Abstract: The present invention describes a novel metal bond superabrasive tool that contains a superabrasive such as diamond or CBN grits distributed in a predetermined or an uniform pattern. Such a pattern is produced by fabricating plurality layers of metal matrix with superabrasive grits distributed therein in a predetermined pattern and concentration and subsequently assembling and consolidating the layers into a tool segment. Superabrasive particles may be incorporated during the process of making these layers, or they may be planted afterwards into these layers that contains the metal matrix powder. In the latter case, the planting may be guided by a template with apertures laid in a specific pattern.

Abstract: A sheet-shaped grindstone for grinding a workpiece includes a plurality of segments arranged in an appropriate pattern with sufficient spaces therebetween such that the grindstone becomes flexible. The segments are formed in a manner in which metal powder including diamond grinding grains is sintered to form granular chips, the chips are disposed in a die in such a density that the chips come into mutual contact, and gaps around the granular chips are filled with a resin through application of pressure. The grindstone is more flexible at contact points with a workpiece than are conventional vitrified grinding tools. The grindstone can evade collision of the segments with the workpiece and can grind a curved surface of the workpiece through smooth contact therewith.

Abstract: A polishing pad for a chemical mechanical polishing apparatus. The polishing pad includes a plurality of circular concentric grooves. The polishing pad may include multiple regions with grooves of different widths and spacings.

Abstract: A CMP polishing pad improves overall material removal rate uniformity by combining multiple polishing pad sections in a serially linked manner, where the polishing pad sections are characterized by at least two different material removal rate profiles. The polishing pad is designed by determining a wafer polishing profile for each of a group of polishing pads where each polishing pad has a unique groove configuration, determining a combination of polishing pad segments, each of the segments constructed with one of the unique groove configurations, that will combine to achieve an improved uniformity in the polishing profile, and manufacturing a polishing pad having pad sections corresponding to the analytically determined pad sections.

Abstract: A system and method for cleaning probe pins on a probe card used in testing a semiconductor device during fabrication thereof. A ceramic cleaning wafer is utilized to clean the probe pins without having to remove the probe card from a production line. The same apparatus used to test production wafers also handles the cleaning wafer during a probe cleaning cycle. During operation of the cleaning cycle, the cleaning wafer is placed in a manual load tray, which inserts the cleaning wafer into a prober machine. The cleaning wafer is transported by a robotic trolley to a prealign stage area where the cleaning wafer is aligned and centered. The cleaning wafer is then placed on a support device. The support device and cleaning wafer are positioned under a pneumatic sensor and profiled to determine wafer planarity. The support device and cleaning wafer are then positioned underneath the probe pins on the probe card to be cleaned.

Abstract: An apparatus for the improved polishing or planarizing of workpiece surfaces which includes polishing pad with a plurality of self-cleaning and anti-tracking grooves along the surface of the pad. The self-cleaning grooves uniformly guide slurry and polishing debris radially outward across the surface of the pad while the anti-tracking capability acts to passively reduce the creation of localized wear zones into the polishing surface. Preferably, the grooves define a concentric pattern upon the surface of the pad and have a cross-section that is cut into a compound shape that has both a vertical and sloped surfaces. Other embodiments may include grooves with sloped parallel surfaces formed into spiral or radial patterns.

Abstract: A method and apparatus for machining flat or planarizing a fire deck of a bimetallic engine block includes providing a grinding wheel by disposing a series of abrasive inserts at spaced locations along a circumference of a circular head, so that during rotation of the head, the inserts form a notional annular grinding ring. The head is preferably a conventional milling head and the inserts are sized and shaped to fit within receptacles adapted to receive conventional milling inserts. In an alternate embodiment, a second series of abrasive inserts may be disposed radially inward of the first series of inserts to form an inner notional annular grinding ring disposed concentrically with the outer ring. Inner and outer inserts preferably comprise a single layer of diamond abrasive brazed onto a metallic substrate.

Abstract: A seamless, composite belt that is designed to maintain a substantially flat surface in the span between two rollers. The belts typically have one or more polymer layers, including the polishing layer, and one or more supporting woven or non-woven layers. The belts have the necessary balance between down-cupping and up-cupping forces achieved by: 1) varying the relative thickness of the different polymer and supporting layers in the belt, 2) varying the relative hardness or rigidity of the different layers in the belt, 3) varying the temperatures at which the different layers are formed, 4) varying the compositions of supporting layers, and 5) prestressing one or more of the composite layers. The belts are particularly useful in chemical mechanical polishing of semiconductor wafers.

Abstract: A tool including abrasive segments, which can be superabrasive segment, mounted to a mounting plate and a method for making the same. The abrasive segments include hard particles and are formed by sintering layers of hard particles with layers of bond material to form a laminated sheet. The abrasive segments are then cut from the laminated sheet and mounted to a planar face of the mounting plate to form a portion of a working region of the tool. Each segment has a grinding surface which can be formed perpendicular to the layers of bond material and layers of hard particles so that the concentration of hard particles at the grinding surface is relatively high. This allows the portion of working surface made up of the abrasive segments to relatively small. The segments can also be mounted to the substrate disc such that the grinding surface of each segment is at an angle to the planar face.

Abstract: A chemical mechanical polishing apparatus includes a plurality of concentric rotatable platens for polishing a substrate. A polishing pad is attached to each platen. Each platen may be rotated independently in either clockwise or counter-clockwise direction.

Abstract: Improved abrasive tools and apparatus and method for the manufacture of the improved abrasive tools and the like which includes apparatus and a method for the creation of a structurally viable matrix having a pattern of abrasive elements which can be shaped, cut and positioned for permanent disposition on a rigid tool body. The apparatus includes a release layer on a transversely magnetized base surface with magnetic protrusions to provide a mosaic-like surface. Magnetizable abrasive particles applied to the release layer orient themselves magnetically to form generally conic stacks which having a stack axis and a distal working portion. The stacks define a working surface which is then coated. Prior to solidification of the coating the cones may be shaped or raked magnetically. A braze paste is applied to encapsulate the cones and form a flexible support web between the cones.

Abstract: An abrasive surface for cutting and grinding tools and having abrasive particles embedded in a filler material. The abrasive surface is bonded to the perimeter edge of a rigid hub and has a circumferential dimension and a width dimension. The abrasive surface is divided along both the circumferential dimension and the width dimension into a plurality of hard regions and soft regions. The hard regions wear more slowly that the soft regions and so different patterns of hard regions and soft regions produce different cutting profiles. A method for fabricating the abrasive surface includes forming a laminated sheet from a plurality of laminated layers. Each laminated layer includes at least a layer of soft, easily deformable material and a layer of abrasive particles. The layers of abrasive particles can be formed into staggered rows to form the pattern of hard regions and soft regions. The layers of the laminated layers are sintered together to form the laminated sheet from which the abrasive surface is cut.

Abstract: Abrasive tools suitable for precision grinding of hard brittle materials, such as ceramics and composites comprising ceramics, at peripheral wheel speeds up to 160 meters/second are provided. The abrasive tools comprise a wheel core attached to an abrasive rim of dense, metal bonded superabrasive segments by means of a thermally stable bond.

Abstract: A flexible abrasive member comprises a porous sheet carrying deposits which consist of a metal containing abrasive particles. The deposits have been applied to the porous sheet by electroplating and the sheet has been impregnated with a coating for stabilizing the deposits, The deposits comprise at least one hollow space through which the sheet extends, which hollow space is filled with coating material.

Abstract: Abrasive tools suitable for precision grinding of hard brittle materials, such as ceramics and composites comprising ceramics, at peripheral wheel speeds up to 160 meters/second are provided. The abrasive tools comprise a wheel core attached to an abrasive rim of dense, metal bonded superabrasive segments by means of a thermally stable bond. A preferred tool for backgrinding ceramic wafers contains graphite filler and a relatively low concentration of abrasive grain.

Abstract: A method of obtaining superabrasive grinding performance from tools employing less expensive, non-superabrasive conventional abrasive grain involves operating the conventional abrasive tool at ultra high tangential contact speed, (that is at least about 125 m/s). Such ultra high operating speeds can be achieved with segmented abrasive grinding wheels having segments formed from vitreous or resin bonded particles of aluminum oxide, silicon oxide, iron oxide, molybdenum oxide, vanadium oxide, tungsten carbide, silicon carbide and the like. The abrasive segments can be cemented to the core of the tool with an adhesive such as epoxy cement. Abrasive segments can be made to a significantly greater depth than traditional superabrasive-bearing segments, and consequently, should provide long life as well as high performance. Additionally, conventional abrasive segments are easier to true and dress and to make into intricate profiles for grinding complex shaped work pieces.

Abstract: An abrasive sheet 1 for a sanding or polishing machine, comprising a body portion 3 and a tip portion 5 providing a working point 11, the tip portion 5 being defined by a weakened region 7 between the body portion 3 and the tip portion 5, wherein the tip portion 5 can be separated from the body portion 3, turned through an angle (FIG. 2) and re-positioned adjacent the body portion 3 to change the working point 11. As a result, an iron-shaped abrasive sheet, for example, can be provided with a plurality of working points 11. The sheet can, therefore, be used for longer periods before it is worn out.

Abstract: A grinding/polishing cover sheet for placing on a rotatable grinding/polishing disc (3) consists of a thin foil (1), to which a coating (2) of a hard composite material has been applied through a stencil with or without an associated serigraphic membrane. The foil (1) is stiff in its own plane, but flexible perpendicularly thereto. The composite layer may consist of a matrix of artificial resin with one or more substances embedded therein, e.g. particles of one or more metals or ceramic materials, or fibers or particles of synthetic substances or graphite. The foil can be held in position on the grinding/polishing disc (3) by magnetism or by glueing.

Abstract: A polishing pad for a chemical mechanical polishing apparatus. The polishing pad includes a plurality of concentric circular grooves. The polishing pad may include multiple regions with grooves of different widths and spacings.

Abstract: A method is provided for machining the fire deck of an engine block. The method includes providing a grinding wheel having an outer annular grinding element disposed concentrically or the wheel may be provided with an inner annular grinding element disposed concentrically inward of an outer element. The outer element comprises a single layer of relatively coarse diamond abrasive brazed on a metallic substrate, while the inner element comprises a single layer of relatively fine diamond abrasive brazed on a similar substrate. The outer grinding element and the inner element if utilized, is formed as a discrete unit individually fastened to a backing plate to facilitate independent height adjustment of the elements relative the backing plate. The method further comprises orienting the grinding wheel with its axis of rotation at a predetermined oblique angle a relative the fire deck.

Abstract: A polishing method and apparatus thereof that selectively or continuously uses multiple kinds of polishing materials which have different polishing characteristics. The polishing materials used are based on appropriate polishing requirements of the object polished. In addition, the polishing rate and uniformity rate can be enhanced by arranging the polishing materials based on their degree of their polishing characteristics.

Abstract: Apparatuses and methods are disclosed using a fixed abrasive polishing pad to perform mechanical polishing of a surface. The apparatus includes a polishing pad positioned opposing a wafer support to provide for polishing of a surface of a wafer placed on the support. The polishing pad includes a first member having a first polishing surface formed from an abrasive first material that is structurally degradable during polishing. The polishing pad also includes a second member having a second polishing surface formed from a second material that is less degradable and less abrasive relative to said first material. The first and second polishing surfaces define a polishing face that is brought into contact with the surface to be polished.

Abstract: An abrasive article is provided which comprises a backing; and at least one three-dimensional abrasive coating comprising diamond particles dispersed within a binder bonded to a surface of the backing, the binder comprising a cured binder precursor including a urethane acrylate oligomer. The abrasive article is capable of rapid glass stock removal coupled with reducing the surface finish as indicated by reduced Ra values using an RPP test procedure.

Abstract: The present invention is a polishing pad that planarizes and cleans a semiconductor wafer in chemical-mechanical planarization processes. The polishing pad has a polishing body and a cleaning element positioned in the polishing body. The polishing body includes a planarizing surface, a basin formed in the body, and an opening at the planarizing surface defined by the basin. The cleaning element is positioned in the basin so that a cleaning surface of the cleaning element is positioned in the opening proximate to a plane defined by the planarizing surface. In operation, the cleaning surface periodically engages the wafer when the wafer is engaged with the pad to remove residual materials from the surface of the wafer.

Abstract: A sanding apparatus (1) has a sanding platen (2) to which motion is applied. The platen (2) has a flat surface (9) to which an abrasive sheet (22) is applied. The peripheral edge (3) of the platen (2) has a point (4) which can be used for detailed sanding. The surface (9) has a detachable portion (14) adjacent the point (4). The detachable portion (14) can be removed from the remainder of the platen (2) and rotated through 180.degree.. The abrasive sheet (22) can have an area corresponding to the detachable portion (14) of the surface (9) which is removable from the remainder of the abrasive sheet (22) by means of a perforated line (24).

Abstract: A method of microfinishing the edge of a die component includes polishing the edges after the die component is machined by known methods to finish the edges of the die component to a smoother finish than the rest of the die component. This eliminates the incidence of undesirable streaking defects in the coating. The polishing step can be lapping, vapor honing, or grit blasting. The edges are polished to a finish of less than 8 microinches.

Abstract: A compounding element for use with a rubbing compound in the finishing of a working surface. The compounding element has a buffing surface and a resiliently deformable skirt around the perimeter of the buffing surface and projecting beyond the buffing surface. In use, application of pressure to the compounding element on a working surface causes deformation of the skirt so that the buffing surface contacts the working surface and the skirt restricts slinging of the rubbing compounds.

Abstract: A sanding apparatus (1) has a sanding platen (2) to which motion is applied. The platen (2) has a flat surface (9) to which an abrasive sheet (22) is applied. The peripheral edge (3) of the platen (2) has a point (4) which can be used for detailed sanding. The surface (9) has a detachable portion (14) adjacent the point (4). The detachable portion (14) can be removed from the remainder of the platen (2) and rotated through 180.degree.. The abrasive sheet (22) can have an area corresponding to the detachable portion (14) of the surface (9) which is removable from the remainder of the abrasive sheet (22) by means of a perforated line (24).

Abstract: A back-up pa supporting and releasably engaging an abrasive article. The back-up pad comprises: a body including a front surface and a back surface in which the front surface comprises a first attachment component thereon and the back surface comprises a second attachment component thereon, and each of the attachment components is adapted for releasable engagement with an abrasive article; a reinforcing plate located within the body between the front surface and the back surface; and tool securing means on the body for securing the back-up pad to a power tool and for selectively orienting the back-up pad in one of a first orientation and a second orientation. When the back-up pad is in the first orientation, substantially the entire front surface is exposed for contacting a workpiece, and when the back-up pad is in the second orientation, substantially the entire back surface is exposed for contacting a workpiece.

Abstract: A grinding wheel with tips which can be uniformly abraded regardless of the position of the tips is disclosed. In the wheel, the inside and outside tips may be formed by bonding diamond dust of the same concentration with resinoid or metal bonds of lower and higher abrasion resistances, respectively. Alternatively, the inside and outside tips may be formed using the same resinoid or metal bond. In this case, the outside tips are laden with diamond dust, while the inside tips are laden with no diamond dust or cheap abrasive. As a further alternative, the concentration of the diamond dust of the tips may be stepwisely reduced from the outside toward the inside. In addition, the top surface of each tip may be inclined downward from the outside toward the inside to compensate for the eccentric abrasion of the tips due to the circumferential speed difference between the inside and outside tips.

Abstract: A profiled, soft cushioned roller is provided with an outer profiled abrading surface that conforms to and rides on a contoured substrate surface during an abrading operation. A soft roller usually in the form of a soft foam layer or body allows the profiled abrading surface to extend to and laterally wrap itself along the contoured substrate surface when pushed against the latter with the force needed to abrade the contoured surface. Because the outer surface portion of the profiled, soft roller is able to distort and wrap across the contoured surface, the soft profiled portion need not have the exact contoured shape and dimensions of the contoured surface being abraded. The soft roller body may have portions with different hardness by using different materials or different densities of the same foam material.

Abstract: A composite polishing pad is provided, with a supporting layer, nodes attached to the supporting layer, and an upper layer attached to the supporting layer which surrounds but does not cover the nodes. The support layer, nodes, and upper layer may all be of different hardnesses.

Abstract: Abrasive tools with preferential arrangements and patterns of abrasive elements which accomplish a range of performance goals and optimize both removal rate and finish are disclosed.

Abstract: A polishing pad comprises a carrier and layer of a non-porous thermoplastic polymer secured to a surface thereof and containing a mass of discrete abrasive particles, comprising diamond or cubic boron nitride, uniformly dispersed therein. The abrasive particles have a particle size of up to 500 microns and are present in the layer in a concentration of up to 30 volume percent. The layer presents an abrasive polishing surface. The abrasive layer may also comprise a plurality of spaced strips secured to a surface of the carrier and each strip presents an abrasive polishing surface.

Abstract: A hand tool having a frame which holds interchangeable working heads for scraping ice and other materials, scrubbing and sanding. The frame pivotally carries the working head at one end and has a curved forearm brace at the other end. A hand grip bar is located between the ends of the frame such that the forearm provides force against the brace to hold the working head against the work surface. This creates a leverage effect and relieves stress on the wrist. The pivotal head allows angled or contoured surfaces to be followed without requiring the wrist to flex at different angles. The scraping head has two scraping edges which scrape on both push and pull strokes. An accessory head which is interchangeable with the ice scraping head can hold two metal scraping blades or interchangeable base plates which provide a sanding sheet and a scrubbing pad, respectively.

Abstract: A flexible honeycomb panel containing wire or other abrasive material for abrading a workpiece, including a honeycomb core embedded with a quantity of abrasive material, and a facing sheet. The honeycomb core is formed of undulating strips of resilient thermoplastic material that are thermal compression bonded together to form cell walls defining a plurality of contiguous regularly shaped cells. The abrasive material is contained within the strips. The facing sheet, formed of resilient thermoplastic material, is thermal compression bonded to a face of the core. The bonding is accomplished by simultaneously applying heat and pressure to the joinder of the facing sheet and the core. The opposite face of the core remains uncovered. In use, the uncovered face of the core is brought into rubbing contact with the workpiece.

Abstract: The present invention relates to an abrasive article for abrading material from a workpiece. In one embodiment, the abrasive article includes a back-up pad having first and second major surfaces. The first major surface includes a shaft adapted to connect the abrasive article to an abrading apparatus for movement relative thereto. Adjoining the second major surface are first and second resilient support portions, to which are attached first and second abrading members, respectively. When an operator applies a first force to the abrading apparatus, the first abrasive surface contacts and abrades the workpiece. When the operator applies a second force that is greater than the first force, both the first and the second abrasive surfaces contact and abrade the workpiece.