Abstract: A polishing pad, a polishing apparatus and a method of manufacturing a semiconductor package using the same are provided. In some embodiments, a polishing pad includes a sub-pad portion and a top pad portion over the sub-pad portion. The top pad portion includes a plurality of grooves having a first width and a plurality of openings having a second width different from the first width, and the openings are located in a center zone of the polishing pad.

Abstract: A polishing apparatus capable of increasing an added value is disclosed. The polishing apparatus includes a polishing table configured to support a polishing pad, a top ring configured to press a substrate against the polishing pad, and a liquid supply mechanism configured to supply a liquid onto the polishing pad. The liquid supply mechanism includes a nozzle arm configured to be movable in a radial direction of the polishing table, and a liquid ejection nozzle attached to the nozzle arm. The liquid ejection nozzle is a fan-shaped nozzle having a liquid throttle surface having a tapered shape.

Abstract: A method of manufacturing a wafer holder, the wafer holder having a frame having at least one cavity capable of receiving and supporting a wafer grown from an ingot to be polished in a polishing machine, the at least one cavity having a cross sectional footprint at least equal to a cross sectional footprint of the wafer, the wafer having a thickness to cross sectional area ratio of 0.001 per unit length or less, a polymer film pad being permanently affixed in the at least one cavity, including cutting a frame from a layer of a thermoset or thermoplastic material having a thickness tolerance and measuring a thickness of the frame at at least one location thereon. The method further includes forming a cavity in the frame having a predetermined depth, and permanently affixing a polymer film pad in the cavity.

Abstract: A developer tool described herein includes a dispenser that includes a greater quantity of nozzles in a central portion relative to a perimeter portion such that the developer tool is capable of more effectively removing material from a photoresist layer near a center of a substrate (which tends to be thicker near the center of the substrate relative to the edge or perimeter of the substrate). In this way, the developer tool may reduce the amount of photoresist residue or scum remaining on the substrate near the center of the substrate after a development operation, which may enable defect removal and/or prevention, may increase semiconductor processing yield, and/or may increase semiconductor processing quality.

Abstract: The present application relates to an adjustable wheel deburring device, comprising a lower lifting-translating-overturning system, a clamping driving system, a upper lifting-moving system, a adjusting system, a brush unit and a upper deburring system, among others. The device according to the present invention in use is able to not only remove burrs at the back cavity and front of the wheel, but also automatically adjust the shape of the brush belt according to the shape of the wheel back cavity.

Abstract: A multi-station wheel deburring device is disclosed, which consists of a lower lifting translation system, a first brush system, a second brush system, a synchronous clamping drive system and a third brush system, etc. The multi-station wheel deburring device can be used for removing burrs from the root of a wheel flange, a center hole, bolt holes and a back cavity, can automatically adjust the position of each brush according to the dimension and shape of a wheel, and at the same time, has the characteristics of high automation, high removal efficiency, advanced technology, strong universality and high safety and stability.

Abstract: A machining swarf removing apparatus includes a left and a right machining swarf removing units. When removing machining swarf adhered to a recovery box, the left machining swarf removing unit is placed in removal starting position. A brush enters an insertion-ready state in which transverse direction thereof is oriented in a second direction D2. The brush is moved to an insertion position for insertion into the recovery box, then the brush is rotated to enter a machining swarf removal-ready state in which a longitudinal direction thereof is oriented in the second direction D2. The left machining swarf removing unit is moved to remove the machining swarf adhered to the recovery box by the brush, while a left rod vibrating device is driven to vibrate a rod, vibrating the brush attached to the rod.

Abstract: The precision lapping and polishing device for external cylindrical surface of disk part and its taper error adjustment method. The device composes a circular baseplate, slant rails, baffles, pressure plates, copper blocks, a washer blanket; blanket plates, a set of bead shafting, a friction driving wheel, a DC motor, a mobile power supply, a LED lamp and a cover body. By adopting the working principle that the generatrix rotates around the fixed axis to form the cylindrical surface, the ultra-precision machining of the cylindrical surface of disk part is realized. The radial-continuous-automatic-micro feeding of the disk part is realized by thinning the thickness of the circular baseplate which is internally tangent to the generatrix of the circular baseplate during the process of lapping and polishing. The device has the advantages of operating simply, adjusting conveniently, low cost and is of important value for popularization and application.

Abstract: According to one embodiment, a substrate polishing method includes: conveying a substrate to a position above a polishing pad by sucking the substrate by a first region of an elastic film; polishing the substrate while bringing the substrate into contact with the polishing pad; and lifting off the substrate by sucking the substrate by a second region of the elastic film, the second region being larger than the first region.

Abstract: A chemical mechanical polishing (CMP) chamber is disclosed. The CMP chamber includes a chamber body, a door mounted on the chamber body and a chamber substructure being one selected from a group consisting of a moisture separator separating a moisture generated in the CMP chamber, a supplementary exhaust port, a transparent window mounted on the door, a sampling port mounted on the door, a sealing material including a metal frame, an o-ring for sealing the door and a combination thereof.

Abstract: A polishing pad includes a polishing layer stack that has a polishing surface, a bottom surface, and an aperture from the polishing surface to the bottom surface. The polishing layer stack includes a polishing layer that has the polishing surface. A fluid-impermeable layer spans the aperture and the polishing pad. A first adhesive layer of a first adhesive material is in contact with and secures the bottom surface of the polishing layer to the fluid-impermeable layer. The first adhesive layer spans the aperture and the polishing pad. The light-transmitting body is positioned in the aperture and has a lower surface in contact with, is secured to the first adhesive layer, and is spaced apart from a side-wall of the aperture by a gap. An adhesive sealant of a different second material is disposed in and laterally fills the gap.

Abstract: A polishing apparatus according to one embodiment includes: a turn table on which a polishing pad for polishing a substrate is provided; a turn table rotation mechanism configured to rotate the turn table; a dresser configured to dress the polishing pad by cutting a surface of the polishing pad; a pressing mechanism configured to press the dresser onto the polishing pad; a dresser rotation mechanism configured to rotate the dresser; a swinging mechanism configured to swing the dresser on the polishing pad; and a controller configured to control the pressing mechanism, the turn table rotation mechanism or the dresser rotation mechanism based on a position and a swinging direction of the dresser.

Abstract: Polishing pads having a foundation layer and a window attached to the foundation layer, and methods of fabricating such polishing pads, are described. In an example, a polishing pad for polishing a substrate includes a foundation layer having a first modulus. A polishing layer is attached to the foundation layer and has a second modulus less than the first modulus. A first opening is through the polishing layer and a second opening is through the foundation layer. The first opening exposes at least a portion of the second opening and exposes a portion of the foundation layer. A window is disposed in the first opening and is attached to the exposed portion of the foundation layer.

Abstract: Apparatus polishing one side of a wafer to accurately realize the desired wafer edge shape without dependence on the period of use of a polishing cloth is provided. In the apparatus of the present invention, a wafer fixed to a head is brought into contact with a polishing cloth provided on a surface of a surface plate, and the head and the surface plate are rotated, thereby polishing one side of the wafer. The contact angle of the polishing cloth (S1) is measured; the rotation speed of the head and the surface plate is determined based on the measured contact angle of the polishing cloth (S4). One side of the wafer is polished by rotating the head and the surface plate at the determined rotation speed (S5, S6).

Abstract: A polishing brush includes: a brush body that includes a cylindrical base section and linear abrasive materials extending from a bottom surface of one side of the base section along a direction of a center of an axis of the base section, and removes burrs and performs polishing on a surface of a workpiece metal by relatively moving the abrasive materials and the workpiece metal while tips of the abrasive materials come into contact with a surface of the workpiece metal; a brush guide that is coaxial with the center of the axis and is disposed on the outside of the brush body in a radial direction so that the tips of the abrasive materials protrude from an end portion; and a displacement mechanism that changes protruding lengths of the abrasive materials from the end portion.

Abstract: The polishing pad is suitable for polishing or planarizing at least one of semiconductor, optical and magnetic substrates. The polishing pad has a polishing surface, an opening through the polishing pad and a transparent window within the opening in the polishing pad. The transparent window has a concave surface with a depth that increases with use of the polishing pad. A signal region slopes downward into the central region for facilitating debris removal and a debris drainage groove extending through the central region into the polishing pad. Rotating the polishing pad with polishing fluid in the debris drainage groove sends debris from the central region into the polishing pad through the debris drainage groove.

Abstract: The described embodiments relate generally to lapping operations and related systems and apparatuses. Various embodiments of lapping tables are described for applying a lapping operation to a non-planar surface of a workpiece. For example, methods and apparatus are described which allow a lapping operation to be applied to a curved outer surface portion of a cylindrical workpiece. Lapping of non-planar outer surfaces of workpieces is conducted by rotating the workpieces during the lapping operations.

Abstract: A probe pin having a bent portion at its tip end portion is used for a probe card, the probe pin is configured such that an angle constituted by a direction of work groove generated at a time of machine-working of a tip end portion of the probe pin and a longitudinal direction of a metal wire is set to 45 degree or less, or both directions are set to be almost parallel to each other. Due to above configuration, even if the tip end portion of the probe pin is subjected to a bending work and a worked surface is formed with recessed portion, a breakage of the probe pin caused by the recessed portion existing on the worked surface and functioning as a starting point of the breakage can be effectively prevented whereby a lowering of a production yield of the probe pin can be greatly suppressed.

Abstract: A polishing apparatus polishes a substrate by bringing the substrate into sliding contact with a polishing surface. The polishing apparatus includes: a substrate holder having a substrate holding surface configured to press the substrate against the polishing surface, a retaining ring coupled to the substrate holding surface and configured to surround the substrate, wherein the retaining ring is brought into contact with the polishing surface during operation of the polishing apparatus, the retaining ring being configured to be tiltable independently of the substrate holding surface; a rotating mechanism configured to rotate the substrate holder about its own axis; and at least one local load exerting mechanism configured to exert a local load on a part of the retaining ring in a direction perpendicular to the polishing surface, the at least one local load exerting mechanism being arranged so as not to move in accordance with the substrate holder.

Abstract: The present invention provides an apparatus capable of uniformly grinding an polishing pad. Further, the present invention provides a method of grinding an polishing pad by using the grinding apparatus.

Abstract: A polishing apparatus for polishing an end edge of a work piece by bringing a bristle tip of a polishing brush into contact with the end edge of the work piece as the bristle tip passes the end edge of the work piece includes a support plate having a through hole into which the polishing brush is inserted and a suppression portion that is provided at the support plate and suppresses a deformation of the bristle tip of the polishing brush when the work piece is polished.

Abstract: Semiconductor wafers are polished by a material-removing polishing process A, on both sides of the wafer, using an abrasive-free polishing pad, and a polishing agent which contains abrasive; and a material-removing polishing process B, on at least one side of the wafer, using a polishing pad with a microstructured surface containing no materials which contact the wafer which are harder than the semiconductor material, and a polishing agent is added which has a pH? to 10 and contains no substances with abrasive action. Preferred is a method for producing a semiconductor wafer, comprising the following ordered steps: separating a semiconductor single crystal into wafers; simultaneously processing both sides of the wafer by chip-removing processing; polishing the wafer, comprising a polishing process A and a polishing process B; and CMP of one side of the wafer, removing <1 ?m.

Abstract: A method for dressing a tool of a gear grinding machine, including a workpiece holder and a tool holder, is provided. The tool holder, arranged on a machining head, is rotatable about a first axis of rotation, and is linearly movable via a first linear axis of movement, wherein a workpiece clamped in the workpiece holder can be machined by a tool clamped in the tool holder. The machine furthermore includes a dressing unit with a dressing tool holder rotatable about a second axis of rotation, wherein a dressing tool accommodated in the dressing tool holder is used for dressing the tool clamped in the tool holder. During the dressing operation the machining head is pivoted about the swivel axis in dependence on a tool profile and is linearly moved with the first linear axis of movement.

Abstract: A process and an apparatus for optimising tyres after vulcanization, in order to improve the dynamic behavior of the tyre itself. The process includes first of all the stages of measuring the curve of the radial force of the tyre, calculating the first harmonic of this radial force and identifying on the tyre a point corresponding to the maximum of the first harmonic. Subsequently, material is removed from the tread over an arc subtending a principal angle positioned either side of the maximum point of the first harmonic. The removal stage is performed by removing discrete circumferential portions of the arc with differentiated depths of removal, increasing from opposite ends of this arc toward the maximum point of the first harmonic.

Abstract: A bowling ball surface treatment device for abrading, polishing or cleansing a bowling ball includes a housing, a ball displacing unit movably mounted to the housing for holding the bowling ball in a rotatable manner and for reciprocatingly displacing the bowling ball between a temporary waiting region and a surface treatment region, a surface treatment disc for supporting and spinning the bowling ball in the surface treatment region, the surface treatment disc having a surface treatment element for making frictional contact with the bowling ball, a temporary support disc for temporarily supporting the bowling ball in the temporary waiting region when the bowling ball is moved out of the surface treatment region, and a disc drive unit for rotatingly driving the surface treatment disc and the temporary support disc.

Abstract: A blade sharpening system is provided that includes a sharpening assembly including a sharpener configured to engage a generally circular agricultural implement blade while mounted on the agricultural implement. The blade sharpening system also includes a rail configured to support the sharpening assembly and to facilitate movement of the sharpening assembly along the rail. The blade sharpening system further includes a mounting feature coupled to the rail and configured to engage a structural member of the agricultural implement to support the rail and sharpening assembly.

Abstract: A bowling ball surface treatment apparatus is designed to uniformly abrade and polish a bowling ball. The apparatus includes a housing and a ball movement guider provided inside the housing for guiding movement of a bowling ball and confining the bowling ball within a limited surface treatment area, and a surface treatment disc arranged below the ball movement guider for supporting, rotating and revolving the bowling ball. The surface treatment disc has a disc shaft and a surface treatment element for abrading or polishing the bowling ball. The apparatus further includes a disc rotating device for rotating the surface treatment disc about a disc center axis and a disc revolving device for rotatably holding the disc shaft of the surface treatment disc and for causing the surface treatment disc to make revolving movement around a sun axis offset from the disc center axis.

Abstract: A multilayer chemical mechanical polishing pad is provided, having a polishing layer with a polishing surface, a polishing layer interfacial region parallel to the polishing surface and an outer perimeter; a porous subpad layer with a bottom surface, a porous subpad layer interfacial region parallel to the bottom surface and an outer perimeter; a pressure sensitive adhesive layer; and, a light transmissive window element; wherein the polishing layer interfacial region and the porous subpad layer interfacial region form a coextensive region; wherein the coextensive region secures the polishing layer to the porous subpad layer without the use of a laminating adhesive; wherein the pressure sensitive adhesive layer is applied to the bottom surface of the porous subpad layer; wherein an internal opening extends through the multilayer chemical mechanical polishing pad from the bottom surface to the polishing surface and is bounded by an internal peripheral edge of the porous subpad layer.

Abstract: A tool for polishing and fine-grinding optically active surfaces in precision optics has a main body which can be attached in a rotationally fixed manner to a tool spindle of a machining machine. A guide element is arranged concentrically in the main body and is mounted such that it can be displaced axially therein. A machining disk is replaceably attached to the outer end of the guide element. The main body is rigidly connected in a rotationally fixed manner, over the full displacement travel, to the guide element mounted such that it can be displaced axially therein, and in that the machining disk is rigidly fixed in a non-tiltable manner on the guide element.

Abstract: To provide a high-rigidity flat grinding device, a substrate flat grinding device has three fastening plate lifting-and-lowering mechanisms that have kinematic couplings and a cylinder rod that move the fastening plate upward or downward. Being a high-rigidity grinding device in which the load of the fastening plate 6 also is a load on the grindstone 14 that does the grinding, there is little deflection in the thickness distribution of the substrates that are obtained, even if they are semiconductor substrates having a large substrate diameter of 450 mm.

Abstract: A saw blade sharpening assembly includes a sharpening disk, a blade support panel disposed generally adjacent to the sharpening disk and a generally sloped blade support base carried by the blade support panel.

Abstract: In the present invention, an insulating material is applied onto a substrate in a coating treatment unit to form a coating insulating film. The substrate is heated in the heating processing unit, whereby the coating insulating film is hardened partway. A brush is then pressed against the front surface of the coating insulating film in a planarization unit and moved along the front surface of the coating insulating film, thereby planarizing the coating insulating film. The substrate is then heated to completely harden the coating insulating film. According to the present invention, the coating film can be planarized without using the CMP technology.

Abstract: A method for polishing lens surfaces, in which a) prior to the polishing process, for the purpose of determining an abrasion profile, at least one point of a workpiece is polished by means of a polishing tool to be used, using at least one pre-defined parameter; b) the polishing abrasion thus achieved on the workpiece side is determined by measuring; c) on the basis of the abrasion profile, at least one parameter is set for a subsequent polishing process, and the polishing process is completed at least partially. A method for polishing lens surfaces, in which the polishing point is places at least outside of the workpiece centre at a distance a from a plane which is tensioned by the tool spindle axis and the workpiece spindle axis.

Abstract: Apparatus comprising a tool (2) for forming an aspherical surface on a material (14), and a support for supporting the material (12) for rotation about an axis, the arrangement being such that the tool (2) is restricted to movement with respect to the material (14) in two substantially linear axes transverse to each other. The apparatus may be a high-performance machine comprising a measuring arrangement (18) mounted so as to extend substantially across the surface of the material (14) and serving to measure the distance between the tool (2) and a referencing region (32) of the measuring arrangement (18) which can be in the form of a symmetrical metrology device (18), the metrology device being structurally unloaded. The apparatus is substantially symmetrical in two substantially vertical planes substantially perpendicular to and intersecting each other.

Abstract: A tool for polishing and fine-grinding optically active surfaces in precision optics has a main body which can be attached in a rotationally fixed manner to a tool spindle of a machining machine. A guide element is arranged concentrically in the main body and is mounted such that it can be displaced axially therein. A machining disk is replaceably attached to the outer end of the guide element. The main body is rigidly connected in a rotationally fixed manner, over the full displacement travel, to the guide element mounted such that it can be displaced axially therein, and in that the machining disk is rigidly fixed in a non-tiltable manner on the guide element.

Abstract: A process and an apparatus for optimising tyres after vulcanization, in order to improve the dynamic behavior of the tyre itself. The process includes first of all the stages of measuring the curve of the radial force of the tyre, calculating the first harmonic of this radial force and identifying on the tyre a point corresponding to the maximum of the first harmonic. Subsequently, material is removed from the tread over an arc subtending a principal angle positioned either side of the maximum point of the first harmonic. The removal stage is performed by removing discrete circumferential portions of the arc with differentiated depths of removal, increasing from opposite ends of this arc toward the maximum point of the first harmonic.

Abstract: A lapping or polishing machine includes a material having a first finishing surface to process a surface of a work item, a measuring tool to measure a contour of the first finishing surface, and a conditioning tool having a second finishing surface to process the first finishing surface to reduce a difference between the measured contour and a desired contour of the first finishing surface.

Abstract: A bowling ball surface treatment machine includes a housing and a ball movement guider provided inside the housing for guiding movement of a bowling ball, the ball movement guider having a guider center axis and an inner circumferential surface. A surface treatment disc with a surface treatment is arranged below the ball movement guider for supporting and rotating the bowling ball. The surface treatment disc has a disc center axis deviating from the guider center axis. The machine further includes a disc driving motor for rotating the surface treatment disc about the disc center axis and a controller for allowing the disc driving motor to repeatedly accelerate the surface treatment disc to a target rotation speed, rotate the surface treatment disc in a surface treatment position at the target rotation speed for a predetermined running time and then decelerate the surface treatment disc toward a zero speed.

Abstract: The invention relates to a device (10) for truing a machining wheel (20), in particular grinding or eroding wheel, by means of a rotating truing tool (30), comprising: a first rotating spindle (18), which can be driven so as to rotate about a first axis of rotation (22), for attaching the machining wheel (20) and a second rotating spindle (28), which can be driven so as to rotate about a second axis of rotation (32), for attaching the truing tool (30), wherein, in order to true the machining wheel (20), the truing tool (30) rotatably driven by the second rotating spindle (28) can be brought into material-removing contact with the machining wheel (20) rotatably driven by the first rotating spindle (18). In this respect, in order to obtain uniform truing results, the first axis of rotation (22) is directed substantially orthogonally to the second axis of rotation (32) during the entire truing process.

Abstract: A grinding apparatus and a grinding system capable of efficient and superior grinding performance prevent the falling of a belt during the grinding of an edge surface thereof. The apparatus includes two rotating bodies 31 and 32 each having segment brushes 4, 4, . . . attached in the circumferential direction at the edge thereof. The rotating bodies 31 and 32 are rotated in the same direction. The tip of the segment brushes 4, 4, . . . is opposed to one edge surface of a belt b stretched between a driving roller 21 and a driven roller 22. The segment brushes 4 of the two rotating bodies enter toward the belt b at appropriate locations on the one edge surface, such that the falling of the belt can be prevented. A grinding apparatus 1 includes a grinder 3 consisting of the rotating bodies 31 and 32, and a holder consisting of the rollers 21 and 22 and a casing 23 by which the rollers are rotatably supported.

Abstract: A grinding machine enabling the easy maintenance and inspections of mechanisms arranged therein, an increase in visibility when the states of a workpiece and a grinding wheel are confirmed, and the easy loading/unloading of the workpiece and the easy replacement of the grinding wheel. The grinding machine comprises a workpiece supporting/driving device, a wheel work head, a wheel head feeder, a coolant supply unit, a cover covering internal devices such as the workpiece supporting/driving device, the wheel work head, the wheel head feeder, and the coolant supply unit, and an open/close door formed at a part of the working space side upper surface of the cover and allowing at least the loading/unloading of the workpiece and the replacement of the grinding wheel.

Abstract: Apparatus and methods for conditioning a polishing pad are provided. An apparatus includes a base, an arm adapted to support a conditioning disk; and a drive mechanism coupled between the arm and the conditioning disk, wherein the drive mechanism is adapted to directly rotate the conditioning disk relative to the arm. Numerous other aspects are disclosed.

Abstract: A polishing machine for optical elements, comprising:—a spindle arranged to rotationally drive an optical element;—a polishing tool mobile relative to the spindle; wherein the polishing machine further comprises a platform mounted on top of a work chamber, the work chamber comprising the spindle, and the platform holding a body on which is mounted the polishing tool.

Abstract: Damage of a surface plate used in a CMP apparatus due to troubles generated in repair or replacement of the surface plate, operation of the CMP apparatus, etc. is prevented. In order to solve the problem, the present invention provides a surface plate protecting device in the CMP apparatus, which is a surface plate 2 used in the CMP apparatus, wherein a polishing pad 16 is replaceably bonded with the upper surface of a sheet 8, and the lower surface of the sheet 8 is bonded with the upper surface of the surface plate 2 by an adhesive agent 9 having adhesive force larger than the adhesive force of the polishing pad 16, so that damage or the like of the surface of the surface plate 2 generated due to troubles, etc. in polishing of a wafer can be blocked by the sheet 8.

Abstract: The present invention relates to an apparatus and method for polishing semiconductor substrates with improved throughput and reduced foot print. One embodiment of the present invention provides an apparatus for polishing a substrate. The apparatus comprises a base, four polishing stations disposed on the base, two load cups disposed on the base, a first wash station disposed on the base adjacent to the first of the four polishing station, and a carousel rotatable about a carousel axis and supported by the base, wherein the carousel comprises six substrate heads alignable to any of the four polishing stations, the two load cups and the first wash station.

Abstract: The present invention relates to semiconductor integrated circuit technology and discloses an electrochemical mechanical processing system for uniformly distributing an applied force to a workpiece surface. The system includes a workpiece carrier for positioning or holding the workpiece surface and a workpiece-surface-influencing-device (WSID). The WSID is used to uniformly distribute the applied force to the workpiece surface and includes various layers that are used to process and apply a uniform and global force to the workpiece surface.

Abstract: A method of processing an antifriction bearing unit for a wheel, the antifriction bearing unit including an outer race, an inner race, a plurality of rolling elements and a flange portion for directly or indirectly mounting a brake disk provided to one of the outer and inner races, the method includes: assembling the outer and inner races and the rolling element together; after assembling, placing the one of the outer and inner race in position incapably of circumferential rotation; grinding the flange portion by bring the flange portion into contact with a grindstone which is rotated while the other of the outer and inner race is left free.

Abstract: The invention refers to a polishing tool for optical lenses with at least one polishing pad adaptable at least partially to the shape of a lens surface of said lenses and drivable by means of a drive shaft, said polishing pad having a membrane, wherein said polishing pad can transmit a bearing force of said membrane at least in an orthogonal direction relative to a lens surface. Moreover, the polishing tool comprises a reinforcing member connectable to said membrane, said reinforcing member being dimensionally stable in a parallel direction relative to a surface of said membrane and being flexible and/or pliable in an orthogonal direction relative to the surface of said membrane, wherein at least one pressure pad with a pressure membrane is arranged within said polishing pad, wherein said pressure membrane can be made to bear and/or can be prestressed against said membrane or said reinforcing member in an indirect or in a direct manner.

Abstract: The present invention relates to an apparatus and method for polishing semiconductor substrates with improved throughput and reduced foot print. One embodiment of the present invention provides an apparatus for polishing a substrate. The apparatus comprises a base, four polishing stations disposed on the base, two load cups disposed on the base and a carousel supported by the base. The carousel comprises six substrate heads and is rotatable about a carousel axis. Each of the six substrate heads is configured to align with any one of the four polishing stations and the two load cups.

Abstract: There is provided an apparatus for polishing a substrate, including (a) a polishing pad formed with a plurality of through-holes through which polishing material is supplied to a surface of the polishing pad, (b) a level block on which the polishing pad is mounted, and (c) a rotatable carrier for supporting a substrate thereon, the carrier being positioned in facing relation with the level block, the level block being rotatable around a rotation axis thereof with the rotation axis being moved along an arcuate path, and causing the polishing pad to make contact with the substrate for polishing the substrate, the polishing pad having a first ring-shaped region concentric thereto where no through-holes are formed. For instance, the first ring-shaped region has a width greater than 10%, but smaller than 95% of a radius of the polishing pad. The apparatus enhances uniformity in polishing a substrate.