Presser Or Former Patents (Class 451/303)
  • Publication number: 20110287698
    Abstract: A pad for polishing media disks has an elastomeric body with a Shore A hardness of not greater than 20, and a coating of polystyrene (PS) and a flexible polymer. The elastomeric pad may comprise styrene-isoprene-styrene block copolymers, or a styrene-ethylene-butylene-styrene block copolymer. The pad may be viscoleastic with a particulate composite coating. The pad may be a styrenic block copolymer and the coating is a different type of styrenic block copolymer containing solid particles. The coating may have a binder with a mixture of PS and flexible styrenic block copolymers, and filler particles comprising cross-linked PS/divinylbenzene polymer microspheres.
    Type: Application
    Filed: May 18, 2010
    Publication date: November 24, 2011
    Applicant: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Thomas E. Karis, Ricardo Ruiz
  • Patent number: 8038508
    Abstract: A wafer polishing apparatus includes a polishing tape extending between two guide rollers, a first surface of the polishing tape contacting a surface of a wafer to be polished, a polishing head including a pusher pad, the pusher pad adapted to push the polishing tape against the surface of the wafer to be polished, a color image sensor adjacent to the polishing tape, the color image sensor being adapted to detect a color image of the polishing tape and to output a signal corresponding to the detected color image, and a controller connected to the color image sensor, the controller being adapted to receive the signal output from the color image sensor and to determine when a color of the color image detected by the color image sensor changes, a change in the color image indicating a polishing end point.
    Type: Grant
    Filed: October 15, 2008
    Date of Patent: October 18, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jong-Heun Lim, Sung-Ho Shin, Bo-Un Yoon, Chang-Ki Hong
  • Patent number: 8029334
    Abstract: A device is described comprising: a segmented sanding pad having a plurality of segments, each segment having a longitudinal axis and corresponding to a respective contact roller having a longitudinal axis, wherein, when the sanding pad is moved obliquely, the segments align in accordance with a degree of oblique movement, characterized in that the longitudinal axes of the individual contact rollers and the respective segments are aligned with respect to each other when the gap between the segments is adjusted to the longitudinal axis of the contact rollers.
    Type: Grant
    Filed: March 27, 2006
    Date of Patent: October 4, 2011
    Inventor: Stephan Kundig
  • Patent number: 7976361
    Abstract: A polishing apparatus is suitable for use in polishing a periphery of a substrate, such as a semiconductor wafer. The polishing apparatus includes a holding section configured to hold a workpiece and a polishing head configured to bring a polishing tape into contact with the workpiece. The polishing apparatus also includes a supply reel configured to supply the polishing tape to the polishing head, a rewind reel configured to rewind the polishing tape that has contacted the workpiece, and a swinging mechanism configured to cause the polishing head to perform a swinging motion with its pivot at a predetermined point.
    Type: Grant
    Filed: June 16, 2008
    Date of Patent: July 12, 2011
    Assignee: Ebara Corporation
    Inventors: Tamami Takahashi, Masaya Seki, Hiroaki Kusa, Kenya Ito
  • Publication number: 20110003537
    Abstract: A polishing apparatus according to the present invention includes a substrate holder (32) configured to hold and rotate a substrate (W), a press pad (50) configured to press a polishing tape (41) having a polishing surface against a bevel portion of the substrate held by the substrate holder, and a feeding mechanism (45) configured to cause the polishing tape to travel in its longitudinal direction. The press pad (50) includes a hard member (51) having a pressing surface (51a) for pressing the bevel portion of the substrate through the polishing tape, and at least one elastic member (53) for pressing the hard member against the bevel portion of the substrate through the belt-shaped polishing tool.
    Type: Application
    Filed: July 8, 2008
    Publication date: January 6, 2011
    Inventors: Dai Fukushima, Atsushi Shigeta, Tamami Takahashi, Kenya Ito, Masaya Seki, Hiroaki Kusa
  • Publication number: 20110003540
    Abstract: A polishing apparatus according to the present invention includes a polishing tape (41) having a polishing surface, a substrate holder configured to hold and rotate a substrate (W), a press pad (50) configured to press the polishing tape against a bevel portion of the substrate held by the substrate holder, and a polishing-tape feeding mechanism (45) configured to cause the polishing tape to travel in its longitudinal direction. The press pad (50) includes a pad body (53), a plate-shaped pressing section having a pressing surface (51a) for pressing the bevel portion of the substrate through the polishing tape and having a rear surface (51b) opposite to the pressing surface, and a plurality of coupling sections (52) coupling the pressing section to the pad body. A space (S) is formed between the rear surface of the pressing section and the pad body.
    Type: Application
    Filed: July 8, 2008
    Publication date: January 6, 2011
    Inventors: Tamami Takahashi, Kenya Ito, Hiroaki Kusa, Masaya Seki
  • Patent number: 7862402
    Abstract: The present invention relates to a polishing apparatus for removing surface roughness produced at a peripheral portion of a substrate, or for removing a film formed on a peripheral portion of a substrate. The polishing apparatus includes a housing for forming a polishing chamber therein, a rotational table for holding and rotating a substrate, a polishing tape supply mechanism for supplying a polishing tape into the polishing chamber and taking up the polishing tape which has been supplied to the polishing chamber, a polishing head for pressing the polishing tape against a bevel portion of the substrate, a liquid supply for supplying a liquid to a front surface and a rear surface of the substrate, and a regulation mechanism for making an internal pressure of the polishing chamber being set to be lower than an external pressure of the polishing chamber.
    Type: Grant
    Filed: February 3, 2010
    Date of Patent: January 4, 2011
    Assignee: Ebara Corporation
    Inventors: Akihisa Hongo, Kenya Ito, Kenji Yamaguchi, Masayuki Nakanishi
  • Publication number: 20100297921
    Abstract: The invention relates to an orbital apparatus (20) for machining of a revolution metallic wall, of the type comprising a fixed annular plate (30) coaxially mounted on a universal support and having a peripheral annular electric collector (35) and an annular plate (50) rotationally mobile and coaxially mounted on the fixed annular plate (30). The mobile annular plate (50) carries a set of electrical contacts (55) cooperating with the electrical collector (35), means (60) for rotationally driving the plate (50), means (70) for machining the metallic wall and pneumatic feeder means (80) to apply and maintain the machining means (70) on the metallic wall.
    Type: Application
    Filed: November 8, 2007
    Publication date: November 25, 2010
    Applicants: AREVA NP, BURCH MASCHINENBAU AG
    Inventors: Jean-Paul Guigon, Didier Bovin, Rolf Schuster
  • Patent number: 7815492
    Abstract: A surface treatment method that enables a surface of an electrostatic chuck to be smoothed, so as to improve the efficiency of heat transfer between the surface of the electrostatic chuck and a substrate. The electrostatic chuck is provided in an upper portion of a susceptor provided in a chamber of a substrate processing apparatus. In the surface treatment of the electrostatic chuck, a sprayed coating film is formed on the surface of the electrostatic chuck, next the surface of the electrostatic chuck is ground by bringing into contact therewith a grindstone, then the surface of the electrostatic chuck is ground flat by bringing into contact therewith a lapping plate onto a surface of which is sprayed a suspension, and then the surface of the electrostatic chuck is ground smooth by bringing into contact therewith a tape of a tape lapping apparatus.
    Type: Grant
    Filed: March 19, 2007
    Date of Patent: October 19, 2010
    Assignee: Tokyo Electron Limited
    Inventors: Yasuharu Sasaki, Masakazu Higuma, Tadashi Aoto, Eiichiro Kikuchi
  • Publication number: 20100255757
    Abstract: A substrate processing method is used to polish a substrate. The substrate processing method includes rotating a substrate 13 by a motor 12, polishing a first surface of a peripheral portion of the substrate 13 by pressing a polishing surface of a polishing mechanism 20 against the first surface, determining a polishing end point of the first surface by monitoring a polished state of the first surface, stopping the polishing according to the determining the polishing end point, determining a polishing time spent for the polishing, determining a polishing time for a second surface of the peripheral portion based on the polishing time of the first surface, and polishing the second surface for the determined polishing time.
    Type: Application
    Filed: June 21, 2010
    Publication date: October 7, 2010
    Inventors: Atsushi SHIGETA, Gen Toyota, Hiroyuki Yano, Kunio Oishi, Kenya Ito, Masayuki Nakanishi, Kenji Yamaguchi
  • Publication number: 20100233940
    Abstract: A polishing system and associated methods are described for polishing a magnetic disk used in a disk drive system. The polishing system includes a polishing film that is used to polish the magnetic disk. The polishing system also includes an actuator operable to move the polishing film across a surface of the magnetic disk to polish the magnetic disk. The polishing system also includes a pad having at least one protrusion extending from a surface of the pad. The protrusion is configured to contact the polishing film and press the polishing film against the magnetic disk. The protrusion is operable to compress to about the surface of the pad when in contact with the polishing film. Once polishing is complete, the pad retracts from the polishing film and the protrusion extends from the pad, reducing the adhesion force between the pad and the polishing film.
    Type: Application
    Filed: March 12, 2009
    Publication date: September 16, 2010
    Inventors: Malika D. Carter, Yun-Lin Hsiao, Thomas E. Karis, Bruno Marchon, Ullal V. Nayak, Christopher Ramm, Wong K. Richard
  • Patent number: 7744445
    Abstract: A polishing apparatus has a polishing tape (21), a supply reel (22) for supplying the polishing tape (21) to a contact portion (30) at which the polishing tape (21) is brought into contact with a notch portion (11) of a substrate (10), and a take-up reel (23) for winding up the polishing tape (21) from the contact portion (30). The polishing apparatus also has a first guide portion (24) having as guide surface (241) for supplying the polishing tape (21) directly to the contact portion (30), and a second guide portion (25) having a guide surface for supplying the polishing tape (21) tot the take-up reel (23). The guide surface (241) of the first guide portion (24) and/or the guide surface of the second guide portion (25) has a shape corresponding to a shape of the notch portion (11) of the substrate (10).
    Type: Grant
    Filed: October 12, 2005
    Date of Patent: June 29, 2010
    Assignees: Kabushiki Kaisha Toshiba, Ebara Corporation
    Inventors: Takeo Kubota, Atsushi Shigeta, Gen Toyota, Tamami Takahashi, Daisaku Fukuoka, Kenya Ito
  • Patent number: 7744446
    Abstract: A sanding apparatus includes a plurality of posts each having an upper end and a lower end. The plurality of posts is four posts. A first horizontal support extends between two of the posts and a second horizontal support extends between another two of the posts. The first and second horizontal supports are vertically adjustable with respect to the posts. A table is mounted to and extends between the first and second horizontal supports. A belt sander is amounted to the posts. The table is positioned between the lower end of the posts and the belt sander. The table is selectively movable upwardly towards or downwardly from the belt sander.
    Type: Grant
    Filed: August 21, 2008
    Date of Patent: June 29, 2010
    Inventor: Ilmars Vilmanis
  • Publication number: 20100136886
    Abstract: The present invention relates to a polishing apparatus for removing surface roughness produced at a peripheral portion of a substrate, or for removing a film formed on a peripheral portion of a substrate. The polishing apparatus includes a housing for forming a polishing chamber therein, a rotational table for holding and rotating a substrate, a polishing tape supply mechanism for supplying a polishing tape into the polishing chamber and taking up the polishing tape which has been supplied to the polishing chamber, a polishing head for pressing the polishing tape against a bevel portion of the substrate, a liquid supply for supplying a liquid to a front surface and a rear surface of the substrate, and a regulation mechanism for making an internal pressure of the polishing chamber being set to be lower than an external pressure of the polishing chamber.
    Type: Application
    Filed: February 3, 2010
    Publication date: June 3, 2010
    Inventors: Akihisa Hongo, Kenya Ito, Kenji Yamaguchi, Masayuki Nakanishi
  • Patent number: 7722445
    Abstract: An insertion tool (12) for an angle grinder (2) that has a hub (16) with at least a first fastening means for fastening the hub (16) to a driving device (22) of the angle grinder (2). The first fastening means if located on a partial circle (54) with a radius (56) of between 12 mm and 25 mm.
    Type: Grant
    Filed: November 9, 2004
    Date of Patent: May 25, 2010
    Assignee: Robert Bosch GmbH
    Inventors: Ernst Kraenzler, Peter Stierle, Albrecht Hofmann, Juergen Wiker, Harald Krondorfer, Joachim Schadow, Sinisa Andrasic, Thomas Schomisch, Christof Hoelzl, Johann Huber
  • Publication number: 20100105291
    Abstract: Apparatus and methods are provided to polish a notch of a substrate. The invention includes a polishing head adapted to apply a polishing tape against the notch of the substrate, including: a plunger; and an actuator, wherein the actuator is adapted to move the plunger with respect to the polishing tape. Numerous other aspects are provided.
    Type: Application
    Filed: October 24, 2008
    Publication date: April 29, 2010
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Gary C. Ettinger, Paul D. Butterfield, Antoine P. Manens, Sen-Hou Ko
  • Publication number: 20100105294
    Abstract: Methods and apparatus are provided for reducing tension on a polishing roller. In some aspects, a polishing head may be provided that is adapted to contact a substrate. The polishing head includes: a polishing unit having a polisher and at least one pair of tension distributors adapted to reduce tension on the polisher; and one or more pairs feed guides. Numerous other aspects are provided.
    Type: Application
    Filed: October 22, 2009
    Publication date: April 29, 2010
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Gary C. Ettinger, Wendy Luo, Antoine P. Manens
  • Publication number: 20100105299
    Abstract: Apparatus and methods are provided to polish a substrate. In some aspects, the invention includes a polishing head adapted to apply a polishing tape against at least one of a substrate edge and a notch in the substrate edge. The polishing head includes a polisher coupled to the polishing head, wherein the polisher has a hollow portion and is adapted to conform to a shape of at least one of the substrate edge and the notch. Numerous other aspects are provided.
    Type: Application
    Filed: October 24, 2008
    Publication date: April 29, 2010
    Applicant: Applied Materials, Inc.
    Inventors: Gary C. Ettinger, Paul D. Butterfield, Antoine P. Manens, Sen-Hou Ko
  • Patent number: 7682225
    Abstract: The present invention relates to a polishing apparatus for removing surface roughness produced at a peripheral portion of a substrate, or for removing a film formed on a peripheral portion of a substrate. The polishing apparatus includes a housing for forming a polishing chamber therein, a rotational table for holding and rotating a substrate, a polishing tape supply mechanism for supplying a polishing tape into the polishing chamber and taking up the polishing tape which has been supplied to the polishing chamber, a polishing head for pressing the polishing tape against a bevel portion of the substrate, a liquid supply for supplying a liquid to a front surface and a rear surface of the substrate, and a regulation mechanism for making an internal pressure of the polishing chamber being set to be lower than an external pressure of the polishing chamber.
    Type: Grant
    Filed: February 23, 2005
    Date of Patent: March 23, 2010
    Assignee: Ebara Corporation
    Inventors: Akihisa Hongo, Kenya Ito, Kenji Yamaguchi, Masayuki Nakanishi
  • Publication number: 20100029184
    Abstract: A belt sander includes a housing and an endless sanding belt supported by the housing. A first shaft is connected to the housing, and the housing is pivotable about the first shaft. A second shaft is connected to the housing and offset from the first shaft. The sander is mounted to the rotating portion of a rotary machining clam shell trackway and revolved around a pipe surface to be sanded while biasing the sander against the surface. The sander may also be pivotable to sand a tapered surface.
    Type: Application
    Filed: January 4, 2008
    Publication date: February 4, 2010
    Inventor: Brent K. Place
  • Publication number: 20100003895
    Abstract: The invention concerns a grinding machine having displaceable grinding means for the processing of workpieces made from wood, wood composite materials, plastics, metals and similar materials. The invention further concerns a method of grinding a workpiece by means of the inventive grinding machine. The grinding aggregate comprises: at least one translational driving means configured to translate the grinding means (6) and at least one eccentric tappet configured to rotatingly move the grinding means (6). The inventive device is characterized in that the grinding aggregate comprises a suctioning device which suctions waste products of the processing, such as chips, through the grinding means. In this way, it is possible to achieve a qualitatively superior grinding result.
    Type: Application
    Filed: April 2, 2009
    Publication date: January 7, 2010
    Applicant: BUETFERING SCHLEIFTECHNIK GMBH
    Inventors: Thomas Bettermann, Hans-Bernd Humpe
  • Publication number: 20100003900
    Abstract: There are provided an abrasive tape capable of suppressing contamination of a magnetic disk due to shattered abrasive particles and smoothing the surface of the magnetic disk; a method for producing an abrasive tape; and a varnishing process. An abrasive tape 1 produced according to the method for producing an abrasive tape of the invention is used in a process for varnishing a magnetic disk and produced according to a process for preparing a slurry by kneading and dispersing abrasive particles 5 and a binding agent 6; a process for forming a coating film by applying the slurry on a support 2; a process for forming an abrasive particle layer 3 by hardening the coating film; and a process for forming a coating layer 4 on the surface of the abrasive particle layer 3.
    Type: Application
    Filed: June 19, 2009
    Publication date: January 7, 2010
    Applicant: SHOWA DENKO K.K.
    Inventors: Ryuji Sakaguchi, Kazuya Niwa
  • Patent number: 7621799
    Abstract: Disclosed herein is a polishing method for polishing the end surface of a wafer by using a polishing tape, wherein the end surface of the wafer is polished in the condition where a polishing liquid containing an oxidizing agent is supplied to the end surface of the wafer.
    Type: Grant
    Filed: July 30, 2007
    Date of Patent: November 24, 2009
    Assignee: Sony Corporation
    Inventor: Takashi Sakairi
  • Publication number: 20090280730
    Abstract: A burnishing apparatus is presented. The burnishing apparatus includes a tape dispensing assembly. The tape dispensing assembly includes a tape supply module for dispensing a tape. A plurality of tape guide rollers is provided for guiding the tape. The burnishing apparatus includes a contact roller mount unit which has a plurality of contact guide rollers and a contact roller. The contact roller contacts the tape against a surface of a media during burnishing. The tape guide rollers and the contact guide rollers are arranged to provide a zero contact force against the media to be burnished.
    Type: Application
    Filed: May 8, 2009
    Publication date: November 12, 2009
    Applicant: SOLVES INNOVATIVE TECHNOLOGY PTE LTD
    Inventor: Teng-Hwee KOH
  • Patent number: 7614935
    Abstract: An apparatus for machining a strip- or plate-shaped metallic workpiece is proposed, in particular for the deburring of cut edges and/or for the grinding of surfaces of the workpiece, having at least one machining unit which has a revolving drive device which directs a machining element at least approximately linearly past the region of the workpiece to be machined obliquely or transversely to the feed direction of the workpiece. According to the invention, the machining element is designed as a grinding belt, the grinding belt, in the region of the workpiece to be machined, being in operative connection with the drive device in such a way that the drive device drives the grinding belt, and the grinding belt and the drive device are separate from one another at least in a region remote from the workpiece.
    Type: Grant
    Filed: February 26, 2008
    Date of Patent: November 10, 2009
    Assignee: Lissmac Maschinebau und Diamantwerkzeuge GmbH
    Inventor: Josef Weiland
  • Publication number: 20090275269
    Abstract: Disclosed herein is a wafer polishing device including: an abrasive member driving device adapted to run a belt-like abrasive member in a direction crossing an outer circumferential end-edge of a wafer which is a wafer to be polished while bringing a belt-like abrasive member into contact with outer circumferential end-edge of the wafer, the abrasive member having non-abrasive sections disposed on both sides of an abrasive grain section; and a guide member having two guide surfaces shaped to conform to the outer circumferential end-edge of the wafer, the two guide surface being adapted to press, from rear sides of the non-abrasive sections, the respective non-abrasive sections of the abrasive member run by the abrasive member driving device.
    Type: Application
    Filed: April 28, 2009
    Publication date: November 5, 2009
    Applicant: SONY CORPORATION
    Inventor: Takashi Sakairi
  • Publication number: 20090227189
    Abstract: A polishing apparatus polishes a periphery of a substrate by bringing a polishing tool into sliding contact with the substrate. The polishing apparatus includes a substrate-holding mechanism configured to hold a substrate and rotate the substrate, a polishing mechanism configured to press a polishing tool against a periphery of the substrate so as to polish the periphery, and a periphery-supporting mechanism configured to support the periphery of the substrate by a fluid. The periphery-supporting mechanism is configured to support a surface of the substrate from an opposite side or the same side of the periphery of the substrate.
    Type: Application
    Filed: March 5, 2009
    Publication date: September 10, 2009
    Inventors: Kazuaki Maeda, Tamami Takahashi, Masaya Seki, Hiroaki Kusa
  • Publication number: 20090163117
    Abstract: A glass substrate for perpendicular magnetic recording, having a surface with an average surface roughness of 2.0 ? or less and surface height variations of 1 ? or less with wavelengths in the range of 0.05 mm-0.5 mm in both radial and circumferential directions, is produced by rotating a glass substrate, supplying polishing slurry containing a specified amount of abrading particles of artificial diamond on its surface, pressing a polishing tape on the surface and causing this polishing tape to travel in a direction opposite to the direction of rotation of the glass substrate.
    Type: Application
    Filed: February 27, 2009
    Publication date: June 25, 2009
    Applicant: Nihon Micro Coating Co., Ltd.
    Inventors: Yuji Horie, Tatsuya Tanifuji, Noriyuki Kumasaka
  • Publication number: 20090117828
    Abstract: The present invention relates to a polishing apparatus for removing surface roughness produced at a peripheral portion of a substrate, or for removing a film formed on a peripheral portion of a substrate. The polishing apparatus includes a housing (3) for forming a polishing chamber (2) therein, a rotational table (1) for holding and rotating a substrate (W), a polishing tape supply mechanism (6) for supplying a polishing tape (5) into the polishing chamber (2) and supplied to the polishing chamber (2), a polishing head (35) for pressing the polishing tape (5) against a bevel portion of the substrate (W), a liquid supply (50) for supplying a liquid to a front surface and a rear surface of the substrate (W), and a regulation mechanism (16) for making an internal pressure of the polishing chamber (2) being set to be lower than an external pressure of the polishing chamber (2).
    Type: Application
    Filed: February 23, 2005
    Publication date: May 7, 2009
    Inventors: Akihisa Hongo, Kenya Ito, Kenji Yamaguchi, Masayuki Nakanishi
  • Publication number: 20090098804
    Abstract: A wafer polishing apparatus includes a polishing tape extending between two guide rollers, a first surface of the polishing tape contacting a surface of a wafer to be polished, a polishing head including a pusher pad, the pusher pad adapted to push the polishing tape against the surface of the wafer to be polished, a color image sensor adjacent to the polishing tape, the color image sensor being adapted to detect a color image of the polishing tape and to output a signal corresponding to the detected color image, and a controller connected to the color image sensor, the controller being adapted to receive the signal output from the color image sensor and to determine when a color of the color image detected by the color image sensor changes, a change in the color image indicating a polishing end point.
    Type: Application
    Filed: October 15, 2008
    Publication date: April 16, 2009
    Inventors: Jong-Heun Lim, Sung-Ho Shin, Bo-Un Yoon, Chang-Ki Hong
  • Patent number: 7438628
    Abstract: A belt sanding system comprising a segmented sanding block including a plurality of individually controllable segments and one or more sanding belt deflecting rollers, a plurality of sensing elements corresponding to the plurality of segments, and a device for interconnecting the plurality of sensing elements, interconnecting the plurality of sensing elements with the segmented sanding block, and effecting lateral movement of the plurality of sensing elements as the segmented sanding block is rotated to an oblique alignment relative to the feed direction.
    Type: Grant
    Filed: February 19, 2008
    Date of Patent: October 21, 2008
    Inventor: Stephan Kundig
  • Patent number: 7431634
    Abstract: In a platen assembly for a polishing apparatus, a platen supports a polishing belt that makes contact with an object during a polishing process, so that the platen provides a pressure on the polishing belt during the polishing process. A plurality of first bladders extends in a first direction on an entire surface of the platen and is spaced apart by a uniform distance, and the first bladders apply pressure to the polishing belt. A plurality of second bladders extends in the first direction on a middle portion of the surface of the platen between a central portion and a peripheral portion of the platen and is positioned between the first bladders, and the second bladders apply pressure to the polishing belt. The pressures of the bladders are individually controlled by pressure controllers. Various pressures are individually applied different portions of the polishing belt by the bladders.
    Type: Grant
    Filed: February 6, 2007
    Date of Patent: October 7, 2008
    Assignee: Samsung Electronics, Co., Ltd.
    Inventor: Young-Chul Lee
  • Patent number: 7413498
    Abstract: A film feeder (FF1) feeds a film (1), a first drive (20) rotates a work (W), a second drive (30) moves the work (W) relative to the film (1), a shoe set handler (40) handles the shoe set (2) to press the film (1) against the work (W), and a deterioration delayer (C) is configured to delay an abrasivity deterioration of the film (1).
    Type: Grant
    Filed: February 6, 2004
    Date of Patent: August 19, 2008
    Assignee: Nissan Motor Co., Ltd.
    Inventors: Masahiro Omata, Masahiko Iizumi, Kiyoshi Hasegawa, Takashi Ogino, Tomohiro Kondo, Kazuo Takeda, Takafumi Watanabe, Yoshiyuki Chida, Yasushi Matsushita
  • Publication number: 20080194185
    Abstract: The present invention relates to a hand-held motorized device that is designed for sanding cylindrical objects. The invention comprises a left side and right side within which are a plurality of rollers, a motor, an on/off button, power supply, and sanding belt. A plurality of diameter knobs located on the exterior side of the housing enable a range of adjustment for various diameters. The sides can be disassembled to enable sanding belt replacement. The device has appealing uses comprising sanding down copper ends for soldering during plumbing installation.
    Type: Application
    Filed: February 12, 2007
    Publication date: August 14, 2008
    Inventor: Michael A. Rowlen
  • Patent number: 7371159
    Abstract: The invention describes devices consisting of a combination of oblique to feed direction aligned belt sanding assemblies, with drives or devices for low sanding belt speeds and/or with conventional, or modified for sanding belt oblique operation, electronic segmented sanding pad. The oblique alignment of the sanding unit can be adjusted steplessly. Its application for both oblique sanding and, when so aligned, sanding directly in the direction of feed meets the requirements of intermediate sanding between paint or varnish coats, as well as those of wood sanding.
    Type: Grant
    Filed: July 22, 2002
    Date of Patent: May 13, 2008
    Inventor: Stephan Kundig
  • Publication number: 20070259608
    Abstract: A polishing apparatus comprising a base for affixing structures thereto, a drive wheel, a polishing wheel assembly, a polishing belt, and at least one routing wheel engaged with the polishing belt. The polishing wheel assembly includes an elongated arm including a distal end, and a rotatable polishing wheel supported at the distal end of the elongated arm. The polishing belt is made with an abrasive outer surface to perform the polishing, and an inner surface for engagement with the perimeters of the drive wheel and the polishing wheel. The routing wheel is engaged with the outer surface of the polishing belt, such that the contact arc of the polishing belt with the polishing wheel differs from an arc of the polishing wheel perimeter extending from a first tangent line between the drive wheel and the polishing wheel to a second tangent line between the drive wheel and the polishing wheel.
    Type: Application
    Filed: May 2, 2007
    Publication date: November 8, 2007
    Inventors: Michael J. Bechtold, Joseph Meisenzahl, David E. Mohring, Darryle E. Fowler, Robert Henderson, Thomas Williams, Alex DiNicola, Christopher Wood, Scott Bambrick
  • Publication number: 20070184759
    Abstract: In a platen assembly for a polishing apparatus, a platen supports a polishing belt that makes contact with an object during a polishing process, so that the platen provides a pressure on the polishing belt during the polishing process. A plurality of first bladders extends in a first direction on an entire surface of the platen and is spaced apart by a uniform distance, and the first bladders apply pressure to the polishing belt. A plurality of second bladders extends in the first direction on a middle portion of the surface of the platen between a central portion and a peripheral portion of the platen and is positioned between the first bladders, and the second bladders apply pressure to the polishing belt. The pressures of the bladders are individually controlled by pressure controllers. Various pressures are individually applied different portions of the polishing belt by the bladders.
    Type: Application
    Filed: February 6, 2007
    Publication date: August 9, 2007
    Applicant: Samsung Electronics Co., Ltd.
    Inventor: Young-Chul Lee
  • Patent number: 7179154
    Abstract: An apparatus for cleaning a semiconductor wafer edge is provided. The apparatus includes a film with an abrasive layer configured to contact the edge surface of a semiconductor substrate coated with a contaminant residue layer. A first reel having the film wound thereon and a second reel for receiving the film fed from the first reel are included. In one embodiment, a third reel configured to force the abrasive layer of the film against the edge surface of the semiconductor substrate so as to create an area of contact between the abrasive layer and the edge surface of the semiconductor substrate; and a pin that protrudes from to the top surface of the third reel. A system and method for cleaning a semiconductor wafer edge are also provided.
    Type: Grant
    Filed: October 3, 2005
    Date of Patent: February 20, 2007
    Assignee: Lam Research Corporation
    Inventors: John M. Boyd, Fritz Redeker, Jason Ryder, Aleksander Owczarz
  • Patent number: 7153182
    Abstract: A system and method for in situ measurement and maintenance of preferred pad smoothness in a CMP process is disclosed. The system includes a linear polisher having one or more sensors for detecting fluid pressure, fluid flow or motor current at the linear polisher during a polishing process. A controller receiving the information provided by the sensors includes an algorithm for adjusting the pad conditioning process to achieve a desired pad smoothness based on the sensor data. The method includes obtaining baseline data on preferred linear polisher characteristics associated with desired pad smoothness and using the baseline data to adjust a pad conditioning regimen on a linear polisher to achieve the desired pad smoothness in situ.
    Type: Grant
    Filed: September 30, 2004
    Date of Patent: December 26, 2006
    Assignee: Lam Research Corporation
    Inventors: Travis R. Taylor, Jingang Yi, Peter Richard Norton
  • Patent number: 7115023
    Abstract: A wafer bevel processing apparatus comprises a plurality of rollers for rotatably supporting a wafer, first process roller, a second process roller, and a process tape extending between the first process roller and the second process roller. The first and second process rollers are positioned to cause the process tape to contact an edge of the wafer when the wafer is loaded into the processing apparatus. The process tape is configured to frictionally prepare the edge where contact occurs with the process tape.
    Type: Grant
    Filed: June 29, 2005
    Date of Patent: October 3, 2006
    Assignee: Lam Research Corporation
    Inventor: Aleksander Owczarz
  • Patent number: 7108587
    Abstract: A shoe for supporting an abrasive tape having an abrasive face and an opposed back face, wherein the shoe comprises a support surface including a frictional engagement material for frictionally engaging the back face of the abrasive tape. The frictional engagement material comprises a plurality of individual frictional engagement areas on a flexible substrate, each frictional engagement area having a plurality of abrasive particles. In an exemplary embodiment, the frictional engagement material comprises diamond abrasive particles retained in a nickel matrix supported on a flexible mesh substrate. The support surface of the shoe may be curvilinear, arcuate, convex, or concave.
    Type: Grant
    Filed: May 2, 2005
    Date of Patent: September 19, 2006
    Assignee: 3M Innovative Properties Company
    Inventor: Arthur P. Luedeke
  • Patent number: 7097547
    Abstract: The invention provides for a powered hand held apparatus for sharpening ice skate blades having an elongated frame with a drive pulley located at one and, and a driven pulley located at the other end. An abrasive grinding belt loops over the pulleys and passes over a convex grinding surface aligned with the pulleys. The pulleys, frame, drive belt, grinding belt and electric motor are contained in a housing having a skate guidance slot such that when a skate is inserted into the slot, the bottom edge of the skate is directed to the abrasive belt at the convex grinding surface.
    Type: Grant
    Filed: May 23, 2003
    Date of Patent: August 29, 2006
    Inventor: Robert McCroary
  • Patent number: 7090560
    Abstract: Systems and methods control abrading operations of an abrading machine by sensing characteristics of an abrading article installed on the abrading machine. When a problem is discovered by sensing the article, appropriate actions may be taken. As one example, the abrading article may be sensed to determine whether the abrading article has been installed with an abrasive side facing the wrong direction. An alert allows an operator to reinstall the article. As another example, the abrading article may be sensed to determine whether splicing tape is present to hold two pieces of abrading tape together. The article may be advanced until the splicing tape is beyond an abrading zone. As another example, the abrading article may be sensed to determine whether the abrading article has stopped moving while the article drive is advancing because the article has broken. An alert allows an operator to repair the break.
    Type: Grant
    Filed: July 28, 2004
    Date of Patent: August 15, 2006
    Assignee: 3M Innovative Properties Company
    Inventor: Daniel A. Billig
  • Patent number: 7077733
    Abstract: A subpad support for use in a web format or belt format polishing apparatus for polishing one or more layers of semiconductor device structures. The subpad support includes a subpad retention element for non-adhesively securing the subpad thereto. The subpad support may also include one or more lips protruding therefrom so as to at least substantially inhibit lateral movement of the subpad relative to the subpad support. Polishing apparatus including the subpad support are also disclosed. The polishing pads of such polishing apparatus may be at least partially moved away from the subpad or subpad support so as to facilitate assembly of a subpad with the subpad support or removal of the subpad from the subpad support without damaging the polishing pad. Methods of removably securing a subpad to the subpad support, removing the subpad from the subpad support, and replacing another subpad on the subpad support, as well as polishing methods, are also disclosed.
    Type: Grant
    Filed: August 31, 2000
    Date of Patent: July 18, 2006
    Assignee: Micron Technology, Inc.
    Inventor: Theodore M. Taylor
  • Patent number: 7066787
    Abstract: A substrate processing apparatus is used for removing surface irregularities occurring on a peripheral portion (a bevel portion, an edge portion, and a notch) of a substrate, such as a semiconductor wafer, and films deposited as a contaminant on the peripheral portion of such a substrate. The substrate processing apparatus includes an edge-portion polisher for pressing a polishing tape against an edge portion of a substrate and causing relative movement between the polishing tape and the substrate to polish the edge portion of the substrate, and a bevel-portion polisher for pressing a polishing tape against a bevel portion of the substrate and causing relative movement between this polishing tape and the substrate to polish the bevel portion of the substrate.
    Type: Grant
    Filed: January 28, 2004
    Date of Patent: June 27, 2006
    Assignees: Ebara Corporation, Kabushiki Kaisha Toshiba
    Inventors: Masayuki Nakanishi, You Ishii, Kenro Nakamura
  • Patent number: 7052380
    Abstract: A sanding station for a belt sanding machine includes at least an endless sanding belt guided over deflection rollers and a pressure segment belt circulating within the sanding belt for pressing the sanding belt against the workpiece. The running direction of the pressure segment belt is oriented transversely to the running direction of the sanding belt.
    Type: Grant
    Filed: August 7, 2004
    Date of Patent: May 30, 2006
    Inventor: Georg Weber
  • Patent number: 7033245
    Abstract: A lapping apparatus lapping a work having a pre-machined surface comprises a lapping film which includes a thin substrate having a surface provided with abrasive grains, a shoe disposed at a back surface side of the lapping film, a shoe driving unit which drives the shoe toward the work in order to press the abrasive-grained surface of the lapping film to the pre-machined surface of the work, a rotational driving unit which drives the work rotationally, a detecting unit which detects the position of the rotating work in the rotating direction, and a controlling unit which controls the pressing force of the shoe driving unit so as to drive the shoe correspondingly to the position of the work in the rotating direction during machining.
    Type: Grant
    Filed: February 10, 2004
    Date of Patent: April 25, 2006
    Assignee: Nissan Motor Co., Ltd.
    Inventors: Kiyoshi Hasegawa, Masahiko Iizumi, Masahiro Omata, Takashi Ogino, Tomohiro Kondo, Kazuo Takeda, Takafumi Watanabe, Yoshiyuki Chida, Yasushi Matsushita
  • Patent number: 7025660
    Abstract: A method and assembly for generating a hydrodynamic air bearing is described, wherein at least one rotor is rotated to force air through channels defined in a platen located adjacent to a linear belt and the forced air is directed to the linear belt. The method includes rotating at least one rotor with a motor such that the rotor forces air through channels defined in a platen, and the air is directed toward a linear belt. The assembly includes a housing in which a platen, rotors, and a bearing plate are located.
    Type: Grant
    Filed: August 15, 2003
    Date of Patent: April 11, 2006
    Assignee: Lam Research Corporation
    Inventors: Travis R. Taylor, Carsten Mehring
  • Patent number: 7018276
    Abstract: An air platen assembly is described and includes a platen that has a plurality of concentric rings. Each of the rings has a plurality of openings in order to provide a cushion of air to a CMP belt. At least one of the rings extends beyond an outer edge of a wafer to be planarized by the CMP belt. A support is attached with the platen and has a plurality of air ports for pressurized air to pass to the rings of the platen. A gasket is positioned between the support and the platen and has a plurality of cutouts that align with the openings and the air ports. A base is also included and supports the support.
    Type: Grant
    Filed: June 25, 2004
    Date of Patent: March 28, 2006
    Assignee: Lam Research Corporation
    Inventors: Anthony de la Llera, Xuyen Pham, Cangshan Xu, David Wei, Tony Luong
  • Patent number: 7014529
    Abstract: A substrate processing apparatus polishes a to-be-polished portion of a semiconductor substrate with a polishing tape. Part of the polishing tape is heated in advance. Part of the polishing tape is deformed conforming to a shape of the to-be-polished portion. Part of the deformed polishing tape is brought into contact with the to-be-polished portion of the substrate. The substrate and polishing tape are moved relative to each other.
    Type: Grant
    Filed: January 18, 2005
    Date of Patent: March 21, 2006
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Takeo Kubota, Atsushi Shigeta, Gen Toyota