Abstract: Methods are described for mechanically scraping surfaces of boards, such as flooring boards, to impart random-looking scraped profiles therein. An apparatus for mechanically scraping boards to form the scraped board products also is described. A board, such as a flooring board, having a random-looking scraped appearance that includes overlapping multiple scrape patterns is described. Boards, such as flooring boards, having a simulated rustic or distressed appearance made with the methods and apparatus also are described.

Abstract: There is disclosed a polishing cleaning mechanism configured to be in contact with a rear surface of a substrate which is held in a substrate holding unit for holding the rear surface of the substrate and perform a polishing process and a cleaning process on the rear surface of the substrate, including a cleaning member configured to clean the rear surface of the substrate, a polishing member configured to polish the rear surface of the substrate, and a support member configured to support the polishing member and the cleaning member to face the rear surface of the substrate held in the substrate holding unit, wherein a surface of the polishing member facing the substrate and a surface of the cleaning member facing the substrate differ in relative height from each other.

Abstract: Disclosed are an apparatus and a method for monitoring a glass plate polishing state. The apparatus may include a location measuring unit for measuring a location on a glass plate being polished by a polishing machine, a current measuring unit for measuring an electric current flowing into the polishing machine, a memory unit for storing a reference value of the electric current flowing into the polishing machine for each polishing location of the glass plate, and a control unit for determining whether a polishing state is faulty, by comparing a value of the electric current measured by the current measuring unit for each polishing location measured by the location measuring unit with a corresponding reference value of the electric current stored in the memory unit for each polishing location.

Abstract: A polishing apparatus capable of monitoring an accurate progress of polishing is disclosed. The polishing apparatus includes: a polishing table for supporting a polishing pad; a table motor configured to rotate the polishing table; a top ring configured to press a substrate against the polishing pad to polish the substrate; a dresser configured to dress the polishing pad while oscillating on the polishing pad during polishing of the substrate; a filtering device configured to remove a vibration component, having a frequency corresponding to an oscillation period of the dresser, from an output current signal of the table motor; and a polishing monitoring device configured to monitor a progress of polishing of the substrate based on the output current signal from which the vibration component has been removed.

Abstract: A method of chemical mechanical polishing a substrate includes polishing a metal layer on the substrate at a polishing station, monitoring thickness of the metal layer during polishing at the polishing station with an eddy current monitoring system, and controlling pressures applied by a carrier head to the substrate during polishing of the metal layer at the polishing station based on thickness measurements of the metal layer from the eddy current monitoring system to reduce differences between an expected thickness profile of the metal layer and a target profile, wherein the metal layer has a resistivity greater than 700 ohm Angstroms.

Abstract: A tooth flank machining device includes a helical teeth grinding wheel, a position adjusting unit] capable of moving a relative position of a rotational axis of the helical teeth grinding wheel to a rotational axis of a work gear, and a controlling unit having a relative position controller activating the position adjusting unit to adjust the relative position of the rotational axis of the helical teeth grinding wheel to the rotational axis of the work gear so that the helical teeth grinding wheel engages the work gear with a grinding wheel tooth flank of the helical teeth grinding wheel abutting on only one of work tooth flanks forming a tooth of the work gear, a grinding wheel rotating unit controller activating a grinding wheel rotating unit, and a torque controlling unit controller activating a rotational torque controlling unit to adjust rotational torque within a predetermined range.

Abstract: In one aspect, a method of controlling polishing includes receiving a measurement of an initial thickness of a conductive film on a first substrate prior to polishing the first substrate from an in-line or stand-alone monitoring system, polishing one or more substrates in a polishing system, the one or more substrates including the first substrate, during polishing of the one or more substrates, monitoring the one or more substrates with an eddy current monitoring system to generate a first signal, determining a starting value of the first signal for a start of polishing of the first substrate, determining a gain based on the starting value and the measurement of the initial thickness, for at least a portion of the first signal collected during polishing of at least one substrate of the one or more substrates, and calculating a second signal based on the first signal and the gain.

Abstract: A method of controlling polishing includes polishing a substrate at a first polishing station, monitoring the substrate with a first eddy current monitoring system to generate a first signal, determining an ending value of the first signal for an end of polishing of the substrate at the first polishing station, determining a first temperature at the first polishing station, polishing the substrate at a second polishing station, monitoring the substrate with a second eddy current monitoring system to generate a second signal, determining a starting value of the second signal for a start of polishing of the substrate at the second polishing station, determining a gain for the second polishing station based on the ending value, the starting value and the first temperature, and calculating a third signal based on the second signal and the gain.

Abstract: A load cup apparatus for transferring a substrate in a processing system includes a pedestal assembly having a substrate support, an actuator, and a controller. The actuator is configured to move the pedestal assembly into a loading position in contact with a retaining ring of a carrier head and to generate a retaining ring thickness signal based on a distance travelled by the pedestal assembly. The controller is configured to receive the retaining ring thickness signal from the actuator.

Abstract: A carrier for a slider row bar for a lapping process. The carrier has a mounting structure comprising a material configured to have a first modulus of at least 1,000,000 Pa at a first period of time and a second modulus of 500 Pa to 500,000 Pa at a second period of time subsequent to the first period. The change from the first modulus to the second modulus is due to an external stimulus on the material.

Abstract: Method and apparatus for lapping gears which includes an active torque system to substantially improve the lapping process with respect to run-out and other longer-term motion transmission errors without compromising tooth-to-tooth performance. Motion transmission error measurements provide the basis for calculating a corrective active torque component which is combined with conventional process torque to reduce or eliminate part run-out.

Abstract: The application discloses embodiments of a lapping head including a sensor device in the base structure of the rotating lapping head. For operation, rotation is imparted to the lapping head through a drive motor coupled to the lapping head through a rotating shaft. As disclosed, the sensor device is electrically connected to one or more electronic components or circuitry through the rotating shaft and a rotating electrical connector coupled to the rotating shaft. In embodiments disclosed, the sensor device is an eddy current sensor configured to measure a gap dimension between a sensor element on the lapping head and a conductive platen to provide an in-situs measurement of workpiece thickness.

Abstract: Methods and apparatus for orienting and operating grinding motors and their associated mechanical parameters for rail applications are described. A method for determining a parameter for operation of grinding motors on a grinding vehicle, may include: receiving a rail profile, comparing the rail profile with a target rail template to provide a comparison result, and determining, by a processor, based on the comparison result, one or more of a grinding motor's orientation, power, and speed.

Abstract: A smoothing method and a smoothing apparatus uses a belt grinding apparatus, including an endless grinding belt and a press pad that presses the grinding belt against a welded area, and uses this belt grinding apparatus in two different modes after obtaining information on heights of surfaces of two welded members along a weld bead of the two welded members. The first mode corresponds to a bead removing step in which the grinding belt is pressed against a welded area by the press pad to reduce the height of the weld bead. The next mode corresponds to a smoothing step in which the grinding belt presses against the welded area by the press pad while being made to move along the surfaces of the two welded members to smooth the welded area.

Abstract: A method of polishing a substrate having a film is provided. The method includes: performing polishing of the substrate in a polishing section; transporting the polished substrate to a wet-type film thickness measuring device prior to cleaning and drying of the substrate; measuring a thickness of the film by the wet-type film thickness measuring device; comparing the thickness with a predetermined target value; and if the thickness has not reached the predetermined target value, performing re-polishing of the substrate in the polishing section prior to cleaning and drying of the substrate.

Abstract: A CMP structure for CMP processing and a method of making a device using the same are presented. The apparatus comprises a polishing pad on a platen table, a head assembly for holding a wafer against the polishing pad, wherein the head assembly includes a retaining ring, a sensor for sensing the depth of grooves on the retaining ring and a controller for determining an update pressure to apply to the retaining ring based on the depth of the grooves and applying the updated pressure to the retaining ring during processing.

Abstract: A method and apparatus for buffing tread from a tire carcass, the method comprising the steps of: positioning a sensor at a first lateral location along a width of the tread; receiving a first signal from the sensor, the first signal generated as a function of a distance between the sensor and a belt in the tire and a tire characteristic; selecting a first signal response curve from a plurality of signal response curves based upon the first lateral location of the sensor, the selected signal response curve representing the function of the distance between the sensor and the tire belt and the tire characteristic; determining from the response curve the distance between the sensor and the belt for the signal response received; buffing tread from the tire until the distance between the sensor and the belt reaches a final distance. The steps are repeated at a second lateral location.

Abstract: A method of controlling a polishing operation includes obtaining a sequence over time of measured spectra with an in-situ optical monitoring system during polishing. For each measured spectrum from the sequence an optical model is fit. The optical model includes dimensions of a repeating structure and the fitting includes calculating a output spectrum using diffraction effects of the repeating structure, and parameters of the optical model include an endpoint parameter and a parameter of the repeating structure. The fitting generates the sequence of fitted endpoint parameter values, and at least one of a polishing endpoint or an adjustment of a pressure to the substrate is determined from the sequence of fitted endpoint parameter values.

Abstract: A method of manufacturing a magnetic read-write head, including the steps of presenting a row bar to a processing location, the row bar including an air bearing surface, at least one read-write head, at least one electronic lapping guide, and at least one trigger device, wherein each electronic lapping guide is positioned at a different distance from the air bearing surface than each trigger device, and wherein the read-write head and at least one of the trigger devices include a multi-layer stack of materials; lapping the air bearing surface while measuring the electrical resistance of at least one electronic lapping guide and at least one trigger device until the resistance measurement of the trigger device provides an open circuit reading, and measuring an offset resistance value of the at least one electronic lapping guide concurrently with the measurement of the open circuit reading by the trigger device.

Abstract: A system and method for positioning a fluid stream for cutting a double contour workpiece includes a compensation module configured to receive information regarding a contour path in at least five degrees of freedom for cutting the double contour workpiece and a velocity of movement of the fluid stream during cutting and configured to provide as an output a modified contour path of said at least five degrees of freedom based on Kerf compensation errors. A motion controller is adapted to receive the modified contour path of said at least five degrees of freedom and the velocity and is configured to provide control signals. A positioner is configured to receive the control signals and position a fluid stream adjacent the workpiece accordingly.

Abstract: A polishing method includes: rotating a polishing table that supports a polishing pad; polishing a conductive film by pressing a substrate having the conductive film against the polishing pad; obtaining a film thickness signal with use of an eddy current film-thickness sensor disposed in the polishing table; determining a thickness of the polishing pad based on the film thickness signal; determining a polishing rate of the conductive film corresponding to the determined thickness of the polishing pad; calculating an expected amount of polishing of the conductive film to be polished at the determined polishing rate for a predetermined polishing time; calculating a temporary end-point film thickness by adding the expected amount of polishing to a target thickness; and terminating polishing of the conductive film when the predetermined polishing time has elapsed from a point of time when the thickness of the conductive film has reached the temporary end-point film thickness.

Abstract: A TSV wafer thinning controlling method and system is provided, which can improve the accuracy of the wafer thinning technique. The system includes a chuck table used for carrying a wafer and a grinding device used for thinning the wafer; and further includes: an infrared sensor equipped on the chuck table or grinding device, and a measurement feedback system connected with the infrared sensor and the grinding device; wherein, the infrared sensor comprises an infrared emitting and receiving circuit, signal amplifying and filtering circuit and a data processor.

Abstract: The invention relates to a method for centering grinding of workpieces, for example optical lenses by a grinding tool using an actuator for generating an advancing movement between the grinding tool and the workpiece, wherein the actuator and a current regulator for an actuator current which determines an advancing force of the actuator are integrated in a position control loop using a predetermined control cycle. For each control cycle: (i) a desired direction of movement (Rsoll(n)) of the advancing movement and an actual direction of movement (Rist(n)) of the advancing movement are ascertained; then (ii) the ascertained actual and desired directions of movement are compared to one another; and (iii) when the comparison results in a deviation between the actual and desired directions of movement, a predetermined current limit (Isollmax) for the actuator current emitted via the current regulator is decreased in a defined manner.

Abstract: A method of controlling a polishing operation includes measuring a plurality of spectra at a plurality of different positions on a substrate to provide a plurality of measured spectra. For each measured spectrum of the plurality of measured spectra, a characterizing value is generated based on the measured spectrum. For each characterizing value, a goodness of fit of the measured spectrum to another spectrum used in generating the characterizing value is determined. A wafer-level characterizing value map is generated by applying a regression to the plurality of characterizing values with the plurality of goodnesses of fit used as weighting factors in the regression. A polishing endpoint or a polishing parameter of the polishing apparatus is adjusted based on the wafer-level characterizing map, and the substrate or a subsequent substrate is polished in the polishing apparatus with the adjusted polishing endpoint or polishing parameter.

Abstract: An adaptive uniform polishing system is equipped with feedback control to apply localized adjustments during a polishing operation. The adaptive uniform polishing system disclosed has particular application to the semiconductor industry. Such an adaptive uniform polishing system includes a rotatable head that holds a semiconductor wafer, and a processing unit structured to be placed in contact with an exposed surface of the wafer. The processing unit includes a rotatable macro-pad and a plurality of rotatable micro-pads that can polish different portions of the exposed surface at different rotation speeds and pressures. Thus, uniformity across the exposed surface can be enhanced by applying customized treatments to different areas. Customized treatments can include the use of different pad materials and geometries. Parameters of the adaptive uniform polishing system are programmable, based on in-situ data or data from other operations in a fabrication process, using advanced process control.

Abstract: Disclosed is a method for dressing a threaded grinding stone for internal gear grinding, by which a threaded grinding stone for grinding an internal gear can be dressed with a high degree of accuracy by using a dressing gear that has been produced with a high degree of accuracy.

Abstract: A controller controls the position of an abrasive. The abrasive is moved to a first desired position adjacent a ball. The ball is rotated while in contact with the abrasive. The abrasive abrades the outer surface of the ball and burrs on the outer surface to remove the burrs. A sensor may be used to sense the position and size of the burrs.

Abstract: The invention relates to a method for hard fine machining of a pre-manufactured flank (11) of a gear wheel by a machine having at least five axes controlled in coordination and one additional tool axis (WA). According to the invention, a rotation-symmetrical tool (20.1) is driven on the machine side such that it is set into a rotation (RA) about the tool axis (WA). In addition, the axes controlled in coordination are actuated such that a straight-lined section of the surface line of the tool (20.1) is guided tangentially along the flank (11) in a generating movement while the tool (20.1) removes material on the pre-manufactured flank (11) by means of the rotation (R1) about the tool axis (WA). The generating movement follows pre-specified movement vectors (E).

Abstract: A method dresses a polishing member with a diamond dresser having diamond particles arranged on a surface thereof. The method includes determining dressing conditions by performing a simulation of a distribution of a sliding distance of the diamond dresser on a surface of the polishing member, and dressing the polishing member with the diamond dresser under the determined dressing conditions. The simulation includes calculating the sliding distance corrected in accordance with a depth of the diamond particles thrusting into the polishing member.

Abstract: A method of repairing a component removes a prior coating from an underlying metal substrate. Small cooling air holes extend through the substrate and the coating that is to be removed. A new coating layer is placed on the metal substrate, and over the existing cooling air holes. The location of the cooling air holes is identified by inspecting the coated component for the location of indicators of the coating passing over the cooling air holes. The identified location of the indicators is used to control a cutting tool to remove any new coating from the cooling air holes. The basic method may also benefit new manufacture.

Abstract: An abrasive blasting apparatus comprises a blast pot, a blast media valve fluidly connected to said blast media outlet of the blast pot, a source of pressurized gas, a proportional air valve in fluid communication with the blast media valve and the source of pressurized air, a hose having a blast nozzle at a distal end thereof, and a main control unit fluidly connected to the blast media valve and the air valve. The blast media valve comprises a housing having a blasting media intake, a plunger disposed within the housing, a sleeve disposed between the housing and the plunger, a blast media port in the sleeve, a casing fixedly connected to the housing, a piston disposed within the casing and connected to the plunger, and a base member fixedly connected to the housing. The plunger is movable by the piston with respect to the blast media port.

Abstract: Embodiments described herein generally relate to connecting electronic lapping guides (ELGs) to a lapping controller to prevent the effects of current crowding while reducing connections to the ELGs in single pad lapping. Devices and systems can include a row of sliders including a magnetoresistive (MR) element, a plurality of high resistance ELGs connected to both the wafer and to at least one bonding pad and at least two peripheral grounding vias connected to the wafer. Methods and systems include a wafer comprising a plurality of sliders wherein each slider is connected to a lapping controller and the delivery of current to the ELGs is sequential to groups of sliders such that only one group of ELGs is being measured at any time.

Abstract: Embodiments described herein generally relate to connecting Electronic Lapping Guides (ELG) to a lapping controller to reduce resistance from current crowding while reducing connections to the ELG. A device and a system can include a wafer with peripheral grounding vias having a radius of at least 10 ?m, a plurality of sliders with a magnetoresistive (MR) elements; a plurality of ELG electrically coupled to the lapping controller through a combination of the wafer and grounding pads and a bonding pad electrically coupled to the ELG. The ELG or the bonding pad can be positioned in the kerf or the device region of a row. If the ELG and the bonding pad are positioned in separate regions, a noble metal should be used to connect. Further, the number of grounding pads can be reduced by using grounding vias at specific intervals and specific sizes.

Abstract: Provided is a method for grinding electrode tips such that the method is capable of detecting irregular grinding when the maximum torque does not occur. Specifically, a tip dresser includes a holder holding a cutter, a servo motor unit allowing the holder to rotate, and a controller controlling the operation of the servo motor unit. The servo motor unit outputs a torque occurrence signal to the controller when a load torque reaches a predetermined value in regular grinding of a pair of electrode tips. The controller detects irregular grinding when not receiving the torque occurrence signal within a time that corresponds to an elapsed time in the regular grinding.

Abstract: The invention relates to a method for machining flat workpieces in a double-sided machining tool, which has an upper and a lower work disk, wherein at least one of the work disks is rotatingly driven and the work disks each have an annular work surface, wherein the work surfaces amongst themselves limit an also annular work gap, in which at least one carrier is located, which guides at least one workpiece in the work gap, so that the at least one workpiece is machined in a double-sided manner between the work surfaces. The distance between the work disks is measured at at least two radially spaced measurement locations of the work gap and in that, from the measured distances, a distance between the work disks is determined at a location of the work gap representing the thickness of the at least one workpiece machined in the work gap.

Abstract: Various embodiments of a semiconductor processing fluid delivery system and a method delivering a semiconductor processing fluid are provided. In aspect, a system for delivering a liquid for performing a process is provided that includes a first flow controller that has a first fluid input coupled to a first source of fluid and a second flow controller that has a second fluid input coupled to a second source of fluid. A controller is provided for generating an output signal to and thereby controlling discharges from the first and second flow controllers. A variable resistor is coupled between an output of the controller and an input of the second flow controller whereby the output signal of the controller and the resistance of the variable resistor may be selected to selectively control discharge of fluid from the first and second flow controllers.

Abstract: Polishing method comprising a step of receiving a surface to be polished, a configuration step during which the polishing machine is configured, and a polishing step during which the optical surface is polished, wherein the angle of inclination of the pin is between 2° and 20°, the inner cusp point is between ?10 mm and 10 mm, the outer cusp point is between R?15 mm and R?5 mm, the speed of advance is between 100 mm/min and 2000 mm/min; the speed of rotation is between 500 rpm and 3000 rpm; and the bearing force is between 50 N and 180 N.

Abstract: A method of controlling a polishing operation includes polishing a first layer of a substrate, during polishing, obtaining a sequence over time of measured spectra with an in-situ optical monitoring system, for each measured spectrum from the sequence of measured spectra, fitting an optical model to the measured spectrum, the fitting including finding parameters that provide a minimum difference between an output spectrum of the optical model and the measured spectrum, the parameters including an endpoint parameter and at least one non-endpoint parameter, the fitting generating a sequence of fitted endpoint parameter values, each endpoint parameter value of the sequence associated with one of the spectra of the sequence of measured spectra, and determining at least one of a polishing endpoint or an adjustment of a pressure to the substrate from the sequence of fitted endpoint parameter values.

Abstract: A device and a method for processing an optical lens are proposed, whereby lens-production data and/or geometric data of the lens are determined from desired optical data of the lens when a corresponding activation code is acquired. Preferably, the lens or a block piece and/or an assigned shipping container is/are provided with the activation code and/or other information relative to the lenses that are to be processed.

Abstract: A system for magnetorheological finishing of a substrate. A spherical wheel meant for carrying a magnetorheological finishing fluid houses a variable-field permanent magnet system having north and south iron pole pieces separated by primary and secondary gaps with a cylindrical cavity bored through the center. A cylindrical permanent magnet magnetized normal to the cylinder axis is rotatably disposed in the cavity. An actuator allows rotation of the permanent magnet to any angle, which rotation changes the distribution of flux in the magnetic circuit through the pole pieces. Thus, one can control field intensity in the gaps by positioning the permanent magnet at whatever angle provides the required field strength. Because the field also passes above the pole pieces, defining a fringing field outside the wheel surface, the variable field extends through a layer of MR fluid on the wheel, thus varying the stiffness of the MR fluid as may be desired for finishing control.

Abstract: A method of generating a library of reference spectra includes storing an optical model for a layer stack having at a plurality of layers, receiving user input identifying a set of one or more refractive index functions and a set of one or more extinction coefficient functions a first layer from the plurality of layers, wherein the set of one or more refractive index functions includes a plurality of different refractive index functions or the set of one or more extinction coefficient functions includes a plurality of different extinction coefficient functions, and for each combination of a refractive index function from the set of refractive index functions and an extinction coefficient function from the set of extinction coefficient functions, calculating a reference spectrum using the optical model based on the refractive index function, the extinction coefficient function and a first thickness of the first layer.

Abstract: A method of controlling polishing includes polishing a substrate of a non-metallic layer undergoing polishing and a metal layer underlying the non-metallic layer; storing a metal reference spectrum, the metal reference spectrum being a spectrum of light reflected from a same metal material as the metal layer; measuring a sequence of raw spectra of light reflected from the substrate during polishing with an in-situ optical monitoring system; normalizing each raw spectrum in the sequence of spectra to generate a sequence of normalized spectra, of which normalizing includes a division operation where the measured spectrum is in the numerator and the metal reference spectrum is in the denominator; and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on at least one normalized predetermined spectrum from the sequence of normalized spectra.

Abstract: An improved destructive and visual measurement automation system and a method for measuring a web thickness of a microdrill are provided. When a dual-axis motion platform module moves the microdrill to a first position, a reflection module reflects a first image in a first direction toward a second direction. A vision module receives the reflected first image in the second direction and outputs the received first image to a computer. According to the first image, the computer performs a positioning procedure and a grinding procedure to drive a drill grinding module to grind the microdrill to a sectional position to be measured of the microdrill. When the microdrill is moved to a second position, the vision module outputs a second image to the computer. According to the second image, the computer performs an image computing procedure to obtain the web thickness at the sectional position to be measured.

Abstract: A film-thickness measuring apparatus and a film-thickness measuring method capable of improving an accuracy of the film-thickness measurement are disclosed. The film-thickness measuring apparatus includes a substrate stage configured to support a substrate horizontally, a rinsing water supply structure configured to supply rinsing water onto an entire surface of the substrate on the substrate stage, a film-thickness measuring head configured to transmit light to a measurement area of the surface of the substrate on the substrate stage, produce a spectrum of reflected light from the measurement area, and determine a film thickness of the substrate from the spectrum, and a fluid supply structure configured to form a flow of a gas on a path of the light and supply the flow of the gas onto the measurement area.

Abstract: A polishing apparatus includes a platen to hold a polishing pad having a plurality of optical apertures, a carrier head to hold a substrate against the polishing pad, a motor to generate relative motion between the carrier head and the platen, and an optical monitoring system. The optical monitoring system includes at least one light source, a common detector, and an optical assembly configured to direct light from the at least one light source to each of a plurality of separated positions in the platen, to direct light from each position of the plurality of separated positions to the substrate as the substrate passes over said each position, to receive reflected light from the substrate as the substrate passes over said each position, and to direct the reflected light from each of the plurality of separated positions to the common detector.

Abstract: Method for the machining of gear teeth whose tooth flanks deviate from their specified geometry by a machining allowance, wherein the machining allowance is removed through an infeed of at least two infeed steps, each of which is followed by a machining pass with a profiling tool that rotates about a tool axis, wherein for this operation the profiling tool—after it has been set to a position relative to the gear wheel that depends on the angle at which the plane of rotation of the tool which is orthogonal to the tool axis is tilted against the axis of the gear wheel—is brought into engagement with the gear teeth, wherein after each infeed step the material within the resultant engagement area of the tool is removed, wherein after the last infeed step with a tilt angle setting of the profiling tool that is determined by the design angle of the latter, the area of tool engagement extends over the entire flank height, so that the next machining pass will remove the amount of material required to attain the speci

Abstract: A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a substrate holding apparatus configured to hold the substrate and to press the substrate against the polishing surface, and a controller. The substrate holding apparatus includes an elastic membrane configured to form a substrate holding surface which is brought into contact with the substrate, a carrier provided above the elastic membrane, at least one pressure chamber formed between the elastic membrane and the carrier, and an infrared light detector configured to measure thermal energy from the elastic membrane. The controller calculates an estimate value of a temperature of the elastic membrane using a measured value of the infrared light detector.

Abstract: A method of controlling polishing includes polishing a substrate having a second layer overlying a first layer, detecting exposure of the first layer with an in-situ monitoring system, receiving an identification of a selected spectral feature and a characteristic of the selected spectral feature to monitor during polishing, measuring a sequence of spectra of light from the substrate while the substrate is being polished, determining a first value for the characteristic of the feature at the time that the first in-situ monitoring technique detects exposure of the first layer, adding an offset to the first value to generate a second value, and monitoring the characteristic of the feature and halting polishing when the characteristic of the feature is determined to reach the second value.

Abstract: A machine tool 1 comprises a bed 11, a column 12, a spindle head 15, a spindle 16, a saddle 17, a table 18, a feed mechanism for moving the spindle head 15, the saddle 17 and the table 18 in Z-axis, Y-axis and X-axis directions respectively, a position detector for detecting the positions of the spindle head 15, saddle 17 and table 18, a controller for feedback controlling the feed mechanism, a position detector 51 for detecting the position of the spindle head 15, a position detector 54 for detecting the position of the spindle head 15, a position detector 57 for detecting the position of the table 18, and a measurement frame 50 which is configured with a different member from the bed 11 and the column 12 and on which readers 53, 56, 59 of the position detectors 51, 54, 57 are disposed.

Abstract: A knife sharpener includes a knife holder in which a knife is inserted so that an edge of the knife is exposed, at least one edge sensor, configured to detect the edge of the knife, at least one abrader, the at least one abrader having a sharpening surface angled to meet an edge of the knife at a sharpening angle of one side of the knife, a motive mechanism connected to the holder and the at least one abrader, and a computing device in communication with the edge sensor and the motive mechanism, and configured to cause the at least one abrader to traverse the edge of the knife using the motive mechanism, in response to the at least one edge sensor. A method for knife sharpening involves directing the abrader to traverse the edge of the knife, responsive to input from an edge sensor.