Turret Patents (Class 451/292)
  • Patent number: 9427841
    Abstract: Disclosed is a method and apparatus for simultaneously polishing both surfaces of an optical substrate. An upper platen and a lower platen, each covered with a polishing pad material and at least one carrier having an aperture for holding the optical substrate between the platens are provided. The location of the aperture of the carrier is set such that the center of the optical substrate is offset from the center of the carrier and at least a portion of the outer perimeter of the optical substrate extends outwardly beyond at least a portion of at least one of the outer perimeter and the inner perimeter of the platens. The platens are rotated with respect to the carrier, and the carrier is rotated with respect to the platens to polish the optical substrate. The location of the aperture of the carrier is adjustable.
    Type: Grant
    Filed: March 17, 2014
    Date of Patent: August 30, 2016
    Assignee: II-VI Incorporated
    Inventors: Samuel J. Goldstein, Stephen M. Miller, III, John M. O'Donnell
  • Patent number: 8979614
    Abstract: A deburring machine for removing burrs from workpieces includes a framework, a deburring mechanism and a transport mechanism. The deburring mechanism mounted on the framework, includes deburring units positioned on the framework. The transport mechanism is positioned on the framework adjacent to the deburring units. The transport mechanism includes a base, multi-station rotating plate and a first driver. The base is positioned on the framework. The multi-station rotating plate is rotatably positioned on the base. The first driver is positioned on the framework and connects with the base. The first driver is capable of driving the multi-station rotating plate to transport the workpieces to the plurality of deburring units, the plurality of deburring units are capable of removing the burrs of the workpieces.
    Type: Grant
    Filed: May 25, 2012
    Date of Patent: March 17, 2015
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Ming-Lu Yang, Liang Zhu, Zhong-Wei Yang
  • Patent number: 7785173
    Abstract: A superfinishing system and method, wherein an abrasive is employed to process a workpiece, and wherein the system simultaneously mounts a plurality of workpieces in a diagonal turret, or mounts a plurality of different types of workpieces in a plurality of chucks for different operations thereon, or performs a plurality of different operations on the same workpiece without remounting. The system improves throughput by allowing flexibility in the operation and multitasking.
    Type: Grant
    Filed: February 27, 2006
    Date of Patent: August 31, 2010
    Assignee: Supfina Machine Co.
    Inventor: Norbert Klotz
  • Publication number: 20080274673
    Abstract: It is possible to execute a one-step polishing or a plural-step polishing at a high throughput, and it is possible to achieve a reduction of an occupied area on the basis of a compact structure of a whole apparatus. Two platens are respectively provided with a first wafer retention head and a second wafer retention head, and a wafer transfer apparatus on which a wafer is mounted is arranged between two platens. The two wafer retention heads are moved between two platens and the wafer transfer apparatus respectively by a first moving means and a second moving means. Further, a two-step polishing is executed by whirl moving two wafer retention heads from one platen to the other platen at 180 degree respectively by a whirl moving means supporting two moving means.
    Type: Application
    Filed: March 25, 2008
    Publication date: November 6, 2008
    Inventor: Tadashi Adachi
  • Patent number: 7381118
    Abstract: A belt sander is disclosed that may include a sanding assembly having a first roller and a second roller, the sanding assembly being configured to receive a sanding belt around the first roller and the second roller to define a sanding surface therebetweeen. The belt sander may include a motor operationally coupled to the sanding assembly and opposite the sanding surface, the motor being configured to rotate at least the first roller and thereby rotate the sanding belt around the first roller and the second roller, as well as a handgrip formed around at least a portion of the motor and substantially encasing the motor.
    Type: Grant
    Filed: April 12, 2007
    Date of Patent: June 3, 2008
    Assignee: Black & Decker Inc.
    Inventors: Daniel P. Wall, Craig A. Carroll
  • Patent number: 6808444
    Abstract: A polishing fixture is provided for polishing the optic ends of a fiber optic cable terminated in a fiber optic connector. A holding plate has a receptacle for receiving the fiber optic connector, with at least a portion of each of a first side and a second side of the connector exposed. A clamping arm is disposed for linear movement relative to the holding plate and the received connector, as well as for pivotal movement relative to the holding plate and the received connector. The clamping arm has first and second clamping portions for engaging the first and second sides, respectively, of the connector. An actuator mechanism is operatively associated with the clamping arm for moving the clamping arm linearly to bring the first clamping portion of the arm into clamping engagement with the first side of the connector and then pivoting the clamping arm to bring the second clamping portion of the arm into clamping engagement with the second side of the connector.
    Type: Grant
    Filed: November 26, 2003
    Date of Patent: October 26, 2004
    Assignee: Molax Incorporated
    Inventors: Igor Kuprin, Igor Grois
  • Patent number: 6648765
    Abstract: A supporting device for a plurality of adapter chucks for the precision grinding or polishing of optical components comprises a spindle shaft having a central bore for supplying one of a gas and a vacuum, at least one arm adjustably supported by a head of the spindle shaft and having a seating for an adapter chuck, and a flexible vacuum/gas line provided between the seating and the spindle shaft. The arm is adjustable as to its angle of inclination relative to an axis of the spindle shaft.
    Type: Grant
    Filed: October 30, 2001
    Date of Patent: November 18, 2003
    Assignee: Leica Camera AG
    Inventors: Ulrich Ehmes, Bernd Schaub
  • Patent number: 6645049
    Abstract: An method and apparatus for forming wafers of varying thickness'. The apparatus includes a template. The template is formed of a main disk including a plurality of cavities extending into a first side thereof. Each cavity has notches cut in the walls thereof and a pattern etched in the base thereof. Holding disks are moistened and positioned within respective cavities for releasably securing a wafer in the cavity. A moistening liquid is dispensed and diffuses into the cavities via the notches cut in the walls and collects in the pattern etched on the base of the cavity thereby increasing the suctional force used to secure the holding disk. When the template is releasably secured within a cavity, rotatably connected to a rotating head and positioned such that the first side faces a lapping and polishing surface, wafers received by the cavities are lapped and polished upon rotation of the rotating head.
    Type: Grant
    Filed: September 25, 2001
    Date of Patent: November 11, 2003
    Inventor: Phuong Van Nguyen
  • Patent number: 6620257
    Abstract: There is disclosed a scrub cleaning device which can reduce cleaning time and which requires no large-scaled device for transferring a substrate to the next cleaning process.
    Type: Grant
    Filed: June 29, 2000
    Date of Patent: September 16, 2003
    Assignee: Hoya Corporation
    Inventors: Hiroshi Kouno, Masahumi Kanahara
  • Patent number: 6612905
    Abstract: A method and apparatus for forming wafers of varying thickness'. The apparatus includes a template. The template is formed of a main disk including a plurality of cavities extending into a first side thereof and a backing plate positioned on a side of the main disk opposite the first side. Holding disks are moistened and positioned within respective cavities for releasably securing a wafer in the cavity. When the template is releasably secured to and rotatable with a rotating head and positioned such that the first side faces a lapping and polishing surface, wafers received by the cavities are lapped and polished upon rotation of the rotating head. A plurality of shims are selectively received within respective cavities between a base of the cavity and the holding disk for adjusting a depth of the cavity thereby adjusting an amount of a wafer to be lapped and polished. The shims have varying thickness' and are color coated, each color being representative of a predetermined thickness for the shim.
    Type: Grant
    Filed: April 23, 2001
    Date of Patent: September 2, 2003
    Inventor: Phuong Van Nguyen
  • Patent number: 6379230
    Abstract: An automatic polishing apparatus has an index table. A loading station, a primary polishing station, a secondary polishing station, and an unloading station are set along the circumference of an index table. The index table has a plurality of holders 2 each of which is for supporting a wafer. The index table is rotated so that rotational movement is given to each of the stations. The wafer is transferred to the loading station. The wafer is transferred from the loading station to the primary polishing station to be subjected to planarization process at the primary polishing station. The wafer is is subject to finish treatment at the secondary polishing station to be polished into a polished wafer which is transferred from the unloading station to an outside of the polishing apparatus.
    Type: Grant
    Filed: April 28, 1998
    Date of Patent: April 30, 2002
    Assignee: NEC Corporation
    Inventors: Yoshihiro Hayashi, Kazuo Kobayashi
  • Patent number: 6343980
    Abstract: Three columns 10, 20, 30 are set up in an approximately triangle arrangement. A saddle 51, which fixes a main spindle 50 thereto, is held in contact with a side face of the column 10, 20 or 30 or a brace 40 which unitarily connects two or three of the columns 10, 20, 30. A plurality of chucking tables 4a, 4b are installed in an indexing table 2a. When a work piece 5b attracted onto one chucking table 4b is carried to a position below the main spindle 50, the other chucking table 4a is located at a loading-unloading position. Since the main spindle 50 is located at a geometrical gravity center of a triangle defined by the columns 10, 20, 30, a reaction force which is generated during machining is uniformly distributed to each of the columns 10, 20, 30. Consequently, the columns 10, 20, 30 are prevented from deformation which causes inclination of the main spindle 50, and the machined work piece has superior flatness.
    Type: Grant
    Filed: November 1, 1999
    Date of Patent: February 5, 2002
    Assignees: Supersilicon Crystal Research Institute Corporation, Disco Corporation
    Inventors: Kohzo Abe, Yutaka Koma
  • Patent number: 6241585
    Abstract: A chemical mechanical polishing apparatus includes a rotatable carousel and multiple carrier head assemblies coupled to the carousel. Each carrier head assembly includes multiple carrier heads each of which can hold a single substrate. The apparatus includes multiple substrate processing stations separated from one another in substantially equal angular intervals. The carrier head assemblies can be positioned in angular alignment with the stations and can be rotated from one station to another station. At least one polishing station includes a fixed abrasive sheet and a fluid bearing surface that provides an upward pressure against the lower surface of the polishing sheet. The carrier head assembly is positioned so that the substrates are in angular alignment with the fluid bearing disposed below the polishing sheet, and the substrates are brought into contact with the polishing sheet.
    Type: Grant
    Filed: June 25, 1999
    Date of Patent: June 5, 2001
    Assignee: Applied Materials, Inc.
    Inventor: John M. White
  • Patent number: 5792709
    Abstract: The present invention is a high-speed planarizing machine with a platform that holds the upward facing wafer stationary during planarization, and a carrier positioned opposite the platform. The carrier rotates about an eccentric axis and translates in a plane that is substantially parallel to the wafer. A polishing pad is smaller in diameter than the wafer and is attached to the carrier and positioned opposite the wafer. The carrier rotates and translates the polishing pad across the wafer while the wafer is held stationary.
    Type: Grant
    Filed: December 19, 1995
    Date of Patent: August 11, 1998
    Assignee: Micron Technology, Inc.
    Inventors: Karl M. Robinson, Hugh Stroupe
  • Patent number: 5718619
    Abstract: An abrasive machining assembly (10) wherein a worktable (14) is rotatably supported on a frame (12) for rotation about a table axis (A) and a plurality of platens (32) are supported on the worktable (14) with each of the platens (32) being adapted for supporting a workpiece to be machined by a machining disc (38) rotating about a tool axis (B). Each platen (32) is rotatably supported for rotation about a platen axis (C) which is radially spaced from the table axis (A) a different distance than the tool axis (B) whereby each of the platens (32) rotates about a platen axis (C) which is parallel to and offset from the tool axis (B) when positioned in the workstation.
    Type: Grant
    Filed: October 9, 1996
    Date of Patent: February 17, 1998
    Assignee: CMI International, Inc.
    Inventors: Daniel L. Merrill, John R. Synder, Chuck O. Eckholm, Jr., Steve M. Sunday, John L. Seaver
  • Patent number: 5674116
    Abstract: An abrasive machining assembly (10) wherein a worktable (14) is rotatably supported on a frame (12) for rotation about a table axis (A) and a plurality of platens (32) are supported on the worktable (14) with each of the platens (32) being adapted for supporting a workpiece to be machined by a machining disc (38) rotating about a tool axis (B). Each platen (32) is rotatably supported for rotation about a platen axis (C) which is radially spaced from the table axis (A) a different distance than the tool axis (B) whereby each of the platens (32) rotates about a platen axis (C) which is parallel to and offset from the tool axis (B) when positioned in the workstation.
    Type: Grant
    Filed: October 9, 1996
    Date of Patent: October 7, 1997
    Assignee: CMI International Inc.
    Inventors: Daniel L. Merrill, John R. Synder, Chuck O. Eckholm, Jr., Steve M. Sunday, John L. Seaver
  • Patent number: 5547415
    Abstract: A method and apparatus for polishing chamfers made along the periphery; of a semiconductor wafer designed such that when the wafer is once picked up by a rotatory suction cup of a transportation robot, arm, the wafer is not released from the suction cup until the entire polishing operation is completed; in an embodiment, a circular turn table having six wafer suction cups is employed which is adapted to turn step-wise, each step consisting of a turn through an angle of 60.degree. to transfer the wafers.
    Type: Grant
    Filed: June 7, 1993
    Date of Patent: August 20, 1996
    Assignee: Shin-Etsu Handotai Co., Ltd.
    Inventors: Fumihiko Hasegawa, Tatsuo Ohtani, Yasuyoshi Kuroda
  • Patent number: 5525096
    Abstract: An apparatus for grinding spherical surfaces of workpieces includes a grinding section having a grindstone rotating mechanism for rotating around an axis of a shaft thereof with a grindstone held at an end of the shaft, a feeding mechanism for feeding the grindstone rotating mechanism toward the workpiece in a direction along the shaft, and a fixing mechanism for holding the grindstone rotating mechanism and the feeding mechanism and determining an angle 1 inclination of the short of the grindstone rotating mechanism with respect to the workpiece. A plurality of workpiece holding mechanisms are provided for holding the workpieces at ends of shafts thereof, the workpiece held by at least one of the workpiece holding mechanisms being opposed to the grindstone. A workpiece rotating mechanism is provided for rotating the workpiece holding mechanism which holds the workpiece opposed to the grindstone.
    Type: Grant
    Filed: February 25, 1994
    Date of Patent: June 11, 1996
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kiyoshi Mayahara, Mamoru Inoue, Keniti Matumura
  • Patent number: 5482495
    Abstract: An apparatus for polishing spherical surfaces of workpieces includes a polishing device rotating on a shaft thereof while holding a polishing tool at an end of the shaft. A pivoting device pivots the polishing device around a polishing position of the tool. A plurality of workpiece holders each hold a workpiece at an end thereof so that one of the workpieces is opposed to the tool. Workpiece holder-holding devices hold the workpiece holders so as to be rotatably and vertically movably. A workpiece holder-pressing device presses at least one of the workpiece holders held by the workpiece holder-holding device against the tool. A rotary table rotates while holding the workpiece holders and the workpiece holder-holding devices, thus placing at least one of the workpiece holders at a workpiece replacing position when the other of the workpiece holders is placed at the polishing position of the polishing device.
    Type: Grant
    Filed: September 29, 1993
    Date of Patent: January 9, 1996
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kiyoshi Mayahara, Mamoru Inoue, Keniti Matumura