Abstract: A cover for a swing member of a substrate processing apparatus includes an upper surface including a first groove, and a first side edge and a second side edge located respectively at both ends of the upper surface in the short-length direction of the cover, where a bottom portion of the first groove is located lower than the first side edge and the second side edge.

Abstract: Embodiments of the invention include apparatuses and systems for determining the position of a carrier ring assembly supported by an end effector. In an embodiment, the position of the carrier ring assembly is determined by passing the carrier ring assembly through a plurality of through beam sensors. As the carrier ring passes through the sensors, a plurality of sensor transitions along points on the carrier ring assembly are detected. Each sensor transition indicates that one of the through beam sensors changed from an unblocked state to a blocked state, or changed from an blocked state to an unblocked state. The position of the end effector is recorded at each sensor transition and is associated with the sensor transition that caused the end effector position to be recorded. A position of the carrier ring assembly is then calculated from the plurality of sensor transitions and their associated end effector positions.

Abstract: A parts carrier assembly for a grinding machine includes an annular parts carrier and a bearing insert. The annular parts carrier includes an upper surface, a lower surface, an inner edge, an outer edge, and a plurality of loading apertures. The inner edge is configured to engage a driving wheel of the grinding machine. The driving wheel rotates about a central axis resulting in rotation of the parts carrier about an offset axis, which is offset from the central axis. The loading apertures are configured to receive parts to be ground by the grinding machine. The bearing insert includes an inner bearing surface complementary in shape to the outer edge of the parts carrier. The outer surface the parts carrier bears against the inner bearing surface of the bearing insert as the parts carrier rotates about the offset axis.

Abstract: A polishing apparatus used in chemical mechanical polishing device is provided. The polishing apparatus includes a polishing plate for holding a wafer to be polished; a polishing pad arm, one end of the polishing pad arm being fixed, another end of the polishing pad arm holding a polishing pad, and the polishing pad arm driving the polishing pad for moving relatively to the wafer; the polishing pad moving relatively to the wafer with drive from the polishing pad arm, and the polishing pad arm ensuring the polishing pad contacting the wafer during movement; and a slurry supply route for supplying polishing slurry between the polishing pad and the wafer during polishing. The present invention also provides a chemical mechanical polishing device. It makes for realizing miniaturization of a chemical mechanical polishing device, saving polishing slurry and improving utilization rate of the polishing pad in the chemical mechanical polishing device to apply the present invention.

Abstract: A grinding wheel dressing assembly includes a driving gear rotatable about a central axis and a dressing ring engaged with the driving gear. Rotation of the driving gear about the central axis results in rotation of the dressing ring about an offset axis, which is offset from the central axis. The dressing ring includes a contact surface generally normal to the offset axis and adapted to remove dull CBN particles from a substantially planar grinding surface of a grinding wheel that comes into contact with the contact surface.

Abstract: There is provided a grinding apparatus including: an upper surface plate; a lower surface plate disposed facing the upper surface plate and rotating in an opposite direction to the upper surface plate; a sun gear rotated by a same rotational shaft as the upper surface plate and the lower surface plate; an internal gear rotated by the same rotational shaft as the upper surface plate and the lower surface plate; and a planetary carrier in which a holding hole that holds a workpiece is formed and which revolves while rotating in engagement with the sun gear and the internal gear. The holding hole in the planetary carrier is provided with a cutaway in a side of the holding hole that contacts a side surface of the workpiece when the planetary carrier rotates.

Abstract: A wafer polishing carrier apparatus and a chemical mechanical polishing equipment employing the same includes a drive rotary union rotating on an axis and receiving a flow of fluid through a first conduit in a sealed-up state; driven rotary unions revolving on their own axis at different sides of the drive rotary union, and receiving the flow of fluid from the drive rotary union through a second conduit in a sealed-up state; a carrier attached to an end part of the driven rotary union to adsorb/detach a wafer using a fluid pressure provided through a third conduit connected through the second conduit; and a filter filtering pollution material in the fluid flowing in and out of the third conduit on the periphery of the carrier to prevent the pollution material from escaping external to the carrier, the pollution material generated from rotation of the drive rotary union and driven rotary unions.

Abstract: A glass mold polishing structure and method. The method includes providing a polishing tool comprising mounting plate, a chuck plate over and mechanically attached to the mounting plate, and a pad structure over and mechanically attached to the chuck plate. A retaining structure is attached the chuck plate. A glass mold comprising a plurality of cavities is placed on the pad structure and within a perimeter formed by the retaining structure. A vacuum device is attached to the chuck plate. The vacuum device is activated such that a vacuum is formed and mechanically attaches the glass mold to the pad structure. The polishing tool comprising the glass mold mechanically attached to the pad structure is placed over and in contact with the polishing pad. The polishing tool comprising the glass mold is rotated. The glass mold is polished as a result of the rotation.

Abstract: Combinatorial processing including rotation and movement within a region is described, including defining multiple regions of at least one substrate, processing the multiple regions of the at least one substrate in a combinatorial manner, rotating a head in one of the multiple regions to perform the processing, and repositioning the head relative to the one of the multiple regions while rotating the head during the processing.

Abstract: Provided is a polishing apparatus comprising a lower stool (12), a motor (18a) and a speed reducer (19a) for driving the lower stool, and a box (17) for covering at least the portion of the lower stool below the working action face. The polishing apparatus polishes a wafer by forcing the wafer to contact the lower stool and by rotating the lower stool. The box has its inside separated by partitions (31a and 31b) into a plurality of regions, and the motor for driving the lower stool is arranged in a region other than the region containing the lower stool. The polishing apparatus can manufacture a wafer of a stable shape, irrespective of the time elapsed from the running start and the presence/absence of the stop of the polishing apparatus.

Abstract: The present invention intends to provide an optical disk restoration apparatus that is simple structured and small sized to reduce the production cost, and that can evenly apply a substantially uniform pressing force. This object can be achieved by an optical disk restoration apparatus, including a turntable 41 on which an optical disk 10 is set via a non-slip sheet 45, a polishing body holder 47 for holding a polishing body 46, a pressing mechanism for pressing the polishing body 46 and the optical disk 10 onto each other with a predetermined pressure required for the polishing process, and a motor 48 for rotating at least the polishing holder 47 and the polishing body 46 to polish the surface of the optical disk 10, where the surface of the turntable 41 and/or the sheet 45 is provided with at least one of an inclined, step-like or curved profile.

Abstract: Combinatorial processing including rotation and movement within a region is described, including defining multiple regions of at least one substrate, processing the multiple regions of the at least one substrate in a combinatorial manner, rotating a head in one of the multiple regions to perform the processing, and repositioning the head relative to the one of the multiple regions while rotating the head during the processing.

Abstract: The present invention discloses a workshop unit for use as a grinding center that includes a support frame having a drive motor and a multi-station tool mounted thereto. Particularly, the grinding center may be used for operations including but not limited to grinding, buffing, polishing, sanding, and cleaning. The multi-station tool includes a plurality of rotary tools, a power transfer system, and a rotary tool selecting system. The power transfer system operates through a plurality of pulleys each in communication with at least one rotary tool and the drive motor through a plurality of transmission links. The rotary tool selecting system, which includes one or more control shafts and a clutch system, allows each tool to be selectively and independently operated.

Abstract: An upper polishing plate is moved downward until facing a lower polishing plate to polish a work piece. The upper polishing plate is rotated in a horizontal plane together with a first elastic member, a second elastic member, an outer member and a connecting member. A pressure difference between a first pressing force pressing the outer member or an inner member upward and a second pressing force pressing the outer member or the inner member downward, which is produced in a first closed space by supplying a compressed fluid into and discharging the same from the first closed space, is adjusted, so that a third pressing force of the upper polishing plate, which presses a work piece, can be adjusted.

Abstract: The small polishing apparatus is capable of simultaneously polishing both side faces of a work piece, and a lower polishing plate, an internal gear and a sun gear are respectively driven by direct drive (DD) motors. The polishing apparatus comprises: an upper and a lower polishing plates; a sun gear and an internal gear; and a carrier provided between the polishing plates and engaged with the gears. Both side faces of the work piece held by the carrier are simultaneously polished by the polishing plates. DD motors respectively rotate the lower polishing plate and the gears. Each DD motor has a ring-shaped output member. A first DD motor has the output member directly connected to a rotary holding member rotatably holding the lower polishing plate. A second DD motor is provided under the first DD motor.

Abstract: Described is an apparatus for the processing of substantially planar workpieces, which can be moved in a transport plane relatively to the apparatus. The apparatus contains at least one grinding head with a tool carrier rotatable around a carrier axis which is orthogonal with respect to the conveyor plane and with several grinding brushes containing a brush body and bristles attached thereto being mounted to the tool carrier so that they can be rotated individually around individual brush axes, the ends of the bristles of the very same grinding brush being arranged at various distances to the transport plane.

Abstract: Embodiments of methods and apparatus in accordance with the present invention provide a chemical mechanical planarization (CMP) process that provides single or multiple polishing pads to have a different rotational velocity, applied pressure and oscillation frequency on the surface of the substrate to address and compensate for the WIW (with-in-substrate) and WID (with-in-die) non-uniformities in planarization ability. The velocity of each polishing pad is adjustable providing a closer match to the substrate surface velocity over a particular zone to yield a linear velocity on the surface of the substrate.

Abstract: A device for polishing digital storage discs including a polishing plate rotatably driven about a vertical axis, the upper side of which has a polishing cloth, wherein the polishing cloth is interrupted by a ring-shaped recess concentric with the axis of the polishing plate, at least one circular load-applying plate from the planar lower side of which a projection centrally protrudes to appropriately engage the central hole of the storage disk, a roller holder which has at least one idling roller and one driven roller against which the circumference of said load-applying plate gets into engagement when said plate is carried along while lying on said polishing plate, a drive for said driven roller, and mechanism for feeding a polishing medium to said polishing cloth.

Abstract: A polishing apparatus includes a polishing pad rotated by a surface plate rotating shaft about a surface plate axis, a slurry conduit supplying slurry to an upper surface of the polishing pad, a substrate holding mechanism holding a substrate, a substrate rotating shaft rotating the substrate holding mechanism about a substrate axis, and a rotating mechanism rotating the substrate axis or the surface plate axis about an eccentric axis. The angular velocity of rotation about the eccentric axis is set larger than the angular velocity of rotation about the substrate axis or the surface plate axis. Thus, the effective contact area between a small area on the substrate and the polishing pad is increased, biased wear of abrasive grains on the polishing pad is prevented, clogging of the polishing pad is suppressed, and new abrasive grains and new chemicals can be supplied with high efficiency to each area of the substrate. Thus, the polishing rate is improved.

Abstract: The frame of a polishing machine has a disc-shaped polishing table mounted thereon for rotation coaxially about a vertical axis, the table having thereon an upper, generally planar polishing surface for removably supporting thereon a plurality of annular workpiece carriers for rotation therewith and for rotation about their repsective axes relative to the table. The outer peripheral surface of each carrier is disposed to be engaged at angularly spaced points thereabout by a pair of rollers mounted on the frame for rotation about spaced, vertical axes. The output of a single AC electric motor is connected to the table to effect rotation thereof about its vertical axis, and to one roller of each pair thereof to drive the one roller about its axis. The one roller of each such pair thereof is in driving, rolling engagement with the carrier engaged thereby, while the other roller of such pair is rotated by the engaged carrier.

Abstract: A supporting device for a plurality of adapter chucks for the precision grinding or polishing of optical components comprises a spindle shaft having a central bore for supplying one of a gas and a vacuum, at least one arm adjustably supported by a head of the spindle shaft and having a seating for an adapter chuck, and a flexible vacuum/gas line provided between the seating and the spindle shaft. The arm is adjustable as to its angle of inclination relative to an axis of the spindle shaft.

Abstract: A chemical mechanical polishing (CMP) system is provided. A carrier has a top surface and a bottom region. The top surface of the carrier is designed to hold and rotate a wafer having a one or more formed layers to be prepared. A preparation head is also included and is designed to be applied to at least a portion of the wafer that is less than an entire portion of the surface of the wafer. Preferably, the preparation head and the carrier are configured to rotate in opposite directions. In addition, the preparation head is further configured to oscillate while linearly moving from one of the direction of a center of the wafer to an edge of the wafer and from the edge of the wafer to the center of the wafer so as to facilitate precision controlled removal of material from the formed layers of the wafer.

Abstract: The inner circumferential surface of through holes in a metal plate is chamfered or put to anchor fabrication and a thermoplastic resin is injection molding to the inner circumferential surface of the through hole thereby forming a resin portion over the entire surface of the through hole and the resin portion is removed by grinding while leaving the peripheral portion of the resin portion thereby forming a polished work holding hole. Thus, when a resin portion is formed to the inner circumference of the holding hole in a polished work holder comprising a metal plate, the production is high and the cost is reduced, and the resin portion is not detached from the bonding portion with no use of the adhesive.

Abstract: Specific embodiments of the present invention provide a chemical-mechanical planarization apparatus for planarizing an object comprising a shaft having a shaft axis and being connected with a polishing head which is coupled to a polishing pad. The polishing pad has a smaller diameter than the object to be planarized. The shaft is rotatable to spin the polishing head and polishing pad around the shaft axis. An orbit housing has, spaced from an orbital axis, an eccentric hole through which the shaft is rotatably disposed. The orbit housing is rotatable to orbit the shaft, the polishing head, and the polishing pad around the orbital axis. In some embodiments, the object is rotated at an object rotational speed and the polishing pad is rotated around the orbital axis at an orbiting speed. A ratio of the greater of the object rotational speed and the orbiting speed to the lesser of the object rotational speed and the orbiting speed is a non-integer.

Abstract: A method and apparatus for improving uniformity of the rate of removal of material from the surface of a semiconductor substrate by chemical mechanical polishing. In accordance with the invention, the semiconductor substrate is subjected to a combination of polishing motions, including orbital motion, and at least one additional polishing motion selected from rotational, oscillating, sweeping, and linear polishing motions. The invention also provides an improved method for conditioning polishing pads to provide more uniform conditioning and to extend their useful life span.

Abstract: The inner circumferential surface of through holes in a metal plate is chamfered or put to anchor fabrication and a thermoplastic resin is injection molding to the inner circumferential surface of the through hole thereby forming a resin portion over the entire surface of the through hole and the resin portion is removed by grinding while leaving the peripheral portion of the resin portion thereby forming a polished work holding hole. Thus, when a resin portion is formed to the inner circumference of the holding hole in a polished work holder comprising a metal plate, the production is high and the cost is reduced, and the resin portion is not detached from the bonding portion with no use of the adhesive.

Abstract: An abrasive machine includes a rotatably driven tool, chucking equipment for holding the work pieces and a feeding device for effecting relative displacement between the work piece and the rotatably driven tool. The machine further includes a tubular cylindrical housing, a shaft provided with a recess, a rotatable outer casing peripherally enclosing the housing, and a lid member connected to the casing and extending radially over a first end of the tubular cylindrical housing such that an inner surface of the lid members faces the first end of the housing. The rotatably driven tool includes abrasive material carried on the inner surface of the lid member. The shaft is arranged such that when the shaft executes an angular displacement, the work piece held by the chucking equipment is caused to approach and contact the abrasive material.

Abstract: An apparatus for providing a flat to stepped convex facing for grinding wheels used for the finished machining of parts, the apparatus including dressing wheels located only at the outer diameter of the Cubic-Boron-Nitride wheels to be dressed.

Abstract: A non-circular workpiece carrier, which includes a wheel-like carrier body, and at least one carriage, wherein the wheel-like carrier body has a transmission unit disposed around the periphery thereof, which receives a transmission power for causing the wheel-like carrier body to turn round, and at least one carrier unit; the at least one carriage is respectively disposed in the at least one carrier unit to hold non-circular workpiece, and forced to gyrate in the at least one carrier unit relative to the wheel-like carrier body, enabling loaded non-circular workpiece to be surface-processed (ground, polished, etc.) more evenly. Different carriages are alternatively used with the carrier body subject to the shapes of workpiece to be processed.

Abstract: Surface polishing system adapted to polish, lap or grind a surface of a workpiece in a plane such that the workpiece is held in sliding contact with a polishing face of a rotating polishing plate, wherein the workpiece is rotated by a work rotating device about an autorotation axis thereof which is parallel to an axis of rotation of the polishing plate and which lies within the surface of the workpiece, and the autorotation axis of the workpiece is revolved by a work revolving device about a revolving axis which is parallel to the axis of rotation of the polishing plate and which lies within a circumscribed circle of the surface of the workpiece.

Abstract: A chemical mechanical polishing apparatus includes a rotatable carousel and multiple carrier head assemblies coupled to the carousel. Each carrier head assembly includes multiple carrier heads each of which can hold a single substrate. The apparatus includes multiple substrate processing stations separated from one another in substantially equal angular intervals. The carrier head assemblies can be positioned in angular alignment with the stations and can be rotated from one station to another station. At least one polishing station includes a fixed abrasive sheet and a fluid bearing surface that provides an upward pressure against the lower surface of the polishing sheet. The carrier head assembly is positioned so that the substrates are in angular alignment with the fluid bearing disposed below the polishing sheet, and the substrates are brought into contact with the polishing sheet.

Abstract: A planetry-gear-type parallel-surface processing machine of the present invention improves the ability of an upper surface plate to follow matrials to be processed. A rotation preventing pin projects from the upper surface of the upper surface plate at a position near the outer periphery thereof, the rotation of the upper surface plate is prevented by abutting a stopper supported by a bracket disposed on a machine main body against a side of the rotation preventing pin, plural pulleys are disposed in a ring mounted to the upper surface plate and suspension plate, and an endless wire cable is stretched between the pulleys so as to support the vertical load of the upper surface plate.

Abstract: A work W is rotated on a lower grinding wheel 13 provided on a work support base 11. Both surfaces of the work W are simultaneously subjected to grinding process by an upper grinding wheel 24 provided on a grinding shaft 22 of a grinding head 21 and the lower grinding wheel 13. The work W is applied with a pressure force of a primary load through the grinding shaft 22 by a piston rod 36 of a primary pneumatic cylinder 35 which is operated by a first air pressure. The work W is also applied with a pressure force of a secondary load through a lever member 43 by a piston rod 46 of the secondary pneumatic cylinder 45 which is operated by a second air pressure higher than the first air pressure. By adjusting the second air pressure, the pressure force is controlled.

Abstract: A method of machining flat parts, includes the use of two permanent magnets which are located opposite to and spaced from one another so as to form a magnetic field with a magnetic flux extending perpendicular to the magnets, placing a flat part in the magnetic field between the magnets so that the magnetic flux extends through the flat part, supplying a magnetic-abrasive powder to the flat part in the magnetic field, and performing a relative movement between at least one of the magnets and the flat part so as to remove a material from a surface of the flat part.

Abstract: A memory disk having a central opening and planar sides for receiving magnetic media on both of the sides is bounded by a cylindrical outside diameter peripheral edge and chamfered edges extending between each of the planar sides. The peripheral edge is clamped by a disk processing chuck including a disk retainer mount having a central disk support for mounting a circular disk edge bounding the central opening and a mount cylindrical beveled edge receiving an outside diameter chamfered edge of the disk. A ring in the retainer mount includes a multiplicity of spaced radial fingers extending cylindrically around the ring, each finger having a distal end extending to a first position outboard of the disk peripheral edge. The distal ends are moveable inwardly to a second position by an inflatable bladder acting simultaneously against all the fingers, placing the distal end tips into clamping contact with the disk peripheral edge mounted on the retainer mount.

Abstract: An automatic workpiece transport apparatus for a double-side polishing machine is disclosed. A carrier is positioned at a predetermined position by a positioning unit, and an image of the top surface of the carrier is captured by use of a visual sensor. A computer performs image processing to obtain the center coordinates of the wafers or the workpiece holders while reference marks or the like provided on the carrier are used as references. The transport robot is moved and controlled based on the thus-detected coordinate data in order to load the wafers into the workpiece holders or to unload the wafers from the workpiece holders. Further, two visual sensors are provided at the tip end of the arm of the transport robot. These visual sensors send to the computer an image of the peripheral portion of the held wafer. Thus, the computer performs fine adjustment in positioning the wafer and the workpiece.

Abstract: A wafer polishing apparatus includes one or more wafer carriers each containing one or more wafers mounted on both sides of the carrier. Upper and lower turntables having upper and lower polishing surfaces, rotate to polish the wafers attached to the carriers. Hence, wafers on the top of the carriers, and wafers on the bottom of the carriers are polished simultaneously. This configuration increases throughput; also, thermal deformations in the wafers are reduced, thus improving flatness.

Abstract: A wafer is rotated on its axis, which is biased with regard to an axis of a grinding wheel, and revolves around an axis which is biased with regard to the axis of the wafer and the axis of the grinding wheel. In this state, the grinding wheel is abutted against the surface of the wafer. Thus, all abrasive grains on the grinding wheel can act on the whole surface of the wafer.

Abstract: The present invention relates generally to a device used to process workpieces. In particular, the invention relates to a carrier that is used to support a workpiece during workpiece honing, grinding, or polishing. The carrier includes a rigid core coated with a fiber-free, scratch-resistant material to prevent scratching of workpieces disposed in the carrier. An adhesive layer is typically used to attach the scratch-resistant layer to the rigid core. The adhesive film and the scratch-resistant films may be attached to the rigid core by hot pressing.

Abstract: A wafer is rotated on its axis, which is biased with regard to an axis of a grinding wheel, and revolves around an axis which is biased with regard to the axis of the wafer and the axis of the grinding wheel. In this state, the grinding wheel is abutted against the surface of the wafer. Thus, all abrasive grains on the grinding wheel can act on the whole surface of the wafer.

Abstract: An apparatus for polishing one or more planar substrates, such as magnetic disks, between rotating polishing plates is described. The apparatus is designed to optimize uniformity and flatness of the substrates by maintaining a substantially constant parallel and coaxial alignment between the rotating polishing plates.

Abstract: A sure-seal rolling pin assembly of a lapping and polishing machine for substantially eliminating friction between the sure-seal rolling pin assembly and a work carrier and for substantially reducing particle contamination between the sure-seal rolling pin assembly and the work carrier. The lapping and polishing machine has a plurality of gears operatively connected to one another by the work carrier and each gear has a counterbore which has a surface. The sure-seal rolling pin comprises a pin, a plurality of ball bearing units and a torsionally stretchable seal. The pin has a longitudinal axis, a head portion and a body portion connected to the head portion and the head portion has a diameter and an outer surface. The body portion has a lower surface located adjacent the outer surface and is removably inserted into the counterbore of one of the gears.

Abstract: A chemical mechanical polishing apparatus polishes the surface of a substrate to remove material therefrom, The apparatus includes a carrier, which positions the substrate against the rotating polishing pad. The carrier includes an integral loading member therein, which controls the load force of the substrate against the polishing pad. Multiple substrates may be simultaneously polished on a single rotating polishing pad, and the polishing pad may be rotationally oscillated to reduce the likelihood that any contaminants are transferred from one substrate to another along the polishing pad. A multi-lobed groove in the polishing pad may be used, in conjunction with a moving substrate, to polish the surface of the substrate.

Abstract: A disc streak pattern forming method and apparatus are provided which are capable of not only forming fine streak patterns on a disc in a single step, but also arbitrarily adjusting an angle of intersection of streak patterns in a precise manner to thereby reduce the cost of production facilities and the cost of manufacture as well as to improve the magnetic property and the finishing accuracy of the disc. The disc streak pattern forming apparatus is equipped with a drum 2, a pad rotating member 3, a first motor 5 and a second motor 6. Polishing pads 4 mounted on the pad rotating member 3 are placed in sliding contact with the disc in the form of a magnetic disc 200 with an information storage surface 201 thereof being disposed within a central bore 40 in each polishing pad 4.

Abstract: A wafer is rotated on its axis, which is biased with regard to an axis of a grinding wheel, and revolves around an axis which is biased with regard to the axis of the wafer and the axis of the grinding wheel. In this state, the grinding wheel is abutted against the surface of the wafer. Thus, all abrasive grains on the grinding wheel can act on the whole surface of the wafer.

Abstract: In accordance with the present invention, there is provided a machine for performing abrading operations. The preferred machine includes an upper lap plate and lower lap plate mounted for rotation about its own vertical axis. A carriage means supports the upper lap plate, and a frame means supports the carriage means at spaced locations in a manner permitting the carriage means to reciprocate vertically within the frame means relative to the lower lap plate for performing abrading operations and to provide access for loading and unloading the workpieces. The upper lap plate also may reciprocate vertically and independently of and relative to the carriage means for performing abrading operations and to provide access for loading and unloading the workpieces. Additionally, the abrading machine may be provided with a temperature control device having at least one tube disposed adjacent the lower lap plate for coolant fluid flow.

Abstract: The process involves optimizing the load conditions for the machined surfaces of the components, selecting and applying the optimum permissible specific force applied to the tool in the light of the relative thickness of the machined component, and using laser cutting to cut the edges of the components to size after the surface of the components has been machined. The process disclosed is carried out using a novel diamond-abrasive tool and novel devices for the devices concerned.According to one variant, the device comprises a surface plate (1) with a diamond-abrasive tool and a surface plate (2) arranged eccentrically on which are mounted holders (5) with recesses for the components (4). Each recess has a resilient lining (6). Force is applied by means of a clamping mechanism (7).

Abstract: This invention relates to a planetary grinding or polishing machine wherein the outer ring gear, the upper platen, and the lower platen are independently rotatable in the clockwise or counterclockwise directions at variable speeds. Such grinding or polishing is especially useful in high precision finishing of aluminum, nickel plated, and ceramic substrates where uniform and non-uniform surface finishes are required from surface-to-surface in the workpiece.

Abstract: A disc streak pattern forming method and apparatus are provided which are capable of not only forming fine streak patterns on a disc in a single step, but also arbitrarily adjusting an angle of intersection of streak patterns in a precise manner to thereby reduce the cost of production facilities and the cost of manufacture as well as to improve the magnetic property and the finishing accuracy of the disc. The disc streak pattern forming apparatus is equipped with a drum 2, a pad rotating member 3, a first motor 5 and a second motor 6. Polishing pads 4 mounted on the pad rotating member 3 are placed in sliding contact with the disc in the form of a magnetic disc 200 with an information storage surface 201 thereof being disposed within a central bore 40 in each polishing pad 4.

Abstract: A chemical mechanical polishing apparatus polishes the surface of a substrate to remove material therefrom. The apparatus includes a carrier, which positions the substrate against the rotating polishing pad. The carrier includes an integral loading member therein, which controls the load force of the substrate against the polishing pad. Multiple substrates may be simultaneously polished on a single rotating polishing pad, and the polishing pad may be rotationally oscillated to reduce the likelihood that any contaminants are transferred from one substrate to another along the polishing pad. A multi-lobed groove in the polishing pad may be used, in conjunction with a moving substrate, to polish the surface of the substrate.