Abstract: A wafer polishing method, in which the outer circumferential edge of a polishing member is first cut by a cutting tool fixed to a table base, thereby forming the polishing member into a completely round shape and also positioning the polishing member in a Y direction at a Y-directional reference position of the table base. Thereafter, a polishing unit is once lifted in the condition where the table base remains still at the reference position. Thereafter, the table base is horizontally moved toward a column in the Y direction to thereby position the polishing member in the Y direction so that only a peripheral portion of the wafer is polished by the polishing member. At this time, the horizontal travel of the table base is preliminarily obtained from the Y-directional positional relation between the cutting tool and the wafer held on a chuck table and from the width of the peripheral portion to be polished.

Abstract: The present invention is a wafer production method at least comprising a chamfering step of chamfering a wafer sliced from an ingot using a grindstone for chamfering, and a step of obtaining a product wafer thinner than the chamfered wafer by performing at least one or more than one of the following processes on the chamfered wafer: flattening, etching, and polishing, the method at least comprising a correction step of chamfering a dummy wafer equivalent in thickness to the product wafer, measuring the chamfered dummy wafer for its chamfered shape, and correcting the shape of the grindstone for chamfering based on the measured chamfered shape of the dummy wafer, at least before the chamfering step, thereby chamfering the wafer sliced from the ingot using the grindstone for chamfering having its shape corrected. Thus, it is possible to provide a wafer production method allowing a product wafer with a desired chamfered shape to be obtained in a short period of time.

Abstract: The present invention provides a polishing apparatus for polishing a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.

Abstract: The invention relates to a method for producing a semiconductor wafer with a polished edge, said method comprising the following steps: a polishing of at least one side of the semiconductor wafer, and a polishing of the edge of the polished semiconductor wafer, wherein the edge is polished in the presence of a polishing agent by means of a polishing cloth containing fixed abrasive.

Abstract: An edge section of a wafer can be polished, and at same time, a polishing surface of a polishing member can be dressed by a dresser mechanism. A polishing member has annular concave trenches, which are coaxially formed in the front surface thereof, and at least an inner surface of the concave trenches is composed of an inclined polishing surface for polishing an edge section of the wafer, and a wafer pressing mechanism presses the edge section of the wafer against the inner surfaces in at least one side of the concave trench of the polishing member, and a dresser mechanism dresses at least the inner surfaces in at least one side of the concave trench of the polishing member.

Abstract: A tool holder transmission structure of a stone chamfering machine which is mainly characterized in that a transmission motor is installed at downward offset position inside the frame of the stone chamfering machine, whereof the transmission gear installed on the spindle of the said motor is through the bottom cut slot of the centered convex block at side plate of the frame to engage with the bottom tool driven gear of the multi-axis tool holder, whereby through rotation of the tool holder, different tool driven gear can be changed to engage with the motor transmission gear. Therefore, it is particularly useful to select different tools for stone chamfering operation according to practical needs.

Abstract: A substrate treating method includes rotating a substrate in a circumferential direction and polishing a peripheral portion of the substrate by pressing a polishing member to it using a pressing mechanism having a pressing pad. An angle of at least a part of the pressing pad with respect to an axial direction, in which the pressing mechanism makes the pressing pad press the peripheral portion of the substrate, is changed by an angle displacement mechanism which actively displaces the angle so that the polishing is performed depending on a surface to be polished in the peripheral portion.

Abstract: There are disclosed a polishing method and a polishing device in which cleaning of a glass substrate surface can be achieved to a high level. A glass substrate (MD substrate 1) in the shape of a circular disc having a circular hole in a center portion is polished with an abrasive liquid 50 containing free abrasive grains being supplied, and an inner peripheral end surface of the glass substrate is polished using the abrasive liquid containing the free abrasive grains by rotating a rotary brush 4 or a polishing pad in contact with the inner peripheral end surface.

Abstract: A method of manufacturing a disk substrate includes a disk substrate forming step of forming a disk substrate; and an outer chamfering step of chamfering an outer edge of the disk substrate. The outer chamfering step includes chamfering the outer edge by bringing an end surface of a cylindrical-shaped outer chamfering grindstone having a hollow portion on its end into contact with the outer edge such that the hollow portion faces the outer edge while rotating each of the outer chamfering grindstone and the disk substrate.

Abstract: A device for polishing the peripheral edge part of a semiconductor wafer includes a wafer stage for holding the wafer, a wafer stage unit including devices for rotating the wafer stage, causing the wafer stage to undergo a rotary reciprocating motion within the same plane as the surface of the wafer stage, and moving the wafer stage parallel to the surface, a notch polishing part for polishing the notch on the wafer and a bevel polishing part for polishing the beveled part of the wafer. Pure water is supplied to the wafer to prevent it from becoming dry as it is transported from the notch polishing part to the bevel polishing part.

Abstract: An automatic machine and an automatic method for grinding the perimetric edge of rectangular or nonrectangular of glass sheets arranged substantially vertically, comprising at least one conveyor and at least one workhead provided with an abrasive tool for grinding the glass sheet at its edge, following its perimetric profile by way of the relative action of movement of the glass sheet and movement of the at least one workhead. During grinding, the glass sheet is no longer supported and moved by the conveyor but by at least one carriage, to which the glass sheet is coupled by way of at least one sucker.

Abstract: The present invention is a method for producing a semiconductor wafer, comprising: at least a double-side polishing step; and a chamfered-portion polishing step; wherein as a first chamfered-portion polishing step, at least, a chamfered portion of the wafer is polished so that a chamfered surface of each of main surface sides in the chamfered portion is in contact with a polishing pad; then the double-side polishing is performed; as a second chamfered-portion polishing step, at least, the chamfered portion of the wafer is polished so that an end surface of the chamfered portion is in contact with a polishing pad and so that both main surfaces of the wafer are not in contact with a polishing pad. Thereby, when a semiconductor wafer is produced, scratch and such generated in the chamfered portion in a double-side polishing process can be removed and, excessive polishing in a peripheral portion of a main surface can be prevented from being caused in polishing a chamfered portion.

Abstract: A method of manufacturing silicon wafers that include a front surface and a block surface and lateral edges, includes forming a silicon wafer by separating a rectangular, in particular, silicon block with lateral surfaces and before separation, grounding and/or polishing the lateral surfaces of the silicon block parallel to the edge of the silicon wafer.

Abstract: There are disclosed a polishing method and a polishing device in which cleaning of a glass substrate surface can be achieved to a high level. A glass substrate (MD substrate 1) in the shape of a circular disc having a circular hole in a center portion is polished with an abrasive liquid 50 containing free abrasive grains being supplied, and an inner peripheral end surface of the glass substrate is polished using the abrasive liquid containing the free abrasive grains by rotating a rotary brush 4 or a polishing pad in contact with the inner peripheral end surface.

Abstract: An optical low pass filter is constituted by a quartz birefringent plate a quarter wavelength plate and a quartz birefringent plate layered in that order. Curved chamfered portions are formed at a periphery of an outgoing light surface (main surface) of one of the quartz birefringent plates. A curve chamfering width of a main surface side is smaller than that of a side surface side.

Abstract: A method of cleaning an edge of a substrate is provided. The method comprises tensioning a first polishing film in a frame; contacting the first polishing film against an edge of a substrate; conforming the first polishing film to the edge of the substrate, the edge including an outer edge and at least one bevel; and rotating the substrate while the first polishing film remains in contact with the substrate. Numerous other aspects are provided.

Abstract: The present invention realizes a polishing apparatus capable of chamfering an end face of a large-sized substrate at a high precision for a table unit for mounting the substrate. A substrate is mounted on a table unit and is fixedly held in a predetermined reference state. A first polishing unit includes a polishing grind stone for polishing an end face of the substrate held on the table unit and substrate side edge portion supporting means for supporting the lower surface of a side edge portion of the substrate in the vicinity of the end face of the substrate to be polished by the polishing unit. The first polishing unit is moved together with the substrate side edge portion supporting means by a first polishing unit moving means along the end face of the substrate while the polishing grind stone is polishing the end face of the substrate.

Abstract: A wafer having an asymmetric edge profile is provided. The wafer has a disk-like body. The disc-like body has a first main surface, a second main surface parallel to the first main surface, and an edge region. The disk-like body has a central line defined between the first main surface and the second main surface, the edge region has an edge profile, and the edge profile is asymmetric with respect to the central line of the first main surface and the second main surface.

Abstract: Methods and apparatus for cleaning an edge of a substrate are provided. The invention includes a polishing film having a polishing side and a second side; an inflatable pad disposed adjacent the second side of the polishing film; a frame adapted to support the polishing film and the inflatable pad; and a substrate rotation driver adapted to rotate a substrate against the polishing side of the polishing film, wherein the polishing film is disposed between an edge of the substrate and the inflatable pad so that the inflatable pad and polishing film contour to the edge of the substrate with the polishing film contacting the edge of the substrate. Numerous other aspects are provided.

Abstract: A polishing apparatus according to the present invention is suitable for use in polishing a periphery of a substrate such as a semiconductor wafer. The polishing apparatus includes a holding section configured to hold the workpiece, a polishing head configured to bring the polishing tape into contact with the workpiece, a supply reel configured to supply the polishing tape to the polishing head, a rewind reel configured to rewind the polishing tape that has contacted the workpiece, and a swinging mechanism configured to cause the polishing head to perform a swinging motion with its pivot lying on a predetermined point.

Abstract: A chamfering apparatus for chamfering an outer periphery of a disk-shaped substrate includes a grinding member having a circular hole inside thereof, wherein the hole has a diameter larger than an outer diameter of the substrate. An inner periphery of the grinding member forming the hole is a grinding surface and grinds the outer periphery of the substrate.

Abstract: Apparatus and methods are provided relating to polishing a substrate using a polishing device, such as a polishing tape. The polishing device may be formed to include a base, a resin layer adhering to the base, and a plurality of embossed abrasive particles and/or abrasive beads affixed to the base by the resin layer. The plurality of abrasive particles and/or beads may be embossed in the resin layer. The plurality of abrasive beads may include a plurality of abrasive particles suspended in binder material. The plurality of abrasive particles and/or beads and the resin layer combine to form an abrasive side of the polishing device adapted to contact the substrate. Polishing of the substrate preferably includes polishing an edge of the substrate while the substrate is rotated by a holding device such that no apparatus other than the polishing tape contacts the edge while the substrate is rotating.

Abstract: Methods and apparatus are provided for polishing a film on an edge of a substrate. In some embodiments, a polishing head is provided having a backing plate adapted to press polishing material against a film on an edge of a substrate. The backing plate has a profiled portion adapted to provide a pre-set film profile. Numerous other aspects are provided.

Abstract: An apparatus and method are provided to polish an edge of a substrate. The invention includes a polishing head including a backing pad, wherein a width of the backing pad that contacts the substrate edge is larger than a width of a notch in the substrate edge. Numerous other aspects are provided.

Abstract: Apparatus and methods are provided to polish an edge of a substrate. The invention includes a polishing head adapted to retain a backing pad having a selected contour, wherein the polishing head is adapted to press the backing pad against an edge of a substrate. Numerous other aspects are provided.

Abstract: Apparatus and methods are provided for polishing a notch on an edge of a substrate. An exemplary apparatus may include a substrate support adapted to support a substrate; a polishing head adapted to contact a notch in an edge of the substrate; and a controller adapted to oscillate the substrate between at least first and second oscillatory positions while the polishing head contacts the substrate notch. Numerous other aspects are provided.

Abstract: There are disclosed a polishing method and a polishing device in which cleaning of a glass substrate surface can be achieved to a high level. A glass substrate (MD substrate 1) in the shape of a circular disc having a circular hole in a center portion is polished with an abrasive liquid 50 containing free abrasive grains being supplied, and an inner peripheral end surface of the glass substrate is polished using the abrasive liquid containing the free abrasive grains by rotating a rotary brush 4 or a polishing pad in contact with the inner peripheral end surface.

Abstract: In a substrate processing method of polishing a periphery of a substrate, in a state where a first polishing surface to which abrasive grains that include particles having a chemical effect on an oxide-silicon-series or nitride-silicon-series film as a main component have been fixed is brought into contact with the periphery of a semiconductor substrate, polishing the periphery of the substrate by sliding the substrate and the first polishing surface. Moreover, in a state where a second polishing surface to which abrasive grains mainly having a mechanical effect have been fixed is brought into contact with the periphery of the substrate, polishing the periphery of the substrate by sliding the substrate and the second polishing surface.

Abstract: A method for manufacturing a silicon wafer comprises a slicing step of a silicon single crystal ingot to obtain sliced wafers, a single-side grinding step to grind only one side of a wafer, and a smoothing step to smooth the other side of the wafer by controlling application of etchant depending on surface profile of the other side of the wafer. According to a method of the present invention a silicon wafer that has high flatness, is removed machine working damage, and is reduced of profile change of chamfer to be minimal can be manufactured.

Abstract: A slider body characterized by rounded corners and edges and smooth surfaces, formed by polishing with a polymeric fiber and a free abrasive slurry of submicron particles.

Abstract: Methods and apparatus are provided for concurrently chemically and mechanically polishing a substrate edge. The invention includes a substrate support adapted to rotate a substrate; a polishing head adapted to contact an edge of the substrate, the polishing head including a first channel adapted to apply a first fluid to the edge of the substrate; a second channel adapted to direct a second fluid onto a major surface of the rotating substrate; and a third channel adapted to direct a third fluid at the major surface of the substrate and to prevent the second fluid from diluting the first fluid. Numerous other aspects are provided.

Abstract: A substrate processing apparatus (1) includes first and second polishing units (70A, 70B) for polishing a peripheral portion of a substrate (W), a primary cleaning unit (100) for cleaning the substrate (W), a secondary cleaning and drying unit (110) for drying the substrate (W) cleaned in the primary cleaning unit (100), and a measurement unit (30) for measuring the peripheral portion of the substrate (W). The measurement unit (30) includes a mechanism for measurement required for polishing in the first and second polishing units (70A and 70B), such as a diameter measurement mechanism, a cross-sectional shape measurement mechanism, or a surface condition measurement mechanism.

Abstract: The polishing method of a disk-shaped substrate for polishing an outer circumference 13 of a disk-shaped substrate using slurry is provided with in this sequence: a first polishing process for polishing the outer circumference 13 using an abrasive-grain inclusion brush 50 made of a resin in which polishing abrasive grains are included; and a second polishing process for polishing the outer circumference 13 using a resin brush 60 made of a resin in which the polishing abrasive grains are not included.

Abstract: The disk-shaped substrate inner circumference polishing method for polishing an inner circumference of a disk-shaped substrate including a portion having an opening hole at the center thereof includes inserting a brush having a shaft core into the portion having the opening hole of the disk-shaped substrate; fixing one end and the other end of the brush to a pair of rotating shafts that are provided at mutually detached positions and pulling at least any one of the one end and the other end of the brush and applying tension in the axial direction to the shaft core of the brush; and rotating the brush and polishing the inner circumference of the disk-shaped substrate.

Abstract: A blade sharpening device is provided for honing a cutting edge of a blade. The device includes a block with a top honing surface, and a jig assembly mounted on the block. The jig assembly holds a blade in a fixed position adjacent the honing surface, and directed towards the honing surface, so that a sharpening stone can be manually moved on the top honing surface and across the blade edge for sharpening. The stone can be moved longitudinally, laterally, and circularly. The jig assembly is pivotally mounted on the block for a desired sharpening angle, and vertically adjustable so that the blade edge is substantially flush with the top honing surface of the block.

Abstract: Semiconductor wafers are polished between upper and lower polishing plates, the semiconductor wafer being polished on both sides while in a recess of a carrier by supplying a polishing agent. The wafer is double-side polished in a first polishing step, which is concluded with a negative overhang, defined as the difference between the thickness of the wafer and the thickness of the carrier after the first polishing step. The wafer is then double-side polished in a second polishing step, in which less than 1 ?m of material is removed from the surfaces of the wafer. Silicon semiconductor wafers having polished front and rear sides with a front side global planarity SBIRmax value of less than 100 nm, and a front side local planarity PSFQR value of 35 nm or less in an edge region, with an edge exclusion of 2 mm, are obtained.

Abstract: An apparatus and method for fabricating a liquid crystal display panel are disclosed. In case of the single mode that liquid crystal display panels are fabricated with the same size on a large glass substrate, unit liquid crystal display panels are kept and discarded not to proceed with a follow-up process. Thus, a material waste is restrained and a yield can be improved. Meanwhile, in case of the multi-mode that liquid crystal display panels are fabricated with difference sizes on a large glass substrate, sub-models are kept, and then after completing the process for the main models, a follow-up process if performed on the sub-models. Thus, use efficiency of the glass substrate can be maximized to improve a productivity and a unit cost of the product can be reduced.

Abstract: Edge modifying apparatuses that include a disc chuck, a disc edge modifying unit having an abrasive article support, and a uniform velocity linear oscillation driver coupled to at least one of the disc chuck and the abrasive article support are described. The uniform velocity linear oscillation driver provides a substantially constant velocity for at least 80% of each half-cycle of oscillation. Methods of modifying the edge of disc using such apparatuses are also described.

Abstract: Aimed at thoroughly preventing abrasive and dusts from adhering onto the circuit-forming region of a wafer, improving yield ratio of semiconductor devices, and thereby improving operation rates of the individual manufacturing apparatuses in the succeeding stage, a semiconductor wafer polishing apparatus of the present invention has a polishing unit polishing the circumferential edge side of a disc-formed wafer; and a gas blowing unit blowing a gas G against the surface of the wafer, so as to separate the space over the wafer by a curtain C of the gas G between a polishing field PF in which the wafer is polished by the polishing unit and a normal field NF except the polishing field PF.

Abstract: Semiconductor wafers with profiled edges, are produced with decreased losses due to edge or other damage by separating a semiconductor wafer from a crystal; profiling the edge in a profile producing step wherein the edge is mechanically machined to a profile that is true to scale with respect to a predefined target profile; mechanically machining the wafer to reduce the a thickness of the semiconductor wafer; and machining the edge profile to acquire the target profile.

Abstract: An apparatus for edge processing of a glass sheet, the apparatus including a shroud, a finishing member and a wiping device. The finishing member is substantially enclosed by the shroud. The apparatus uses pressurized air emitted by at least one slot in the wiping device to prevent contaminants resulting from the edge processing from settling on and/or adhering to surfaces of the glass sheet. The wiping device may include a jet of washing fluid directed at the glass sheet to further wash the surfaces and the processed edge of the glass sheet.

Abstract: An apparatus for treating edge surfaces of panels, comprises conveyor tables to displace panels in sequence, two of the conveyor tables being configured such that panels are sequentially displaced in longitudinal alignment between the two conveyor tables with a longitudinal edge first. Two other of the conveyor tables are configured such that panels are sequentially displaced in lateral alignment between the two other conveyor tables with a lateral edge first. A first tool is positioned between the two conveyor tables. A second tool is positioned between the two other conveyor tables.

Abstract: A method of processing a substrate is disclosed, wherein a sidewall surface of a notch portion formed in a circumferential portion of a substrate to be processed is polished by using a cylindrical polishing head rotatable with an axis as a rotational center.

Abstract: A method and system for making glass sheets is provided. At least one grinding wheel is provided for grinding a lateral edge of a glass sheet. An airbag and corresponding air pressure regulator are provided for biasing the grinding wheel against the lateral edge of the glass sheet being ground. In certain example embodiments, the airbag is advantageous in that it permits the grinding wheel to be biased against the lateral edge of the glass sheet with a substantially constant pressure, where this pressure does not substantially fluctuate due to small changes in the location of the edge of the passing glass.

Abstract: An apparatus for edge processing of a glass sheet, the apparatus including a shroud, a finishing member and a wiping device. The finishing member is substantially enclosed by the shroud. The apparatus uses pressurized air emitted by at least one slot in the wiping device to prevent contaminants resulting from the edge processing from settling on and/or adhering to surfaces of the glass sheet. The wiping device may include a jet of washing fluid directed at the glass sheet to further wash the surfaces and the processed edge of the glass sheet.

Abstract: Systems and methods for beveling microfeature workpiece edges are disclosed. A system in accordance with one embodiment is configured to remove material from a microfeature workpiece having a first face, a second face facing opposite from the first face, an edge surface between the first and second faces, and an edge at a juncture between the edge surface and one of the first and second faces. The system can include a carrier positioned to carry the workpiece with the first and second faces generally normal to an axis, and a first polishing pad having a support surface and a polishing surface facing generally away from the support surface. The polishing surface can have a first shape with at least one portion oriented at an acute angle relative to the axis and the support surface to remove material from the edge of the workpiece.

Abstract: Systems and methods for beveling microfeature workpiece edges are disclosed. A system in accordance with one embodiment is configured to remove material from a microfeature workpiece having a first face, a second face facing opposite from the first face, an edge surface between the first and second faces, and an edge at a juncture between the edge surface and one of the first and second faces. The system can include a carrier positioned to carry the workpiece with the first and second faces generally normal to an axis, and a first polishing pad having a support surface and a polishing surface facing generally away from the support surface. The polishing surface can have a first shape with at least one portion oriented at an acute angle relative to the axis and the support surface to remove material from the edge of the workpiece.

Abstract: An exemplary method for grinding workpieces is provided. Firstly, a plurality of workpieces (18) are bonded together. The bonded workpieces have a central axis (181). Secondly, a grinding wheel (10) is provided. The grinding wheel has a rotating axis (100), and the rotating axis is perpendicular to the central axis. Thirdly, the bonded workpieces are rotated around the central axis. Fourthly, the grinding wheel is placed near to the bonded workpieces, and the rotating axis and the central axis are separated by a predetermined perpendicular distance. Finally, the grinding wheel is rotationally moved along the central axis to grind the workpieces whilst maintaining the predetermined distance between the rotating axis and the central axis.

Abstract: The present invention is directed to an apparatus for grinding or polishing at least one edge of a glass substrate. The apparatus includes an air bearing support member configured to pivot about an axis of rotation with zero frictional resistance opposing said pivotal movement. A grinding unit is coupled to the air bearing support member. The grinding unit is configured to apply a predetermined force normal to the at least one edge to remove a predetermined amount of material from the at least one edge. The predetermined force is directly proportional to the predetermined amount of material and less than a normal force resulting in glass substrate breakage.

Abstract: A plurality of disks include a first disk and a second disk stacked upon the first disk. The first disk and the second disk are each formed from glass or glass-ceramic. A powder is disposed between the first disk and the second disk. The powder is selected from the group including calcium carbonate, calcium magnesium carbonate, calcium phosphate, magnesium carbonate, magnesium borate, magnesium oxide, magnesium phosphate, and clay.