Abstract: A lens edger which is capable of measuring the curvature of an eyeglass lens is disclosed. The lens edger includes a carriage which rotatably fixes a pair of lens fixing shafts and moves the position of the lens fixing shafts clamping a lens to be processed; a lens rotation motor for rotating the lens fixing shafts; a carriage driving means for moving the carriage; and an apparatus for measuring a curvature of the lens.

Abstract: Technology of making freestanding gallium nitride (GaN) wafers has been matured at length. Gallium nitride is rigid but fragile. Chamfering of a periphery of a GaN wafer is difficult. At present edges are chamfered by a rotary whetstone of gross granules with weak pressure. Minimum roughness of the chamfered edges is still about Ra 10 ?m to Ra 6 ?m. The large edge roughness causes scratches, cracks, splits or breaks in transferring process or wafer process. A wafer of the present invention is bevelled by fixing the wafer to a chuck of a rotor, bringing an edge of the wafer into contact with an elastic whetting material having a soft matrix and granules implanted on the soft matrix, rotating the wafer and feeding the whetting material. Favorably, several times of chamfering edges by changing the whetting materials of smaller granules are given to the wafer. The chamfering can realize small roughness of Ra 10 nm and Ra 5 ?m at edges of wafers.

Abstract: The present invention relates to several embodiments of tools for finishing stone particularly stone tiles. The first embodiment is a production table on which a plurality of tiles can be secured within a cabinet so a worker may finish and polish the edges of the aligned tiles to produce a desired profile. Another embodiment of the invention relates to a modification of a standard tile saw in which any auxiliary carriage table is securable to the conveyer. The auxiliary table has an adjustable fence for precisely positioning a tile to be polished. The saw blade is replaced with an arbor to which a replaceable polishing ring can be secured. The rings are plastic having an abrasive surface defining various profiles and are provided in various grits. The tile is advanced by the table to bring the edge of the tile into engagement with the periphery of the ring to polish and profile the tile.

Abstract: An apparatus for cleaning a semiconductor wafer edge is provided. The apparatus includes a film with an abrasive layer configured to contact the edge surface of a semiconductor substrate coated with a contaminant residue layer. A first reel having the film wound thereon and a second reel for receiving the film fed from the first reel are included. In one embodiment, a third reel configured to force the abrasive layer of the film against the edge surface of the semiconductor substrate so as to create an area of contact between the abrasive layer and the edge surface of the semiconductor substrate; and a pin that protrudes from to the top surface of the third reel. A system and method for cleaning a semiconductor wafer edge are also provided.

Abstract: Disclosed is a device for grinding a liquid crystal display panel improving the efficiency of using equipment by independently operating first and second grinding units for grinding the unit liquid crystal display panel. The present invention includes a first grinding unit grinding edges of short or long sides of the unit liquid crystal display panel in a normal mode and a second grinding unit grinding the edges of the short or long sides of the unit liquid crystal display panel that are not ground by the first grinding unit in the normal mode or grinding the edges of the long and short sides of the unit liquid crystal display panel in an emergency mode.

Abstract: A polishing apparatus includes a polishing jig. The polishing jig includes an elastic balloon member, a fixture, and a fluid supply portion. The fixture airtightly closes the rear opening portion of the balloon member. The fluid supply portion supplies a fluid into a space formed by the fixture and balloon member. The balloon member has a cup shape constructed by a dome portion and a cylinder portion extending backward from the outer periphery of the dome portion. The fixture fixes the opening portion of the cylinder portion of the balloon member.

Abstract: An apparatus for treating edge surfaces of panels, comprises conveyor tables to displace panels in sequence, two of the conveyor tables being configured such that panels are sequentially displaced in longitudinal alignment between the two conveyor tables with a longitudinal edge first. Two other of the conveyor tables are configured such that panels are sequentially displaced in lateral alignment between the two other conveyor tables with a lateral edge first. A first tool is positioned between the two conveyor tables. A second tool is positioned between the two other conveyor tables.

Abstract: Disclosed is a grinding table apparatus for a liquid crystal display panel and a grinder using the adapt to various sizes of unit liquid crystal display panels for grinding edges of the corresponding liquid crystal display panel by adjusting a variable moving distance of the grinding tables instead of replacing the previous grinding table. The present invention includes at least two grinding tables displaced in a direction making the grinding tables get farther from or closer to each other to adapt to the size of the unit liquid crystal display panel to grind edges of the unit liquid crystal display panel.

Abstract: An apparatus and method are described herein which help prevent particles and other contaminants that are generated when an edge of a glass sheet is processed from contaminating or damaging the glass sheet. The apparatus includes an encapsulation device and a processing device. The encapsulation device is capable of supporting two surfaces of a glass sheet. And, the processing device is capable of processing (e.g., cutting, scribing, grinding or polishing) the edge that is adjacent to the supported two surfaces of the glass sheet which are located on a first side of the encapsulation device. The encapsulation device is also capable of substantially preventing particles and other contaminants that are generated when the processing device processes the edge of the glass sheet from reaching the two surfaces of the glass sheet which are located on a second side of the encapsulation device.

Abstract: An apparatus and method are described herein which help prevent particles and other contaminants that are generated when an edge of a glass sheet is processed from contaminating or damaging the glass sheet. The apparatus includes an encapsulation device and a processing device. The encapsulation device is capable of supporting two surfaces of a glass sheet. And, the processing device is capable of processing (e.g., cutting, scribing, grinding or polishing) the edge that is adjacent to the supported two surfaces of the glass sheet which are located on a first side of the encapsulation device. The encapsulation device is also capable of substantially preventing particles and other contaminants that are generated when the processing device processes the edge of the glass sheet from reaching the two surfaces of the glass sheet which are located on a second side of the encapsulation device.

Abstract: A glass grinding bit includes a monolithic plastic body having a first end, a second end and a central longitudinal axis. A central bore formed as part of the body in alignment with the longitudinal axis for receiving a drive shaft. An outer surface is formed as part of the body in alignment with the longitudinal axis and in concentric relationship with the central bore. A grinding sleeve has an inner surface in permanent interfacial contact with the body outer surface and an abrasive outer grinding surface. A threaded bore in the body extends transversely from the body outer surface to the central bore. A set screw in the transverse bore allows the grinding bit to be secured to a drive shaft.

Abstract: A method for processing a first optical face and a second optical face of a lens, where a lens blank is positioned and gripped by a gripping device relying on reference datum indications rendering it possible to obtain topographic orientation for processing both faces of the lens, and wherein not more then one reference datum indication extends on a face of the lens.

Abstract: A wafer bevel processing apparatus comprises a plurality of rollers for rotatably supporting a wafer, first process roller, a second process roller, and a process tape extending between the first process roller and the second process roller. The first and second process rollers are positioned to cause the process tape to contact an edge of the wafer when the wafer is loaded into the processing apparatus. The process tape is configured to frictionally prepare the edge where contact occurs with the process tape.

Abstract: In a semiconductor substrate having a notch in an edge portion thereof, each of the two shoulder portions of the notch is configured as an arc and the difference in curvature between the two shoulder portions of the notch is not less than 0 mm and not more than 0.1 mm.

Abstract: A tool for gripping ophthalmic lenses including a vacuum gripper, a shaft associated with said vacuum gripper, the shaft having two ends and being slidably attached at one end thereof to a support structure, a resilient member which biases the vacuum gripper in a direction away from said support structure and a locking member which locks the shaft in a desired position during a lens gripping operation. Another embodiment of the present invention includes a lens hold down mechanism for holding lenses in a lens tray. Another embodiment of the present invention includes an electronic communications scheme for a robotic manufacturing operation. Another embodiment of the present invention includes an ophthalmic lens manufacturing cell layout wherein ophthalmic edging machines have an opening that faces away from a robotic arm. Another embodiment of the present invention includes an arrangement for holding an ophthalmic edging machine within an ophthalmic manufacturing cell.

Abstract: There are disclosed a polishing method and a polishing device in which cleaning of a glass substrate surface can be achieved to a high level. A glass substrate (MD substrate 1) in the shape of a circular disc having a circular hole in a center portion is polished with an abrasive liquid 50 containing free abrasive grains being supplied, and an inner peripheral end surface of the glass substrate is polished using the abrasive liquid containing the free abrasive grains by rotating a rotary brush 4 or a polishing pad in contact with the inner peripheral end surface.

Abstract: In comparison with the prior art the present machine offers many important advantages. Concerning the practicalness, the working processes are simpler and there is less wear and tear in the movable parts. Concerning the construction, the present machine avoids the utilization of the conventional supporting units needed to permit an angular movement along a curved path. As is known, the said supporting units are complex and costly. The peculiarity of the present invention is that a head holding unit (1) comprises a plurality of motorized spindles provided with respective polishing tools or grinders (3) and is mounted at its two ends on fulcrum-type supports (4). In the present case, the supports (4) are horizontal shafts disposed on ball bearings.

Abstract: Systems and methods for beveling microfeature workpiece edges are disclosed. A system in accordance with one embodiment is configured to remove material from a microfeature workpiece having a first face, a second face facing opposite from the first face, an edge surface between the first and second faces, and an edge at a juncture between the edge surface and one of the first and second faces. The system can include a carrier positioned to carry the workpiece with the first and second faces generally normal to an axis, and a first polishing pad having a support surface and a polishing surface facing generally away from the support surface. The polishing surface can have a first shape with at least one portion oriented at an acute angle relative to the axis and the support surface to remove material from the edge of the workpiece.

Abstract: A slurry recycling apparatus having a first filter, a dirty side storage tank, slurry pump, second filter, clean side storage tank and slurry outlet, in which used slurry from an edge notch polishing apparatus is delivered to the first screen filter, transported to the dirty side slurry storage tank, pumped from the dirty side slurry storage tank through a second filter that filters out small particulate matter from the slurry and allows the slurry to pass to the clean side slurry storage tank, and finally to the edge notch polishing apparatus as needed. Slurry which is not immediately taken from the clean side slurry storage tank is continuously recycled through the second filter by overflowing from the clean side to the dirty side slurry storage tank where it is there pumped through the second filter back into the clean side slurry storage tank.

Abstract: An apparatus (1) for working a glass plate includes: a glass-plate working section (4) for working a glass plate (2) whose upper surface (3) is coated; and transporting means (6) for carrying into the glass-plate working section (4) the glass plate (2) to be worked and carrying it out from the glass-plate working section (4) after working, by imparting to a lower surface (5) thereof a moving force in an X direction parallel to the upper surface (3) and the lower surface (5) of the glass plate (2).

Abstract: The moving trajectory that a robot hand 16 depicts when chamfering a glass sheet G is a trajectory A that a center of rotation 01 of the robot hand 16 vertically moves along a straight line Q connecting between the center of rotation 01 of the robot hand 16 and a rotation 02 of a grinding wheel 30.

Abstract: Methods and systems are disclosed whereby the edges of a glass sheet may be beveled with minimal equipment down time. Preferably such methods and systems bevel the upper and lower edges along lateral sides of a glass sheet. In especially preferred embodiments, laterally separated pairs of upper and lower edge grinding assemblies are provided having respective upper and lower oppositely oriented tapered grinding wheels. A glass sheet may thus be moved in a generally horizontal conveyance direction between one of these pairs of upper and lower edge grinding assemblies so that respective upper or lower lateral edges of the glass sheet are brought into grinding contact therewith. Continually moving the glass sheet in the horizontal conveyance direction will therefore present the other lateral edge to the other pair of upper or lower edge grinding assemblies positioned downstream. As such, the other edge will then be beveled.

Abstract: The circumferential edges of glass or ceramic disks used in disk drive data storage devices are preferably finished by ductile grinding to produce an essentially fracture-free surface, which is not chemically strengthened. Preferably, the material is glass, and both the inner and outer edges of the disk are finished. Edge finishing is preferably achieved in a two-stage process, involving a coarse grind and a ductile grind, using air bearing spindles rotated at high speed for grinding wheels and workpiece. Preferably, the grinding wheels are shaped to provide a radius at the juncture of the circumferential edges and flat disk surfaces.

Abstract: A new technical advancement in the field of precision aluminum optics permits high quality optical polishing of aluminum monolith, which, in the field of optics, offers numerous benefits because of its machinability, lightweight, and low cost. This invention combines diamond turning and conventional polishing along with india ink, a newly adopted material, for the polishing to accomplish a significant improvement in surface precision of aluminum monolith for optical purposes. This invention guarantees the precise optical polishing of typical bare aluminum monolith to surface roughness of less than about 30 angstroms rms and preferably about 5 angstroms rms while maintaining a surface figure accuracy in terms of surface figure error of not more than one-fifteenth of wave peak-to-valley.

Abstract: Provided are a novel edge polished wafer in which a wafer peripheral sag is suppressed, a polishing cloth, a polishing apparatus and a polishing method for processing the wafer. The wafer is provided by controlling an over-polish width in edge polishing to 400 ?m or less. Also, the polishing cloth has a multi-layer structure of at least two layers including a polishing fabric layer an Asker C hardness of which is 65 or higher and a sponge layer an Asker C hardness of which is 40 or lower, or a single layer structure of the polishing fabric layer. Further, the polishing apparatus and the polishing method are provided by edge polishing such that the wafer in rotation is put into contact with a rotary drum having the polishing cloth adhered thereon at a prescribed angle thereto while supplying polishing slurry to the contact portion of the polishing cloth.

Abstract: A method of blocking ophthalmic lenses for edging comprises providing an ophthalmic lens having first and second surfaces, providing a first block for securing against the first lens surface and a second block for securing against the second lens surface. The method then includes placing an adhesive layer on the first block, placing a film having cling properties between the adhesive layer and the first lens surface, and urging the first block toward the first lens surface and the second block toward the second lens surface. The film having cling properties provides sufficient bonding force between the adhesive layer and the first lens surface to prevent the ophthalmic lens from slipping in the blocks during edging thereof.

Abstract: A polishing apparatus and method has a function of polishing a surface of a film formed on a substrate to a flat mirror finish and a function of polishing unnecessary metal film such as copper film deposited on an outer peripheral portion of the substrate to remove such unnecessary metal film. The polishing apparatus comprises a surface polishing mechanism comprising a polishing table having a polishing surface and a top ring for holding the substrate and pressing the substrate against the polishing surface of the polishing table to thereby polish a surface of the substrate, and an outer periphery polishing mechanism for polishing an outer peripheral portion of the substrate.

Abstract: In manufacturing a semiconductor device, a part of an element is formed on the surface of a substrate, and at least a periphery of the substrate is polished using a polishing member stretched around the periphery of the substrate so that a polishing face of the polishing member is slid on a polishing target surface of the periphery.

Abstract: A polishing machine for polishing a periphery of a sheet of the present invention comprises a grinding shaft tilting mechanism (1) capable of changing a tilting angle of a rotary shaft of a grinding stone (3) with respect to a rotary shaft of the sheet (2) and also capable of changing its tilting direction. Accordingly, in a recess portion or a protrusion portion in the periphery, when the tilting direction is changed while the tilting angle is being maintained, chamfering (polishing) can be executed with high accuracy in the same manner as that of the outer circumferential portion of the sheet.

Abstract: A semiconductor wafer has a top surface and an edge bevel surface, and a first material layer and a second material layer are respectively formed on the top surface and the edge bevel surface. A surface chemical mechanical polishing (surface CMP) process is performed to polish and remove portions of the first material layer down to a first thickness, and a rim CMP process is performed to completely remove the second material layer on the edge bevel surface down to the edge bevel surface thereafter to achieve a smooth surface of the edge bevel surface. Finally, a chemical cleaning process is performed to clean the edge bevel surface and the top surface, and the semiconductor wafer is dried thereafter.

Abstract: A rotating belt (10) is used to finish the edges (23) of glass sheets (11), such as, the thin sheets (e.g., 0.7 mm) used as substrates for liquid crystal displays (LCDs). The edge (23) of the sheet (11) engages the working zone (15) of the belt (10) along a line segment (17) whose included angle with the direction of motion (19) of the belt (10) is less than 10°. The working zone (15) is brought into contact with the edge (23) by a pressure sensitive platen (13) which can accommodate errors in the positioning of the sheet (11) at the finishing station (12).

Abstract: The present invention relates to a rippled edge beveler comprising a wheelhead feeding mechanism having an upper planker and a grinding wheel, wherein the upper planker 2 is connected to the middle planker which is connected to the lower planker fixed on the grinding wheel beam. A drive motor is joined to the lower part of the grinding wheel beam, the drive motor connected to a driving gear which engages the middle gear. The spin axis is connected to the middle gear. Several driven gears are joined to the middle of the spin axis. The driven gears are connected to the input end of the worm screw decelerator, whose output end is connected to the vertical shaft, whose end is connected to the middle planker. The present structure is reliable to use, convenient and easy to install and pleasing to the eye.

Abstract: To cut a protecting sheet adhered over the obverse of a wafer, an inclination angle of a cutting tool is adjusted according to a form of a chamfered part of the wafer and a finishing thickness of the wafer so that the protecting sheet is cut into the required minimum size for protecting the obverse of the wafer. Thus, the protecting sheet is not included inside a removed portion in a grinding process of the reverse of the wafer with a grindstone even if the wafer is ground to have extremely thin finishing thickness. Hence, the protecting sheet is not ground while the reverse of the wafer is ground, and the grindstone is thus prevented from being clogged up with ground material of the protecting sheet.

Abstract: An apparatus for processing a lens comprising a rotating tool for chamfering used for chamfering a peripheral portion of a spectacle lens, the apparatus comprising: a holding shaft supporting the lens and a lens-holding unit that rotates the holding shaft and displaces the lens towards the finishing unit based on data describing a shape of a lens frame and a rotation angle of the holding shaft; and a means for positioning in an axial direction that displaces the lens in an axial direction of the holding shaft; wherein the rotating tool for chamfering includes a rotating tool having a hemispherical shape, wherein a chamfering angle, or a chamfering amount, is set in accordance with a displacement in the axial direction of the means for positioning in an axial direction and a displacement of the lens-holding unit.

Abstract: A work chamfering apparatus includes a work holding portion. The work holding portion includes a work table and a clamper. The work table has an upper surface having two end portions each formed with holding grains projecting out of the upper surface. The two end portions of the upper surface of the work table have a static friction coefficient greater than 0.1, which is greater than that of a center portion. When chamfering, first, the work is held by the work table and a generally U-shaped member of the clamper. At this time, the two end portions of the upper surface of the work table contact a lower surface of the work, whereas lower surfaces of respective end portions of the U-shaped member contact an upper surface of the work. In this state, a rotating center of the work is between the lower surfaces, and the lower surfaces are apart generally equally from the rotating center.

Abstract: In a semiconductor wafer (W) having a periphery thereof chamfered, and having at least a main surface side thereof subjected to mirror finishing, an inclined surface (21) is formed on the periphery of the wafer, such that has an angle (?) of inclination of the inclined surface (21) with respect to a main surface (10) is not smaller than 5° and not larger than 25°, and at the same time a length (L) of the same in the radial direction of the wafer is 100 ?m or longer. Further, the inclined surface is configured to have a non-mirror-finished portion (21b) toward the periphery of the wafer.

Abstract: A machine for radiusing the corners of glass sheets (K) by tools (A, B, C) operated by an electric motor (33), in which the electric motor (33) is supported vertically movable by a first support structure (34), which is supported rotatable about vertical axis (Y) by a second support structure (13) moveable horizontally in two mutually perpendicular directions (X, R).

Abstract: In a process for polishing the chamfered peripheral part of a wafer using a polishing cloth while supplying a polishing slurry in order to improve productivity of the process by reducing a polishing time, at least two steps of polishing processes are performed in sequence. The process comprises a first polishing process to polish a particular part, e.g. the part corresponding to the {110} plane of a peripheral part of the wafer and a second polishing process in which the whole part of a peripheral part of the wafer is polished for finishing by means of varying a hardness of the polishing clothes and/or a particle size of abrasives in the slurry such as the hardness of the polishing cloth in the second polishing process being softer than that of in the first polishing process and a particle size of abrasives in the slurry in the second polishing process being finer than that of in the first polishing process.

Abstract: A method of positioning a grooved grinding wheel relative to a disc-like circular workpiece for edge grinding the workpiece using the groove in the wheel includes the steps of mounting the workpiece for rotation about a first axis, mounting the grinding wheel for rotation about a second parallel axis, effecting relative movement between the workpiece and the wheel to engage the rim of the wheel within the groove and performing a preliminary grind. The position of the wheel is axially adjusted in accordance with the measurements made on the profile of the rim produced by the preliminary grind, and the rim is ground again with a second preliminary grind with the grinding wheel located at the axially shifted position. The steps of grinding and measuring the periphery of the workpiece are repeated until the rim profile possesses the desired accuracy. The final position of the grooved grinding wheel is then utilized for grinding future wafers.

Abstract: A single-sided finishing apparatus is provided having a plurality of finishing stations with rotating transfer stations positioned therebetween. A hold down system presents the edge of the workpiece to the finishing head. The rotating transfer station includes a clamp for grasping a leading corner of a workpiece while rollers continue to drive the workpiece forward, thereby rotating the workpiece 90°.

Abstract: The circumferential edges of glass or ceramic disks used in disk drive data storage devices are preferably finished by ductile grinding to produce an essentially fracture-free surface, which is not chemically strengthened. Preferably, the material is glass, and both the inner and outer edges of the disk are finished. Edge finishing is preferably achieved in a two-stage process, involving a coarse grind and a ductile grind, using air bearing spindles rotated at high speed for grinding wheels and workpiece. Preferably, the grinding wheels are shaped to provide a radius at the juncture of the circumferential edges and flat disk surfaces.

Abstract: An improvement is disclosed in a brush cleaning apparatus for cleaning a major surface of a wafer and including wafer guide wheels for transporting the wafer. The improvement includes a polish pad material disposed on a circumference of the guide wheels. The polish pad material is a material used in chemical-mechanical polishing of the wafer. The polish pad material contacts an edge portion of the wafer during cleaning thereof, thereby removing contaminants from the edge portion of the wafer, so that edge cleaning is performed in situ in addition to the brush cleaning of the major surface of the wafer.

Abstract: An outer edge ring of a semiconductor wafer is polished to prevent delamination and peeling-off of at least one layer of material deposited near the outer edge of the semiconductor wafer during fabrication of integrated circuits. The semiconductor wafer is mounted on a wafer chuck, and the wafer chuck holding the semiconductor wafer is rotated such that the semiconductor wafer rotates. A polishing pad is moved toward the semiconductor wafer as the semiconductor wafer is rotating. The polishing pad has a polishing surface that faces and contacts the outer edge ring of the semiconductor wafer as the polishing pad is moved toward the semiconductor wafer to polish the outer edge ring of the semiconductor wafer. The outer edge ring has the at least one layer of material that is polished off by the polishing surface of the polishing pad.

Abstract: A grinding wheel for polishing, which comprises a grinding substrate and diamond-containing resin fibers implanted in the substrate in a form of a brush.

Abstract: A grinding machine (1) for glass slabs (2) comprising a grinding head (77) that comprises a supporting structure (9), grinding wheels (20, 28) for grinding and polishing the edge of the slab (2), and grinding wheels (24, 26) for grinding and polishing the threads of the slabs (2), where the grinding wheels (20, 28) for grinding and polishing the edges rotate independently one from another around an axis that is perpendicular to the rotation axis of the grinding wheels (24, 26) for grinding and polishing the threads, and where the grinding wheels (20, 24, 26, 28) for grinding and polishing the edges and polishing the threads are configured to perform, during operation, axial movements that can be actuated independently from each other along the slab (2).

Abstract: A lens-holding shaft 41 displaces a lens 1 towards a main rotating tool 50 for processing the peripheral portion of the lens 1. A long hole 115 penetrating a waterproof case 101 is formed in the waterproof case 101 along the locus of displacement of the lens-holding shaft 41 and the lens-holding shaft is inserted through the long hole 115. At the outside of the waterproof case 101 along the long hole 115, a flexible water-resistant sliding shutter 130 is disposed in a manner such that the sliding shutter 130 can be freely displaced. The sliding shutter 130 is connected with the lens-holding shaft 41. A guide member 150 containing the sliding shutter 130 is bent at a position before the main shaft 51.

Abstract: A method and apparatus for processing of planar rigid materials is provided whereby the edges of separate materials can be processed simultaneously, quickly and efficiently. Separate planar materials are moved in position and are clamped in place in horizontal alignment. Thereafter a grinding wheel moves between the opposing edges of the planar materials to abrade the leading edge of one of the materials and the trailing edge of the second opposing material. The process describes abrading both the longitudinal and lateral edges of rectangular shaped materials moved along conveyors, such planar materials being glass, ceramic, stone or the like.

Abstract: An invention is disclosed for improving edge performance in a chemical mechanical polishing process is disclosed. The system includes a wafer head disposed above a wafer, where the wafer head includes a first active retaining ring capable of extension and retraction. Below the wafer head is a polishing belt, and disposed below the polishing belt is a platen having a second active retaining ring capable of extension and retraction. During operation the first active retaining ring and the second active retaining ring can be controlled to provide positional control for the polishing belt, thus adjusting and controlling the removal rate at the edge of the wafer.

Abstract: A method of forming a stone inlay in an abrasion-sensitive substrate, such as wood, by forming a depression in the substrate, mounting stone on a damping material capable of absorbing the abrasive energy applied to the stone in reducing the dimensions of the stone to fit the depression, cutting the inlay to size and inserting it into the substrate. The cut inlay/damping material composite may be sold separately as an article of manufacture.

Abstract: When a device wafer is chucked and is rotated about an axis thereof, arc-shaped work faces of first and second inclined-face-polishing members are brought into line-contact with inclined faces disposed at front and rear faces, respectively, of the device wafer, the arc-shaped work face of a peripheral-face-polishing member is brought into line-contact with a peripheral face of the device wafer, and a disc-shaped work face of a peripheral-edge-polishing member is brought into planar contact with the front face of the device wafer at a peripheral edge thereof, whereby the inclined faces, the peripheral face, and the peripheral edge are polished simultaneously by the respective polishing members. Thus, an unnecessary part of a metallic film is removed from the periphery of the device wafer.