Sectional Patents (Class 451/529)
  • Patent number: 10086499
    Abstract: An abrasive article includes a body having an annular surface including abrasive segments coupled to the annular surface, and the abrasive segments define an abrasive annular region and a percent abrasive surface area of not greater than 24% for the total surface area of the abrasive annular region.
    Type: Grant
    Filed: March 4, 2016
    Date of Patent: October 2, 2018
    Assignees: SAINT-GOBAIN ABRASIVES, INC., SAINT-GOBAIN ABRASIFS
    Inventors: Cecile O. Mejean, Srinivasan Ramanath, Ramanujam Vedantham, Kelley McNeal
  • Patent number: 9776361
    Abstract: A polishing article manufacturing system includes a feed section and a take-up section, the take-up section comprising a supply roll having a polishing article disposed thereon for a chemical mechanical polishing process, a print section comprising a plurality of printheads disposed between the feed section and the take-up section, and a curing section disposed between the feed section and the take-up section, the curing section comprising one or both of a thermal curing device and an electromagnetic curing device.
    Type: Grant
    Filed: September 23, 2015
    Date of Patent: October 3, 2017
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Kasiraman Krishnan, Daniel Redfield, Russell Edward Perry, Gregory E. Menk, Rajeev Bajaj, Fred C. Redeker, Nag B. Patibandla, Mahendra C. Orilall, Jason G. Fung
  • Patent number: 9649741
    Abstract: Polishing materials suitable for polishing hard surfaces, media including the polishing material, and methods of forming and using the polishing materials and media are disclosed. Exemplary polishing materials have a relatively high hard segments:soft segments ratio and exhibit relatively high removal rates and/or relatively high process yields.
    Type: Grant
    Filed: July 7, 2014
    Date of Patent: May 16, 2017
    Assignee: JH RHODES COMPANY, INC.
    Inventors: Scott Daskiewich, Brent Muncy, George Wasilczyk
  • Patent number: 9415480
    Abstract: An abrasive pad used to abrade the surfaces of glass, ceramic, and metal materials, the abrasive pad being provided with a substrate layer, and an abrasive layer provided on a first surface side of the substrate layer and including an abrasive material, and the abrasive layer having a plurality of base portions arranged mutually separated on the substrate layer, columnar or frustum shaped tip portions arranged mutually separated on the base portions, and a group of grooves containing a plurality of groove portions provided between base portions such that the substrate layer is exposed, with each of the grooves mutually intersecting.
    Type: Grant
    Filed: July 8, 2013
    Date of Patent: August 16, 2016
    Assignee: 3M Innovative Properties Company
    Inventors: Toru Aoki, Akira Yoda, Takayuki Tachihara
  • Patent number: 9211628
    Abstract: Polishing pads with concentric or approximately concentric polygon groove patterns are described. Methods of fabricating polishing pads with concentric or approximately concentric polygon groove patterns are also described.
    Type: Grant
    Filed: January 26, 2011
    Date of Patent: December 15, 2015
    Assignee: NexPlanar Corporation
    Inventors: William C. Allison, Diane Scott, Alexander William Simpson
  • Patent number: 9180570
    Abstract: CMP pads having novel groove configurations are described. For example, described herein are CMP pads comprising primary grooves, secondary grooves, a groove pattern center, and an optional terminal groove. The CMP pads may be made from polyurethane or poly (urethane-urea), and the grooves produced therein may be made by a method from the group consisting of molding, laser writing, water jet cutting, 3-D printing, thermoforming, vacuum forming, micro-contact printing, hot stamping, and mixtures thereof.
    Type: Grant
    Filed: March 16, 2009
    Date of Patent: November 10, 2015
    Assignee: NexPlanar Corporation
    Inventors: Robert Kerprich, Karey Holland, Diane Scott, Sudhanshu Misra
  • Publication number: 20150126098
    Abstract: Provided are abrasive articles in which the make layer, abrasive particle layer, and size layer are coated onto a backing according to a coating pattern characterized by a pattern of discrete islands, or features, having an areal density ranging from about 30 features to about 300 features per square centimeter and an average feature diameter ranging from about 0.1 millimeters to about 1.5 millimeters. Optionally, the provided abrasive particles have an average abrasive particle size ranging from about 20 micrometers to about 250 micrometers and the average make layer thickness ranging from 33 percent to 100 percent of the average abrasive particle size. This coating pattern provides that all three components are generally in registration with each other, while also providing a pervasive uncoated area extending across the backing, thereby providing improved cut and finish performance while displaying a resistance to curl in wet environments.
    Type: Application
    Filed: June 26, 2013
    Publication date: May 7, 2015
    Inventors: Deborah J. Eilers, Jeffrey R. Janssen
  • Publication number: 20150126099
    Abstract: A method of fabricating a polishing layer of a polishing pad includes determining a desired distribution of particles to be embedded within a polymer matrix of the polishing layer. A plurality of layers of the polymer matrix is successively deposited with a 3D printer, each layer of the plurality of layers of polymer matrix being deposited by ejecting a polymer matrix precursor from a nozzle. A plurality of layers of the particles is successively deposited according to the desired distribution with the 3D printer. The polymer matrix precursor is solidified into a polymer matrix having the particles embedded in the desired distribution.
    Type: Application
    Filed: October 9, 2014
    Publication date: May 7, 2015
    Inventors: Kasiraman Krishnan, Nag B. Patibandla, Periya Gopalan
  • Publication number: 20150126100
    Abstract: A polishing article has a polishing surface and an aperture, the aperture including a first section and a second section. The polishing article includes a projection extending inwardly into the aperture. The polishing article includes a lower portion on a side of the first surface farther from the polishing surface. A window has a first portion positioned in the first section of the aperture and a second portion extending into the second section of the aperture. The window has a second surface substantially parallel to the polishing surface. A first adhesive adheres the first surface of the projection to the second surface of the window to secure the window to the projection and a second adhesive of different material composition than the first adhesive. The second adhesive is positioned laterally between the second portion of the window and the lower portion of the polishing article.
    Type: Application
    Filed: January 12, 2015
    Publication date: May 7, 2015
    Inventors: Rajkumar Alagarsamy, Yongqi Hu, Simon Yavelberg, Periya Gopalan, Christopher R. Mahon
  • Publication number: 20150111476
    Abstract: The invention provides a polishing pad and a method of using the polishing pad for chemically-mechanically polishing a substrate. The polishing pad comprises at least a grooved region and an exclusion region, wherein the exclusion region is adjacent to the circumference of the polishing pad, and wherein the exclusion region is devoid of grooves.
    Type: Application
    Filed: October 16, 2014
    Publication date: April 23, 2015
    Inventors: Ching-Ming TSAI, Shi-Wei CHENG, Jia-Cheng HSU, Kun-Shu YANG, Hui-Feng CHEN, Gregory GAUDET, Sheng-Huan LlU
  • Patent number: 9011211
    Abstract: Disclosed herein is sandpaper that includes a first plurality of particles having a first grain size, the first plurality of particles having a first sanding surface covering a first area of the sandpaper. The sandpaper includes a second plurality of particles having a second grain size that is smaller than the first grain size, the second plurality of particles having a second sanding surface covering a second area of the sandpaper. Further, the sandpaper includes a bonding layer having a back surface located opposite the first sanding surface and second sanding surface and a buffer positioned to raise the second plurality of particles such that the first sanding surface and the second sanding surface of the sandpaper are substantially planar.
    Type: Grant
    Filed: March 29, 2010
    Date of Patent: April 21, 2015
    Inventor: Christian T. Zyniecki
  • Publication number: 20150065020
    Abstract: The present application relates to polishing pads for chemical mechanical planarization (CMP) of substrates, and methods of fabrication and use thereof. The pads described in this invention are customized to polishing specifications where specifications include (but not limited to) to the material being polished, chip design and architecture, chip density and pattern density, equipment platform and type of slurry used. These pads can be designed with a specialized polymeric nano-structure with a long or short range order which allows for molecular level tuning achieving superior themo-mechanical characteristics. More particularly, the pads can be designed and fabricated so that there is both uniform and nonuniform spatial distribution of chemical and physical properties within the pads.
    Type: Application
    Filed: September 17, 2014
    Publication date: March 5, 2015
    Inventors: Pradip K. Roy, Manish Deopura, Sudhanshu Misra
  • Publication number: 20150038066
    Abstract: Low density polishing pads and methods of fabricating low density polishing pads are described. In an example, a polishing pad for polishing a substrate includes a polishing body having a density of less than 0.5 g/cc and composed of a thermoset polyurethane material. A plurality of closed cell pores is dispersed in the thermoset polyurethane material.
    Type: Application
    Filed: July 31, 2013
    Publication date: February 5, 2015
    Inventors: Ping Huang, William C. Allison, Richard Frentzel, Paul Andre Lefevre, Robert Kerprich, Diane Scott
  • Publication number: 20150004889
    Abstract: An abrasive article having a plurality of abrasive areas arranged in a non-uniform distribution pattern, wherein the pattern is spiral or phyllotactic, such as a spiral lattice, and in particular those patterns described by the Vogel model, such as a sunflower pattern.
    Type: Application
    Filed: June 27, 2014
    Publication date: January 1, 2015
    Inventor: Anuj SETH
  • Patent number: 8920219
    Abstract: Polishing pads with apertures are described. Methods of fabricating polishing pads with apertures are also described.
    Type: Grant
    Filed: July 15, 2011
    Date of Patent: December 30, 2014
    Assignee: NexPlanar Corporation
    Inventors: William C. Allison, Diane Scott, Rajeev Bajaj
  • Publication number: 20140349554
    Abstract: A polish pad including a polish region contributing to polishing of a polish object; and a polish layer being disposed in the polish region and including unfoamed segments comprising unfoamed resin and foamed segments comprising resin including independent pores. The unfoamed segments and the foamed segments of the polish layer are made of the same raw resin.
    Type: Application
    Filed: December 4, 2013
    Publication date: November 27, 2014
    Applicant: Kabushiki Kaisha Toshiba
    Inventor: Takashi Watanabe
  • Publication number: 20140331838
    Abstract: A blade sharpening system for log saw machines is provided. An example multiphase grinding wheel has a grinding face with one or more abrasive concentric rings for sharpening the cutting blade of the log saw machine, and one or more padded concentric rings consisting of fiber padding. Sharpening with the multiphase grinding wheel improves cut quality, increases blade life, removes glues and varnishes from the cutting blade, reduces blade deformation, and hones the edge of the cutting blade. A pneumatic tensioning system uses air bladders to apply a dynamically cushioned pressure between the grinding wheels and the cutting blade. The fiber-padded grinding wheels and the air bladder tensioner provide improved sharpness of the cutting blade and longer life for the mechanical components. The padded grinding wheels decrease fire risk, and the tensioner can be operated remotely, decreasing human injuries common with conventional setup actions near the sharp cutting blade.
    Type: Application
    Filed: May 9, 2014
    Publication date: November 13, 2014
    Inventor: LAWRENCE E. BAKER
  • Publication number: 20140308884
    Abstract: Provided are abrasive articles in which the make layer, abrasive particle layer, and size layer are coated onto a backing according to a coating pattern characterized by a plurality of discrete islands. The coating pattern has features in which all three components are generally in registration with each other, while providing a pervasive uncoated area extending across the backing. Advantageously, this configuration provides a coated abrasive that displays superior curl-resistance compared with previously disclosed abrasive articles. Moreover, this configuration resists loading, resists de-lamination, has enhanced flexibility, and decreases the quantity of raw materials required to achieve the same level of performance as conventional abrasive articles.
    Type: Application
    Filed: December 19, 2012
    Publication date: October 16, 2014
    Applicant: 3M Innovative Properties Company
    Inventors: Jeffrey R. Janssen, Deborah J. Eilers, Paul D. Graham
  • Patent number: 8840447
    Abstract: An abrasive article for polishing a surface of a workpiece. The abrasive article includes a plurality of polishing islands arranged to interact with a workpiece to maintain a substantially constant contact area. Abrasive features are associated with at least some of the plurality of polishing islands. The abrasive features apply cutting forces to the work piece during motion of the abrasive article relative to the workpiece.
    Type: Grant
    Filed: March 26, 2012
    Date of Patent: September 23, 2014
    Assignee: RDC Holdings, LLC
    Inventors: Karl Schwappach, Zine-Eddine Boutaghou
  • Publication number: 20140273777
    Abstract: Polishing pads having a polishing surface with continuous protrusions having tapered sidewalls are described. Methods of fabricating polishing pads having a polishing surface with continuous protrusions having tapered sidewalls are also described.
    Type: Application
    Filed: March 14, 2013
    Publication date: September 18, 2014
    Applicant: NexPlanar Corporation
    Inventors: Paul Andre Lefevre, William C. Allison, Alexander William Simpson, Diane Scott, Ping Huang, Leslie M. Charns, James Richard Rinehart, Robert Kerprich
  • Patent number: 8821214
    Abstract: The disclosure is directed to polishing pads with porous polishing elements, and to methods of making and using such pads in a polishing process. In one exemplary embodiment, the polishing pad includes a multiplicity of polishing elements, at least some of which are porous, each polishing element affixed to a support layer so as to restrict lateral movement of the polishing elements with respect to one or more of the other polishing elements, but remaining moveable in an axis normal to a polishing surface of the polishing elements. In certain embodiments, the polishing pad may include a guide plate positioned to arrange and optionally affix the plurality of polishing elements on the support layer, and additionally, a polishing composition distribution layer. In some embodiments, the pores are distributed throughout substantially the entire porous polishing element. In other embodiments, the pores are distributed substantially at the polishing surface of the elements.
    Type: Grant
    Filed: June 26, 2009
    Date of Patent: September 2, 2014
    Assignee: 3M Innovative Properties Company
    Inventor: William D. Joseph
  • Patent number: 8808065
    Abstract: A surface treating device includes an open lofty non-woven layer (1) and a woven layer (2). The non-woven layer and woven layer have facing sides (5, 6) which are adhered to each other. A plurality of abrasive segments (3) is adhered to the woven layer on the side (7) of the woven layer (2) which faces away from the non-woven layer (1). Thus, the abrasive segments are held in a stable manner so as to better withstand the frictional forces exerted thereon during service.
    Type: Grant
    Filed: June 21, 2012
    Date of Patent: August 19, 2014
    Assignee: Design Technologies LLC
    Inventor: James Weder
  • Patent number: 8808064
    Abstract: A polishing article with a plurality of polishing pads adapted to polish a substrate. Gimbal structures are attached to the polishing pads that permit the polishing pads to move independently along at least a pitch axis and a roll axis. Stems supported by preload flexures apply preloads through dimple structures to the polishing pads. A plurality of stand-offs provide fixed boundary conditions between the preload and the gimbal structures. Recesses allow for the preload flexures to move vertically.
    Type: Grant
    Filed: October 18, 2011
    Date of Patent: August 19, 2014
    Assignee: Roc Holdings, LLC
    Inventors: Karl G. Schwappach, Zine-Eddine Boutaghou
  • Publication number: 20140206268
    Abstract: Polishing pads having a polishing surface with continuous protrusions are described. Methods of fabricating polishing pads having a polishing surface with continuous protrusions are also described.
    Type: Application
    Filed: January 22, 2013
    Publication date: July 24, 2014
    Applicant: NexPlanar Corporation
    Inventors: Paul Andre Lefevre, William C. Allison, Alexander William Simpson, Diane Scott, Ping Huang, Leslie M. Charns, James Rinehart, Robert Kerprich
  • Publication number: 20140141704
    Abstract: A polishing pad includes at least a polishing layer including a groove, on a polishing surface, having side surfaces, wherein at least one of the side surfaces includes a first side surface that extends continuously to the polishing surface and forms an angle ? with the polishing surface, and a second side surface that extends continuously to the first side surface and forms an angle ? with a plane parallel to the polishing surface, the angle ? is larger than 95 degrees, the angle ? is larger than 95 degrees, and the angle ? is smaller than the angle ?, and a bending point depth from the polishing surface to a bending point between the first side surface and the second side surface is more than 0.2 mm and not more than 3.0 mm.
    Type: Application
    Filed: July 12, 2012
    Publication date: May 22, 2014
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Nana Takeuchi, Seiji Fukuda, Ryoji Okuda
  • Patent number: 8721394
    Abstract: A polishing pad and a polishing method for polishing a substrate are described. The polishing pad includes a polishing layer and at least two grooves. The grooves form polishing tracks respectively. The polishing tracks collectively construct an even tracking zone. A better polishing uniformity of a substrate surface is achieved with the even tracking zone.
    Type: Grant
    Filed: December 19, 2007
    Date of Patent: May 13, 2014
    Assignee: IV Technologies Co., Ltd.
    Inventor: Yu-Piao Wang
  • Publication number: 20140113534
    Abstract: A sanding paper for use with a floor sander having one direction sanding comprising a paper sleeve or belt having a length and a width and a first surface and a second surface joined together and running parallel along the length of the sand paper wherein the first surface is disposed on the sander to apply to the floor first and the second to follow immediately thereafter and wherein the first surface has a grit which is more coarse than the second surface. The sanding paper first grit is a grit between 24-60 and the second grit is between 80 and 120 grit. In place of a middle grit, The intermediate surface between the first surface and second surface and wherein the first surface is between 24 and 40 grit, the intermediate surface between 41 and 80 grit and the third surface between 80 and 120 grit.
    Type: Application
    Filed: October 24, 2012
    Publication date: April 24, 2014
    Inventor: Clyde Alan Pritchett
  • Publication number: 20140045414
    Abstract: A tool for the roughing and/or polishing of hard surfaces such as stone, marble or the like, is described. The tool is usable in association with hand-operated machines, such as an angle grinder or the like, for manual treatment of surfaces by an operator. In particular, the tool provides a roughing and/or polishing tool whose flexibility and safety level is extremely high.
    Type: Application
    Filed: April 4, 2012
    Publication date: February 13, 2014
    Inventor: Mauro Di Mattia
  • Publication number: 20140038502
    Abstract: To provide a nonwoven fabric polishing roll that can reduce the occurrence of polishing defects and carry out uniform polishing.
    Type: Application
    Filed: January 26, 2012
    Publication date: February 6, 2014
    Applicant: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Masashi Nakayama, Akira Yoda
  • Publication number: 20140030958
    Abstract: A polishing pad, an apparatus for chemical mechanical polishing of semiconductor wafers and a method of making a device using the same are presented. The apparatus includes a first platform for mounting a semiconductor wafer; a second platform for mounting a polishing pad; a rotator for rotating the wafer against the polishing pad; and a diamond dresser for dressing the polishing pad. The polishing pad has a single groove of a width (w) surrounding the periphery of an undressed portion of the polishing pad thus eliminating contact of the undressed portion with the outer edge of the diamond dresser.
    Type: Application
    Filed: July 25, 2013
    Publication date: January 30, 2014
    Applicant: GLOBAL FOUNDRIES Singapore Pte. Ltd.
    Inventor: Wee Yang ONG
  • Publication number: 20140017984
    Abstract: An abrasive article including a substrate having an elongated body, a tacking layer overlying the substrate, a first type of abrasive particle overlying the tacking layer, a second type of abrasive particle different than the first type of abrasive particles overlying the tacking layer, and a bonding layer overlying at least a portion of one of the first type of abrasive particle and the second type of abrasive particle and the tacking layer.
    Type: Application
    Filed: June 28, 2013
    Publication date: January 16, 2014
    Inventors: Paul W. Rehrig, Yinggang Tian, Wei Che, Arup K. Khaund, Thomas Puthanangady, Christopher Arcona, Srinivasan Ramanath
  • Publication number: 20130344785
    Abstract: A surface treating device includes an open lofty non-woven layer (1) and a woven layer (2). The non-woven layer and woven layer have facing sides (5, 6) which are adhered to each other. A plurality of abrasive segments (3) is adhered to the woven layer on the side (7) of the woven layer (2) which faces away from the non-woven layer (1). Thus, the abrasive segments are held in a stable manner so as to better withstand the frictional forces exerted thereon during service.
    Type: Application
    Filed: June 21, 2012
    Publication date: December 26, 2013
    Applicant: DESIGN TECHNOLOGIES LLC
    Inventor: James Weder
  • Publication number: 20130344786
    Abstract: A coated abrasive article having a plurality of formed ceramic abrasive particles each having a surface feature. The plurality of formed ceramic abrasive particles attached to a flexible backing by a make coat comprising a resinous adhesive forming an abrasive layer. The surface feature having a specified z-direction rotational orientation, and the specified z-direction rotational orientation occurs more frequently in the abrasive layer than would occur by a random z-direction rotational orientation of the surface feature.
    Type: Application
    Filed: February 1, 2012
    Publication date: December 26, 2013
    Applicant: 3M Innovative Properties Company
    Inventor: Steven J. Keipert
  • Publication number: 20130324021
    Abstract: An abrasive pad for use on hard surfaces is described. The pad includes a fibrous, non-woven body with an abrasive coating containing diamond particles applied to a first side thereof. A plurality of diamond-impregnated abrasive elements is affixed to the first side. One or more of the abrasive elements are located near an outer edge of the first side of the pad. A resilient reinforcing material is applied to the outer edge of the pad to resist compression of the pad and to maintain adjacent abrasive elements parallel to a surface being worked on. The abrasive elements at least partially recess into the pad body and enable simultaneous contact of the abrasive elements and the pad with the surface being worked on. Thereby, multiple surface-preparation steps, e.g. polishing and burnishing, are completed simultaneously reducing surface-preparation time and eliminating separate surface-preparation steps.
    Type: Application
    Filed: May 31, 2013
    Publication date: December 5, 2013
    Inventor: Webster Ryan
  • Publication number: 20130324020
    Abstract: Polishing pads with a polishing surface layer having an aperture or opening above a transparent foundation layer are described. In an example, a polishing pad for polishing a substrate includes a foundation layer having a global top surface and a transparent region. A polishing surface layer is attached to the global top surface of the foundation layer. The polishing surface layer has a polishing surface and a back surface. An aperture is disposed in the polishing pad from the back surface through to the polishing surface of the polishing surface layer, and aligned with the transparent region of the foundation layer. The foundation layer provides an impermeable seal for the aperture at the back surface of the polishing surface layer. Methods of fabricating such polishing pads are also described.
    Type: Application
    Filed: June 4, 2012
    Publication date: December 5, 2013
    Inventors: Paul Andre Lefevre, William C. Allison, James P. LaCasse, Diane Scott, Alexander William Simpson, Ping Huang, Leslie M. Charns
  • Patent number: 8597087
    Abstract: A universal abrasive sheet is provided for a sanding or polishing machine and includes segments defined by weakened regions that allow portions of the universal abrasive sheet to be removed in order to adapt the abrasive sheet to alternative platent configurations. Each of the different configurations of the universal abrasive sheet can be provided with an individualized tip portion which can be separated from a body portion and either repositioned or replaced in order to change the working point of the tip portion when it becomes worn out.
    Type: Grant
    Filed: May 3, 2013
    Date of Patent: December 3, 2013
    Assignee: Black & Decker Inc.
    Inventors: Jason C. Shermer, Matthew J. Holland
  • Publication number: 20130303062
    Abstract: A floor treatment device includes a pad (1) of an open lofty non-woven material as well as a plurality of segments (3) spaced from one another and consisting of a plastic material (4) and abrasive particles (7, 8), such as diamond particles. The segments are adhered to a surface (2) of the pad (1). The floor treatment device is characterized by bodies (5) which are embedded in the plastic material (4) of the segments (3), the bodies (5) including a matrix material (6) as well as abrasive particles (7) contained in the matrix material.
    Type: Application
    Filed: May 10, 2012
    Publication date: November 14, 2013
    Applicant: DESIGN TECHNOLOGIES LLC
    Inventor: James WEDER
  • Publication number: 20130288579
    Abstract: The present invention relates to a one-circle two-chamfer deburring machine and a deburring method comprising the following steps after starting up: (1) The upper wheelhead motor drives the upper grinding belt to rotate horizontally (2) the lower wheelhead motor drives the lower grinding belt to rotate horizontally and (3) when a deburred workpiece goes through a passage formed by the active feeding roller row and the upper grinding belt, an upper abrasive block elastically contacts surface of the workpiece and, under the drive of the upper wheelhead motor and the upper active drum, polishes and deburrs the front side of the workpiece twice; the lower abrasive block elastically contacts the surface of the workpiece and, under the drive of the lower wheelhead motor and the lower active drum, polishes and deburrs the back side of the workpiece twice.
    Type: Application
    Filed: July 12, 2012
    Publication date: October 31, 2013
    Applicant: HANGZHOU XIANGSHENG ABRASIVE MACHINE MANUFACTURING CO., LTD.
    Inventor: Yongqi Chen
  • Publication number: 20130244554
    Abstract: A universal abrasive sheet is provided for a sanding or polishing machine and includes segments defined by weakened regions that allow portions of the universal abrasive sheet to be removed in order to adapt the abrasive sheet to alternative platent configurations. Each of the different configurations of the universal abrasive sheet can be provided with an individualized tip portion which can be separated from a body portion and either repositioned or replaced in order to change the working point of the tip portion when it becomes worn out.
    Type: Application
    Filed: May 3, 2013
    Publication date: September 19, 2013
    Applicant: BLACK & DECKER INC.
    Inventors: Jason C. SHERMER, Matthew J. HOLLAND
  • Publication number: 20130225051
    Abstract: An abrasive pad assembly, for use with a surfacing machine, includes a circular pad member and a diamond abrasive member. The circular pad member includes an exterior surface and the diamond abrasive member is affixed to the exterior surface of the circular pad member. The diamond abrasive member includes an insert and a diamond abrasive material. The insert has a first surface affixed to the exterior surface of the circular pad member. The diamond abrasive material is a polycrystalline diamond substance that is affixed to the second surface of the insert. The polycrystalline diamond material is spaced apart from the exterior surface of the circular pad member.
    Type: Application
    Filed: February 27, 2013
    Publication date: August 29, 2013
    Inventor: Raymond Vankouwenberg
  • Patent number: 8444457
    Abstract: A universal abrasive sheet is provided for a sanding or polishing machine and includes segments defined by weakened regions that allow portions of the universal abrasive sheet to be removed in order to adapt the abrasive sheet to alternative platent configurations. Each of the different configurations of the universal abrasive sheet can be provided with an individualized tip portion which can be separated from a body portion and either repositioned or replaced in order to change the working point of the tip portion when it becomes worn out.
    Type: Grant
    Filed: April 5, 2005
    Date of Patent: May 21, 2013
    Assignee: Black & Decker Inc.
    Inventors: Jason C Shermer, Matthew J Holland
  • Patent number: 8425278
    Abstract: A structured abrasive article comprises a backing, and an abrasive layer disposed on and secured to the backing. The abrasive layer comprises shaped abrasive composites, each comprising abrasive particles dispersed in a binder. Each the shaped abrasive composites independently comprises: a base disposed on the backing; a plurality of walls extending away from the base, and a grinding surface not contacting the base. Adjacent walls share a common edge. Each wall independently forms a dihedral angle with the base of less than or equal to 90 degrees. The grinding surface has a plurality of: cusps, and facets that contact a recessed feature. At least a portion of the recessed feature is disposed closer to the base than each of the cusps. Each cusp is formed by an intersection of two of the walls and at least one of the facets. Use of the structured abrasive article to abrade a workpiece is also disclosed.
    Type: Grant
    Filed: August 26, 2009
    Date of Patent: April 23, 2013
    Assignee: 3M Innovative Properties Company
    Inventors: Scott R Culler, John D. Haas, Chaodi Li
  • Patent number: 8398461
    Abstract: A polishing method, a polishing pad and a polishing system are provided. In the invention, the polishing pad is used to polish a polishing article. The polishing pad includes a polishing layer and a surface pattern disposed in the polishing layer. The polishing layer includes a polishing surface, a rotating central region, and a peripheral region. The surface pattern includes many grooves distributed from near the rotating central region and extending outward to near the peripheral region. The grooves include many groove cross sections along a circumferential direction of a same radius. Each of the groove cross sections has a left sidewall and a right sidewall. An included angle is formed by the polishing surface and one of a group of the left sidewalls and a group of the right sidewalls. The included angle is an obtuse angle.
    Type: Grant
    Filed: January 21, 2010
    Date of Patent: March 19, 2013
    Assignee: IV Technologies Co., Ltd.
    Inventor: Yu-Piao Wang
  • Patent number: 8360830
    Abstract: A grinding lamella (1) for being arranged on a rotatingly drivable grinding wheel (8), has at least two annular portions (4, 5, 6, 7, 24, 25, 26, 27, 34, 35, 36, 37, 44, 45, 46, 47) arranged at an angle (?) relative to one another. At least partially, the grinding lamellae (1) have a shape that deviates from the shape of a circular wheel with a central aperture. The grinding wheel (8) containing the grinding lamellae has at least one carrier element (2) and a least two such grinding lamellae (1) that partially overlap and, together, form an annular shape. If use is made of a pattern (14, 32) for a piece of material or a strip of material for producing the grinding lamellae (1), the grinding lamellae (1) are arranged side by side in the same direction so as to adjoin one another and offset relative to one another by 180°.
    Type: Grant
    Filed: February 28, 2007
    Date of Patent: January 29, 2013
    Assignee: Lukas-Erzett Vereinigte Schleif-und Fräswerkzeugfabriken GmbH & Co. KG
    Inventor: Georg Klug
  • Publication number: 20130012108
    Abstract: The disclosure is directed to polishing pads with porous polishing layers, methods of making such polishing pads, and methods of using such pads in a polishing process. The polishing pad includes a compliant layer having first and second opposing sides and a porous polishing layer disposed on the first side of the compliant layer. The porous polishing layer includes a crosslinked network comprising a thermally cured component and a radiation cured component, wherein the radiation cured component and the thermally cured component are covalently bonded in the crosslinked network. The porous polishing layer also includes polymer particles dispersed within the crosslinked network, wherein the polymer particles comprise at least one of thermoplastic polymers or thermoset polymers. The porous polishing layer typically also includes closed cell pores dispersed within the crosslinked network.
    Type: Application
    Filed: December 20, 2010
    Publication date: January 10, 2013
    Inventors: Naichao Li, William D. Joseph
  • Publication number: 20130005229
    Abstract: An abrasive article for polishing a surface of a workpiece. The abrasive article includes a plurality of polishing islands arranged to interact with a workpiece to maintain a substantially constant contact area. Abrasive features are associated with at least some of the plurality of polishing islands. The abrasive features apply cutting forces to the work piece during motion of the abrasive article relative to the workpiece.
    Type: Application
    Filed: March 26, 2012
    Publication date: January 3, 2013
    Inventors: Karl Schwappach, Zine-Eddine Boutaghou
  • Publication number: 20120315830
    Abstract: Polishing pads containing a phase-separated polymer blend, and methods of making and using such pads in a polishing process. In one exemplary embodiment, the polishing pads include a multiplicity of polishing elements integrally formed in a sheet. In another exemplary embodiment, the polishing elements are bonded to a support layer, for example by thermal bonding. In certain embodiments, the polishing pad may additionally include a compliant layer affixed to the support layer, and optionally, a polishing composition distribution layer.
    Type: Application
    Filed: December 28, 2010
    Publication date: December 13, 2012
    Applicant: 3M Innovative Properties Company
    Inventors: William D. Joseph, Gary M. Palmgren, Stephen C. Loper, Christopher N. Loesch
  • Patent number: 8303378
    Abstract: A polishing pad, a polishing method and a method of forming a polishing pad are provided. The polishing pad includes a polishing layer and a plurality of arc grooves. The arc grooves are disposed in the polishing layer. Each of the arc grooves has two ends, and at least one end thereof has an inclined wall. The angle between the inclined wall of each groove and the surface plane of the polishing layer is less than 90 degree.
    Type: Grant
    Filed: April 22, 2009
    Date of Patent: November 6, 2012
    Assignee: IV Technologies Co., Ltd
    Inventor: Yu-Piao Wang
  • Patent number: 8192257
    Abstract: Processing pads for mechanical and/or chemical-mechanical planarization or polishing of substrates in the fabrication of microelectronic devices, methods for making the pads, and methods, apparatus, and systems that utilize and incorporate the processing pads are provided. The processing pads include grooves or other openings in the abrading surface containing a solid or partially solid fill material that can be selectively removed as desired to maintain the fill at an about constant or set distance from the abrading surface of the pad and an about constant depth of the pad openings for multiple processing and conditioning applications over the life of the pad.
    Type: Grant
    Filed: April 6, 2006
    Date of Patent: June 5, 2012
    Assignee: Micron Technology, Inc.
    Inventors: Naga Chandrasekaran, Arun Vishwanathan
  • Publication number: 20120122380
    Abstract: A polishing article with a plurality of polishing pads adapted to polish a substrate. Gimbal structures are attached to the polishing pads that permit the polishing pads to move independently along at least a pitch axis and a roll axis. Stems supported by preload flexures apply preloads through dimple structures to the polishing pads. A plurality of stand-offs provide fixed boundary conditions between the preload and the gimbal structures. Recesses allow for the preload flexures to move vertically.
    Type: Application
    Filed: October 18, 2011
    Publication date: May 17, 2012
    Inventors: Karl G. Schwappach, Zine-Eddine Boutaghou