Abstract: A method and apparatus for supporting, cleaning and/or drying a polishing pad used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a cleaning head positioned adjacent a post-operative portion of the polishing pad to clean and/or dry the rear surface of the polishing pad. The cleaning head can include a heat source, a mechanical contact element, and/or orifices that direct fluid and/or gas toward the rear surface. The apparatus can further include a vessel through which the rear surface of the polishing pad passes to clean the rear surface. The apparatus can also include a flow passage in fluid communication with a region between the polishing pad and a support pad upon which the polishing pad rests during planarization. Gas moves through the flow passage toward or away from an interface region between the polishing pad and the support pad to draw the polishing pad toward or away from the support pad.

Abstract: A method for preparing a chemical mechanical polishing apparatus for polishing product substrates includes polishing designated “warm-up” substrates until polishing pad characteristics have achieved steady state conditions. The reusable warm-up substrates may be formed of a mechanically resistant material or a material having substantially the same removal characteristic as the product film to be polished. The reusable warm-up substrates may also be formed of a mechanically resistant film formed over a semiconductor substrate. The polishing pad characteristic of pad compression may be determined using a previously established correlation or it may be measured.

Abstract: The present invention relates to apparatus and methods for cleaning debris from a test probe. Debris is cleaned from the test probe by oxidizing the test probe debris in an oxidizing agent and dissolving said oxidized debris in a cleaning agent. Preferably, a membrane, such as a liquid polymer, is disposed over the oxidizing agent and/or the cleaning agent to prevents any off-gassing of either agent, prevent reaction of either agent with ambient atmosphere or each other, and/or prevent either agent being spilled and/or having personnel exposed to either agent.

Abstract: An apparatus and a method are provided for uniformly conditioning a polishing pad over the entire surface. The conditioning is achieved by contacting the entire polishing surface of the polishing pad with a polishing pad conditioner having a surface area larger than that of the polishing pad.

Abstract: An apparatus for use with a chemical mechanical planarization (CMP) system includes an ultrasonic source that is disposed proximate a workpiece carrier. The ultrasonic source generates an ultrasonic signal toward an area of a polishing pad or a workpiece during the polishing of the workpiece held by the carrier. An ultrasonic detector is configured to receive a reflected ultrasonic signal for processing in order to determine the presence of extraneous material at the area of the polishing pad.

Abstract: A newly proposed wire cleaning apparatus used for removing slurry from a wire, which reciprocatively travels between a slicing chamber and a wiring chamber. The wire cleaning apparatus has a couple of multigrooved guide rollers 41, 42 rotatably provided at a cover 30. A slurry receiver 20 is detachably attached to the cover 30. A centrifugal force is generated during repeated reciprocative movement of the wire 5 between the multigrooved guide rollers 41 and 42. Slurry is shaken off from the wire 5 by the centrifugal force and gathered in the slurry receiver 20. Removal of the slurry is accelerated by spraying a cleaning liquid W at the same time. Introduction of the cleaning liquid W into the slicing chamber is inhibited by on-off control of the cleaning nozzles 41, 42 in response to a travelling direction of the wire 5.

Abstract: A method and apparatus for conditioning and monitoring a planarizing medium used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a conditioning body having a conditioning surface that engages a planarizing surface of the planarizing medium and is movable relative to the planarizing medium. A force sensor is coupled to the conditioning body to detect a frictional force imparted to the conditioning body by the planarizing medium when the conditioning body and the planarizing medium are moved relative to each other. The apparatus can further include a feedback device that controls the motion, position, or force between the conditioning body and the planarizing medium to control the conditioning of the planarizing medium.

Abstract: A method and apparatus for conditioning and monitoring a planarizing medium used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a conditioning body having a conditioning surface that engages a planarizing surface of the planarizing medium and is movable relative to the planarizing medium. A force sensor is coupled to the conditioning body to detect a frictional force imparted to the conditioning body by the planarizing medium when the conditioning body and the planarizing medium are moved relative to each other. The apparatus can further include a feedback device that controls the motion, position, or force between the conditioning body and the planarizing medium to control the conditioning of the planarizing medium.

Abstract: A method and apparatus for conditioning and monitoring a planarizing medium used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a conditioning body having a conditioning surface that engages a planarizing surface of the planarizing medium and is movable relative to the planarizing medium. A force sensor is coupled to the conditioning body to detect a frictional force imparted to the conditioning body by the planarizing medium when the conditioning body and the planarizing medium are moved relative to each other. The apparatus can further include a feedback device that controls the motion, position, or force between the conditioning body and the planarizing medium to control the conditioning of the planarizing medium.

Abstract: A method and apparatus for conditioning and monitoring a planarizing medium used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a conditioning body having a conditioning surface that engages a planarizing surface of the planarizing medium and is movable relative to the planarizing medium. A force sensor is coupled to the conditioning body to detect a frictional force imparted to the conditioning body by the planarizing medium when the conditioning body and the planarizing medium are moved relative to each other. The apparatus can further include a feedback device that controls the motion, position, or force between the conditioning body and the planarizing medium to control the conditioning of the planarizing medium.

Abstract: A method and apparatus for conditioning and monitoring a planarizing medium used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a conditioning body having a conditioning surface that engages a planarizing surface of the planarizing medium and is movable relative to the planarizing medium. A force sensor is coupled to the conditioning body to detect a frictional force imparted to the conditioning body by the planarizing medium when the conditioning body and the planarizing medium are moved relative to each other. The apparatus can further include a feedback device that controls the motion, position, or force between the conditioning body and the planarizing medium to control the conditioning of the planarizing medium.

Abstract: Apparatuses and methods for planarizing a microelectronic-device substrate assembly on a planarizing pad. In one aspect of the invention, material is removed from the substrate assembly by pressing the substrate assembly against a planarizing surface of a planarizing pad and moving the substrate assembly across the planarizing surface through a planarizing zone. The method also includes replacing at least a portion of a used volume of planarizing solution on the planarizing surface with fresh planarizing solution during the planarization cycle of a single substrate assembly. The used planarizing solution can be replaced with fresh planarizing solution by actively removing the used planarizing solution from the pad with a removing unit and depositing fresh planarizing solution onto the pad in the planarizing zone.

Abstract: The present invention relates to a substrate cleaning apparatus, and more particularly to a substrate cleaning apparatus suitable for cleaning a substrate which requires a high level of cleanliness, such as a semiconductor wafer, a glass substrate, a liquid crystal panel, etc.

Abstract: There are provided an electrically conductive grindstone 12 for machining a workpiece 1, a disc-shaped discharge electrode 14 having an outer peripheral edge 14a which can be disposed in the vicinity of a machining surface 12a of the grindstone, an electrode rotating unit 16 for rotating the electrode around an axial center Z, a position controller 18 for controlling a relative position of the outer peripheral edge of the electrode and the grindstone, a voltage applying unit 20 for applying a predetermined voltage between the grindstone and the electrode in a pulse manner, and a machining liquid supply unit 22 for supplying an alkaline liquid between the grindstone and the electrode.

Abstract: A system for dislodging by-product agglomerations from a polishing pad of a chemical mechanical polishing (CMP) machine. The present invention is used in conjunction with a CMP machine that polishes semiconductor wafers. Specifically, an embodiment of the dislodging system in accordance with the present invention includes a megasonic nozzle which is adapted to effectively dislodge polishing by-product agglomerations and particles from the grooves and micro-pits of the surface of a polishing pad through the application of an output stream of extremely agitated fluid (e.g., deionized water). One embodiment of the megasonic nozzle in accordance with the present invention includes two piezoelectric transducers which operate at a resonant frequency to produce the extremely agitated stream of fluid. A fluid line is connected to the megasonic nozzle and a fluid source in order to convey fluid to the megasonic nozzle.

Abstract: A conditioner head for conditioning the polishing surface of a polishing pad. The conditioner head includes a drive element carried for rotation about a longitudinal axis and a disk backing element. The disk backing element carries an abrasive disk and holds the lower surface of the disk in engagement with the polishing pad. The conditioner head further includes a driven element coupling the disk backing element to the drive element to transmit torque and rotation therebetween. The driven element is longitudinally movable between retracted and extended positions. An annular diaphragm spans a gap between the drive element and the driven element and is coupled to the drive element and to the driven element to rotate therewith as a unit.

Abstract: A chemical-mechanical polishing apparatus (100, 200) comprising a polishing pad assembly. The polishing pad assembly (300) comprises a removable cap (318) to be rotatably coupled to a drive device of a chemical mechanical polishing apparatus and a polishing pad comprising a fixed abrasive disposed on the removable cap. The removable cap (318) and the polishing pad being a detached unit to be attached to or removed from the drive device.

Abstract: An apparatus and a method for chemical mechanical polishing a metal on a semiconductor wafer capable of achieving improved pad life are disclosed. In the apparatus, in addition to a first spray nozzle used for spraying a slurry solution onto the top of a polishing pad, a second spray nozzle is provided for mounting juxtaposed to a conditioning pad for dispensing a cleaning solution capable of dissolving polishing debris formed on the polishing pad surface. The apparatus may further include at least one cleaning solution reservoir for storing and delivering a cleaning solution to the second spray nozzle. The method can be advantageously carried out in two-steps during which a first cleaning solution is sprayed onto the pad surface for dissolving the polishing debris, and then a second cleaning solution is sprayed onto the pad surface for removing or flushing away the dissolved debris.

Abstract: A method and apparatus for cleaning polishing debris from the surface of a polishing pad by wetting the surface with a liquid and irradiating the wetted surface with a beam of light. The light beam has sufficient intensity at the polishing surface of the pad to vaporize at least a portion of the liquid such that the vaporized liquid causes at least a portion of the debris to be expelled from the polishing surface of the pad.

Abstract: A cleaning cup for holding and cleaning a pad conditioner having a conditioner head, the cleaning cup includes a spray nozzle for spraying a cleaning solution on a top side of the conditioner head. The cleaning cup further includes a plurality of support pins extending upwards from a base of the cleaning cup to receive the conditioner head thereon.

Abstract: A method of manufacturing a semiconductor device using a polishing apparatus is provided. A top ring holding a wafer is arranged on a pad. A polishing chemical liquid supply line for supplying a polishing chemical liquid is arranged above the pad in a direction ahead of rotation with respect to the top ring. Around the center of rotation of the pad, a partition plate having a columnar side surface is arranged. Above the pad on a side which goes away from the top ring when the pad is rotated, a polishing chemical liquid draining mechanism is arranged extending continuously from the partition plate to the outer periphery of the pad. Accordingly, a polishing apparatus is obtained by which the amount of polishing of the surface to be polished of the semiconductor substrate is stabilized and generation of microscratches on the surface to be polished can be suppressed.

Abstract: Featured is a method and system for cleaning abrasive sanding and/or planing media, for example sandpaper, wide belt sanding belts, planers, grinding wheels or other abrasive surfaces while the media is either in-situ in the sanding, planing, grinding equipment or when removed. Additionally, the cleaning featured method and system can clean the media while the abrasive media is being used as well as when the abrasive media is not being used. In the cleaning method dry ice (CO2, solid carbon dioxide) particles are propelled towards the abrasive surface at a high velocity so the dry ice particles impact on the surface of the abrasive media at a high velocity. Additionally, the dry ice (CO2, solid carbon dioxide) particles are propelled as to impact the abrasive surface at varying angles and locations as necessary to effectively clean the abrasive surface.

Abstract: The present invention discloses a method for preventing particle contamination in a polishing machine that utilizes slurry composition for the removal of material from the surface of a substrate. The novel method is particularly suited for use in a chemical mechanical polishing apparatus in which a slurry composition is used. The method includes the step of providing a plurality of cleaning devices each having a bendable, shapable conduit and a spray nozzle for dispensing a cleaning solvent on the spindle and the conditioner arm utilized in the CMP apparatus. The present invention further discloses an apparatus for use in carrying out a method for preventing particle contamination in a CMP apparatus by using bendable, shapable conduits for dispensing a cleaning solvent such as deionized water onto the chamber components for removing slurry deposits that may have splattered thereon and therefore, eliminating sources for particle contamination.

Abstract: Conditioning systems and methods for conditioning polishing pads used in mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies. In one aspect of the invention, a conditioning system includes a conditioning element or conditioning member having a conditioning face configured to engage a polishing pad. The conditioning face preferably includes a bonding medium covering at least a portion of the conditioning face and a plurality of conditioning particles attached to the bonding medium. The conditioning system also includes a corrosion-inhibiting unit that can be coupled to the conditioning element or a liquid on the polishing pad. The corrosion-inhibiting unit retards corrosion of the bonding medium in the presence of chemicals on the polishing pad that would otherwise corrode the bonding medium.

Abstract: The invention encompasses polishing systems for polishing semiconductive material substrates, and encompasses methods of cleaning polishing slurry from semiconductive substrate surfaces. In one aspect, the invention includes a method of cleaning a polishing slurry from a substrate surface comprising: a) providing a substrate surface having a polishing slurry in contact therewith; b) providing a liquid; c) injecting a gas into the liquid to increase a total dissolved gas concentration in the liquid; and d) after the injecting, providing the liquid against the substrate surface to displace the polishing slurry from the substrate surface.

Abstract: The present invention relates to a dressing apparatus for conditioning and regenerating a chemical mechanical polishing (CMP) pad. More specifically, the invention relates to a diamond disc dresser that employs an air spraying assembly and radially arranged dressing tools to clean, flatten, and roughen the polishing pad. Each of the dressing tools points at a same radial angle but are not necessarily equidistantly separated. Furthermore, a debris collector is used to collect the micro-particles and other types of contamination after they are swept off the working surface of the polishing pad.

Abstract: A conditioner head for conditioning the polishing surface of a polishing pad. The conditioner head includes a drive element carried for rotation about a longitudinal axis and a disk backing element. The disk backing element carries an abrasive disk and holds the lower surface of the disk in engagement with the polishing pad. The conditioner head further includes a driven element coupling the disk backing element to the drive element to transmit torque and rotation therebetween. The driven element is longitudinally movable between retracted and extended positions. An annular diaphragm spans a gap between the drive element and the driven element and is coupled to the drive element and to the driven element to rotate therewith as a unit.

Abstract: A chemical-mechanical polishing apparatus is provided with a downstream device for conditioning a web-shaped polishing pad. The device may be used to condition a glazed portion of the pad, and then the conditioned pad portion may be used again for polishing. The conditioning device is preferably arranged to apply different conditioning treatments to different portions of the glazed pad. The conditioning device may have roller segments that rotate at different speeds. Alternatively, the device may have non-cylindrical rollers that provide different rotational speeds at the pad surface, or the device may apply different pressures at different portions of the pad. The device may be arranged to provide uniform conditioning across the width of the pad. The invention is applicable to methods of planarizing semiconductor wafers. The invention may be used to condition circular pads in addition to web-shaped pads.

Abstract: An apparatus and a method for cleaning a polishing pad used in a chemical mechanical polishing apparatus are disclosed. In the apparatus, a plurality of brush means is mounted to the bottom surface of either a conditioning head, a slurry delivery arm, or both for operating in-situ or ex-situ in a chemical mechanical polishing process. Each of the plurality of brush means may be formed of a multiplicity of bristles made of a polymeric material that is acid resistant and base resistant. A suitable material is nylon that has sufficient hardness for efficient cleaning of surface grooves in a top surface of the polishing pad. The present invention novel apparatus is efficient in removing particles from the surface grooves before the particles present a serious scratching hazard or otherwise damaging the wafer surface during a CMP polishing process.

Abstract: A chain saw for aggregate material has a nozzle that provides a spray of water to that portion of the saw chain that is traveling between the guide bar and the drive sprocket. The flooding provided by the nozzle washes slurry off of the saw chain. A basin with inclined baffles is provided to collect the slurry carried by the saw chain into the housing. Apertures are provided in the basin for discharging the collected slurry.

Abstract: Featured is a method and system for cleaning abrasive sanding and/or planing media, for example sandpaper, wide belt sanding belts, planers, grinding wheels or other abrasive surfaces while the media is either in-situ in the sanding, planing, grinding equipment or when removed. Additionally, the cleaning featured method and system can clean the media while the abrasive media is being used as well as when the abrasive media is not being used. In the cleaning method dry ice (CO.sub.2, solid carbon dioxide) particles are propelled towards the abrasive surface at a high velocity so the dry ice particles impact on the surface of the abrasive media at a high velocity. Additionally, the dry ice (CO.sub.2, solid carbon dioxide) particles are propelled as to impact the abrasive surface at varying angles and locations as necessary to effectively clean the abrasive surface.

Abstract: The present invention provides a cleaning solution for cleaning a polishing pad used in a chemical-mechanical polishing (CMP) process for polishing the surface of a semiconductor wafer. The cleaning solution comprises a potassium hydroxide (KOH) solution for cleaning off slurry remaining on the surface of the polishing pad, and a hydrogen peroxide (H.sub.2 O.sub.2) solution and ammonia water (NH.sub.4 OH) solution for removing abrasive debris remaining on the surface of the polishing pad after the chemical-mechanical polishing process.

Abstract: A terra cotta sharpening block for sharpening edged objects such as knives, tools, and scissors. The terra cotta sharpening block includes a block with first and second faces, a pair of ends, and a pair of sides extending between the ends of the block. The block comprises a terra cotta material.

Abstract: A linear pad conditioning mechanism provides a linear in situ or ex situ conditioning for a polishing pad mounted on a polishing belt of a CMP apparatus. The linear pad conditioning mechanism includes a linear oscillation mechanism for driving a conditioning pad in a direction orthogonal to the polishing belt's direction of travel. In one example, multiple conditioning assemblies are provided to each provide a trapezoidal conditioning pad, and the conditioning assemblies are positioned such that a constant-width area in the polishing belt's direction of travel is provided. In that example, a rotational mechanism is provided to position the conditioning pad between a conditioning position against the polishing pad, and a cleaning position in a bath of cleaning fluid. Further, each conditioning assembly is provided a fluid delivery system to a conditioner block, so that a conditioner fluid can be delivered at the point of use.

Abstract: A chemical mechanical planarization tool that reduces a volume of polishing chemistry used in a wafer polishing process includes a rinse bar (87) for removing polishing chemistry and particulates from a polishing media and a slurry measurement system (84) for regulating a pump (83) of a slurry delivery system. A volume of the slurry delivery system is reduced to less than 100 milliliters. Approximately a minimum volume of polishing chemistry for polishing a single wafer is dispensed during each wafer polishing process of a wafer lot. During each wafer polishing process the slurry delivery system is purged to prevent settling, agglomeration, and hardening of the polishing chemistry. The rinse bar (87) sprays a surface of the polishing media to remove spent polishing chemistry and particulates prior to polishing another semiconductor wafer.

Abstract: A bristle carrier for leaning a polishing apparatus comprises a number of radial slots into which sub-frames carrying bristles can be releasably mounted. The bristle carrier is used in place of a component carrier used during normal polishing, and is driven in planetary fashion over clothed polishing surfaces to clean those surfaces. The same carrier can be used, even when the bristles have to be replaced due to wear, by replacing the sub-frames having new bristles.

Abstract: The present invention provides a method and apparatus for delivering one or more rinse agents to a surface, such as a polishing pad surface and preferably one or more polishing fluids. The invention also provides a method of cleaning one or more surfaces, such as a polishing pad surface and a substrate surface, by delivering a spray of one or more rinse agents to the surface and, preferably, causing the rinse agent to flow across the surface from a central region to an outer region where unwanted debris and material is collected.

Abstract: A semiconductor wafer polishing pad conditioner which includes a support structure and a roller which is rotatably mounted to the support structure. The roller has a working surface which is formed with a plurality of blades.

Abstract: An improved chemical-mechanical polishing method and apparatus is provided. A brush is employed to continually brush slurry particles from surface features, e.g., grooves, on a polishing pad. In this manner slurry is prevented from becoming compacted within the grooves as the slurry passes beneath and is subjected to compressive forces of a wafer polishing head. The invention may be practiced by use of a stationary brush operatively coupled to the polishing pad surface, or by an improved conditioning assembly having both a diamond surface for conditioning the polishing pad and a brush for cleaning the pad's surface features. The brush portion of the conditioning assembly may or may not rotate as it is scanned across the surface of the polishing pad.

Abstract: To provide a cleaning apparatus capable of easily and positively washing off attachments from a dresser (6) for dressing a lap in a plane polishing apparatus. An air nozzle (15) for bubbling, a first bottom surface brush (18) that comes in slidable contact with a dressing member (9), and second bottom surface brushes (22a and 22b) that come in slidable contact with a portion (6a) other than the dressing member (9) are provided in a cleaning tank (11) for accommodating the dresser (6), which is provided with the dressing member (9) on its bottom surface, in a state where the dresser (6) is immersed in a cleaning solution. Furthermore, a side surface brush (25) that comes in contact with an outer side surface of the dresser (6) is provided.

Abstract: A method and apparatus for conditioning the surface of a polishing pad used to polish a substrate, such as a semiconductor wafer. A conditioning apparatus uses two or more end effectors to abrade and/or remove the polishing byproducts from the surface of the pad. Different types of conditioning performance can be achieved when the end effectors are employed individually, sequentially, or simultaneously during a polishing process.

Abstract: A single side work polishing apparatus rectifies the surface geometry of a polishing pad during the polishing of a work. A correction roller is mounted to a pressure member that pushes a work against a polishing pad held by a rotating surface plate. The correction roller has a length substantially equivalent to the width of the working area of the polishing pad and is arranged along the radial direction of the surface plate. During polishing, the work and the correction roller are pressed against the polishing pad by the pressure member. The correction roller rotates about its longitudinal axis to rectify the polishing pad while the work is being polished.

Abstract: An improved gear or pin cleaning assembly for polishing or grinding machines having a rotating plate is presented. One or more nozzle members are positioned within the rotating plate and a source of fluid, such as deionized water, is connected to the nozzle or nozzles to emit a pressurized stream of fluid which rinses off the gear assembly as the plate rotates. The rotating plate may contain a channel for delivering the fluid from the exterior or interior of the plate to the nozzle(s).

Abstract: In the polishing machine 10 for pressing the polished surface 7 of the workpiece 1 against the face where there are abrasives 15 of the rotating polishing tool 11 and executing chemical mechanical polishing, the brushing device 30, the cleaner 40, the abrasive supplier 52, and the pure water supplier 60 are sequentially arranged behind the location of the head 20 for pressing the workpiece 1 against the polishing tool 11 in the rotational direction. The cleaner 40 sprays the cleaning water 47 to the face where there are abrasives 15 of the rotating polishing tool 11 and sucks and collects it by the vacuum hole 45. Fresh slurry 62 is always supplied by the slurry supplier 63 comprising the abrasive supplier 52 and the pure water supplier 60.

Abstract: A method and apparatus for conditioning a polishing pad is described. The method includes steps of moving a cylindrical roller having an abrasive substance affixed to it against a moving polishing pad. The roller may be passively rotated by contact with the polishing pad, or actively reciprocated, while maintaining a pressure against the polishing pad. The apparatus includes a cylindrical roller attached to one or more pressure application devices mechanically connected to the roller.

Abstract: A chemical-mechanical polishing station having a belt-operated conditioner. The belt-operated conditioner comprises a longitudinal main body, a belt sprinkled with hard particles, and a plurality of rollers. The belt wraps around the external edge of the longitudinal main body and is capable of rotating at a constant speed. The axles of the roller are parallel to each other. Furthermore, all the rollers are positioned within but touching the belt. Consequently, the rollers can rotate when they are driven by the belt. The hard particles sprinkled along the belt are used for scouring the polishing pad so that polishing pad surface can be reconditioned and any residual impurity particles can be removed. The belt-operated conditioner further includes a cleaning device. The cleaning device is used for removing any impurity particles clinging onto the belt when the conditioner is in operation.

Abstract: A machine tool comprises a spindle which has a tool receptacle for tool holders. Also provided are a tool changing apparatus for transferring the tool holders between their respective magazine position and a working position in the tool receptacle, and an internal cooling system which delivers coolant from a coolant supply system, through an internal duct running longitudinally through the spindle, to a tool holder clamped into the tool receptacle, in order to flush out a tool that is in use. Also provided is a flushing apparatus in order to flush the tool holder while it is being inserted into the tool receptacle, the flushing apparatus flushing with coolant from the coolant supply system.

Abstract: Systems and methods for polishing a substrate with reduced contamination are described. A rinse arm has one or more nozzles configured to direct rinse fluid toward a polishing surface for polishing a substrate. The rinse arm further includes a fluid dispenser configured to direct rinse fluid to one or more surfaces of the rinse arm in proximity to the polishing surface and exposed to airborne slurry particles generated from slurry on the polishing surface. By maintaining the atmosphere in the vicinity of the exposed rinse arm surfaces at an elevated relative humidity level, airborne slurry particles adhering to the exposed rinse arm surfaces remain in suspension and, therefore, may be easily cleaned, e.g., during a high pressure rinse cycle. This feature reduces the likelihood that slurry particles will accumulate on exposed surfaces of the polishing apparatus and flake off while a substrate is being polished, reducing the likelihood of substrate defects caused by such slurry contamination.

Abstract: A cleaner for a belt sander comprising a mounting plate pivotally coupled to a supporting plate having a cleaning block mounted thereon. The mounting plate is adapted to be mounted to the cover of a belt sander. When the two plates are pivoted closed, the cleaning block is facing away from the abrasive belt of the belt sander so that the sander can be used for sanding. When it is desired to clean the belt, the plates are pivoted open, so that the cleaning block rests against the belt and can clean the belt as it rotates through the sander. The cleaner is especially adapted for use on portable belt sanders.

Abstract: A conditioner head uses a fluid purge system to prevent debris from entering openings in the conditioner head and causing deterioration of bearings and other moving components in the conditioner head. The fluid may be a gas, such as nitrogen, or a liquid, such as water or reactive solvents.