Side Face Of Disk Patents (Class 451/63)
  • Patent number: 7462094
    Abstract: A wafer grinding method is disclosed, in which only a region, corresponding to a device formation region, of the back side of a wafer is ground in rough grinding conducted first, while the part surrounding the region thus ground is left unground as an annular projected part, to prevent the outer peripheral edge of the wafer from becoming knife edge-like in shape. In the subsequent finish grinding, the annular projected part is ground and, further, the whole area of the back side of the wafer is ground to be flat. Chippings of the outer peripheral edge may be generated only during the finish grinding, whereby the chippings are prevented from occurring or limited to minute ones.
    Type: Grant
    Filed: September 19, 2007
    Date of Patent: December 9, 2008
    Assignee: Disco Corporation
    Inventors: Shinji Yoshida, Osamu Nagai
  • Publication number: 20080299877
    Abstract: This invention comprises methods, devices, and systems for buffing, to repair and restore all types of compact discs. The restoration is essentially accomplished by interaction of rotating buffers with a compact disc on a rotating platform. For added effectiveness certain chemicals are added to the rotating buffers. The portable system is fully automatic such that an operator can perform other functions. The device also includes plurality of timers and indicators as well as a convenient carrying handle. The CD Buffing Unit allows the restoration and maintenance of all known CD Media, DVDs, single or double sided, including 3-inch discs with the use of a 3-inch adapter.
    Type: Application
    Filed: July 3, 2008
    Publication date: December 4, 2008
    Inventor: Daniel Diotte
  • Patent number: 7458878
    Abstract: The present embodiments provide methods, systems and apparatuses for use in grinding work pieces, such as wafers. Some embodiments provide methods that position a grind spindle to contact a first grinding spindle to a face of a work piece, remove a portion of the face, and control the removing of the portion of the face according to a control algorithm. This control algorithm can comprise determining a force applied to the work piece during the removing of the portion of the face, adjusting a feed rate of the first grind spindle when the force applied to the work piece has a predefined relationship with a first threshold level; and dressing a portion of the first grinding portion when the force applied to the work piece has a predefined relationship with a second threshold level that is greater than the first threshold.
    Type: Grant
    Filed: October 10, 2006
    Date of Patent: December 2, 2008
    Assignee: Strasbaugh, a California corporation
    Inventors: Thomas A. Walsh, Salman Moudrek Kassir
  • Patent number: 7455571
    Abstract: A window polishing pad having a reduced stress pad window formed therein for performing optical end point detection are provided, wherein the window polishing pad comprises a pad window and a pressure relief channel, wherein the pressure relief channel extends to an outer periphery of the window polishing pad from a cavity formed behind the pad window when the window polishing pad is interfaced with a platen and wherein a membrane is provided over at least one of an inlet and an outlet of the pressure relief channel. Also disclosed are methods of making and of using the window polishing pads to polish a semiconductor wafer.
    Type: Grant
    Filed: June 20, 2007
    Date of Patent: November 25, 2008
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Charles C. Kuo, Jennifer M. O'Sullivan
  • Patent number: 7438627
    Abstract: A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information.
    Type: Grant
    Filed: June 27, 2007
    Date of Patent: October 21, 2008
    Assignees: Ebara Corporation, Shimadzu Corporation
    Inventors: Yoichi Kobayashi, Shunsuke Nakai, Hitoshi Tsuji, Yasuo Tsukuda, Junki Ishimoto, Kazunari Shinya
  • Patent number: 7435158
    Abstract: The present invention provides an initial position setting method of grinding wheels, before starting a grinding operation, in a vertical double disc surface grinding machine for surface grinding the upper and lower grinding surfaces of a work-piece simultaneously by rotation-driving a pair of grinding wheels by a grinding wheel rotation drive motor and moving the grinding wheels up and down by a grinding wheel vertical drive motor.
    Type: Grant
    Filed: December 10, 2004
    Date of Patent: October 14, 2008
    Assignees: Daisho Seiki Corporation, Honda Motor Co., Ltd.
    Inventors: Yoshihiro Wakaiki, Yoshinari Uchida
  • Publication number: 20080207094
    Abstract: A method and apparatus for ultra thin wafer backside processing are disclosed. The apparatus includes an outer ring holding a high temperature grinding and/or dicing tape to form a support structure. An ultra thin wafer or diced wafer is adhered to the tape within the ring for wafer backside processing. The wafer backside processing includes ion implantation, annealing, etching, sputtering and evaporation while the wafer is in the support structure. Alternative uses of the support structure are also disclosed including the fabrication of dies having metalized side walls.
    Type: Application
    Filed: February 28, 2007
    Publication date: August 28, 2008
    Inventors: Tao Feng, Ming Sun
  • Patent number: 7416476
    Abstract: A method and apparatus for grinding a brake pad forms inclined faces at both ends of the brake pad through a single route of movement and no grinding limit quantity is involved whether boundary lines are parallel with each other or not. The apparatus includes: a fixing portion 11 for fixing a brake pad 3; a rotary whetstone 21 having a rotation axis parallel to a friction face 3a of the brake pad 3, a grinding face of which a distance to the rotation axis increases gradually or in a plurality of steps in one direction of the rotation axis, and another grinding face of which a distance to the rotation axis decreases gradually or in a plurality of steps in the one direction of the rotation axis; and a transporter 10 for moving one of the brake pad and the rotary whetstone in relation to each other in a intersecting direction to the rotation axis.
    Type: Grant
    Filed: June 2, 2003
    Date of Patent: August 26, 2008
    Assignee: Nisshinbo Industries, Inc
    Inventors: Kozo Yokoyama, Ryoichi Sakaguchi
  • Patent number: 7413499
    Abstract: A process of grinding a surface of a workpiece, by a grinding tool rotated about its axis. The process includes a grinding step of grinding the workpiece surface, by pressing at least one of the grinding tool and the workpiece against the other of the grinding tool and the workpiece, such that a constant force is exerted on the other of the grinding tool and the workpiece by the at least one of the grinding tool and the workpiece. Also disclosed is a grinding apparatus including: a moving device operable to move at least one of the grinding tool and the workpiece relative to the other of the grinding tool and the workpiece, at least in an infeed direction that increases a depth of cut of the grinding tool into the workpiece; and a controller which controls the moving device, such that the at least one of the grinding tool and the workpiece is pressed against the other of the grinding tool and the workpiece, with a constant force.
    Type: Grant
    Filed: September 28, 2005
    Date of Patent: August 19, 2008
    Assignee: Noritake Co., Limited
    Inventor: Kenji Noda
  • Patent number: 7410409
    Abstract: The present invention discloses a CMP abrasive comprising cerium oxide particles, a dispersant, an organic polymer having an atom or a structure capable of forming a hydrogen bond with a hydroxyl group present on a surface of a film to be polished and water, a method for polishing a substrate comprising polishing a film to be polished by moving a substrate on which the film to be polished is formed and a polishing platen while pressing the substrate against the polishing platen and a polishing cloth and supplying the CMP abrasive between the film to be polished and the polishing cloth, a method for manufacturing a semiconductor device comprising the steps of the above-mentioned polishing method, and an additive for a CMP abrasive comprising an organic polymer having an atom or a structure capable of forming a hydrogen bond with a hydroxyl group present on a surface of a film to be polished, and water.
    Type: Grant
    Filed: June 15, 2000
    Date of Patent: August 12, 2008
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Naoyuki Koyama, Kouji Haga, Masato Yoshida, Keizou Hirai, Toranosuke Ashizawa, Youiti Machii
  • Publication number: 20080119117
    Abstract: A deglazing tool for use on motorcycle and ATV disc brake rotors. The tool is handheld and has abrasive pads that engage the rotor braking surface. The abrasive pads cut through the glaze on the braking surface of the rotor. Grip pressure on the handles maintains pad engagement with the rotor to assist the deglazing action. Compression springs below the deglazing heads or between the handles may be utilized to control the pressure between the rotor and pad. The surface glaze is removed and the surface is “roughened-up” and restored to the desired surface finish to improve overall braking performance and feel. The tool can be used with the rotor and brake caliper in place.
    Type: Application
    Filed: September 5, 2007
    Publication date: May 22, 2008
    Inventor: Robert William Nichols
  • Patent number: 7374473
    Abstract: Texturing slurry for texturing a substrate for a magnetic hard disk is obtained by dispersing abrading particles of a specified kind in a specified kind of dispersant. The abrading particles include diamond clusters formed with artificial diamond particles with primary particle diameter of 20 nm or less and surrounded by impurities containing chlorine at a certain ratio. The cluster diameter and the average cluster diameter of the diamond clusters are each within a specified range. For texturing a substrate surface, the substrate is rotated, texturing slurry of this invention is supplied to the surface and a texturing tape of a specified kind is pressed against the substrate surface while it is caused to run.
    Type: Grant
    Filed: November 27, 2006
    Date of Patent: May 20, 2008
    Assignee: NIHON Micro Coating Co., Ltd.
    Inventors: Noriyuki Kumasaka, Yuji Horie, Mitsuru Saito, Kazuei Yamaguchi
  • Patent number: 7364495
    Abstract: The present invention provides a wafer double-side polishing apparatus comprising at least a carrier plate having wafer holding holes; upper and lower turn tables to which polishing pads are attached; and a slurry supply means; with wafers held in the wafer holding holes, the carrier plate being moved between the upper and lower turn tables while supplying slurry, to simultaneously polish both front and back surfaces of wafers, wherein a PCD of upper turn table load supporting points that is a diameter of a circle joining load supporting points of the upper turn table coincides with a PCD of centers of the wafer holding holes on the carrier plate that is a diameter of a circle joining each center of the wafer holding holes on the carrier plate.
    Type: Grant
    Filed: March 26, 2003
    Date of Patent: April 29, 2008
    Assignee: Etsu Handotai Co., Ltd.
    Inventors: Hiroyoshi Tominaga, Toshiyuki Hayashi
  • Patent number: 7314404
    Abstract: A burnishing head comprises at least two rails, each rail having an inner wall and an outer wall. The outer walls are at an angle relative to one another and relative to a central axis of the burnishing head. This angle permits the burnishing head to exhibit improved recovery time if it contacts a disk being burnished. The rail walls are vertical, and the corner between the rail walls and the top surface of the rails is sharp.
    Type: Grant
    Filed: April 7, 2006
    Date of Patent: January 1, 2008
    Assignees: Komag, Inc., Ahead Magnetics, Inc.
    Inventors: Balvinder Singh, Howard Temple, Rohini Patel, legal representative, Ravi Patel, legal representative, Geera Peters, legal representative, Jayadev Patel, deceased
  • Patent number: 7311586
    Abstract: A resilient pneumatic annular sealing bladder is coupled for fluid communication to a first pressurized pneumatic fluid to define a first pneumatic zone and is attached to a first surface of the wafer stop plate adjacent the retaining ring interior cylindrical surface to receive the wafer and to support the wafer at a peripheral edge. The resilient pneumatic annular sealing bladder defines a second pneumatic zone radially interior to the first pneumatic zone and extends between the first surface of the wafer stop plate and the wafer when the wafer is attached to the polishing head during a polishing operation and is coupled for fluid communication to a second pressurized pneumatic fluid. The wafer attachment stop plate is operative during non polishing periods to prevent the wafer from flexing excessively from an applied vacuum force used to hold the wafer to the polishing head during wafer loading and unloading operations.
    Type: Grant
    Filed: January 31, 2006
    Date of Patent: December 25, 2007
    Assignee: Ebara Corporation
    Inventors: Gerard S. Maloney, Jason Price, Scott Chin, Jiro Kajiwara, Malik Charif
  • Patent number: 7278206
    Abstract: A terminal board having a plurality of terminals on which ball electrodes are formed can be prepared efficiently and economically without having any short-circuiting between terminals when its terminals formed in very close proximity to one another, as on an interposer (1), have their heads made uniform in height by causing the terminals (4) to project from a surface of a board (2) coated with a resist film, and applying a cutting tool (19) to the surface of the board (2) having the terminals project therefrom to carry out lathe turning for the heads of the terminals (4), while having the terminal board held by a rotatable chuck table (17) and rotating the chuck table (17).
    Type: Grant
    Filed: August 20, 2003
    Date of Patent: October 9, 2007
    Assignee: Disco Corporation
    Inventors: Kazuhisa Arai, Hideyuki Sando
  • Patent number: 7270596
    Abstract: A chemical mechanical polishing process includes rotating at least one of a semiconductor substrate and polishing pad relative to the other. A chemical mechanical polishing slurry is provided intermediate the substrate and pad. The substrate is polished with the slurry and pad during the rotating. The chemical mechanical polishing slurry includes liquid and abrasive solid components. At least some of the abrasive solid component includes individually non-homogeneous abrasive particles.
    Type: Grant
    Filed: May 20, 2005
    Date of Patent: September 18, 2007
    Assignee: Micron Technology, Inc.
    Inventor: Trung Tri Doan
  • Patent number: 7270595
    Abstract: A polishing pad (20) for polishing a wafer (32) or other article, the pad having a groove network (60) configured to increase the residence time polishing medium (46) on the pad. The groove network has a first portion (72) that may extend substantially radially outwardly and an oscillating portion (74) that begins at a transition point (76) and is configured to slow the radially outward flow of the polishing medium.
    Type: Grant
    Filed: May 27, 2004
    Date of Patent: September 18, 2007
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Carolina L. Elmufdi, Ravichandra V. Palaparthi
  • Patent number: 7267602
    Abstract: Finishing a seal assembly as a unit is proposed, which prevents alignment of the end gaps of the annular body and the annular ring of the seal assembly, provides the ability to manufacture the seal assembly to very low tolerances, and establishes virtually perfect parallelism between the upper and lower surfaces of the seal assembly. A finishing process is characterized by lapping a seal assembly as an assembled unit with a lapper using gritted oil as a polishing medium.
    Type: Grant
    Filed: April 18, 2005
    Date of Patent: September 11, 2007
    Inventors: Maurice J. Moriarty, Matthew V. Hartford, Joseph D. Moriarty
  • Patent number: 7267841
    Abstract: An information-storage media is provided that includes: (a) a substrate disk 312 having first and second opposing surfaces; (b) a first interface layer 304 on the first surface, the first interface layer having a first thickness; (c) a second interface layer 308 on the second surface, the second interface layer having a second thickness, wherein the first and second interface layers have a different chemical composition than the substrate disk; and (d) an information-storage layer 412 adjacent to one or both of the interface layers. The first and second thicknesses are different to provide an unequal stress distribution across the cross-section of the media.
    Type: Grant
    Filed: August 2, 2005
    Date of Patent: September 11, 2007
    Assignee: Maxtor Corporation
    Inventors: Kwang Kon Kim, Ramon Clasara
  • Patent number: 7255943
    Abstract: On a principal surface of a glass disk substrate, a texture comprising a combination of an isotropic texture for stabilizing a flight of a magnetic head flying and traveling over a magnetic disk and an anisotropic texture for imparting a magnetic anisotropy to a magnetic layer of the magnetic disk is formed.
    Type: Grant
    Filed: May 13, 2004
    Date of Patent: August 14, 2007
    Assignee: Hoya Corporation
    Inventors: Takemi Miyamoto, Masao Takano
  • Patent number: 7238090
    Abstract: Methods and apparatus for chemical mechanical polishing are described. In one embodiment, an apparatus includes a table top and a transfer station and multiple polishing stations are mounted on the table top. The apparatus further includes multiple washing stations, where each washing station is located between either two polishing stations or between a polishing station and a transfer station. Multiple carrier heads are supported by a support member that is rotatable about an axis. The transfer station and the multiple polishing stations are arranged at approximately equal angular intervals about the axis.
    Type: Grant
    Filed: October 13, 2004
    Date of Patent: July 3, 2007
    Assignee: Applied Materials, Inc.
    Inventors: Robert D. Tolles, Norm Shendon, Sasson Somekh, Ilya Perlov, Eugene Gantvarg, Harry Q. Lee
  • Patent number: 7217175
    Abstract: A polishing apparatus comprises a first polishing table having a first polishing surface, a substrate carrier for holding a substrate and positioning the substrate so as to bring a surface of the substrate into contact with the first polishing surface, a pressing mechanism for pressing, against the first polishing surface, the surface of the substrate which has been brought into contact with the first polishing surface by the substrate carrier, a retainer ring mounted on the substrate carrier so as to surround the substrate which has been pressed against the first polishing surface by the pressing mechanism, and a retainer-ring-position-adjustment mechanism for adjustably positioning the retainer ring relative to the substrate, which has been pressed against the first polishing surface, in directions toward and away from the first polishing surface.
    Type: Grant
    Filed: May 29, 2002
    Date of Patent: May 15, 2007
    Assignee: Ebara Corporation
    Inventor: Tetsuji Togawa
  • Patent number: 7207862
    Abstract: A polishing apparatus comprises a polishing tool having a polishing surface, and a holder device (top ring) for holding a semiconductor wafer (a substrate). The polishing apparatus further comprises a color CCD camera for taking a color image of a region on the polishing surface; an image processor for determining whether or not any foreign matter exists on the polishing surface based on a condition of a color in color image data acquired by the color CCD camera; and an apparatus operation control section which in response to determination of the image processing section, stops relative movement between the semiconductor wafer and the polishing surface and separates the top ring and the polishing surface from each other.
    Type: Grant
    Filed: February 27, 2003
    Date of Patent: April 24, 2007
    Assignee: Ebara Corporation
    Inventors: Osamu Nabeya, Tetsuji Togawa
  • Patent number: 7175511
    Abstract: A magnetic polishing method capable of easily and satisfactorily polishing the inner peripheral end face of a circular hole (1) at the center part of a disk substrate (2) even if the diameter of the circular hole is reduced. By this method, a large quantity of disk substrates with stable quality can be supplied, thermal asperity trouble and head crush can be prevented from occurring on a magnetic disk, and the density of the information recording surface of the magnetic disk can be increased.
    Type: Grant
    Filed: July 9, 2004
    Date of Patent: February 13, 2007
    Assignee: Hoya Corporation
    Inventors: Masaaki Ueda, Ryuichi Kashima
  • Patent number: 7153196
    Abstract: A polishing agent for polishing a surface of a target object without unduly scratching it includes mother particles and very fine abrading particles which are supported on the surfaces of the mother particles and remain so supported during a polishing process, becoming reattached if removed. Such an agent is produced by adding the mother particles into the abrading particles and stirring them together. In a polishing process, a specified amount of such an agent is supplied onto a lapping plate and a lapping process is carried out while the plate is rotated at a specified rotational speed.
    Type: Grant
    Filed: December 4, 2001
    Date of Patent: December 26, 2006
    Assignees: Nihon Microcoating Co., Ltd.
    Inventors: Yasuhiro Tani, Lu Yishen
  • Patent number: 7144304
    Abstract: A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated, non-continuous polishing pad oriented at an angle relative to the horizontal to allow planarizing liquids and materials removed from the microelectronic substrate to flow off the polishing pad under the force of gravity. Two such polishing pads can be positioned opposite each other in a vertical orientation and can share either a common platen or a common substrate carrier. The polishing pads can be pre-attached to both a supply roll and a take-up roll to form a cartridge which can be easily removed from the apparatus and replaced with another cartridge.
    Type: Grant
    Filed: April 5, 2002
    Date of Patent: December 5, 2006
    Assignee: Micron Technology, Inc.
    Inventor: Scott E. Moore
  • Patent number: 7118462
    Abstract: A method of machining a disk for a toroidal-type continuously variable transmission, has the steps of fixing a disk to a core bar having a pair of reference portions for rotation at both end thereof, clamping the reference portions by a first center and a second center opposing the first center, abutting a first flat surface portion formed on one side surface of the disk against a reference for axial abutment, machining a first traction surface formed on another side surface of the disk, inverting the disk with the disk fixed to the core bar, clamping the pair of reference portions by the first center and the second center, abutting a second flat surface portion formed on the other side surface of the disk against the reference for axial abutment and machining a second traction surface formed on the one side surface of the disk.
    Type: Grant
    Filed: March 29, 2005
    Date of Patent: October 10, 2006
    Assignee: NSK, Ltd.
    Inventor: Kiyotaka Hirata
  • Patent number: 7118446
    Abstract: A grinding assembly for shaping work pieces that includes one or more grind spindles. Each of the grind spindles include two independent grinding wheels driven by a single spindle drive. The grind spindles translate horizontally to perform both edge and face grinding with a single grind spindle. A non-contact position sensor in a work spindle measures work spindle displacement during grinding and provides feedback to the grind spindle to regulate the force imparted on the work piece by the grind spindle. In variations, an abrasive wheel disposed radially with respect to an axis of spindle rotation is utilized to perform edge grinding of the work piece. In other variations cleaning, polishing and grinding are carried out in a single grinding assembly. In yet other variations, a wheel dressing apparatus is utilized to dress the wheel when one or more forces to maintain productivity of the grind wheel exceed a threhold.
    Type: Grant
    Filed: April 4, 2003
    Date of Patent: October 10, 2006
    Assignee: Strasbaugh, a California corporation
    Inventors: Thomas A. Walsh, Salman Moudrek Kassir
  • Patent number: 7104871
    Abstract: An apparatus and method for re-surfacing compact discs. One method is a two-step method in which the disc to be re-surfaced is first placed on a shaft. A resilient pad supports an abrasive medium and is positioned so the abrasive medium overlaps only the protective layer of the CD. The disc and abrasive material are rotated in opposite directions at about the same speed to remove deeper blemishes in a wet operation. Subsequent polishing is accomplished in a similar manner using a polishing compound instead of an abrasive. The re-surfacing and polishing apparatus each have motor driven shafts which are parallel and spaced apart and support the CD and pad in a cabinet. A transparent cover extends across the top of the cabinet. In another embodiment, the resurfacing and polishing is accomplished in a one-step operation in which polishing fluid is applied to a non-abrasive medium is utilized and the fluid is continuously recycled.
    Type: Grant
    Filed: July 13, 2004
    Date of Patent: September 12, 2006
    Inventor: Michael S. Kennedy
  • Patent number: 7101252
    Abstract: A chemical mechanical polishing method for polishing an oxide film and a protective film formed on a substrate having recesses comprises four steps. The first step planarizes the oxide film using a polishing pad and a polishing agent containing cerium oxide particles by causing relative rotational motion between the substrate and the polishing pad. The second step continues polishing the oxide film to maintain the planarized property of the oxide film. The third step polishes the oxide film until at least a portion of the protective film becomes exposed. The fourth step polishes the oxide film until the oxide film is substantially removed and the protective film is substantially exposed. During the four steps, torque values are measured on the substrate or the polishing pad, and changes in torque with time are calculated. This information is used to determine the status of each of the steps during the polishing run.
    Type: Grant
    Filed: April 25, 2003
    Date of Patent: September 5, 2006
    Assignee: Applied Materials
    Inventors: Tomohiko Kitajima, Gen Yasuhara
  • Patent number: 7094132
    Abstract: A method of magnetic-abrasive machining of parts has the steps of supporting a part, generating a magnetic field by magnetic means located at one side of the part, placing a magnetic-abrasive powder on a surface located at another, opposite side of the part, so that the magnetic-abrasive powder is attracted by the magnetic means and pressed to the surface of the part, and providing a relative movement of the parts and the magnetic abrasive powder retained by the magnetic means relative to one another so as to machine the surface of the part which is therefore open for observation and supply of the magnetic abrasive powder; and an apparatus is proposed as well.
    Type: Grant
    Filed: June 24, 2004
    Date of Patent: August 22, 2006
    Assignee: Magnetic Abrasive Technologies, Inc.
    Inventor: Gennady Kremen
  • Patent number: 7094131
    Abstract: A microelectronic substrate and method for removing conductive material from a microelectronic substrate. In one embodiment, the microelectronic substrate includes a conductive or semiconductive material with a recess having an initially sharp corner at the surface of the conductive material. The corner can be blunted or rounded, for example, by applying a voltage to an electrode in fluid communication with an electrolytic fluid disposed adjacent to the corner. Electrical current flowing through the corner from the electrode can oxidize the conductive material at the corner, and the oxidized material can be removed with a chemical etch process.
    Type: Grant
    Filed: June 21, 2001
    Date of Patent: August 22, 2006
    Assignee: Micron Technology, Inc.
    Inventors: Whonchee Lee, Scott G. Meikle, Scott E. Moore
  • Patent number: 7090567
    Abstract: A surface polishing method in which a workpiece having at least one surface for polishing is set into rotation and has said surface pressed against a polishing element that is driven with motion in rotation or in translation, wherein said surface of the workpiece presents points that are situated outside a circumference of center coinciding with the center of rotation of the workpiece and traveling, during one revolution of said workpiece, along a path comprising first and second portions, with the rate of polishing over said second portion being smaller than over said first portion, in such a manner as to compensate for an over-polishing effect that occurs on the edge of said workpiece over said first portion of the path.
    Type: Grant
    Filed: May 5, 2005
    Date of Patent: August 15, 2006
    Assignee: Societe Europeenne de Systemes Optiques
    Inventor: Jean-Jacques Fermé
  • Patent number: 7083504
    Abstract: A method of processing an antifriction bearing unit for a wheel, the antifriction bearing unit including an outer race, an inner race, a plurality of rolling elements and a flange portion for directly or indirectly mounting a brake disk provided to one of the outer and inner races, the method includes: assembling the outer and inner races and the rolling element together; after assembling, placing the one of the outer and inner race in position incapably of circumferential rotation; grinding the flange portion by bring the flange portion into contact with a grindstone which is rotated while the other of the outer and inner race is left free.
    Type: Grant
    Filed: June 14, 2004
    Date of Patent: August 1, 2006
    Assignee: Koyo Seiko Co., Ltd.
    Inventors: Takeshi Fukao, Toshihiro Nakano
  • Patent number: 7083502
    Abstract: Various methods and apparatus for simultaneously texturing two single-sided hard memory disks is provided. The two disks are placed in a concentric contact merge orientation such that the outwardly facing surface of each disk may be simultaneously subjected to texturing by equipment designed to texture one double-sided disk.
    Type: Grant
    Filed: May 9, 2003
    Date of Patent: August 1, 2006
    Assignee: Maxtor Corporation
    Inventors: Gerardo Buitron, Walter Crofton, Barry Okamoto, Lynnette A. Sagen, Nghia Ta
  • Patent number: 7066792
    Abstract: Systems and methods for beveling microfeature workpiece edges are disclosed. A system in accordance with one embodiment is configured to remove material from a microfeature workpiece having a first face, a second face facing opposite from the first face, an edge surface between the first and second faces, and an edge at a juncture between the edge surface and one of the first and second faces. The system can include a carrier positioned to carry the workpiece with the first and second faces generally normal to an axis, and a first polishing pad having a support surface and a polishing surface facing generally away from the support surface. The polishing surface can have a first shape with at least one portion oriented at an acute angle relative to the axis and the support surface to remove material from the edge of the workpiece.
    Type: Grant
    Filed: August 6, 2004
    Date of Patent: June 27, 2006
    Assignee: Micron Technology, Inc.
    Inventor: Theodore M. Taylor
  • Patent number: 7059942
    Abstract: A method of backgrinding wafers wherein backgrinding tape or a pad is applied to the chuck and not to the wafers. The backgrinding tape or pad is left on the chuck as each wafer is sequentially placed on the tape or pad, background, rinsed on the backside, removed from the tape and then cleaned on the front side and backside. A tool for applying tape to a chuck, as described herein, facilitates this method.
    Type: Grant
    Filed: November 18, 2003
    Date of Patent: June 13, 2006
    Assignee: Strasbaugh
    Inventors: Alan Strasbaugh, Salman M. Kassir
  • Patent number: 7052372
    Abstract: A polish apparatus for planarizing wafers and films over wafers comprising the following. A substrate chuck for holding a substrate with a surface to be polished thereof being directed about vertically. A first drive means for rotating the substrate chuck. A polishing head having a polishing surface which is adjacent to the substrate during the polishing of the substrate. The polishing surface of the polishing head is smaller than the surface of the substrate. A polishing solution supply means for supplying a polishing solution through the polishing head to the substrate held by the substrate chuck. A reciprocating means for reciprocally moving the polishing head on the surface to be polished. A pressing means for pressing the polishing pad against a substrate held by the substrate chuck by way of the polishing head. The polish head is preferably comprised of one piece of molded polymer. No polish pad is used.
    Type: Grant
    Filed: December 13, 2001
    Date of Patent: May 30, 2006
    Assignee: Chartered Semiconductor Manufacturing, LTD
    Inventors: Seng-Keong Victor Lim, Paul Richard Proctor, Robert Chin Fu Tsai
  • Patent number: 7052375
    Abstract: Planarizing machines, carrier heads for planarizing machines and methods for planarizing microelectronic-device substrate assemblies in mechanical or chemical-mechanical planarizing processes. In one embodiment of the invention, a carrier head includes a backing plate, a bladder attached to the backing plate, and a retaining ring extending around the backing plate. The backing plate has a perimeter edge, a first surface, and a second surface opposite the first surface. The second surface of the backing plate can have a perimeter region extending inwardly from the perimeter edge and an interior region extending inwardly from the perimeter region. The perimeter region, for example, can have a curved section extending inwardly from the perimeter edge of the backing plate or from a flat rim at the perimeter edge. The curved section can curve toward and/or away from the first surface to influence the edge pressure exerted against the substrate assembly during planarization.
    Type: Grant
    Filed: July 29, 2005
    Date of Patent: May 30, 2006
    Assignee: Micron Technology, Inc.
    Inventors: Daniel G. Custer, Aaron Trent Ward
  • Patent number: 7052363
    Abstract: A system and method for treating (e.g. polishing to remove defects) the surface of a media, such as a magnetic hard disk, while in operation, such as during dynamic electrical testing is disclosed. Further, a method for manufacturing a head for treating the surface of a media is disclosed.
    Type: Grant
    Filed: March 13, 2002
    Date of Patent: May 30, 2006
    Assignee: SAE Magnetics (H.K.), Ltd.
    Inventors: Guo Qiang Zheng, Jia Bing Shen, Yu Li, Hong Tian
  • Patent number: 7044839
    Abstract: A glass substrate for use in an information recording medium is manufactured by polishing a surface of a disc-shaped glass substrate and then performing texture processing on the surface. The texture processing includes the steps of forming lines of texture on the surface of the glass substrate extending along a circumferential direction of the glass substrate by performing a mechanical texture formation method in which the surface of the glass substrate is supplied with an abrasive slurry while an abrasive member slidably contacts the surface, and correcting the shape of the texture by removing burrs formed on the texture during the formation of the texture. The correction of the shape of the texture is performed by using a correcting pad made of foam of a synthetic resin having a 100% modulus of 3 to 40 MPa and scrubbing the surface of the glass substrate with the correcting pad in a direction intersecting the direction in which the texture extends.
    Type: Grant
    Filed: May 31, 2005
    Date of Patent: May 16, 2006
    Assignee: Hoya Corporation
    Inventor: Makoto Maeda
  • Patent number: 7044838
    Abstract: The invention provides structure and method for achieving a uniformly polished or planarized substrate such as a semiconductor wafer including achieving substantially uniform polishing between the center of the semiconductor wafer and the edge of the wafer. In one aspect the invention provides a polishing apparatus including a housing, a carrier for mounting a substrate to be polished, a retaining ring circumscribing the carrier for retaining the substrate, a first coupling attaching the retaining ring to the carrier such that the retaining ring may move relative to the carrier, a second coupling attaching the carrier to the housing such that the carrier may move relative to the housing, the housing and the first coupling defining a first pressure chamber to exert a pressure force against the retaining ring, and the housing and the second coupling defining a second pressure chamber to exert a pressure force against the subcarrier. In one embodiment, the couplings are diaphragms.
    Type: Grant
    Filed: February 27, 2004
    Date of Patent: May 16, 2006
    Assignee: EBARA Corporation
    Inventors: Gerard S. Maloney, Scott Chin, John J. Geraghty, William Dyson, Jr., Tanlin K. Dickey
  • Patent number: 7040965
    Abstract: Methods for removing material from microfeature workpieces are disclosed. A method in accordance with one embodiment of the invention includes disposing a surfactant-bearing polishing liquid between a doped silicon material of the microfeature workpiece and a polishing pad material. At least one of the workpiece and the polishing pad material is moved relative to the other to simultaneously and uniformly remove at least some of the doped silicon material from portions of the workpiece having different crystalinities and/or different doping characteristics. The surfactant can include a generally non-ionic surfactant having a relatively low concentration in the polishing liquid, for example, from about 0.001% to about 1.0% by weight.
    Type: Grant
    Filed: September 18, 2003
    Date of Patent: May 9, 2006
    Assignee: Micron Technology, Inc.
    Inventors: Theodore M. Taylor, Stephen J. Kramer
  • Patent number: 7021997
    Abstract: Provided is a multifunctional whetstone comprising a handle comprising a rear cutter, top slits of different width, and a bottom magnet; a head comprising an open mouth including a curved recess for gripping a sheet of paper and a bottom opening with two concealed abrasive blades anchored in both sides; and a yoke-shaped guide fastened at the cavity and both eyes and comprising two wings. In one operation blunt cutting edges of a blade of a knife are placed in the opening and are adapted to rub against either abrasive blade to-and-fro repeatedly. In another operation a piece of glass is cut along a predetermined line by manipulating the cutter, a portion of the glass is inserted into one conformed slit with the predetermined line aligned with an opening of the slit, and the handle is adapted to pivot to break the glass into two parts.
    Type: Grant
    Filed: May 27, 2005
    Date of Patent: April 4, 2006
    Inventor: Wen Yueh Chiang
  • Patent number: 7014536
    Abstract: A wafer polishing method which can prevent polishing swarfs from entering the gap between the periphery of a wafer and a protective tape when the back surface of the wafer is dry polished with a polishing pad after the protective tape is affixed onto the front surface of the wafer, the method comprising the steps of cutting an arcuate chamfered portion formed at the periphery of the wafer to form a precipice at the periphery of the wafer; affixing the protective tape onto the surface to be held on the chuck table of a polishing machine, of the wafer; and placing the wafer on the chuck table in such a manner that the side of the protective tape comes into contact with the chuck table to dry polish the surface of the wafer with a polishing means.
    Type: Grant
    Filed: December 1, 2004
    Date of Patent: March 21, 2006
    Assignee: Disco Corporation
    Inventor: Toshiyuki Sakai
  • Patent number: 7008310
    Abstract: A wafer carrier for use in polishing disks. The wafer carrier includes a main body and an integral visual inspection wear indicator. The main body has at least one opening formed therein adapted to receive a disk. The visual inspection wear indicator provides a visual indication of when the main body has reached the end of its useful life. The inspection wear indicator may have several portions to incrementally identify the approximate wear stage, that is, the approximate remaining useful life.
    Type: Grant
    Filed: August 1, 2002
    Date of Patent: March 7, 2006
    Assignee: Entegris, Inc.
    Inventor: Todd E. Andres
  • Patent number: 7004822
    Abstract: The invention provides a chemical mechanical polishing and pad dressing method based on differing the rotational of a pad dresser, head, and/or polishing pad to improve center removal slow profiling.
    Type: Grant
    Filed: February 28, 2003
    Date of Patent: February 28, 2006
    Assignee: Ebara Technologies, Inc.
    Inventors: Gerard Stephen Moloney, Huey-Ming Wang, Peter Lao
  • Patent number: 7001245
    Abstract: A carrier head for a chemical mechanical polishing apparatus includes a membrane with an exterior grooved surface for improved chemical mechanical polishing. The exterior grooved surface provides a path for the flow of air from the portion between the membrane and a substrate.
    Type: Grant
    Filed: March 7, 2003
    Date of Patent: February 21, 2006
    Assignee: Applied Materials Inc.
    Inventor: Hung Chih Chen
  • Patent number: 6997785
    Abstract: A wafer polishing solution and method for polishing a wafer comprising an amino acid and calcium ions or barium ions. The wafer polishing solution can be adjusted to control cut rate and selectivity for modifying semiconductor wafers using a fixed abrasive CMP process.
    Type: Grant
    Filed: December 23, 2004
    Date of Patent: February 14, 2006
    Assignee: 3M Innovative Properties Company
    Inventors: Christopher J. Rueb, Richard J. Webb, Bhaskar V. Velamakanni