Abstract: The invention provides a polishing pad that contains at least one light-transmitting region and optionally a polishing pad body. The light-transmitting region is composed of a material comprising (a) a polymeric resin and (b) at least one light-absorbing compound, and the light-transmitting region has a total light transmittance of about 25% or more at one or more wavelengths in a range of 250 nm to 395 nm.

Abstract: A method is provided to remove a thickness of a sputter target surface deformation layer to thereby achieve a reduced burn-in time during sputtering operations. The method comprises extrusion hone polishing of the target surface with a visco-elastic abrasive medium.

Abstract: Producing and using very low packing density ceramic abrasive grits comprising various fused aluminum oxide materials with or without other oxide additives, fused aluminum oxide-zirconium oxide co-fusions with or without other oxide additives, or sintered sol gel aluminum oxide materials with or without other oxide additives where the ceramic abrasive grains are preferably made by crushing bubbles of the material.

Abstract: Processing pads for mechanical and/or chemical-mechanical planarization or polishing of substrates in the fabrication of microelectronic devices, methods for making the pads, and methods, apparatus, and systems that utilize and incorporate the processing pads are provided. The processing pads include grooves or other openings in the abrading surface containing a solid or partially solid fill material that can be selectively removed as desired to maintain the fill at an about constant or set distance from the abrading surface of the pad and an about constant depth of the pad openings for multiple processing and conditioning applications over the life of the pad.

Abstract: A wafer polishing apparatus includes a rotatable turntable for holding a polishing pad and at least one rotatable polishing head adapted for attachment of at least one wafer alignment assembly. A wafer alignment assembly includes an upper plate and a lower plate connected by three lever assemblies symmetrically positioned about a wafer alignment assembly axis of rotation. Each of the lever assemblies comprises a spherical joint, an elongated cylindrical hinge, and a kinematic axis which intersects a center of rotation for the spherical hinge, an axis of rotation for the elongated cylindrical hinge, and a gimbal point about which a wafer may tilt during polishing. The gimbal point may be positioned above, coincident with, or below a working surface of a polishing pad by adjustment of the lever assemblies. Some embodiments of the invention comprise steps in a method for polishing a wafer in a wafer polishing apparatus.

Abstract: According to one embodiment, there is provided a polishing pad having a surface for the polishing processing of a polishing workpiece. Here, the polishing pad is made of a plate-shaped thermal shrinking material, and it has a half-cut portion cut to a particular depth from one principal surface.

Abstract: A glass substrate polishing method having polishing processes for polishing a glass substrate surface while supplying a polishing agent. The glass substrate polishing method is characterized in that the polishing processes include a first polishing process in which the surface of the glass substrate is polished using a first polishing pad made from a polishing cloth and a second polishing process in which the surface of the glass substrate is polished using a second polishing pad made from urethane foam.

Abstract: An aspect of the present disclosure relates to a chemical mechanical planarization pad including a first domain and a second continuous domain wherein the first domain includes discrete elements regularly spaced within the second continuous domain. The pad may be formed by forming a plurality of openings for a first domain within a second continuous domain of the pad, wherein the openings are regularly spaced within the second domain, and forming the first domain within the plurality of openings in second continuous domain. In addition, the pad may be used in polishing a substrate with a polishing slurry.

Abstract: A method capable of quickly polishing an angular portion formed by a grinded back surface and a circumferential surface of a substrate without causing damages on the thin substrate is provided. The method includes rotating the substrate about its center, and pressing a polishing tape against the angular portion formed by the back surface and the circumferential surface of the substrate to polish the angular portion.

Abstract: A method of polishing workpieces includes final tape polishing (FTP) a media disk by rotating the media disk; applying a liquid that is substantially pure to the media disk adjacent to an FTP tape; applying the FTP tape to the media disk at a pad load to polish the media disk, such that the liquid acts as a transient lubricant between the media disk and the FTP tape; and completing FTP. The FTP process is completely independent of the final disk lubricant, such that the final disk lubricant may be applied before or after FTP.

Abstract: Methods and apparatus provide for a conformable polishing head for uniformly polishing a workpiece. The polishing head includes an elastic polishing pad mounted on an elastic membrane that seals a cavity in the polishing head. The cavity is pressurized to expand the membrane and press the polishing pad down on the top surface of the workpiece, such that the polishing pad conforms to the surface and applies a substantially uniform pressure distribution across the workpiece and thereby uniformly removes material across high and low spots on the workpiece.

Abstract: A method includes a grinding step of forming the shape of a contact surface, a grooving step of roughening the shaped contact surface to form grooves therein, and a contact surface lapping step of lapping the contact surface having the grooves with a lapping film to form oil grooves for holding a lubricant oil. The surface roughness of the contact surface is such that the maximum height roughness Rz is 4 ?m or less, the mean length RSm of the roughness profile elements is 30 to 60 ?m, the skewness Rsk of the roughness profile is ?2.7 to ?0.6 (no unit), the reduced peak height Rpk is 0.09 ?m or less, and the reduced valley depth Rvk is 0.4 to 1.3 ?m.

Abstract: A polishing pad has a polishing layer including a non-foamed polyurethane, wherein the non-foamed polyurethane is a reaction cured body of a polyurethane raw material composition containing an isocyanate-terminated prepolymer obtained by reacting a prepolymer raw material composition containing a diisocyanate, a high-molecular-weight polyol and a low-molecular-weight polyol; an isocyanate modified body polymerized by adding three or more diisocyanates; and a chain extender, and the addition amount of the isocyanate-modified body is 5 to 30 parts by weight with respect to 100 parts by weight of the isocyanate-terminated prepolymer. The polishing pad hardly causes scratches on the surface of an object to be polished and has an improved dressing property.

Abstract: There are provided an abrasive tape capable of suppressing contamination of a magnetic disk due to shattered abrasive particles and smoothing the surface of the magnetic disk; a method for producing an abrasive tape; and a varnishing process. An abrasive tape 1 produced according to the method for producing an abrasive tape of the invention is used in a process for varnishing a magnetic disk and produced according to a process for preparing a slurry by kneading and dispersing abrasive particles 5 and a binding agent 6; a process for forming a coating film by applying the slurry on a support 2; a process for forming an abrasive particle layer 3 by hardening the coating film; and a process for forming a coating layer 4 on the surface of the abrasive particle layer 3.

Abstract: In an indexable insert having wide sides, inclined narrow sides are to be ground, that is to say the grinding allowance 38 is to be removed. To this end, the indexable insert is set in rotation about a driven axis of rotation between a clamping insert and a thrust bolt. Serving for the grinding is a grinding wheel which rotates about rotation axis and which has a circumferential surface 18a contoured in a circular shape and having a largest diameter and is composed of a leading region and a trailing region. The grinding wheel is guided relative to the indexable insert along the geometrical defining line which is formed by the generating line of the finished narrow side in the feed direction. The leading region tapering forwards effects preliminary grinding of the narrow side by longitudinal grinding, whereas the trailing region effects finish grinding by linear contact with the narrow side. The grinding wheel is held with the clamping flanges on a grinding spindle.

Abstract: A method for polishing a semiconductor wafer having a first side and a second side, the method includes polishing the first side using a Fixed Abrasive Polishing (FAP) with a polishing pad including fixedly bonded abrasives having an average particle size of 0.1-1.0 ?m; applying a cement layer with a thickness of at most 3 ?m to the polished first side; fixing the polished and cemented first side on a carrier plate of a polishing machine; and polishing the second side using a single-side chemical mechanical polishing.

Abstract: An arena cleaning machine includes cleaning members, such as pads or brushes supported on a carriage that provides stability to the cleaning members and situates them in a position to contact the surface of ice rink dasher boards. The cleaning members are moveable into a desired cleaning position by adjusting their position along the carriage. A driver of the machine can make several passes around the rink, cleaning successive strips on the dasher boards.

Abstract: A polishing pad, a polishing method and a method of forming a polishing pad are provided. The polishing pad includes a polishing layer and a plurality of arc grooves. The arc grooves are disposed in the polishing layer. Each of the arc grooves has two ends, and at least one end thereof has an inclined wall. The angle between the inclined wall of each groove and the surface plane of the polishing layer is less than 90 degree.

Abstract: A chemical mechanical polishing pad includes a polishing layer, a recess being formed in a polishing surface of the polishing layer, the polishing layer including a surface layer that forms at least an inner side of the recess, and a ratio (D1/D2) of an average opening ratio D1(%) to an average opening ratio D2(%) being 0.01 to 0.5, the average opening ratio D1 being an average opening ratio of the inner side of the recess when the polishing layer has been immersed in water at 23° C. for 1 hour, and the average opening ratio D2 being an average opening ratio of a cross section of the polishing layer that does not intersect the surface layer when the cross section has been immersed in water at 23° C. for 1 hour.

Abstract: In one embodiment, the present invention provides a buffer brush. When rotating, the buffer brush acts as a centrifugal pump. The buffer brush contains a core having a first side and a second side and the brush extends racially from the surface of the core. The first and second sides have at least one opening configured to allow air to flow laterally through the core. Vents on the surface of the cure are configured to allow air flowing laterally through the core to also flow radially through the vents into the brush.

Abstract: Provided is a process for producing a polishing liquid composition with which it is possible to give a polished work that has a reduced surface roughness and a reduced amount of particles. The process for producing a polishing liquid composition involves a step in which a raw silica dispersion containing colloidal silica having an average primary-particle diameter of 1-100 nm is filtered through a filter including a filter aid, the filter aid having an average pore diameter, as measured by the mercury intrusion method, of 0.1-3.5 ?m.

Abstract: A method for cutting by a traveling wire, wherein the wire traveling direction of the wire and/or the workpiece are/is inclined alternately in relation to one another into at least two different specific angular positions in the cutting direction, with the result that the effective cutting height (s) on the workpiece (2) becomes smaller than the entire workpiece height.

Abstract: 3D porous material comprises at least one machined side. The machined side has a solid percentage Ps being (1?Po), said Po is the porosity of the bulk of said 3D porous material and said Ps is within the 99.5% confidence interval. The present invention provides the method of manufacturing such 3D porous material. Preferably, the 3D porous material is open cell metal foam. The present invention also provides use of such open cell metal foam in a heat exchanger. The present invention further provides a heat exchanger comprising open cell metal foam.

Abstract: The disclosure is directed to conversion assemblages adapted for use in converting a surface modifying apparatus, such as a pole sander, whereby the conversion assemblage includes a generally rigid body assembly including first and second major surfaces opposing each other, the first major surface is adapted for receiving the supporting member, and the second major surface is attachable to a surface modifying member.

Abstract: A nonwoven abrasive wheel comprising one or more layers of a nonwoven fiber web, a plurality of super abrasive particles having a Vickers hardness greater than 40 GPa, a polyurethane binder adhering the plurality of super abrasive particles to the nonwoven fibers and adhering the layers of the nonwoven fiber web to each other, and wherein the nonwoven abrasive wheel comprises a Flexural Modulus from 4.0 to 128.0 lb/inch of thickness per inch of displacement.

Abstract: Disclosed is a substrate polishing method capable of minimizing a difference of polishing amounts between a center portion and a rim portion of a large scale plate during a plate polishing process.

Abstract: An example coating removal apparatus for a component includes a table having a first platform disposed along an axis. The platform is arranged to receive at least one fixture for holding a corresponding component. The coating removal apparatus also includes a removal device having a web. The table is slidably moveable in an axial direction and configured to move the fixture a pre-determined distance such that at least one portion of the component contacts the web to remove a coating of the component.

Abstract: Disclosed herein are abrasive filaments with improved stiffness and industrial brushes comprising the same, wherein the abrasive filaments are formed of polyamide compositions comprising, (a) at least one polyamide; (b) about 0.1-1 wt % of at least one linear chain extending compound that has a molecular weight of 1000 Daltons or lower; (c) about 0.1-1 wt % of at least one antioxidant; and (d) about 10-40 wt % of abrasive particles, with the total wt % of all components in the composition totaling to 100 wt %.

Abstract: An abrasive hand pad includes a coaled abrasive member secured to a nonwoven abrasive member. Methods of abrading a surface of a workpiece are also disclosed.

Abstract: To provide a polishing tool for a plastic lens, a method of polishing a plastic lens and a method of manufacturing a plastic lens, capable of suppressing a deterioration of a polishing efficiency while reducing a cost required for treating a polishing waste liquid generated during polishing applied to the plastic lens, wherein the polishing tool is used for adjusting and completing an optical surface of the plastic lens, and is composed of a single layer in which abrasive grains made of crystalline alumina are uniformly dispersed and fixed to a substance mainly composed of polyurethane resin having foamability.

Abstract: A method for manufacturing a semiconductor device makes it possible to efficiently polish with a polishing tape a peripheral portion of a silicon substrate under polishing conditions particularly suited for a deposited film and for silicon underlying the deposited film. The method includes pressing a first polishing tape against a peripheral portion of a device substrate having a deposited film on a silicon surface while rotating the device substrate at a first rotational speed, thereby removing the deposited film lying in the peripheral portion of the device substrate and exposing the underlying silicon. A second polishing tape is pressed against the exposed silicon lying in the peripheral portion of the device substrate while rotating the device substrate at a second rotational speed, thereby polishing the silicon to a predetermined depth.

Abstract: Methods, apparatus, and systems for polishing a substrate are provided. The invention includes an upper platen; a torque/strain measurement instrument coupled to the upper platen; and a lower platen coupled to the torque/strain measurement instrument and adapted to drive the upper platen to rotate through the torque/strain measurement instrument. In other embodiments, the invention includes an upper carriage; a side force measurement instrument coupled to the upper carriage; and a lower carriage coupled to the side force measurement instrument and adapted to support a polishing head. Numerous additional aspects are disclosed.

Abstract: A polishing liquid composition includes composite oxide particles containing cerium and zirconium, a dispersing agent, and an aqueous medium. A powder X-ray diffraction spectrum of the composite oxide particles obtained by CuK?1 ray (?=0.154050 nm) irradiation includes a peak (first peak) having a peak top in a diffraction angle 2? (? is a Bragg angle) range of 28.61 to 29.67°, a peak (second peak) having a peak top in a diffraction angle 2? range of 33.14 to 34.53°, a peak (third peak) having a peak top in a diffraction angle 2? range of 47.57 to 49.63°, and a peak (fourth peak) having a peak top in a diffraction angle 2? range of 56.45 to 58.91°. A half-width of the first peak is 0.8° or less.

Abstract: Polishing pads including organic particulates in a continuous polymer phase, and methods of making and using such pads in a polishing process. In one exemplary embodiment, the polishing pads include a multiplicity of polishing elements integrally formed in a sheet. In another exemplary embodiment, the polishing elements are bonded to a support layer, for example by thermal bonding. In certain embodiments, the polishing pad may additionally include a compliant layer affixed to the support layer, and optionally, a polishing composition distribution layer.

Abstract: An apparatus for chemical mechanical planarization includes a spindle assembly structure and at least one substrate carrier, which make a linear lateral movement relative to each other while abrasive surfaces of a plurality of cylindrical spindles in the spindle assembly structure contact, and rotate against, at least one substrate mounted on the at least one substrate carrier. The direction of the linear lateral movement is within the plane that tangentially contacts the plurality of cylindrical spindles, and can be orthogonal to the axes of rotation of the plurality of cylindrical spindles.

Abstract: A method of monitoring a thickness of a conductive film on a substrate during polishing of the substrate with use of an eddy current sensor is provided. This method includes: polishing the conductive film by pressing the substrate against a polishing surface on the rotating polishing table; obtaining output signal of the eddy current sensor during polishing; calculating an amount of output adjustment of the eddy current sensor using the output signal obtained when the substrate is not present above the eddy current sensor; with use of the amount of output adjustment, correcting the output signal obtained when the substrate is present above the eddy current sensor; and monitoring the thickness of the conductive film based on the corrected output signal.

Abstract: A fixed abrasive pad (100) in the form of a structured abrasive article is provided that has a structured abrasive layer (120) disposed on a backing (110). The structured abrasive layer (120) includes a polymeric binder, abrasive particles dispersed in the binder and a nonionic polyether surfactant dispersed in the binder. The abrasive particles have a mean particle size of less than 200 nm and the surfactant is in the binder in an amount of from 0.75 to 2.2 weight percent based upon the total weight of the structured abrasive layer. A method of abrading a workpiece using the provided fixed abrasive pad is also provided.

Abstract: The present invention discloses a method for surface-treating a mirror-finish stainless steel workpiece, which comprises steps: dividing the surface of a mirror-finish stainless steel workpiece into different grinding areas according to the depths of the scratches; selecting sand papers respectively having appropriate grit sizes for the grinding areas, and grinding the grinding areas to remove all the scratches; sequentially using three combinations of polishing agents and grinding materials to undertake polishing; and using an abrasive paste and a fourth grinding material to perform mirror-finishing.

Abstract: Disclosed are an orbital smoothing device for smoothing a surface of a substrate and a method of smoothing a surface of a substrate using the orbital smoothing device. The orbital smoothing device includes a rotatable plate that is driveable by a motor in at least one of a clockwise or a counterclockwise direction and a plurality of smoothing pad assemblies coupled to said plate. Each of the plurality of smoothing pad assemblies is capable of independent rotation in both clockwise and counterclockwise directions and includes a shaft for coupling each of said smoothing pad assemblies to the rotatable plate, means for providing independent rotation in both clockwise and counterclockwise directions mounted on the shaft and securable in a pad holder and a pad holder for receiving and securing the means for independent rotation. The pad holder has removably mounted thereon a smoothing pad capable of smoothing the surface of the substrate when the rotatable plate is driven by the motor.

Abstract: A polishing pad, a polishing method and a method of forming a polishing pad are provided. The polishing pad includes a polishing layer and a plurality of arc grooves. The arc grooves are disposed in the polishing layer. Each of the arc grooves has two ends, and at least one end thereof has an inclined wall. The angle between the inclined wall of each groove and the surface plane of the polishing layer is less than 90 degree.

Abstract: A method of form transfer grinding a three-dimensional shape utilizes a form transfer tool over which a belt is driven. The form transfer tool includes a shape that is desired in the finished part and guides a belt that grinds an area of a part to a finished or nearly finished condition.

Abstract: A self-bonded foamed abrasive article and a method of machining using such an article. The machining method includes providing a workpiece having a worksurface and removing material from the worksurface by moving an abrasive relative to the worksurface, wherein the abrasive comprises a foamed abrasive body consisting of abrasive grains and a porosity of at least about 66 vol %.

Abstract: A polishing pad used in conjunction with a carrier ring to polish a substrate and has a motion direction when polishing is provided. The carrier ring has at least one carrier groove, and the substrate has a substrate radius. The polishing pad has a polishing layer and a surface pattern. The surface pattern has traversing grooves, and an angle between the tangent line of each traversing groove and the tangent line of the motion direction is not equal to 0 degree. Each traversing groove respectively has a traversing groove trajectory corresponding to the motion direction, and the traversing groove trajectory of the traversing groove has a trajectory width smaller than the substrate radius. At leading region of the carrier ring corresponding to the motion direction, the traversing grooves have at least one carrier compatible groove which aligns with the at least one carrier groove of the carrier ring.

Abstract: The disclosure is directed to polishing pads with porous polishing layers, methods of making such polishing pads, and methods of using such pads in a polishing process. The polishing pad includes a compliant layer having first and second opposing sides and a porous polishing layer disposed on the first side of the compliant layer. The porous polishing layer includes a crosslinked network comprising a thermally cured component and a radiation cured component, wherein the radiation cured component and the thermally cured component are covalently bonded in the crosslinked network. The porous polishing layer also includes polymer particles dispersed within the crosslinked network, wherein the polymer particles comprise at least one of thermoplastic polymers or thermoset polymers. The porous polishing layer typically also includes closed cell pores dispersed within the crosslinked network.

Abstract: A structured abrasive article includes a backing having a structured abrasive layer disposed on and secured thereto. The structured abrasive layer includes shaped abrasive composites that comprise abrasive particles and nonionic polyether surfactant dispersed in a crosslinked polymeric binder. The abrasive particles have a mean particle size of less than 10 micrometers. The nonionic polyether surfactant is not covalently bound to the crosslinked polymeric binder and is present in an amount of from 2.5 to 3.2 percent by weight based on a total weight of the shaped abrasive composites. The structured abrasive articles are useful for abrading a workpiece.

Abstract: A method for manufacturing a polishing pad prevents slurry leaks and provides a pad that can be used to provide high optical detection accuracy. The method for manufacturing a polishing pad includes forming a groove for injecting a light-transmitting region forming material on the back surface of a polishing layer; injecting the light-transmitting region forming material into the groove and curing the material to form a light-transmitting region; and buffing the front surface of the polishing layer to expose the light-transmitting region on the front surface.

Abstract: Provided is a novel high-nitrogen stainless-steel pipe which is not obtained with any conventional technique, the stainless-steel pipe having high strength, high ductility, and excellent corrosion and heat resistance and being obtained through size reduction of crystal grains and strengthening by slight plastic working besides formation of a gradient structure in which the concentration of solid-solution nitrogen continuously decreases gradually from the surface. Also provided are hollow materials of various shapes and sizes which are formed from the steel pipe and processes for producing the steel pipe and the hollow materials. An austenitic stainless-steel pipe is treated in a range of the temperatures not higher than the critical temperature for crystal grain enlargement of the steel pipe material to cause nitrogen (N) to be absorbed into the surface of the pipe and diffused into the solid phase, while minimizing the enlargement of crystal grains during the treatment.

Abstract: The polishing liquid according to the embodiment comprises abrasive grains, an additive and water, wherein the abrasive grains include a tetravalent metal element hydroxide, and produce a liquid phase with a nonvolatile content of 500 ppm or greater when an aqueous dispersion with a content of the abrasive grains adjusted to 1.0 mass % has been centrifuged for 50 minutes at a centrifugal acceleration of 1.59×105 G.

Abstract: A method of processing an article with a coated abrasive product, including a repeat of a single marking, comprises detecting at least two characteristics of the repeat of a single marking. The repeat is placed along the length of the abrasive product at a first major surface, wherein each of the detected characteristics conveys independent information regarding the abrasive product. The method further includes comparing the information to a database. A method of acquiring information of the coated abrasive product includes detection and comparing steps.

Abstract: Polishing pads containing a phase-separated polymer blend, and methods of making and using such pads in a polishing process. In one exemplary embodiment, the polishing pads include a multiplicity of polishing elements integrally formed in a sheet. In another exemplary embodiment, the polishing elements are bonded to a support layer, for example by thermal bonding. In certain embodiments, the polishing pad may additionally include a compliant layer affixed to the support layer, and optionally, a polishing composition distribution layer.