Abstract: An apparatus for shaping an edge of an aerofoil, the apparatus having first and second brushes and each brush having a plurality of bristles. A first motor rotates the first brush about a first axis and a second motor rotates the second brush about a second axis. The axes are arranged substantially parallel to the bristles of the respective brush. A support structure holds the first brush such that the first axis intersects a first surface of the edge of the aerofoil and holds the second brush such that the second axis intersects a second surface of the edge of the aerofoil. There are means to produce relative movement the first and second brushes and the aerofoil such that the first and second brushes move longitudinally along the edge of the aerofoil to shape the edge of the aerofoil.

Abstract: The present invention mainly relates to a polishing pad and method of producing the same. The polishing pad comprises a base material having a surface for polishing a substrate, wherein the surface comprises a plurality of bundles of first long fibers and an elastomer embedded into the bundles. The bundles of first long fibers are entangled with each other.

Abstract: The invention relates to a device for sanding a predetermined impression into a workpiece. The device has a pattern belt positioned inside the area formed by a sanding belt. A pad is positioned inside the area formed by the pattern belt. A raised pattern is formed on the outer surface of the pattern belt. In use, the pad contacts the pattern belt, urging the raised pattern of the pattern belt to contact the sanding belt. The portion of the sanding belt contacted by the pattern belt is urged toward the workpiece so that the predetermined impression is sanded into the workpiece.

Abstract: A polishing pad, a polishing method and a method of forming a polishing pad are provided. The polishing pad includes a polishing layer and a plurality of arc grooves. The arc grooves are disposed in the polishing layer. Each of the arc grooves has two ends, and at least one end thereof has an inclined wall. The angle between the inclined wall of each groove and the surface plane of the polishing layer is less than 90 degree.

Abstract: Embodiments herein provide polishing pads that produce high post-polish planarity, such as on a wafer substrate or other substrates. Exemplary pads include a bulk matrix and embedded polymer particles. Pads according to embodiments herein may be used to remove material over a composite substrate, comprised of two or more different materials, or a substrate comprised of a single material.

Abstract: A polishing method for reducing an amount of polishing liquid used without lowering a polishing rate is provided. The polishing method comprises determining, in advance, the relationship between a supply flow rate of a polishing liquid and a polishing rate at the time the substrate is polished without controlling a surface temperature of the polishing pad, and the relationship between a supply flow rate of a polishing liquid and a polishing rate at the time the substrate is polished while controlling a surface temperature of the polishing pad at a predetermined level, and continuously supplying the polishing liquid to the surface of the polishing pad to achieve a higher polishing rate when the substrate is polished while controlling the surface temperature of the polishing pad at the predetermined level, than when the substrate is polished without controlling the surface temperature of the polishing pad.

Abstract: Three rotary wafer abrasive lapping spindles having attached wafers are mounted on the flat surface of a granite lapping machine base. A flexible raised island abrasive disk is attached to the annular abrading surface of an abrading platen that is rotated at high speeds to flat lap, or polish, the exposed surfaces of the rotating wafers. Resilient wafer pads are used to minimize the effects of the abraded surfaces of the wafers not being precisely parallel to the platen abrading surface due to misalignment of the spindle tops. The resilient pads also compensate for two opposed flat surfaces of wafers not precisely parallel with each other. A mixture of the same types of chemicals that are used in the conventional CMP polishing of wafers with applied coolant water can be used with this abrasive lapping or polishing system to enhance abrading and to continually wash abrading debris from the wafers.

Abstract: A method of making shape memory chemical mechanical polishing pads is provided, wherein the shape memory chemical mechanical polishing pads comprise a polishing layer in a densified state. Also provided is a method for using the shape memory chemical mechanical polishing pads to polish substrates.

Abstract: A method for providing an edge preparation on a cutting edge of a tool by means of an edge processing operation includes clamping the tool in a processing machine for providing the edge preparation, recording as a reference value the position of the cutting edge to be processed by means of a sensor arranged on the processing machine, carrying out an edge processing operation by means of a preparation tool, recording the position of the cutting edge again by means of the sensor arranged on the processing machine and storing the position as an actual value, monitoring the edge processing operation on the basis of a comparison between the reference value and the actual value, and comparing the actual value with a desired value for material removed on the cutting edge.

Abstract: A sheet of coarse sandpaper includes a backing layer having opposed first and second major surfaces, an adhesive make coat on the second major surface, coarse abrasive particles at least partially embedded in the make coat, thereby defining a coarse abrasive surface, and an exposed non-slip coating layer on the first major surface. Methods of making and using such coarse sandpaper are also provided.

Abstract: The present invention provides an abrasive article, e.g. a sheet of sandpaper, comprising a backing layer having opposed first and second major surfaces, an adhesive make coat on the second major surface, abrasive particles at least partially embedded in the make coat, thereby defining an abrasive surface, and an exposed non-slip coating layer on the first major surface, the non-slip coating layer comprising at least a base resin and a tackifying resin.

Abstract: To provide a polishing pad (14) useful for polishing semiconductor materials having a high hardness. The polishing pad (14) is used for polishing a workpiece (16) in combination with loose grains and comprises a polishing surface (15) comprising a textile of high-tenacity organic fibers, the fiber has a tenacity of not lower than 15 cN/dtex. In the textile, the high-tenacity organic fiber may have a single fiber fineness within the range between 0.3 dtex and 15 dtex, or a total fineness of within the range between 3 dtex and 3,000 dtex. The fiber may include, for example, a fully-aromatic polyester fiber.

Abstract: The polishing method of a disk-shaped substrate for polishing an outer circumference 13 of a disk-shaped substrate using slurry is provided with in this sequence: a first polishing process for polishing the outer circumference 13 using an abrasive-grain inclusion brush 50 made of a resin in which polishing abrasive grains are included; and a second polishing process for polishing the outer circumference 13 using a resin brush 60 made of a resin in which the polishing abrasive grains are not included.

Abstract: A vacuum-assisted sanding device removably connectable to a conventional sanding pad of the type used with mechanical sanders. The sanding device may include a swiveling connection tube for connecting dust removal channels and a recess of a handle block of the sanding device to a vacuum system. The manual sanding device may also include a plate system for suctioning away dust and other particulate matter created during the sanding process.

Abstract: A polishing pad is provided herein, which may include a plurality of soluble fibers having a diameter in the range of about 5 to 80 micrometers, and an insoluble component. The pad may also pad include a first surface having a plurality of micro-grooves, wherein the soluble fibers form the micro-grooves in the pad. The micro-grooves may have a width and/or depth up to about 150 micrometers. In addition, a method of forming the polishing pad and a method of polishing a surface with the polishing pad is disclosed.

Abstract: A method of form transfer grinding a three-dimensional shape utilizes a form transfer tool over which a belt is driven. The form transfer tool includes a shape that is desired in the finished part and guides a belt that grinds an area of a part to a finished or nearly finished condition.

Abstract: A method of form transfer grinding a three-dimensional shape utilizes a form transfer tool over which a belt is driven. The form transfer tool includes a shape that is desired in the finished part and guides a belt that grinds an area of a part to a finished or nearly finished condition.

Abstract: A polishing slurry can include zirconia particles. The polishing slurry can be used to polish conductive and insulating materials, and is particularly well suited for polishing oxide materials as well as metals. The characteristics of the zirconia particles can affect the polishing of workpieces. By selecting the proper characteristics, the polishing slurry can have a good material removal rate while still providing an acceptable surface finish. The zirconia particles can be used as a replacement for, or in conjunction with, ceria or other abrasive particles. The content of zirconia particles in the polishing slurry may be less than a comparable polishing slurry having silica or alumina particles.

Abstract: A patterned portion of a patterned semiconductor substrate is removed by abrasive mechanical planarization employing an abrasive pad but without employing any slurry. Preferably, water is supplied to enhance the removal rate during the mechanical planarization. The removal rate of material is substantially independent for common materials employed in back-end-of-line (BEOL) semiconductor materials, which enables non-selective removal of the material containing metallization structures. The removal rate of silicon is lower than the removal rate for the BEOL semiconductor materials, enabling a self-stopping planarization process.

Abstract: A composition including an abrasive, a suspension agent, a surfactant, and a lubricant, is provided for removing scratches, hazing, discoloration, and other defects from plastic surfaces. The composition is applied to a surface and used to polish the surface. The defects within the surface are removed without the removal of significant amounts of the material. Accordingly, the present invention removes defects from surfaces without creating optical distortion.

Abstract: The method provides a method of preparing a silicate-containing polishing pad useful for polishing at least one of semiconductor, magnetic and optical substrates. The method includes introducing a feed stream of gas-filled polymeric microelements into a gas jet. The polymeric microelements have varied densities, varied wall thickness and varied particle size. Passing the gas-filled microelements in the gas jet adjacent a Coanda block, the Coanda block having a curved wall for separates the polymeric microelements with Coanda effect, inertia and gas flow resistance. The coarse polymeric microelements from the curved wall of the Coanda block to clean the polymeric microelements. The polymeric microelements collected contain less than 0.

Abstract: A polishing composition contains at least abrasive grains and water and is used in polishing an object to be polished. The abrasive grains are selected so as to satisfy the relationship X1×Y1?0 and the relationship X2×Y2>0, where X1 [mV] represents the zeta potential of the abrasive grains measured during polishing of the object by using the polishing composition, Y1 [mV] represents the zeta potential of the object measured during polishing of the object by using the polishing composition, X2 [mV] represents the zeta potential of the abrasive grains measured during washing of the object after polishing, and Y2 [mV] represents the zeta potential of the object measured during washing of the object after polishing. The abrasive grains are preferably of silicon oxide, aluminum oxide, cerium oxide, zirconium oxide, silicon carbide, or diamond. The object is preferably of a nickel-containing alloy, silicon oxide, or aluminum oxide.

Abstract: Provided is a lapping carrier including a base carrier having a first major surface, a second major surface and at least one aperture for holding a workpiece. The aperture extends from the first major surface through the base carrier to the second major surface. The base carrier includes a first metal or a polymer. At least a portion of the first major surface or at least a portion of each of the first and the second major surfaces includes a polymeric region. In at least a portion of the polymeric region, at least one adhesion promoting layer is interposed between the polymeric region and the base carrier. The adhesion promoting layer includes an inorganic coating.

Abstract: The present disclosure relates to a polishing pad including a chemical agent present in an amount sufficient to be released and dissolving into an aqueous abrasive particle polishing medium during chemical mechanical planarization and reducing abrasive particle agglomeration and a binder. The pad includes a surface such that as the pad is abraded the surface is renewed exposing at least a portion of the chemical agent.

Abstract: A method is disclosed for maintaining a hard surface, the method comprising treating the surface with a flexible pad (1), in the presence of abrasive particles, bonded to the pad, on a contact surface between the pad (1) and the hard surface. The abrasive particles comprise diamond particles, and the treating is performed in the absence of an effective amount of crystallization agent on the contact surface. A tool for use in the method is also provided, as well as a floor surfacing machine comprising such a tool and a method for manufacturing such a tool.

Abstract: A tip of a capillary used for microinjection is polished on a plurality of sides by using a polishing plate having a surface roughened by dry etching. A first side of the tip is placed on the polishing plate at a predetermined angle and with a predetermined amount of pressing. The polishing plate is repeatedly moved at a predetermined speed by a predetermined distance such that the first side is polished. The capillary is then rotated around an axis thereof to obtain a second side of the tip, and the process of polishing is repeated for the second side.

Abstract: A polishing liquid composition that makes it possible to provide a polished substrate surface on which scratches and/or waviness are reduced, without impairing productivity, is provided, and further, a method for manufacturing and polishing a substrate using this polishing liquid composition is provided. The polishing liquid composition contains an abrasive, a water-soluble polymer, and water, wherein the water-soluble polymer has a sulfonic acid group, and has an aromatic ring in each of a main chain and a side chain. The method for manufacturing a substrate, and the method for polishing a substrate, include performing polishing by supplying the above-described polishing liquid composition to a surface to be polished of a substrate to be polished, bringing a polishing pad into contact with the surface to be polished, and moving the polishing pad and/or the substrate to be polished.

Abstract: A mix head assembly for use in the manufacture of chemical mechanical polishing pad polishing layers is provided, wherein inclusions of entrained gas inclusion defects are minimized.

Abstract: A polishing composition and method for polishing polymer-based surfaces that can be rinsed from the polished polymer-based surface using water so as to leave substantially less polishing residue behind as compared to conventional polishing compositions. Polishing compositions according to the invention include abrasive particles and a rinsing agent dispersed in water. Polishing compositions according to the invention can be used to polish all types of polymer-based surfaces including, for example, organic polymer-based ophthalmic substrates and clear-coat automotive finishes.

Abstract: The present invention relates to a method for producing a glass substrate for a magnetic disk, the method including a step of polishing a main surface of a circular glass plate while supplying a polishing slurry containing a polishing material, in which polishing is performed, after a polishing surface is subjected to dressing treatment, by using a polishing pad having: a first resin foam layer which forms the polishing surface, includes a resin foam having pores with a pore diameter of more than 20 ?m and has a thickness of 400 ?m or less; and a second resin foam layer which is provided between a platen for fixing the polishing pad and the first resin foam layer, includes a resin foam having pores with a pore diameter of 20 ?m or less and has a thickness of 50 to 250 ?m, and in which a total thickness of the first resin foam layer and the second resin foam layer is 550 ?m or less, and a international rubber hardness degree of the polishing pad measured by the M method according to JIS K6253 is 40 IRHD or mor

Abstract: A continuously variable transmission metal belt includes a metal ring assembly and metal elements. The metal ring assembly includes stacked endless metal rings. Each of the stacked endless metal rings includes a flat peripheral surface and a substantially semicircular end face. The substantially semicircular end face is connected to an end of the peripheral surface in a width direction of each of the stacked endless metal rings. The metal elements are supported on the metal ring assembly. A displacement Z of the end face is smaller than or equal to 0.1R. The displacement Z is defined as Z=R?H. R is a radius of an imaginary circle that passes through a contact point between the peripheral surface and the end face and that is tangent to the end face. H is a distance from a center of the imaginary circle to the peripheral surface.

Abstract: A multilayer chemical mechanical polishing pad is provided, having a polishing layer with a polishing surface, a polishing layer interfacial region parallel to the polishing surface and an outer perimeter; a porous subpad layer with a bottom surface, a porous subpad layer interfacial region parallel to the bottom surface and an outer perimeter; a pressure sensitive adhesive layer; and, a light transmissive window element; wherein the polishing layer interfacial region and the porous subpad layer interfacial region form a coextensive region; wherein the coextensive region secures the polishing layer to the porous subpad layer without the use of a laminating adhesive; wherein the pressure sensitive adhesive layer is applied to the bottom surface of the porous subpad layer; wherein an internal opening extends through the multilayer chemical mechanical polishing pad from the bottom surface to the polishing surface and is bounded by an internal peripheral edge of the porous subpad layer.

Abstract: The invention provides a polishing pad for chemical-mechanical polishing comprising a polymeric material comprising two or more adjacent regions, wherein the regions have the same polymer formulation and the transition between the regions does not include a structurally distinct boundary. In a first embodiment, a first region and a second adjacent region have a first and second non-zero void volume, respectively, wherein the first void volume is less than the second void volume. In a second embodiment, a first non-porous region is adjacent to a second adjacent porous region, wherein the second region has an average pore size of about 50 ?m or less. In a third embodiment, at least two of an optically transmissive region, a first porous region, and an optional second porous region, are adjacent. The invention further provides methods of polishing a substrate comprising the use of the polishing pads and a method of producing the polishing pads.

Abstract: A method and apparatus for releasably attaching flexible abrasive disks to a flat-surfaced platen that floats in three-point abrading contact with three rigid flat-surfaced rotatable fixed-position workpiece spindles that are mounted on a flat surface of an abrading machine base where the spindle surfaces are in a common plane. Three spindles are positioned to form a three-point triangle of platen supports where the rotational-centers of each of the spindles are positioned at the center of the annular width of the platen abrading surface. The spindles are supported by two-piece spindle-mount devices having a common-radius spherical joint that allows the spindles to be rotated to co-planar align the top flat surfaces of the rotatable spindle-tops and then to be locked into this aligned position. Spindle-mount spherical-action locking devices include mechanical fasteners and stress-free adhesive tabs. Precision-flat platens can be used as an alignment jig for co-planar alignment of the spindles.

Abstract: A method of preparing a polarizing dye receiving surface includes bringing the polarizing dye receiving surface into contact with a brushing surface of a brush pad carrying an abrasive material and brushing the polarizing dye receiving surface with the brushing surface in one or more brushing strokes. Each brushing stroke comprises effecting a unidirectional relative motion between the polarizing dye receiving surface and the brushing surface along a brushing path. The polarizing dye receiving surface is separated from the brushing surface after the brushing.

Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.

Abstract: A method of grinding a workpiece with a grinding wheel is provided wherein the shape of the wheel is distorted in a predetermined manner during grinding by changing the speed of rotation of the wheel. This deformation of the wheel during grinding is employed to impart a desired shape to the surface of the workpiece. A grinding wheel is also provided which is asymmetric in side view to adapt it for use in accordance with the method.

Abstract: A lapping carrier (110) including a base carrier (112) having first and second major surfaces and at least one aperture for holding a workpiece extending from the first major surface to the second major surface, the aperture circumference defined by a third surface of the base carrier, at least a portion of the first and/or second major surfaces including a polymeric region having at least the following adhesion promoting layers: (a) a primer layer (116) including at least one of a phenolic resin or a novolac resin; (b) a tie layer(115) adjoining the primer layer(116), the tie layer(115) including at least one of an amino-functional epoxy resin or a hydroxyl-functional epoxy resin; and (c) a polymeric layer (114) adjoining the tie layer (115) on a side opposite the primer layer(116), the polymeric layer(116) including an isocyanate-functional polymer. Also described are methods of making and using the carrier.

Abstract: A wafer polishing apparatus includes a polishing tape extending between two guide rollers, a first surface of the polishing tape contacting a surface of a wafer to be polished, a polishing head including a pusher pad, the pusher pad adapted to push the polishing tape against the surface of the wafer to be polished, a color image sensor adjacent to the polishing tape, the color image sensor being adapted to detect a color image of the polishing tape and to output a signal corresponding to the detected color image, and a controller connected to the color image sensor, the controller being adapted to receive the signal output from the color image sensor and to determine when a color of the color image detected by the color image sensor changes, a change in the color image indicating a polishing end point.

Abstract: A method for manufacturing a glass substrate for an information recording medium having a high level of cleanness and superior smoothness. The manufacturing method includes washing a disk-shaped glass plate with an acid washing liquid, removing at least part of a surface layer, which is formed on the surface of the glass plate, by performing grinding with diamond abrasion grains, and washing the surface with a neutral or alkaline washing liquid.

Abstract: The inventive polishing composition comprises an abrasive, an aqueous medium, a surfactant in an amount above its critical micelle concentration, and a hydrophobic surface active compound. The invention also provides a method of using a polishing composition.

Abstract: A flexible sanding composite in accordance with the principles of the invention includes about 10% to about 70% by weight liquid component, such as polybutene and/or oleic acid; about 30% to about 80% by weight abrasive material including calcium carbonate and aluminum oxide; and about 0% to about 5% by weight synthetic rubber. The invention also includes a method of removing dirt or contamination from a surface, or flattening surface irregularities, which includes rubbing the flexible sanding composite against the surface repeatedly until the dirt or contamination is diminished.

Abstract: Embodiments of the present invention include methods of use of a clip or other securing device to create a loop of sandpaper that can be slid down a user's arm or wrist when not in use. The apparatus is a clip, adhesive, or other device that is used to maintain a strip of sandpaper in a loop. The loop of sandpaper is held with the abrasive side outward, and is used to sand an object. After the object is sanded, the user moves the loop of sandpaper to a position around the user's arm, freeing the user to perform a different task. When the sandpaper strip is needed again, the user moves the sandpaper up the user's arm and again places the loop of sandpaper in the user's hand, to sand an object, where the object can be a different object or the same object previously sanded. This process can continue many times until the user no longer needs to use the sandpaper.

Abstract: A polishing apparatus is suitable for use in polishing a periphery of a substrate, such as a semiconductor wafer. The polishing apparatus includes a holding section configured to hold a workpiece and a polishing head configured to bring a polishing tape into contact with the workpiece. The polishing apparatus also includes a supply reel configured to supply the polishing tape to the polishing head, a rewind reel configured to rewind the polishing tape that has contacted the workpiece, and a swinging mechanism configured to cause the polishing head to perform a swinging motion with its pivot at a predetermined point.

Abstract: A polishing apparatus polishes wafers at a high yield rate even if roll-off exists. The polishing apparatus polishes a wafer by applying a pressure between a polishing member (polishing pad) and the wafer held by a holding member (top ring) and moving the polishing member relative to the wafer. The polishing apparatus includes a top ring for holding the wafer, a pressure adjusting mechanism for adjusting a supporting pressure with which the wafer is supported on a supporting surface by a retainer ring, and a control unit for controlling the pressure adjusting mechanism to bring the supporting pressure to a desired pressure based on a roll off quantity of the wafer. The top ring comprises an air bag for pressing the wafer against the polishing pad, a retainer ring which surrounds the wafer, and an air bag for pressing the retainer ring.

Abstract: A polishing apparatus is provided for polishing wafers at a high yield rate even if roll-off exists. The polishing apparatus polishes a wafer by applying a pressure between a polishing member (polishing pad) 201 and the wafer held by a holding member (top ring) 52 and moving the polishing member relative to the wafer. The polishing apparatus includes a top ring 52 for holding the wafer, a pressure adjusting mechanism for adjusting a supporting pressure with which the wafer is supported on a supporting surface by a retainer ring, and a control unit for controlling the pressure adjusting mechanism to bring the supporting pressure to a desired pressure based on a roll off quantity of the wafer. The top ring comprises an air bag 202 for pressing the wafer against the polishing pad, a retainer ring which surrounds the wafer, and an air bag for pressing the retainer ring.

Abstract: A dryer operable in close proximity to and in series with an inkjet printhead comprises a heat source and an air bearing structure on one side of the predetermined path and having a pressurized air inlet and an air outlet adjacent to the drying position of the receiver medium. Air flow from the air bearing structure outlet forms an air bearing for the receiver medium. A microporous filter positioned at the outlet and being adapted to convert the air flow from the outlet to a diffuse flow, the microporous filter being formed of an inner layer of very fine screen for optimum air diffusion and an outer layer of courser woven screen to add rigidity and protection from scuffing.

Abstract: A method and apparatus for finishing the surface of rubber or synthetic covered rollers (10) is disclosed. As seen in FIG. 3, a rotating hub (16) having a circumferential abrasion band (47) and an adjacent set of rasp blades (20) arranged end-to-end and extending circumferentially about the hub is used to progressively and sequentially removebands of surface material by cutting and then abrading as the hub and roller are rotated and one is moved axially relative to the other.

Abstract: A flexible membrane assembly for a wafer carrier in a CMP system. The flexible membrane assemble has a flat, flexible membrane joined to a rigid cylindrical sidewall.

Abstract: Spots generated on a glass substrate after a polishing step are reduced. The present invention relates to a method for polishing a glass substrate including injecting a silica abrasive and a high-boiling solvent in a final glass substrate polishing step. The high-boiling solvent is preferably a solvent having a molecular weight of 300 or lower and a boiling point of 150° C. or higher. As Examples of the high-boiling solvent having a molecular weight of 300 or lower and a boiling point of 150° C. or higher includes ethylene glycol, propylene glycol and glycerine.