Computer Controlled Patents (Class 451/5)
  • Patent number: 11312017
    Abstract: This disclosure describes systems, methods, and devices related to robotic control for tool sharpening. The device may determine a first location associated with a first cutting tool of the one or more cutting tools relative to the first container. The device may grip the first cutting tool based on the first location of the first cutting tool relative to the first container. The device may move the robotic device to one more scanning sensors. The device may collect three dimensional data. The device may extract a profile of the first cutting tool. The device may determine a top edge and a bottom edge based on the profile. The device may determine a tip of the first cutting tool. The device may generate a sharpening path based on the tip and the profile of the first cutting tool.
    Type: Grant
    Filed: February 10, 2020
    Date of Patent: April 26, 2022
    Assignee: Omnisharp, LLC
    Inventors: Russell Aldridge, Marc Christenson, Jacob Robinson, Isaac Jones, Joshua Foss, Mathius Jules, Michael Morgan, Austin Christensen, Jason Orr, Nathan Powelson, Sam Grayson
  • Patent number: 11289387
    Abstract: Methods and apparatus perform backside via reveal processes using a centralized control framework for multiple process tools. In some embodiments, a method for performing a backside via reveal process may include receiving process tool operational parameters from process tools involved in the backside via reveal process by a central controller, receiving sensor metrology data from at least one or more of the process tools involved in the backside via reveal process, and altering the backside reveal process based, at least in part, on the process tool operational parameters and the sensor metrology data by adjusting two or more of the process tools involved in the backside via reveal process. The profile parameters are configured to prevent backside via breakage during a chemical mechanical polishing (CMP) process.
    Type: Grant
    Filed: July 31, 2020
    Date of Patent: March 29, 2022
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Prayudi Lianto, Sik Hin Chi, Shih-Chao Hung, Pin Gian Gan, Ricardo Fujii Vinluan, Gaurav Mehta, Ramesh Chidambaram, Guan Huei See, Arvind Sundarrajan, Upendra V. Ummethala, Wei Hao Kew, Muhammad Adli Danish Bin Abdullah, Michael Charles Kutney, Mark McTaggart Wylie, Amulya Ligorio Athayde, Glen T. Mori
  • Patent number: 11285578
    Abstract: A height of an upper surface of a sub-chuck table is measured by a holding surface measuring unit in contact with the upper surface of the sub-chuck table. A height of a holding surface of a chuck table is measured by an upper surface height measuring unit in contact with the holding surface of the chuck table. A first difference between the height of the upper surface of the sub-chuck table and the height of the holding surface of the chuck table is calculated. A workpiece is held on the holding surface, and the height of the upper surface of the sub-chuck table is calculated again by the holding surface measuring unit. The upper surface height measuring unit is brought into contact with the upper surface of the workpiece by vertically moving it, and the height of the upper surface of the workpiece is measured.
    Type: Grant
    Filed: July 21, 2020
    Date of Patent: March 29, 2022
    Assignee: DISCO CORPORATION
    Inventor: Jiro Genozono
  • Patent number: 11278976
    Abstract: A method for the manufacture of a gear component includes, in a soft machining process, introducing a preliminary toothing 3 with a machining allowance 7 that is fixed relative to a final toothing 4 into a blank such that a semi-finished part 2 is produced. The method also includes, in a fine machining process, removing the machining allowance 7 and producing the final toothing 4 of the toothed component. The machining allowance 7 is removed in a single-stage hobbing method by a grinding tool 1, wherein the grinding tool 1 removes the machining allowance completely in a single stroke movement H.
    Type: Grant
    Filed: June 25, 2020
    Date of Patent: March 22, 2022
    Assignee: ZF FRIEDRICHSHAFEN AG
    Inventors: Franz-Josef Hoener, Frank Klein, Thomas Barrois
  • Patent number: 11224953
    Abstract: A method for determining a dimension between the back and the cutting edge of a vibrating blade mounted on a cutting head includes successively of acquiring a digital image of the blade mounted on the cutting tool so a line corresponding to a cutting edge of the blade and a line corresponding to a back of the blade are visible in the image, determining on the digital image along a straight line perpendicular to the line corresponding to the cutting edge of the blade the pixels comprised between the line corresponding to the cutting edge of the blade and the line corresponding to the back of the blade, and calculating a filtered dimension between the back and the cutting edge of the blade from the number of pixels comprised between the line corresponding to the cutting edge of the blade and the line corresponding to the back of the blade.
    Type: Grant
    Filed: June 19, 2018
    Date of Patent: January 18, 2022
    Assignee: LECTRA
    Inventors: Didier Chabirand, Régis Pierre André Lallement
  • Patent number: 11203839
    Abstract: A rail treatment machine, mobile on a track, for removing irregularities on a rail head surface of at least one rail of a laid track, includes a machine frame supported on a front on-track undercarriage and a rear on-track undercarriage, as seen in a working direction. A tool frame accommodates at least one tool carrier. A rear end of the tool frame is articulated on the rear on-track undercarriage in an articulation point on a vertical axis of rotation. A front end of the tool frame is supported on a separate on-track undercarriage situated between the front on-track undercarriage and the rear on-track undercarriage.
    Type: Grant
    Filed: August 9, 2017
    Date of Patent: December 21, 2021
    Assignee: Plasser & Theurer Export von Bahnbaumaschinen Gesellschaft m.b.H.
    Inventor: Herbert Woergoetter
  • Patent number: 11183435
    Abstract: A method of detecting a polishing endpoint includes storing a plurality of library spectra, measuring a sequence of spectra from the substrate in-situ during polishing, and for each measured spectrum of the sequence of spectra, finding a best matching library spectrum from the plurality of library spectra to generate a sequence of best matching library spectra. Each library spectrum has a stored associated value representing a degree of progress through a polishing process, and the stored associated value for the best matching library spectrum is determined for each best matching library spectrum to generate a sequence of values representing a progression of polishing of the substrate. The sequence of values is compared to a target value, and a polishing endpoint is triggered when the sequence of values reaches the target value.
    Type: Grant
    Filed: April 29, 2019
    Date of Patent: November 23, 2021
    Assignee: Applied Materials, Inc.
    Inventors: Dominic J. Benvegnu, Jeffrey Drue David, Boguslaw A. Swedek
  • Patent number: 11117265
    Abstract: Exemplary substrate processing systems may include a transfer region housing defining a transfer region fluidly coupled with a plurality of processing regions. A sidewall of the transfer region housing may define a sealable access for providing and receiving substrates. The systems may include a transfer apparatus having a central hub including a shaft extending at a distal end through the transfer region housing into the transfer region. The transfer apparatus may include a lateral translation apparatus coupled with an exterior surface of the transfer region housing, and configured to provide at least one direction of lateral movement of the shaft. The systems may also include an end effector coupled with the shaft within the transfer region. The end effector may include a plurality of arms having a number of arms equal to a number of substrate supports of the plurality of substrate supports in the transfer region.
    Type: Grant
    Filed: July 7, 2020
    Date of Patent: September 14, 2021
    Assignee: Applied Materials, Inc.
    Inventors: Paul Z. Wirth, Charles T. Carlson, Jason M. Schaller
  • Patent number: 11103974
    Abstract: An automated apparatus for grinding an ice blade on an ice skate comprises a processor, an input device in communication with said processor, a skate holder, a non-contact measuring device in communication with said processor, and a grinding device in communication with said processor. The input device permits a user to select an ice blade grinding option. The skate holder releasably holds at least one said ice skate to said apparatus. The non-contact measuring device is configured to measure a three-dimensional (3D) shape of said ice blade. The grinding device is configured to perform a grinding action on said ice blade in said holder based on said selected ice blade grinding option to change said 3D shape of said ice blade to a desired 3D shape.
    Type: Grant
    Filed: October 12, 2017
    Date of Patent: August 31, 2021
    Assignee: Skatescribe Corporation
    Inventors: Nathan Chan, Steve Martin, Jamie A. Gonzalez, Emidio Di Pietro, Tony Di Pietro
  • Patent number: 11072138
    Abstract: A spectacle lens manufacturing system includes resin material filling means which fills a lens mold with a lens material (heat-curable resin material), and at least a portion of the lens mold is formed by a three-dimensional printer. The lens mold includes a front lens mold having a rear surface that defines a front surface of a spectacle lens, a rear lens mold having a front surface that defines a rear surface of the spectacle lens, and a side peripheral lens mold having an inner surface that defines a side periphery of the spectacle lens. The side peripheral lens mold is formed by the three-dimensional printer.
    Type: Grant
    Filed: December 12, 2017
    Date of Patent: July 27, 2021
    Assignee: Tokai Optical Co., Ltd.
    Inventors: Atsushi Nagao, Hiroaki Watanabe, Shingo Ono, Hiroshi Ueno
  • Patent number: 10994381
    Abstract: To provide a controller, a data generation device, a control method, and a control program allowing a part of a machining program to be changed easily. A controller comprises: a storage unit that stores change designation data describing a command value in association with respective identifiers indicating at least one block among multiple blocks constituting a machining program for a machine tool; a change unit that reads the multiple blocks in the machining program sequentially, and changes the block indicated by the identifier based on the command value described in the change designation data; and an analysis unit that analyzes the block changed by the change unit, and generates execution data.
    Type: Grant
    Filed: February 12, 2019
    Date of Patent: May 4, 2021
    Assignee: FANUC CORPORATION
    Inventors: Giichi Nakanishi, Yorikazu Fukui
  • Patent number: 10978321
    Abstract: A system and method are presented for controlling a process applied to a structure comprising at least one of material removal and material deposition processes. The system comprises: a heating radiation source configured and operable to generate a temperature field profile across a processing area of the structure; and a control unit configured and operable to control operation of said heating radiation source in accordance with a predetermined pattern map within the processing area, so as to create a corresponding pattern selective profile of said temperature field across said processing area providing desired pattern selective distribution of at least one parameter characterizing the process applied to the processing area of the structure.
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: April 13, 2021
    Assignee: NOVA MEASURING INSTRUMENTS LTD.
    Inventor: Igor Turovets
  • Patent number: 10935957
    Abstract: A cutting apparatus includes a chuck table that holds a workpiece, a processing unit that forms a processed groove in the workpiece, an imaging unit that images the workpiece, a display unit that displays a captured image of a processed groove imaged by the imaging unit, and a control unit that executes display control of a display screen of the display unit. The control unit causes a mark that indicates the latest processed groove based on the Y-coordinate of the latest processed groove to be displayed on the display unit while being superimposed on a captured image.
    Type: Grant
    Filed: April 5, 2019
    Date of Patent: March 2, 2021
    Assignee: DISCO CORPORATION
    Inventors: Keiji Kashiwagi, Satoshi Miyata
  • Patent number: 10919122
    Abstract: Grinding and/or erosion machine (10) for machining a chip-cutting rotary tool including a tool body (18) and several cutting plates (19) per existing pitch (TR). A control device (25) activates an axis arrangement (11) to move a machine tool (12) and the rotary tool (13) to be machined relative to each other. An interface device (26) triggers a data import function for reading-in the position data of the cutting plates (19). The position data (P) describe at least one angular value (?1, ?2), a first length value (z1) and a second length value (z2). The control device (25) imports the position data (P) in chaotic order and allocates the position data (P) of each cutting plate (19) in the imported machine data set (M) to respectively one separate virtual pitch (TV), independent of whether the cutting plates (19) belong to a common pitch of the rotary tool (13).
    Type: Grant
    Filed: May 16, 2018
    Date of Patent: February 16, 2021
    Assignee: WALTER Maschinenbau GmbH
    Inventors: Siegfried Hegele, Ulrich Braendle
  • Patent number: 10759020
    Abstract: In a first step, an output of an eddy current sensor is measured while a polishing target whose film thickness has been known is in contact with the polishing face, thereby obtaining a measurement value of the eddy current sensor which corresponds to the film thickness. In a second step, an output of the eddy current sensor is measured when the polishing target is polished while pressed against the polishing face, thereby obtaining a measurement value of the eddy current sensor that corresponds to a film thickness during polishing. A correspondence relationship between the film thickness of the polishing target and the measurement value of the eddy current sensor is determined from the measurement value obtained in the first step and the measurement value obtained in the second step.
    Type: Grant
    Filed: April 24, 2018
    Date of Patent: September 1, 2020
    Assignee: EBARA CORPORATION
    Inventor: Akira Nakamura
  • Patent number: 10713111
    Abstract: A method includes initiating a power on sequence of a computer equipment including a plurality of sensors at a serviceable location within a component of the computer equipment, the plurality of sensors communicating with a sensor monitor coupled with an interlock mechanism, and a service console capable of communicating with the sensor monitor, receiving feedback data from the plurality of sensors during the power on sequence, each of the plurality of sensors is detecting a physical condition at the serviceable location, determining whether the feedback data exceeds a predefined threshold value, the feedback data exceeding the predefined threshold value is associated with a fault at a serviceable location, in response to the feedback data exceeding the predefined threshold value, logging the fault at the serviceable location, aborting the power on sequence of the equipment, and prompting an equipment servicer of the fault at the serviceable location.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: July 14, 2020
    Assignee: International Business Machines Corporation
    Inventors: Jonathan D. Bradbury, Jonathan R. Fry, Michael R. Kane, Jeffrey Nettey
  • Patent number: 10705502
    Abstract: A numerical controller includes a position instruction generating unit configured to generate the position instruction; an oscillation instruction generating unit configured to generate the oscillation instruction; a position speed control unit configured to add the position instruction and the oscillation instruction to generate a synthesized instruction; and a current control unit configured to control movement of a tool or rotation of a spindle. The oscillation instruction generating unit includes a tracking error calculating unit configured to obtain and calculate an actual angle and an ideal angle of the spindle, and a frequency recalculating unit configured to recalculate the oscillation frequency or a rotational speed of the spindle based on the actual angle and the ideal angle. The current control unit controls the movement of the tool or the rotation of the spindle according to the recalculated oscillation frequency or rotational speed of the spindle.
    Type: Grant
    Filed: August 20, 2018
    Date of Patent: July 7, 2020
    Assignee: Fanuc Corporation
    Inventor: Toshihiro Watanabe
  • Patent number: 10688623
    Abstract: A slurry dispersion system is provided, and includes a slurry source system, an in-line analyzer and a controller. The slurry source system provides a slurry for a chemical mechanical polishing (CMP) process. The in-line analyzer measures at least one parameter of a sampled slurry sampled from the slurry dispersion system, and generates an indication signal based on the parameter, in which the indication signal indicates at lease one characteristic of the slurry. The controller receives the indication signal, and generates a control signal based on the indication signal for performing a real time control on the slurry dispersion system for controlling quality of the slurry.
    Type: Grant
    Filed: September 30, 2014
    Date of Patent: June 23, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: I-Chen Chiang, Hwai-Te Chiu, Yi-Tsang Chen, Chih-Chiang Tseng, Yung-Long Chen
  • Patent number: 10688622
    Abstract: A substrate processing apparatus is provided with a polishing part that polishes a substrate, a transporting part that transports a substrate before polishing to the polishing part, and a cleaning part that cleans the polished substrate. The cleaning part has a first cleaning unit and a second cleaning unit that are vertically arranged in two stages. The first cleaning unit and the second cleaning unit each have a plurality of cleaning modules that are arranged in series. The transporting part has a slide stage that is disposed between the first cleaning unit and the second cleaning unit, and transports a substrate before polishing along an arrangement direction of the plurality of cleaning modules.
    Type: Grant
    Filed: June 6, 2017
    Date of Patent: June 23, 2020
    Assignee: Ebara Corporation
    Inventors: Hiroshi Aono, Kuniaki Yamaguchi, Hiroshi Shimomoto, Koji Maeda, Tetsuya Yashima, Kenji Shinkai, Koichi Hashimoto, Mitsuhiko Inaba, Hidetatsu Isokawa, Hidetaka Nakao, Soichi Isobe
  • Patent number: 10668590
    Abstract: A method and apparatus for blocking an unfinished optical lens member on a blocker for manufacturing an optical lens from the unfinished optical lens member, the latter being provided with a finished surface having a first reference frame, the blocker having a second reference frame, includes: placing the unfinished optical lens member on the blocker; measuring the relative positioning of the first reference frame of the finished surface of the placed unfinished lens member with respect to the positioning of the second reference frame of the blocker; comparing the measured relative positioning with a predetermined relative positioning to determine a relative positioning shift; moving at least the blocker and/or the lens member to change the relative positioning of the first reference frame with respect to the second reference frame to compensate for the relative positioning shift; and blocking the unfinished lens member on the blocker at the changed relative positioning.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: June 2, 2020
    Assignee: Essilor International
    Inventor: Vincent Godot
  • Patent number: 10654148
    Abstract: Systems and methods for conditioning blades are provided. A method may include, for example, obtaining a cutting device, measuring various characteristics of the cutting edge of the cutting device, creating a current edge profile based on the characteristics, creating a modified edge profile, and/or conditioning the blade. Conditioning may include grinding, buffing and/or polishing. One or more of the conditioning steps may be based on the modified edge profile.
    Type: Grant
    Filed: January 11, 2018
    Date of Patent: May 19, 2020
    Assignee: Wolff Industries, Inc.
    Inventors: David Vogel, Walker Newell
  • Patent number: 10576608
    Abstract: Disclosed herein is a dressing board for dressing a cutting blade. The dressing board is held on a chuck table in dressing the cutting blade. The dressing board includes a bar code formed on the front side of the dressing board for indicating kind information on the dressing board, and a groove code formed on the front side of the dressing board at an edge portion thereof, the groove code being composed of grooves having pattern corresponding to that of the bar code. Even when the bar code is cut off by the cutting blade in dressing the cutting blade, the kind information on the dressing board is indicated by the groove code left on the front side of the dressing board.
    Type: Grant
    Filed: January 17, 2018
    Date of Patent: March 3, 2020
    Assignee: DISCO CORPORATION
    Inventor: Kazuma Sekiya
  • Patent number: 10569381
    Abstract: The present invention relates to a method and an apparatus for polishing a surface of a substrate having a film whose thickness varies along a circumferential direction of the substrate. The polishing method includes: obtaining a film-thickness distribution in a circumferential direction of a substrate (W); determining a first area having a maximum or minimum film thickness based on the film-thickness distribution; rotating a polishing table (3) holding a polishing pad (2); pressing a surface of the substrate (W) against the polishing pad (2) while rotating the substrate by a polishing head (1); and polishing the first area at a removal rate different from that of a second area in the surface of the substrate (W).
    Type: Grant
    Filed: July 13, 2016
    Date of Patent: February 25, 2020
    Assignee: Ebara Corporation
    Inventor: Hiroshi Yoshida
  • Patent number: 10562092
    Abstract: A tool for hot stamping metal sheets, formed least partially of a base block and a functional layer, is proposed. The functional layer comprises cooling channels and multiple functional layers, which building upon each other create the connection to the base block. The cooling channels are designed as a cooling channel array and are produced in a laser sintering method.
    Type: Grant
    Filed: December 8, 2014
    Date of Patent: February 18, 2020
    Assignee: MAGNA INTERNATIONAL INC.
    Inventors: Edward Schleichert, Jason Wilson, Mark Fabischeck, Jim Metz, Nick Adam
  • Patent number: 10551816
    Abstract: A numerical controller of the present invention is provided with an oscillating motion data holding unit configured to hold oscillating motion data used for the control of an oscillating motion, an oscillating pulse calculation unit configured to calculate oscillating pulses used for the control of an oscillation axis, based on the oscillating motion data held in the oscillating motion data holding unit, and output the calculated oscillating pulses, a motor control unit configured to control a motor for driving the oscillation axis, based on the oscillating pulses, and an oscillating motion data calculation unit configured to determine a data item related to the oscillating motion to be adjusted, based on the state of a switch means on a control panel of a machine, and to adjust the value of the data item related to the oscillating motion, based on manual pulses input from a manual pulse generator.
    Type: Grant
    Filed: November 16, 2016
    Date of Patent: February 4, 2020
    Assignee: Fanuc Corporation
    Inventor: Yousuke Koyanaka
  • Patent number: 10507593
    Abstract: The invention relates to a cutting system. The cutting system (1) is designed to extend in the direction of a first system axis (7) which extends horizontally along a width (B) of the cutting system (1), in the direction of a second system axis (8) which extends vertically relative to the first system axis (7), and in the direction of a third system axis (9) which extends along the depth (T) of the cutting system orthogonally to the first system axis (7) and the second system axis (8). The cutting system has a support (2), a tool (3; 4) which is received on the support (2) in the form of a saw with a spindle shaft (13; 14), the operating direction of the tool following the direction of the first system axis (7), and an additional tool (5) which is received on the support (2) in the form of a chop saw with a third spindle shaft (15), the operating direction of the additional tool following the direction of the first system axis (7).
    Type: Grant
    Filed: March 13, 2016
    Date of Patent: December 17, 2019
    Assignee: D. Swarovski KG
    Inventors: Johannes Schweigl, Hubert Schwabegger, Joachim Karger, Gerhard Lindenthaler, Andreas Mimm
  • Patent number: 10459425
    Abstract: A numerical control device includes a tool-attitude vector tolerance input unit to accept a tolerance for correction amounts for tool-attitude vectors; a rotation-axis tolerance determining unit to determine, on the basis of tool attitudes calculated from rotation-axis angles before smoothing and of the tolerance for correction amounts for tool-attitude vectors, a tolerance for correction amounts for the rotation-axis angles; a rotation-axis angle smoothing unit to smooth the rotation-axis angles before smoothing so that change in the rotation-axis angle becomes smooth, thereby calculating rotation-axis angles after smoothing; and a rotation-axis angle determining unit to correct the rotation-axis angles after smoothing so as to fall within the tolerance for correction amounts for rotation-axis angles from the rotation-axis angles before smoothing.
    Type: Grant
    Filed: June 11, 2015
    Date of Patent: October 29, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Toshihiro Azuma, Kenji Okuma, Junji Matsuno
  • Patent number: 10449655
    Abstract: The polishing apparatus comprises: a dressing section for dressing a polishing pad; a measuring section for measuring a surface property of the polishing pad; a polishing result measuring section for measuring a polishing result of a work; a storing section for storing correlation data between dressing condition data for dressing the polishing pad, surface property of the polishing pad and polishing results, which are learned by an artificial intelligence; and an input section for inputting an object polishing result. The artificial intelligence performs a first arithmetic process, in which the surface property of the polishing pad corresponding to the object polishing result is inversely estimated on the basis of the correlation data, and a second arithmetic process, in which the corresponding dressing condition is derived on the basis of the surface property of the polishing pad inversely estimated.
    Type: Grant
    Filed: January 3, 2018
    Date of Patent: October 22, 2019
    Assignees: FUJIKOSHI MACHINERY CORP., KANAZAWA INSTITUTE OF TECHNOLOGY
    Inventors: Kazutaka Shibuya, Yoshio Nakamura, Michio Uneda, Kenichi Ishikawa
  • Patent number: 10427269
    Abstract: A polishing apparatus which can maintain a polishing load within an appropriate range is disclosed. The polishing apparatus includes: a pressing member for pressing a polishing tool against the substrate; an actuator configured to control a pressing force of the pressing member; a positioning member which is movable together with the pressing member; a stopper arranged to restrict movement of the pressing member and the positioning member; a stopper moving mechanism configured to move the stopper in a predetermined direction; a polishing-load detector configured to obtain a load feedback value which varies according to a polishing load applied to the pressing member; and a stopper-speed determining device configured to determine a movement speed of the stopper which can allow the load feedback value to fall within a set range.
    Type: Grant
    Filed: April 4, 2017
    Date of Patent: October 1, 2019
    Assignee: EBARA CORPORATION
    Inventors: Makoto Kashiwagi, Michiyoshi Yamashita
  • Patent number: 10414015
    Abstract: A polishing apparatus includes a polishing table for supporting a polishing pad and a substrate holding device for pressing a substrate against the polishing pad. The substrate holding device includes an elastic film to form multiple pressure chambers to press the substrate, and a pressure control unit controlling pressure of the pressure chambers. The pressure control unit includes a first flow path connected to a first pressure chamber, and first and second pressure regulation mechanisms. The pressure control unit performs switching control from first pressure regulation mechanism to second pressure regulation mechanism when a set pressure within first pressure chamber reaches a first threshold value. Then, the pressure control unit performs switching control from second pressure regulation mechanism to first pressure regulation mechanism when the set pressure within the first pressure chamber reaches a second threshold value lower than the first threshold value.
    Type: Grant
    Filed: August 26, 2016
    Date of Patent: September 17, 2019
    Assignee: Ebara Corporation
    Inventors: Makoto Fukushima, Hozumi Yasuda, Shingo Togashi
  • Patent number: 10406646
    Abstract: A device and a method for polishing of an optical lens by means of rotary tool are proposed, a fixture for the lens being pivotable around a pivoting axis transversely to the axis of rotation by means of a push-rod adjustment and being pivotable up out of a machining position such that the lens can be changed from overhead. This allows a compact structure and easy changing of the lens.
    Type: Grant
    Filed: February 28, 2012
    Date of Patent: September 10, 2019
    Assignee: SCHNEIDER GMBH & CO. KG
    Inventors: Gunter Schneider, Helwig Buchenauer, Ulf Börner, Klaus Krämer
  • Patent number: 10354902
    Abstract: A conveyance system includes a track, ceiling conveyance vehicles, storage apparatuses, and a conveyance controller configured or programmed to control operations of the ceiling conveyance vehicles and a local vehicle in accordance with an operation mode. The storage apparatus includes a storage plate and the local vehicle that transfer a FOUP between the storage plate and an apparatus port. The conveyance controller switches the operation mode among a first mode prohibiting transfer from the apparatus port to the storage plate by the local vehicle, a second mode prohibiting transfer to the storage plate by any of the ceiling conveyance vehicles and transfer from the storage plate to the apparatus port by the local vehicle, and a third mode that does not restrict transfer by the local vehicle.
    Type: Grant
    Filed: October 13, 2016
    Date of Patent: July 16, 2019
    Assignee: MURATA MACHINERY, LTD.
    Inventors: Osamu Honda, Keiji Yamada, Daisuke Ono, Takashi Nozawa
  • Patent number: 10343255
    Abstract: A polishing apparatus for polishing a substrate is provided. The polishing apparatus includes: a polishing table holding a polishing pad; a top ring configured to press the substrate against the polishing pad; first and second optical heads each configured to apply the light to the substrate and to receive reflected light from the substrate; spectroscopes each configured to measure at each wavelength an intensity of the reflected light received; and a processor configured to produce a spectrum indicating a relationship between intensity and wavelength of the reflected light. The first optical head is arranged so as to face a center of the substrate, and the second optical head is arranged so as to face a peripheral portion of the substrate.
    Type: Grant
    Filed: April 10, 2018
    Date of Patent: July 9, 2019
    Assignee: EBARA CORPORATION
    Inventors: Itsuki Kobata, Yoichi Kobayashi, Katsutoshi Ono, Masaki Kinoshita, Toshifumi Kimba
  • Patent number: 10315271
    Abstract: A dressing system that can appropriately control the dressing amount of the electrode of a spot welding gun so as to not excessively and insufficiently dress the electrode. The dressing system for dressing the electrode of the spot welding gun includes a cutter that dresses the electrode, a controller that controls the rotational operation of the cutter, and a measuring part that measures the dressing amount of the electrode. The controller determines the rotational speed of the cutter based on the dressing amount measured by the measuring part.
    Type: Grant
    Filed: July 23, 2015
    Date of Patent: June 11, 2019
    Assignee: FANUC CORPORATION
    Inventor: Toshimichi Aoki
  • Patent number: 10319807
    Abstract: A wafer group facilitates securing uniformity of products manufactured from the wafer group whose composition varies among wafers. A technique excludes uncertain factors in forming OF, forming OF with extremely high probability and extremely high accuracy, the wafer group being constituted by a plurality of wafers obtained from the same ingot, with all wafers having an orientation flat (OF), wherein the wafer group is constituted by 70 or more wafers, and in the OF orientation accuracy of the wafer group represented by an angle, the OF orientation accuracy in each wafer is within ±0.010°.
    Type: Grant
    Filed: December 9, 2015
    Date of Patent: June 11, 2019
    Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Shinya Shoji, Makoto Ishii, Kazuyuki Umetsu, Junji Sugiura
  • Patent number: 10293451
    Abstract: There is provided a circumference calculating device including an expected shape specifying part 201b configured to obtain an expected finish shape of a bevel in consideration of an interference amount of a beveling tool when beveling is performed to an uncut spectacle lens; and a theoretical circumference calculating part 201d configured to obtain a bevel circumference of the spectacle lens having the expected finish shape obtained by the expected shape specifying part 201b, as a theoretical circumference of this spectacle lens.
    Type: Grant
    Filed: March 18, 2013
    Date of Patent: May 21, 2019
    Assignee: HOYA CORPORATION
    Inventor: Yoshihiro Kikuchi
  • Patent number: 10286520
    Abstract: A double-head grinding machine includes: a spindle driving portion configured to rotate a spindle to which a grinding wheel is attachable; a moving portion configured to move the spindle driving portions toward and away from a wafer; and an inclination measuring portion configured to measure a change in an inclination of the spindle in association with a movement of the spindle driving portions.
    Type: Grant
    Filed: February 26, 2015
    Date of Patent: May 14, 2019
    Assignee: SUMCO CORPORATION
    Inventor: Yoshinobu Nishimura
  • Patent number: 10256104
    Abstract: The present invention relates to a film-thickness measuring method for detecting a film thickness by analyzing optical information contained in a reflected light from a substrate. The film-thickness measuring method includes producing a spectral waveform indicating a relationship between intensity and wavelength of reflected light from a substrate; performing Fourier transform processing on the spectral waveform to determine strengths of frequency components and corresponding film thicknesses; determining local maximum values (M1, M2) of the strengths of the frequency components; and selecting, according to a preset selection rule, one film thickness from film thicknesses (t1, t2) corresponding respectively to the local maximum values (M1, M2). The selection rule is either to select an N-th largest film thickness or to select an N-th smallest film thickness, and N is a predetermined natural number.
    Type: Grant
    Filed: April 5, 2016
    Date of Patent: April 9, 2019
    Assignee: EBARA CORPORATION
    Inventor: Toshifumi Kimba
  • Patent number: 10252084
    Abstract: A device and method to be used in the calibration process for a linear accelerator (LINAC). The optical water surface detector device allows the accurate determine of the height of the water surface in a tank. The device housing includes a light source and a light receiver. The housing can also include a circuit board. The device is mounted on an arm attached to a vertical position mechanism mounted within the tank. The light source within the device is controlled by a main control unit which also receives signals from the receiver and determines the amount of light striking the receiver. The control unit also controls the position of the vertical position mechanism and thus the arm on which the device is mounted.
    Type: Grant
    Filed: November 16, 2016
    Date of Patent: April 9, 2019
    Assignee: AKTINA CORP.
    Inventor: Nicholas G. Zacharopoulos
  • Patent number: 10254572
    Abstract: Provided are an inverting device capable of suppressing a defect caused by wear debris generated by contacting and sliding of clamping members on a substrate with a sealing member, the wear debris being melted when heating the substrate and then adhered thereto after cooling thereof, and a manufacturing method of a liquid crystal display panel using the inverting device. The inverting device includes a main body, an inverting portion, a substrate contact portion, and a substrate support portion. The substrate contact portion and the substrate support portion clamp the substrate, and the inverting portion inverts the substrate. The substrate contact portion and the substrate support portion each have heat-resistant layer with a heat resistance temperature which is equal to or higher than a temperature at which the sealing member is cured by heating.
    Type: Grant
    Filed: July 27, 2017
    Date of Patent: April 9, 2019
    Assignee: SAKAI DISPLAY PRODUCTS CORPORATION
    Inventors: Kenji Asakura, Makoto Tsuji, Kazuyuki Yamasaki
  • Patent number: 10220480
    Abstract: A spindle speed adjusting device in machining is provided, which may include a plurality of signal detection modules, a signal capturing module and a signal processing module. Each of the signal detection modules may keep measuring the vibration signals in machining. The signal capturing module may capture the vibration signals. The signal processing module may execute a transmissibility analysis to obtain the transmissibility between the signal detection modules, and execute a frequency response fitting according to the transmissibility to obtain a plurality of system dynamic parameters, and then execute a stability lobe diagram analysis to calculate the optimized spindle speed of the machining tool so as to make the machining tool operate at the optimized spindle speed. The signal processing module may repeatedly execute the transmissibility analysis, the frequency response fitting and the stability lobe diagram analysis to keep updating the optimized spindle speed until the machining process ends.
    Type: Grant
    Filed: May 22, 2017
    Date of Patent: March 5, 2019
    Assignee: NATIONAL CHUNG CHENG UNIVERSITY
    Inventors: Chih-Chun Cheng, Ping-Chun Tsai, Wen-Nan Cheng, Yu-Hsin Kuo, Yin-Chun Cheng, Yu-Sheng Chiu
  • Patent number: 10198012
    Abstract: A system for automatic routing of chemicals includes a plurality of equipment, including a source and a destination, and one or more possible paths between the source and destination. The system further includes a process control unit to communicate with the equipment, a routing control unit to communicate with the process control unit. The routing control unit is provided with control algorithms for finding an optimum path between the source and the destination based at least partially on feedback from the process control unit.
    Type: Grant
    Filed: September 23, 2014
    Date of Patent: February 5, 2019
    Assignee: National Oilwell Varco Norway AS
    Inventors: Svenn Kristoffersen, Jan Helge Sørensen, Tormod Hertzenberg, Thomas Klemetsen, Deepak Arora
  • Patent number: 10191474
    Abstract: Automated fixture layout is approached in two distinct stages. First, the spatial locations of clamping points on the work piece are determined to ensure immobility of the fixtured part under any infinitesimal perturbation. Second, spatial locations are matched against a user-specified library of reconfigurable clamps to synthesize a valid fixture layout or configuration that includes clamps that are accessible and collision free. The spatial locations matching during the second stage can be the same spatial locations chosen in the first stage to ensure immobility, or a different set of spatial locations.
    Type: Grant
    Filed: January 11, 2016
    Date of Patent: January 29, 2019
    Assignee: Sandvik Intellectual Property AB
    Inventors: Saigopal Nelaturi, Arvind Rangarajan, Tolga Kurtoglu, Christian Fritz
  • Patent number: 10166652
    Abstract: Provided are a device and method for polishing a substrate, in which an upper ground surface, a side surface and a lower ground surface of a substrate can be simultaneously polished, and a polishing wheel can be evenly used on the whole so as to be uniformly abraded. A substrate polishing system is to polish a substrate, of which upper edge and a lower edge are polished, and includes: a table, on which the substrate is secured; a spindle provided at the upper portion of a side surface of the table; a polishing wheel formed in the shape of a cylinder and having a rotating shaft mounted perpendicularly to the substrate, so as to polish the substrate with a side surface thereof while rotating by the spindle; and a Z axis movement means for moving the polishing wheel in the vertical direction during the polishing of the substrate.
    Type: Grant
    Filed: June 2, 2016
    Date of Patent: January 1, 2019
    Assignees: KNJ CO., LTD., SAMSUNG DISPLAY CO., LTD.
    Inventors: Gi-Hwan Bae, Jun-Woo Hong
  • Patent number: 10160056
    Abstract: Arc welding equipment for joining the objects at high speed and for reducing the strain of the objects after being joined is provided. The nozzle housing an electrode forming arc plasma is formed from a gas supply part and a gas suction part. The gas supply part has gas supply holes supplying gas outward in a radial direction of the arc plasma. The gas suction part suctions the gas supplied form the gas supply part. A pair of the gas supply holes, which are disposed so that the electrode is disposed therebetween, supply the gas of a first pressure to a position away from the electrode by a first distance. A pair of the gas supply holes, which are disposed so that the electrode is disposed therebetween other than the pair of the gas supply holes, supply the gas of a second pressure to a position away from the electrode by a second distance. The second distance is longer than the first distance. The gas of the second pressure is lower than that of the first pressure.
    Type: Grant
    Filed: November 5, 2015
    Date of Patent: December 25, 2018
    Assignee: DENSO CORPORATION
    Inventors: Hideaki Shirai, Tsuyoshi Hayakawa, Yuusuke Kataoka
  • Patent number: 10153204
    Abstract: Systems and methods may be provided for generating reduced-height circuit packages such as infrared detector packages. An alignment and dicing system may include an infrared camera that captures images of alignment marks of a wafer assembly through a lid wafer of the wafer assembly, a light source that illuminates the alignment marks through the lid wafer, and dicing equipment that dices the wafer assembly based on infrared images captured using the infrared camera. The light source may illuminate the alignment marks through the lid wafer by providing light such as infrared light to the wafer assembly through optics of the infrared camera. The infrared camera may capture images of alignment marks formed on a detector wafer of the wafer assembly or on an interior or lower surface of the lid wafer through the lid wafer. The dicing equipment may be aligned with the wafer assembly based on the captured images.
    Type: Grant
    Filed: June 2, 2015
    Date of Patent: December 11, 2018
    Assignee: FLIR Systems, Inc.
    Inventors: Tiahaar Kurtheru Clayton McKenzie, Richard E. Bornfreund, Devin Leonard, Gregory A. Carlson
  • Patent number: 10130512
    Abstract: An apparatus for covering a left eye and a right eye of a human, includes: a first eye piece configured for covering a left eye of a human; and a second eye piece configured for covering a right eye of the human; wherein the first eye piece and the second eye piece are configured for preventing transmission of visible light; and wherein at least one of the first eye piece and the second eye piece comprises a region that is transparent for electromagnetic radiation with a wavelength range outside a visible range.
    Type: Grant
    Filed: May 9, 2016
    Date of Patent: November 20, 2018
    Assignee: Natus Medical Incorporated
    Inventor: Thomas Geertsen
  • Patent number: 10108031
    Abstract: The present invention relates to the technical field for detecting a display substrate, and discloses a substrate detection apparatus and a protrusion height detection method. The substrate detection apparatus comprises a carrier configured to carry a substrate to be detected as well as a sensor bracket, a height measuring sensor is disposed at one end of the sensor bracket, the height measuring sensor is of a cone structure, and a diameter of an end face, which is configured to detect the substrate to be detected, of the height measuring sensor is smaller than that of the other end face. The substrate detection apparatus and the protrusion height detection method can solve problems such as inaccurate measurement and inaccurate calculation for a height of a protrusion defect on a color filter substrate.
    Type: Grant
    Filed: August 12, 2015
    Date of Patent: October 23, 2018
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Guilin Liu, Jingjing Li, Xiujuan Cui, Juan Li, Hongyan Zhang, Shanshan Yu
  • Patent number: 10052741
    Abstract: In one embodiment, a semiconductor manufacturing apparatus includes a polishing table configured to hold a polishing pad for polishing a substrate, and to rotate the polishing pad. The apparatus further includes a dressing module configured to hold a dresser for dressing the polishing pad, and to dress a surface of the polishing pad by sweeping the polishing pad with the dresser while rotating the dresser. The apparatus further includes a controller configured to control a number of revolutions of the polishing table based on a position of the dresser to the polishing table, while the polishing pad is dressed.
    Type: Grant
    Filed: August 2, 2016
    Date of Patent: August 21, 2018
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Takashi Watanabe, Shunsuke Doi
  • Patent number: 9969048
    Abstract: A polishing apparatus for polishing a substrate is provided. The polishing apparatus includes: a polishing table holding a polishing pad; a top ring configured to press the substrate against the polishing pad; first and second optical heads each configured to apply the light to the substrate and to receive reflected light from the substrate; spectroscopes each configured to measure at each wavelength an intensity of the reflected light received; and a processor configured to produce a spectrum indicating a relationship between intensity and wavelength of the reflected light. The first optical head is arranged so as to face a center of the substrate, and the second optical head is arranged so as to face a peripheral portion of the substrate.
    Type: Grant
    Filed: July 24, 2015
    Date of Patent: May 15, 2018
    Assignee: Ebara Corporation
    Inventors: Itsuki Kobata, Yoichi Kobayashi, Katsutoshi Ono, Masaki Kinoshita, Toshifumi Kimba