Abstract: A method includes: accessing a toolpath and processing parameters—including a target force and feed rate—assigned to a region of a workpiece; and accessing a wear model representing abrasive degradation of a sanding pad arranged on a sanding head. The method also includes, during a processing cycle: accessing force values output by a force sensor coupled to the sanding head; navigating the sanding head across the workpiece region according to the toolpath and, based on the force values deviating the sanding head from the toolpath to maintain forces of the sanding head on the workpiece region proximal the target force; accessing contact characteristics representing contact between the sanding pad and the workpiece; estimating abrasive degradation of the sanding pad based on the wear model and the sequence of contact characteristics; and modifying the set of processing parameters based on the abrasive degradation.

Abstract: Embodiments of the present invention provide a multiple-variable predictive maintenance method for a component of a production tool and a computer program product thereof, in which a multiple-variable time series prediction (TSPMVA) and an information criterion algorithm are adapted to build a best vector autoregression model (VAR), thereby forecasting the complicated future trend of accidental shutdown of the component of the production tool. Therefore, the multiple-variable prediction of the present invention can improve the accuracy of prediction compared with the single-variable prediction.

Abstract: A hand-held power tool, including: a drive circuit for providing an adjustment signal as a function of actuation of a button, a control apparatus for adjusting a drive current for an electric motor of the hand-held power tool as a function of the adjustment signal, wherein the control apparatus is connected to an electrical energy source for operating the hand-held power tool via a first electrical line arrangement, the drive circuit is connected to the control apparatus via a second electrical line arrangement, a drive current line carrying the drive current for the electric motor is routed via an interruption switch, coupled to the button, for interrupting the drive current, and wherein an interference-suppression capacitor is connected to the drive power line via a first node and to the second electrical line arrangement via a second node.

Abstract: The present application relates to a method for controlling a repairing apparatus and a repairing apparatus. The method for controlling the repairing apparatus includes: measuring, by a sensor, a height of a target object when a grinding part of the repairing apparatus completes positioning the target object; calculating an idle distance of a grinding belt on the grinding part in a predetermined process according to the height of the target object, in which, the predetermined process is the grinding part descending from the initial position to the highest position of the target object; and driving a motor to rotate back the grinding belt on the grinding part for the idle distance, and repairing the target object through the grinding belt on the grinding part.

Abstract: Systems and methods are provided for predicting irregular motions of one or more mechanical components of a semiconductor processing apparatus. A mechanical motion irregular prediction system includes one or more motion sensors that sense motion-related parameters associated with at least one mechanical component of a semiconductor processing apparatus. The one or more motion sensors output sensing signals based on the sensed motion-related parameters. Defect prediction circuitry predicts an irregular motion of the at least one mechanical component based on the sensing signals.

Abstract: A monitoring method and a device for chemical mechanical polishing are provided. The method includes: loading a to-be-polished wafer with a carrier, attaching the wafer to a polishing pad on a polishing platen, and supplying slurry between the polishing pad and the wafer with a slurry supply apparatus; conditioning the polishing pad with a conditioner, and obtaining strain data of the conditioner, wherein the conditioner includes a drive arm and a conditioning head, the conditioning head conditions the polishing pad with the support of the drive arm, the drive arm undergoes a strain in response to a force applied by the the conditioning head, and the strain data is used to indicate a strain value of the drive arm; determining a conditioning deviation based on the strain data, and determining a wear state of the polishing pad based on the conditioning deviation.

Abstract: An eddy current sensor assembly includes an eddy current sensor and an output signal processing circuit that processes an output signal from the eddy current sensor. The output signal processing circuit includes a mixer circuit that accepts the output signal and a signal of the predetermined frequency as input, multiplies the two signals received as input, and outputs an output signal obtained by the multiplication, and a low-pass filter that accepts the output signal output by the mixer circuit as input, cuts a high-frequency signal included in the output signal received as input, and outputs at least a direct-current (DC) signal.

Abstract: An eyeglass lens peripheral edge processing system includes a plurality of eyeglass manufacturing devices and a robot arm. The plurality of eyeglass manufacturing devices 1 perform mutually different steps out of a plurality of steps for processing the eyeglass lens, and include mutually different housings. The robot arm includes an arm unit and a holding unit. The arm unit has a plurality of joint portions. The holding unit is disposed in the arm unit to hold and release an object. The robot arm rotates the arm unit via the joint portion to move the object held by the holding unit. The robot arm rotates the arm unit to move the eyeglass lens between the plurality of eyeglass manufacturing devices.

Abstract: A method of training a neural network includes obtaining two ground truth thickness profiles a test substrate, obtaining two thickness profiles for the test substrate as measured by an in-situ monitoring system while the test substrate is on polishing pads of different thicknesses, generating an estimated thickness profile for another thickness value that is between the two thickness values by interpolating between the two profiles, and training a neural network using the estimated thickness profile.

Abstract: A method of manufacturing a part using a cutting machine includes placing a non-porous sheet on a surface of a material cutting machine, removing material from the non-porous sheet to form a plurality of sections of the part, and while the non-porous sheet is present on the material cutting machine, forming fastening holes within the sections. The method further includes removing the sections from a remainder of the sheet, placing the sections together such that each section of the part abuts another section, and inserting fasteners through the fastening holes of the sections.

Abstract: Provided is an automatic teaching system that is readily able to achieve automation, even when a small but varied number of processing objects are to undergo polishing or coating. The automatic teaching system includes a three-dimensional shape measurement apparatus, a reference marker, an image analysis apparatus, and a robot control device. The three-dimensional shape measurement apparatus acquires shape data of a processing target region on a processing object relative to the reference marker, and the image analysis apparatus divides the shape data of the processing target region into a plurality of continuous reference surfaces, in accordance with a predetermined algorithm, automatically generates a program of an operation path along which a polishing apparatus or coating apparatus of the robot is to be operated, for every reference surface, in accordance with a predetermined operation path generation rule, and transmits the program of the operation path to the robot control device.

Abstract: There is provided a surfacing station for processing of surfaces of optical elements as workpieces, including a processing unit configured to process surfaces of optical elements; a controller unit configured to communicate with a database containing processing protocols, which can be carried out by the surfacing station, and to control operation of the processing unit in accordance with the processing protocols; and an identification tag base configured to communicate with the controller unit and configured to determine identification tags of consumable items used by the surfacing station, the controller unit being configured to enable a surfacing protocol for processing of the optical elements as workpieces in function of an identified consumable item.

Abstract: A fine adjustment thread assembly couples a first part and a second part to each other while keeping the first part and the second part spaced apart, adjusts the distance between the first part and the second part, and detects a load applied to the second part. The assembly includes first external threads that can be brought into threaded engagement with first internal threads formed in the first part, second external threads that are axially spaced from the first external threads, that have a thread pitch different from that of the first internal thread, and that can be brought into threaded engagement with second internal threads formed in the second part. A joint portion between the first external threads and the second external threads houses a load sensor under a compressive load.

Abstract: Methods and apparatuses associated with surface cleaning are described. Examples can include detecting at a processing resource of a robot and via a temperature sensor of the robot, a temperature of a surface on which the robot is located. Examples can include the processing resource shutting down the robot in response to the temperature being at or above a particular threshold temperature, and the processing resource instructing the robot to clean the surface following a particular cleaning path using a vacuum, a scrubber, or both in response to the temperature being below a particular threshold temperature.

Abstract: The present invention relates to a polishing apparatus having a surface-property measuring device for measuring surface properties of a polishing pad which is used to polish a substrate, such as semiconductor wafer, and a polishing system including such a polishing apparatus. The polishing apparatus includes a surface-property measuring device (30) for measuring surface properties of a polishing pad (2), a support arm (50) for supporting the surface-property measuring device (30), and a moving unit (53) coupled to the support arm (50) and configured to move the surface-property measuring device (30) from a retreat position to a measure position.

Abstract: A method includes polishing a wafer on a polishing pad, performing conditioning on the polishing pad using a disk of a pad conditioner, and conducting a heat-exchange media into the disk. The heat-exchange media conducted into the disk has a temperature different from a temperature of the polishing pad.

Abstract: A polishing apparatus that is capable of referring to a storage in which a machine learning model is stored, the machine learning model being learned using learning data in which a feature amount of a signal regarding a frictional force between a polishing member and a substrate in polishing or a feature amount of a temperature of the polishing member or the substrate in polishing is input, and data regarding a film thickness of the polished substrate or a parameter related to yield of a product included in the polished substrate is output, the device including: a polishing table provided with the polishing member and configured to be rotatable; a polishing head facing the polishing table and configured to be rotatable, wherein the substrate is attachable to a surface facing the polishing table; a control unit configured to perform control to polish the substrate by pressing the substrate against the polishing member while rotating the polishing table and the polishing head having the substrate attached there

Abstract: A substrate processing apparatus includes a polishing head defining plural pressure chambers D1 to D5 for pressing a wafer W on a polishing pad 42, a pressure control unit performing pressure feedback control by individually controlling pressures in the pressure chambers D1 to D5, a film thickness measurement unit measuring a film thickness distribution of the wafer W being polished, a storage unit storing multiple pieces of information on a preset pressure of the pressure chambers D1 to D5, and a response characteristic acquisition unit changing the preset pressure every time a predetermined condition is satisfied during polishing of the wafer W, measuring a polishing rate applied to the wafer W, and acquiring a response characteristic of the polishing of the wafer W. The response characteristic indicates responsiveness of the polishing of the wafer W to the pressure feedback. The response characteristic is acquired based on the obtained polishing rates.

Abstract: A disc changing system for a robotic defect repair system is presented. The system has a first abrasive disc and a second abrasive disc. The first and second abrasive discs are coupled to a liner. The system includes an abrasive disc placement device configured to automatically: remove the first abrasive disc from the liner, transport the first abrasive disc to a robotic tool of the robotic defect repair system, and place the first abrasive disc on a backup pad coupled to the robotic tool. The system also includes an abrasive disc remover configured to automatically remove the first abrasive disc after receiving a removal signal. The system also includes a controller configured to send an instruction to the disc placement device to remove, transport and place the first abrasive disc, instruct the robotic tool to conduct an abrasive operation. The controller is also configured to send the removal signal.

Abstract: A processing apparatus includes a table base to which a jig table is removably secured, a cutting unit, a moving assembly for moving the table base between a processing area and a mounting/dismounting area, and a delivery assembly for delivering the jig table from a temporary rest area onto the table base while applying a negative pressure to a second suction channel of the jig table. The delivery assembly includes a pair of grippers for gripping both sides of the jig table, a suction pipe connected to the second suction channel of the jig table that is gripped by the grippers, and a lifting and lowering unit for positioning the suction pipe selectively in an operative position where the suction pipe is connected to the second suction channel and a lifted position where the suction pipe is spaced from the second suction channel.

Abstract: Among other things, a computer-based method is described. The method comprises receiving, by one or more computers, a plurality of measured spectra reflected from a substrate at a plurality of different positions on the substrate. The substrate comprises at least two regions having different structural features. The method also comprises performing, by the one or more computers, a clustering algorithm on the plurality of measured spectra to separate the plurality of measured spectra into a number of groups based on the spectral characteristics of the plurality of measured spectra; selecting one of the number of groups to provide a selected group having a subset of spectra from the plurality of measured spectra; and determining, in the one or more computers, at least one characterizing value for the substrate based on the subset of spectra of the selected group.

Abstract: A system may include a head-mounted device. The head-mounted device may have a head-mounted housing that includes a display. The display is configured to display an image for viewing by a user when the user's eyes are located in eye boxes adjacent to the head-mounted housing. The head-mounted housing may have a compressible opaque light seal. The light seal may have a ring shape and may block stray ambient light around the periphery of the head-mounted housing, thereby ensuring that stray light does not interfere with viewing of the image by the user. Sensors may be provided in the light seal to measure facial expressions and gather other measurements. Information on a measured facial expression of a user can be transmitted to external devices so that the external devices can update corresponding facial expressions on an avatar to reflect the user's current facial expression.

Abstract: Material delivery systems as well as systems and methods relating thereto are disclosed. In an embodiment, the material delivery system includes a tank to hold water therein. In addition, the material delivery system includes a hopper to hold dry ingredients of the extrudable building material therein. Further, the material delivery system includes a mixing unit to receive water from the tank and dry ingredients from the hopper. The mixing unit includes an agitator to mix the water and the dry ingredients together to form the extrudable building material. Still further, the material delivery system includes a controller coupled to the agitator that is to: measure a load imparted to the agitator by the extrudable building material, add additional water to the mixing unit when the load is above a first threshold, and add additional dry ingredients to the mixing unit when the load is below a second threshold.

Abstract: A management method of a machining system includes a chuck table, a machining unit, a transfer unit that transfers a wafer onto the chuck table, a camera unit that acquires an image containing a pattern formed on a side of a front surface of the wafer, and an information recording section. The management method is applied when the pattern is recorded in association with machining conditions in the information recording section; and records in the information recording section new machining conditions to be used when machining a new type of wafer, causes an automatic machining program, which automatically machines the new type of wafer, to start, forms an image, which contains a new pattern of the new type of wafer, by the camera unit, and records the new pattern in association with the new machining conditions in the information recording section.

Abstract: A processing apparatus includes: a selection section that selects two or more components from a plurality of components including a holding table, a processing unit, a robot, a temporary placing unit, a carrying-in mechanism, a cleaning unit, and a carrying-out mechanism; and a control unit that handles a workpiece at part of routes that correspond to the components selected by the selection section, of the routes for passage of the workpiece at the time of processing the workpiece full-automatically by use of the plurality of components.

Abstract: The present disclosure provides a carbide blade grinding forming processing production line, relates to the field of blade processing in forming, and provides a production line for grinding forming processing of a carbide blade with inscribed circular holes, which has functions of blade grinding forming processing, blade cleaning and drying and detection of external dimension of a formed blade, and has an automatic loading and uninstalling function. In most processing course of the blade, the cutter head is taken as a carrier, and an overturning device is configured to overturn a whole cutter die box, such that integral end surface overturning of the cutter head in the cutter die box after single end surface grinding is realized, and blade filling processes in different processing links are reduced.

Abstract: A wafer held on a delivery pad is lifted from a holding surface, and when a lower surface of the wafer has been spaced in its entirety from the holding surface, an air flow rate regulating valve is opened to eject air from the holding surface. As the distance between the holding surface and the wafer spaced from the holding surface increases by lifting of a delivery unit, the degree of opening of the air flow rate regulating valve is adjusted to increase a flow rate of air from the holding surface, thereby spacing the wafer from the holding surface in a short period of time without rupturing the wafer.

Abstract: A chemical mechanical polishing system includes a platen to support a polishing pad, a carrier head to hold a substrate and bring a lower surface of the substrate into contact with the polishing pad, and an in-situ friction monitoring system including a friction sensor. The friction sensor includes a pad portion having a substrate contacting portion with an upper surface to contact the lower surface of the substrate, and a pair of capacitive sensors positioned below and on opposing sides of the substrate contacting portion.

Abstract: A system for sanding a surface includes a sanding tool, a robotic manipulator to move the sanding tool relative to the surface, and a control unit operatively coupled with the sanding tool and the robotic manipulator. The control unit is operable to: (1) move the sanding tool to a sanding position relative to the surface in which an abrasive surface is in contact with the surface and a sanding force is approximately normal to the surface; (2) set one or more sanding parameters corresponding to a model material removal rate; (3) monitor one or more of the sanding parameters; (4) determine an actual material removal rate, based on one or more of the sanding parameters being monitored; and (5) modify one or more of the sanding parameters until the actual material removal rate is approximately equal to the model material removal rate.

Abstract: A first and a second substrate polishing apparatus and are provided with a film thickness sensor for measuring a film thickness of layer to be polished and polish the layer by pressing the substrate against a polishing pad. The first substrate polishing apparatus outputs difference between output value of the film thickness sensor when an underlayer is exposed and output value of the film thickness sensor when the substrate is not present, as a first offset value. The second substrate polishing apparatus has a storage unit that stores information of the first offset value, an output correction unit that corrects the output value from the film thickness sensor based on the first offset value, and an end point detection unit that outputs control signal indicating end point of substrate polishing when measured value of the film thickness of the layer calculated based on the corrected output value reaches target value.

Abstract: A set includes a molding device having a molding face having the same shape as a contact face of the blocking device. A removable overlay of rigid material has a first face attached to a first face of the semi-finished optical element and a second face opposite to the first face having the same shape as the contact face of the blocking device, the set being configured for having a first subset configuration in which the second face of the removable overlay is in molding contact with the molding face of the molding device, then a second subset configuration in which the second face of the removable overlay is free and then a third subset configuration in which the second face of the removable overlay is retained in contact with the contact face of the blocking device.

Abstract: Examples are directed to an approach to specifying design guidelines for fabricating a free-form optical component, and methods of fabricating the free-form optical components. In one example, a family of optical prescriptions is created, and a fabricator may manufacture the free-form optical element to any selected prescription within the family. According to certain examples, the series of prescriptions in the family each describe a very similar optical surface providing the same or similar optical performance, and are layered relative to one another such that the thickness of the optical element at any point is slightly less for each subsequent surface defined by the next prescription in the series.

Abstract: A grinding apparatus includes a chuck table for holding a workpiece thereon, a table base supporting the chuck table, a grinding unit for grinding the workpiece held on the chuck table with a grinding wheel mounted on an end of a spindle, a load detecting unit for detecting a load applied from the grinding unit to the table base, a tilt adjustment unit supporting the table base thereon, for adjusting a tilt of the table base, a storage for storing a correlative relation between loads applied to the table base and changes in the tilt of the table base, and a controller for controlling the tilt adjustment unit based on the load detected by the load detecting unit and the correlative relation, to adjust the tilt of the table base so that a change in the tilt of the table base that corresponds to the detected load is cancelled out.

Abstract: A machine (10) for machining workpieces with optical quality has at least one workpiece spindle (12), which rotatably drives a workpiece (L) to be machines about a workpiece axis of rotation (C). A swivel head (14) located opposite the workpiece spindle, is pivotable about a pivot axis (B), and bears at least two tool spindles (16, 18), each of which rotatably driving at least one machining tool (T1, T2, T3) about a tool axis of rotation (D, D?). The workpiece spindle and the swivel head (14) are adjustable relative to one another along three mutually perpendicular linear axes (X, Y, Z). One axis (Y) extends parallel to the pivot axis (B). Another axis (Z) extends parallel to the axis (C) of workpiece rotation. At least one tool spindle is attached to the swivel head with its tool axis of rotation (D?) extending parallel to the pivot axis (B).

Abstract: A grinding control method and device for a wafer, and a grinding device are provided. A grinder is controlled to grind a mass production wafer with a set grinding parameter. In a case that it is determined to perform a test using a test wafer, the grinder may be controlled to grind the test wafer with the set grinding parameter. A first total thickness variation of the grinded test wafer is acquired by a dedicated measurement device, and an updated grinding parameter is acquired based on the first total thickness variation. The grinder is controlled to grind the mass production wafer with the updated grinding parameter. In this way, a wafer with a uniform thickness can be obtained, thereby improving flatness of the grinded wafer.

Abstract: Disclosed are threading device and threading method, including a turning step for threading a rotating workpiece with a predetermined cutting depth, by relatively moving a tool in the axial direction of the workpiece and then rounding-up the workpiece obliquely by relatively moving the tool in the axial direction and radially outward. The workpiece is subjected to the threading process by repeatedly carrying out the turning step while sequentially shifting the axial position for starting the rounding-up of the workpiece relative to an axial position where the rounding-up of the workpiece has been started in a previous turning step.

Abstract: A grinding package fitted on robotic arm includes a main body, a pneumatic motor, a bridging part and a grinding tool. The main body is formed with a first space, a second space, a communicating hole communicating the first space to the second space, a connecting wall within the first space, an intake channel, an exhaust channel, openings of the first space and the second space respectively located on each of two parallel sides of the main body, the connecting wall having a ventilation hole. The pneumatic motor includes a motor body within the first space, and a transmission shaft connected to the motor body while extended from the second space through the communicating hole. The bridging part is combined with the main body and the robotic arm, the bridging part closing off the first space, the grinding tool facing the second space and being joined to the transmission shaft.

Abstract: A system and method for thinning an integrated circuit (IC) wafer. The system includes a support structure to hold the IC wafer and a mechanism to operate on the IC wafer. The support structure includes one or more inductive coils configured to transmit a power signal to the IC wafer and receive a feedback signal from the IC wafer. The system further includes a process controller to control the operation based at least in part on the feedback signal received from the IC wafer.

Abstract: A method for producing a hot-rolled titanium plate includes, [1] melting at least one part of the side surface of the titanium slab by radiating a beam or plasma toward the side surface, not toward the surface to be rolled, and thereafter causing re-solidification to form, in the side surface, a layer having grain diameter of 1.5 mm or less and a depth of 3.0 mm or more from the side surface; [2] performing a finishing process on the surface to be rolled of the titanium slab in which the layer is formed, to thereby bring a slab flatness index X to 3.0 or less; and [3] subjecting the titanium slab after the finishing process to hot rolling under a condition in which a length of an arc of contact of a roll L in a first pass of rough rolling is 230 mm or more.

Abstract: An object is to enable accurate machining by enabling shots to be accurately blasted on a workpiece even while workpiece is being deformed. A part manufacturing system includes: a peening device including a nozzle that projects a plurality of shots toward a workpiece, and a sensor that detects a distance to the workpiece; and a machining robot including a hand to which the peening device is attached, and a control unit that adjusts a position or an orientation of the peening device by controlling the hand based on the distance detected by the sensor.

Abstract: Provided herein are particle detection systems, and related methods configured to characterize a liquid sample, comprising: a first probe configured to determine a first parameter set of a plurality of first particles in a liquid sample, the first particles characterized by a size characteristic selected from a first size range; wherein the first parameter set comprises a first size distribution and a first concentration; and a second probe configured to determine a second parameter set of one or more second particles in the liquid sample, the second particles being characterized by a size characteristic selected from a second size range; wherein the second parameter set comprises a second size distribution and a second concentration.

Abstract: The present invention relates to a substrate polishing system comprising a polishing pad covered on the polishing platen; a plurality of substrate carriers including a first substrate carrier which moves in a state in which a substrate is mounted and performs a polishing process in a state in which the substrate is in contact with the polishing pad on the polishing pad; a monitoring unit of displaying the information including the identity, position of at least one of the substrate carriers; and a control unit of outputting a warning signal and/or changes the operation of operating devices when an error occurs in real time thereby improving the monitoring efficiency and operation reliability of the polishing process of the substrate.

Abstract: A processing apparatus includes a first distinguishing display unit which, when a mechanism making a holding force or a processing force act on a workpiece causes an error, displays a workpiece illustration representing the workpiece to which the error is caused and on which the holding force or the processing force acts distinguishably from another workpiece illustration. The workpiece on which the holding force or the processing force of the mechanism causing the error acts can be thereby identified easily.

Abstract: This disclosure describes systems, methods, and devices related to robotic control for tool sharpening. The device may determine a first location associated with a first cutting tool of the one or more cutting tools relative to the first container. The device may grip the first cutting tool based on the first location of the first cutting tool relative to the first container. The device may move the robotic device to one more scanning sensors. The device may collect three dimensional data. The device may extract a profile of the first cutting tool. The device may determine a top edge and a bottom edge based on the profile. The device may determine a tip of the first cutting tool. The device may generate a sharpening path based on the tip and the profile of the first cutting tool.

Abstract: Methods and apparatus perform backside via reveal processes using a centralized control framework for multiple process tools. In some embodiments, a method for performing a backside via reveal process may include receiving process tool operational parameters from process tools involved in the backside via reveal process by a central controller, receiving sensor metrology data from at least one or more of the process tools involved in the backside via reveal process, and altering the backside reveal process based, at least in part, on the process tool operational parameters and the sensor metrology data by adjusting two or more of the process tools involved in the backside via reveal process. The profile parameters are configured to prevent backside via breakage during a chemical mechanical polishing (CMP) process.

Abstract: A height of an upper surface of a sub-chuck table is measured by a holding surface measuring unit in contact with the upper surface of the sub-chuck table. A height of a holding surface of a chuck table is measured by an upper surface height measuring unit in contact with the holding surface of the chuck table. A first difference between the height of the upper surface of the sub-chuck table and the height of the holding surface of the chuck table is calculated. A workpiece is held on the holding surface, and the height of the upper surface of the sub-chuck table is calculated again by the holding surface measuring unit. The upper surface height measuring unit is brought into contact with the upper surface of the workpiece by vertically moving it, and the height of the upper surface of the workpiece is measured.

Abstract: A method for the manufacture of a gear component includes, in a soft machining process, introducing a preliminary toothing 3 with a machining allowance 7 that is fixed relative to a final toothing 4 into a blank such that a semi-finished part 2 is produced. The method also includes, in a fine machining process, removing the machining allowance 7 and producing the final toothing 4 of the toothed component. The machining allowance 7 is removed in a single-stage hobbing method by a grinding tool 1, wherein the grinding tool 1 removes the machining allowance completely in a single stroke movement H.

Abstract: A method for determining a dimension between the back and the cutting edge of a vibrating blade mounted on a cutting head includes successively of acquiring a digital image of the blade mounted on the cutting tool so a line corresponding to a cutting edge of the blade and a line corresponding to a back of the blade are visible in the image, determining on the digital image along a straight line perpendicular to the line corresponding to the cutting edge of the blade the pixels comprised between the line corresponding to the cutting edge of the blade and the line corresponding to the back of the blade, and calculating a filtered dimension between the back and the cutting edge of the blade from the number of pixels comprised between the line corresponding to the cutting edge of the blade and the line corresponding to the back of the blade.

Abstract: A rail treatment machine, mobile on a track, for removing irregularities on a rail head surface of at least one rail of a laid track, includes a machine frame supported on a front on-track undercarriage and a rear on-track undercarriage, as seen in a working direction. A tool frame accommodates at least one tool carrier. A rear end of the tool frame is articulated on the rear on-track undercarriage in an articulation point on a vertical axis of rotation. A front end of the tool frame is supported on a separate on-track undercarriage situated between the front on-track undercarriage and the rear on-track undercarriage.

Abstract: A method of detecting a polishing endpoint includes storing a plurality of library spectra, measuring a sequence of spectra from the substrate in-situ during polishing, and for each measured spectrum of the sequence of spectra, finding a best matching library spectrum from the plurality of library spectra to generate a sequence of best matching library spectra. Each library spectrum has a stored associated value representing a degree of progress through a polishing process, and the stored associated value for the best matching library spectrum is determined for each best matching library spectrum to generate a sequence of values representing a progression of polishing of the substrate. The sequence of values is compared to a target value, and a polishing endpoint is triggered when the sequence of values reaches the target value.