Abstract: A saw grinding apparatus comprises a saw blade mount for mounting a saw blade thereto; a tool rack comprising multiple tool bays each for storing a grinding tool; and at least one computer numerically controlled (CNC) multiple axes grind wheel manipulator which uses each grinding tool to perform a saw grinding operation. The manipulator includes a spindle connectable to a grinding tool and is movable to a grinding position wherein a grinding operation can be performed on a saw blade mounted to the saw blade mount. The manipulator is also movable to a tool change position wherein the spindle can engage a grinding tool stored in a tool bay and can deposit a grinding tool in an empty tool bay.

Abstract: A measuring device for measuring a film thickness of a silicon wafer (1) comprises: position and velocity sensors (4) linearly arranged along a longitudinal direction into first and second position and velocity sensor arrays spaced apart from each other in a lateral direction, in which the position and velocity sensors (4) in the first position and velocity sensor array are in one-to-one correspondence with the position and velocity sensors (4) in the second position and velocity sensor array in the lateral direction; an eddy current sensor (2) disposed in a symmetrical plane between the first position and velocity sensor array and the second position and velocity sensor array and perpendicular to the lateral direction; and a controller connected to the position and velocity sensors (4) and the eddy current sensor (2) respectively for controlling measurement of the thickness of the film according to detection signals from the position and velocity sensors (4) and the eddy current sensor (2).

Abstract: A method and an apparatus for machining an exterior surface of a metal alloy casing of a portable electronic device to form a combination of a flat edge surface, a curved edge surface and a flat bottom surface is disclosed. The flat edge surface is abraded by contacting a first flat section of a rotating cutting tool along a first circuit of a pre-determined continuous spiral path. The curved edge surface is abraded by contacting a convex section of the rotating cutting tool along additional circuits of the first pre-determined continuous spiral path. The pitch of vertical movement of the cutting tool is adjusted for each circuit of the continuous spiral path based on a resulting curvature of the metal alloy casing. The bottom surface is abraded by contacting a flat section of the cutting tool along a second pre-determined alternating direction linear path.

Abstract: The described embodiments relate generally to lapping operations and related systems and apparatuses. Various embodiments of lapping tables are described for applying a lapping operation to a non-planar surface of a workpiece. For example, methods and apparatus are described which allow a lapping operation to be applied to a curved outer surface portion of a cylindrical workpiece. Lapping of non-planar outer surfaces of workpieces is conducted by rotating the workpieces during the lapping operations.

Abstract: A system for system for controlling functions of a multi-feed blasting apparatus is disclosed. Tank pressure, charge/discharge control, status of a vessel cover, total hours of pressurization or operation for the vessel and individual feed lines, ambient environmental or weather conditions, and abrasive material level inside the vessel may also be monitored and controlled by the disclosed system.

Abstract: An object of the present invention is to provide a method of polishing silicon wafers, capable of suppressing generation of undesired sounds from carriers and reducing the thickness variation of the wafers after polished. The method is a wafer polishing method in which wafers 20 are polished by supplying a polishing solution to surfaces 30a of a pair of polishing pads 30 positioned above and below carriers 10 each having a circular hole 11 for retaining the wafers 20, the carriers 10 being thinner than the wafers 20; and sliding the polishing pads 30 relatively to the carriers 10, thereby simultaneously polishing both surfaces of the wafers 20 retained in the carriers 10. The method is characterized in that information sourced from the carriers 10 when a difference between the thickness of the carriers 10 and the thickness of the wafers 20 reaches a predetermined value is detected to calculate the thickness of the wafers 20, thereby terminating polishing.

Abstract: The invention relates to a device and method for using same for sanding a predetermined impression into a workpiece. The device has a pattern belt positioned inside the area formed by a sanding belt. A pad is positioned inside the area formed by the pattern belt. A raised pattern is formed on the outer surface of the pattern belt. In use, the pad is selectively controlled to contact the pattern belt, thereby urging the raised pattern of the pattern belt to contact the sanding belt. The portion of the sanding belt contacted by the pattern belt is urged toward the workpiece so that the predetermined impression is sanded into the workpiece.

Abstract: The system delivers media blasting material to an interior surface of a large storage tank comprises a substantially upright support structure secured to the surface to be blasted. The upright support structure is preferably vertical. A frame extends across the upright support structure. An extendable arm is affixed to the frame at a section. The section is securely and pivotably attached to the section in such a way to enable the arm to rotate freely inside the large storage tank, so that the blaster secured at the end of the extendable arm can blast the entire interior surface of the large storage tank while the upright support structure remains in place. A robot blaster is positioned at the end of the extendable arm and performs the media blasting. A work station is located nearby the site of the large storage tank and controls the position of the extendable arm relative to the interior surface being blasted via a processor and the operation of the blasting delivery system.

Abstract: A method for producing a dental shaped part includes checking an outer contour of a tool of machining equipment, using least one gauge provided on a blank formed from a tooth restoration material from which a dental shaped part is to be machined using the machining equipment. The method also includes machining the dental shaped part from the blank using the tool of the machining equipment, when the outer contour of the tool corresponds to the at least one gauge provided on the blank.

Abstract: A system and method for imparting a textured surface effect in a board. The system and method are configured to releasably secure a charge on a table; determine a random abrasion pattern for the charge with at least one programmable controller; and control at least one abrasion assembly with the at least one programmable controller in accord with the random abrasion pattern to selectively engage and remove desired portions of the upper surface of the charge with the at least one abrasion assembly to form a randomized textured surface effect thereon.

Abstract: A fluid jet system is configured to etch a workpiece to a plurality of depths to produce an etched part corresponding to a computer image.

Abstract: A method and an apparatus for shaping an edge at a juncture of two adjoining surfaces of a part. A first surface and a second surface of the part are abraded by contacting a polishing surface of a polishing wheel to the first surface and to the second surface. The polishing surface spins in opposite rotational directions about an axis parallel to the edge when contacting the first and second surfaces respectively. The polishing surface moves at different translational speeds and the polishing wheel spins at different rotational speeds along straight segments and along curved segments of the edge. The shaped edge has a visually smooth and geometrically uniform appearance.

Abstract: A method of controlling polishing includes storing a library having a plurality of reference spectra, polishing a substrate, measuring a sequence of spectra of light from the substrate during polishing, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum using a matching technique other than sum of squared differences to generate a sequence of best matching reference spectra, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the sequence of best matching reference spectra. Finding a best matching reference spectrum may include performing a cross-correlation of the measured spectrum with each of two or more of the plurality of reference spectra from the library and selecting a reference spectrum with the greatest correlation to the measured spectrum as a best matching reference spectrum.

Abstract: The present invention relates to a detection apparatus of chemical mechanical polishing conditioner, comprising: a working platform with a working plane; a placement base disposed on the working plane of the working platform, for carrying a chemical mechanical polishing conditioner; an image capture device forming one or a plurality of captured images on different regions of the chemical mechanical polishing conditioner; a display device; an image recognition module, wherein the captured images are performed a color matching by the image recognition module to determine one or a plurality of risk diamonds on the chemical mechanical polishing conditioner, and the coordinate location of the risk diamonds are outputted into the display device; and a mobile platform for moving the risk diamonds to specified locations. A detection method of the above mentioned detection apparatus is also disclosed.

Abstract: A gear grinding machine, whose tool spindle (18) is supported on a first swivel-motion unit (17) seated on a first linear-motion unit (15), has a second linear-motion unit (19) which is arranged on the first linear-motion unit (15) and carries a dressing spindle (21) that is capable of being driven in rotary movement.

Abstract: A scratch removal tool that includes a motor, a housing, a rotatable shaft operably coupled to the motor and movable in an axial direction along a length of the shaft, and a head assembly. The head assembly includes a shroud member having an open end, a pad member, a slurry input, a slurry output, and a seal member. The pad member is positioned within the shroud and mounted to the shaft. Rotation of the shaft rotates the pad member. Axial movement of the shaft moves the pad member relative to the open end of the shroud. The slurry input and slurry are in fluid communication with the pad member. The seal member is positioned at the open end of the shroud.

Abstract: A method of controlling polishing includes polishing a substrate and receiving an identification of a selected spectral feature, a wavelength range having a width, and a characteristic of the selected spectral feature to monitor during polishing. A sequence of spectra of light from the substrate is measured while the substrate is being polished. A sequence of values of the characteristic of the selected spectral feature is generated from the sequence of spectra. For at least some spectra from the sequence of spectra, a modified wavelength range is generated based on a position of the spectral feature within a previous wavelength range used for a previous spectrum in the sequence of spectra, the modified wavelength range is searched for the selected spectral feature, and a value of a characteristic of the selected spectral feature is determined.

Abstract: A TSV (through silicon via) reveal process using CMP (chemical mechanical polishing) may be acoustically monitored and controlled to detect TSV breakage and automatically respond thereto. Acoustic emissions received by one or more acoustic sensors positioned proximate a substrate holder and/or a polishing pad of a CMP system may be analyzed to detect TSV breakage during a CMP process. In response to detecting TSV breakage, one or more remedial actions may automatically occur. In some embodiments, a polishing pad platen may have one or more acoustic sensors integrated therein that extend into a polishing pad mounted on the polishing pad platen. Methods of monitoring and controlling a TSV reveal process are also provided, as are other aspects.

Abstract: A method of polishing a substrate is disclosed. The method includes irradiating the substrate with light; measuring intensity of the reflected light; producing spectral waveform representing relationship between relative reflectance and wavelength of the light; performing a Fourier transform process on the spectral waveform to determine a thickness of the film and a corresponding strength of frequency component; determining whether the determined thickness of the film is reliable or not by comparing the strength of frequency component with a threshold value; calculating a defective data rate representing a proportion of the number of unreliable measured values to the total number of measured values; and changing the threshold value based on the defective data rate.

Abstract: Methods, systems, and apparatus for spectrographic monitoring of a substrate during chemical mechanical polishing are described. In one aspect, a computer-implemented method includes storing a library having a plurality of reference spectra, each reference spectrum of the plurality of reference spectra having a stored associated index value, measuring a sequence of spectra in-situ during polishing to obtain measured spectra, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum to generate a sequence of best matching reference spectra, determining the associated index value for each best matching spectrum from the sequence of best matching reference spectra to generate a sequence of index values, fitting a linear function to the sequence of index values, and halting the polishing either when the linear function matches or exceeds a target index or when the associated index value from the determining step matches or exceeds the target index.

Abstract: The invention concerns a method of grinding a toothed workpiece in which a central axis of the toothed contour profile is defined, wherein the method encompasses at least two work operations. In a first work operation a grinding zone of a grinding tool whose selection is determined by the grinding process to be performed, which rotates about an axis of rotation and is set up for an infeed in the direction of the shortest distance between said central axis and the rotation axis, is brought into grinding engagement with a tooth flank of the workpiece. In a later, second work operation, the tooth flank is brought into grinding engagement with a grinding zone of a grinding tool whose selection is determined by the grinding process to be performed and which is advanced in the infeed direction of the first operation.

Abstract: A process control system is provided for use with a processing tool for thin film patterning by a material removal processing system. The system includes an optical end-point detector operable within a working area defined by the processing tool when the processing tool is applied to an article, the optical end-point detector performing in-situ measurements of parameters of patterned thin film on the article. An optical integrated monitoring tool is installed with the processing tool and operable outside the working area for measuring parameters of the patterned thin film on the article. A control unit is connected to the end-point detector and to the integrated monitoring tool, and includes processing and computational intelligence responsive to data received from the end-point detector and to the measured data received from the integrated monitoring tool for analyzing data and generating a signal for terminating the patterning of the thin film on the article.

Abstract: In a lens edging system using a lens edger and an edging control terminal, the lens edger includes a calculation switching section configured to switch a setting of a calculating section so as to select either one of a first calculating section and a second calculating section for calculating edging shape data, and a data acquisition section configured to acquire the edging shape data calculated by the second calculating section from the edging control terminal, wherein when the calculation switching section switches the setting of a calculating section so as to select the second calculating section for calculating the edging shape data, the edging shape data calculated by the second calculating section is acquired by a data acquisition section, and a lens edging section performs edging using the acquired edging shape data.

Abstract: A method for simultaneous double-side material-removing processing of at least three workpieces includes disposing the workpieces in a working gap between rotating upper and lower working disks of a double-side processing apparatus. The workpieces lie in freely movable fashion in respective openings in a guide cage and are moved under pressure in the working gap using the guide cage. Upon attaining a preselected target thickness of the workpieces, a deceleration process is initiated that includes reducing an angular velocity ?i(t) of a respective drive i of each of the upper working disk, lower working disk and guide cage to a standstill. The reducing is carried out such that ratios of the angular velocities ?i(t) with respect to one another as a function of time t deviate by no more than 10% from initial ratios of the angular velocities ?i(t) corresponding to when the preselected target thickness was attained.

Abstract: The present relates to an apparatus and method for blending added material with base material on manufactured components. The apparatus comprises an abrasive device having an abrasive surface for removing exceeding added material, and a guide fixed to the abrasive device. The method determines a trajectory of the abrasive surface with respect to a manufactured component: determines which of a plurality of contact points of the guide shall be in contact with the manufactured component along the trajectory; actuates the abrasive device; and controls position and angle of the abrasive surface en the manufactured component along the trajectory, while keeping the determined contact point in contact with the manufactured component. A force is applied to the abrasive device when the abrasive surface is in contact with the manufactured component and transferred when the guide gets in contact with the base material.

Abstract: There is provided a polishing apparatus capable of detecting uneven wear occurring on a polishing pad and detecting an appropriate replacement timing of the polishing pad. The polishing apparatus detects, every predetermined time, a value of rotation speed or a value of rotation torque of a table drive shaft for rotationally driving a polishing table or a dresser drive shaft for driving a dresser, or a value of swing torque of a dresser swing shaft for driving the dresser; calculates a change quantity thereof based on the value of the detected rotation speed, the value of the detected rotation torque, or the value of the detected swing torque; determines whether or not the change quantity exceeds a predetermined value; and notifies a user of a warning when a determination is made that the change quantity exceeds the predetermined value.

Abstract: A method for providing a magnetic transducer including an underlayer is provided. The method comprises providing a recessed region in the underlayer. The recessed region includes a front having an angle from horizontal. The angle is greater than zero and less than ninety degrees. The method further comprises providing an assist pole layer in the recessed region, providing a main pole layer, a portion of the main pole layer residing on the assist pole layer, and defining a main pole from the assist pole layer and the main pole layer.

Abstract: An apparatus for polishing a substrate includes a rotatable polishing table supporting a polishing pad, a substrate holder configured to hold the substrate and press the substrate against a polishing surface of the polishing pad on the rotating polishing table so as to polish the substrate, and a pad-temperature detector configured to measure a temperature of the polishing surface of the polishing pad. The apparatus also includes a pad-temperature regulator configured to contact the polishing surface to regulate the temperature of the polishing surface, and a temperature controller configured to control the temperature of the polishing surface by controlling the pad-temperature regulator based on information on the temperature of the polishing surface detected by the pad-temperature detector.

Abstract: A predictive calculation method for calculating the shape of a cross-section of an engagement ridge of an ophthalmic lens obtained by beveling the lens with a beveling grindwheel driven in accordance with an initial path setting. The method includes the following steps: acquiring the initial path setting for the beveling grindwheel relative to the lens; determining at least two approximations (Sii, Sij) of the shape of the cross-section under consideration of the engagement ridge, the approximations being deduced from the intersection between the beveling grindwheel and the ophthalmic lens when the beveling grindwheel is situated at two distinct positions of the initial path setting; determining the intersection between these two approximations; and deducing therefrom the shape (Si) of the cross-section under consideration of the engagement ridge.

Abstract: The method includes the steps of measuring a surface height of a polishing member 10 at each of plural oscillation sections Z1 to Z5 which are defined in advance on the polishing member 10 along an oscillation direction of a dresser 5; calculating a difference between a current profile obtained from measured values of the surface height and a target profile of the polishing member 10; and correcting moving speeds of the dresser 5 in the plural oscillation sections Z1 to Z5 so as to eliminate the difference.

Abstract: A method of polishing a wafer is disclosed that includes determining a removal profile. The wafer is measured to determine a starting wafer profile and then the wafer is polished. The wafer is again measured after being polished to determine a polished wafer profile. The starting wafer profile and the polished wafer profile are compared to each other to determine the removal profile by computing the amount and shape of material removed from the first wafer during polishing.

Abstract: A method for controlling the residue clearing process of a chemical mechanical polishing (“CMP”) process is provided. Dynamic in-situ profile control (“ISPC”) is used to control polishing before residue clearing starts, and then a new polishing recipe is dynamically calculated for the clearing process. Several different methods are disclosed for calculating the clearing recipe. First, in certain implementations when feedback at T0 or T1 methods are used, a post polishing profile and feedback offsets are generated in ISPC software. Based on the polishing profile and feedback generated from ISPC before the start of the clearing process, a flat post profile after clearing is targeted. The estimated time for the clearing step may be based on the previously processed wafers (for example, a moving average of the previous endpoint times). The calculated pressures may be scaled to a lower (or higher) baseline pressure for a more uniform clearing.

Abstract: A programmable coolant nozzle system and method for grinding wheel machines. The system comprises a fluid manifold block that automatically or manually follows the wear of the grinding wheel, to position coolant jets tangential to the wheel surface throughout the life of the grinding wheel. The positioning is by an arcuate motion, through a parallelogram mechanism, to ensure that the coolant jets remain at the same angle to the grinding wheel surface throughout the entire range of motion.

Abstract: A device and method for finishing a surface of a work piece. The device includes a finishing apparatus which cooperates with the surface of the work piece. A mounting member is provided which cooperates with the surface of the work piece to removably mount the device to the surface of the work piece. At least one support member extends between the mounting member and the finishing apparatus. The finishing apparatus is moveable relative to the mounting member to allow the finishing apparatus to perform a finishing operation on the surface of the work piece.

Abstract: A method of controlling polishing includes polishing a substrate and receiving an identification of a selected spectral feature, a wavelength range having a width, and a characteristic of the selected spectral feature to monitor during polishing. A sequence of spectra of light from the substrate is measured while the substrate is being polished. A sequence of values of the characteristic of the selected spectral feature is generated from the sequence of spectra. For at least some spectra from the sequence of spectra, a modified wavelength range is generated based on a position of the spectral feature within a previous wavelength range used for a previous spectrum in the sequence of spectra, the modified wavelength range is searched for the selected spectral feature, and a value of a characteristic of the selected spectral feature is determined.

Abstract: The invention relates to a method for ascertaining topography deviations of a dressing tool. The method includes executing a predefined relative movement of a dressing tool in relation to a dressable grinding tool, wherein during the execution of the relative movement, at least one contour region of the dressing tool is transferred into a transfer region of the grinding tool. A plunging body made of material which can be ground in the machine is provided. The transfer region of the grinding tool is moved into the vicinity of the plunging body by a relative infeed movement. A rotational movement of the grinding tool around an axis of rotation is executed. Plunging the transfer region of the grinding tool into the material of the plunging body, to thus perform a transfer of the topography of the transfer region into an imaging region of the plunging body.

Abstract: The present invention relates to a method for hard-fine machining of tooth flanks with corrections and/or modifications on a gear-cutting machine, wherein respective toothed wheel pairings which mesh with one another within a transmission or a test device are machined while taking account of the respective mating flanks, and wherein the tooth flanks of the relevant workpieces are provided with periodic waviness corrections or waviness modifications. In accordance with the invention, the rotational error extent is determined by means of rotational distance error measurement of the toothed wheel pairs in a gear measuring device and/or transmission. This measurement result serves as an input value for defining the amplitude, frequency and phase position for the periodic flank waviness corrections on the tooth flanks of the toothed wheel pairings for production in the gear-cutting machine.

Abstract: A method for operating a machining tool, comprising: setting a flow rate and a pressure of a flow of coolant to a target flow rate and a pressure target, respectively, the coolant flow being provided to the machining tool; machining a work-piece using the machining tool; measuring the flow rate and the pressure of the flow of coolant; and detecting an anomaly with respect to the coolant flow; and taking a corrective action depending on the type of the detected anomaly.

Abstract: Disclosed herein is a device for cutting a glass sheet, continuously supplied after a melting and solidification process, into quadrangular glass substrates. The glass sheet cutting device includes two or more cutters for cutting a glass sheet into quadrangular glass substrates, a defect inspector for scanning the glass sheet to three-dimensionally check defect positions in a length direction, a width direction and a thickness direction of the glass sheet, a position adjuster for moving at least one of the cutters to a portion of the glass sheet at which few defects are distributed, and a controller for informing the position adjuster of positions of the cutters based on the scanned results received from the defect inspector.

Abstract: A method of controlling a polishing operation includes measuring a plurality of spectra at a plurality of different positions on a substrate to provide a plurality of measured spectra. For each measured spectrum of the plurality of measured spectra, a characterizing value is generated based on the measured spectrum. For each characterizing value, a goodness of fit of the measured spectrum to another spectrum used in generating the characterizing value is determined. A wafer-level characterizing value map is generated by applying a regression to the plurality of characterizing values with the plurality of goodnesses of fit used as weighting factors in the regression. A polishing endpoint or a polishing parameter of the polishing apparatus is adjusted based on the wafer-level characterizing map, and the substrate or a subsequent substrate is polished in the polishing apparatus with the adjusted polishing endpoint or polishing parameter.

Abstract: A method of controlling a polishing operation is described. A controller stores an optical model for a layer stack having a plurality of layers and a plurality of input parameters including a first parameter and a second parameter. The controller stores data defining a plurality of default values for the first parameter and measures an optical property of a substrate and generates a second value. Using the optical model and the second value and iterating over the first values, a number of reference spectra are calculated. A spectrum is measured and the measured spectrum is matched to the reference spectra and the best matched reference spectrum is determined. The first value of the best matched reference spectrum is determined and is used to adjust a polishing endpoint or a polishing parameter of a polishing apparatus.

Abstract: A method of operating a polishing system includes polishing a substrate at a polishing station, the substrate held by a carrier head during polishing, transporting the substrate to an in-sequence optical metrology system positioned between the polishing station and another polishing station or a transfer station, measuring a plurality of spectra reflected from the substrate with a probe of the optical metrology system while moving the carrier head to cause the probe to traverse a path across the substrate and while the probe remains stationary, the path across the substrate comprising either a plurality of concentric circles or a plurality of substantially radially aligned arcuate segments, and adjusting a polishing endpoint or a polishing parameter of the polishing system based on one or more characterizing values generated based on at least some of the plurality of spectra.

Abstract: A method of controlling a polishing system includes transporting a substrate to an in-line optical metrology system positioned in a chemical mechanical polishing system, at the in-line optical metrology system, moving a probe relative to the substrate to measure a plurality of spectra reflected from the substrate at a plurality of different positions on the substrate, for each measured spectrum of the plurality of spectra, determining a goodness of fit of the measured spectrum to a reference spectrum; and adjusting a polishing endpoint or a polishing parameter of the polishing system based on one or more characterizing values generated based on a subset of the plurality of spectra that includes only spectra of the plurality of spectra for which the goodness of fit meets a matching threshold.

Abstract: There are provided a grinding machine and a grinding method that make it possible to achieve a high degree of accuracy of the roundness of a workpiece. As at least one of a coolant dynamic pressure and a grinding efficiency varies depending on a phase of the workpiece, a pressing force in the cut-in direction, which an eccentric cylindrical portion of the workpiece receives from a grinding wheel, varies and a degree of deflection of the eccentric cylindrical portion also varies. In the grinding machine, the degree of deflection during grinding is acquired based on the coolant dynamic pressure and the grinding efficiency, a first correction value for a command position of the grinding wheel relative to the eccentric cylindrical portion is computed, and the command position is corrected based on the first correction value.

Abstract: A method of controlling a polishing operation includes storing an optical model for a layer stack having a plurality of layers. The optical model has a plurality of input parameters, the plurality of input parameters including a first parameter and a second parameter. The second parameter is a polarization angle or a relative contribution between two orthogonal polarizations. A spectrum reflected from the substrate is measured with an in-sequence or in-situ monitoring system to provide a measured spectrum. The optical model is fit to the measured spectrum, or a plurality of reference spectra are calculated using the optical model and a best matching reference spectrum from the plurality of reference spectra is determined.

Abstract: The present invention is directed to an apparatus for grinding or polishing at least one edge of a glass substrate. The apparatus includes a grinding unit configured to remove a predetermined amount of material from the edge when in an aligned position. The grinding unit applies a predetermined force normal to the edge. An air bearing slide system is coupled to the grinding unit. The air bearing slide system is configured to slide along a predetermined axis on a thin film of pressurized air that provides a zero friction load bearing interface. A linear actuation motor is coupled to the air bearing slide system. The linear actuation motor is configured to control the movement of the air bearing slide system such that the grinding unit is moved from a non-aligned position to the aligned position.

Abstract: A method of polishing includes polishing a substrate, receiving an identification of a selected spectral feature to monitor during polishing, measuring a sequence of spectra of light reflected from the substrate while the substrate is being polished, determining a location value and an associated intensity value of the selected spectral feature for each of the spectra in the sequence of spectra to generate a sequence of coordinates, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the sequence of coordinates. At least some of the spectra of the sequence differ due to material being removed during the polishing, and the coordinates are pairs of location values and associated intensity values.

Abstract: The described embodiment relates generally to the polishing of a device housing. The device housing can be formed of a thermoplastic, or a metal such as aluminum or stainless steel. More particularly, a method and an apparatus are described for calibrating a polishing process in which a precise amount of material can be removed. Accurate measurement of such a polishing process can be especially helpful in accurately determining material removal rates and pad wear occurring across curved surfaces and edges where such parameters tend to be difficult to predict.

Abstract: The method is used to drill at least one hole into a front wall section of a workpiece (12) by way of a machining jet formed from liquid, to which abrasive material is admixed as needed. As seen looking in the drilling direction, the front wall section is located in front of a rear wall section of the workpiece, which is disposed with an intermediate space at a distance from the front wall section. The hole is drilled at least partially by the machining jet impinging on the front wall section in a pulsed manner. This pulsed jet is generated by the recurrent interruption of the impingement of the liquid and/or of the abrasive material on the front wall section.

Abstract: A method and an apparatus for smart automation of robotic surface finishing of a three-dimensional surface of a work piece is described. A three-dimensional motion path is created along the surface of the work piece. A variable contact force profile is specified along the three-dimensional motion path. The three-dimensional motion path is modified based on the specified variable contact force profile. The surface of the work piece is finished using one or more surface finishing tools along the modified three-dimensional motion path. The surface of the work piece includes at least a flat region and a curved region.