Abstract: A grinding machine has an abrasive wheel mounted on a spindle carried by a wheelhead which provides for movement in a direction perpendicular to the spindle. A pair of workheads are separately mounted on workslides and cross slides so that the workheads may be moved along an X-axis or a Y-axis as required to bring chucks of the workheads into grinding position. Sliding movement of the workslides and cross slides is produced by ball screws powered by servo motors and mounted on bearing housings, with the ball screws propelling ball nuts connected to the slides. The machine uses CNC computerized controls, with each of the workheads having a separate and independent control. This enables attainment of a high degree of precision.

Abstract: A substrate carrier having a deformable surface for receiving a substrate. Non annular pressure application zones apply pressure to the deformable surface, and addressable transducers within the pressure application zones receive a signal and applying a selectable amount of pressure in response to the signal. In this manner, the amount of pressure provided by the substrate carrier differs from one portion of the substrate to another in a selectable manner. Thus, the pressure applied to the substrate can be tailored to the non uniform thickness of the layer that is being thinned. In other words, portions of the substrate where the layer is thicker can be pressed upon with a greater force by the substrate carrier, thus urging the substrate more forcefully into the polishing pad in those portions, and thereby removing material from the layer at a greater rate of speed in those portions.

Abstract: A carrier head is provided that improves the pressure uniformity of a semiconductor wafer against the polishing pad in chemical mechanical polishing (CMP). The carrier head includes a carrier, a carrier film, and a guide ring. The objective of CMP is to provide planarization of the surface of a semiconductor wafer by uniformly removing material. One embodiment of the invention uses independent adjusting screws threaded in the carrier to provide uniform wafer pressure and lengthen guide ring life. The adjusting screws are threaded internally to accept holding screws attached to the guide ring using a backing. This facilitates variation in the spacing between the carrier and guide ring at each adjusting screw. A locking nut on each adjusting screw is used to maintain each gap setting. This embodiment eliminates the need for shims and the associated trial-and-error set-up time in selecting shims. In addition, compensating for guide ring wear can be easily performed without disassembling the carrier head.

Abstract: An method and apparatus for forming wafers of varying thickness'. The apparatus includes a template. The template is formed of a main disk including a plurality of cavities extending into a first side thereof. Each cavity has notches cut in the walls thereof and a pattern etched in the base thereof. Holding disks are moistened and positioned within respective cavities for releasably securing a wafer in the cavity. A moistening liquid is dispensed and diffuses into the cavities via the notches cut in the walls and collects in the pattern etched on the base of the cavity thereby increasing the suctional force used to secure the holding disk. When the template is releasably secured within a cavity, rotatably connected to a rotating head and positioned such that the first side faces a lapping and polishing surface, wafers received by the cavities are lapped and polished upon rotation of the rotating head.

Abstract: An apparatus (100) and method are provided for polishing a substrate (105) that achieves a high-planarization uniformity. In one embodiment, the apparatus (100) includes a subcarrier (165) with a lower surface (170), a flexible member (245) extending across the lower surface, and a control-insert (280) disposed between the flexible member and the lower surface. The flexible member (245) has a surface adapted to press the substrate against a polishing pad. The control-insert (280) inhibits non-planar polishing by providing a variable removal rate across the substrate surface. The control-insert (245) can be an annular ring (280A) located near an outer edge of the flexible member (245) to control the removal rate near an edge of the substrate (105), or a disk (280B) near a center (290) of the flexible member to control the removal rate near a center of the substrate. The removal rate can be further controlled by varying a cross-sectional thickness of the control-insert (245).

Abstract: The present invention has an object to provide a retention plate used in a polishing device that mirror polishes semiconductor substrates such as silicon wafers, particularly a retention plate used with the hard chuck method, that can prevent roll-off, and can achieve a high improvement in flatness. According to the present invention, by means of using a retention plate of a constitution that is of a smaller diameter than that of the wafer and which gives a region in which the area of contact with the wafer is reduced by means of groove processing, or a porous structure and the like, on the outer peripheral part, a reduction of the processing pressure of the outer peripheral part becomes possible, and, because the polishing of the region in which roll-off occurs is delayed, the amount removed by polishing becomes uniform over the wafer surface, and high precision wafer processing becomes possible.

Abstract: A chuck means for flat workpieces, in particular semi-conductor wafer for the chemical-mechanical polishing, comprising a circular housing which is attached to a driving spindle for rotation therewith and has a top wall and an annular side wall, a retaining ring which forms the lower part of the side wall, a chuck plate of rigid, however elastically deformable material which has an upper and a lower side and a plurality of openings at the lower side as well which openings are in connection with radial and axial parallel passages in the chuck plate, the passages being in fluid connection with an axial passage in the spindle, the axial passage being connected to a vacuum and/or fluid source, the chuck plate being floatingly and vertically movably located in the housing, a plurality of pressure chambers above the chuck plate, the pressure chambers having lower wall portions which are yieldable and engage the upper side of the chuck plate, pressure manifold means which are connected with a fluid source under pres

Abstract: Planarizing machines, carrier heads for planarizing machines and methods for planarizing microelectronic-device substrate assemblies in mechanical or chemical-mechanical planarizing processes. In one embodiment of the invention, a carrier head includes a backing plate, a bladder attached to the backing plate, and a retaining ring extending around the backing plate. The backing plate has a perimeter edge, a first surface, and a second surface opposite the first surface. The second surface of the backing plate can have a perimeter region extending inwardly from the perimeter edge and an interior region extending inwardly from the perimeter region. The perimeter region, for example, can have a curved section extending inwardly from the perimeter edge of the backing plate or from a flat rim at the perimeter edge. The curved section can curve toward and/or away from the first surface to influence the edge pressure exerted against the substrate assembly during planarization.

Abstract: A polishing head with a floating knife-edge mechanism includes a base, a retaining ring secured to the base defining a pocket area beneath the base, and a lower assembly floating within the pocket area via a diaphragm seal. The lower assembly includes a disk-shaped support plate having a plurality of apertures distributed in a center region of the support plate, a clamp ring used to secure the diaphragm seal along a rim region of the support plate, and the floating knife-edge mechanism positioned between the rim region and the center region of the support plate.

Abstract: An apparatus and method for planarizing a substrate are provided. The apparatus (101) includes a subcarrier (354) having an outer surface (378) with an annular first membrane (376) coupled thereto. The first membrane (376) has a receiving surface (380) adapted to receive the substrate (356) thereon, and a lip (382) adapted to seal with a backside of the substrate to define a first chamber (384) therebetween. A second membrane (386) positioned above the first membrane (376), and coupled to the subcarrier (354) defines a second chamber (388). During a polishing operation pressurized fluid introduced into the second chamber (388) causes it to expand outward to exert a force on a portion of the backside of the substrate (356), thereby pressing a predetermined area (392) of the surface of the substrate against the polishing pad. The predetermined area (392) is directly proportional to the pressure of the fluid introduced into the second chamber (388).

Abstract: A drum slicing apparatus is capable of highly accurately and efficiently slicing a drum made of a thin metal sheet which is relatively highly flexible. The drum slicing apparatus has a support shaft rotatable about its own axis, a cylindrical drum holder supported on the support shaft for holding the drum by pressing engagement with an inner circumferential surface of the drum over an entire length thereof, and a slicing device having slicing edges for slicing the drum into the metal rings by engaging and cutting into the drum at predetermined cutting positions thereon while the drum is being rotated by the support shaft through the drum holder.

Abstract: An apparatus for performing semiconductor planarizing operations is disclosed. In an exemplary embodiment, the apparatus includes a carrier assembly for maintaining a workpiece therein in a face up orientation. A roller assembly includes a first cylindrical roller and a cylindrical second roller, the first and second rollers being linked to one another through a pair of arms. Each of the first and second rollers may be independently positioned with respect to a horizontal plane, the horizontal plane being substantially parallel to a top surface of the workpiece.

Abstract: A method and apparatus for forming wafers of varying thickness'. The apparatus includes a template. The template is formed of a main disk including a plurality of cavities extending into a first side thereof and a backing plate positioned on a side of the main disk opposite the first side. Holding disks are moistened and positioned within respective cavities for releasably securing a wafer in the cavity. When the template is releasably secured to and rotatable with a rotating head and positioned such that the first side faces a lapping and polishing surface, wafers received by the cavities are lapped and polished upon rotation of the rotating head. A plurality of shims are selectively received within respective cavities between a base of the cavity and the holding disk for adjusting a depth of the cavity thereby adjusting an amount of a wafer to be lapped and polished. The shims have varying thickness' and are color coated, each color being representative of a predetermined thickness for the shim.

Abstract: A material with a mesh of fibers and a binder material holding the fibers in the mesh can be used on a carrier head or a polishing pad. A polishing apparatus can include a pad cleaner with nozzles to direct jets of cleaning fluid onto the polishing pad and a brush to agitate a surface of the polishing pad.

Abstract: A chemical mechanical planarization (CMP) system having a polishing pad, a carrier plate and a wafer plate is provided with an active gimbal. The active gimbal is defined by a circular hollow ring having a wall thickness and a diameter. The circular hollow ring is configured by an elastomeric material for placement in a space between the carrier plate and the wafer plate, and the space preferably is defined in part by a cavity tightly receiving the ring. The circular hollow ring is filled with a gel-like material that flows from one portion of the ring that is squeezed and deformed when the wafer plate tilts relative to the carrier plate. The flow is to another portion of the ring that returns to an original configuration during such tilting. Methods of making the gimbal include operations for selecting materials for the hollow ring and the gel-like material.

Abstract: A method for controlling a process in a multi-zonal processing apparatus and specifically for determining the optimum values to set for processing parameters J(Zi) in each of the zones of that apparatus includes processing a test work piece in the apparatus with initial values Jl(Zi) of the parameters in each zone i to achieve a process result Ql(x). Then a process result Qf(x) to be expected from incremental changes in the parameters to values Jf(x) is calculated. The expected process results Qf(x) are related to the initial process results Ql(x) by the relationship: Qf(x)=Ql(x)*Jf(x)/Jl(x). After determining optimum values of J(Zi) to reduce the difference between the expected process result and a target process result, a work piece is processed through the process apparatus using those optimum values of J(Zi).

Abstract: A polishing head for holding a wafer during a polishing process without the edge-effect or the edge peeling defect and a method for improving edge profile on a wafer during a polishing process are described. The polishing head is constructed by a carrier head, a retaining ring, and at least three piezoelectric actuator/sensors mounted in-between a recessed peripheral edge portion of the carrier head and a top surface of the retaining ring.

Abstract: A polishing head of a polishing apparatus of this invention has a structure in which an air blast port is formed in a lower surface of a carrier 20, and an upper outer peripheral portion 24 of the carrier is so formed as to protrude in a diametric direction, and is placed on a retainer ring 30 to thereby form a seal portion 25. The retainer ring clamps a peripheral edge of a rubber sheet in such a form as to cover the carrier. Consequently, an air chamber 61 is formed between the carrier lower surface and the rubber sheet, and an air pressure of this air chamber pushes a wafer W to a polishing cloth 2.

Abstract: The wafer polishing apparatus enables the control of proper polishing pressure, so that the quality of wafers can be maintained high. A wafer holding head is composed of a carrier for pressing the wafer against a polishing pad, a retainer ring at the circumference of the carrier, and a holding head body. The holding head body includes a carrier pressing device having an air bag of which pressing surface area is 50% or smaller of the area of the wafer, and the pressing force from the carrier pressing device is transmitted to the carrier.

Abstract: The invention provides a process apparatus including a wafer holder, and a process method, in which high planarization performance, scratch free process, narrow edge exclusion and high uniformity can be maintained for more than 10,000 processed wafers. The invention is achieved by providing a unit for keeping a retainer and surface of a polishing wheel non-contact with each other and controlling the gap within a certain range and by setting compression strength of the retainer at more than 3,000 kg/cm2.

Abstract: A system and method for chemically and mechanically polishing surfaces of semiconductor wafers utilizes multiple polishing pads having diameters that are smaller than the diameter of the wafers to simultaneously polish a given semiconductor wafer. The use of these smaller-sized polishing pads can significantly reduce the footprint of the system. Furthermore, the simultaneous polishing of the wafers by the multiple smaller-sized polishing pads can significantly increase the throughput for short period planarization. In addition, by independently controlling the lateral movement, the vertical movement and the rotational speed of each of the polishing pads during polishing, the system and method can more precisely control the amount of polishing at different regions of a wafer surface.

Abstract: A circular or non-circular workpiece is ground in a plurality of grinding steps, including a final finish grinding step. A grinding wheel is caused to effect profile generation movement in synchronism with rotation of the workpiece and in accordance with profile data derived from the target shape of the workpiece. In each grinding step, the grinding wheel is advanced in such a manner that the grinding wheel causes cut-in movement within a predetermined cut-in angle defined on the workpiece. After completion of the final finish grinding step, the grinding wheel is retracted over a predetermined back-off angle defined on the workpiece. The retraction is effected in accordance with composite data obtained through combining the profile data and back-off data. The back-off angle is greater than the cut-in angle employed during the final finish grinding step.

Abstract: A housing and hub for an apparatus for securing a workpiece to a rotatable machine member are provided. The machine may include a lathe. The workpiece includes a rotor such a brake rotor. The apparatus includes a hub slidably engageable with a rotatable driven shaft of the lathe. The hub is formed with a first banded channel. Also included is a centering device axially positionable on the shaft. A spring having a distal end demountably insertable in the hub, and a proximal end connectable to the centering device, is included. The apparatus also includes a retaining ring attachable to the hub for retaining the centering device in the hub. A housing is provided that is freely movable axially on the shaft for securing the rotor substantially vertically on the shaft. The housing is formed with a second banded channel. A locking nut is included to secure the components of the apparatus on a machine member.

Abstract: An abrading machine and abrading method are provided which permit a workpiece to be abraded without damage even in the case of heavy stock removal. A work holding member for mechanical abrasion includes a first holding member with a hole for receiving a workpiece and which transmits external drive force to the workpiece, and a second holding member placed on the first holding member and also having a hole for receiving the workpiece. The second holding member is removed after a predetermined volume of stock is abraded away; the workpiece is then abraded to a target thickness while being held by the first holding member alone. Thicknesses t1 and t2 of the first and second holding members are given by T1>t1+t2 and (½)T2≦t1, where T1 and T2 represent the workpiece thickness before and after abrasion, respectively.

Abstract: A mill blank assembly for making a dental prosthesis includes a milling section and a support section. The support section is adapted to fit in a chuck or collet of a milling machine. One of the milling section and the support section includes a projection that extends into a recess of the other, in order to enhance the strength of the bond between the milling section and the support section. As a result, the completed assembly is less likely to fracture or become disassembled during the milling process.

Abstract: A carrier head has a backing assembly with a substrate support surface, a housing connectable to a drive shaft to rotate with the drive shaft about a rotation axis, and a dampening material in a load path between the backing assembly and the housing. The dampening material reduces transmission of vibrations from the backing assembly to the housing.

Abstract: A work piece carrier head for a CMP or other polishing apparatus is configured to eliminate the slow band associated with the polishing of the surface of a work piece. The carrier head includes a wear ring that is positioned circumferentially about the work piece and that together with the work piece is pressed against a moving polishing pad. The wear ring is resiliently coupled to the body of the carrier head in a manner to avoid any overturning moment on the ring caused by the frictional force of the polishing pad against the wear ring.

Abstract: A polisher head backing film that resists slipping relative to a backing plate. In one embodiment, a polisher head backing film/backing plate assembly is provided. The backing film/backing plate assembly includes a backing film with a hole pattern as well as holding pins that protrudes from one of the film's surfaces. The backing film/backing plate assembly also includes a backing plate that has a corresponding hole pattern and receiving holes such that the hole patterns on the backing film and backing plate can be aligned. The receiving holes can receive the holding pins of the backing film such that when the hole patterns are aligned, the holding pins and the receiving holes are also aligned. The holding pins can thus be inserted into the receiving holes upon alignment such that the backing film is prevented from moving relative to the backing plate once the holding pins are properly inserted.

Abstract: The present invention provides a polishing head, for use with a polishing apparatus. In one embodiment, the polishing head includes a carrier head assembly, and a retaining ring having a surface positionable adjacent a polishing pad and couplable to the carrier head assembly and configured to retain a semiconductor wafer therein, the retaining ring having a slurry conduit located therethrough to provide a flow of slurry to the polishing pad.

Abstract: A polishing apparatus (100) and method for polishing and planarizing a substrate (105) is provided that achieves a high-planarization uniformity across the substrate, while providing a more efficient use of slurry. In one embodiment, the apparatus (100) includes a subcarrier (160) with a flexible member (185) attached to a lower surface (165) of it on which the substrate is held. The flexible member (185) has at least one hole (195) therein so that a pressurized fluid introduced between the flexible member and the subcarrier (160) directly presses the substrate (105) against a polishing surface (125) during operation. The number and size of the holes (195) are selected to provide sufficient friction between the flexible member (185) and the substrate (105) to cause it to rotate when a drive mechanism rotates the subcarrier (160).

Abstract: An apparatus for manufacturing a semiconductor device includes a rotatable spindle, a head detachably connected to the spindle, and a clamp for clamping outer circumferential surfaces of the spindle and the head to one another so that the head may be driven by the spindle. The clamp has an annular clamping frame sized to encircle the outer circumferential surfaces of the spindle and the head, a projection disposed on one end of the clamping frame, a lever pivotally connected to the other end of the clamping frame, and a fastener pivotally connected to the lever and configured to hook over the projection. Once the fastener is hooked over the projection, the lever is pivoted to force the ends of the annular clamping frame together and thereby produce a clamping force that secures the spindle and head to one another. The clamp can be manipulated easily and with a simple motion to clamp the head to the spindle. Also, the parts of the clamp generate little mechanical friction.

Abstract: A polishing apparatus which attaches the semi-conductor wafers 5 to the polishing plate 4 for performing the polishing as applying pressure the polishing cloth with the semi-conductor wafers, is provided with a guide ring 7 disposed outside of the polishing plate for pressing the polishing cloth separately from the polishing plate, a retainer ring 8 provided at the lower end of the guide ring for contacting the polishing cloth, and a weight 9 detachably mounted on the upper surface of the guide ring for adjusting the pressure to the polishing cloth.

Abstract: A carrier head for a chemical mechanical polishing system includes a substrate sensing mechanism. The carrier head includes a base and a flexible member connected to the base to define a chamber. A lower surface of the flexible member provides a substrate receiving surface. The substrate sensing mechanism includes a sensor to measure a pressure in the chamber and generate an output signal representative thereof, and a processor configured to indicate whether the substrate is attached to the substrate receiving surface in response to the output signal.

Abstract: A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane with a lip portion to engage a substrate to form a seal for improved vacuum-chucking.

Abstract: A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane, the lower surface of which provides a substrate-receiving surface. The carrier head may include a projection which contacts an upper surface of the flexible membrane to apply an increased load to a potentially underpolished region of a substrate. Fluid jets may be used for the same purpose.

Abstract: The present invention provides an improved planarization or polishing apparatus for chemical mechanical planarization and other types of polishing such as metal polishing and optical polishing. In an exemplary embodiment, an apparatus for polishing an object comprises a pad having a polishing surface to be placed on a target surface of the object to be polished. A pad drive member is connected to the pad to move the pad relative to the object to change a position of the polishing surface of the pad on the target surface of the object. A drive support is movably coupled with the pad drive member to support the pad drive member for rotation relative to the drive support around a pivot point which is disposed substantially on the target surface of the object during polishing.

Abstract: In one aspect, the invention provides a method for planarizing a circular disc-type semiconductor wafer or other substrate. The method includes the steps of pressing a retaining ring surrounding the wafer against a polishing pad at a first pressure; pressing a first peripheral edge portion of the wafer against the polishing pad with a second pressure; and pressing a second portion of the wafer interior to the peripheral edge portion against the polishing pad with a third pressure. The second pressure may be provided through a mechanical member in contact with the peripheral edge portion; and the second pressure may be a pneumatic pressure against a backside surface of the wafer. Desirably, the pneumatic pressure is exerted through a resilient membrane, or is exerted by gas pressing directly against at least a portion of the wafer backside surface.

Abstract: A chemical mechanical polishing apparatus polishes the surface of a substrate to remove material therefrom. The apparatus includes a carrier, which positions the substrate against the rotating polishing pad. The carrier includes an integral loading member therein, which controls the load force of the substrate against the polishing pad. Multiple substrates may be simultaneously polished on a single rotating polishing pad, and the polishing pad may be rotationally oscillated to reduce the likelihood that any contaminants are transferred from one substrate to another along the polishing pad. A multi-lobed groove in the polishing pad may be used, in conjunction with a moving substrate, to polish the surface of the substrate.

Abstract: A wafer mounting plate for use in a polishing apparatus is disclosed. The wafer mounting plate includes a metal plate and a screen mounted to a top surface of the metal plate. The metal plate is normally formed of circular shape and provided with a plurality of vacuum passageways therethrough. The metal plate has a bottom surface for engaging a membrane member and a wafer by vacuum through the plurality of vacuum passageways, and a top surface for engaging a pressurizing means, such as a pneumatic gasket. The screen mounted to the top surface of the metal plate has a multiplicity of apertures each of a size not larger than 0.5 mm in diameter. The screen is mounted sandwiched between the top surface of the metal plate and the pressurizing means. The screen effectively prevents debris of a wafer breakage from entering a vacuum system that is used for holding the wafer on the wafer mounting plate.

Abstract: An improved chuck for supporting elongated work pieces having conical end portions, such as single crystal ingots used to fabricate semiconductor wafers, while such. The chuck is typically used in a lathe for positioning and allowing rotation of the work piece during a grinding procedure that results in optimal work piece diameter. The chuck comprises a ring-shaped base, or socket, having a cavity defining a central axis therethrough and a series of fastener holes for securing the base to a headstock or tailstock of a lathe. The base receives within the cavity a portion of a chuck insert. The chuck insert defines a work piece support surface that is coaxial with the central axis when the chuck insert is disposed in a nominal position within the cavity of the base. The work piece support surface will typically define a continuous, arcuate, convex surface capable of supporting work pieces having conical end portions of varying diameters.

Abstract: A lightweight, carrier for wafer-like objects, including semiconductor wafers, is provided. The carrier may be used to secure and position a wafer during various polishing processes. The improved design of the lightweight carrier includes a relatively high number of ribs and an annular flange having an annular protrusion to provide uniform load onto the wafer during polishing operations. The relatively lower weight of the carrier facilitate manual loading and unloading of it (the carrier) into and from the polishing machine.

Abstract: A carrier head with a housing, a lower flexible membrane that defines a first chamber, an upper flexible membrane that defines a second chamber, and a pressure distribution assembly positioned between the upper flexible membrane and the lower flexible membrane. A lower surface of the lower flexible membrane provides a substrate mounting surface, and a portion of the upper flexible membrane can be biasable into contact with an upper surface of the lower flexible membrane. The pressure distribution assembly can include an upper surface in contact with the upper flexible membrane and a lower surface in contact with the lower flexible membrane. The pressure distribution assembly can be configured to transfer pressure from a portion of the upper flexible membrane to a more concentrated region of the substrate.

Abstract: A wafer polishing head utilizes a wafer backing member having a wafer facing pocket which is sealed against the wafer and is pressurized with air or other fluid to provide a uniform force distribution pattern across the width of the wafer inside an edge seal feature at the perimeter of the wafer to urge (or press) the wafer uniformly toward a polishing pad. Wafer polishing is carried out uniformly without variations in the amount of wafer material across the usable area of the wafer. A frictional force between the seal feature of the backing member and the surface of the wafer transfers rotational movement of the head to the wafer during polishing. A pressure controlled bellows supports and presses the wafer backing member toward the polishing pad and accommodates any dimensional variation between the polishing head and the polishing pad as the polishing head is moved relative to the polishing pad.

Abstract: An improved system and method for automated fiber polishing overcomes the limitations of conventional systems and methods. In particular, the present invention provides for continuous determination of the quality of the polish during a polishing procedure. An optical signal is transmitted to a fiber tip, and any back-reflected signal is detected and monitored to determine polish quality. In this manner, automated polishing quality assurance is provided in real time.

Abstract: Disclosed is a polishing head of a chemical and mechanical polishing apparatus uniformly polishing a wafer. The polishing head has a body defining at least one air passage therein through which air is introduced into and exhausted from the polishing head. The body is movable upward and downward. An air pressure distributing member is mounted to a lower portion of the body for distributing a pressure of the air supplied through the air passage. A membrane is mounted to enclose a lower surface of the air pressure distributing member so as to be expanded and shrunk by the pressure of the air supplied through the air pressure distributing member. A surface of the air pressure distributing member makes contact with a back surface of a wafer. An air pressure compensating member makes uniformly the pressure that is applied to central and edge portions of the wafer which makes contact with the membrane.

Abstract: In the wafer polishing device, a retainer ring can be attached and detached with ease. Under a retainer ring attaching part disposed on a head body, a retainer ring is attached with a snap ring. The snap ring is divided into two. An upper projection part and a lower projection part are formed on the inner periphery of the snap ring. The upper projection part is fitted to an upper groove formed on the outer periphery of the retainer ring attaching part, and the lower projection part is fitted to a lower groove formed on the outer periphery of the retainer ring. In attachment, the retainer ring is connected to the lower part of the retainer ring attaching part, and the snap ring is placed on the outer periphery of the joint.

Abstract: A pair of edge polishing members (13a, 13b) each having a recess arcked working surface (22) are located on both sides of a diameter direction of a circular plate-shaped work (1) which is held by a chuck means (12) and is rotatable therewith, with the axes of the respective polishing members being inclined with respect to the axis (L) of the work (1), in a manner such that the working surface (22) of one edge polishing member (13a) gets in contact with the edge portion (2a) on the front side of the work (1), while the working surface (22) of the other edge polishing member (13b) gets in contact with the edge portion (2b) on the back side of the work (1), thereby polishing the two edge portions (2a, 2b).

Abstract: A compressible film that is detachably securable to a surface of a rigid structure in the carrier head. The compressible film has a plurality of apertures positioned to create a non-uniform pressure distribution on a substrate during polishing so as to improve polishing uniformity. The apertures may be spaced and positioned to provide a pressure distribution on the substrate that is locally uniform but globally non-uniform.

Abstract: A chemical mechanical polishing (CMP) machine (20) includes a workpiece carrier assembly (22) having a carrier base (24) with a workpiece contacting side (26) for holding a first surface (30) of a workpiece (32). A method utilizing the CMP machine (20) to polish the workpiece (32) and achieve a minimal edge exclusion region (92) entails adapting the carrier base (24) to reduce a first diameter (53) of a workpiece contacting side (26) of the carrier base (24) to a second diameter (84). The method further calls for providing a retainer ring (68, 106) disposed concentrically on the carrier base (24) for retaining the workpiece (32), and applying pressure on the carrier base (24) to urge a second surface (34) of the workpiece (36) against a polishing pad (36) of the CMP machine (20).

Abstract: A wafer holding plate for a wafer grinding apparatus. The plate includes a substrate having a wafer adhering surface to which a semiconductor wafer is adhered by an adhesive. The wafer adhering surface includes a mirror-like surface portion and a groove pattern, which anchors the adhesive. When the plate is used for grinding wafers, the quality and accuracy of the finished wafers is greatly improved.