Abstract: The disk-shaped substrate inner circumference polishing method for polishing an inner circumference of a disk-shaped substrate including a portion having an opening hole at the center thereof includes inserting a brush having a shaft core into the portion having the opening hole of the disk-shaped substrate; fixing one end and the other end of the brush to a pair of rotating shafts that are provided at mutually detached positions and pulling at least any one of the one end and the other end of the brush and applying tension in the axial direction to the shaft core of the brush; and rotating the brush and polishing the inner circumference of the disk-shaped substrate.

Abstract: Methods and apparatus provide for a conformable polishing head for uniformly polishing a workpiece. The polishing head includes an elastic polishing pad mounted on an elastic membrane that seals a cavity in the polishing head. The cavity is pressurized to expand the membrane and press the polishing pad down on the top surface of the workpiece, such that the polishing pad conforms to the surface and applies a substantially uniform pressure distribution across the workpiece and thereby uniformly removes material across high and low spots on the workpiece.

Abstract: A retainer ring and a method of using the retainer ring are provided. The retainer ring has openings along a bottom surface. Grooves encompass the openings and extend to an interior portion of the retainer ring wherein a semiconductor wafer may be held. In operation, a semiconductor wafer is placed inside the retainer ring. As the retainer ring and the semiconductor wafer are moved relative to an underlying polishing pad, slurry is dispensed through the openings in the retainer ring. The grooves in the retainer ring allow the slurry to flow from the openings to the interior portion of the retainer ring and the semiconductor wafer.

Abstract: A method for manufacturing chemical mechanical polishing pad polishing layers that minimizes entrained gas inclusion defects is provided. Also provided is a mix head assembly for use in the manufacture of chemical mechanical polishing pad polishing layers, wherein inclusions of entrained gas inclusion defects are minimized.

Abstract: A method for manufacturing a glass substrate for an information recording medium having a high level of cleanness and superior smoothness. The manufacturing method includes washing a disk-shaped glass plate with an acid washing liquid, removing at least part of a surface layer, which is formed on the surface of the glass plate, by performing grinding with diamond abrasion grains, and washing the surface with a neutral or alkaline washing liquid.

Abstract: The invention concerns a sanding element with a succession of overlapping lamellas (3, 4) comprising sanding grains (9), characterized in that these lamellas (3, 4) are alternately formed of sanding lamellas (3) and compressible lamellas (4), whereby each sanding lamella (3) rests on a compressible lamella (4).

Abstract: A conditioning process including the steps of: (a) providing a system including: (i) a workpiece having a metal working surface; (ii) a contact surface, disposed generally opposite the working surface, the contact surface including an organic, polymeric material and (iii) a plurality of particles, including abrasive particles, the plurality of particles disposed between the contact surface and the working surface, and (b) treating the workpiece so as to: (i) effect an at least partially elastic interaction between the contact surface and the abrasive particles such that at least a portion of the abrasive particles penetrate the working surface, and (ii) incorporate organic particles into the metal working surface, thereby producing a modified working surface, wherein the treating of the workpiece includes a lapping process including: (i) exerting a load on the contact surface and the metal working surface, and (ii) applying a relative motion between the metal working surface and the contact surface.

Abstract: A bowling ball abrader and polisher utilizes cooperative rotational inter-engagement between a cup-shaped abrading an polishing tool and a non-motorized rotating ball holder assembly to obtain even, concentric abrasion patterns on a bowling ball surface. Upon placement of a bowling ball in a ball cradling surface formed in the rotating ball holder, application of the rotating abrading and polishing tool on the surface of the bowling ball causes a corresponding rotation of the bowling ball using the non-motorized rotating ball holder, which enables the outer surface of the bowling ball to be more uniformly abraded and polished.

Abstract: A method of reducing the surface roughness of articulating surfaces of orthopaedic implants is provided. The method includes the steps of providing an abrasive particle providing a chemical including at least one of an oxidant, a corrosion inhibitor, a complexing agent and a surfactant, combining the chemical with the abrasive particle to form a slurry, and polishing the implant with the slurry.

Abstract: A polishing pad can include a first layer and a second layer. The first layer can have a first polishing surface and a first opening. The second layer can have an attaching surface and a second opening substantially contiguous with the first opening. The polishing pad can further include, a pad window lying within the first opening. The pad window can include a second polishing surface. When the pad would be attached to a platen, the first and second polishing surfaces can lie along a same plane, and an opposing surface of the pad window can abut an exterior surface of a platen window. In another aspect, a polishing apparatus can include an exterior surface of a platen window abutting the polishing pad. In still another aspect, a process of polishing can include polishing a workpiece such that the pad window contacts the workpiece and the platen window simultaneously.

Abstract: A polishing method, a polishing pad and a polishing system are provided. In the invention, the polishing pad is used to polish a polishing article. The polishing pad includes a polishing layer and a surface pattern disposed in the polishing layer. The polishing layer includes a polishing surface, a rotating central region, and a peripheral region. The surface pattern includes many grooves distributed from near the rotating central region and extending outward to near the peripheral region. The grooves include many groove cross sections along a circumferential direction of a same radius. Each of the groove cross sections has a left sidewall and a right sidewall. An included angle is formed by the polishing surface and one of a group of the left sidewalls and a group of the right sidewalls. The included angle is an obtuse angle.

Abstract: It is an object of the invention to provide a polishing pad capable of high precision optical detection of an endpoint during polishing in progress and prevention of slurry leakage from between a polishing region and a light-transmitting region during the use thereof even after the polishing pad has been used for a long period. It is a second object of the invention to provide a polishing pad capable of suppression of deterioration of polishing characteristics (such as in-plane uniformity) and generation of scratches due to a difference in behavior of a polishing region and a light-transmitting region during polishing. It is a third object of the invention to provide a polishing pad having a polishing region and a light-transmitting region with a concentration of a specific metal equal to or lower than a specific value (threshold value).

Abstract: Disclosed is a polishing method for polishing a surface of a structure for magnetic-head manufacture by CMP in the process of manufacturing a magnetic head using a ceramic substrate made of a ceramic material containing AlTiC, the structure including the ceramic substrate and one or more layers formed thereon, and having the surface to be polished. The polishing method uses a retainer ring made of a ceramic material containing AlTiC.

Abstract: The abrasion machining method according to the invention, for abrading a part that cannot be machined by conventional means, comprises the following steps: a pin is placed at a certain distance from the part to be machined, so that there is no contact between the part and the pin; the pin is driven so as to rotate; an abrasive liquid is injected between the rotating pin and the part in order to abrade the latter; and the pin is moved translationally along the part. Thanks to the method, the part may be machined precisely and reproducibly.

Abstract: A flap sander is disclosed for use with a workpiece having a nonlinear profile. The flap sander comprises a cylindrical rotary head including a central hub concentric with an axis of rotation of the rotary head, and an inclined surface extending radially outward from the central hub. A plurality of abrasive flaps are detachably secured to the inclined surface of the rotary head and are aligned in a radial array radiating outward from central hub to the periphery of the rotary head. Each of the abrasive flaps comprises an unsecured working edge having a nonlinear profile that substantially matches the profile of the workpiece to provide an even sanding distribution across the workpiece profile independent of the shape of the profile.

Abstract: The present invention relates to a substrate polishing apparatus and a substrate polishing method for polishing a substrate such as a semiconductor wafer to a flat finish. The substrate polishing apparatus includes a polishing table (100) having a polishing surface (101), a substrate holder (1) for holding and pressing a substrate (W) against the polishing surface (101) of the polishing table (100), and a film thickness measuring device (200) for measuring a thickness of a film on the substrate (W). The substrate holder (1) has a plurality of pressure adjustable chambers (22 to 25), and pressures in the respective chambers (22 to 25) are adjusted based on the film thickness measured by the film thickness measuring device (200).

Abstract: A surface treatment method that enables a surface of an electrostatic chuck to be smoothed, so as to improve the efficiency of heat transfer between the surface of the electrostatic chuck and a substrate. The electrostatic chuck is provided in an upper portion of a susceptor provided in a chamber of a substrate processing apparatus. In the surface treatment of the electrostatic chuck, a sprayed coating film is formed on the surface of the electrostatic chuck, next the surface of the electrostatic chuck is ground by bringing into contact therewith a grindstone, then the surface of the electrostatic chuck is ground flat by bringing into contact therewith a lapping plate onto a surface of which is sprayed a suspension, and then the surface of the electrostatic chuck is ground smooth by bringing into contact therewith a tape of a tape lapping apparatus.

Abstract: A method for fabricating a solar cell. The method includes providing a thin metallic substrate in roll form. The method also includes applying an abrasive grit to a surface of the thin metallic substrate. The method includes mechanical-polishing the surface with the abrasive grit such that the surface is polished to remove at least one defect from the surface. Mechanical-polishing the surface of the thin metallic substrate is by a roll-to-roll polishing process of the surface of the thin metallic substrate. Moreover, the method includes depositing an absorber layer of the solar cell on the thin metallic substrate.

Abstract: A hand-held, manually-operated sanding tool includes a base body, a handle, and a coupling device. The base body defines an aperture extending from a first surface of the base body to a second surface of the base body. The handle includes a grip and a post. The coupling device is coupled with the post of the handle through the aperture. The handle and the coupling device are positioned near opposite surfaces of the base body to rotatably couple the handle to the base body such that the handle is rotatable about an axis defined by the post.

Abstract: The polishing pad (104) is useful for polishing at least one of magnetic, optical and semiconductor substrates (112) in the presence of a polishing medium (120). The polishing pad (104) includes a three-dimensional network of interconnected unit cells (225). The interconnected unit cells (225) are reticulated for allowing fluid flow and removal of polishing debris. A plurality of polishing elements (208, 308 and 408) form the three-dimensional network of interconnected unit cells (225). The polishing elements (208, 308 and 408) have a first end connected to a first adjacent polishing element at a first junction (209, 309 and 409) and a second end connected to a second adjacent polishing element at a second junction (209, 309 and 409) and having a cross-sectional area (222, 322 and 422) that remains within 30% between the first and the second junctions (209, 309 and 409).

Abstract: It is intended to produce a high-quality purified surface-treated granular substance and processed substance through, without application of excessive pressure or temperature, efficient grinding of a surface layer region of feedstock granular substance by means of simple apparatus and operation to thereby remove unwanted portions, such as surface nonedible portion, oxidizing coating layer and attachment, without denaturation, decomposition or elimination or useful matter. Feedstock granular substance (7) is fed into cylindrical retention tube (3) provided with a multiplicity of retention parts (8) for retaining of granular substance (7) moving along the inner circumference thereof.

Abstract: Embodiments herein provide polishing pads that produce high post-polish planarity, such as on a wafer substrate or other substrates. Exemplary pads include a bulk matrix and embedded polymer particles. Pads according to embodiments herein may be used to remove material over a composite substrate, comprised of two or more different materials, or a substrate comprised of a single material.

Abstract: A finishing device for finishing the exterior, flutes and tip of a drill bit is disclosed. The finishing device includes a containment vessel which houses an abrasive media which may have a visco-elastic component and an abrasive component. The drill bit is inserted into or through the abrasive media and rotated. A rotary member may be connected to the shank of the drill bit to provide rotation of the drill bit. The drill bit displaces the abrasive media thereby finishing the exterior, flutes, cutting edges and tip of the drill bit.

Abstract: A polishing apparatus has a polishing tape (21), a supply reel (22) for supplying the polishing tape (21) to a contact portion (30) at which the polishing tape (21) is brought into contact with a notch portion (11) of a substrate (10), and a take-up reel (23) for winding up the polishing tape (21) from the contact portion (30). The polishing apparatus also has a first guide portion (24) having as guide surface (241) for supplying the polishing tape (21) directly to the contact portion (30), and a second guide portion (25) having a guide surface for supplying the polishing tape (21) tot the take-up reel (23). The guide surface (241) of the first guide portion (24) and/or the guide surface of the second guide portion (25) has a shape corresponding to a shape of the notch portion (11) of the substrate (10).

Abstract: The present invention provides a polishing head 1 comprising a carrier 3, a guide ring 4, a dress ring 5, and a head body 2, wherein the head body 2 is rotatable, and holds the carrier 3, the guide ring 4, and the dress ring 5; the head body 2 has a reversed-bowl shape and has a hollow 8; the dress ring, and at least the guide ring or the carrier are held by being coupled to a lower brim of the head body via a diaphragm 6; the hollow of the head body is sealed. During polishing, the pressure of the sealed hollow is adjusted with a pressure regulating mechanism 9 communicating with the hollow, thereby elastically deforming the diaphragm. As a result, a wafer W can be polished while the wafer and the dress ring are pressed with a given pressing force against a polishing pad 11 on a turn table 12 with rotating the wafer held by the carrier and the dress ring.

Abstract: A polishing tool comprising a support member, and polishing means fixed to the support member. The polishing means is composed of felt having a density of 0.20 g/cm3 or more and a hardness of 30 or more, and abrasive grains dispersed in the felt. A polishing method and apparatus involving pressing the polishing means against a surface of a workpiece to be polished, while rotating the workpiece and also rotating the polishing tool.

Abstract: A method is provided to remove a thickness of a sputter target surface deformation layer to thereby achieve a reduced burn-in time during sputtering operations. The method comprises extrusion hone polishing of the target surface with a visco-elastic abrasive medium.

Abstract: A faux stainless steel sheet material of ferrous carbon sheet steel core is polished in a polishing apparatus comprising a series of commercially available polishing heads each of which utilizes a polishing belt of a predetermined grit mesh and size, belt speed, belt oscillations transverse to the sheet steel conveyed direction, at predetermined conveyance rate of the sheet steel and pressure. The polishing heads scratch the material surface wherein the scratches mimic a stainless steel finish such as #4 stainless steel finish (80 mesh). An example and sample are described in one embodiment of the invention.

Abstract: An abrasive polishing net with a stickable fiber layer includes an abrasive polishing net layer and a stickable fiber layer. This abrasive polishing net layer is consisted by metal meshes and has an outer surface, an inner surface and multiple conduits. The adhesive polishing net layer is coated with a wear-resistant coating wrap that includes many tiny wear-resistant particles and an adhering portion. The wear-resistant particle is composed of silicon carbide and zirconia. The stickable fiber laye is composed by fibers. Spaces are disposed among these fibers for allowing needle structures to insert in. The stickable fiber layer further includes a gluing layer for adhering with the abrasive polishing net layer. So, the abrasive polishing net layer has sufficient strength. The fibers provide excellent adhering force. Plus, the stickable fiber layer has many openings for expelling polishing debris.

Abstract: An embodiment of a tool includes a tool body. A base is coupled to the tool body and a pad is coupled to the base. The tool includes a working material coupled to the pad.

Abstract: The present invention relates to a substrate polishing apparatus and a substrate polishing method for polishing a substrate such as a semiconductor wafer to a flat finish. The substrate polishing apparatus includes a polishing table (100) having a polishing surface (101), a substrate holder (1) for holding and pressing a substrate (W) against the polishing surface (101) of the polishing table (100), and a film thickness measuring device (200) for measuring a thickness of a film on the substrate (W). The substrate holder (1) has a plurality of pressure adjustable chambers (22 to 25), and pressures in the respective chambers (22 to 25) are adjusted based on the film thickness measured by the film thickness measuring device (200).

Abstract: A tool for moving an abrasive media can include a tool body and a drive system housed in the tool body. The drive system can include an output member. A retaining member can be disposed on the tool body. A first platen having a first attachment hub can be selectively coupled with the retaining member in an installed position The first platen can have a first rotatable member that selectively attaches to the output member in a first mode of operation. A second platen having a second attachment hub can selectively couple with the retaining member in an installed position. The second platen can have a second rotatable member that selectively attaches to the output member in a second mode of operation.

Abstract: Methods for cylindrical grinding a workpiece are disclosed. The method includes cylindrical grinding, with a bonded abrasive wheel having a permeable structure that includes interconnected porosity, a workpiece at a specific cutting energy of less than about 12 Hp/in3·min (29.7 J/mm3), and a material removal rate of at least about 1 in3/min·in (10.8 mm3/sec/mm)grinding. The bonded abrasive wheel may include at least about 3 volume percent of a filamentary sol-gel alpha-alumina abrasive grain having an average length-to-cross-sectional-width ratio of greater than about 4:1, or agglomerates thereof. In one embodiment, the workpiece is ground in the presence of a water soluble oil.

Abstract: Chemical mechanical polishing pads having an electrospun polishing layer are provided, wherein the electrospun polishing layer has a polishing surface that is adapted for polishing a semiconductor substrate. Also provided are methods of making such chemical mechanical polishing pads and for using them to polish semiconductor substrates.

Abstract: A sheet-like abrasive article includes a resilient backing sheet having opposed major surfaces and a continuous abrasive sheet affixed to the backing sheet. The abrasive sheet includes an abrasive support layer with abrasive particles arranged thereon, thereby defining an abrasive surface. A sanding tool assembly including such a sheet-like abrasive article is also disclosed.

Abstract: Disclosed is a burnishing tape, a method of producing the same and a method of burnishing a magnetic disk with which a surface of the magnetic disk may be smoothed while contamination of a magnetic disk caused by crushed abrasive grains is prevented. A burnishing tape (1) manufactured by the method of manufacturing of the burnishing tape according to an embodiment of the invention is used to burnish the magnetic disk. The method includes: kneading and dispersing abrasive grains (5) and a binder (6) to prepare slurry; applying the slurry on the support (2) to form a coating layer; curing the coating layer to form an abrasive grain layer (3); and forming a liquid lubricant layer (4) on a surface of the abrasive grain layer (3).

Abstract: There are provided an abrasive tape capable of suppressing contamination of a magnetic disk due to shattered abrasive particles and smoothing the surface of the magnetic disk; a method for producing an abrasive tape; and a varnishing process. An abrasive tape 1 produced according to the method for producing an abrasive tape of the invention is used in a process for varnishing a magnetic disk and produced according to a process for preparing a slurry by kneading and dispersing abrasive particles 5 and a binding agent 6; a process for forming a coating film by applying the slurry on a support 2; a process for forming an abrasive particle layer 3 by hardening the coating film; and a process for forming a coating layer 4 on the surface of the abrasive particle layer 3.

Abstract: A sheet of sandpaper includes a backing layer having opposed first and second major surfaces, an adhesive make coat on the first major surface, abrasive particles at least partially embedded in the make coat, thereby defining an abrasive surface, and a non-slip coating layer on the second major surface. Methods of making and using such sandpaper are also provided.

Abstract: To provide a method of polishing an end face of a multi-fiber optical connector capable of eliminating recesses produced in core parts of multi-mode optical fibers. A polishing base is prepared, comprising a soft material having a Shore hardness of less than 30 and a film having a thickness of less than 75 ?m, without including any polishing material, on said soft material, and further comprising a polishing material on said film. Next, a multi-fiber optical connector having a plurality of multi-mode optical fibers is arranged so that the tip of the multi-mode optical fibers come into contact with the upper surface of the film with a predetermined pressure. Next, the tip of the multi-mode optical fibers are polished by moving at least one of the polishing base and the multi-fiber optical connector while maintaining the contact between the tip of the multi-mode optical fibers and the upper surface of the film.

Abstract: Disclosed herein is a polishing method for polishing the end surface of a wafer by using a polishing tape, wherein the end surface of the wafer is polished in the condition where a polishing liquid containing an oxidizing agent is supplied to the end surface of the wafer.

Abstract: Methods and apparatus for providing a flushing system for flushing a top surface of an optical head. The flushing system includes a source of gas configured to provide a flow of gas, a delivery nozzle, a delivery line that connects the source of gas to the delivery nozzle, a vacuum source configured to provide a vacuum, a vacuum nozzle, and a vacuum line that connects the vacuum source to the vacuum nozzle. The source of gas and the delivery nozzle are configured to direct a flow of gas across the top surface of the optical head. The vacuum nozzle and vacuum sources are configured so that the flow if gas is laminar.

Abstract: Methods and apparatus are provided for housing a polishing tape adapted to polish a substrate. The invention includes a cassette comprising a body portion; and a head portion, wherein the head portion includes: a pair of guide walls; one or more supply rollers positioned between the guide walls in the head portion; and wherein the guide walls are adapted to guide a polishing tape housed in the body over the one or more supply rollers. Numerous other aspects are provided.

Abstract: A method of form transfer grinding a three-dimensional shape utilizes a form transfer tool over which a belt is driven. The form transfer tool includes a shape that is desired in the finished part and guides a belt that grinds an area of a part to a finished or nearly finished condition.

Abstract: A polishing pad and a method of producing a polishing pad. The method includes providing a mold, having a first cavity and a second cavity, wherein the first cavity defines a recess, providing a polymer matrix material including void forming elements in the recess, forming a polishing pad and removing at least a portion of the elements from the polishing pad forming void spaces within the polishing pad by one of a chemical method or mechanical method, prior to use in chemical/mechanical planarization procedures.

Abstract: Floor sanding sponge pads (as referred to as “sponge pads”) are designed to sand both raw (unfinished) or treated (finished with stain, sealer, polyurethane, etc.) floors in order to smooth out surface roughness while applying a sufficient surface texture to allow subsequent application of finish to properly adhere. The sponge pad may have a vacuum hole configuration to remove swarf from the work surface.

Abstract: A method is disclosed for treating or maintaining a hard surface comprising a stone or stone-like material, the method comprising treatment of the surface with a flexible pad, in the presence of abrasive particles, bonded to the pad, on a contact surface between the pad and the hard surface, wherein the abrasive particles comprise diamond particles, and the treatment is performed in the absence of an effective amount of crystallization agent on the contact surface. The treatment is performed on a substantially regular basis, such as daily, weekly or monthly, and the treatment is performed using a pad comprising an open, lofty, three dimensional non-woven webs of fibers. A tool for use in the method is also provided, as well as a floor-surfacing machine comprising such a tool and a method for manufacturing such a tool. Furthermore, methods for treating or maintaining hard, smooth surfaces such as wood, polymer material, lacquer, linoleum, gelcoat, glass and automotive enamel are disclosed.

Abstract: A pedestal pad (workpiece supporting table pad) is arranged on the top of a pedestal (workpiece supporting table) for temporarily placing and holding a pre-polished or post-polished wafer (workpiece). This pedestal pad is formed of resin, and at least a surface of the pedestal pad which comes into contact with the wafer is non-absorbable to a fluid. The tissue of the pedestal pad is dense and smooth, and does not have any cavity, such as fine holes, which holds the fluid.

Abstract: An aspect of the present invention comprises an integrally molded brush comprising a base and bristles extending from said base, further comprising a moldable composition that includes a dispersed phase comprising ultra-high molecular weight polyethylene. Another aspect of the present invention is a method of making an integrally molded brush comprising the steps of providing a moldable composition comprising a dispersed phase of ultra-high molecular weight polyethylene; causing said moldable composition to become a flowable material; shaping said flowable material; and hardening said flowable material.

Abstract: The present disclosure relates to a polishing pad including a chemical agent present in an amount sufficient to be released and dissolving into an aqueous abrasive particle polishing medium during chemical mechanical planarization and reducing abrasive particle agglomeration and a binder. The pad includes a surface such that as the pad is abraded the surface is renewed exposing at least a portion of the chemical agent.

Abstract: The invention provides methods and apparatus for automated contamination removal in association with integrated circuit manufacturing and testing. Disclosed embodiments include methods for cleaning electrical contacts of integrated circuit packages with steps for transporting the package from a first position to a second position and, during the transit, bringing the electrical contacts into engagement with one or more cleaning station. Aspects of the disclosed apparatus include a package transit chute for moving packages from a first position to a second position and one or more cleaning stations between the first and second positions. The cleaning stations further include one or more cleaning mats positioned for cleaning electrical contacts of packages transported in the chute.