Computer Controlled Patents (Class 451/5)
  • Patent number: 10688622
    Abstract: A substrate processing apparatus is provided with a polishing part that polishes a substrate, a transporting part that transports a substrate before polishing to the polishing part, and a cleaning part that cleans the polished substrate. The cleaning part has a first cleaning unit and a second cleaning unit that are vertically arranged in two stages. The first cleaning unit and the second cleaning unit each have a plurality of cleaning modules that are arranged in series. The transporting part has a slide stage that is disposed between the first cleaning unit and the second cleaning unit, and transports a substrate before polishing along an arrangement direction of the plurality of cleaning modules.
    Type: Grant
    Filed: June 6, 2017
    Date of Patent: June 23, 2020
    Assignee: Ebara Corporation
    Inventors: Hiroshi Aono, Kuniaki Yamaguchi, Hiroshi Shimomoto, Koji Maeda, Tetsuya Yashima, Kenji Shinkai, Koichi Hashimoto, Mitsuhiko Inaba, Hidetatsu Isokawa, Hidetaka Nakao, Soichi Isobe
  • Patent number: 10688623
    Abstract: A slurry dispersion system is provided, and includes a slurry source system, an in-line analyzer and a controller. The slurry source system provides a slurry for a chemical mechanical polishing (CMP) process. The in-line analyzer measures at least one parameter of a sampled slurry sampled from the slurry dispersion system, and generates an indication signal based on the parameter, in which the indication signal indicates at lease one characteristic of the slurry. The controller receives the indication signal, and generates a control signal based on the indication signal for performing a real time control on the slurry dispersion system for controlling quality of the slurry.
    Type: Grant
    Filed: September 30, 2014
    Date of Patent: June 23, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: I-Chen Chiang, Hwai-Te Chiu, Yi-Tsang Chen, Chih-Chiang Tseng, Yung-Long Chen
  • Patent number: 10668590
    Abstract: A method and apparatus for blocking an unfinished optical lens member on a blocker for manufacturing an optical lens from the unfinished optical lens member, the latter being provided with a finished surface having a first reference frame, the blocker having a second reference frame, includes: placing the unfinished optical lens member on the blocker; measuring the relative positioning of the first reference frame of the finished surface of the placed unfinished lens member with respect to the positioning of the second reference frame of the blocker; comparing the measured relative positioning with a predetermined relative positioning to determine a relative positioning shift; moving at least the blocker and/or the lens member to change the relative positioning of the first reference frame with respect to the second reference frame to compensate for the relative positioning shift; and blocking the unfinished lens member on the blocker at the changed relative positioning.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: June 2, 2020
    Assignee: Essilor International
    Inventor: Vincent Godot
  • Patent number: 10654148
    Abstract: Systems and methods for conditioning blades are provided. A method may include, for example, obtaining a cutting device, measuring various characteristics of the cutting edge of the cutting device, creating a current edge profile based on the characteristics, creating a modified edge profile, and/or conditioning the blade. Conditioning may include grinding, buffing and/or polishing. One or more of the conditioning steps may be based on the modified edge profile.
    Type: Grant
    Filed: January 11, 2018
    Date of Patent: May 19, 2020
    Assignee: Wolff Industries, Inc.
    Inventors: David Vogel, Walker Newell
  • Patent number: 10576608
    Abstract: Disclosed herein is a dressing board for dressing a cutting blade. The dressing board is held on a chuck table in dressing the cutting blade. The dressing board includes a bar code formed on the front side of the dressing board for indicating kind information on the dressing board, and a groove code formed on the front side of the dressing board at an edge portion thereof, the groove code being composed of grooves having pattern corresponding to that of the bar code. Even when the bar code is cut off by the cutting blade in dressing the cutting blade, the kind information on the dressing board is indicated by the groove code left on the front side of the dressing board.
    Type: Grant
    Filed: January 17, 2018
    Date of Patent: March 3, 2020
    Assignee: DISCO CORPORATION
    Inventor: Kazuma Sekiya
  • Patent number: 10569381
    Abstract: The present invention relates to a method and an apparatus for polishing a surface of a substrate having a film whose thickness varies along a circumferential direction of the substrate. The polishing method includes: obtaining a film-thickness distribution in a circumferential direction of a substrate (W); determining a first area having a maximum or minimum film thickness based on the film-thickness distribution; rotating a polishing table (3) holding a polishing pad (2); pressing a surface of the substrate (W) against the polishing pad (2) while rotating the substrate by a polishing head (1); and polishing the first area at a removal rate different from that of a second area in the surface of the substrate (W).
    Type: Grant
    Filed: July 13, 2016
    Date of Patent: February 25, 2020
    Assignee: Ebara Corporation
    Inventor: Hiroshi Yoshida
  • Patent number: 10562092
    Abstract: A tool for hot stamping metal sheets, formed least partially of a base block and a functional layer, is proposed. The functional layer comprises cooling channels and multiple functional layers, which building upon each other create the connection to the base block. The cooling channels are designed as a cooling channel array and are produced in a laser sintering method.
    Type: Grant
    Filed: December 8, 2014
    Date of Patent: February 18, 2020
    Assignee: MAGNA INTERNATIONAL INC.
    Inventors: Edward Schleichert, Jason Wilson, Mark Fabischeck, Jim Metz, Nick Adam
  • Patent number: 10551816
    Abstract: A numerical controller of the present invention is provided with an oscillating motion data holding unit configured to hold oscillating motion data used for the control of an oscillating motion, an oscillating pulse calculation unit configured to calculate oscillating pulses used for the control of an oscillation axis, based on the oscillating motion data held in the oscillating motion data holding unit, and output the calculated oscillating pulses, a motor control unit configured to control a motor for driving the oscillation axis, based on the oscillating pulses, and an oscillating motion data calculation unit configured to determine a data item related to the oscillating motion to be adjusted, based on the state of a switch means on a control panel of a machine, and to adjust the value of the data item related to the oscillating motion, based on manual pulses input from a manual pulse generator.
    Type: Grant
    Filed: November 16, 2016
    Date of Patent: February 4, 2020
    Assignee: Fanuc Corporation
    Inventor: Yousuke Koyanaka
  • Patent number: 10507593
    Abstract: The invention relates to a cutting system. The cutting system (1) is designed to extend in the direction of a first system axis (7) which extends horizontally along a width (B) of the cutting system (1), in the direction of a second system axis (8) which extends vertically relative to the first system axis (7), and in the direction of a third system axis (9) which extends along the depth (T) of the cutting system orthogonally to the first system axis (7) and the second system axis (8). The cutting system has a support (2), a tool (3; 4) which is received on the support (2) in the form of a saw with a spindle shaft (13; 14), the operating direction of the tool following the direction of the first system axis (7), and an additional tool (5) which is received on the support (2) in the form of a chop saw with a third spindle shaft (15), the operating direction of the additional tool following the direction of the first system axis (7).
    Type: Grant
    Filed: March 13, 2016
    Date of Patent: December 17, 2019
    Assignee: D. Swarovski KG
    Inventors: Johannes Schweigl, Hubert Schwabegger, Joachim Karger, Gerhard Lindenthaler, Andreas Mimm
  • Patent number: 10459425
    Abstract: A numerical control device includes a tool-attitude vector tolerance input unit to accept a tolerance for correction amounts for tool-attitude vectors; a rotation-axis tolerance determining unit to determine, on the basis of tool attitudes calculated from rotation-axis angles before smoothing and of the tolerance for correction amounts for tool-attitude vectors, a tolerance for correction amounts for the rotation-axis angles; a rotation-axis angle smoothing unit to smooth the rotation-axis angles before smoothing so that change in the rotation-axis angle becomes smooth, thereby calculating rotation-axis angles after smoothing; and a rotation-axis angle determining unit to correct the rotation-axis angles after smoothing so as to fall within the tolerance for correction amounts for rotation-axis angles from the rotation-axis angles before smoothing.
    Type: Grant
    Filed: June 11, 2015
    Date of Patent: October 29, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Toshihiro Azuma, Kenji Okuma, Junji Matsuno
  • Patent number: 10449655
    Abstract: The polishing apparatus comprises: a dressing section for dressing a polishing pad; a measuring section for measuring a surface property of the polishing pad; a polishing result measuring section for measuring a polishing result of a work; a storing section for storing correlation data between dressing condition data for dressing the polishing pad, surface property of the polishing pad and polishing results, which are learned by an artificial intelligence; and an input section for inputting an object polishing result. The artificial intelligence performs a first arithmetic process, in which the surface property of the polishing pad corresponding to the object polishing result is inversely estimated on the basis of the correlation data, and a second arithmetic process, in which the corresponding dressing condition is derived on the basis of the surface property of the polishing pad inversely estimated.
    Type: Grant
    Filed: January 3, 2018
    Date of Patent: October 22, 2019
    Assignees: FUJIKOSHI MACHINERY CORP., KANAZAWA INSTITUTE OF TECHNOLOGY
    Inventors: Kazutaka Shibuya, Yoshio Nakamura, Michio Uneda, Kenichi Ishikawa
  • Patent number: 10427269
    Abstract: A polishing apparatus which can maintain a polishing load within an appropriate range is disclosed. The polishing apparatus includes: a pressing member for pressing a polishing tool against the substrate; an actuator configured to control a pressing force of the pressing member; a positioning member which is movable together with the pressing member; a stopper arranged to restrict movement of the pressing member and the positioning member; a stopper moving mechanism configured to move the stopper in a predetermined direction; a polishing-load detector configured to obtain a load feedback value which varies according to a polishing load applied to the pressing member; and a stopper-speed determining device configured to determine a movement speed of the stopper which can allow the load feedback value to fall within a set range.
    Type: Grant
    Filed: April 4, 2017
    Date of Patent: October 1, 2019
    Assignee: EBARA CORPORATION
    Inventors: Makoto Kashiwagi, Michiyoshi Yamashita
  • Patent number: 10414015
    Abstract: A polishing apparatus includes a polishing table for supporting a polishing pad and a substrate holding device for pressing a substrate against the polishing pad. The substrate holding device includes an elastic film to form multiple pressure chambers to press the substrate, and a pressure control unit controlling pressure of the pressure chambers. The pressure control unit includes a first flow path connected to a first pressure chamber, and first and second pressure regulation mechanisms. The pressure control unit performs switching control from first pressure regulation mechanism to second pressure regulation mechanism when a set pressure within first pressure chamber reaches a first threshold value. Then, the pressure control unit performs switching control from second pressure regulation mechanism to first pressure regulation mechanism when the set pressure within the first pressure chamber reaches a second threshold value lower than the first threshold value.
    Type: Grant
    Filed: August 26, 2016
    Date of Patent: September 17, 2019
    Assignee: Ebara Corporation
    Inventors: Makoto Fukushima, Hozumi Yasuda, Shingo Togashi
  • Patent number: 10406646
    Abstract: A device and a method for polishing of an optical lens by means of rotary tool are proposed, a fixture for the lens being pivotable around a pivoting axis transversely to the axis of rotation by means of a push-rod adjustment and being pivotable up out of a machining position such that the lens can be changed from overhead. This allows a compact structure and easy changing of the lens.
    Type: Grant
    Filed: February 28, 2012
    Date of Patent: September 10, 2019
    Assignee: SCHNEIDER GMBH & CO. KG
    Inventors: Gunter Schneider, Helwig Buchenauer, Ulf Börner, Klaus Krämer
  • Patent number: 10354902
    Abstract: A conveyance system includes a track, ceiling conveyance vehicles, storage apparatuses, and a conveyance controller configured or programmed to control operations of the ceiling conveyance vehicles and a local vehicle in accordance with an operation mode. The storage apparatus includes a storage plate and the local vehicle that transfer a FOUP between the storage plate and an apparatus port. The conveyance controller switches the operation mode among a first mode prohibiting transfer from the apparatus port to the storage plate by the local vehicle, a second mode prohibiting transfer to the storage plate by any of the ceiling conveyance vehicles and transfer from the storage plate to the apparatus port by the local vehicle, and a third mode that does not restrict transfer by the local vehicle.
    Type: Grant
    Filed: October 13, 2016
    Date of Patent: July 16, 2019
    Assignee: MURATA MACHINERY, LTD.
    Inventors: Osamu Honda, Keiji Yamada, Daisuke Ono, Takashi Nozawa
  • Patent number: 10343255
    Abstract: A polishing apparatus for polishing a substrate is provided. The polishing apparatus includes: a polishing table holding a polishing pad; a top ring configured to press the substrate against the polishing pad; first and second optical heads each configured to apply the light to the substrate and to receive reflected light from the substrate; spectroscopes each configured to measure at each wavelength an intensity of the reflected light received; and a processor configured to produce a spectrum indicating a relationship between intensity and wavelength of the reflected light. The first optical head is arranged so as to face a center of the substrate, and the second optical head is arranged so as to face a peripheral portion of the substrate.
    Type: Grant
    Filed: April 10, 2018
    Date of Patent: July 9, 2019
    Assignee: EBARA CORPORATION
    Inventors: Itsuki Kobata, Yoichi Kobayashi, Katsutoshi Ono, Masaki Kinoshita, Toshifumi Kimba
  • Patent number: 10315271
    Abstract: A dressing system that can appropriately control the dressing amount of the electrode of a spot welding gun so as to not excessively and insufficiently dress the electrode. The dressing system for dressing the electrode of the spot welding gun includes a cutter that dresses the electrode, a controller that controls the rotational operation of the cutter, and a measuring part that measures the dressing amount of the electrode. The controller determines the rotational speed of the cutter based on the dressing amount measured by the measuring part.
    Type: Grant
    Filed: July 23, 2015
    Date of Patent: June 11, 2019
    Assignee: FANUC CORPORATION
    Inventor: Toshimichi Aoki
  • Patent number: 10319807
    Abstract: A wafer group facilitates securing uniformity of products manufactured from the wafer group whose composition varies among wafers. A technique excludes uncertain factors in forming OF, forming OF with extremely high probability and extremely high accuracy, the wafer group being constituted by a plurality of wafers obtained from the same ingot, with all wafers having an orientation flat (OF), wherein the wafer group is constituted by 70 or more wafers, and in the OF orientation accuracy of the wafer group represented by an angle, the OF orientation accuracy in each wafer is within ±0.010°.
    Type: Grant
    Filed: December 9, 2015
    Date of Patent: June 11, 2019
    Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Shinya Shoji, Makoto Ishii, Kazuyuki Umetsu, Junji Sugiura
  • Patent number: 10293451
    Abstract: There is provided a circumference calculating device including an expected shape specifying part 201b configured to obtain an expected finish shape of a bevel in consideration of an interference amount of a beveling tool when beveling is performed to an uncut spectacle lens; and a theoretical circumference calculating part 201d configured to obtain a bevel circumference of the spectacle lens having the expected finish shape obtained by the expected shape specifying part 201b, as a theoretical circumference of this spectacle lens.
    Type: Grant
    Filed: March 18, 2013
    Date of Patent: May 21, 2019
    Assignee: HOYA CORPORATION
    Inventor: Yoshihiro Kikuchi
  • Patent number: 10286520
    Abstract: A double-head grinding machine includes: a spindle driving portion configured to rotate a spindle to which a grinding wheel is attachable; a moving portion configured to move the spindle driving portions toward and away from a wafer; and an inclination measuring portion configured to measure a change in an inclination of the spindle in association with a movement of the spindle driving portions.
    Type: Grant
    Filed: February 26, 2015
    Date of Patent: May 14, 2019
    Assignee: SUMCO CORPORATION
    Inventor: Yoshinobu Nishimura
  • Patent number: 10252084
    Abstract: A device and method to be used in the calibration process for a linear accelerator (LINAC). The optical water surface detector device allows the accurate determine of the height of the water surface in a tank. The device housing includes a light source and a light receiver. The housing can also include a circuit board. The device is mounted on an arm attached to a vertical position mechanism mounted within the tank. The light source within the device is controlled by a main control unit which also receives signals from the receiver and determines the amount of light striking the receiver. The control unit also controls the position of the vertical position mechanism and thus the arm on which the device is mounted.
    Type: Grant
    Filed: November 16, 2016
    Date of Patent: April 9, 2019
    Assignee: AKTINA CORP.
    Inventor: Nicholas G. Zacharopoulos
  • Patent number: 10256104
    Abstract: The present invention relates to a film-thickness measuring method for detecting a film thickness by analyzing optical information contained in a reflected light from a substrate. The film-thickness measuring method includes producing a spectral waveform indicating a relationship between intensity and wavelength of reflected light from a substrate; performing Fourier transform processing on the spectral waveform to determine strengths of frequency components and corresponding film thicknesses; determining local maximum values (M1, M2) of the strengths of the frequency components; and selecting, according to a preset selection rule, one film thickness from film thicknesses (t1, t2) corresponding respectively to the local maximum values (M1, M2). The selection rule is either to select an N-th largest film thickness or to select an N-th smallest film thickness, and N is a predetermined natural number.
    Type: Grant
    Filed: April 5, 2016
    Date of Patent: April 9, 2019
    Assignee: EBARA CORPORATION
    Inventor: Toshifumi Kimba
  • Patent number: 10254572
    Abstract: Provided are an inverting device capable of suppressing a defect caused by wear debris generated by contacting and sliding of clamping members on a substrate with a sealing member, the wear debris being melted when heating the substrate and then adhered thereto after cooling thereof, and a manufacturing method of a liquid crystal display panel using the inverting device. The inverting device includes a main body, an inverting portion, a substrate contact portion, and a substrate support portion. The substrate contact portion and the substrate support portion clamp the substrate, and the inverting portion inverts the substrate. The substrate contact portion and the substrate support portion each have heat-resistant layer with a heat resistance temperature which is equal to or higher than a temperature at which the sealing member is cured by heating.
    Type: Grant
    Filed: July 27, 2017
    Date of Patent: April 9, 2019
    Assignee: SAKAI DISPLAY PRODUCTS CORPORATION
    Inventors: Kenji Asakura, Makoto Tsuji, Kazuyuki Yamasaki
  • Patent number: 10220480
    Abstract: A spindle speed adjusting device in machining is provided, which may include a plurality of signal detection modules, a signal capturing module and a signal processing module. Each of the signal detection modules may keep measuring the vibration signals in machining. The signal capturing module may capture the vibration signals. The signal processing module may execute a transmissibility analysis to obtain the transmissibility between the signal detection modules, and execute a frequency response fitting according to the transmissibility to obtain a plurality of system dynamic parameters, and then execute a stability lobe diagram analysis to calculate the optimized spindle speed of the machining tool so as to make the machining tool operate at the optimized spindle speed. The signal processing module may repeatedly execute the transmissibility analysis, the frequency response fitting and the stability lobe diagram analysis to keep updating the optimized spindle speed until the machining process ends.
    Type: Grant
    Filed: May 22, 2017
    Date of Patent: March 5, 2019
    Assignee: NATIONAL CHUNG CHENG UNIVERSITY
    Inventors: Chih-Chun Cheng, Ping-Chun Tsai, Wen-Nan Cheng, Yu-Hsin Kuo, Yin-Chun Cheng, Yu-Sheng Chiu
  • Patent number: 10198012
    Abstract: A system for automatic routing of chemicals includes a plurality of equipment, including a source and a destination, and one or more possible paths between the source and destination. The system further includes a process control unit to communicate with the equipment, a routing control unit to communicate with the process control unit. The routing control unit is provided with control algorithms for finding an optimum path between the source and the destination based at least partially on feedback from the process control unit.
    Type: Grant
    Filed: September 23, 2014
    Date of Patent: February 5, 2019
    Assignee: National Oilwell Varco Norway AS
    Inventors: Svenn Kristoffersen, Jan Helge Sørensen, Tormod Hertzenberg, Thomas Klemetsen, Deepak Arora
  • Patent number: 10191474
    Abstract: Automated fixture layout is approached in two distinct stages. First, the spatial locations of clamping points on the work piece are determined to ensure immobility of the fixtured part under any infinitesimal perturbation. Second, spatial locations are matched against a user-specified library of reconfigurable clamps to synthesize a valid fixture layout or configuration that includes clamps that are accessible and collision free. The spatial locations matching during the second stage can be the same spatial locations chosen in the first stage to ensure immobility, or a different set of spatial locations.
    Type: Grant
    Filed: January 11, 2016
    Date of Patent: January 29, 2019
    Assignee: Sandvik Intellectual Property AB
    Inventors: Saigopal Nelaturi, Arvind Rangarajan, Tolga Kurtoglu, Christian Fritz
  • Patent number: 10166652
    Abstract: Provided are a device and method for polishing a substrate, in which an upper ground surface, a side surface and a lower ground surface of a substrate can be simultaneously polished, and a polishing wheel can be evenly used on the whole so as to be uniformly abraded. A substrate polishing system is to polish a substrate, of which upper edge and a lower edge are polished, and includes: a table, on which the substrate is secured; a spindle provided at the upper portion of a side surface of the table; a polishing wheel formed in the shape of a cylinder and having a rotating shaft mounted perpendicularly to the substrate, so as to polish the substrate with a side surface thereof while rotating by the spindle; and a Z axis movement means for moving the polishing wheel in the vertical direction during the polishing of the substrate.
    Type: Grant
    Filed: June 2, 2016
    Date of Patent: January 1, 2019
    Assignees: KNJ CO., LTD., SAMSUNG DISPLAY CO., LTD.
    Inventors: Gi-Hwan Bae, Jun-Woo Hong
  • Patent number: 10160056
    Abstract: Arc welding equipment for joining the objects at high speed and for reducing the strain of the objects after being joined is provided. The nozzle housing an electrode forming arc plasma is formed from a gas supply part and a gas suction part. The gas supply part has gas supply holes supplying gas outward in a radial direction of the arc plasma. The gas suction part suctions the gas supplied form the gas supply part. A pair of the gas supply holes, which are disposed so that the electrode is disposed therebetween, supply the gas of a first pressure to a position away from the electrode by a first distance. A pair of the gas supply holes, which are disposed so that the electrode is disposed therebetween other than the pair of the gas supply holes, supply the gas of a second pressure to a position away from the electrode by a second distance. The second distance is longer than the first distance. The gas of the second pressure is lower than that of the first pressure.
    Type: Grant
    Filed: November 5, 2015
    Date of Patent: December 25, 2018
    Assignee: DENSO CORPORATION
    Inventors: Hideaki Shirai, Tsuyoshi Hayakawa, Yuusuke Kataoka
  • Patent number: 10153204
    Abstract: Systems and methods may be provided for generating reduced-height circuit packages such as infrared detector packages. An alignment and dicing system may include an infrared camera that captures images of alignment marks of a wafer assembly through a lid wafer of the wafer assembly, a light source that illuminates the alignment marks through the lid wafer, and dicing equipment that dices the wafer assembly based on infrared images captured using the infrared camera. The light source may illuminate the alignment marks through the lid wafer by providing light such as infrared light to the wafer assembly through optics of the infrared camera. The infrared camera may capture images of alignment marks formed on a detector wafer of the wafer assembly or on an interior or lower surface of the lid wafer through the lid wafer. The dicing equipment may be aligned with the wafer assembly based on the captured images.
    Type: Grant
    Filed: June 2, 2015
    Date of Patent: December 11, 2018
    Assignee: FLIR Systems, Inc.
    Inventors: Tiahaar Kurtheru Clayton McKenzie, Richard E. Bornfreund, Devin Leonard, Gregory A. Carlson
  • Patent number: 10130512
    Abstract: An apparatus for covering a left eye and a right eye of a human, includes: a first eye piece configured for covering a left eye of a human; and a second eye piece configured for covering a right eye of the human; wherein the first eye piece and the second eye piece are configured for preventing transmission of visible light; and wherein at least one of the first eye piece and the second eye piece comprises a region that is transparent for electromagnetic radiation with a wavelength range outside a visible range.
    Type: Grant
    Filed: May 9, 2016
    Date of Patent: November 20, 2018
    Assignee: Natus Medical Incorporated
    Inventor: Thomas Geertsen
  • Patent number: 10108031
    Abstract: The present invention relates to the technical field for detecting a display substrate, and discloses a substrate detection apparatus and a protrusion height detection method. The substrate detection apparatus comprises a carrier configured to carry a substrate to be detected as well as a sensor bracket, a height measuring sensor is disposed at one end of the sensor bracket, the height measuring sensor is of a cone structure, and a diameter of an end face, which is configured to detect the substrate to be detected, of the height measuring sensor is smaller than that of the other end face. The substrate detection apparatus and the protrusion height detection method can solve problems such as inaccurate measurement and inaccurate calculation for a height of a protrusion defect on a color filter substrate.
    Type: Grant
    Filed: August 12, 2015
    Date of Patent: October 23, 2018
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Guilin Liu, Jingjing Li, Xiujuan Cui, Juan Li, Hongyan Zhang, Shanshan Yu
  • Patent number: 10052741
    Abstract: In one embodiment, a semiconductor manufacturing apparatus includes a polishing table configured to hold a polishing pad for polishing a substrate, and to rotate the polishing pad. The apparatus further includes a dressing module configured to hold a dresser for dressing the polishing pad, and to dress a surface of the polishing pad by sweeping the polishing pad with the dresser while rotating the dresser. The apparatus further includes a controller configured to control a number of revolutions of the polishing table based on a position of the dresser to the polishing table, while the polishing pad is dressed.
    Type: Grant
    Filed: August 2, 2016
    Date of Patent: August 21, 2018
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Takashi Watanabe, Shunsuke Doi
  • Patent number: 9969048
    Abstract: A polishing apparatus for polishing a substrate is provided. The polishing apparatus includes: a polishing table holding a polishing pad; a top ring configured to press the substrate against the polishing pad; first and second optical heads each configured to apply the light to the substrate and to receive reflected light from the substrate; spectroscopes each configured to measure at each wavelength an intensity of the reflected light received; and a processor configured to produce a spectrum indicating a relationship between intensity and wavelength of the reflected light. The first optical head is arranged so as to face a center of the substrate, and the second optical head is arranged so as to face a peripheral portion of the substrate.
    Type: Grant
    Filed: July 24, 2015
    Date of Patent: May 15, 2018
    Assignee: Ebara Corporation
    Inventors: Itsuki Kobata, Yoichi Kobayashi, Katsutoshi Ono, Masaki Kinoshita, Toshifumi Kimba
  • Patent number: 9962804
    Abstract: A polishing apparatus includes: a turntable for supporting a polishing pad; a turntable rotation mechanism configured to rotate the turntable; a dresser configured to dress the polishing pad; and a scanning mechanism configured to cause the dresser to scan between a first position and a second position on the polishing pad, wherein Ttt/Tds and Tds/Ttt are a non-integer where the Ttt is a rotation cycle of the turntable during dressing, and the Tds is a scanning cycle during which the dresser scans between the first position and the second position.
    Type: Grant
    Filed: March 15, 2016
    Date of Patent: May 8, 2018
    Assignee: Ebara Corporation
    Inventor: Hiroyuki Shinozaki
  • Patent number: 9925635
    Abstract: In an eyeglass lens processing apparatus, if a material selector selects a thermoplastic material for the lens, a control unit performs a first step and then a second step. In the first step, the control unit controls a lens rotating unit to position a lens in a plurality of lens rotation angles and controls an axis-to-axis distance changing unit to cause a roughing tool to cut into the lens up to a roughing path for each of the plurality of lens rotation angles, the lens being not rotated by the lens rotating unit when the roughing tool is cutting into the lens up to the roughing path. In the second step, the control unit controls the lens rotating unit and the axis-to-axis distance changing unit to rough the lens based on the roughing path while the lens rotating unit rotates the lens.
    Type: Grant
    Filed: September 29, 2011
    Date of Patent: March 27, 2018
    Assignee: NIDEK CO., LTD.
    Inventor: Ryoji Shibata
  • Patent number: 9922852
    Abstract: The invention simplifies airbag calibration. A pressure calibration jig calibrates pressure to be applied to a plurality of airbags disposed inside a top ring for holding and pressing a wafer against a polishing pad. The pressure calibration jig includes a plurality of first passages capable of communicating with the plurality of airbags, respectively; a second passage which combines and connects the plurality of first passages to a pressure calibration sensor; and a flow control portion configured to allow a fluid to flow through the first passage of the plurality of first passages, which first passage corresponds to an airbag selected for pressure calibration, in a direction from the selected airbag toward the second passage, and also configured to prevent the fluid from flowing through the first passages other than the first passage corresponding to the selected airbag in a direction from the second passage toward the airbags.
    Type: Grant
    Filed: April 6, 2015
    Date of Patent: March 20, 2018
    Assignee: EBARA CORPORATION
    Inventors: Suguru Sakugawa, Nobuyuki Takahashi, Toru Maruyama
  • Patent number: 9870788
    Abstract: A method is provided for manufacturing a magneto-resistive device, comprising the steps of: extracting at least one subset of bars from at least one bar section of a wafer; obtaining a magnetic performance of the at least one subset of the bars; determining an angle based on the magnetic performance; and processing remaining bars from the at least one bar section of the wafer based on the determined angle.
    Type: Grant
    Filed: May 13, 2014
    Date of Patent: January 16, 2018
    Assignee: Western Digital (Fremont), LLC
    Inventors: Leo Michael C. Miranda, Mark D. Moravec, Tang Hyok Lim, Reymon G. Ilaw
  • Patent number: 9842783
    Abstract: A polishing method capable of obtaining an accurate thickness of a silicon layer during polishing of a substrate and determining an accurate polishing end point of the substrate based on the thickness of the silicon layer obtained. The method includes: calculating relative reflectance by dividing the measured intensity of the infrared ray by predetermined reference intensity; producing spectral waveform representing relationship between the relative reflectance and wavelength of the infrared ray; performing a Fourier transform process on the spectral waveform to determine a thickness of the silicon layer and a corresponding strength of frequency component; and determining a polishing end point of the substrate based on a point of time when the determined thickness of the silicon layer has reached a predetermined target value.
    Type: Grant
    Filed: December 20, 2016
    Date of Patent: December 12, 2017
    Assignee: EBARA CORPORATION
    Inventor: Toshifumi Kimba
  • Patent number: 9799578
    Abstract: A method of polishing includes storing a predetermined location and a predetermined number as criteria for detecting an end point, polishing a substrate, measuring a sequence of current spectra of light reflected from the substrate while the substrate is being polished, identifying a plurality of peaks or valleys that persist with an evolving location through at least some of the sequence of current spectra, counting a number of peaks or valleys that were identified that pass the predetermined location as polishing progresses, and ceasing to polish the substrate when the number counted reaches the predetermined number.
    Type: Grant
    Filed: December 12, 2016
    Date of Patent: October 24, 2017
    Assignee: Applied Materials, Inc.
    Inventors: Dominic J. Benvegnu, Boguslaw A. Swedek, David J. Lischka
  • Patent number: 9791846
    Abstract: To include an analysis processing unit that obtains a movement command for moving on a movement path in a machining program, and vibration conditions for vibrating along the movement path, a command-movement-amount calculation unit that calculates a command-movement amount per unit time, a vibrational-movement-amount calculation unit that uses the vibration conditions to calculate a vibrational-movement amount per unit time at a time corresponding to the movement command, and a movement-amount combining unit that combines the command-movement amount with the vibrational-movement amount to calculate a combined movement amount, and that acquires a movement amount within the unit time such that a position, which has moved from a reference position for calculating the combined movement amount by the combined movement amount, is located on the movement path.
    Type: Grant
    Filed: February 12, 2013
    Date of Patent: October 17, 2017
    Assignees: Mitsubishi Electric Corporation, CITIZEN WATCH CO., LTD., CITIZEN MACHINERY CO., LTD.
    Inventors: Mitsuo Watanabe, Masakazu Sagasaki, Junichi Kamata, Hiroshi Shinohara, Hajime Matsumaru, Hitoshi Matsumoto, Takanori Shinohara, Akihiko Shinohara, Shigeo Yanagidaira
  • Patent number: 9764364
    Abstract: A movable wafer probe may include: an immersion hood including a top body portion and a bottom foot portion, the top body portion having first inner sidewalls surrounding a top opening, the bottom foot portion having second inner sidewalls surrounding a bottom opening; a transducer disposed above the bottom opening and within the top opening, the transducer spaced apart from the first inner sidewalls of the top body portion by a first spacing, the first spacing forming a fluid exhaust port; and a fluid input port extending through the transducer, a bottom end of the fluid input port opening to the bottom opening.
    Type: Grant
    Filed: December 23, 2014
    Date of Patent: September 19, 2017
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ying-Hsueh Chang Chien, Chin-Hsiang Lin, Chi-Ming Yang, Ming-Hsi Yeh, Shao-Yen Ku
  • Patent number: 9721595
    Abstract: A method for providing a storage device that includes a plurality of read sensor stacks for each reader of the storage device. The plurality of read sensor stacks are distributed along a down track direction and offset in a cross-track direction. A plurality of electronic lapping guides (ELGs) are provided for the read sensor stacks. The read sensor stacks are lapped. Lapping is terminated based on signal(s) from the ELG(s).
    Type: Grant
    Filed: December 4, 2014
    Date of Patent: August 1, 2017
    Assignee: WESTERN DIGITAL (FREMONT), LLC
    Inventors: Steven C. Rudy, Christopher L. Beaudry, Shaoping Li
  • Patent number: 9649743
    Abstract: A method of controlling polishing includes polishing a substrate and receiving an identification of a selected spectral feature, a wavelength range having a width, and a characteristic of the selected spectral feature to monitor during polishing. A sequence of spectra of light from the substrate is measured while the substrate is being polished. A sequence of values of the characteristic of the selected spectral feature is generated from the sequence of spectra. For at least some spectra from the sequence of spectra, a modified wavelength range is generated based on a position of the spectral feature within a previous wavelength range used for a previous spectrum in the sequence of spectra, the modified wavelength range is searched for the selected spectral feature, and a value of a characteristic of the selected spectral feature is determined.
    Type: Grant
    Filed: January 13, 2016
    Date of Patent: May 16, 2017
    Assignee: Applied Materials, Inc.
    Inventors: Jeffrey Drue David, Harry Q. Lee
  • Patent number: 9640507
    Abstract: A bonding method for bonding a semiconductor chip to an underlying structure includes aligning an electrical contact of a lower surface of the semiconductor chip with an electrical connection member of an upper surface of the underlying structure, the electrical contact at least partially encased by a support material. The method further includes first heating the semiconductor chip and the underlying structure, deforming the electrical contact, and curing the support material encasing the deformed electrical contact. The method still further includes second heating the semiconductor chip and the underlying structure to bond the electrical contact of the semiconductor chip to the electrical connection member of the underlying structure while maintaining the support material in a cured state.
    Type: Grant
    Filed: April 25, 2014
    Date of Patent: May 2, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ilyoung Han, Kyoungran Kim, Donggil Shim, Youngjoo Lee, Byunggon Kim, Byeongkap Choi
  • Patent number: 9604342
    Abstract: In an eyeglass lens processing apparatus, a roughing tool for roughing a periphery of an eyeglass lens cuts the periphery up to a roughing path without rotating an eyeglass lens in a first stage and the roughing tool moves along the roughing path while rotating the eyeglass lens in a second stage. A calculating unit for obtaining control data of the lens rotating unit at the second stage. The calculating unit obtains a first load torque applied to a lens chuck shaft at every rotation angle of the lens based on condition data, and obtains a rotation speed of the lens at which the first load torque per unit time becomes equal to or lower than a predetermined reference value.
    Type: Grant
    Filed: February 1, 2013
    Date of Patent: March 28, 2017
    Assignee: NIDEK CO., LTD.
    Inventors: Ryoji Shibata, Osamu Tanabe
  • Patent number: 9601395
    Abstract: In one aspect, a method of predicting warp in a plurality of wafers after an epitaxial layer deposition process is provided. The method includes receiving, by a processor, a measured resistivity of a first wafer of the plurality of wafers, receiving, by the processor, a measured shape of the first wafer after at least one of a grinding process and an etching process, and calculating, using the processor, a change in wafer shape during the epitaxial layer deposition process. The method further includes superposing, using the processor, the calculated shape change onto the measured shape of the first wafer to determine a post-epitaxial wafer shape and calculating, using the processor, a post-epitaxial warp value based on the determined post-epitaxial wafer shape.
    Type: Grant
    Filed: December 28, 2012
    Date of Patent: March 21, 2017
    Assignee: SunEdison Semiconductor Limited (UEN201334164H)
    Inventors: Sumeet S. Bhagavat, Roland R. Vandamme
  • Patent number: 9517517
    Abstract: The invention concerns a method of grinding a toothed workpiece in which a central axis of the toothed contour profile is defined, wherein the method encompasses at least two work operations. In a first work operation a grinding zone of a grinding tool whose selection is determined by the grinding process to be performed, which rotates about an axis of rotation and is set up for an infeed in the direction of the shortest distance between said central axis and the rotation axis, is brought into grinding engagement with a tooth flank of the workpiece. In a later, second work operation, the tooth flank is brought into grinding engagement with a grinding zone of a grinding tool whose selection is determined by the grinding process to be performed and which is advanced in the infeed direction of the first operation.
    Type: Grant
    Filed: November 15, 2012
    Date of Patent: December 13, 2016
    Assignee: Gleason-Pfauter Maschinenfabrik GmbH
    Inventor: Edgar Weppelmann
  • Patent number: 9490186
    Abstract: A method of controlling polishing includes polishing a region of a substrate at a first polishing rate, measuring a sequence characterizing values for the region of the substrate during polishing with an in-situ monitoring system, determining a polishing rate adjustment for each of a plurality of adjustment times prior to a polishing endpoint time, and adjusting a polishing parameter to polish the substrate at a second polishing rate. The time period is greater than a period between the adjustment times and the projected time is before the polishing endpoint time. The second polishing rate is the first polishing rate as adjusted by the polishing rate adjustment.
    Type: Grant
    Filed: November 27, 2013
    Date of Patent: November 8, 2016
    Assignee: Applied Materials, Inc.
    Inventors: Dominic J. Benvegnu, Benjamin Cherian, Sivakumar Dhandapani, Harry Q. Lee
  • Patent number: 9440327
    Abstract: The present invention provides an apparatus and a method for polishing a substrate having a film formed thereon. The method includes: rotating a polishing table supporting a polishing pad by a table motor; pressing the substrate against the polishing pad by a top ring; obtaining a signal containing a thickness information of the film; producing from the signal a polishing index value that varies in accordance with a thickness of the film; monitoring a torque current value of the table motor and the polishing index value; and determining a polishing end point based on a point of time when the torque current value has reached a predetermined threshold value or a point of time when a predetermined distinctive point of the polishing index value has appeared, whichever comes first.
    Type: Grant
    Filed: April 9, 2013
    Date of Patent: September 13, 2016
    Assignee: Ebara Corporation
    Inventors: Yasumasa Hiroo, Yoichi Kobayashi, Katsutoshi Ono
  • Patent number: 9440328
    Abstract: The invention relates to a method for ascertaining topography deviations of a dressing tool. The method includes executing a predefined relative movement of a dressing tool in relation to a dressable grinding tool, wherein during the execution of the relative movement, at least one contour region of the dressing tool is transferred into a transfer region of the grinding tool. A plunging body made of material which can be ground in the machine is provided. The transfer region of the grinding tool is moved into the vicinity of the plunging body by a relative infeed movement. A rotational movement of the grinding tool around an axis of rotation is executed. Plunging the transfer region of the grinding tool into the material of the plunging body, to thus perform a transfer of the topography of the transfer region into an imaging region of the plunging body.
    Type: Grant
    Filed: March 5, 2014
    Date of Patent: September 13, 2016
    Assignee: Klingelnberg AG
    Inventor: Karl-Martin Ribbeck