Abstract: A system includes a distribution tool, a backing, a first plurality of abrasive particles and a second plurality of abrasive articles. The distribution tool includes a first section and a second section. The first section is configured to receive the first plurality of abrasive particles and pass the first plurality of abrasive particles through one or more of the plurality of slots to the backing. The second plurality of abrasive particles differ in at least one of a size, an average weight and a shape from the first plurality of abrasive particles. The second section is configured to receive the second plurality of abrasive particles and pass the second plurality of abrasive particles through one or more of the plurality of slots to the backing.

Abstract: A substrate holding apparatus which can adjust polishing profile precisely is disclosed. The substrate holding apparatus includes an elastic membrane that forms a plurality of pressure chambers for pressing a substrate, and a head body to which the elastic membrane is coupled. The elastic membrane includes a contact portion to be brought into contact with the substrate for pressing the substrate against a polishing pad, an edge circumferential wall extending upwardly from a peripheral edge of the contact portion, and a plurality of inner circumferential walls arranged radially inwardly of the edge circumferential wall and extending upwardly from the contact portion. At least two adjacent inner circumferential walls of the plurality of inner circumferential walls include slope circumferential walls inclined radially inwardly. The slope circumferential walls are inclined radially inwardly in their entirety from their lower ends to upper ends, and extend upwardly.

Abstract: A method of processing a surface in additive manufacturing includes assembling a structure for a component by additive manufacturing out of a bed of a powdery base material, such that the structure is provided with an internal surface and a powdery base material covers at least a part of the internal surface, and actuating the base material relatively to the structure such that the internal surface is mechanically processed by the base material.

Abstract: A weather-resistant polishing pad, including an upper layer operating for polishing, a buffer layer, and a transparent base. The buffer layer is disposed between the upper layer and the transparent base, and the upper layer, the buffer layer, and the transparent base are bonded via a pressure sensitive adhesive or an adhesive agent. The upper layer includes a weather-resistant polyurethane prepolymer, a curing agent, and a functional filler. The polyurethane prepolymer is a polymerization product of polyol and polyfunctional isocyanate. The polyfunctional isocyanate includes a first isocyanate containing no benzene ring, or the first isocyanate having an isocyanato group and a benzene group, and the isocyanato group and the benzene group are connected indirectly.

Abstract: Provided are porous metal oxide particles, in which 50% mean particle size by volume is equal to or larger than 50 nm and equal to or smaller than 300 nm, ratio of 90% mean particle size by volume to 50% mean particle size by volume (D90/D50) is equal to or lower than 2.0, the particles have mesopores having a pore size determined by BJH method of equal to or larger than 5 nm and equal to or smaller than 30 nm, and the structure of the pores is a three-dimensional cubic phase structure.

Abstract: Methods, apparatus, and systems for polishing a substrate are provided. The invention includes an upper platen; a torque/strain measurement instrument coupled to the upper platen; and a lower platen coupled to the torque/strain measurement instrument and adapted to drive the upper platen to rotate through the torque/strain measurement instrument. In other embodiments, the invention includes an upper carriage; a side force measurement instrument coupled to the upper carriage; and a lower carriage coupled to the side force measurement instrument and adapted to support a polishing head. Numerous additional aspects are disclosed.

Abstract: Polishing pads with apertures are described. Methods of fabricating polishing pads with apertures are also described.

Abstract: The polishing apparatus has a polishing unit capable of forming a right-angled cross section by polishing a peripheral portion of the substrate. The polishing unit includes a polishing head having a pressing member configured to press a polishing tape against the peripheral portion of the substrate from above, a tape supply and recovery mechanism configured to supply the polishing tape to the polishing head and to recover the polishing tape from the polishing head, a first moving mechanism configured to move the polishing head in a radial direction of the substrate, and a second moving mechanism configured to move the tape supply and recovery mechanism in the radial direction of the substrate. The guide rollers are arranged such that the polishing tape extends parallel to a tangential direction of the substrate and a polishing surface of the polishing tape is parallel to a surface of the substrate.

Abstract: An orthopaedic surgical instrument comprising an orthopaedic cutting block includes a metallic bearing insert configured to support a bone cutting tool and a body molded to the bearing insert. The bearing insert includes a plurality of chemically etched holes, and the body is molded to the bearing insert such that each of the plurality of chemically etched holes is at least partially filled by a portion of the body. The body of the orthopaedic cutting block may include a bone-facing surface adapted to contact a portion of a patient's bone, and the bearing insert may be positioned to allow a surgeon to perform a cut on the patient's bone using the bearing insert for support. A method of manufacturing an orthopaedic surgical instrument is also disclosed.

Abstract: The invention provides a chemical-mechanical polishing composition containing (a) abrasive particles, (b) a polymer, and (c) water, wherein (i) the polymer possesses an overall charge, (ii) the abrasive particles have a zeta potential Za measured in the absence of the polymer and the abrasive particles have a zeta potential Zb measured in the presence of the polymer, wherein the zeta potential Za is a numerical value that is the same sign as the overall charge of the polymer, and (iii) |zeta potential Zb|>|zeta potential Za|. The invention also provides a method of polishing a substrate with the polishing composition.

Abstract: A chemical mechanical polishing pad is provided containing a polishing layer having a polishing surface; and, an endpoint detection window; wherein the endpoint detection window comprises a reaction product of ingredients, comprising: an isocyanate terminated urethane prepolymer having 5.5 to 9.5 wt % unreacted NCO groups, wherein the isocyanate terminated urethane prepolymer is a reaction product of ingredients comprising: an aliphatic polyfunctional isocyanate; and, a prepolymer polyol; and, a curative system, comprising: 0 to 99 wt % of a difunctional curative; and, 1 to 100 wt % of an amine initiated polyol curative having at least one nitrogen atom per molecule and an average of at least three hydroxyl groups per molecule. Also provide are methods of making and using the chemical mechanical polishing pad.

Abstract: Provided are elements arranged along a ring of a drive power transfer belt wound on pulleys of a belt-drive continuously variable transmission. Each element has a recess at one side of the element and a projection projecting from the other side to fit into the recess of the adjacent element. The projection has a first engagement portion provided at its base side such that a predetermined engagement gap is created on the radially outer side when the projection fits in the recess of the adjacent element, and a second engagement portion provided at the tip side of the projection and decreasing in diameter toward the tip of the projection from the first engagement portion. The gradient with which the diameter of the second engagement portion decreases is larger than the gradient with which the diameter of the first engagement portion decreases toward the tip of the projection.

Abstract: An apparatus for shaping an edge of an aerofoil, the apparatus having first and second brushes and each brush having a plurality of bristles. A first motor rotates the first brush about a first axis and a second motor rotates the second brush about a second axis. The axes are arranged substantially parallel to the bristles of the respective brush. A support structure holds the first brush such that the first axis intersects a first surface of the edge of the aerofoil and holds the second brush such that the second axis intersects a second surface of the edge of the aerofoil. There are means to produce relative movement the first and second brushes and the aerofoil such that the first and second brushes move longitudinally along the edge of the aerofoil to shape the edge of the aerofoil.

Abstract: A polishing liquid comprising an abrasive grain, an additive, and water, wherein the abrasive grain includes a hydroxide of a tetravalent metal element, produces absorbance of 1.00 or more and less than 1.50 for light having a wavelength of 400 nm in an aqueous dispersion having a content of the abrasive grain adjusted to 1.0 mass %, and produces a liquid phase having a content of a non-volatile component of 300 ppm or more when centrifuging an aqueous dispersion having a content of the abrasive grain adjusted to 1.0 mass % for 50 minutes at a centrifugal acceleration of 1.59×105 G.

Abstract: A tool is disclosed for selective honing of the outer diameter of a cylinder using an abrasive belt in semi-circular contact upon the outer-diameter of a cylindrical work-piece to perform a similar function to honing the inner-diameter of a hollow cylinder. The belt is retained within the tool body by U-shaped restraint arms, and a slot in the tool body. A clamp block retains the ends of the belt which exit the slot. Springs on the arms, and contact of the block on the outside of the tool body, force the belt into a triangular shape inside the body. A cylindrical work-piece inserted within the triangular shaped belt causes the belt to deform into three semi-circular areas of contact between the belt and work-piece. When the work-piece is rotated, the belt abrades material from the work-piece.

Abstract: The present invention provides: a method of polishing an object to be polished for processing a surface of the object to be polished into a concave or convex state with a high degree of accuracy; and a polishing pad. An object to be polished is placed on a polishing pad over the boundary between the first polishing region and the second polishing region, the first polishing region has grooves and the second polishing region has grooves different from those of the first polishing region, and either one of the two regions being formed on a region on the center side, and the other on the outer side in a radial direction on the surface of the polishing pad; and the object to be polished is polished by rotating the polishing pad and the object to be polished.

Abstract: A substrate holder capable of preventing an increase in a polishing rate of an edge portion of a substrate, even when polishing a plurality of substrates successively, is disclosed. The substrate holder includes: a top ring body configured to hold the substrate; and a retaining ring disposed so as to surround the substrate held by the top ring body. The retaining ring includes a pad pressing structure in an annular shape which is to be brought into contact with the polishing pad and the pad pressing structure has a width in a range of 3 mm to 7.5 mm.

Abstract: There is disclosed a polishing cleaning mechanism configured to be in contact with a rear surface of a substrate which is held in a substrate holding unit for holding the rear surface of the substrate and perform a polishing process and a cleaning process on the rear surface of the substrate, including a cleaning member configured to clean the rear surface of the substrate, a polishing member configured to polish the rear surface of the substrate, and a support member configured to support the polishing member and the cleaning member to face the rear surface of the substrate held in the substrate holding unit, wherein a surface of the polishing member facing the substrate and a surface of the cleaning member facing the substrate differ in relative height from each other.

Abstract: The invention relates to devices, systems and methods for restoring optical discs, including CD's, DVD's and Blu-ray discs. The invention provides an easy to use device for user's to repair optical discs without having to clean or remove rotating pads in the device between uses for the life of the pads of about 84 cycles.

Abstract: A platen assembly includes a platen body, a polishing pad, and a fountain slurry supplier. The platen body has an upper surface. The polishing pad is disposed on the upper surface of the platen body. The fountain slurry supplier is at least partially disposed on the upper surface of the platen body for supplying slurry up onto the polishing pad.

Abstract: A method for shortening one or more rotor blade(s) (2) of a turbomachine (3) by removal of material at the blade tip, and apparatus (1;19) for carrying out the method: a belt grinding apparatus (1;19) shortens the rotor blades (2) and a contour of the blade tip is generated by a relative movement of the blade tip along the static belt.

Abstract: A method for deburring a ground metal part includes loading a ground metal part into a carrier, contacting a first planar surface of the ground metal part with a first grinding wheel, and contacting a second planar surface of the ground metal part with a second grinding wheel. The first grinding wheel is rotated in a first rotational direction. The second grinding wheel is rotated also in the first rotational direction. After the first grinding wheel is rotated in the first rotational direction, the first grinding wheel is then rotated in a second rotational direction, which is opposite to the first rotational direction. After the second grinding wheel is rotated in the first rotational direction, the second grinding wheel is also rotated in the second rotational direction.

Abstract: The invention provides a polishing pad and a method of using the polishing pad for chemically-mechanically polishing a substrate. The polishing pad comprises at least a grooved region and an exclusion region, wherein the exclusion region is adjacent to the circumference of the polishing pad, and wherein the exclusion region is devoid of grooves.

Abstract: A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.

Abstract: A polishing liquid comprising an abrasive grain, an additive, and water, wherein the abrasive grain includes a hydroxide of a tetravalent metal element, produces absorbance of 1.00 or more and less than 1.50 for light having a wavelength of 400 nm in an aqueous dispersion having a content of the abrasive grain adjusted to 1.0 mass %, and produces absorbance of 0.035 or more for light having a wavelength of 400 nm in a liquid phase obtained when centrifuging an aqueous dispersion having a content of the abrasive grain adjusted to 1.0 mass % for 50 minutes at a centrifugal acceleration of 1.59×105 G.

Abstract: Apparatus and method for sharpening cutting tools. In accordance with some embodiments, an abrasive medium is presented adjacent a guide housing. The guide housing includes a guide slot to facilitate presentation of a magnetically permeable tool against the abrasive medium. A magnet positioned adjacent the guide slot exerts a biasing force upon the tool that both draws the first tool against a guide surface of the guide slot and draws the tool into the guide slot along the guide surface to hold the tool at a neutral position at which a cutting edge of the first tool applies a contacting force against the abrasive medium.

Abstract: Disclosed are various embodiments for a system and method of processing a surface using a mixture containing magnetic particles. A mixture is disposed on a workpiece and exposed to a dynamic magnetic field. In response to the dynamic magnetic field, the magnetic particles of the mixture may move along the workpiece. The movement of the magnetic particles creates a pattern of grooves on the surface of the workpiece.

Abstract: The present invention discloses a method for surface-treating a mirror-finish stainless steel workpiece, which comprises steps: dividing the surface of a mirror-finish stainless steel workpiece into different grinding areas according to the depths of the scratches; selecting sand papers respectively having appropriate grit sizes for the grinding areas, and grinding the grinding areas to remove all the scratches; sequentially using three combinations of polishing agents and grinding materials to undertake polishing; and using an abrasive paste and a fourth grinding material to perform mirror-finishing.

Abstract: A chemical mechanical polishing pad is provided containing: a polishing layer; a rigid layer; and, a hot melt adhesive bonding the polishing layer to the rigid layer; wherein the polishing layer exhibits a specific gravity of greater than 0.6; a Shore D hardness of 60 to 90; an elongation to break of 100 to 300%; and, a unique combination of an initial hydrolytic stability and a sustained hydrolytic instability.

Abstract: A device for removing contaminants from a bus stab of an electrical enclosure is provided. The electrical enclosure includes an electrical bus member disposed in a first plane. The bus stab extends outwardly from the electrical bus member and is disposed in a second plane perpendicular to the first plane. The device includes a gripping assembly and a scraping assembly coupled thereto, the scraping assembly comprising a number of flexible members structured to scrape and thereby clean the bus stab, the device being structured to move in a direction parallel to the second plane when the flexible members scrape the bus stab.

Abstract: A method of chemical mechanical polishing a substrate is provided, including: providing a substrate; providing a chemical mechanical polishing pad, comprising: a polishing layer having a composition and a polishing surface, wherein the composition of polishing layer is selected to exhibit an initial hydrolytic stability; coupled with a sustained hydrolytic instability; a rigid layer having a top surface and a bottom surface; a hot melt adhesive interposed between the base surface of the polishing layer and the top surface of the rigid layer; wherein the hot melt adhesive bonds the polishing layer to the rigid layer; a pressure sensitive platen adhesive layer having a stack side and a platen side; wherein the stack side of the pressure sensitive platen adhesive layer is adjacent to the bottom surface of the rigid layer; and, creating dynamic contact between the polishing surface and substrate to polish a surface of the substrate.

Abstract: The present invention provides methods and apparatus for a pre-CMP semiconductor substrate buffing module. The invention includes a polishing pad assembly adapted to be rotated against a major surface of a substrate; a chuck adapted to hold the substrate and to rotate the substrate against the polishing pad assembly as the polishing pad assembly is rotated; and a lateral motion motor adapted to oscillate the polishing pad assembly laterally across the major surface of the substrate while the polishing pad assembly is rotated against the rotating substrate. Numerous additional features are disclosed.

Abstract: The invention provides a polishing pad for chemical-mechanical polishing comprising a porous polymeric material, wherein the polishing pad comprises closed pores and wherein the polishing pad has a void volume fraction of 70% or more. Also disclosed is a method for preparing the aforesaid polishing pad and a method of polishing a substrate by use of theaforesaid polishing pad.

Abstract: The present invention discloses a grinding device and a grinding method. The grinding device for grinding a panel includes a grinding belt held between an upper surface and a bottom surface of the panel for grinding both surfaces of the panel simultaneously, a transferring mechanism for transferring the grinding belt and a belt pressing mechanism for pressing the grinding belt on the upper surface and the bottom surface of the panel. The grinding device and the grinding method in the present invention save manufacturing cost by reducing numbers of grinding belt in a grinding period because it uses one grinding belt to grind the upper surface and the bottom surface of the panel at the same time. Furthermore, the grinding belt exerting evenly on the upper and bottom surfaces of the panel in use of one grinding belt enhances flatness of two surfaces of the panel.

Abstract: The invention relates to a suspension of cerium oxide particles, of which the particles (secondary particles) have an average size of at most 200 nm, these secondary particles consisting of primary particles whose average size measured by TEM is of at most 150 nm with a standard deviation of at most 30% of the value of said average size, and for which the ratio of the average size measured by TEM to the average size measured by BET is at least 1.5. This suspension is prepared from a solution of a cerium III salt, comprising a colloidal dispersion of cerium IV, which is brought into contact, in the presence of nitrate ions and under an inert atmosphere, with a base; the medium obtained is subjected to a thermal treatment under an inert atmosphere and then acidified and washed. The suspension can be used for polishing.

Abstract: A polishing apparatus capable of achieving a highly-precise polishing result is disclosed. The polishing apparatus includes an in-line film-thickness measuring device configured to measure a film thickness of the substrate in a stationary state, and an in-situ spectral film-thickness monitor having a film thickness sensor disposed in a polishing table, the in-situ spectral film-thickness monitor being configured to subtract an initial film thickness, measured by the in-situ spectral film-thickness monitor before polishing of the substrate, from an initial film thickness, measured by the in-line film-thickness measuring device before polishing of the substrate, to determine a correction value, add the correction value to a film thickness that is measured when the substrate is being polished to obtain a monitoring film thickness, and monitor a progress of polishing of the substrate based on the monitoring film thickness.

Abstract: For the manufacture of an abrasive bristle, a plastic material is melted, and a granular material made of abrasive particles is mixed into the melt. The melt is extruded together with the abrasive particles into a filament, and the filament is subsequently treated and cut up. The plastic material may be a high-temperature-resistant polymer with a continued use temperature of ?150° C. and for the melt with the abrasive particles to be extruded at a temperature of ?280° C. A brush equipped with corresponding abrasive bristles can be used for the surface treatment of a workpiece, whereby the brush is rotated with a speed in the range of 3,000 rpm to 12,000 rpm and is brought into contact with the surface to be treated.

Abstract: A workpiece having a multiple-phase working surface, and a lapping process for producing the surface, the process including: (a) providing a system including: (i) a workpiece having a multiple-phase working surface having a first continuous solid phase, and a second solid phase, intimately dispersed within the continuous phase in the multiple-phase working surface, the continuous phase having a hardness exceeding a hardness of the second phase by a Mohs Hardness of at least 0.

Abstract: An apparatus, system, and method are provided for reducing edge damage of a disk during chemical mechanical polishing. The apparatus includes a disk carrier configured to receive a disk, the disk having an outside edge and an inside edge, a raised ring adjacent the outside edge of the disk and extending from a surface of the disk carrier to a height greater than a height of the disk, and a raised column adjacent the inside edge of the disk and having a height greater than a height of the disk. The system includes a disk carrier for receiving a disk, a raised ring adjacent the outside edge of each opening, and plugs insertable into a central opening in the disk and having a height greater than a height of the disk. The method includes providing the apparatus, inserting a disk into the apparatus, and polishing the disk.

Abstract: A continuously variable transmission metal belt includes a metal ring assembly and metal elements. The metal ring assembly includes stacked endless metal rings. Each of the stacked endless metal rings includes a flat peripheral surface and a substantially semicircular end face. The substantially semicircular end face is connected to an end of the peripheral surface in a width direction of each of the stacked endless metal rings. The metal elements are supported on the metal ring assembly. A displacement Z of the end face is smaller than or equal to 0.1R. The displacement Z is defined as Z=R?H. R is a radius of an imaginary circle that passes through a contact point between the peripheral surface and the end face and that is tangent to the end face. H is a distance from a center of the imaginary circle to the peripheral surface.

Abstract: In accordance with an embodiment, a manufacturing method of a semiconductor device includes forming a polish target film on a substrate and conducting a CMP process for the polish target film. The conducting the CMP process includes bringing a surface of the polish target film into contact with a surface of a polishing pad with a negative Rsk value, and adjusting friction dependency on polishing speed between the polish target film and the polishing pad to a value that restrains the occurrence of a stick slip to polish the polish target film.

Abstract: A tool is disclosed for selective honing of the outer diameter of a cylinder using an abrasive belt in semi- circular contact upon the outer-diameter of a cylindrical work-piece to perform a similar function to honing the inner-diameter of a hollow cylinder. The belt is retained within the tool body by U-shaped restraint arms, and a slot in the tool body. A clamp block retains the ends of the belt which exit the slot. Springs on the arms, and contact of the block on the outside of the tool body, force the belt into a triangular shape inside the body. A cylindrical work-piece inserted within the triangular shaped belt causes the belt to deform into three semi-circular areas of contact between the belt and work-piece. When the work-piece is rotated, the belt abrades material from the work-piece.

Abstract: The invention provides a polishing pad comprising a polishing pad body comprising a polishing surface, wherein the polishing body comprises pores, and wherein the polishing surface has a surface roughness of about 0.1 ?m to about 10 ?m.

Abstract: The disclosed embodiments relate generally to methods for creating smooth cosmetic surfaces along small features of an electronic device. The disclosed embodiments are well suited for reaching surfaces disposed in constrained spaces. More specifically a method for finishing a workpiece is described. For example, the method may be employed to finish an inlet portion of a cable connector. The method may involve the use of an abrasive brush which may include a single filament and abrasive particles coupled thereto, which can be configured to provide any number of different surface geometries during a finishing operation.

Abstract: Provided is an abrasive agent for substrates that includes, as an abrasive material component in the abrasive agent, cerium oxide as the main component. The abrasive agent for substrates includes soluble silica and cerium oxide. The concentration ratio of the soluble silica, calculated as Si content, and the cerium oxide in the abrasive agent is 0.001:1 to 0.1:1.

Abstract: The invention relates to a device and method for using same for sanding a predetermined impression into a workpiece. The device has a pattern belt positioned inside the area formed by a sanding belt. A pad is positioned inside the area formed by the pattern belt. A raised pattern is formed on the outer surface of the pattern belt. In use, the pad is selectively controlled to contact the pattern belt, thereby urging the raised pattern of the pattern belt to contact the sanding belt. The portion of the sanding belt contacted by the pattern belt is urged toward the workpiece so that the predetermined impression is sanded into the workpiece.

Abstract: A polish pad including a polish region contributing to polishing of a polish object; and a polish layer being disposed in the polish region and including unfoamed segments comprising unfoamed resin and foamed segments comprising resin including independent pores. The unfoamed segments and the foamed segments of the polish layer are made of the same raw resin.

Abstract: Disclosed is a substrate polishing method capable of minimizing a difference of polishing amounts between a center portion and a rim portion of a large scale plate during a plate polishing process.

Abstract: A nonwoven abrasive wheel comprising one or more layers of a nonwoven fiber web, a plurality of super abrasive particles having a Vickers hardness greater than 40 GPa, a polyurethane binder adhering the plurality of super abrasive particles to the nonwoven fibers and adhering the layers of the nonwoven fiber web to each other, and wherein the nonwoven abrasive wheel comprises a Flexural Modulus from 4.0 to 128.0 lb/inch of thickness per inch of displacement.

Abstract: A polishing system configured to polish a lap includes a lap configured to contact a workpiece for polishing the workpiece; and a septum configured to contact the lap. The septum has an aperture formed therein. The radius of the aperture and radius the workpiece are substantially the same. The aperture and the workpiece have centers disposed at substantially the same radial distance from a center of the lap. The aperture is disposed along a first radial direction from the center of the lap, and the workpiece is disposed along a second radial direction from the center of the lap. The first and second radial directions may be opposite directions.