Abstract: A single-side polishing method, and an apparatus therefor, for the upper surface and the end face of a substrate edge with a polishing strip are provided. The apparatus comprises a substrate holding member rotatably holding the substrate and a supporting a member capable of coming into contact with and retreating from the substrate holding member; a moving section pressed by a force imparting member against a single side and an end face of the substrate edge via the polishing strip is arranged so that the polishing strip polishes the side and the end face of the substrate edge upon rotation of the substrate.

Abstract: A machine for grinding coated sheets of glass has a supporting surface for a sheet of glass for grinding, and two grinding units located on opposite sides of the supporting surface; each grinding unit having at least one first grinding wheel for grinding a portion of a peripheral edge of the sheet of glass, and a second grinding wheel for removing a portion of the layer of material coating the sheet of glass.

Abstract: A bilateral edge-type machine for machining the edges of glass, or stone-like plate materials and the like comprising a supporting frame for a plurality of machining heads arranged on both sides of the plate being machined. Each head comprises a structure associated with a supporting body which is connected to the frame. The structure has, on one side, a grinding wheel supporting spindle which is directed upward and, on the other side, an actuation motor which is directed upward. The motor is connected to the spindle by way of a belt drive.

Abstract: A pre-cutter or edger machine for processing the periphery of an optic is provided. The pre-cutter or edger machine of the present invention is advantageous in that it provides a machine that eliminates the need to mount the optic on a block, is completely automatic, and has a cycle time of approximately 10 seconds. The machine also is capable of pre-cutting or edging an optic to any of a number of different diameters or shapes with or without the need for traced data. The machine cleans the optic automatically and maintains the edge processing stations substantially free from debris.

Abstract: A tool mountable on a high speed spindle of a CNC machine tool, operable to finish a side edge of a flat workpiece positioned directly on a support surface of the machine tool, generally consisting of a member having a shank portion removeably mountable on the spindle of the toolhead assembly of the machine, and a head section. The head section is provided with an annular side surface engageable with the side edge of a flat workpiece positioned directly on the support surface of the table of the machine. The annular surface also is provided with a profile corresponding to the profile of the side edge of the workpiece being finished, and abrasive particles bonded thereto.

Abstract: A method for reducing thickness of spin-on glass on semiconductor wafers includes rotatably mounting a semiconductor wafer and positioning a grinding member proximate an outer edge of the semiconductor wafer. The method further includes rotating both the semiconductor wafer and the grinding member, and engaging the rotating grinding member with the outer edge of the rotating semiconductor wafer while applying a chemical to the outer edge.

Abstract: For two-side processing of optical lenses, the invention provides that blanks to be used for each lens body (7) comprise a chucking extension (18) whereby a single machine is sufficient for implementing the procedure. In addition to workpiece spindles (1, 2) as well as tool spindles (4, 5) with coarse tools (8) and finishing tools (9), the machine also includes an unloading device (10) and a loading device (13) which in successive interacting operations take the lens body (7) when processed on one side and at the circumference from a chucking tool (12) of the tool spindle (1) and turn it round for centered insertion in its inverted position into a chucking tool (15) of the tool spindle (2) for processing on the other side. The workpiece spindles (1, 2) may be mounted parallel to each other on a horizontally displaceable and vertically adjustable feed slide (3). A feed carriage (6) may displace and slew the tool spindles (4, 5) together with the unloading device (10) around a horizontal B axis.

Abstract: An apparatus and method for honing, sharpening or grinding a curved peripheral cutting surface of a slicer blade are provided. Included is the use of one of a set of interchangeable cams that generally follows the curved shape of the blade cutting surface, whether same has a constant radius or varying radii. The honing is accomplished off-line of the slicer equipment, and the movement of two honing or grinding wheels is closely controlled so as to provide honed or ground cutting edges which are of substantially uniform width throughout their respective peripheries. The two honing or grinding wheels operate independently of each other on opposing edges of the blade, a large blade load area is provided therebetween, precision gib adjustments are provided between the wheel and the cam follower, and a single tool is needed to make adjustments of the apparatus.

Abstract: A method for making magnetic disks comprises the steps of: applying a protective layer of material on a sheet of glass; b) cutting the sheet of glass into glass squares; c) stacking the glass squares; d) removing a circular core from the stack of glass squares, thereby defining the inner diameter of the glass substrates being formed; e) using a cutting annulus to cut through the stack of glass squares, thereby forming a stack of glass disks; f) subjecting the stack of glass disks to an edge polishing process to round the corners of the glass disks both at the inner and outer diameters; h) unstacking the glass disks; i) removing the protective layers from the glass disks; j) subjecting the glass disks to a chemical strengthening step; and k) sputtering an underlayer, magnetic layer and protective overcoat onto the glass substrate to thereby form a magnetic disk.

Abstract: A process, multi-functional grinding wheel and apparatus for mirror-finishing the edge of at least one of a cut unfinished glass recording disk or a cut unfinished glass-ceramic recording disk.

Abstract: A utility wafer, more specifically, an utility wafer for simulating a workpiece in a semiconductor processing system. The utility wafer includes a first side, a second side and a peripheral edge wherein one or both edges of the peripheral edge are relieved to remove the otherwise sharp edge. In one embodiment, the peripheral edge is polished. The utility wafer is resistant to chipping, stress cracking and breakage when undergoing chemical mechanical planarization.

Abstract: A method of forming a laminated glass substrate structure suitable for use in a display device or the like, includes the steps of: a) preparing a first glass substrate having first and second main faces; b) preparing a second glass substrate having third and fourth main faces; c) after the steps a) and b), adhering the first and second glass substrates with a space formed therebetween and with the third main face facing to the second main face; and d) after the step c), performing a smoothing process relative to all edges excepting one edge among edges defining the first main face. The laminated glass substrate structure provides an improved load resistance.

Abstract: An apparatus for cleaning edges and/or bevel areas of substrates. In one embodiment, the present invention provides a cleaning mechanism that cleans particles off the edge of the wafer based upon friction at the contact point between the wafer and a rotating belt.

Abstract: A method and apparatus for processing of planar rigid materials is provided whereby the edges of separate materials can be processed simultaneously, quickly and efficiently. Separate planar materials are moved in position and are clamped in place in horizontal alignment. Thereafter a grinding wheel moves between the opposing edges of the planar materials to abrade the leading edge of one of the materials and the trailing edge of the second opposing material. The process describes abrading both the longitudinal and lateral edges of rectangular shaped materials moved along conveyors, such planar materials being glass, ceramic, stone or the like.

Abstract: A method for glass substrate chamfering using a metal-bonded outer-surface grindstone 12 for simultaneously processing the end surface and the oblique surfaces of the outer periphery of a doughnut-like glass substrate 1 with a circular hole 1a at the center thereof, and a metal-bonded inner-surface grindstone 14 for simultaneously processing the end surface and the oblique surfaces of the inner periphery are provided; the outer-surface grindstone and the inner-surface grindstone simultaneously grind end surfaces and oblique surfaces of the outer and inner peripheries of the glass substrate, and during grinding, the outer-surface grindstone is sharpened by dressing it electrolytically, and the inner-surface grindstone is sharpened by an electrolytic dressing when not processing as the glass substrate is being replaced.

Abstract: A method for processing a peripheral portion of a thin plate, comprises the steps of; contacting the thin plate with a processing part of a tool, which has a round free end and projects to the thin plate in order to process the contacted peripheral portion of the thin plate, and moving at least one selected from the tool and the thin plate in a direction of the other, which is parallel to a main surface of the thin plate and in a direction of the other, which is normal to the main surface of the thin plate, in order to change one contacting point between the peripheral portion of the thin plate and the processing part of the tool to another contacting point and to process the changed contacting point of the peripheral portion of the thin plate.

Abstract: An apparatus for cleaning edges of substrates is described. The present invention provides a cleaning mechanism that cleans particles off the edge of the wafer based on friction and/or a difference in tangential velocity at a point of contact between the wafer and the cleaning mechanism.

Abstract: A workpiece 23 formed of a circular thin plate is rotated about its center as an axis L1. Each of disk-shaped rotating grinding wheels 27 and 28, while being rotated about an axis L3 extending in a direction substantially parallel to the plane of the workpiece 23 and perpendicular to the radial direction of the workpiece 23, is made to undergo relative feeding movement on both obverse and reverse surface sides of the workpiece 23 along an outer peripheral edge portion 23a of the workpiece 23. Consequently, the outer peripheral edge portion 23a of the workpiece 23 is ground by an outer peripheral surface of each of the rotating grinding wheels 27 and 28. In this case, it is preferred that two grinding wheels 27 and 28 for rough grinding and finish grinding be provided as the disk-shaped rotating grinding wheels, and that rough grinding and finish grinding are performed by the same station.

Abstract: A method for chamfer mirror-like polishing a wafer having an orientation flat by rotating the wafer in a state of being pressed by a rotating buffering wheel with a predetermined pressure, is disclosed. Mirror-surface polishing a stable wafer chamfer can be obtained with a relatively simple control system. The invention is predicated in the fact that the wafer rotation speed Ns has low inertial mass and low rotation speed so that the wafer rotation speed control can be obtained with high response property and high accuracy compared to pressing pressure control and buffering wheel control, and it features detecting intrinsic peripheral part, corners and orientation flat part of wafer according to a detection signal of detection means for detecting the wafer mirror-like polishing position and controlling the wafer rotation speed Ns according to the detected wafer mirror-like polishing position.

Abstract: An apparatus for cleaning edges and/or bevel areas of substrates. In one embodiment, the present invention provides a cleaning mechanism that cleans particles off the edge of the wafer based upon friction at the contact point between the wafer and a rotating belt.

Abstract: A method and system for the manufacture of ophthalmic lenses comprising a computer (102) and a CNC machining platform (104) in operative connection with the computer. The CNC machining platform includes a mounting stage (110), a block (106) in releasable connection with the mounting stage, and a machining tool (112). When an unfinished lens blank (108) is properly mounted on the block, the computer is operative to direct the CNC machining platform to perform both back surface generation and patternless edging of the lens blank in one machining cycle. The computer is further operative to direct the CNC machining platform to machine a lap tool for each lens and machine a block for receiving each lens. The block is machined by the platform to include scribe lines for facilitating proper alignment of lens blank.

Abstract: The following was done in order to mechanically polish a bevel face after bevel finishing without manually polishing and thereby speed up the polishing process and improve uniformity of finishing precision, as well as obtain fashionable eyeglasses: That is, a polishing wheel for polishing a bevel with a bevel polishing groove the shape of which essentially matches the bevel faces of the finished lens is used. The bevel is polished in two processes using said wheel. During the first process, the apex position of the bevel in the finished lens is displaced from the bevel-groove center position of the bevel polishing groove in the wheel to the concave side of the lens and the polishing allowance on the concave side of the bevel faces is polished.

Abstract: An outer edge ring of a semiconductor wafer is polished to prevent delamination and peeling-off of at least one layer of material deposited near the outer edge of the semiconductor wafer during fabrication of integrated circuits. The semiconductor wafer is mounted on a wafer chuck, and the wafer chuck holding the semiconductor wafer is rotated such that the semiconductor wafer rotates. A polishing pad is moved toward the semiconductor wafer as the semiconductor wafer is rotating. The polishing pad has a polishing surface that faces and contacts the outer edge ring of the semiconductor wafer as the polishing pad is moved toward the semiconductor wafer to polish the outer edge ring of the semiconductor wafer. The outer edge ring has the at least one layer of material that is polished off by the polishing surface of the polishing pad.

Abstract: A method for edge finishing glass sheets. Glass sheets are separated into desired sizes, after which the edges of the glass sheets are finished using first grinding wheels to grind the edges, followed by polishing wheels to round off the ground edges by contacting and moving the edges of the glass sheet against stationary rotating grinding and polishing wheels which are each oriented approximately parallel to the major surface of the glass sheet.

Abstract: This device is a computer numerically controlled (CNC) machine tool such as an edge grinding apparatus. More specifically, the device is a CNC apparatus for processing blanks such as a glass sheet. The device uses a sensor to program the path of the grinding wheel. The device analyzes the position of all like-workpieces placed in the machine and creates offset parameters to accurately process each workpiece in accordance with the initial preprogrammed path.

Abstract: An eyeglass-frame-shape measuring device for measuring a lens frame shape of an eyeglass frame has a holding mechanism for holding the frame in a predetermined condition, a feeler movable while being kept in contact with a frame groove of the frame held by the holding mechanism, a measuring mechanism for obtaining information (rn, &thgr;n) on radius vector of the frame based on an amount of movement of the feeler, a moving mechanism having a first motor for moving the feeler in a direction of the radius vector of the frame, and a control mechanism for variably controlling driving of the first motor during measurement based on the information on the radius vector obtained by the measuring mechanism.

Abstract: The disk edge polishing machine is capable of polishing an inner edge of a center hole of a disk and an outer edge thereof. In the disk edge polishing machine, a sucking member has a cylindrical end section. The sucking member sucks the disk by the cylindrical end section and exposes the inner edge and the outer edge of the disk. The sucking member spins together with the disk. An outer polishing member polishes the outer edge of the disk. An inner polishing member is inserted into the center hole and simultaneously polishes the inner edge of the disk. A first driving mechanism relatively moves the outer polishing member and the sucking member close to and away from the outer edge of the disk along a predetermined course. A second driving mechanism relatively moves the inner polishing member and the sucking member close to and away from the inner edge of the disk along another predetermined course extended from the predetermined course.

Abstract: In the wafer chamfering method, there is used a disk-shaped grindstone 8 which includes: a peripheral edge portion serving as a grinding surface 1; a flat portion formed in the central portion of the grinding surface 1 in the width direction thereof; and, two edge portions 5 respectively formed on the two sides of the flat portion 2 in the width direction thereof and made in the form of the shape of the valley portion of the notch portion 4 of a disk-shaped wafer 3 to be chamfered. In operation, in the wafer chamfering method, while rotating the above grindstone 8, the grindstone 8 is revolved in the thickness direction of the wafer 3 to thereby chamfer the wafer 3.

Abstract: An edge face of a deposited film at an edge portion of a device wafer having the deposited film formed on a substrate is polished at a substantially right angle so as to prevent the deposited film from peeling-off and dusting. A forming body having a sectional shape substantially agreeing with that of an edge portion of a device wafer after polishing, which is an object to be polished, is rotated and brought into contact with a polishing body so as to form a polishing portion on the polishing body surface. The edge portion of the object to be polished is rotated and urged into contact with the formed polishing portion, so that the edge portion of the object to be polished is polished in a sectional shape agreeing with that of the polishing portion of the polishing body. The edge face of the deposited film on the substrate surface is polished not slantingly but at a right angel so as to be removed, so that peeling-off of the deposited film due to a post-process, etc.

Abstract: A method and apparatus for processing of planar rigid materials is provided whereby the edges of separate materials can be processed simultaneously, quickly and efficiently. Separate planar materials are moved in position and are clamped in place in horizontal alignment. Thereafter a grinding wheel moves between the opposing edges of the planar materials to abrade the leading edge of one of the materials and the trailing edge of the second opposing material. The process describes abrading both the longitudinal and lateral edges of rectangular shaped materials moved along conveyors, such planar materials being glass, ceramic, stone or the like.

Abstract: The notch polishing machine employs a plurality of polishing tapes which can be sequentially introduced into the notch of a wafer to polish both sides of the notch, i.e. the top and bottom surfaces. Each tape is pulled off a supply reel and passed into a mounting block sized to fit into the wafer notch. Each block is also mounted to be oscillated to effect a polishing action. Also, all the blocks are mounted in common to be pivoted between a position angularly disposed relative to the top of the top of the wafer and a position angularly disposed relative to the bottom of the wafer.

Abstract: In the wafer chamfering method, there is used a disk-shaped grindstone 8 which includes: a peripheral edge portion serving as a grinding surface 1; a flat portion formed in the central portion of the grinding surface 1 in the width direction thereof; and, two edge portions 5 respectively formed on the two sides of the flat portion 2 in the width direction thereof and made in the form of the shape of the valley portion of the notch portion 4 of a disk-shaped wafer 3 to be chamfered. In operation, in the wafer chamfering method, while rotating the above grindstone 8, the grindstone 8 is revolved in the thickness direction of the wafer 3 to thereby chamfer the wafer 3.

Abstract: The present invention provides a polishing compound which does not make stain grow on the surface of work-piece comprising, the dispersion containing 1-30 wt. % of metal oxide particles having 8-500 nm average diameter, acid or alkali and salt, and whose pH is 7-12. Desirably said polishing compound is the compound in which water soluble organic solvent is contained. Further, present invention provides edge polishing method and surface polishing method by use of said polishing compound.

Abstract: A grinding disk (20) has a a peripheral groove for grinding the edges of glass panes (11), whereby a cooling liquid is fed to the point of grinding (18). When the disk (20) is in a mounted position, a lateral stop surface (8) fits closely against the opposite surface (7) of the grinding spindle, whereby the axial position thereof in relation to the lane of the glass pane can be adjusted. In order to increase the service life of said tool, irrespective of the composition of the abrasive product, the grinding disk (20) has a stop surface (8(I), 8(II)) on two opposite-lying flat sides (I, II) in addition to two peripheral grooves (13,14), whereby each peripheral groove is assigned to one of the two stop surfaces (8(I), 8(II)). The two peripheral grooves (13,14) are located at the same distance (X,X) from the respective stop surfaces (8(I), 8(II)).

Abstract: The invention relates to an axially-functioning grinding tool (10) for fastening on a rotary shaft (14), wherein the tool (10) comprises an inner rotating area (11) and an outer rotating area (12). The inner rotating area (11) supports a cylinder-shaped grinding device with several layers of a grinding device support, which are arranged concentrically around the longitudinal axis of the rotating shaft (14). The outer rotating area (12) is provided with radially arranged strip-shaped grinding devices.

Abstract: There are disclosed a polishing method and a polishing device in which cleaning of a glass substrate surface can be achieved to a high level. A glass substrate (MD substrate 1) in the shape of a circular disc having a circular hole in a center portion is immersed in an abrasive liquid 50 containing free abrasive grains, and an inner peripheral end surface of the glass substrate is polished using the abrasive liquid containing the free abrasive grains by rotating a rotary brush 4 or a polishing pad in contact with the inner peripheral end surface.

Abstract: A grindstone and a wafer are rotated at high speeds in the same direction. The rotating wafer is slowly moved toward the rotating grindstone to thereby gradually chamfer the periphery of the wafer.

Abstract: A method of grinding the edge of a disc uses a grinding machine having mounted thereon a grooved grinding wheel, in which the groove is formed in situ using a forming wheel also mounted on the grinding machine. After a workpiece has been ground or after a succession of workpieces have been ground, re-engaging the grinding wheel and the forming wheel with the grinding wheel remaining in situ, to re-form the groove in the grinding wheel to correct for wear.

Abstract: A new method is provided to edge and bevel the periphery of a semiconductor substrate. The wafer is positioned in a horizontal plane and held in place against two positioning pegs. The wafer is rotated and slurry is distributed over the periphery of the substrate surface. The periphery of the wafer is entered into one or more abrasive fixtures, also referred to as bevel/edge heads. These abrasive fixtures will create the desired edge and the desired bevel around the periphery of the substrate.

Abstract: This invention provides an improved machine for finishing the edges of glass or other brittle materials. The machine is distinguished by its few moving parts, and its ease of maintenance. The edge-finishing machine includes a main conveyor section including two toothed main belts that grip and convey the glass or other material to be finished past grinding or polishing wheels, or other means for finishing the edges of the material. These main conveyor belts are synchronously driven, each by a separate motor or other power transmission unit. The main conveyor section of the machine also includes means to tension the main belts, preferably including non-rotating returns made from durable, low-friction material such as ultra-high molecular weight plastic.

Abstract: An apparatus and process for chemical-mechanical polishing an edge of a semiconductor wafer using a heated polishing pad and a heated liquid chemical slurry. The apparatus includes a rotatable drum having a cylindric outer surface, a heatable mat positioned around the outer surface of the drum, and a polishing pad in generally parallel arrangement with the mat. A wafer holder, a container of liquid slurry, and a slurry delivery system are also included. The process includes the steps of heating a liquid slurry to an elevated temperature and applying heat to the polishing pad from an underside of the polishing pad to elevate the temperature of the polishing pad. A peripheral edge of a semiconductor wafer is engaged against a polishing side of the polishing pad, and a relative motion is effected between the wafer and the pad while simultaneously dispensing the heated slurry onto a region where the edge of the wafer engages the pad.

Abstract: A work chamfering apparatus includes a work holding portion. The work holding portion includes a work table and a clamper. The work table has an upper surface having two end portions each formed with holding grains projecting out of the upper surface. The two end portions of the upper surface of the work table have a static friction coefficient greater than 0.1, which is greater than that of a center portion. When chamfering, first, the work is held by the work table and a generally U-shaped member of the clamper. At this time, the two end portions of the upper surface of the work table contact a lower surface of the work, whereas lower surfaces of respective end portions of the U-shaped member contact an upper surface of the work. In this state, a rotating center of the work is between the lower surfaces, and the lower surfaces are apart generally equally from the rotating center.

Abstract: An eyeglass lens grinding apparatus which is designed to ensure that the lens processing operation proceeds smoothly enough to streamline the overall process flow. Processing information about right and left eyeglass lenses is provided on the basis of information about configuration of the eyeglass frame and information about a layout of each eyeglass lens with respect to the eyeglass frame. The processing information about the eyeglass lenses is stored in a memory even after processing has ended. Information about size correction is entered to modify the processing information. Lens corrective processing information is provided on the basis of the entered corrective information and the processing information stored in the memory. After sequentially processing the right and left eyeglass lenses on the basis of the processing information, corrective processing is carried out on the basis of the corrective processing information.

Abstract: A substrate holder for holding a substrate to be polished thereon and pressing the substrate against a polishing pad includes a substrate-holding head for holding the substrate thereon and pressing the substrate against the polishing pad. The substrate-holding head is disposed to be vertically movable toward/away from the polishing pad. A pressing member for pressing a peripheral region of the substrate, except for an outer edge region thereof, against the polishing pad is attached to the substrate-holding head.

Abstract: To provide a small polishing means featuring high machining efficiency that is capable of efficiently and quickly mirror-polishing an outer periphery of a chamfered workpiece (5) by bringing the outer periphery into even contact with a plurality of polishing drums (2, 2) at the same time. In an apparatus for polishing an outer periphery by bringing an outer periphery of the workpiece (5) retained by workpiece retaining means (3a, 3b) into contact with two polishing drums (2, 2) simultaneously to perform mirror polishing, the workpiece retaining means (3a, 3b) are supported by a sliding mechanism (16) such that they may move in a direction in which the two polishing drums (2, 2) are arranged, thereby to form an aligning means. In addition, the workpiece retaining means (3a, 3b) are provided with loading means (30) for absorbing a force applied to the workpiece retaining means in an X direction, the force being generated due to contact between the rotating workpiece (5) and the polishing drums (2, 2).

Abstract: Method and device for polishing an edge of a work is disclosed, wherein a rubber wheel 6 containing abrasives is rotated in a plane normal to a surface of a work 5 in a form of a thin plate having an edge 5a to be polished. A spindle portion 8 holding the rubber wheel such that the rubber wheel is driven to rotate in a plane normal to the surface of the work. A mount portion 4 for mounting the work 5 thereon such that the work 5 is movable straight with respect to the rubber wheel 6 in a plane normal to the plane in which the rubber wheel 6 is rotated. Elastic means 9 is provided to urge the spindle portion 8 and the work mounting portion 4 in a direction so as to bring the rubber wheel 6 and the edge 5a of the work 5 in contact with each other, wherein one of the spindle portion 8 and the mount portion 4 is movable toward and away from the other during polishing operation.

Abstract: A method of forming a laminated glass substrate structure suitable for use in a display device or the like, includes the steps of: a) preparing a first glass substrate having first and second main faces; b) preparing a second glass substrate having third and fourth main faces; c) after the steps a) and b), adhering the first and second glass substrates with a space formed therebetween and with the third main face facing to the second main face; and d) after the step c), performing a smoothing process relative to all edges excepting one edge among edges defining the first main face. The laminated glass substrate structure provides an improved load resistance.

Abstract: A method and apparatus for polishing chamfers made along the periphery of a semiconductor wafer designed such that when the wafer is once picked up by a rotatory suction cup of a transportation robot arm, the wafer is not released from the suction cup until the entire polishing operation is completed; in an embodiment, a circular turn table having six wafer suction cups is employed which is adapted to turn step-wise, each step consisting of a turn through an angle of 60° to transfer the wafers.

Abstract: A device for edging of glass panes (3) has at least one grinding head as the machining tool, consisting of two crossing belt grinders (10, 12) which simultaneously engage the edges of one border of the glass pane (3) to edge-finish these edges. The belt grinders (10, 12) are supported to swivel in the machine frame (1) so that from a readiness position into their [sic] they can be placed against the edges of one border of the glass pane (3) which is to be edged for example to remove burrs. Because the belt grinders (10, 12) are arranged to be adjustable, their position can be matched to glass panes (3) of varied thickness. When there are several grinding heads, glass panes (3) can be machined at the same time on several borders.

Abstract: The outer periphery of a workpiece (semiconductor wafer) 42 is caused to come into contact with an abrasive material (abrasive cloth) 28 in a cylindrical polishing drum 23, and the polishing drum 23 and the workpiece 42 are relatively rotated, whereby the region where the outer periphery of the workpiece is in contact with the abrasive cloth 28 is increased and a polishing effect can be increased.