Abstract: A wafer carrier assembly including a subassembly for in-situ nondestructive pad conditioning, characterized by continuously cleansing the pad surface with an energized fluid. The fluid may be abrasive in nature, such as a slurry, or non-abrasive, such as DeIonized (DI) water. In addition, the fluid may be of a type known to assist in removing slurry and/or residual materials from a pad surface and followed by a DI water rinse. The chemical may be either liquid or gas.

Abstract: An improved method of in-situ conditioning of a polishing pad for use with a stationary pad conditioner during chemical mechanical polishing is described. A polishing table having a polishing pad on its surface is rotated in a first direction during polishing of a semiconductor wafer. A polishing pad conditioner is adjustably attached to the rotating polishing table such that the conditioner is stationary in relation to the rotating polishing table. The conditioner has a roughened surface which is in contact with the polishing pad providing in-situ conditioning during polishing of a semiconductor wafer. After polishing of the semiconductor wafer, the polishing table is rotated in a second direction while the conditioner is still in contact with polishing pad. Rotating the polishing pad in a second direction dislodges the polishing debris clogging the roughened surface of the conditioner and redistributes CMP slurry.

Abstract: A method and apparatus for conditioning a polishing pad. In this method and apparatus a glazed polishing pad is conditioned by being contacted with a stream of cryogenic pellets.

Abstract: A pad refurbisher that provides in situ, real-time conditioning and/or cleaning of a polishing surface on a polishing pad used in chemical-mechanical polishing of a semiconductor wafer and other microelectronic substrates. The pad refurbisher has a body adapted for attachment to a wafer carrier of a chemical-mechanical polishing machine, and a refurbishing element connected to the body. The body has a distal face positioned proximate to a perimeter portion of the wafer carrier and facing generally toward the polishing surface of the polishing pad. The body travels with the wafer carrier as the wafer carrier moves over the polishing pad. The refurbishing element is connected to the distal face of the body so that the refurbishing element can operatively engage the polishing surface substantially adjacent to the perimeter of the wafer carrier.

Abstract: With an abrasive dresser for a polishing disc of a chemical-mechanical polisher for abrading a flat rotatable polishing disc of a chemical-mechanical polisher which supplies a chemical polishing agent to the surface of the polishing disc to polish the surface of an article on top of the polishing disc, a sectional shape of an abrasive surface being a peripheral portion of a flat disc shaped base member which protrudes upwards over a predetermined width with an abrasive grit distributed substantially uniformly over and affixed to the surface thereof, is formed as a convex circular arc curved surface. In this way, the portion of contact with the polishing disc of the chemical-mechanical polisher becomes surface contact, thereby enabling a reduction in wear during use and an increase in life, together with an increase in the efficiency of abrading the polishing disc.

Abstract: Lapping or polishing at high speeds with fine abrasive particles offer significant advantages in the speed of lapping, savings of time in lapping, and smoothness in the finished articles. An improved lapping system comprises a lapper platen system comprising:a) a frame having a total weight of at least 200 kg supporting a work piece holderb) a rotatable platen having an abrasive surface comprising an abrasive sheet secured to said platen;c) a work piece holder which is movable on said frame;d) a means for introducing a first amount of liquid onto said abrasive surface of said platen at a location before contact between a work piece held on said work piece holder and said abrasive surface on said platen;e) a means for introducing a second amount of liquid onto said abrasive surface of said platen after contact between said work piece and said abrasive surface; andf) means for directing air against said abrasive surface after introduction of said second amount of liquid.

Abstract: A method and apparatus for selectively conditioning a planarizing surface of a polishing pad. In one embodiment, a conditioning system has a carrier assembly with an arm that may be positioned over a polishing pad, a conditioning element coupled to the arm, and an actuator coupled to the arm to move the conditioning element into engagement with the planarizing surface of the polishing pad. The conditioning element is an abrasive member, such as an abrasive disk or a brush. The conditioning system may also have a controller operatively coupled to the engagement actuator to control an operating parameter of the conditioning element as a function of the distribution of a surface characteristic across the planarizing surface of the polishing pad.

Abstract: A process for conditioning a polishing pad has been developed that incorporates in-situ conditioning where the conditioning is performed while the substrate (27, 40) is on the polishing pad (22) but terminates before the polishing of the substrate (27, 40) is completed. In one embodiment, ex-situ conditioning of the polishing pad (22) is used on the polishing pad between substrates (27, 40). The process has benefits of both in-situ and ex-situ conditioning.

Abstract: A chemical-mechanical polishing system includes a polishing pad having a polishing surface for polishing the semiconductor substrate, and a polishing pad brush including a plurality of bristles attached to a support for cleaning the polishing surface of the polishing pad. In addition, a polishing pad brush arm is operatively coupled to the brush support for transferring the polishing pad brush to and from the polishing pad. Related methods are also discussed.

Abstract: The present invention advantageously provides a method for conditioning a polishing pad used for chemical mechanical polishing of a semiconductor wafer surface. The method involves directing a fluid at a relatively high pressure toward the surface of the pad, thereby roughening the surface of the pad and removing particles embedded in pores of the pad. This process provides for uniform conditioning across the surface of the pad and excludes the use of particles which might become disposed on the pad, unlike some other conventional conditioning methods. The exclusion of abrasive particles prevents scratching of wafers which may subsequently undergo CMP using the polishing pad. The conditioning fluid hereof may, among other things, be a typical CMP slurry or variation thereof, or may be deionized water.

Abstract: An end effector to facilitate conditioning of a surface of a polishing pad used in chemical-mechanical polishing of an substrate surface is described. The end effector includes a rigid body including a contact surface capable of being attached to a conditioning disk and having a predetermined non-planar region that is adapted to at least one of (i) effectively maintain a non-planar area on the surface of the polishing pad and (ii) shape the polishing pad, when the end effector is employed to condition the polishing pad.

Abstract: A process of conditioning a polishing pad used in chemical mechanical polishing of an integrated circuit and having a glazed layer is described. The process includes introducing a conditioning reagent including at least one of hydrofluoric acid, buffered oxide etch composition and potassium hydroxide on the polishing pad to dissolve at least a portion of the glazed layer; and abrading the glazed layer and disloding at least some particles from the glazed layer.

Abstract: A utility wafer is used to mechanically condition and chemically stabilize a polishing pad and ready the pad for chemical-mechanical polishing of semiconductor production wafers. The utility wafer is fabricated from a high-purity ceramic material, such as quartz (SiO.sub.2), or a high-purity metal, such as tungsten. Because there are no dielectric coatings to be maintained on the utility wafer, the utility wafer can be used much longer and at greatly reduced cost than other types of utility wafers. In one embodiment, a light reflective coating may be applied to one side of a ceramic utility wafer to ensure process machinery will detect the presence of the wafer. In another embodiment, a silicon wafer is bonded to the utility wafer to provide structural support to the utility wafer as the utility wafer is thinned by the abrasive action of the polishing pad.

Abstract: A flexible conditioning apparatus and method for uniformly conditioning a polishing surface of a pad used to remove undesirable irregularities from a silicon wafer and to achieve a planar condition of the polishing pad. In a preferred embodiment of the present invention, a roughening member comprising a plurality of point contacts, such as diamond particles, is adapted for movement into and out of engagement with the surface of the pad. A flexible member supporting the roughening member allows the roughening member to conform to the surface of the pad to achieve uniform polishing of the pad.

Abstract: Chemical-mechanical polishing apparatus includes a pad reconditioning mechanism which comprises nested conical tubes which overly the pad. The outer tube has an array of holes in it much like the head of an electric razor and is rotated about its axis by being in contact with the rotating pad. The inner cone is stationary and has a longitudinal, downward-facing slot. An air stream from the narrow end of the inner cone towards the wide end carries particle-laden slurry to the wide end for removal or recycling. The nested cones are arranged like a detachable bridge with the narrow end secured to a non-rotating center core and the wide end secured to the top of the table in which the (now annular) platen rotates.

Abstract: A resurfacer for resurfacing a working surface of a foam pad used for polishing auto finishes, in particular, includes a base having a support surface for supporting a polishing pad while it is being driven by a polisher power unit with which the polishing pad is used for the actual polishing operation. The base surface has an abrading section made of, preferably, partially perforated thin steel so that sharp corners protrude a selected height above the base surface and a guide fence for guiding the polishing pad as it is moved across the abrading pad so that it is held true and square, until the polishing pad is provided with a new flat and square working surface. The support surface is of size so that it will support the entire polishing pad while the abrading pad has a width slightly more than one-half the diameter of the polishing pad so that the polishing pad is stably held and can be made true and flat.

Abstract: An apparatus for and method of conditioning a polishing pad suitable for in-situ use, is described. The apparatus consists of a wedge-shaped conditioning plate whose width varies as a function of its length and whose exact geometry is a function of the radial effects of the polishing process effecting conditioning of the polishing pad. The conditioning plate rests on the polishing pad and is surrounded by a loose-fitting frame that holds the conditioning plate stationary with respect to the rotating polishing table, preventing lateral movement of the conditioning plate, but allowing the plate to move in the vertical direction so that it can rest flat on the polishing pad.

Abstract: An apparatus and method for refurbishing fixed-abrasive polishing pads. In one embodiment, a refurbishing device has an arm positionable over the planarizing surface of the polishing pad, a refurbishing element attached to one end of the arm, and an actuator connected to the other end of the arm. The refurbishing element has a non-abrasive contact medium engageable with the planarizing surface of the polishing pad that does not abrade or otherwise damage raised features on the fixed-abrasive pad under desired conditioning down forces. The actuator moves the arm downwardly and upwardly with respect to the planarizing surface to engage and disengage the non-abrasive contact medium with the planarizing surface of the polishing pad. The refurbishing device may also have a conditioning solution dispenser positionable proximate to the planarizing surface of the polishing pad to dispense a liquid conditioning solution onto the planarizing surface.

Abstract: Polishing apparatus cuts and shapes a polishing pad to produce a polishing surface which minimizes pad runout and which can be contoured to better achieve desired polishing rates, pressures, and performance with respect to selected areas on a semiconductor wafer being processed with the polishing pad.

Abstract: The present invention is a pad scrubber that cleans the planarizing surface of a polishing pad used in CMP processing of semiconductor wafers. The pad scrubber has a fluid manifold, a first nozzle attached to one side of the manifold, and a second nozzle attached to another side of the manifold. The first nozzle directs a first fluid stream generally outwardly toward a peripheral edge of the pad, and the second nozzle directs a second fluid stream generally outwardly to the peripheral edge of the pad and also toward the first fluid stream. The first and second fluid streams converge on the planarizing surface of the pad to separate accumulated waste matter from the polishing pad and to create a contained stream of separated particles that flows across the planarizing surface to the peripheral edge of the pad.

Abstract: A method and apparatus for conditioning a polishing pad improves the polishing characteristics of the pad by providing an embedded pattern that facilitates polishing and reduces glazing. Moreover, the present invention conditions a pad without significantly abrading the polishing surface, thereby prolonging the pad's useful life. A series of independently rotatable rollers having a knurled outer surface is used to embed a pattern of score marks in the surface of the polishing pad. Alternatively, a knurled conical roller engages a radius of the pad. The apparatus is adaptable to either manual or automated processes. The present invention is particularly useful for conditioning polishing pads used in the fabrication of semiconductor wafers.

Abstract: A polishing apparatus is equipped with a wafer holder and a pad conditioner concurrently changed to working position over a polishing pad, and the polishing pad grinds the semiconductor wafer under concurrent cleaning operation thereon so as to enhance the throughput of the polishing apparatus: grooves are formed in a wafer carrier of the wafer holder for sufficiently supplying polishing slurry to the semiconductor wafer, and a guide wall is provided over the polishing pad so as to cause the polishing slurry to partly return to a central area of the polishing pad.

Abstract: A method and an apparatus are for machining semiconductor material with a inding tool while feeding a liquid cleaning agent to the working surface of the grinding tool, has the cleaning agent being exposed to sound waves having a specific frequency and having a specific intensity. In one embodiment of the method, the cleaning agent is exposed to sound waves in at least one nozzle and then the cleaning agent is directed against the working surface of the grinding tool. In another embodiment, the cleaning agent is guided through at least two cleaning agent jets against the working surface of the grinding tool, which cleaning agent jets differ from each other in that they are exposed to sound waves of different frequencies.

Abstract: A method and an apparatus for sharpening the surface of a grindstone for a pulp grinder. In the method a high-pressure water jet is obliquely projected on the surface of the grindstone for detaching bonding material between abrasive grains, without excessively wearing a medium between grinding segments.The apparatus comprises a nozzle, arranged to spray water obliquely onto the surface of the grindstone and a high-pressure pump for feeding high-pressure water through the nozzle. The nozzle is arranged to be moved by transfer means in the axial direction of the grindstone while the grindstone is being rotated.

Abstract: The invention relates to an apparatus for polishing wafers in the fabrication of semiconductor integrated circuits. The apparatus has a turntable on which a polishing pad of polyurethane foam is placed. The pad has a multiplicity of cavities in the polishing surface. In periodically dressing the pad, abrasive grains of diamond fall off the dressing tool, and some of the fallen abrasive grains remain in the cavities in the pad surface even though the pad surface is washed by water. According to the invention the polishing apparatus includes a cleaning device to drive abrasive grains out of the cavities. The cleaning device has a cylindrical body which rotates above the polishing pad. In an embodiment the cleaning device is a rotary brush having a multiplicity of needle-like parts of a synthetic resin on the cylindrical outer surface. The needle-like parts intrude into the cavities in the pad surface and flip abrasive grains out of the cavities.

Abstract: A method and apparatus for determining the amount of conditioning required to be applied to a polishing pad to achieve a desired removal rate during the polishing of a semiconductor wafer utilizes a rotating conditioning wheel in contact with a rotating polishing pad. Preselected points on just polished wafers are measured for removal rate and such measurements are used to calculate the removal rate as a function of wafer radius. When the removal rate changes by a preselected amount, the polishing pad is conditioned in accordance with the calculations.

Abstract: The present invention is a method for selectively reconditioning a polishing pad used in chemical-mechanical planarization of semiconductor wafers. A desired polishing rate is selected based upon a set of operating parameters for a specific wafer. The set of operating parameters may be different from those of previously planarized wafers. A desired change in the thickness of the pad material is estimated for reconditioning the pad to achieve a desired polishing rate. The estimate of the desired change in pad thickness is based upon the desired polishing rate and a predetermined correlation between wafer polishing rates and changes in pad thickness per conditioning cycle. A layer of material having a thickness substantially equal to the desired change in thickness is then removed from the planarizing surface to create a new planarizing surface.

Abstract: The process for grinding a rotating rubber roll by means of a grinding wheel is taking place in such a way that at least during the last grinding cut a rotating plugging roll is applied to the grinding wheel which plugging roll has a harder rubber than the rubber roll.

Abstract: A dressing apparatus is used to resurface a polishing surface of a polish cloth used to polish semiconductor wafers. A dressing brush which spins on its own axis is also coupled to a drive shaft of a main drive of the dressing apparatus through a planetary gear mechanism so that the brush will rotate or orbit about the drive shaft. Therefore, the dressing brush traces a complex path and its dressing action is spread over a wide surface area of the polishing cloth to produce thorough resurfacing of the polishing surface. The service life of the cloth is significantly increased and contributes to improving the overall efficiency of preparing high quality polished semiconductor wafers. For economy, the dressing apparatus can be mounted easily on a conventional polishing apparatus having a dressing facility.

Abstract: A blowing device for a belt grinding machine has a nozzle arrangement having nozzles positioned relative to its grinding belt for blowing cleaning air jets onto the circulating grinding belt. The device further has an oscillating drive to oscillate the nozzle arrangement in the longitudinal direction thereof. A pair of elastic members suspend the nozzle arrangement, which is oscillated in the longitudinal direction by using a magnetic field. A ferromagnetic member is connected to the nozzle arrangement and is positioned within the magnetic field produced by an electric coil. By varying the magnetic field, the nozzle arrangement can be moved in the longitudinal direction, the spring providing an elastic restoring force to move the nozzle arrangement is the opposite direction when the magnetic field is turned off.

Abstract: Sanding accessory for a conventional belt sander or the like, enabling manually held workpieces to be sanded to a super-smooth finish without rounding off their edges. A workpiece held by hand sideways against a fence parallel to the direction of travel of the belt moves forward by belt friction to a crosswise face of the fence and is retained there as the fence reciprocates laterally across the belt and back, sanding the workpiece evenly and distributing the belt wear uniformly over substantially its entire abrasive surface.

Abstract: The present invention is a pad scrubber that cleans the planarizing surface of a polishing pad used in CMP processing of semiconductor wafers. The pad scrubber has a fluid manifold, a first nozzle attached to one side of the manifold, and a second nozzle attached to another side of the manifold. The first nozzle directs a first fluid stream generally outwardly toward a peripheral edge of the pad, and the second nozzle directs a second fluid stream generally outwardly to the peripheral edge of the pad and also toward the first fluid stream. The first and second fluid streams converge on the planarizing surface of the pad to separate accumulated waste matter from the polishing pad and to create a contained stream of separated particles that flows across the planarizing surface to the peripheral edge of the pad.

Abstract: A method and apparatus for conditioning and/or rinsing a pad in a chemical-mechanical polisher. A scoring apparatus is rotated about its center directly over the polishing pad of the chemical-mechanical polisher. The scoring apparatus scores the pad surface while rotating above the pad. Consequently the pad is conditioned in a uniform and concentric fashion.

Abstract: A method and apparatus is achieved for creating or restoring a high friction surface to a drive roller 52. Abrasive pads 12 define a scrubbing surface for acting upon a media roller's surface 54-58. As the roller's surface is scrubbed, creping occurs which increases the surface's coefficient of friction, and more particularly, the coefficient of friction between the roller and media sheet ("COF(rm)"). In one embodiment, the creping apparatus is formed by a pair of plates 16, 18 hinged along one edge 30 and open along an opposite edge 28. A spring 19 is positioned between the plates biasing the plates apart at the open end. One or more abrasive pads are attached to the outer surface of one plate 18. The spring is selected to provide a specific biasing force. To create or restore a high friction surface, the apparatus 10 is positioned adjacent to the roller 52.

Abstract: A preconditioning plate (10) prepares the surface of a polishing pad (24) to prepare the pad's surface for subsequent metal polishing of semiconductor wafers (27). The preconditioning plate has at least three intersecting radial ridges (14) on its surface and is made from a rigid plastic material. The preconditioning plate is rotated relative to the surface of the polishing pad prior to actual polishing to provide a uniform and stable polishing surface. The preconditioning plate does not abrade or wear away the polishing pad, nor does it form grooves in the polishing pad. Additionally, the preconditioning plate is reusable.

Abstract: A device for conditioning the surface of a polishing pad covering a platen mounted on a polishing machine for rotation about a vertical axis, comprising a rigid carrier element carrying cutting means on its bottom surface and which is adapted for vertical movement into and out of engagement with the surface of a polishing pad and which is adapted for oscillating horizontal movement over the surface of the polishing pad. The cutting means are dispersed in a circular or ring configuration.

Abstract: A cleaner for attachment to a wide belt sander, the cleaner being mounted adjacent the top roller of the belt sander. The cleaner is applied to the sanding belt only during operation of the sander.

Abstract: A hand-held cleaning and dressing tool for foam buffing pads includes a series of toothed cleaning wheels mounted for independent rotation on a common shaft attached to the end of a pistol grip handle. The cleaning wheels are shrouded to help capture caked material picked up from the surface of the rotating pad. The tool also includes an abrasive dressing surface to reshape the buffing pad as a result of wear. Both the cleaning and dressing tools are operated by holding the same in operative contact with the rotatably driven pad.

Abstract: A turntable with an abrasive cloth mounted thereon and a top ring positioned above the turntable are independently rotatably provided. The top ring holds a workpiece to be polished and presses the workpiece against the abrasive cloth. The turntable and the top ring are rotated to polish the surface of the workpiece to a flat mirror finish on the abrasive cloth. A rotatable brush pressed against the abrasive cloth is rotated about an axis substantially perpendicularly to the plane of the abrasive cloth, and oscillated substantially radially between radially inner and outer positions over the abrasive cloth. A cleaning solution is sprayed from a nozzle onto the abrasive cloth. The turntable has a bank along an outer circumferential edge thereof for preventing a protective solution, which is supplied to the abrasive cloth to keep the abrasive cloth wet and prevent it, from flowing off the turntable when the turntable is stationary.