Side Face Of Disk Patents (Class 451/63)
  • Patent number: 9697862
    Abstract: A disk-shaped glass substrate for a magnetic-disk glass substrate includes an outer circumference having a roundness of 1.3 ?m or less. A first reference circle is obtained with a least squares method from a first outline corresponding to a shape of a lap around the outer circumference. A second reference circle is obtained with a least squares method from a second outline obtained by performing low-pass filtering using a period in which the number of peaks per lap is 150 as a cut-off value on the first outline. A ratio of the second peak count value defined by the number of peaks of the second outline that project outward in a radial direction from the second reference circle to the first peak count value defined by the number of peaks of the first outline that project outward in a radial direction from the first reference circle is 0.2 or less.
    Type: Grant
    Filed: June 27, 2014
    Date of Patent: July 4, 2017
    Assignee: HOYA CORPORATION
    Inventor: Ryuichi Kashima
  • Patent number: 9275874
    Abstract: Methods for fabricating integrated circuits using chemical mechanical planarization (CMP) for recessing metal are provided. In an embodiment, a method for fabricating an integrated circuit includes filling a trench with a metal and forming an overburden portion of the metal outside of the trench. The method further includes performing a planarization process with an etching slurry to remove the overburden portion of the metal and to recess the metal within the trench.
    Type: Grant
    Filed: August 30, 2013
    Date of Patent: March 1, 2016
    Assignees: GLOBALFOUNDRIES, INC., INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Kunaljeet Tanwar, Xunyuan Zhang, Donald Canaperi, Raghuveer Patlolla
  • Patent number: 9033764
    Abstract: The present invention provides: a method of polishing an object to be polished for processing a surface of the object to be polished into a concave or convex state with a high degree of accuracy; and a polishing pad. An object to be polished is placed on a polishing pad over the boundary between the first polishing region and the second polishing region, the first polishing region has grooves and the second polishing region has grooves different from those of the first polishing region, and either one of the two regions being formed on a region on the center side, and the other on the outer side in a radial direction on the surface of the polishing pad; and the object to be polished is polished by rotating the polishing pad and the object to be polished.
    Type: Grant
    Filed: September 6, 2011
    Date of Patent: May 19, 2015
    Assignee: NGK Insulators, Ltd.
    Inventors: Kazumasa Kitamura, Tomoki Nagae
  • Patent number: 8986071
    Abstract: A parts carrier assembly for a grinding machine includes an annular parts carrier and a bearing insert. The annular parts carrier includes an upper surface, a lower surface, an inner edge, an outer edge, and a plurality of loading apertures. The inner edge is configured to engage a driving wheel of the grinding machine. The driving wheel rotates about a central axis resulting in rotation of the parts carrier about an offset axis, which is offset from the central axis. The loading apertures are configured to receive parts to be ground by the grinding machine. The bearing insert includes an inner bearing surface complementary in shape to the outer edge of the parts carrier. The outer surface the parts carrier bears against the inner bearing surface of the bearing insert as the parts carrier rotates about the offset axis.
    Type: Grant
    Filed: December 6, 2011
    Date of Patent: March 24, 2015
    Assignee: White Drive Products, Inc.
    Inventor: Hollis N. White, Jr.
  • Patent number: 8974267
    Abstract: An insert carrier is configured to receive at least one semiconductor wafer for double-side processing of the wafer between two working disks of a lapping, grinding or polishing process. The insert carrier includes a core of a first material that has a first surface and a second surface, and at least one opening configured to receive a semiconductor wafer. A coating at least partially covers the first and second surfaces of the core. The coating includes a surface remote from the core that includes a structuring including elevations and depressions. A correlation length of the elevations and depressions is in a range of 0.5 mm to 25 mm and an aspect ratio of the structuring is in a range of 0.0004 to 0.4.
    Type: Grant
    Filed: December 6, 2011
    Date of Patent: March 10, 2015
    Assignee: Siltronic AG
    Inventors: Georg Pietsch, Michael Kerstan
  • Patent number: 8926400
    Abstract: An apparatus, system, and method are provided for reducing edge damage of a disk during chemical mechanical polishing. The apparatus includes a disk carrier configured to receive a disk, the disk having an outside edge and an inside edge, a raised ring adjacent the outside edge of the disk and extending from a surface of the disk carrier to a height greater than a height of the disk, and a raised column adjacent the inside edge of the disk and having a height greater than a height of the disk. The system includes a disk carrier for receiving a disk, a raised ring adjacent the outside edge of each opening, and plugs insertable into a central opening in the disk and having a height greater than a height of the disk. The method includes providing the apparatus, inserting a disk into the apparatus, and polishing the disk.
    Type: Grant
    Filed: March 7, 2012
    Date of Patent: January 6, 2015
    Assignee: HGST Netherlands B.V.
    Inventors: Neale M. Jones, Kurt A. Rubin
  • Patent number: 8888560
    Abstract: Disclosed is a substrate polishing method capable of minimizing a difference of polishing amounts between a center portion and a rim portion of a large scale plate during a plate polishing process.
    Type: Grant
    Filed: January 29, 2013
    Date of Patent: November 18, 2014
    Assignee: LG Chem, Ltd.
    Inventors: Kyoung-Hoon Min, Ye-Hoon Im, Dae-Yeon Lee, Jae-Ik Song, Su-Chan Park
  • Patent number: 8834230
    Abstract: The present invention is a wafer polishing method including simultaneously polishing both surfaces of a wafer by pressing and rubbing the wafer, while holding the wafer with: a lower turn table having a flat polishing-upper-surface rotationally driven; an upper turn table having a flat polishing-lower-surface rotationally driven, the upper turn table being arranged with facing to the lower turn table; and a carrier having a wafer-holding hole for holding the wafer, wherein the polishing is performed while measuring a thickness of the wafer through a plurality of openings provided between a rotation center and an edge of the upper turn table or the lower turn table, and switching a polishing slurry with a polishing slurry having a different polishing rate during the polishing of the wafer. As a result, there is provided a wafer polishing method that can manufacture a wafer having a high flatness and a high smoothness at high productivity and high yield.
    Type: Grant
    Filed: June 30, 2009
    Date of Patent: September 16, 2014
    Assignee: Shin-Etsu Handotai Co., Ltd.
    Inventors: Daisuke Furukawa, Kazumasa Asai, Takahiro Kida, Tadao Tanaka
  • Patent number: 8827769
    Abstract: There is provided a method of producing a substrate for magnetic recording media which is capable of efficiently removing alumina abrasive grains in the latter polishing step that have been stuck in the former polishing step during polishing of the substrate for magnetic recording media in which a NiP plating film has been formed on the surface of an Al alloy substrate, the method including: a rough polishing step for polishing the surface of a substrate for magnetic recording media, which is prepared by forming a NiP plating film on the surface of an Al alloy substrate, using a first grinder while supplying a polishing liquid containing alumina abrasive grains; and a finish polishing step for polishing the substrate for magnetic recording media following washing, using a second grinder while supplying a polishing liquid containing colloidal silica abrasive grains, wherein supply of the polishing liquid containing alumina abrasive grains is stopped and alumina abrasive grains are removed from the grinder b
    Type: Grant
    Filed: August 15, 2011
    Date of Patent: September 9, 2014
    Assignee: Showa Denko K.K.
    Inventors: Yasuyuki Nakanishi, Hidenori Inada, Katsuhiro Yoshimura
  • Patent number: 8821735
    Abstract: An object of the invention is to effectively remove particles on the glass substrate surfaces, even in the case wherein abrasive particles having a small particle size is used in the polishing step of the glass substrate and a supersonic treatment is performed at a high frequency at the supersonic cleaning step after the polishing step. In a manufacturing method of a glass substrate for a magnetic disk comprising a polishing step for performing polishing of the glass substrate and a supersonic cleaning step for performing supersonic cleaning of the glass substrate after the polishing step, the polishing step uses abrasive particles having a particle size of 10 nm to 30 nm and a first supersonic cleaning is performed at a frequency of 300 kHz to 1,000 kHz to form secondary particles and then a second supersonic cleaning is performed at a frequency of 30 kHz to 100 kHz in the supersonic cleaning step.
    Type: Grant
    Filed: March 31, 2011
    Date of Patent: September 2, 2014
    Assignee: Hoya Corporation
    Inventor: Yosuke Suzuki
  • Patent number: 8801500
    Abstract: A method for the simultaneous material-removing processing of both sides of at least three semiconductor wafers includes providing a double-side processing apparatus including two rotating ring-shaped working disks and a rolling apparatus. The carriers are arranged in the double-side processing apparatus and the openings are disposed in the carriers so as to satisfy the inequality: R/e·sin(?/N*)?r/e?1?1.2 where N* denotes a ratio of the round angle and an angle at which adjacent carriers are inserted into the rolling apparatus with the greatest distance with respect to one another, r denotes a radius of each opening for receiving a respective semiconductor wafer, e denotes a radius of a pitch circle around a midpoint of the carrier on which the opening is arranged, and R denotes a radius of the pitch circle on which the carriers move between the working disks by means of the rolling apparatus.
    Type: Grant
    Filed: December 7, 2011
    Date of Patent: August 12, 2014
    Assignee: Siltronic AG
    Inventor: Georg Pietsch
  • Patent number: 8758092
    Abstract: A skewed burnishing head arrangement is provided for burnishing the surface of a disc. The skewing of the burnishing head relative to the diameter perpendicular to a sweeping direction provides improved wiping action that catches loose particles and surface contamination, as well as performing aggressive asperity cutting and surface conditioning, while preventing particles from being embedded into a disc surface.
    Type: Grant
    Filed: November 16, 2005
    Date of Patent: June 24, 2014
    Assignee: Seagate Technology LLC
    Inventors: Yong Hu, Eric K. Dahlini, Hamid F. Ghazvini, Pranesh K. Swamy
  • Patent number: 8740668
    Abstract: A method and apparatus for releasbly attaching flexible abrasive disks to a flat-surfaced platen that floats in three-point abrading contact with three rigid equal-height flat-surfaced rotable fixed-position workpiece spindles that are mounted on a precision-flat abrading machine base where the spindle surfaces are in a common plane that is co-planar with the base surface. The three spindles are positioned to form a triangle of platen supports where the rotational-centers of each of the spindles are positioned at the center of the annular width of the platen abrading surface. Flat surfaced workpieces are attached to the spindles and the rotating floating-platen abrasive surface contacts all three rotating workpieces to perform single-sided abrading. The platen abrasive can be re-reflattened by attaching equal-thickness abrasive disks to the three spindles that are rotated while in abrading contact with the rotating platen abrasive. There is no wear of the abrasive-disk protected platen surface.
    Type: Grant
    Filed: March 12, 2010
    Date of Patent: June 3, 2014
    Inventor: Wayne O. Duescher
  • Patent number: 8721390
    Abstract: A method for double-side polishing of a semiconductor wafer includes situating the semiconductor wafer in a cutout of a carrier that is disposed in a working gap between an upper polishing plate covered by a first polishing pad and a lower polishing plate covered by a second polishing pad. The first and second polishing pads each include tiled square segments that are formed by an arrangement of channels on the pads, where the square segments of the first pad are larger than the segments of the second pad. The square segments of the polishing pads include abrasives. During polishing, the carrier is guided such that a portion of the wafer temporarily projects laterally outside of the working gap. A polishing agent with a pH that is variable is supplied during polishing at a pH in a range of 11 to 12.5 during a first step and at a pH of at least 13 during a second step.
    Type: Grant
    Filed: March 7, 2011
    Date of Patent: May 13, 2014
    Assignee: Siltronic AG
    Inventors: Juergen Schwandner, Thomas Buschhardt, Roland Koppert
  • Patent number: 8721391
    Abstract: A carrier head for a chemical mechanical polisher includes base, a substrate mounting surface, an annular inner ring, and an annular outer ring. The inner ring has an inner surface configured to circumferentially surround the edge of a substrate positioned on the substrate mounting surface, an outer surface, and a lower surface to contact a polishing pad. The inner ring is vertically movable relative to the substrate mounting surface. The outer ring has an inner surface circumferentially surrounding the inner ring, an outer surface, and a lower surface to contact the polishing pad. The outer ring is vertically movable relative to and independently of the substrate mounting surface and the inner ring. The lower surface of the inner ring has a first width, and the lower surface of the outer ring has a second width greater than the first width.
    Type: Grant
    Filed: August 5, 2011
    Date of Patent: May 13, 2014
    Assignee: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Samuel Chu-Chiang Hsu, Yin Yuan, Huanbo Zhang, Gautam Shashank Dandavate
  • Patent number: 8721392
    Abstract: A method for finishing an edge of a glass sheet comprising a first grinding step and a second polishing step using different abrasive wheels. The method results in consistent finished edge quality and improved edge quality in term of sub-surface damage (SSD). The method can be advantageously utilized to finish the edges of a thin glass substrate for use as substrates of display devices, such as LCD displays and the like.
    Type: Grant
    Filed: June 28, 2011
    Date of Patent: May 13, 2014
    Assignee: Corning Incorporated
    Inventors: James William Brown, Siva Venkatachalam
  • Patent number: 8651919
    Abstract: An adhesive sheet comprising a sheetlike base material and, superimposed on one major surface thereof, an adhesive layer, wherein the average surface roughness on one major surface of the base material is in the range of 0.1 to 3.5 ?m and on the other major surface thereof is in the range of 0.05 to 0.7 ?m. In this structure, the average surface roughness values on both the major surfaces of the base material as a constituent of the adhesive sheet are regulated so as to fall within respective specified ranges, so that not only can any blocking occurring in backwinding of reeled adhesive sheet be inhibited but also any occurrence of minute unevenness (waving) on the wafer surface after grinding can be inhibited, and further that the transparency of the adhesive sheet can be maintained.
    Type: Grant
    Filed: August 30, 2007
    Date of Patent: February 18, 2014
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Masanobu Kutsumi, Masashi Kume
  • Patent number: 8647173
    Abstract: A method of polishing a semiconductor wafer using a holding system including a lined cutout the size of the semiconductor wafer that is fixed to a carrier. The method includes holding the semiconductor wafer in the cutout through adhesion of a first side of the semiconductor wafer to a bearing surface in the cutout and polishing a second side of the held semiconductor wafer using a polishing pad that is fixed on a polishing plate while introducing a polishing agent between the second side of the semiconductor wafer and the polishing pad, the polishing pad including fixedly bonded abrasive materials. The carrier is guided during polishing such that a portion of the second side of the semiconductor wafer temporarily projects beyond a lateral edge of a surface of the polishing pad.
    Type: Grant
    Filed: March 11, 2013
    Date of Patent: February 11, 2014
    Assignee: Siltronic AG
    Inventors: Juergen Schwandner, Thomas Buschhardt, Roland Koppert
  • Patent number: 8647176
    Abstract: A workpiece having a planar face the workpiece is rotated about a workpiece axis substantially perpendicular to the planar workpiece face, and a grinding disk centered on a disk axis is rotated about the disk axis. The disk has an annular planar disk face perpendicular to and centered on the disk axis and an annular frustoconical disk face extending from an edge of the planar disk face, centered on the disk axis, and angled inward from the planar disk face. A portion of the annular face is oriented perpendicular to the workpiece axis and pressed against the planar workpiece face to premachine most of the planar workpiece face. Thereafter the disk is pivoted and oriented parallel the planar workpiece face to finish machine the planar workpiece face with the planar disk face.
    Type: Grant
    Filed: June 7, 2011
    Date of Patent: February 11, 2014
    Assignee: Emag Holding GmbH
    Inventor: Roland Schmitz
  • Patent number: 8628378
    Abstract: A retainer is used with an apparatus for polishing a substrate. The substrate has upper and lower surfaces and a lateral, substantially circular, perimeter. The apparatus has a polishing pad with an upper polishing surface for contacting and polishing the lower face of the substrate. The retainer has an inward facing retaining face for engaging and retaining the substrate against lateral movement during polishing of the substrate. The retaining face engages a substrate perimeter at more than substantially a single discrete circumferential location along the perimeter.
    Type: Grant
    Filed: October 26, 2012
    Date of Patent: January 14, 2014
    Assignee: Applied Materials, Inc.
    Inventors: Steven M. Zuniga, Hung Chih Chen
  • Patent number: 8597078
    Abstract: A method for creating a concave section of glass from a glass substrate having flat surfaces includes the use of a grinding wheel and a turntable. The method includes the steps of securing the glass substrates to the turntable. The turntable is then spun to create a turntable axis of rotation. The grinding wheel is rotated about a wheel axis of rotation such that the wheel axis of rotation is perpendicular to the turntable axis of rotation. The grinding wheel and the turntable move relative to each other along the turntable axis of rotation. The glass substrate is ground by the grinding wheel contacting the glass substrate to create the concave section of glass while the glass substrate is rotating about the wheel axis of rotation and moving relative to the turntable.
    Type: Grant
    Filed: May 24, 2013
    Date of Patent: December 3, 2013
    Assignee: SMR Patents S.a.r.l.
    Inventors: Douglas J. Wilson, Paul R. Henion, Brian Glombowski
  • Patent number: 8579679
    Abstract: The present invention provides an apparatus capable of uniformly grinding an polishing pad. Further, the present invention provides a method of grinding an polishing pad by using the grinding apparatus.
    Type: Grant
    Filed: September 13, 2010
    Date of Patent: November 12, 2013
    Assignee: Sumco Corporation
    Inventors: Hiroto Fukushima, Tomonori Miura, Yasuhiko Tsukanaka, Takeshi Ezaki
  • Patent number: 8562390
    Abstract: A double-disc grinding apparatus having at least: a rotatable ring-shaped holder for supporting a sheet-like wafer having a notch for indicating a crystal orientation from an outer circumference side along a radial direction, the holder having a protruding portion to be engaged with the crystal-orientation-indicating notch; and a pair of grindstones for simultaneously grinding both surfaces of the wafer supported by the holder, in which the holder is provided with at least one protruding portion separately from the protruding portion to be engaged with the crystal-orientation-indicating notch, and the both surfaces of the wafer are simultaneously ground by the pair of the grindstones while the wafer is supported and rotated with the at least one protruding portion being engaged with a wafer-supporting notch formed on the wafer.
    Type: Grant
    Filed: April 20, 2009
    Date of Patent: October 22, 2013
    Assignee: Shin-Etsu Handotai Co., Ltd.
    Inventors: Kenji Kobayashi, Tadahiro Kato
  • Patent number: 8550880
    Abstract: A process is provided for polishing a silicon electrode utilizing a polishing turntable and a dual function electrode platen. The dual function electrode platen is secured to the polishing turntable and comprises a plurality of electrode mounts arranged to project from an electrode engaging face of the dual function electrode platen. The electrode mounts complement respective positions of mount receptacles formed in a platen engaging face of the silicon electrode to be polished. The electrode mounts and the mount receptacles are configured to permit non-destructive engagement and disengagement of the electrode engaging face of the electrode platen and the platen engaging face of the silicon electrode. The dual function electrode platen further comprises platen adapter abutments positioned radially inward of the electrode mounts. The platen adapter abutments are configured to bring a platen adapter into approximate alignment with the rotary polishing axis.
    Type: Grant
    Filed: December 10, 2009
    Date of Patent: October 8, 2013
    Assignee: Lam Research Corporation
    Inventors: Armen Avoyan, Duane Outka, Catherine Zhou, Hong Shih
  • Patent number: 8551253
    Abstract: A method for cleaning plated polished disks used in hard drive media is provided. The method includes positioning plated polished disks in a first batch scrubber having multiple first brushes, wherein each of the plated polished disks is positioned between two of the first brushes, and scrubbing the plated polished disks with the first brushes. The method further includes positioning the plated polished disks scrubbed in the first batch scrubber in a second batch scrubber having multiple second brushes, wherein each of the plated polished disks is positioned between two of the second brushes, and scrubbing the plated polished disks with the second brushes.
    Type: Grant
    Filed: June 29, 2010
    Date of Patent: October 8, 2013
    Assignee: WD Media, LLC
    Inventors: Nazman Na'im, Yeong Yih Boo
  • Patent number: 8517801
    Abstract: A method includes a grinding step of forming the shape of a contact surface, a grooving step of roughening the shaped contact surface to form grooves therein, and a contact surface lapping step of lapping the contact surface having the grooves with a lapping film to form oil grooves for holding a lubricant oil. The surface roughness of the contact surface is such that the maximum height roughness Rz is 4 ?m or less, the mean length RSm of the roughness profile elements is 30 to 60 ?m, the skewness Rsk of the roughness profile is ?2.7 to ?0.6 (no unit), the reduced peak height Rpk is 0.09 ?m or less, and the reduced valley depth Rvk is 0.4 to 1.3 ?m.
    Type: Grant
    Filed: December 20, 2010
    Date of Patent: August 27, 2013
    Assignee: Honda Motor Co., Ltd.
    Inventors: Nobuhiro Asai, Satoshi Kaneko, Masaharu Kitafuji, Daisuke Koshino, Tsuyoshi Kubota
  • Patent number: 8512100
    Abstract: There are provided an abrasive tape capable of suppressing contamination of a magnetic disk due to shattered abrasive particles and smoothing the surface of the magnetic disk; a method for producing an abrasive tape; and a varnishing process. An abrasive tape 1 produced according to the method for producing an abrasive tape of the invention is used in a process for varnishing a magnetic disk and produced according to a process for preparing a slurry by kneading and dispersing abrasive particles 5 and a binding agent 6; a process for forming a coating film by applying the slurry on a support 2; a process for forming an abrasive particle layer 3 by hardening the coating film; and a process for forming a coating layer 4 on the surface of the abrasive particle layer 3.
    Type: Grant
    Filed: June 19, 2009
    Date of Patent: August 20, 2013
    Assignee: Showa Denko K.K.
    Inventors: Ryuji Sakaguchi, Kazuya Niwa
  • Patent number: 8500516
    Abstract: A method for polishing a semiconductor wafer having a first side and a second side, the method includes polishing the first side using a Fixed Abrasive Polishing (FAP) with a polishing pad including fixedly bonded abrasives having an average particle size of 0.1-1.0 ?m; applying a cement layer with a thickness of at most 3 ?m to the polished first side; fixing the polished and cemented first side on a carrier plate of a polishing machine; and polishing the second side using a single-side chemical mechanical polishing.
    Type: Grant
    Filed: October 19, 2010
    Date of Patent: August 6, 2013
    Assignee: Siltronic AG
    Inventor: Juergen Schwandner
  • Patent number: 8460060
    Abstract: A method for creating a concave section of glass from a glass substrate having flat surfaces includes the use of a grinding wheel and a turntable. The method includes the steps of securing the glass substrates to the turntable. The turntable is then spun to create a turntable axis of rotation. The grinding wheel is rotated about a wheel axis of rotation such that the wheel axis of rotation is perpendicular to the turntable axis of rotation. The grinding wheel and the turntable move relative to each other along the turntable axis of rotation. The glass substrate is ground by the grinding wheel contacting the glass substrate to create the concave section of glass while the glass substrate is rotating about the wheel axis of rotation and moving relative to the turntable.
    Type: Grant
    Filed: February 1, 2010
    Date of Patent: June 11, 2013
    Assignee: SMR Patents S.a.r.l.
    Inventors: Douglas J. Wilson, Paul R. Henion, Brian Glombowski
  • Patent number: 8360822
    Abstract: Methods and devices for machining a die plate of an extruder for pelletization are provided. The device can include a grinding wheel with a grinding surface rotatably disposed on a drive mechanism of a cutter head associated with the extruder. The grinding surface can include a hard coating aligned with the die plate.
    Type: Grant
    Filed: September 25, 2009
    Date of Patent: January 29, 2013
    Assignee: Automatik Plastics Machinery GmbH
    Inventor: Stefan Dahlheimer
  • Patent number: 8348724
    Abstract: A method for manufacturing a polishing pad prevents slurry leaks and provides a pad that can be used to provide high optical detection accuracy. The method for manufacturing a polishing pad includes forming a groove for injecting a light-transmitting region forming material on the back surface of a polishing layer; injecting the light-transmitting region forming material into the groove and curing the material to form a light-transmitting region; and buffing the front surface of the polishing layer to expose the light-transmitting region on the front surface.
    Type: Grant
    Filed: May 9, 2008
    Date of Patent: January 8, 2013
    Assignee: Toyo Tire & Rubber Co., Ltd.
    Inventors: Masato Doura, Junji Hirose, Kenji Nakamura, Takeshi Fukuda, Akinori Sato
  • Patent number: 8348721
    Abstract: A glass substrate for perpendicular magnetic recording, having a surface with an average surface roughness of 2.0? or less and surface height variations of 1? or less with wavelengths in the range of 0.05 mm-0.5 mm in both radial and circumferential directions, is produced by rotating a glass substrate, supplying polishing slurry containing a specified amount of abrading particles of artificial diamond on its surface, pressing a polishing tape on the surface and causing this polishing tape to travel in a direction opposite to the direction of rotation of the glass substrate.
    Type: Grant
    Filed: February 27, 2009
    Date of Patent: January 8, 2013
    Assignee: Nihon Micro Coating Co., Ltd.
    Inventors: Yuji Horie, Tatsuya Tanifuji, Noriyuki Kumasaka
  • Patent number: 8342907
    Abstract: A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information.
    Type: Grant
    Filed: November 30, 2009
    Date of Patent: January 1, 2013
    Assignees: Ebara Corporation, Shimadzu Corporation
    Inventors: Yoichi Kobayashi, Shunsuke Nakai, Hitoshi Tsuji, Yasuo Tsukuda, Junki Ishimoto, Kazunari Shinya
  • Patent number: 8292690
    Abstract: A thinned semiconductor wafer and a method for thinning the semiconductor wafer. A semiconductor wafer is thinned from its backside to form a cavity in a central region of the backside of the semiconductor wafer. Forming the cavity also forms a ring support structure in a peripheral region of the semiconductor wafer. The ring support structure has an inner edge and an outer edge. The inner edge may be beveled or have a stepped shape.
    Type: Grant
    Filed: September 8, 2008
    Date of Patent: October 23, 2012
    Assignee: Semiconductor Components Industries, LLC
    Inventor: Michael J. Seddon
  • Patent number: 8277283
    Abstract: A wafer is polished by a method comprising a slicing step of cutting out a wafer from a single crystal ingot and a step of polishing at least one of both surfaces and an end face of the wafer, wherein the at least one surface and end face of the wafer are simultaneously subjected to a mirror polishing.
    Type: Grant
    Filed: June 10, 2009
    Date of Patent: October 2, 2012
    Assignee: Sumco Corporation
    Inventor: Hiroaki Sato
  • Patent number: 8267745
    Abstract: Methods for holding a workpiece with a hydrostatic pad are disclosed herein. The pad includes hydrostatic pockets formed in a face of the body directly opposed to the wafer. The pockets are adapted for receiving fluid through the body and into the pockets to provide a barrier between the body face and the workpiece while still applying pressure to hold the workpiece during grinding. The hydrostatic pads allow the wafer to rotate relative to the pads about their common axis. The pockets are oriented to reduce hydrostatic bending moments that are produced in the wafer when the grinding wheels shift or tilt relative to the hydrostatic pads, helping prevent nanotopology degradation of surfaces of the wafer commonly caused by shift and tilt of the grinding wheels.
    Type: Grant
    Filed: October 6, 2010
    Date of Patent: September 18, 2012
    Assignee: MEMC Electronic Materials, Inc.
    Inventors: Milind S. Bhagavat, Puneet Gupta, Roland R. Vandamme, Takuto Kazama, Noriyuki Tachi
  • Patent number: 8251778
    Abstract: A double-side grinding apparatus is designed to be capable of minimizing thermal expansion of hydrostatic pad members and reducing nanotopography in performing wafer grinding. The double-side grinding apparatus is a double-side grinding apparatus for wafers that can simultaneously grind either surface of a wafer to be ground by pressing a grindstone against either surface of the wafer to be ground while hydrostatically supporting either surface of the wafer to be ground in a noncontact manner. Each hydrostatic supporting unit is formed with a hydrostatic pad member facing the wafer to be ground, and a base member placed on the back surface of the hydrostatic pad member. The hydrostatic pad member is made of a ceramic member, and the base member is made of a metal member.
    Type: Grant
    Filed: October 28, 2009
    Date of Patent: August 28, 2012
    Assignee: Sumco Techxiv Corporation
    Inventor: Hiroyasu Futamura
  • Patent number: 8231432
    Abstract: Optical polishing pitch formulations include synthetic polymers or other synthetic resins. As alternatives to traditional optical pitches, these materials offer improved stability in use, storage, and processing. In addition, these pitch compositions may be masterbatched and manufactured with precision to ensure superior reproducibility and quality control in polishing performance.
    Type: Grant
    Filed: July 27, 2011
    Date of Patent: July 31, 2012
    Inventors: Stephen P. Sutton, William T. Sutton
  • Patent number: 8231433
    Abstract: The polishing method of a disk-shaped substrate for polishing an outer circumference 13 of a disk-shaped substrate using slurry is provided with in this sequence: a first polishing process for polishing the outer circumference 13 using an abrasive-grain inclusion brush 50 made of a resin in which polishing abrasive grains are included; and a second polishing process for polishing the outer circumference 13 using a resin brush 60 made of a resin in which the polishing abrasive grains are not included.
    Type: Grant
    Filed: February 19, 2008
    Date of Patent: July 31, 2012
    Assignee: Showa Denko K.K.
    Inventors: Kazuyuki Haneda, Satoshi Fujinami
  • Patent number: 8221192
    Abstract: A magnetic-recording-disk test-head. The magnetic-recording-disk test-head includes a slider, a test pad and a slider-surface-shape control mechanism. The slider includes a leading edge and a trailing edge. The test pad is disposed at a trailing-edge side of the slider and is configured to remove and to detect asperities on a magnetic-recording disk. The slider-surface-shape control mechanism is configured to change a shape of an air-bearing surface of the slider and is disposed at a leading-edge side of the slider.
    Type: Grant
    Filed: August 7, 2009
    Date of Patent: July 17, 2012
    Assignee: Hitachi Global Storage Technologies, Netherlands B.V.
    Inventors: Hidekazu Kashiwase, Hiroyuki Suzuki, Masae Suzuki, legal representative, Mitsuhiro Shoda, Takayoshi Ohtsu, Kiyoshi Hashimoto
  • Patent number: 8210901
    Abstract: A method for producing a die for molding a ceramic honeycomb structure, which has molding grooves arranged in a lattice pattern and apertures communicating with the molding grooves for supplying a moldable material, wherein the formation of the lattice-patterned grooves by machining is conducted by a first machining operation for forming pluralities of first parallel grooves, and a second machining operation for forming second grooves crossing the first grooves; wherein the first and second machining operations are conducted by at least 2 passes of grinding or cutting using a rotating tool; and wherein the second machining operation is conducted by up-cutting in the second pass or later, and a method for producing a ceramic honeycomb structure using such a die.
    Type: Grant
    Filed: October 29, 2007
    Date of Patent: July 3, 2012
    Assignee: Hitachi Metals, Ltd.
    Inventors: Kazuyuki Kurakake, Tomohisa Ogata, Hiroshi Inoue
  • Patent number: 8210904
    Abstract: A patterned portion of a patterned semiconductor substrate is removed by abrasive mechanical planarization employing an abrasive pad but without employing any slurry. Preferably, water is supplied to enhance the removal rate during the mechanical planarization. The removal rate of material is substantially independent for common materials employed in back-end-of-line (BEOL) semiconductor materials, which enables non-selective removal of the material containing metallization structures. The removal rate of silicon is lower than the removal rate for the BEOL semiconductor materials, enabling a self-stopping planarization process.
    Type: Grant
    Filed: April 29, 2008
    Date of Patent: July 3, 2012
    Assignee: International Business Machines Corporation
    Inventors: Graham M. Bates, David Domina, James L. Hardy, Jr., Eric J. White
  • Patent number: 8197303
    Abstract: A sapphire substrate includes a generally planar surface having a crystallographic orientation selected from the group consisting of a-plane, r-plane, m-plane, and c-plane orientations, and having a nTTV of not greater than about 0.037 ?m/cm2, wherein nTTV is total thickness variation normalized for surface area of the generally planar surface, the substrate having a diameter not less than about 9.0 cm.
    Type: Grant
    Filed: December 21, 2007
    Date of Patent: June 12, 2012
    Assignee: Saint-Gobain Ceramics & Plastics, Inc.
    Inventors: Brahmanandam V. Tanikella, Palaniappan Chinnakaruppan, Robert A. Rizzuto, Isaac K. Cherian, Ramanujam Vedantham
  • Patent number: 8197300
    Abstract: Correction of grinding spindle positions in double-side grinding machines for the simultaneous double-side machining of semiconductor wafers is achieved by torsionally coupling the two grinding spindles, each comprising a grinding disk flange for receiving a grinding disk, and providing a measuring unit with an inclinometer and two sensors for distance measurement, between the two grinding disk flanges such that the grinding spindles are essentially in the position they would have with mounted grinding disks during the grinding process, wherein the coupled grinding spindles are rotated while inclinometer and sensors determine radial and axial correction values of axial alignment to adjust the grinding spindles to a symmetrical orientation. The spindle positions may be corrected under the action of process forces.
    Type: Grant
    Filed: October 1, 2008
    Date of Patent: June 12, 2012
    Assignee: Siltronic AG
    Inventors: Joachim Junge, Robert Weiss
  • Patent number: 8157617
    Abstract: Semiconductor wafers are CMP polished by polishing the rear side of the semiconductor wafer by means of CMP with a material removal with a profile along the diameter of the wafer wherein material removal is higher at the center than at the edge of the rear side; and polishing the front side of the wafer by means of CMP with a material removal with a profile along the diameter of the wafer wherein material removal is lower in the center of the front side than in an edge region of the front side.
    Type: Grant
    Filed: August 18, 2009
    Date of Patent: April 17, 2012
    Assignee: Siltronic AG
    Inventors: Clemens Zapilko, Thomas Jaeschke, Makoto Tabata, Klaus Roettger
  • Patent number: 8152599
    Abstract: A method is disclosed for maintaining a hard surface, the method comprising treating the surface with a flexible pad (1), in the presence of abrasive particles, bonded to the pad, on a contact surface between the pad (1) and the hard surface. The abrasive particles comprise diamond particles, and the treating is performed in the absence of an effective amount of crystallization agent on the contact surface. A tool for use in the method is also provided, as well as a floor surfacing machine comprising such a tool and a method for manufacturing such a tool.
    Type: Grant
    Filed: March 15, 2005
    Date of Patent: April 10, 2012
    Assignee: HTC Sweden A3
    Inventor: Håkan Thysell
  • Patent number: 8151434
    Abstract: A brake disk mounting surface is ground by bringing it into contact with an annular grinding wheel, while an inner ring having the brake disk mounting surface is rotated around its center axis, in a state where a part of the annular grinding wheel overlaps with a recess over an entire region of the annular grinding wheel in a radial direction, and in a state where a grinding surface of the annular grinding wheel is inclined with respect to the brake disk mounting surface so that a distance between the brake disk mounting surface and the annular grinding wheel grows larger in a direction toward an outer edge of the brake disk mounting surface.
    Type: Grant
    Filed: March 28, 2007
    Date of Patent: April 10, 2012
    Assignee: JTEKT Corporation
    Inventor: Takeshi Fukao
  • Patent number: 8118642
    Abstract: A method for machining a face (1) of an optical object (6), includes providing a machine tool which itself includes a bed (1) for locating an object to be machined. The bed (1) has a receiving surface (3) that is angularly adjustable about an axis perpendicular to the receiving surface (3). A spindle (8) is suitable for rotating a machining tool (9) about an axis essentially parallel to the receiving surface (3) of the bed (1) and is suitable for moving the machining tool (9) translationally in a plane essentially parallel or perpendicular to the receiving surface (3) of the bed (1).
    Type: Grant
    Filed: June 13, 2007
    Date of Patent: February 21, 2012
    Assignee: Essilor International
    Inventors: Alain Coulon, Jean-Pierre Chauveau, Alain Dubois
  • Patent number: 8113914
    Abstract: An object of the present invention is to provide a treating method for brittle member capable of stably holding the brittle member when applying predetermined treatments such as transportation and grinding back surface of a brittle member such as a semi-conductor wafer and separating the brittle member without breakage after finishing required treatment to thereby attaining high thickness accuracy of the brittle member. A treating method for brittle member comprising: a step of removably fixing a brittle member on a flexible glass base plate, a step of treating said brittle member, a step of fixing said brittle member side by holding means, and a step of separating said flexible glass base plate from said brittle member by bending said flexible glass base plate.
    Type: Grant
    Filed: June 6, 2008
    Date of Patent: February 14, 2012
    Assignee: LINTEC Corporation
    Inventors: Hitoshi Ohashi, Naofumi Izumi
  • Patent number: RE44986
    Abstract: Semiconductor wafers are CMP polished by polishing the rear side of the semiconductor wafer by means of CMP with a material removal with a profile along the diameter of the wafer wherein material removal is higher at the center than at the edge of the rear side; and polishing the front side of the wafer by means of CMP with a material removal with a profile along the diameter of the wafer wherein material removal is lower in the center of the front side than in an edge region of the front side.
    Type: Grant
    Filed: July 19, 2012
    Date of Patent: July 1, 2014
    Assignee: Siltronic AG
    Inventors: Clemens Zapilko, Thomas Jaeschke, Makoto Tabata, Klaus Roettger