Abstract: Systems and methods for correcting fabrication error in magnetic recording heads using magnetic write width (MWW) measurements are provided. One such method includes separating a wafer into sections containing row bars, each row bar including magnetic recording heads, selecting a first row bar from a first section of the sections, lapping the first row bar to form sliders, performing a test of a magnetic write width (MWW) on each of the sliders, calculating a first error profile for the first row bar based on results of the magnetic write width tests, generating a second error profile for a stripe height of a component of the sliders based on the first error profile, where the component is selected from a magnetic read head and a magnetic write head, and lapping a second row bar from the row bars of the first section using the second error profile.

Abstract: A method of manufacturing turned surfaces of a rotor disc of a gas turbine engine, including rotating the rotor disc about its central axis, rotating an abrasive grinding wheel having an outer grinding surface with a hardness greater than that of a material of the rotor disc, contacting the rotating wheel with at least one annular surface of the rotating disc, and sliding the rotating wheel along a curved cross-sectional profile of the at least one annular surface of the rotating disc.

Abstract: A novel polishing pad is described. The polishing pad includes a base plate, a main polishing body, a plurality of metal bottom portions, a positive electrode conductive wire and a negative electrode conductive wire. The main polishing body made from a non-conductive material and disposed on the base plate includes a plurality of cavities thereon. The metal bottom portions are disposed in the cavities with each of the cavities having one of the metal bottom portions therein. The positive electrode conductive wire electrically is connected to a positive electrode of a power supply. The negative electrode conductive wire electrically is connected to a negative electrode of the power supply. The positive electrode conductive wire and the negative electrode conductive wire alternatively pass through the base plate and connect to the metal bottom portions respectively.

Abstract: A measured characterizing value dependent on a thickness of a region of a substrate is input into a first predictive filter. The first predictive filter generates a filtered characterizing value. A measured characterizing rate at which the measured characterizing value changes is input into a second predictive filter. The second predictive filter generates a filtered characterizing rate of the region of the substrate. The measured characterizing value and the measured characterizing rate are determined based on in-situ measurements made at or before a first time during a polishing process of the substrate. A desired characterizing rate is determined to be used for polishing the region of the substrate after the first time and before a second, later time based on the filtered characterizing value and the filtered characterizing rate.

Abstract: A slider bar apparatus, and a method for lapping a back side surface of the slider bar, is provided. The slider bar includes a head part and a pair of sliders separated by the head part. Each of the sliders has an air bearing surface (ABS) and a back side surface opposite the ABS. Each of the sliders has a reader element and a writer element of a magnetic head for use in a magnetic hard disk drive. An electrical lapping guide is mounted on the back side surface and has a pair of terminals and a conductive material extending between the terminals. The conductive material is arranged on the slider bar such that the resistance between the terminals increases during a lapping of the back side of the sliders.

Abstract: The invention relates to a method for adjusting the position of a transparent element (1), consisting in forming an image of a peripheral edge (B1) of the transparent element, using the light diffused by said peripheral edge. In this way, movements by the transparent element relative to reference marks can be followed on a screen or carried out automatically based on an analysis of the image. The method can be used to apply a piece of film (2) to a spectacle lens, adjusting the distance between the respective peripheral edges (B1, B2) of the spectacle lens and the piece of film.

Abstract: Embodiments of the present invention provide an apparatus and method for wafer thinning endpoint detection. Embodiments of the present invention utilize through silicon via (TSV) structures formed in the wafer. A specially made wafer handle is bonded to the wafer. Conductive slurry is used in the wafer backside thinning process. The wafer handle provides electrical connectivity to an electrical measurement tool, and conductive posts in the wafer handle are proximal to a test structure on the wafer. A plurality of electrically isolated TSVs is monitored via the electrical measurement tool. When the TSVs are exposed on the backside as a result of thinning, the conductive slurry shorts the electrically isolated TSVs, changing the electrical properties of the plurality of TSVs. The change in electrical properties is detected and used to trigger termination of the wafer backside thinning process.

Abstract: A method for adjusting a height position of a polishing head, comprising moving the polishing head to a height position at which the polishing head comes in noncontact with the polishing pad with the polishing head holding no workpiece, and then rotating at least one of the polishing head and the turn table; measuring the load torque current of the at least one of the polishing head and the turn table rotated with the torque-measuring mechanism while the height-adjusting mechanism moves the polishing head toward the polishing pad until the polishing head contacts the polishing pad, and recording the height position of the polishing head as a reference position when a variation in the measured load torque current exceeds a threshold; and adjusting the height position of the polishing head to the predetermined position on the basis of a distance from the reference position.

Abstract: An electronic device for controlling and/or regulating a drive unit includes a memory configured to make available at least two at least partially different control parameter sets which are each usable to at least one of control and regulate one of at least two drive units. The electronic device further includes a control unit which is configured to select one of the at least two parameter sets of the memory unit as a function of at least one operating parameter of the drive unit.

Abstract: A machine grinding system is provided for machine grinding the main bearing journals, pin bearing journals, the post surface, gear-fit wall surface, and the flywheel flange surfaces of a four cylinder crankshaft. The system includes three operating stations, each operating station only requiring one machine to maintain the desired production rate. The first operating station machine grinds the main bearing journals, post surface, and gear-fit wall surface; the second operating station machine grinds the pin journals; and the third operating station machine grinds the thrust bearing surfaces and the flywheel flange surfaces.

Abstract: A method of generating control code for a CNC machine is described. The method includes the steps of: (1) generating in a computer a first plurality of coordinate values, xi, yi, zi, said first plurality of coordinate values representing a plurality of first connected line segments which surround a vertical axis, said first connected line segments gradually descending to a first predetermined depth, (2) generating in a computer a second plurality of coordinate values xj, yj, zj, said second coordinate values representing a plurality of second connected line segments which surround the vertical axis, said plurality of second connected line segments having a starting point at approximately the first predetermined depth, and gradually descending to a second predetermined depth greater than the first depth, and (3) converting the first and the second coordinate values to a code for controlling the CNC machine.

Abstract: A method is capable of monitoring the polishing surface of the polishing pad without removing the polishing pad from the polishing table. The method includes: conditioning the polishing surface of the polishing pad by causing a rotating dresser to oscillate on the polishing surface; measuring a height of the polishing surface when the conditioning of the polishing surface is performed; calculating a position of a measuring point of the height on a two-dimensional surface defined on the polishing surface; and repeating the measuring of the height of the polishing surface and the calculating of the position of the measuring point to create height distribution in the polishing surface.

Abstract: A self-cleaning optical system for the transmission or reflection of light to and/or from a process region comprises a liquid bath and a transparent or reflective optical component continuously rotatable about a non-vertical axis so that a lower part of the component continuously rotates through the bath. When the component emerges from the bath, a coating of the liquid remains thereon which forms a substantially uniform film on at least a part of the component through which the light is transmitted or from which the light is reflected.

Abstract: Determining position parameters defining relative position of a manufactured derivable surface relative to a reference surface, the process comprising: providing a nominal surface expressed in a nominal frame of reference and corresponding to the theoretical derivable surface to be manufactured with the nominal value of the position parameters defining the relative position of the nominal surface relative to the reference surface, providing a measured surface of the manufactured derivable surface expressed in the nominal frame of reference, providing at least one deformation surface defined by at least one deformation adjustable parameter, determining a composed surface by adding the measured surface and the deformation surface, determining the position parameters and at least one deformation parameter by minimizing the difference between the nominal surface and the composed surface.

Abstract: An edge grinding apparatus and method for grinding a glass substrate, with which a glass substrate can be ground by a fixed amount and the occurrence of defects can be minimized. The edge grinding apparatus includes an edge grinding unit which grinds a cut edge of a glass substrate while following the cut edge; a measuring unit which obtains positional information of the cut edge; and a control unit which receives the positional information of the cut edge from the measuring unit and controls a position of the edge grinding unit based on the positional information of the cut edge.

Abstract: A method of aligning an ingot of semiconductor or solar-grade material with a mounting block includes supporting the ingot using adjustable supports, aligning a predetermined centerline of the ingot with a reference line using a laser, and attaching the mounting block to the ingot such that the predetermined centerline remains aligned with the reference line.

Abstract: A method of precision manufacture of an outer arm of a rocker arm assembly is performed by determining structures of a rough outer arm that would require precision processing and locations to support the structures as they are processed. Starting with at least one structure requiring precision processing, locations on the outer arm close to the structure to hold the outer arm during processing are determined that would cause minimal distortion of the outer arm during processing. The outer arm is then provided with clamping lobes at these locations. The clamping lobes of the outer arm are clamping into a fixture for manufacturing. The slider pad may now be precision ground while the outer arm is clamped in the fixture with minimal risk of distortion of the outer arm.

Abstract: A method for dressing a tool of a gear grinding machine, including a workpiece holder and a tool holder, is provided. The tool holder, arranged on a machining head, is rotatable about a first axis of rotation, and is linearly movable via a first linear axis of movement, wherein a workpiece clamped in the workpiece holder can be machined by a tool clamped in the tool holder. The machine furthermore includes a dressing unit with a dressing tool holder rotatable about a second axis of rotation, wherein a dressing tool accommodated in the dressing tool holder is used for dressing the tool clamped in the tool holder. During the dressing operation the machining head is pivoted about the swivel axis in dependence on a tool profile and is linearly moved with the first linear axis of movement.

Abstract: A method of polishing one side of a wafer, which makes it possible to accurately realize the desired wafer edge shape without dependence on the period of use of a polishing cloth, is provided. In the method according to the present invention, a wafer fixed to a head is brought into contact with a polishing cloth provided on a surface of a surface plate, and the head and the surface plate are rotated, thereby polishing one side of the wafer, the method including the steps of measuring a contact angle of the polishing cloth (S1); determining a rotation speed of the head and the surface plate, based on the measured contact angle of the polishing cloth (S4); and polishing the one side of the wafer by rotating the head and the surface plate at the determined rotation speed (S5, S6).

Abstract: A commanded speed is acquired by a command program analysis unit, an override is acquired by an override input unit, and the override before input is changed in steps by a stepwise override change unit to the override that is input, in a predesignated time or by a predesignated change amount, and outputs the override changed as an actual override. The actual override is acquired by a speed operation unit in an interpolation cycle from the stepwise override change unit and the commanded speed is multiplied by the actual override to calculate a feed speed.

Abstract: A polishing pad has structural parts embedded therein; sensors, a memory for storing detected information obtained by the sensors, and a communication unit driven by a power supply unit to communicate with outside in a non-contact manner. The polishing pad and a communication unit configured to communicate with the communication unit of the polishing pad in a non-contact manner constitute a polishing information management system. The polishing pad and a communication unit configured to transmit and receive the information to and from the communication unit of the polishing pad in a non-contact manner constitute a polishing apparatus.

Abstract: This machine includes a base frame (17) and a lens support (19) mounted on the frame (17) with the lens support (19) having elements (29A, 29B) for driving a lens (15) into rotation around a first axis. It includes a tool holder set (21) including a rotary shaft (39) around a second axis (C-C?) and elements (43) for inclining the first axis (A-A?) with respect to the second axis (C-C?). The rotary shaft (39) bears at least two tools (49, 51) for machining the lens, spaced out along the second axis (C-C?), and a spacer (50) positioned in an intermediate area (55) located between both machining tools (49, 51). The spacer (50) defines an outer surface (57) for machining the lens.

Abstract: A CMP structure for CMP processing and a method of making a device using the same are presented. The apparatus comprises a polishing pad on a platen table; a head assembly for holding a wafer against the polishing pad, wherein the head assembly includes the retaining ring; a sensor for sensing the step height between the retaining ring and its membrane and a controller for adjusting the movement of the retaining ring based on the step height between the retaining ring and its membrane to ensure the step height remains at a fixed value as the retaining ring wears out.

Abstract: In a machining method of supporting a workpiece having a cylindrical machined portion such that the workpiece is rotatable and feeding a grinding wheel in a radial direction, a start diameter that is a diameter including a measurement start point on a surface of the machined portion is measured, and, after the measurement start point passes through a machining application portion, an end diameter that is a diameter including a measurement end point is measured. An actual grinding depth at the time when the measurement start point is machined is computed by the equation, U=|D0?D1|, a runout of the machined portion is computed from a relative difference in the actual grinding depth (U) between positions of the machined portion in a rotational direction, and infeed control of the grinding wheel is executed such that the runout is removed.

Abstract: A polishing apparatus polishes a substrate by moving the substrate and a polishing pad relative to each other. The apparatus includes: an elastic modulus measuring device configured to measure an elastic modulus of the polishing pad, and a polishing condition adjustor configured to adjust polishing conditions of the substrate based on a measured value of the elastic modulus. The polishing conditions include pressure of a retaining ring, arranged around the substrate, exerted on the polishing pad and a temperature of the polishing pad.

Abstract: The present invention relates to a grinding wheel truing tool, its manufacturing method, and a truing apparatus, a method for manufacturing a grinding wheel and a wafer edge grinding apparatus using the same. The grinding wheel truing tool of the present invention compensates a groove of a fine-grinding wheel for fine-grinding a wafer edge, and includes a truer having an edge of the same angle as a slanted surface of the groove of the fine-grinding wheel and a cross-sectional shape corresponding to a cross-sectional shape of the groove. The present invention uses the truing tool to easily process the groove of the grinding wheel for fine-grinding the wafer edge.

Abstract: A method of fabricating a part by forging, the method including: measuring geometrical characteristics of the forged part; comparing a measured shape with a theoretical shape that is to be obtained for the part; deducing therefrom zones that are not in compliance with the theoretical shape and also thicknesses of material that need to be removed from the zones that are not in compliance; and polishing the zones of the forged part that are not in compliance to remove the deduced thicknesses of material by using a controlled abrasive band. The control of the abrasive band takes account of at least one parameter representative of wear of the abrasive band during polishing of zones that are not in compliance.

Abstract: In a method for producing a base body with hard material particles, an adhesive is first of all applied with a defined film thickness to the entire or parts of the working surface of the tool to be produced. Next, the hard material particles are applied to the regions of the working surface provided with the adhesive for lasting adhesion. Hard material particles are applied evenly by an apparatus and are then transferred to the working surface of the tool to be produced provided with the adhesive, on which they remain adhered before the adhesive has hardened. This method enables rapid coating of the working surface of the tool with a predeterminable uniform number of detached hard material particles per unit of area.

Abstract: A method comprising: (a). providing a device comprising: a movable table having a movement gage; a gage for measuring a dimension of one or more bearing blanks; and a machining tool for machining the one or more bearing blanks; (b). prompting a user to input one or more process variables; (c). supplying the one or more bearing blank into the device; (d). moving the bearing blank to a table grinding position; and (e). measuring the dimension of the one or more bearing blanks using the gage; (f). measuring a distance moved by the movable table so that a reference measurement is provided; and (g). comparing the measurement of step (e) to the reference measurement of step (f).

Abstract: Provided are a carrier head and a carrier head unit for sucking and securely supporting a substrate during a chemical mechanical polishing process. The carrier head using sucking force to fix a substrate includes a head main body that includes a receiving space in a central portion thereof, the receiving space being opened downward to receive the substrate, a housing part in an edge thereof to surround a side portion of the receiving space, a main passage passing through the head main body to communicate with the receiving space, and a plurality of connecting holes vertically passing through the housing part to communicate with the main passage, a retaining ring coupled to a bottom surface of the housing part of the head main body to close lower portions of the connecting holes, and a cover coupled to a top surface of the head main body to close upper portions of the connecting holes.

Abstract: The method includes the steps of measuring a surface height of a polishing member 10 at each of plural oscillation sections Z1 to Z5 which are defined in advance on the polishing member 10 along an oscillation direction of a dresser 5; calculating a difference between a current profile obtained from measured values of the surface height and a target profile of the polishing member 10; and correcting moving speeds of the dresser 5 in the plural oscillation sections Z1 to Z5 so as to eliminate the difference.

Abstract: Enhanced methods are disclosed for performing operations such as cleaning, inspection or data acquisition on an external surface of a hollow cylindrical tubular. Preferred embodiments include providing a fluid dispenser and an abrasion assembly on a buggy that travels up and down the length of the tubular as the tubular rotates. The fluid dispenser includes nozzles that dispense cleaning fluids onto the tubular's external surface. The abrasion assembly includes a swivel brush and a brush train providing different styles of abrasion cleaning of the tubular's external surface. Preferred embodiments of the buggy also carry a range finding laser and an optical camera generating samples that may be processed in real time into data regarding the surface contours and the diameter variations on the tubular's external surface. Cleaning and inspection variables such as tubular rotational speed, or buggy speed, may be adjusted responsive to measured surface contour data.

Abstract: An eyeglass lens processing apparatus includes: a lens rotation unit configured to rotate a lens chuck shaft; a processing tool rotational shaft to which a processing tool is attached; a shaft-to-shaft distance change unit that includes a carriage which holds the lens chuck shaft or the processing tool rotational shaft and is movable in a direction where a shaft-to-shaft distance between the lens chuck shaft and the processing tool rotational shaft changes by driving a motor, a movement member that is moved in the shaft-to-shaft distance direction, a connection member that connects the movement member and the carriage, and a deformation detecting sensor configured to detect a deformation of the connection member; and a controller configured to control the driving of the motor based on a detection result of the deformation detecting sensor.

Abstract: An apparatus for detecting the flatness of a top surface of a wafer includes a plurality of detector elements, a metal sink and a plurality of injection pipes. Each detector element comprises: a metal tube body, jet pipes, a light receiver and a light emitter. The method comprises: injecting ultra-pure water into the detector elements by injection pipes; emitting parallel beams along an upward-oblique direction, a preset Angle ? being formed between the beams and the vertical direction. The radiated beams above the water surface are incident on a receiver. The intensity of the beams received by the light receiver is used to calculate the height of the detecting point of the surface of the silicon wafer to determine the flatness condition of the wafer surface. The flatness of the photo-resist covered on the wafer surface can also be accurately measured by this method.

Abstract: A method of grinding the tip of a blade which forms part of a rotor for a gas turbine engine is provided. The method includes mounting a plurality of blades in a disc to provide a blade assembly; mounting the blade assembly in a grinding apparatus; aligning the plurality of blades in a predetermined position using compressed fluid; and, grinding the blade tips.

Abstract: A first method is provided that comprises the steps of: measuring a first surface disposed on a first substrate, measuring a second surface disposed on a second substrate, calculating a variable gap between the first surface and the second surface, depositing a variable amount of adhesive on the first surface of the first substrate based at least in part on the calculation of the variable gap, and placing the second substrate over the first substrate, wherein the adhesive is disposed between the first surface of the first substrate and the second surface of the second substrate.

Abstract: Embodiments described herein generally relate to connecting Electronic Lapping Guides (ELG) to a lapping controller such that the number of wire bonds from the controller to a row of read heads is minimized. When lapping the air bearing surface of the read heads, the electrical resistances of the ELGs are monitored to adjust the lapping process and set the stripe height for read sensors in the read heads. Once the resistance corresponds to the desired stripe height, the lapping process is stopped. To measure the resistance, each ELG may be electrically coupled to the same substrate—i.e., share the same common ground. The lapping controller applies a voltage potential across the ELGs using a wire bonded to a pad in the respective read head and one or more connections to the grounded substrate. This configuration avoids having to bond two wires onto each read head.

Abstract: A system for providing transducer(s) including a disk structure and having an air-bearing surface (ABS) are described. The disk structure resides a distance from the ABS and has a disk dimension substantially perpendicular to the ABS. Lapping control and disk windage ELGs are provided. The lapping control ELG has first and second edges first and second distances from the ABS. The disk windage ELG has edges different distances from the ABS. A difference between these edges corresponds to the disk dimension. A windage resistance of the disk windage ELG is measured and a disk windage determined. The disk windage corresponds to a difference between designed and actual disk dimensions perpendicular to the ABS. A lapping ELG target resistance is determined based on the disk windage. The transducer is lapped. Lapping is terminated based on a resistance of the lapping control ELG and the lapping ELG target resistance.

Abstract: Methods for manufacturing electronic lapping guides (ELGs) for writer heads that closely track the pole formation of the writer heads are provided. Once such method includes forming an ELG adjacent to a writer head that is subjected to substantially all of the sub-processing actions associated with the pole formation of the writer head, lapping the pole material, measuring a resistance of the ELG during the lapping, comparing the measured resistance with a target resistance, and terminating the lapping based on the comparison of the measured resistance with the target resistance.

Abstract: Provided is a method of making a barrel-shaped worm-like tool whereby a barrel-shaped worm-like tool capable of efficiently performing grinding without unequal wear can easily be made. The aforementioned method comprises making the barrel-shaped worm-like tool (12) by using a dressing gear (11) to dress the barrel-shaped worm-like tool (12), which is used for machining an internal gear and has a diameter that gradually increases from the ends (12b, 12c) to the center (12a) in the axial direction. On the basis of data wherein the number of teeth is less than that of the internal gear to be machined, the dressing gear (11) and the barrel-shaped worm-like tool (12) are engaged with each other at the same axial intersection angle as during gear-machining performed by the barrel-shaped worm-like tool (12).

Abstract: A polishing is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a substrate holding apparatus configured to hold the substrate and to press the substrate against the polishing surface, and a controller. The substrate holding apparatus includes an elastic membrane configured to forma substrate holding surface which is brought into contact with the substrate, a carrier provided above the elastic membrane, at least one pressure chamber formed between the elastic membrane and the carrier, and an infrared light detector configured to measure thermal energy from the elastic membrane. The controller calculates an estimate value of a temperature of the elastic membrane using a measured value of the infrared light detector.

Abstract: Teaching (contacting) operation is performed, and from the contact position (SX), the workpiece (2) is ground by a given “test grinding amount (A).” Subsequently, the diameter of the workpiece is measured. Based on the result of the measurement, the residual amount to be ground (residual grinding amount) to obtain the finished dimensions is calculated, and grinding by the “residual grinding amount (R)” is performed.

Abstract: The described embodiment relates generally to the development of a finishing process for a device housing. The device housing can be formed of a thermoplastic, or a metal such as aluminum or stainless steel. A method and an apparatus are described for accurately measuring the amount of material removed during a finishing process. More particularly embodiments described within this application disclose a method of accurately measuring material removal during a finishing process across a curved or spline shaped surface by drilling an array of pockets along a surface of the device housing, where the drilled pockets can be used to measure material removal rates with a high degree of accuracy.

Abstract: A method of controlling polishing includes polishing a region of a substrate at a first polishing rate, measuring a sequence characterizing values for the region of the substrate during polishing with an in-situ monitoring system, determining a polishing rate adjustment for each of a plurality of adjustment times prior to a polishing endpoint time, and adjusting a polishing parameter to polish the substrate at a second polishing rate. The time period is greater than a period between the adjustment times and the projected time is before the polishing endpoint time. The second polishing rate is the first polishing rate as adjusted by the polishing rate adjustment.

Abstract: A measured characterizing value dependent on a thickness of a region of a substrate is input into a first predictive filter. The first predictive filter generates a filtered characterizing value. A measured characterizing rate at which the measured characterizing value changes is input into a second predictive filter. The second predictive filter generates a filtered characterizing rate of the region of the substrate. The measured characterizing value and the measured characterizing rate are determined based on in-situ measurements made at or before a first time during a polishing process of the substrate. A desired characterizing rate is determined to be used for polishing the region of the substrate after the first time and before a second, later time based on the filtered characterizing value and the filtered characterizing rate.

Abstract: The method for machining a series of workpieces (21) via at least one machining jet includes the following steps: each workpiece (21) is associated with an identifier for uniquely identifying the workpiece, during the machining of a respective workpiece, the temporal characteristic of the machining jet is detected by at least one sensor (30), the detected temporal characteristic is evaluated so as to obtain at least one comparative value, and for detecting incorrect machining, the at least one comparative value is compared with at least one threshold value.

Abstract: Provided is a chemical mechanical polishing (CMP) apparatus that includes a swing unit installed apart from a platen, on which a CMP pad to be conditioned is placed, at a predetermined interval, a connector installed on an upper end of the swing unit at one end thereof in a perpendicular direction to the swing unit and pivoting around the swing unit above the CMP pad, a rotator rotatably installed on the other end of the connector, a CMP pad conditioner coupled to the rotator and conditioning the CMP pad when rotated, and a vibration meter installed on the connector and detecting vibrations to measure a vibration acceleration of the CMP pad conditioner, thereby predicting a wear rate of the CMP pad based on the vibration acceleration and a state in which the CMP pad conditioner is installed or being used.

Abstract: A multi-carriage dual-spindle symmetrical grinding processing center, wherein: A work table with a rotary table therein is positioned on a first carriage which is attached to a front base; first and second upright posts are positioned in a gantry form on a back base; a horizontal grinding head is connected to a second carriage between the upright posts; a third left carriage and a third right carriage are slidingly connected to the first and second upright posts, respectively, and a left slider and a right slider are connected to the third left carriage and the third right carriage, respectively; a vertical grinding head is installed at the front end of the right slider; an automatic tool changing device is equipped with the vertical grinding head, and a grinding wheel profile dressing device can be installed on the second carriage and on the left slider.

Abstract: A master servo motor and a slave servo motor that synchronously drive for rotation a master main spindle provided with a center that supports one end of a work piece and a slave main spindle provided with a center that supports the other end of the work piece are included. Before grinding, a slip detection cycle that detects a limit current value for the servo motors, at which the work piece and the centers slip, is executed and, during grinding, a grinding condition is changed to prevent a slip between the work piece and the centers in advance at the time when any one of current values of the servo motors has reached a slip threshold value set on the basis of the limit current value.

Abstract: Methods are described for mechanically scraping surfaces of boards, such as flooring boards, to impart random-looking scraped profiles therein. An apparatus for mechanically scraping boards to form the scraped board products also is described. A board, such as a flooring board, having a random-looking scraped appearance that includes overlapping multiple scrape patterns is described. Boards, such as flooring boards, having a simulated rustic or distressed appearance made with the methods and apparatus also are described.