Abstract: An end face polishing device for optical fiber ferrule for polishing an end face of an optical fiber ferrule by applying a polishing pressure between a polishing plate driven by a polishing drive shaft and an optical fiber ferrule held by a holding portion. The end face polishing device has: a bearing portion for allowing the polishing plate to rotate relatively around the polishing drive shaft and to move relatively to the polishing drive shaft in an axial direction; a polishing plate guide supporting portion for movably supporting the polishing plate on a base portion to apply the polishing pressure to the holding portion by allowing the polishing plate to move in the axial direction; a pressing drive source for outputting a driving force to apply the polishing pressure; and a pressing force transmission mechanism for transmitting the driving force output from the pressing drive source as a pressing force in the axial movement direction of the polishing plate.

Abstract: The present invention provides an end face polishing device capable of improving a polishing accuracy by polishing an end face of an optical fiber ferrule with adjusted polishing pressure. An end face polishing device 1 for optical fiber ferrule for polishing an end face of an optical fiber ferrule by applying a polishing pressure between a polishing plate 5 driven by a polishing drive shaft and an optical fiber ferrule held by a holding portion 9.

Abstract: Provided is an optical fiber ferrule polishing jig capable of fixing an optical fiber ferrule and releasing the optical fiber ferrule. An optical fiber ferrule polishing jig 10A has; a base 12a having insertion holes 20 into which optical fiber ferrules 51 can be detachably inserted; pivoting rods 13 which are adjacent to the insertion holes 20 of the base 12a and rotatable around lower end portions 36; fixing pieces 14a installed in installation recesses 19a formed in the base 12a to fix the optical fiber ferrules 51 with respect to the insertion holes 20 by being moved as the rods are pivoted; and a plurality of coil springs 15a installed in the installation recesses 19a to bias the fixing pieces 14a so as to release fixing of the optical fiber ferrules 51 with respect to the insertion holes 20.

Abstract: Disclosed is a method and apparatus for simultaneously polishing both surfaces of an optical substrate. An upper platen and a lower platen, each covered with a polishing pad material and at least one carrier having an aperture for holding the optical substrate between the platens are provided. The location of the aperture of the carrier is set such that the center of the optical substrate is offset from the center of the carrier and at least a portion of the outer perimeter of the optical substrate extends outwardly beyond at least a portion of at least one of the outer perimeter and the inner perimeter of the platens. The platens are rotated with respect to the carrier, and the carrier is rotated with respect to the platens to polish the optical substrate. The location of the aperture of the carrier is adjustable.

Abstract: A deburring machine for removing burrs from workpieces includes a framework, a deburring mechanism and a transport mechanism. The deburring mechanism mounted on the framework, includes deburring units positioned on the framework. The transport mechanism is positioned on the framework adjacent to the deburring units. The transport mechanism includes a base, multi-station rotating plate and a first driver. The base is positioned on the framework. The multi-station rotating plate is rotatably positioned on the base. The first driver is positioned on the framework and connects with the base. The first driver is capable of driving the multi-station rotating plate to transport the workpieces to the plurality of deburring units, the plurality of deburring units are capable of removing the burrs of the workpieces.

Abstract: A superfinishing system and method, wherein an abrasive is employed to process a workpiece, and wherein the system simultaneously mounts a plurality of workpieces in a diagonal turret, or mounts a plurality of different types of workpieces in a plurality of chucks for different operations thereon, or performs a plurality of different operations on the same workpiece without remounting. The system improves throughput by allowing flexibility in the operation and multitasking.

Abstract: It is possible to execute a one-step polishing or a plural-step polishing at a high throughput, and it is possible to achieve a reduction of an occupied area on the basis of a compact structure of a whole apparatus. Two platens are respectively provided with a first wafer retention head and a second wafer retention head, and a wafer transfer apparatus on which a wafer is mounted is arranged between two platens. The two wafer retention heads are moved between two platens and the wafer transfer apparatus respectively by a first moving means and a second moving means. Further, a two-step polishing is executed by whirl moving two wafer retention heads from one platen to the other platen at 180 degree respectively by a whirl moving means supporting two moving means.

Abstract: A belt sander is disclosed that may include a sanding assembly having a first roller and a second roller, the sanding assembly being configured to receive a sanding belt around the first roller and the second roller to define a sanding surface therebetweeen. The belt sander may include a motor operationally coupled to the sanding assembly and opposite the sanding surface, the motor being configured to rotate at least the first roller and thereby rotate the sanding belt around the first roller and the second roller, as well as a handgrip formed around at least a portion of the motor and substantially encasing the motor.

Abstract: A polishing fixture is provided for polishing the optic ends of a fiber optic cable terminated in a fiber optic connector. A holding plate has a receptacle for receiving the fiber optic connector, with at least a portion of each of a first side and a second side of the connector exposed. A clamping arm is disposed for linear movement relative to the holding plate and the received connector, as well as for pivotal movement relative to the holding plate and the received connector. The clamping arm has first and second clamping portions for engaging the first and second sides, respectively, of the connector. An actuator mechanism is operatively associated with the clamping arm for moving the clamping arm linearly to bring the first clamping portion of the arm into clamping engagement with the first side of the connector and then pivoting the clamping arm to bring the second clamping portion of the arm into clamping engagement with the second side of the connector.

Abstract: A supporting device for a plurality of adapter chucks for the precision grinding or polishing of optical components comprises a spindle shaft having a central bore for supplying one of a gas and a vacuum, at least one arm adjustably supported by a head of the spindle shaft and having a seating for an adapter chuck, and a flexible vacuum/gas line provided between the seating and the spindle shaft. The arm is adjustable as to its angle of inclination relative to an axis of the spindle shaft.

Abstract: An method and apparatus for forming wafers of varying thickness'. The apparatus includes a template. The template is formed of a main disk including a plurality of cavities extending into a first side thereof. Each cavity has notches cut in the walls thereof and a pattern etched in the base thereof. Holding disks are moistened and positioned within respective cavities for releasably securing a wafer in the cavity. A moistening liquid is dispensed and diffuses into the cavities via the notches cut in the walls and collects in the pattern etched on the base of the cavity thereby increasing the suctional force used to secure the holding disk. When the template is releasably secured within a cavity, rotatably connected to a rotating head and positioned such that the first side faces a lapping and polishing surface, wafers received by the cavities are lapped and polished upon rotation of the rotating head.

Abstract: There is disclosed a scrub cleaning device which can reduce cleaning time and which requires no large-scaled device for transferring a substrate to the next cleaning process.

Abstract: A method and apparatus for forming wafers of varying thickness'. The apparatus includes a template. The template is formed of a main disk including a plurality of cavities extending into a first side thereof and a backing plate positioned on a side of the main disk opposite the first side. Holding disks are moistened and positioned within respective cavities for releasably securing a wafer in the cavity. When the template is releasably secured to and rotatable with a rotating head and positioned such that the first side faces a lapping and polishing surface, wafers received by the cavities are lapped and polished upon rotation of the rotating head. A plurality of shims are selectively received within respective cavities between a base of the cavity and the holding disk for adjusting a depth of the cavity thereby adjusting an amount of a wafer to be lapped and polished. The shims have varying thickness' and are color coated, each color being representative of a predetermined thickness for the shim.

Abstract: An automatic polishing apparatus has an index table. A loading station, a primary polishing station, a secondary polishing station, and an unloading station are set along the circumference of an index table. The index table has a plurality of holders 2 each of which is for supporting a wafer. The index table is rotated so that rotational movement is given to each of the stations. The wafer is transferred to the loading station. The wafer is transferred from the loading station to the primary polishing station to be subjected to planarization process at the primary polishing station. The wafer is is subject to finish treatment at the secondary polishing station to be polished into a polished wafer which is transferred from the unloading station to an outside of the polishing apparatus.

Abstract: Three columns 10, 20, 30 are set up in an approximately triangle arrangement. A saddle 51, which fixes a main spindle 50 thereto, is held in contact with a side face of the column 10, 20 or 30 or a brace 40 which unitarily connects two or three of the columns 10, 20, 30. A plurality of chucking tables 4a, 4b are installed in an indexing table 2a. When a work piece 5b attracted onto one chucking table 4b is carried to a position below the main spindle 50, the other chucking table 4a is located at a loading-unloading position. Since the main spindle 50 is located at a geometrical gravity center of a triangle defined by the columns 10, 20, 30, a reaction force which is generated during machining is uniformly distributed to each of the columns 10, 20, 30. Consequently, the columns 10, 20, 30 are prevented from deformation which causes inclination of the main spindle 50, and the machined work piece has superior flatness.

Abstract: A chemical mechanical polishing apparatus includes a rotatable carousel and multiple carrier head assemblies coupled to the carousel. Each carrier head assembly includes multiple carrier heads each of which can hold a single substrate. The apparatus includes multiple substrate processing stations separated from one another in substantially equal angular intervals. The carrier head assemblies can be positioned in angular alignment with the stations and can be rotated from one station to another station. At least one polishing station includes a fixed abrasive sheet and a fluid bearing surface that provides an upward pressure against the lower surface of the polishing sheet. The carrier head assembly is positioned so that the substrates are in angular alignment with the fluid bearing disposed below the polishing sheet, and the substrates are brought into contact with the polishing sheet.

Abstract: The present invention is a high-speed planarizing machine with a platform that holds the upward facing wafer stationary during planarization, and a carrier positioned opposite the platform. The carrier rotates about an eccentric axis and translates in a plane that is substantially parallel to the wafer. A polishing pad is smaller in diameter than the wafer and is attached to the carrier and positioned opposite the wafer. The carrier rotates and translates the polishing pad across the wafer while the wafer is held stationary.

Abstract: An abrasive machining assembly (10) wherein a worktable (14) is rotatably supported on a frame (12) for rotation about a table axis (A) and a plurality of platens (32) are supported on the worktable (14) with each of the platens (32) being adapted for supporting a workpiece to be machined by a machining disc (38) rotating about a tool axis (B). Each platen (32) is rotatably supported for rotation about a platen axis (C) which is radially spaced from the table axis (A) a different distance than the tool axis (B) whereby each of the platens (32) rotates about a platen axis (C) which is parallel to and offset from the tool axis (B) when positioned in the workstation.

Abstract: An abrasive machining assembly (10) wherein a worktable (14) is rotatably supported on a frame (12) for rotation about a table axis (A) and a plurality of platens (32) are supported on the worktable (14) with each of the platens (32) being adapted for supporting a workpiece to be machined by a machining disc (38) rotating about a tool axis (B). Each platen (32) is rotatably supported for rotation about a platen axis (C) which is radially spaced from the table axis (A) a different distance than the tool axis (B) whereby each of the platens (32) rotates about a platen axis (C) which is parallel to and offset from the tool axis (B) when positioned in the workstation.

Abstract: A method and apparatus for polishing chamfers made along the periphery; of a semiconductor wafer designed such that when the wafer is once picked up by a rotatory suction cup of a transportation robot, arm, the wafer is not released from the suction cup until the entire polishing operation is completed; in an embodiment, a circular turn table having six wafer suction cups is employed which is adapted to turn step-wise, each step consisting of a turn through an angle of 60.degree. to transfer the wafers.

Abstract: An apparatus for grinding spherical surfaces of workpieces includes a grinding section having a grindstone rotating mechanism for rotating around an axis of a shaft thereof with a grindstone held at an end of the shaft, a feeding mechanism for feeding the grindstone rotating mechanism toward the workpiece in a direction along the shaft, and a fixing mechanism for holding the grindstone rotating mechanism and the feeding mechanism and determining an angle 1 inclination of the short of the grindstone rotating mechanism with respect to the workpiece. A plurality of workpiece holding mechanisms are provided for holding the workpieces at ends of shafts thereof, the workpiece held by at least one of the workpiece holding mechanisms being opposed to the grindstone. A workpiece rotating mechanism is provided for rotating the workpiece holding mechanism which holds the workpiece opposed to the grindstone.

Abstract: An apparatus for polishing spherical surfaces of workpieces includes a polishing device rotating on a shaft thereof while holding a polishing tool at an end of the shaft. A pivoting device pivots the polishing device around a polishing position of the tool. A plurality of workpiece holders each hold a workpiece at an end thereof so that one of the workpieces is opposed to the tool. Workpiece holder-holding devices hold the workpiece holders so as to be rotatably and vertically movably. A workpiece holder-pressing device presses at least one of the workpiece holders held by the workpiece holder-holding device against the tool. A rotary table rotates while holding the workpiece holders and the workpiece holder-holding devices, thus placing at least one of the workpiece holders at a workpiece replacing position when the other of the workpiece holders is placed at the polishing position of the polishing device.