Abstract: A method includes providing a structure having a memory region and a logic region; a first metal layer and a dielectric barrier layer over the first metal layer in both the memory region and the logic region; a first dielectric layer over the dielectric barrier layer; multiple magnetic tunneling junction (MTJ) devices over the first metal layer, the dielectric barrier layer, and the first dielectric layer; and a second dielectric layer over the first dielectric layer and the MTJ devices. The first dielectric layer, the MTJ devices, and the second dielectric layer are in the memory device region and not in the logic device region. The method further includes depositing an extreme low-k (ELK) dielectric layer using FCVD over the memory region and the logic region; and buffing the ELK dielectric layer to planarize a top surface of the ELK dielectric layer.

Abstract: In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.

Abstract: A patterned structure is provided, including a plurality of pattern groups. Each the pattern group has a plurality of patterned band regions. Each the patterned band region extends from a staring end to an ending end. Each the patterned band region has a plurality of pattern units. The pattern unit of one of the patterned band region partial overlaps the pattern unit of another patterned band region.

Abstract: Implementations of methods of singulating a plurality of die included in a substrate may include forming a plurality of die on a first side of a substrate, forming a backside metal layer on a second side of a substrate, forming a groove only partially through a thickness of the backside metal layer, and singulating the plurality of die included in the substrate through removing backmetal material in the die street and removing substrate material in the die street. The groove may be located in a die street of the substrate.

Abstract: This invention provides a method for manufacturing a decorated part having a dynamic visual effect of a design that is drawn onto the surface of a work, thus reducing the manufacturing cost. The decorated part is manufactured by a laser-irradiating process, which involves irradiating a laser onto a decorative surface 4, thus forming a design 20 having many laser-processed linear grooves 21 closely aligned in a specific direction F1 on said decorative surface. Also, in the laser-irradiating process, said design 20 is formed such that the angle ?2 that is made by the specific direction F1 and by the direction F2 in which the laser-processed linear grooves 21 are extending is gradually changing into the direction in which such laser-processed linear grooves are aligned.

Abstract: An apparatus which can remove particles, such as polishing debris, from a back surface with high removal efficiency is provided. The apparatus includes: a substrate holder configured to rotate the substrate while holding the substrate with the back surface facing upward; a scrub cleaning tool configured to be rotatable; a two-fluid nozzle disposed above the substrate holder; and a housing defining a cleaning chamber in which the substrate holder, the scrub cleaning tool, and the two-fluid nozzle are located.

Abstract: Disclosed are an additive raw material composition and an additive for superhard material product, a method for preparing the additive, a composite binding agent, a superhard material product, a self-sharpening diamond grinding wheel and a method for manufacturing the same. The raw material composition consisting of components in following mass percentage: Bi2O3 25%˜40%, B2O3 25%˜40%, ZnO 5%˜25%, SiO2 2%˜10%, Al2O3 2%˜10%, Na2CO3 1%˜5%, Li2CO3 1%˜5%, MgCO3 0%˜5%, and CaF2 1%˜5%. The composite binding agent is prepared from the additive and a metal composite binding agent. The self-sharpening diamond grinding wheel prepared from the composite binding agent has high self-sharpness, high strength, and fine texture, is uniformly consumed during the grinding process, does not need to be trimmed during the process of being used, and maintains good grinding force all the time, fundamentally solving the problems of long trimming time and high trimming cost of the diamond grinding wheel.

Abstract: A rare earth magnet block is cutoff machined into pieces by rotating a plurality of cutoff abrasive blades. Improvements are made by starting the machining operation from the upper surface of the magnet block downward, interrupting the machining operation, turning the magnet block upside down, placing the magnet block such that the cutoff grooves formed before and after the upside-down turning may be aligned with each other, and restarting the machining operation from the upper surface of the upside-down magnet block downward until the cutoff grooves formed before and after the upside-down turning merge with each other.

Abstract: A polishing liquid for CMP, comprising: an abrasive grain including a cerium-based compound; a 4-pyrone-based compound; a polymer compound having an aromatic ring and a polyoxyalkylene chain; a cationic polymer; and water.

Abstract: A method for testing the adhesion of elastic adhesives or elastic sealing materials on surfaces of components including: a) applying the adhesive/sealing material to a component surface, b) attempting by exerting a peeling force to detach the applied adhesive/sealing material from the component surface, and c) assessing the adhesion of the adhesive/sealing material on the basis of fractures caused in the adhesive/sealing material and the detachment of the adhesive/sealing material from the component surface by the exertion of the peeling force. Prior to and/or during step a), an anti-adhesion material layer is applied to at least one first part of the component surface, which causes poorer adhesion of the adhesive/sealing material to the component surface and therefore can be detached from the component surface with less peeling force than directly from the component surface.

Abstract: A polishing method is used for polishing a surface of a substrate such as a semiconductor wafer. The polishing method includes a polishing process for polishing a surface of the substrate in accordance with a preset polishing recipe, a pad cleaning process for removing foreign matters on the polishing pad by ejecting a cleaning fluid onto the polishing pad, and a substrate transferring process in which the polished substrate is removed from the top ring at a substrate transferring position, a subsequent substrate to be polished is loaded onto the top ring, and then the top ring holding the subsequent substrate to be polished is returned to the polishing table. The pad cleaning process is started after the completion of the polishing recipe is detected, and the pad cleaning process is terminated by detecting a position of the subsequent substrate to be polished which is undergoing the substrate transferring process.

Abstract: The invention includes a method for preparing and top coating an item made of powder coated MDF (or other substrate containing wood) with the end result of improved visual and tactile smoothness; the invention includes the steps of cutting and machining the part, pre-powder preparation and sanding of the part, powder coating the part, post-powder preparation and sanding, and applying the liquid top coat to the part, resulting in a smoother finish than is currently available in any other powder coated MDF finish while requiring less coats than similar liquid paint finishes.

Abstract: The invention relates to a device for sanding a predetermined impression into a workpiece. The device has a pattern belt positioned inside the area formed by a sanding belt. A pad is positioned inside the area formed by the pattern belt. A raised pattern is formed on the outer surface of the pattern belt. In use, the pad contacts the pattern belt, urging the raised pattern of the pattern belt to contact the sanding belt. The portion of the sanding belt contacted by the pattern belt is urged toward the workpiece so that the predetermined impression is sanded into the workpiece.

Abstract: The invention relates to a device and method for using same for sanding a predetermined impression into a workpiece. The device has a pattern belt positioned inside the area formed by a sanding belt. A pad is positioned inside the area formed by the pattern belt. A raised pattern is formed on the outer surface of the pattern belt. In use, the pad is selectively controlled to contact the pattern belt, thereby urging the raised pattern of the pattern belt to contact the sanding belt. The portion of the sanding belt contacted by the pattern belt is urged toward the workpiece so that the predetermined impression is sanded into the workpiece.

Abstract: An improved grinder/polisher includes a base having a bowl, a rotating drive plate and a drive plate drive that is adapted to support a platen. The grinder/polisher includes a head configured to support a specimen holder. The head has a first drive for rotational drive of the specimen holder and a second drive for moving the specimen holder toward and away from the drive plate. The head includes a load cell operably connected to the first drive and a counter operably connected to the second drive. The counter is configured to determine movement and the extent of movement of the head toward and away from the drive plate. The grinder/polisher includes a control panel mounted within a housing and including a microprocessor controlled control system having a touch panel or screen.

Abstract: Disclosed is a liquid processing apparatus which includes: a plurality of liquid processing units to supply a processing liquid to an object to be processed and liquid-process the object; a common exhaust path to discharge atmospheres in the plurality of liquid processing units; an individual exhaust path to connect the common exhaust path with each of the liquid processing units; an opening-closing mechanism provided on the individual exhaust path to be openable; and an air injecting port to inject an air into the common exhaust path. An injection amount adjusting valve is provided on the common exhaust path to adjust the flow rate of the air injected from the air injecting port. A controller controls an opening degree of the injection amount adjusting valve based on an opening-closing state of the opening-closing mechanism.

Abstract: An apparatus for shaping an edge of an aerofoil, the apparatus having first and second brushes and each brush having a plurality of bristles. A first motor rotates the first brush about a first axis and a second motor rotates the second brush about a second axis. The axes are arranged substantially parallel to the bristles of the respective brush. A support structure holds the first brush such that the first axis intersects a first surface of the edge of the aerofoil and holds the second brush such that the second axis intersects a second surface of the edge of the aerofoil. There are means to produce relative movement the first and second brushes and the aerofoil such that the first and second brushes move longitudinally along the edge of the aerofoil to shape the edge of the aerofoil.

Abstract: An automated method for reconditioning a plurality of digital discs within a reconditioning apparatus is disclosed. The method comprises holding the digital discs in a load area, and then transferring each of the digital discs from the load area to at least one workstation with a disc transfer mechanism. The method also comprises reconditioning each of the digital discs transferred to the workstation with at least one worktool operable to remove a portion of the protective coating of each of the digital discs without removal of the data underlying the protective coating. The method further comprises transferring each of the digital discs from the workstation to an unload area with the disc transfer mechanism, and then holding the digital discs in the unload area for manual retrieval. Advantageously, the digital discs may be automatically reconditioned within the reconditioning apparatus without manual manipulation of the digital discs during the reconditioning process.

Abstract: The present invention provides: a method of polishing an object to be polished for processing a surface of the object to be polished into a concave or convex state with a high degree of accuracy; and a polishing pad. An object to be polished is placed on a polishing pad over the boundary between the first polishing region and the second polishing region, the first polishing region has grooves and the second polishing region has grooves different from those of the first polishing region, and either one of the two regions being formed on a region on the center side, and the other on the outer side in a radial direction on the surface of the polishing pad; and the object to be polished is polished by rotating the polishing pad and the object to be polished.

Abstract: A method for making a circuit board includes separating a plurality of versatile circuit boards from a collective board by cutting a connecting portion of the collective board, the plurality of versatile circuit boards being connected each other via the connecting portion, and cutting a part of a wiring formed on each of the plurality of versatile circuit boards to produce the circuit board. The cutting of the part of the wiring is conducted within the separating of the plurality of versatile circuit boards.

Abstract: Methods are described for mechanically scraping surfaces of boards, such as flooring boards, to impart random-looking scraped profiles therein. An apparatus for mechanically scraping boards to form the scraped board products also is described. A board, such as a flooring board, having a random-looking scraped appearance that includes overlapping multiple scrape patterns is described. Boards, such as flooring boards, having a simulated rustic or distressed appearance made with the methods and apparatus also are described.

Abstract: The wafer polishing apparatus comprises a polishing plate, a polishing head capable of holding a wafer, and a slurry supplying section. The polishing plate includes: a plurality of concentric polishing zones, each of which has a prescribed width for polishing the wafer and on each of which a polishing cloth is adhered; and a groove for discharging slurry being formed between the polishing zones. A head cleaning section, which cleans the polishing head, or a wafer cleaning section, which cleans the polished wafer, is provided to a center part of the polishing plate and located on the inner side of the innermost polishing zone.

Abstract: A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.

Abstract: A substrate having an antimicrobial surface. The texture of the surface which has exposed metal e.g., copper or copper alloy contributes to the antimicrobial properties. Cavities or depressions in the surface can be coated or partially coated with an organic polymer, and the polymer can contain antimicrobial agents. Methods of preparing a coated surface, and uses are described.

Abstract: A method of controlling a polishing operation includes measuring a plurality of spectra at a plurality of different positions on a substrate to provide a plurality of measured spectra. For each measured spectrum of the plurality of measured spectra, a characterizing value is generated based on the measured spectrum. For each characterizing value, a goodness of fit of the measured spectrum to another spectrum used in generating the characterizing value is determined. A wafer-level characterizing value map is generated by applying a regression to the plurality of characterizing values with the plurality of goodnesses of fit used as weighting factors in the regression. A polishing endpoint or a polishing parameter of the polishing apparatus is adjusted based on the wafer-level characterizing map, and the substrate or a subsequent substrate is polished in the polishing apparatus with the adjusted polishing endpoint or polishing parameter.

Abstract: A parts carrier assembly for a grinding machine includes an annular parts carrier and a bearing insert. The annular parts carrier includes an upper surface, a lower surface, an inner edge, an outer edge, and a plurality of loading apertures. The inner edge is configured to engage a driving wheel of the grinding machine. The driving wheel rotates about a central axis resulting in rotation of the parts carrier about an offset axis, which is offset from the central axis. The loading apertures are configured to receive parts to be ground by the grinding machine. The bearing insert includes an inner bearing surface complementary in shape to the outer edge of the parts carrier. The outer surface the parts carrier bears against the inner bearing surface of the bearing insert as the parts carrier rotates about the offset axis.

Abstract: An abrasive article includes a polymer matrix and abrasive grains dispersed in the polymer matrix, wherein the abrasive article has a void volume of at least 50%. The polymer matrix is polymerized from a monomer including at least one double bond.

Abstract: The present invention discloses a method for surface-treating a mirror-finish stainless steel workpiece, which comprises steps: dividing the surface of a mirror-finish stainless steel workpiece into different grinding areas according to the depths of the scratches; selecting sand papers respectively having appropriate grit sizes for the grinding areas, and grinding the grinding areas to remove all the scratches; sequentially using three combinations of polishing agents and grinding materials to undertake polishing; and using an abrasive paste and a fourth grinding material to perform mirror-finishing.

Abstract: The system for machining the bottom of skis comprises a machine frame, in which a ski is stationary supported by roller carriers. The machining is performed by machining tools on a carriage, which extends throughout under the ski. During the machining, the carrier rollers that are alternately arranged behind each other, take over the support of the ski. There are always so many carrier rollers directly under the ski that its bottom remains in a stationary position.

Abstract: An apparatus for performing both edge trimming and surface grinding includes two spindles for holding two workpieces, a bridge element laterally movable relative to the spindles, and two grinding wheels coupled to the bridge element. The apparatus may be a surface grinding apparatus that includes a system for enabling the surface grinding apparatus to additionally perform edge trimming. A method for processing the workpieces entails placing the two workpieces on the two spindles of the apparatus, directing the bridge element to move laterally to an edge trimming position to trim the outer edge of one workpiece using one of the grinding wheels, to move laterally to another edge trimming position to trim the outer edge of the other workpiece using one of the grinding wheels, and to move laterally to surface grinding positions to perform surface grinding on both of the workpieces using one or both of the grinding wheels.

Abstract: A method of forming a workpiece having machinability rating not greater than a machinability rating of Inconel 718. The method may include removing material from the workpiece by moving at least one grinding tool relative to the workpiece and may be conducted at a specific grinding energy of not greater than about 7 Hp/in3 min (about 19 J/mm3) for a material removal rate of at least about 2.5 in3/min·in (about 25 mm3sec/mm).

Abstract: A method of forming a complex form in a workpiece includes moving a grinding tool having a complex shape relative to a surface of a workpiece to form a complex shape opening in the workpiece, and the grinding tool is tilted in a lateral plane relative to the workpiece.

Abstract: The present invention relates to a method and a device for processing parts, preferably made from timber-derived materials, especially MDF elements for achieving a sanded or polished surface, wherein blasting media are directed onto the surface at a shallow impact angle, and correspondingly produced wood parts.

Abstract: A method of manufacturing a tubular structure is implemented by housing a tubular base, which has a side circumference surface formed in a bellows-like shape, in a polishing container, causing magnetic particles to flow along a circumferential direction of the tubular base due to action of magnetic poles, and supplying abrasive particles to the polishing container so that the abrasive particles flow along an axial direction of the tubular base, thereby polishing a surface of the tubular base. The method includes: a first polishing step of polishing an exposed surface of the tubular base by causing the magnetic particles and the abrasive particles to flow while an inner surface of the tubular base remains covered; and a second polishing step of polishing an exposed surface of the tubular base by causing the magnetic particles and the abrasive particles to flow while an outer surface of the tubular base remains covered.

Abstract: A dual-side wafer bar grinding method and apparatus is disclosed herein that slices wafer bars from a wafer block for use in manufacturing thin film magnetic heads, for example. By grinding opposing faces of the wafer bars sliced from the wafer block, variations in flatness, perpendicularity, surface finish, and/or overall dimensions are improved.

Abstract: A method of efficiently cutting and machining opposite ends of rod members in sequence is provided, which comprises steps of: abutting a grinding wheel (5) against the periphery of a long rod material (10a) placed at a predetermined work position; moving the grinding wheel towards and along the axis of a first portion of the long rod material (10a) in rotation to taper the tail end of the first portion (to be provided as a rod member); and then moving the grinding wheel (5) further towards the axis of the rod material (10a) to cut the first portion off the long rod material and at the same time chamfer the leading end of a second portion of the long rod material in contact with the rear side of the grinding wheel. After removing the first rod member cut off, the sequence of these steps is repeated as needed.

Abstract: A method for simultaneous double-side material-removing processing of at least three workpieces includes disposing the workpieces in a working gap between rotating upper and lower working disks of a double-side processing apparatus. The workpieces lie in freely movable fashion in respective openings in a guide cage and are moved under pressure in the working gap using the guide cage. Upon attaining a preselected target thickness of the workpieces, a deceleration process is initiated that includes reducing an angular velocity ?i(t) of a respective drive i of each of the upper working disk, lower working disk and guide cage to a standstill. The reducing is carried out such that ratios of the angular velocities ?i(t) with respect to one another as a function of time t deviate by no more than 10% from initial ratios of the angular velocities ?i(t) corresponding to when the preselected target thickness was attained.

Abstract: Machining of the present invention is machining of polishing work to be polished by movement of polishing sheet relative to work, in a state where polishing sheet is in contact with a surface of work to be polished. In the machining, work is arranged in contact with polishing sheet in a state where work is sandwiched between first simultaneous machining material with hardness lower than that of work, and second simultaneous machining material with hardness higher than that of work, and work is polished by relative movement of polishing sheet from first simultaneous machining material toward second simultaneous machining material.

Abstract: A carrier for a slider row bar for a lapping process. The carrier has a mounting structure comprising a material configured to have a first modulus of at least 1,000,000 Pa at a first period of time and a second modulus of 500 Pa to 500,000 Pa at a second period of time subsequent to the first period. The change from the first modulus to the second modulus is due to an external stimulus on the material.

Abstract: The present invention is a wafer polishing method including simultaneously polishing both surfaces of a wafer by pressing and rubbing the wafer, while holding the wafer with: a lower turn table having a flat polishing-upper-surface rotationally driven; an upper turn table having a flat polishing-lower-surface rotationally driven, the upper turn table being arranged with facing to the lower turn table; and a carrier having a wafer-holding hole for holding the wafer, wherein the polishing is performed while measuring a thickness of the wafer through a plurality of openings provided between a rotation center and an edge of the upper turn table or the lower turn table, and switching a polishing slurry with a polishing slurry having a different polishing rate during the polishing of the wafer. As a result, there is provided a wafer polishing method that can manufacture a wafer having a high flatness and a high smoothness at high productivity and high yield.

Abstract: There is provided a method of producing a substrate for magnetic recording media which is capable of efficiently removing alumina abrasive grains in the latter polishing step that have been stuck in the former polishing step during polishing of the substrate for magnetic recording media in which a NiP plating film has been formed on the surface of an Al alloy substrate, the method including: a rough polishing step for polishing the surface of a substrate for magnetic recording media, which is prepared by forming a NiP plating film on the surface of an Al alloy substrate, using a first grinder while supplying a polishing liquid containing alumina abrasive grains; and a finish polishing step for polishing the substrate for magnetic recording media following washing, using a second grinder while supplying a polishing liquid containing colloidal silica abrasive grains, wherein supply of the polishing liquid containing alumina abrasive grains is stopped and alumina abrasive grains are removed from the grinder b

Abstract: A polishing apparatus includes a peripheral-portion polishing unit configured to polish a peripheral portion of the substrate, a CMP unit configured to polish a flat surface of the substrate W, a cleaning unit configured to clean the polished substrate, a transport system configured to transport the substrate. The transport system transports the substrate that has been polished in one of the peripheral-portion polishing unit and the CMP unit to the cleaning unit, and transports the substrate that has been cleaned in the cleaning unit to the other of the peripheral-portion polishing unit and the CMP unit.

Abstract: The present disclosure relates generally to multicomponent optical devices having a space within the device. In various embodiments, an optical device comprises a first posterior component having an anterior surface, a posterior support component, and an anterior component having a posterior surface. An optical device can also comprise an anterior skirt. The first posterior component and the anterior skirt can comprise gas-permeable optical materials. An optical device also comprises a primary space between the posterior surface and the anterior surface, with the primary space configured to permit diffusion of a gas from a perimeter of the primary space through the space and across the anterior surface of the first posterior component. A method of forming a multicomponent optical device having a space is also provided.

Abstract: The described embodiment relates generally to the polishing of a device housing. The device housing can be formed of a thermoplastic, or a metal such as aluminum or stainless steel. More particularly, a method and an apparatus are described for calibrating a polishing process in which a precise amount of material can be removed. Accurate measurement of such a polishing process can be especially helpful in accurately determining material removal rates and pad wear occurring across curved surfaces and edges where such parameters tend to be difficult to predict.

Abstract: Apparatus and associated method for sharpening a cutting edge of a tool. In accordance with some embodiments, a side of the tool is placed in contacting engagement against a reverse sharpening guide surface to orient the tool at an acute angle with respect to an abrasive surface, with the abrasive surface extending in a lateral direction from a first end to a second end and the reverse sharpening guide surface located proximate the first end. The tool is moved away from the reverse sharpening guide surface and along the abrasive surface in the lateral direction toward the second end while nominally maintaining the tool at the acute angle so that a cutting edge of the tool is sharpened against the abrasive surface in a trailing cutting edge orientation with a top surface of the tool opposite the cutting edge maintained closer to the second end than the cutting edge.

Abstract: A method for grinding the surface of non-round workpieces. The method includes the steps of clamping a workpiece within a machining unit; machining the workpiece; without unclamping the workpiece, contactlessly measuring the workpiece using an optical measuring device having a conoscopic holography sensor with a characteristic measuring range; and machining and measuring the workpiece in an alternating manner to iteratively approach the desired measurements of a specified form by adjusting the distance between the optical measuring device and the surface of the workpiece depending on there being a deviation of the surface from the specified form so that a respectively measured area of the surface of the workpiece remains within the measuring range of the optical sensor.

Abstract: The linear semiconductor substrate 1 or 2 of the present invention comprises at least one desired thin film 4 formed on a linear substrate 3 having a length ten or more times greater than a width, thickness, or diameter of the linear substrate itself. Adopting semiconductor as the thin film 4 forms a linear semiconductor thin film. The linear semiconductor substrate 1 or 2 of the present invention is produced by utilizing a fiber-drawing technique which is a fabricating technique of optical fibers.

Abstract: A method for deburring a ground metal part includes loading a ground metal part into a carrier, contacting a first planar surface of the ground metal part with a first grinding wheel, and contacting a second planar surface of the ground metal part with a second grinding wheel. The first grinding wheel is rotated in a first rotational direction. The second grinding wheel is rotated also in the first rotational direction. After the first grinding wheel is rotated in the first rotational direction, the first grinding wheel is then rotated in a second rotational direction, which is opposite to the first rotational direction. After the second grinding wheel is rotated in the first rotational direction, the second grinding wheel is also rotated in the second rotational direction.

Abstract: Shot blasting particles are constituted by a ceramic material having an apparent relative density of more than 4.0 and less than 5.0 and comprising more than 5% of silica, as a percentage by weight based on the oxides.

Abstract: A method of polishing a metal layer comprising the following steps. A structure having an upper patterned dielectric layer with an opening therein is provided. A barrier layer is formed over the patterned upper dielectric layer and lining the opening. A metal layer is formed over the barrier layer, filling the opening. A first polish step employing a first slurry composition is conducted to remove a portion of the overlying metal layer. A second polish step employing the first slurry composition is conducted to: polish the partially removed overlying metal layer; and to expose portions of the barrier layer overlying the patterned upper dielectric layer. A third polish step employing a second slurry composition is conducted to remove the exposed barrier layer portions and exposing underlying portions of the patterned upper dielectric layer. A fourth polish step employing the second slurry composition and BTA is conducted to buff the exposed upper dielectric layer portions.