Side Face Of Disk Patents (Class 451/63)
  • Patent number: 6981907
    Abstract: One or more high angle grinding units are supported by a carriage mountable on the underside of a rail grinding vehicle. Each grinding unit is attached to the carriage in a manner enabling controllable movement of the grinding units laterally, vertically, and angularly, with respect to the rails, so that a grinding stone rotated by the grinding unit can be operated to grind between a railhead and a closely adjacent rail structure to reform the gauge side of the railhead and the field side of the closely adjacent structure.
    Type: Grant
    Filed: November 3, 2004
    Date of Patent: January 3, 2006
    Assignee: RailWorks Corporation
    Inventors: Richard Korinek, Victor Jaugilas, William G. Walls
  • Patent number: 6976903
    Abstract: A CMP system accurately measures eccentric forces applied to carriers for wafer or polishing pad conditioning pucks. An initial coaxial relationship between wafer axis of rotation and a carrier axis is maintained during application of the eccentric force, such that a sensor may measure the eccentric forces. Such initial coaxial relationship is maintained by a linear bearing assembly mounted between the carrier and the sensor. The linear bearing assembly is provided as an array of separate linear bearing assemblies, and may be assembled with a retainer ring in conjunction with a motor for moving the ring relative to the wafer mounted on the carrier so that an exposed surface of the wafer and a surface of the retainer ring to be engaged by the polishing pad are coplanar during the polishing operation.
    Type: Grant
    Filed: September 3, 2003
    Date of Patent: December 20, 2005
    Assignee: Lam Research Corporation
    Inventor: Damon Vincent Williams
  • Patent number: 6974367
    Abstract: A chemical mechanical polishing process includes rotating at least one of a semiconductor substrate and polishing pad relative to the other. A chemical mechanical polishing slurry is provided intermediate the substrate and pad. The substrate is polished with the slurry and pad during the rotating. The chemical mechanical polishing slurry includes liquid and abrasive solid components. At least some of the abrasive solid component includes individually non-homogeneous abrasive particles.
    Type: Grant
    Filed: November 20, 2000
    Date of Patent: December 13, 2005
    Assignee: Micron Technology, Inc.
    Inventor: Trung Tri Doan
  • Patent number: 6942552
    Abstract: A disc repair system which is provided for the purpose of consumer-repairing of scratches on optically-read discs (e.g., digitally recorded discs, known commonly, as “CD” discs or “DVD” discs, etc., containing audio or video or other formats of data information), such that an optical reader, which uses a laser to read digital information stored on a compact disc, can read the digital information without the optical distortion caused by a scratch. The system utilizes diamond grit as an abrading compound to recondition the disc surface.
    Type: Grant
    Filed: September 18, 2003
    Date of Patent: September 13, 2005
    Inventors: Edward A. Lalli, William M. Doherty, John L. Doherty, Jr.
  • Patent number: 6942544
    Abstract: A method of precisely controlling the amount of flatness or curvature in a lapping plate is disclosed. The lapping plate is formed from two layers of metal alloys, such as tin-antimony and steel. A bimetallic effect is exploited to induce a linear expansion in the plate so that the flatness or curvature of the plate is manipulated with thermal cycling. The plate is machined and charged under very specific and tightly controlled temperatures to produce a very robust, flat plate charge. As temperature cycling induces a linear expansion along a single plane across the plate, the resultant flatness change is scalar with temperature, and can be repeated and controlled. When the plate laps magnetic sliders, the plate can be thermally cycled to produce a conical surface and a high crown-to-camber ratio can be achieved.
    Type: Grant
    Filed: September 30, 2003
    Date of Patent: September 13, 2005
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Jacey Robert Beaucage, Paul Arthur Goddu, Jeffrey P. Gunder, Eduardo Padilla, Huey-Ming Tzeng, Tsai-Wei Wu
  • Patent number: 6935925
    Abstract: An in-situ technique for the acoustic emission monitoring of burnish heads while they are cleaning or burnishing magnetic media is described. The burnishing process is monitored and controlled to identify interaction or contact between the head and media due to, for example, burnish head damage, substrate curvature problems, and lube pick-up problems. A piezoelectric sensor is mounted on the burnish arm that holds the burnish heads. When head-disk interaction occurs, stress waves travel through the head to the sensor and an amplified signal is gathered in a tester database as an acoustic emission. Abnormal conditions will trigger an unusual emission that is detected to trigger an alert.
    Type: Grant
    Filed: June 30, 2004
    Date of Patent: August 30, 2005
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Parul Agrawal, Bradley Frederick Baumgartner, Norman Chu, Charles Lee, Tony Mello, Christopher Ramm, Bob Clyde Robinson
  • Patent number: 6923710
    Abstract: An apparatus and method for chemical mechanical polishing are disclosed. An example apparatus for use with a chemical mechanical polishing (CMP) process includes a polishing part configured to perform a CMP process to a polishing endpoint for a polishing target deposited on a substrate, a cleaning part configured to clean the substrate, and a resistance measurement part configured to measure a sheet resistance of the substrate. The example apparatus also includes a CMP control part configured to determine based on the sheet resistance whether a residual target exists, to estimate re-polishing time, and to control the polishing part to perform a re-polishing process if the residual target exists.
    Type: Grant
    Filed: August 2, 2004
    Date of Patent: August 2, 2005
    Inventor: Jae Won Han
  • Patent number: 6921322
    Abstract: The invention features a self-contained, portable apparatus for performing precision grinding operations on metal disks of up to, e.g., 54 inches in diameter. The apparatus can be attached to the surface of the disk to be refinished and is leveled using special precision leveling adjusters. During operation, the adjusters are turned in precision increments to set the depth of cut. The grinder is then rotated on an arm about the center of the disk, by the use of a hydraulically driven speed reducer, rotor, bearing assembly. In a further aspect, the invention includes a dressing assembly for performing dressing-truing on a vitreous wheel when the wheel is in grinding position. The in position dressing assembly dresses a grinding wheel at up to 0.00125-inch increments.
    Type: Grant
    Filed: January 24, 2003
    Date of Patent: July 26, 2005
    Assignee: Artisan Industries, Inc.
    Inventors: Andrew E. Donovan, Edmund L. Pessa, David A. Hudson, Victor Takata
  • Patent number: 6916226
    Abstract: A chemical mechanical processing apparatus includes a polishing pad capable of polishing a substrate; a stepped retaining having an inner side, a bottom side, and an open region, the open region extending radially outward from the inner side and upward from the bottom side, the open region providing space for pad rebound, the open region further having a plurality of tips to hold a substrate in position during rotation of the substrate against the polishing pad, the stepped retaining ring capable of rotating the substrate against the polishing pad; and a dispenser capable of dispensing a slurry onto the pad.
    Type: Grant
    Filed: December 13, 2002
    Date of Patent: July 12, 2005
    Assignee: Ebara Technologies, Inc.
    Inventors: Gerard Stephen Moloney, Huey-Ming Wang
  • Patent number: 6913520
    Abstract: A semiconductor wafer has a top surface and an edge bevel surface, and a first material layer and a second material layer are respectively formed on the top surface and the edge bevel surface. A surface chemical mechanical polishing (surface CMP) process is performed to polish and remove portions of the first material layer down to a first thickness, and a rim CMP process is performed to completely remove the second material layer on the edge bevel surface down to the edge bevel surface thereafter to achieve a smooth surface of the edge bevel surface. Finally, a chemical cleaning process is performed to clean the edge bevel surface and the top surface, and the semiconductor wafer is dried thereafter.
    Type: Grant
    Filed: January 16, 2004
    Date of Patent: July 5, 2005
    Assignee: United Microelectronics Corp.
    Inventors: Mu-Liang Liao, Chi-Piao Cheng, Te-Sung Hung, Yung-Chieh Kuo
  • Patent number: 6908369
    Abstract: An apparatus for smoothing a surface of a rotatably supported substrate includes a base plate, a block having an extending arm structure and being attached to the base plate so as to be movable along the surface of the base plate, a roller attached to a tip portion of the arm structure in a direction perpendicular to the base plate, a mobile member attached to the arm structure so as to be movable perpendicularly to the axial direction of the roller, a tape-running device attached to the base plate for feeding and taking up a polishing tape through the roller so as to advance the tape around the mobile member, and a moving device attached to the arm structure of the block for moving the mobile member.
    Type: Grant
    Filed: July 9, 2003
    Date of Patent: June 21, 2005
    Assignee: NIHON Microcoating Co., Ltd.
    Inventor: Tetsujiro Tada
  • Patent number: 6905399
    Abstract: Embodiments of a conditioning mechanism for a chemical mechanical polishing system have been provided. In one embodiment, a conditioning mechanism includes a rotor assembly and a conditioning element mounting assembly. A seal is disposed between the rotor assembly and conditioning element mounting assembly and bounds one surface of an expandable plenum defined between the rotor assembly and conditioning element mounting assembly. A spring is disposed between the rotor and conditioning element mounting assemblies and is adapted to bias a lower surface of the conditioning element mounting assembly towards the rotor assembly.
    Type: Grant
    Filed: April 10, 2003
    Date of Patent: June 14, 2005
    Assignee: Applied Materials, Inc.
    Inventor: David J. Lischka
  • Patent number: 6899595
    Abstract: Finishing a seal assembly as a unit is proposed, which prevents alignment of the end gaps of the annular body and the annular ring of the seal assembly, provides the ability to manufacture the seal assembly to very low tolerances, and establishes virtually perfect parallelism between the upper and lower surfaces of the seal assembly. A finishing process is characterized by lapping a seal assembly as an assembled unit with a lapper using gritted oil as a polishing medium.
    Type: Grant
    Filed: March 28, 2003
    Date of Patent: May 31, 2005
    Inventors: Maurice J. Moriarty, Matthew V. Hartford, Joseph D. Moriarty
  • Patent number: 6887133
    Abstract: Embodiments of the invention as directed to supporting a polishing pad that can be easily replaced. In one embodiment, a method for polishing an object comprises coupling a polishing head to a substrate for holding a polishing pad which is smaller in area than the object; applying a resilient mechanical force to the perimeter of the substrate with the polishing head to hold the substrate in place during a polishing operation; placing the polishing pad in contact with the object; and rotating the polishing pad with the polishing head.
    Type: Grant
    Filed: March 4, 2003
    Date of Patent: May 3, 2005
    Assignee: Strasbaugh
    Inventor: David G. Halley
  • Patent number: 6881133
    Abstract: A double surface grinding method for a vertical type of double disc surface grinding machine in which upper and lower ground surfaces of a work like a disc brake are ground simultaneously. The entire vertical moving stroke of the grinding wheel includes an idle feed stroke in which the wheel moves at a specified idle feed speed from the waiting position to a detection start position before contacting with the ground surface; a detection stroke in which the wheel moves at a detection speed lower than the idle feed speed from the detection start position to a detection end position after contacting with the ground surface then the wheel detects a grinding start position; and a grinding stroke in which the wheel moves at a grinding speed from the grinding start position to a grinding end position.
    Type: Grant
    Filed: May 16, 2003
    Date of Patent: April 19, 2005
    Assignee: Daisho Seiki Corporation
    Inventors: Akiyoshi Saitoh, Masahiko Hamada
  • Patent number: 6881134
    Abstract: A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a membrane formed from a compressible, flexible material, such as neoprene or silicone, and having a first portion with a thickness greater than that of a second portion. The membrane can be aligned with the microelectronic substrate to bias the microelectronic substrate against a planarizing medium such that the first portion of the membrane biases the microelectronic substrate with a greater downward force than does the second portion of the membrane. Accordingly, the membrane can compensate for effects, such as varying linear velocities across the face of the substrate that would otherwise cause the substrate to planarize in a non-uniform fashion or, alternatively, the membrane can be used to selectively planarize portions of the microelectronic substrate at varying rates.
    Type: Grant
    Filed: July 20, 2001
    Date of Patent: April 19, 2005
    Assignee: Micron Technology, Inc.
    Inventor: Nathan R. Brown
  • Patent number: 6875086
    Abstract: Embodiments of methods and apparatus in accordance with the present invention provide a chemical mechanical planarization (CMP) process that provides single or multiple polishing pads to have a different rotational velocity, applied pressure and oscillation frequency on the surface of the substrate to address and compensate for the WIW (with-in-substrate) and WID (with-in-die) non-uniformities in planarization ability. The velocity of each polishing pad is adjustable providing a closer match to the substrate surface velocity over a particular zone to yield a linear velocity on the surface of the substrate.
    Type: Grant
    Filed: January 10, 2003
    Date of Patent: April 5, 2005
    Assignee: Intel Corporation
    Inventors: Reza M. Golzarian, Mansour Moinpour
  • Patent number: 6875085
    Abstract: A polishing system such as a chemical mechanical belt polisher includes a hydrostatic fluid bearing that supports polishing pads and incorporates one or more of the following novel aspects. One aspect uses compliant surfaces surrounding fluid inlets in an array of inlets to extend areas of elevated support pressure around the inlets. Another aspect modulates or reverses fluid flow in the bearing to reduce deviations in the time averaged support pressure and to induce vibrations in the polishing pads to improve polishing performance. Another aspect provides a hydrostatic bearing with a cavity having a lateral extent greater than that of an object being polished. The depth and bottom contour of cavity can be adjusted to provide nearly uniform support pressure across an area that is surrounded by a retaining ring support. Changing fluid pressure to the retaining ring support adjusts the fluid film thickness of the bearing.
    Type: Grant
    Filed: September 23, 2002
    Date of Patent: April 5, 2005
    Assignee: Mosel Vitelic, Inc.
    Inventors: David E. Weldon, Shu-Hsin Kao, Tim H. Huynh
  • Patent number: 6872131
    Abstract: A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a membrane formed from a compressible, flexible material, such as neoprene or silicone, and having a first portion with a thickness greater than that of a second portion. The membrane can be aligned with the microelectronic substrate to bias the microelectronic substrate against a planarizing medium such that the first portion of the membrane biases the microelectronic substrate with a greater downward force than does the second portion of the membrane. Accordingly, the membrane can compensate for effects, such as varying linear velocities across the face of the substrate that would otherwise cause the substrate to planarize in a non-uniform fashion or, alternatively, the membrane can be used to selectively planarize portions of the microelectronic substrate at varying rates.
    Type: Grant
    Filed: July 20, 2001
    Date of Patent: March 29, 2005
    Assignee: Micron Technology, Inc.
    Inventor: Nathan R. Brown
  • Patent number: 6869340
    Abstract: A polishing cloth has a base material of a woven cloth formed by weaving in woven bundles of plastic fibers and its surface layer is formed by portions of these woven bundles which are cut and raised from a surface. When such a polishing cloth is used for texturing a target surface of a disk substrate, the target surface is rubbed by such a cloth while a liquid slurry containing free abrasive particles are supplied to the surface.
    Type: Grant
    Filed: March 18, 2003
    Date of Patent: March 22, 2005
    Assignee: Nihon Microcoating Co., Ltd.
    Inventors: Yuji Horie, Yoshitomo Aoyama
  • Patent number: 6866564
    Abstract: A method of backgrinding wafers wherein backgrinding tape or a pad is applied to the chuck and not to the wafers. The backgrinding tape or pad is left on the chuck as each wafer is sequentially placed on the tape or pad, background, and then removed from the tape. A tool for applying tape to a chuck, as described herein, facilitates this method.
    Type: Grant
    Filed: December 10, 2002
    Date of Patent: March 15, 2005
    Assignee: Strasbaugh
    Inventors: Alan Strasbaugh, Salman M. Kassir
  • Patent number: 6863590
    Abstract: The wafer planarization apparatus comprises a processing part which holds a wafer through a protective sheet adhering to the obverse of the wafer and processes the reverse of the wafer, an inspecting device which inspects the wafer having been processed by the processing part, a frame adhering part which adheres a frame through a sheet to the reverse of the wafer having been inspected by the inspecting device, a peeling part which peels the protective sheet from the wafer to which the frame has been adhered, and a transporting device which transports the wafer between the processing part, the inspecting device, the frame adhering part, and the peeling part, so that the series of processing for the wafer can be systematized in line.
    Type: Grant
    Filed: May 20, 2002
    Date of Patent: March 8, 2005
    Assignee: Tokyo Seimitsu Co., Ltd.
    Inventor: Kazuo Kobayashi
  • Patent number: 6852017
    Abstract: A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a membrane formed from a compressible, flexible material, such as neoprene or silicone, and having a first portion with a thickness greater than that of a second portion. The membrane can be aligned with the microelectronic substrate to bias the microelectronic substrate against a planarizing medium such that the first portion of the membrane biases the microelectronic substrate with a greater downward force than does the second portion of the membrane. Accordingly, the membrane can compensate for effects, such as varying linear velocities across the face of the substrate that would otherwise cause the substrate to planarize in a non-uniform fashion or, alternatively, the membrane can be used to selectively planarize portions of the microelectronic substrate at varying rates.
    Type: Grant
    Filed: July 20, 2001
    Date of Patent: February 8, 2005
    Assignee: Micron Technology, Inc.
    Inventor: Nathan R. Brown
  • Patent number: 6843704
    Abstract: A method and apparatus for automatically loading and unloading wafer crystals to and from a double-sided polishing machine of the type having an upper and a lower polishing plate, runner disks with reception openings for the wafer crystals, and a drive to move runner disks to a predetermined loading and unloading position. The position of the centers of the reception openings in a runner disk located in the loading position is measured and stored by means of an optical identification system. A gripping means of a robot arm is successively oriented towards the measured center positions of the reception openings, and the position of the centers of the individual openings is determined and stored by first and second optical identification systems. The individual wafer crystals are tilted while being inserted by the gripping means of the loading arm into the reception openings.
    Type: Grant
    Filed: July 8, 2002
    Date of Patent: January 18, 2005
    Assignee: Peter Wolters Werkzeugmaschinen GmbH
    Inventor: Eberhard Potempka
  • Patent number: 6835119
    Abstract: A method for lapping which eliminates lapping damage includes a high-speed lapping operation at a high torque which is continuously performed after performing intermittently a low-speed lapping operation under low torque on a workpiece. Therefore, the excessive load during a first lapping stage due to the projection on the surface of the workpiece is greatly decreased. A continuous lapping is performed after the projection becomes smooth to some extent, and thus the lapping damage is prevented.
    Type: Grant
    Filed: February 27, 2004
    Date of Patent: December 28, 2004
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Nobuyuki Hori
  • Patent number: 6817926
    Abstract: A method of chemically modifying a wafer suited for fabrication of semiconductor devices includes a) contacting a surface of wafer with an article that includes a plurality of unit cells repeating across the surface of the article, the individual unit cells including at least a portion of a three-dimensional structure and being characterized by a unit cell parameter as follows: [[V1−Vs]/Aas]/Auc>5 where V1 is the volume defined by the area of the unit cell and the height of the structure of the unit cell, Vs is the volume of the structure of the unit cell, Aas is the apparent contact area of the structure of the unit cell, and Auc is the area of the unit cell, and b) moving at least one of the wafer and the article relative to each other in the presence of a polishing composition that is chemically reactive with a surface of the wafer and capable of either enhancing or inhibiting the rate of removal of at least a portion of the surface of the wafer.
    Type: Grant
    Filed: June 19, 2003
    Date of Patent: November 16, 2004
    Assignee: 3M Innovative Properties Company
    Inventors: Jeffrey S. Kollodge, Robert P. Messner
  • Patent number: 6814651
    Abstract: An end face polishing machine has a jig plate for supporting at least one workpiece. A polishing plate is mounted to undergo rotation and revolving movement. A polishing sheet is disposed over the polishing plate for rotation and revolving movement therewith. An elastic member having a hardness that varies with temperature is disposed between the polishing sheet and the polishing plate. A pressing unit presses the end face of the workpiece against a surface of the polishing sheet during rotation and revolving movement of the polishing plate to thereby polish the end face of the workpiece during a polishing operation. A temperature control unit controls the temperature of the elastic member during the polishing operation to thereby polish the end face of the workpiece into a spherical surface during the polishing operation.
    Type: Grant
    Filed: July 12, 2002
    Date of Patent: November 9, 2004
    Assignee: Seiko Instruments Inc.
    Inventors: Yoshitaka Enomoto, Kouji Minami, Junji Taira
  • Patent number: 6805617
    Abstract: The process describes how transmission gears (6) can be manufactured in a highly economical and highly precise manner. In one single mounting, the complete hard fine-machining on all of the most important functional surfaces of the workpiece is conducted simultaneously. This multi-process is made possible through the combined use of a continuous generating grinding process for the machining of gearing, a known method for the machining of the boring and possibly of a frontal surface, and the fixing of workpieces (6) on form elements such as chamfers or plane surfaces by means of centering elements (9, 10) which are designed in such a way that they do not block the free access of the individual tools (5, 11, 28) to the surfaces (7, 8, 27) to be machined.
    Type: Grant
    Filed: January 16, 2002
    Date of Patent: October 19, 2004
    Assignee: Reishauer AG
    Inventor: Walter Wirz
  • Patent number: 6802760
    Abstract: Vending apparatus for optical disk restoration has a housing for receiving the disk form a customer; a disk inspection device to determine whether the disk is correctly positioned for polishing and providing a signal indicative of disk position, a disk perforation detecting device providing a signal indicative of any perforation in a reflective layer of the disk; and a device for ejecting a perforated disk from the housing. A user interface requests and receives payment from a customer in response to a signal by the detecting device that the reflective layer is imperforate and provides a signal indicating receipt of correct payment. Polishing wheels polish, with slurry, an exposed light receiving surface of a data carrying protective layer of the disk to ameliorate scratches in response to a signal from the user interface of correct payment and a device ejects a polished disk from the housing to a customer.
    Type: Grant
    Filed: March 19, 2003
    Date of Patent: October 12, 2004
    Inventor: Steven G. Goldstein
  • Patent number: 6800019
    Abstract: An abrasive ground fabric which is a composite ground fabric comprising a fiber substrate and a elastic polymer filled in the fiber substrate, wherein (1) the fiber substrate is composed of bundles, each consisting of 20 to 3,000 fine fibers, and (2) the average diameter (D1) of fine fibers existent in a center portion from the center of the cross section perpendicular to a lengthwise direction of each bundle to ½ of the radius of each bundle is 0.3 to 10 &mgr;m, the average diameter (D2) of fine fibers existent in a peripheral portion from ½ of the radius to the end of each bundle is 0.05 to 1 &mgr;m, and the D1/D2 ratio is 1.5 or more. According to the present invention, the abrasive ground fabric is suitably used for the texturing of a substrate in the production of a magnetic recording medium, particularly a hard disk, enables high-accuracy surface finish and has excellent strength.
    Type: Grant
    Filed: July 31, 2002
    Date of Patent: October 5, 2004
    Assignee: Teijin Limited
    Inventors: Manabu Tanaka, Yoshiyuki Suzuki, Shusuke Kitawaki, Masahisa Mimura
  • Patent number: 6790123
    Abstract: Layers of material deposited exhibit both a local and a global pattern. The local pattern is a function of the underlying wafer surface, but the global pattern is a function of the equipment in which the layer was deposited. Accurate reconstruction of the surface topology of a layer on a product wafer is achieved despite the local pattern by determining the surface topology of a blanket layer on a blank wafer, measuring the thickness of the layer at a few selected locations on a product wafer, calculating scaling coefficients representing deviations of the measured thickness from the blanket layer topology, and then multiplying the blanket layer topology by the scaling coefficients. The surface reconstruction results from modifying the surface topology of the blanket layer so that it has the same thickness at the measured locations as does the product wafer layer.
    Type: Grant
    Filed: May 16, 2002
    Date of Patent: September 14, 2004
    Assignee: Speedfam-IPEC Corporation
    Inventors: Nikolay Korovin, Stephen C. Schultz
  • Patent number: 6782717
    Abstract: A method for manufacturing a disk-like glass substrate that is used as an information recording medium. The glass substrate is acid resistant. When an index of acid resistance is the maximum depth at which components other than silica dissolve from the glass substrate during immersion of the glass substrate in 1 percentage of weight of sulfuric acid, the acid resistance of the glass substrate is represented by the maximum depth of 0.5 nm to 10 nm. A linear texture is formed by pressing a tape against the glass substrate in a circumferential direction of the glass substrate while feeding abrasion slurry to the surface of the glass substrate. Acid treatment is performed on the glass substrate on which the texture is formed.
    Type: Grant
    Filed: January 16, 2003
    Date of Patent: August 31, 2004
    Assignee: Hoya Corporation
    Inventors: Yasuhiro Saito, Kazuishi Mitani, Tatsuro Umeyama, Koji Okuhata, Toshiaki Hashimoto
  • Patent number: 6783432
    Abstract: A method and composition for planarizing a substrate. The composition includes a pressure sensitive solution and one or more chemical agents for complexing with a metal or oxidized metal. The method for removal of a copper containing layer from a substrate surface, comprising applying a composition to a polishing media, the composition comprising a pressure sensitive solution, and one or more chemical agents for complexing with a metal or oxidized metal, and polishing the substrate surface with the polishing media.
    Type: Grant
    Filed: June 4, 2001
    Date of Patent: August 31, 2004
    Assignee: Applied Materials Inc.
    Inventors: Jui-Lung Li, Yuchun Wang, Rajeev Bajaj, Fred C. Redeker
  • Patent number: 6783426
    Abstract: The present invention for a method and apparatus for detection of chemical mechanical planarization endpoint and device planarity comprises imparting at least one variation of an atomic mass of at least one material within the layer. The variation of the atomic mass within the layer is indicative of the layer thickness. The removal of the layer is monitored by detecting the variation in the atomic mass, and/or a change in concentration of the at least one material, during removal of the layer. Once the concentration of the material reaches a minimum threshold, or an atomic mass is detected at a minimum intensity, within a predetermined time duration, the removal of the layer is terminated. The variation in atomic mass, and/or concentration of materials within the layer is used to measure a planarity of the device.
    Type: Grant
    Filed: April 10, 2002
    Date of Patent: August 31, 2004
    Assignee: Agere Systems, Inc.
    Inventors: Jennifer Lynne Drown, Kim Elshot, Erik Cho Houge, Tingkwan Cheung
  • Patent number: 6780090
    Abstract: An apparatus and method for re-surfacing compact discs. The method is a two-step method in which the disc to be re-surfaced is first placed on a shaft. A resilient pad supports an abrasive medium and is positioned so the abrasive medium overlaps only the protective layer of the CD. The disc and abrasive material are rotated in opposite directions at about the same speed to remove deeper blemishes in a wet operation. Subsequent polishing is accomplished in a similar manner using a polishing compound instead of an abrasive. The re-surfacing and polishing apparatus each have motor driven shafts which are parallel and spaced apart and support the CD and pad in a cabinet. A transparent cover extends across the top of the cabinet.
    Type: Grant
    Filed: November 21, 2001
    Date of Patent: August 24, 2004
    Inventors: Michael S. Kennedy, Justin R. Hastings
  • Patent number: 6772507
    Abstract: A method of manufacturing a magnetic recording medium having a disc-shaped flexible slave medium accommodated in a case, onto which servo signals are effectively recorded by a magnetic transfer method with high quality. The method includes a slitting step for cutting an original sheet into discrete webs; a punching step for obtaining a disc-shaped slave medium; a thermo step for removing distortion; a burnishing step for smoothing a surface of the slave medium; a center core attachment step; a magnetic transfer step for performing a magnetic transfer while a master medium is allowed to be brought into close contact with one of the web and the slave medium; an assembly step for incorporating slave medium into the case; a cleaning step for cleaning a surface of the slave medium; a verifying step for checking the servo signals; and a packing step.
    Type: Grant
    Filed: September 12, 2001
    Date of Patent: August 10, 2004
    Assignee: Fuji Photo Film Co., Ltd.
    Inventor: Masashi Aoki
  • Patent number: 6769961
    Abstract: A chemical mechanical planarization (CMP) apparatus includes a bath of an aqueous solution. A first holder, which is configured to support a wafer, is disposed within the bath. A first spindle is configured to rotate the first holder. A second holder, which is rotated by a second spindle, is disposed above the first holder. The second holder supports a planarization media, which is disposed within the bath. The planarization media is oriented to face the surface of the first holder on which the wafer is to be supported. The planarization media can be a pad containing polyurethane or a substrate having an overlying abrasive film. The CMP apparatus also can include a system for recirculating and reconditioning the aqueous solution. A method for performing a CMP process also is described.
    Type: Grant
    Filed: January 15, 2003
    Date of Patent: August 3, 2004
    Assignee: Lam Research Corporation
    Inventors: Rodney C. Kistler, Aleksander Owczarz
  • Patent number: 6758726
    Abstract: An invention is provided for a carrier head that includes a metal plate having an opening formed in a central location. The metal plate has a wafer side, which faces the backside of a wafer during a CMP operation, and a non-wafer side. Positioned above the non-wafer side of the metal plate, and located above the opening in the metal plate, is a bladder or membrane. To facilitate uniformity during polishing, an inflating pressure is applied to the bladder, or membrane, that is substantially equivalent to a polishing pressure utilized during the CMP operation. To facilitate transporting the wafer, a vacuum can be applied to the opening in the metal plate to adhere the wafer to the carrier head. Further, to release the wafer from the carrier head, the bladder, or membrane, can be inflated such that it protrudes through the opening in the metal plate.
    Type: Grant
    Filed: June 28, 2002
    Date of Patent: July 6, 2004
    Assignee: Lam Research Corporation
    Inventor: Peter Renteln
  • Patent number: 6755722
    Abstract: Minute and uniform line marks can be formed on the surface of a glass substrate for a magnetic disk by pressing a woven cloth tape comprising plastic fibers preferably by a rubber roller with hardness greater than 60 and causing it to run thereover while supplying a suspension containing abrading particles and a solution which contains hydroxyl groups such as a KOH solution.
    Type: Grant
    Filed: June 8, 2000
    Date of Patent: June 29, 2004
    Assignee: Nihon Microcoating Co., Ltd.
    Inventors: Yuji Horie, Takabumi Marukawa, Kanichi Endo
  • Publication number: 20040116053
    Abstract: Embodiments of the invention abrade the information bearing surface of a compact disc (CD), DVD or other digital information bearing disk, in order to render it unreadable by standard consumer grade disk readers. This is accomplished via embodiments of the invention that are extremely lightweight, highly portable and inexpensive. Embodiments may or may not employ an outer case in order to retain the remnants of the abraded information layer of the disk. In order to operate one embodiment of the invention, the apparatus is opened and a compact disc is inserted with the face of the disk against the abrasive mechanism. After closing the apparatus, the outer housing of the apparatus is rotated with sufficient pressure against the abrasive mechanism in order to cause the substrate to be damaged sufficiently to render it unreadable by consumer based disk readers. The apparatus can be opened over a trash bin in order to empty both the disk and the particulate matter generated by the abrasive process.
    Type: Application
    Filed: September 11, 2003
    Publication date: June 17, 2004
    Applicant: DISC DEALER INC.
    Inventors: Carlo Smith, Les Kollegian
  • Patent number: 6749485
    Abstract: An improved pad and process for polishing metal damascene structures on a semiconductor wafer. The process includes the steps of pressing the wafer against the surface of a polymer sheet in combination with an aqueous-based liquid that optionally contains sub-micron particles and providing a means for relative motion of wafer and polishing pad under pressure so that the moving pressurized contact results in planar removal of the surface of said wafer, wherein the polishing pad has a low elastic recovery when said load is removed, so that the mechanical response of the sheet is largely anelastic. The improved pad is characterized by a high energy dissipation coupled with a high pad stiffness and hydrolytic stability.
    Type: Grant
    Filed: September 20, 2000
    Date of Patent: June 15, 2004
    Assignee: Rodel Holdings, Inc.
    Inventors: David B. James, Arun Vishwanathan, Lee Melbourne Cook, Peter A. Burke, David Shidner, Joseph K. So, John V. H. Roberts
  • Patent number: 6746308
    Abstract: In one illustrative embodiment, the method comprises providing a plurality of wafer lots, each of the lots comprising a plurality of wafers, performing at least one process operation on at least some of the wafers in each of the plurality of lots, identifying processed wafers having similar characteristics, re-allocating the wafers to lots based upon the identified characteristics, and performing additional processing operations on the identified wafers having similar characteristics in the re-allocated lots. In one illustrative embodiment, the system comprises a first processing tool for performing processing operations on each of a plurality of wafers in each of a plurality of wafer lots, a controller for identifying processed wafers having similar characteristics and re-allocating the wafers to lots based upon the identified characteristics, and a second processing tool adapted to perform additional processing operations on the identified wafers having similar characteristics in the re-allocated lot.
    Type: Grant
    Filed: July 11, 2001
    Date of Patent: June 8, 2004
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Christopher A. Bode, Alexander J. Pasadyn
  • Patent number: 6736696
    Abstract: A method of improving uniformity control in chemical mechanical polishing (CMP). A CMP apparatus is provided with at least a platen, a polishing pad disposed on the platen and at least a polishing carrier installed over the platen. The platen rotates in a first rotating direction, and the polishing carrier is used to press a wafer on the polishing pad and drive the wafer to rotate. First, in a first-CMP step, the polishing carrier rotates in a second rotating direction. Then, in a second-CMP step, the polishing carrier rotates in a third rotating direction different from the second rotating direction.
    Type: Grant
    Filed: April 30, 2002
    Date of Patent: May 18, 2004
    Assignee: ProMOS Technologies Inc.
    Inventors: Cheng-An Peng, Guan-Jiun Yi
  • Patent number: 6726534
    Abstract: The invention provides a polishing system that comprises a liquid carrier, an alkali metal ion, hydroxide ions, and a polishing pad and/or an abrasive. The abrasive can be dispersed in the liquid carrier of the polishing system or bound to the polishing pad. The alkali metal ion can be any univalent group I metal ion and is present in the polishing system at a concentration of about 0.05 M or more. Hydroxide ions are present in a sufficient amount to provide the system with a pH of about 9 or more. The liquid carrier of the polishing system can be any suitable polar solvent, such as water. The invention further provides a polishing method that involves polishing a portion of a substrate with the polishing system beginning about 6 hours or less after the polishing system is prepared.
    Type: Grant
    Filed: February 28, 2002
    Date of Patent: April 27, 2004
    Assignee: Cabot Microelectronics Corporation
    Inventors: Gregory H. Bogush, Jeffrey P. Chamberlain, Paul M. Feeney, Brian L. Mueller, David J. Schroeder, Alicia F. Walters
  • Patent number: 6726525
    Abstract: A double side grinding apparatus comprises a pair of grinding wheels (4), work rotating device (1) and moving device (2).
    Type: Grant
    Filed: August 28, 2001
    Date of Patent: April 27, 2004
    Assignees: Shin-Estu Handotai Co., Ltd., Koy Machine Industries Co., Ltd.
    Inventors: Tadahiro Kato, Shunichi Ikeda, Kenji Ohkura
  • Patent number: 6722951
    Abstract: A method for lapping which eliminates lapping damage includes a high-speed lapping operation at a high torque which is continuously performed after performing intermittently a low-speed lapping operation under low torque on a workpiece. Therefore, the excessive load during a first lapping stage due to the projection on the surface of the workpiece is greatly decreased. A continuous lapping is performed after the projection becomes smooth to some extent, and thus the lapping damage is prevented.
    Type: Grant
    Filed: December 9, 2002
    Date of Patent: April 20, 2004
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Nobuyuki Hori
  • Patent number: 6722957
    Abstract: A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated, non-continuous polishing pad oriented at an angle relative to the horizontal to allow planarizing liquids and materials removed from the microelectronic substrate to flow off the polishing pad under the force of gravity. Two such polishing pads can be positioned opposite each other in a vertical orientation and can share either a common platen or a common substrate carrier. The polishing pads can be pre-attached to both a supply roll and a take-up roll to form a cartridge which can be easily removed from the apparatus and replaced with another cartridge.
    Type: Grant
    Filed: April 5, 2002
    Date of Patent: April 20, 2004
    Assignee: Micron Technology, Inc.
    Inventor: Scott E. Moore
  • Patent number: 6716087
    Abstract: A dresser is used which makes it possible to simultaneously dress and condition the surface of a polishing pad deteriorated by polishing a semiconductor wafer in the CMP process. The dresser is a dresser comprised of a ceramic such as dressing SiC, SiN, alumina or silica. Use of this dresser enables to shorten the time of dressing/conditioning the deteriorated polishing pad.
    Type: Grant
    Filed: April 23, 2001
    Date of Patent: April 6, 2004
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Naoto Miyashita, Yoshihiro Minami
  • Publication number: 20040063388
    Abstract: A disc repair system which is provided for the purpose of consumer-repairing of scratches on optically-read discs (e.g., digitally recorded discs, known commonly, as “CD” discs or “DVD” discs, etc., containing audio or video or other formats of data information), such that an optical reader, which uses a laser to read digital information stored on a compact disc, can read the digital information without the optical distortion caused by a scratch. The system utilizes diamond grit as an abrading compound to recondition the disc surface.
    Type: Application
    Filed: September 18, 2003
    Publication date: April 1, 2004
    Inventors: Edward A. Lalli, William M. Doherty, John L. Doherty
  • Patent number: 6712673
    Abstract: A wafer polishing apparatus for polishing a semiconductor wafer. The polisher comprises a base, a turntable, a polishing pad and a head drive mechanism for driven rotation of a polishing head. The polishing head comprises a sealing ring adapted to hold at least one wafer for engaging a front surface of the wafer with a work surface of the polishing pad. The sealing ring allows for application of uniform air pressure over the rear surface of the wafer. The sealing ring is constructed so that the wafer itself defines a portion of a pressure cavity receiving pressurized air.
    Type: Grant
    Filed: October 4, 2001
    Date of Patent: March 30, 2004
    Assignee: MEMC Electronic Materials, Inc.
    Inventors: Peter Albrecht, Ashley Samuel Hull, David Vadnais