 2006
    Date of Patent: January 23, 2007
    Assignee: Applied Materials, Inc.
    Inventor: Hung Chih Chen
  • Patent number: 6783446
    Abstract: There is provided an apparatus for polishing a substrate, including (a) a polishing pad formed with a plurality of through-holes through which polishing material is supplied to a surface of the polishing pad, (b) a level block on which the polishing pad is mounted, and (c) a rotatable carrier for supporting a substrate thereon, the carrier being positioned in facing relation with the level block, the level block being rotatable around a rotation axis thereof with the rotation axis being moved along an arcuate path, and causing the polishing pad to make contact with the substrate for polishing the substrate, the polishing pad having a first ring-shaped region concentric thereto where no through-holes are formed. For instance, the first ring-shaped region has a width greater than 10%, but smaller than 95% of a radius of the polishing pad. The apparatus enhances uniformity in polishing a substrate.
    Type: Grant
    Filed: February 24, 1999
    Date of Patent: August 31, 2004
    Assignee: NEC Electronics Corporation
    Inventors: Mieko Suzuki, Yasuaki Tsuchiya
  • Patent number: 6705929
    Abstract: Cloth cleaning device of a polishing machine which is capable of fully cleaning a polishing cloth including a part in the vicinity of a center roller. The cloth cleaning device includes an arm movable in a plane parallel to the polishing cloth between a first position above the polishing cloth and a second position outside of the polishing cloth. A jet nozzle is attached to the arm and directs high pressure water toward the polishing cloth. An enclosing member encloses the jet nozzle so as to prevent the high pressure water, which has been directed out from the jet nozzle, from scattering. The jet nozzle is oriented toward the center roller and the high pressure water is directed toward the part of the polishing cloth in the vicinity of the center roller when the arm moves the jet nozzle close to the center roller.
    Type: Grant
    Filed: November 20, 2000
    Date of Patent: March 16, 2004
    Assignee: Fujikoshi Machinery Corp.
    Inventors: Yoshinobu Nishimoto, Makoto Nakajima, Yoshio Nakamura, Yasuhide Denda, Chihiro Miyagawa
  • Patent number: 6666756
    Abstract: A wafer carrier head assembly for holding a wafer in chemical mechanical planarization applications is dis;losed that includes a downwardly protruding wafer retaining ring that moves independent of the wafer carrier head and retains an edge of the wafer on said polishing surface. An adjustable wafer holding mechanism that applies one of a uniform downward force and a uniform upward force to the wafer is also included. Application of the upward force allows the wafer holding mechanism to retain and transport the wafer to a polishing surface. Application of the downward force allows the wafer holding mechanism to retain the wafer on the polishing surface and allows the wafer to be uniformly polished. The wafer carrier head assembly herein disclosed is also configured to pivotally accommodate changes in parallelism between the wafer and the polishing surface when the wafer is being polished.
    Type: Grant
    Filed: March 31, 2000
    Date of Patent: December 23, 2003
    Assignee: Lam Research Corporation
    Inventor: Glenn W. Travis
  • Publication number: 20030068965
    Abstract: A polishing tool used for a CMP process is disclosed. The polishing tool includes a polishing platen for holding a wafer faced-up thereon and carrying the wafer to move to and fro between a first position and a second position, a polishing pad for polishing the wafer, and a holder for holding the polishing pad to self-rotate and carrying the polishing pad to move across the wafer surface and further driving the polishing pad to polish the wafer.
    Type: Application
    Filed: April 19, 2002
    Publication date: April 10, 2003
    Applicant: ProMos Technologies, Inc.
    Inventor: Champion Yi
  • Patent number: 6537135
    Abstract: The present invention relates to an apparatus and method for polishing substrate surfaces. The method can include the steps of holding a substrate against a polishing surface and depositing slurry on the polishing surface. The method can further include the step of moving the holding device in a substantially curvilinear path relative to the polishing surface, or the step of moving the polishing surface in a substantially curvilinear path relative to the holding device. The apparatus comprises a polishing surface, a holding device for holding a substrate against the polishing surface, and a slurry supply system for depositing slurry on the polishing surface. The apparatus further includes a moving structure for moving the holding device in a substantially curvilinear path along the polishing surface, or a moving structure for moving the polishing surface in a substantially curvilinear path relative to the holding device. The substantially curvilinear path is preferably substantially a figure eight path.
    Type: Grant
    Filed: December 13, 1999
    Date of Patent: March 25, 2003
    Assignee: Agere Systems Inc.
    Inventors: William G. Easter, John A. Maze, III, Sailesh M. Merchant, Frank Miceli, Charles W. Pearce
  • Patent number: 6524176
    Abstract: A polishing pad has a first layer, a second layer, a hole and a plug. The hole is formed in the polishing pad and has a first section in the first layer of the polishing pad and a second section in a second layer of the polishing pad. The plug is embedded in the hole and has an upper portion and a lower portion. The upper portion of the plug fits into the first section of the hole, and the lower portion of the plug fits into the second section of the hole. Since the plug has a height of the polishing pad, the problem of depositions, such as water droplets, has been solved. The endpoint detection can thus be precisely controlled.
    Type: Grant
    Filed: March 25, 2002
    Date of Patent: February 25, 2003
    Assignee: Macronix International Co. Ltd.
    Inventors: Chih-Hsien Cheng, Yuh-Turng Liu
  • Publication number: 20030008601
    Abstract: A porous, roll-grinding tool has an abrasive surface which is adapted to contact and grind the surface of a roll and configured to a planar polygonal shape having 4 to 20 sides. Using the grinding tool, a roll can be ground within a satisfactory dimensional tolerance, with feed marks crossing the circumferential direction of the roll at a small feed mark pitch inclination angle, so that no streaky printing defects will be produced when the ground roll is used in printing.
    Type: Application
    Filed: June 28, 2002
    Publication date: January 9, 2003
    Applicant: SHINANO ELECTRIC REFINING CO., LTD.
    Inventors: Noukou Toyama, Kenichi Kazama
  • Publication number: 20020160701
    Abstract: A holder in a brush-cleaning installation, preferably for combined use in the brush-cleaning and centrifugal-drying process, contains a carrier part from which there extend, in a spider-shaped manner, a plurality of carrying arms. On the carrying arms there is mounted, in a rotatable manner in each case, a guide roller which, in addition to positioning the semiconductor wafer vertically, also makes it possible for the semiconductor wafer to be positioned horizontally with the aid of an annular collar on a bottom section of the guide roller.
    Type: Application
    Filed: April 29, 2002
    Publication date: October 31, 2002
    Inventors: Matthias Fehr, Rudiger Hunger, Thomas Mieth