Abstract: The wheel outer rim groove polishing device includes three major systems, which are a wheel rotation system which is used for positioning, clamping and rotating of a wheel, thereby polishing all grooves in the circumferential direction of the wheel, a left polishing system for reciprocally polishing groove tool grains in the longitudinal direction, and a right polishing system for reciprocally polishing groove tool grains in the transverse direction; and three systems cooperate with each other and are combined orderly to jointly complete the polishing of tool grains on the wheel outer rim grooves. The present disclosure can meet the requirements for polishing the tool grains on the wheel outer rim grooves. Compared with artificial polishing, the device improves the polishing effect, improves the work efficiency, and reduces the risk of rim deformation. The device has the characteristics of high efficiency, practicality, easy manufacture, flexible operation and the like.

Abstract: The present disclosure provides a cleaning machine that simplifies the structure around a turn table. The cleaning machine (10) of the present disclosure comprises a cleaning table (31), a rotation mechanism (40), and a first flow path (5a˜5e). The rotation mechanism includes a motor (42), a first bevel gear (44), a reducer (50) having an output shaft (52) and an input shaft (51), a second bevel gear (56), a first swivel housing (60) inserted into the input shaft (51), a first swivel shaft (61) arranged inside the first swivel housing, and a first flange (62). The first flow path includes a first annular path (63a˜63e), a first upstream flow path (64a˜64e), and a first downstream flow path (65a˜65e) arranged inside the first swivel shaft and connected to the first upstream flow path via the first annular path.

Abstract: An automated method for reconditioning a plurality of digital discs within a reconditioning apparatus is disclosed. The method comprises holding the digital discs in a load area, and then transferring each of the digital discs from the load area to at least one workstation with a disc transfer mechanism. The method also comprises reconditioning each of the digital discs transferred to the workstation with at least one worktool operable to remove a portion of the protective coating of each of the digital discs without removal of the data underlying the protective coating. The method further comprises transferring each of the digital discs from the workstation to an unload area with the disc transfer mechanism, and then holding the digital discs in the unload area for manual retrieval. Advantageously, the digital discs may be automatically reconditioned within the reconditioning apparatus without manual manipulation of the digital discs during the reconditioning process.

Abstract: A fiber optic connector fiber stub remover and method for automated fiber stub removal. The device has a top plate with a platen opening, and a platen with a well that carries a polishing film over the well. An air pocket is formed between the polishing film and the well. The platen is positioned with a top surface of the polishing film accessible via the platen opening. A fixture holds connector ends of fiber optic cables with fiber stubs extending therefrom, and a weight biases the fiber stubs into contact with the polishing film. A motor is controlled by a motor control unit to control a ramp up time and final speed of movement of the platen over a timespan. Each connector ends moves independently relative to the polishing film. The air pocket provides shock absorption of the polishing film so that an ideal pressure is exerted on each fiber stub during stub removal.

Abstract: Methods and devices for milling a channel-shaped cavity by a five-axis computer numerical control (CNC) machine by selecting a workpiece to be machined, determining cutting tool flow along the channel-shaped cavity, determining cutting tool in-depth penetration, determining a trochoid path, and determining auxiliary movements.

Abstract: A wafer surface of a semiconductor wafer to be used as a device active region is mirror-polished, and an outer peripheral portion of the mirror-polished wafer surface is further polished, thereby forming an edge roll-off region between the device active region of the wafer surface and a beveled portion formed at the wafer edge. The edge roll-off region has a specific roll-off shape corresponding to an edge roll-off of the oxide film to be formed in a device fabrication process. Thus, a semiconductor wafer can be provided in which reduction in the thickness of an oxide film on the outer peripheral portion of the wafer in a CMP process can be prevented while maintaining high flatness of the wafer surface.

Abstract: A machine for the flow finishing of mechanical pieces is described. The machine has a rotary vat for containing finishing media and a unit for moving pieces having at least one mechanical arm for moving the pieces being machined, said mechanical arm being associated to means for rotating the pieces within the rotary vat, the rotary vat has at least two separate sections formed by concentric circular crowns.

Abstract: In a wafer dicing press for reducing time and cost for wafer dicing and for evenly applying a dicing pressure to a whole wafer, a wafer dicing press includes a support unit supporting a first side of a wafer; and a pressurization device applying a pressure, by dispersing the pressure, to a second side of the wafer so that a laser-scribed layer of the wafer operates as a division starting point. Accordingly, the wafer dicing press reduces laser radiation and pressure-application times for dividing a wafer into semiconductor devices. This increased efficiency is achieved without increasing the likelihood of damaging the wafer.

Abstract: A polishing apparatus used in chemical mechanical polishing device is provided. The polishing apparatus includes a polishing plate for holding a wafer to be polished; a polishing pad arm, one end of the polishing pad arm being fixed, another end of the polishing pad arm holding a polishing pad, and the polishing pad arm driving the polishing pad for moving relatively to the wafer; the polishing pad moving relatively to the wafer with drive from the polishing pad arm, and the polishing pad arm ensuring the polishing pad contacting the wafer during movement; and a slurry supply route for supplying polishing slurry between the polishing pad and the wafer during polishing. The present invention also provides a chemical mechanical polishing device. It makes for realizing miniaturization of a chemical mechanical polishing device, saving polishing slurry and improving utilization rate of the polishing pad in the chemical mechanical polishing device to apply the present invention.

Abstract: Machining of the present invention is machining of polishing work to be polished by movement of polishing sheet relative to work, in a state where polishing sheet is in contact with a surface of work to be polished. In the machining, work is arranged in contact with polishing sheet in a state where work is sandwiched between first simultaneous machining material with hardness lower than that of work, and second simultaneous machining material with hardness higher than that of work, and work is polished by relative movement of polishing sheet from first simultaneous machining material toward second simultaneous machining material.

Abstract: A wafer surface of a semiconductor wafer to be used as a device active region is mirror-polished, and an outer peripheral portion of the mirror-polished wafer surface is further polished, thereby forming an edge roll-off region between the device active region of the wafer surface and a beveled portion formed at the wafer edge. The edge roll-off region has a specific roll-off shape corresponding to an edge roll-off of the oxide film to be formed in a device fabrication process. Thus, a semiconductor wafer can be provided in which reduction in the thickness of an oxide film on the outer peripheral portion of the wafer in a CMP process can be prevented while maintaining high flatness of the wafer surface.

Abstract: A polishing apparatus 100 includes a holding stage 4 that holds a central portion of a back surface of a substrate W, a motor M1 that rotates the holding stage 4, a front surface nozzle 36 that feeds a rinse liquid to a front surface of the substrate W, a back surface nozzle 37 that feeds the rinse liquid to a back surface of the substrate W, a rinse liquid control section 110 that feeds the rinse liquid through the back surface nozzle 37 after a preset time elapses since the start of feeding of the rinse liquid through the front surface nozzle 36 and a polishing head assembly 1A that polishes a peripheral portion of the substrate installed on the holding stage 4 after the rinse liquid control section 110 feeds the rinse liquid to the substrate W.

Abstract: A polishing apparatus includes: a rotatable polishing table for supporting a polishing pad having a polishing surface; a top ring head having a top ring; a top ring head cover surrounding the top ring head; a dresser head having a dresser configured to dress the polishing surface; a dresser head cover surrounding the dresser head; a spray nozzle configured to spray a cleaning liquid onto an upper surface of the top ring and an outer surface of the top ring head cover when the top ring is in the substrate transfer position; and a spray nozzle configured to spray a cleaning liquid onto an outer surface of the dresser head cover when the dresser is in the retreated position.

Abstract: Disclosed is a deburring apparatus. The deburring apparatus includes a transfer module installed on a base to form a transfer path of transferring a workpiece to be deburred, a deburring module provided on the transfer path of the workpiece installed on the base to deburr the workpiece, and a blocking cover installed on the base to reciprocate thereon to selectively prevent the transfer module and the workpiece on the transfer module from being exposed to an outside, and to prevent dust and noise, which are produced when a deburring work is performed for the workpiece by using the deburring module, from being delivered to the outside. The burrs, which are produced when a metallic produce or a non-metallic produce having a 3-D shape is molded or cut, are easily and rapidly removed.

Abstract: A polishing apparatus is used for polishing and planarizing a substrate such as a semiconductor wafer on which a conductive film such as a copper (Cu) layer or a tungsten (W) layer is formed. The polishing apparatus includes a polishing table having a polishing surface, a motor for rotating the polishing table, a top ring for holding a substrate and pressing the substrate against the polishing surface, a film thickness measuring sensor disposed in the polishing table for scanning a surface of the substrate, and a computing device for processing signals of the film thickness measuring sensor to compute a film thickness of the substrate.

Abstract: A complex geographical edge finishing system includes a fixture that holds an external part having a complex three-dimensional edge, a track disposed around the fixture and surrounding the edge of the part held in the fixture, and one or more finishing apparatuses that can sand, polish, buff, paint and/or apply coatings to the complex three-dimensional edge. The finishing apparatuses move about the track such that the three-dimensional edge of the part can be polished. The path of the track can substantially match, mimic or otherwise correspond to the path of the three-dimensional edge, such that special requirements for the finishing apparatuses are not required.

Abstract: A processing apparatus includes a turn table rotatably provided and having an opening; at least five chuck tables provided on the turn table, each chuck table having a holding surface for holding a workpiece; a support bed inserted through the opening of the turn table; four processing unit supporting mechanisms each including a first support column provided on the outside of the turn table, a second support column provided on the support bed, and a support member mounted to the first and second support columns; four processing units respectively supported by the four processing unit supporting mechanisms, the four processing units respectively corresponding to four of the at least five chuck tables; and four feeding units for respectively moving the four processing units in a direction perpendicular to the holding surfaces of the chuck tables.

Abstract: A knife sharpening system mountable in a small vehicle is disclosed. The knife sharpening system includes a grinding device including a motor, and an abrasive member directly connected to the motor without using a reduction device, to reduce loss of power transmitted from a battery to the abrasive member, and a water-proof device for preventing scattering of water and dust caused by rapid rotation of the abrasive member. The abrasive member can rotate using small force in accordance with direct connection of the abrasive member to the motor. Even when the abrasive member rotates at high speed, scattering of water or dust is prevented in accordance with direct connection of the abrasive member to the motor. Accordingly, the abrasive member can be driven using a battery of a small vehicle.

Abstract: A cylindrical grinding and polishing device includes a main body defining a cavity, a polishing device, a cylindrical grinding device, a support device. The polishing device is received in the cavity, and includes a number of polishing wheels positioned along a first direction. The cylindrical grinding device is received in the cavity, and includes a grinding wheel positioned at an end of the cavity along a second direction substantially perpendicular to the first direction. The support device is received in the cavity, and includes a support plate for supporting a work-piece. The support device carries the work-piece to contact the polishing wheels or the grinding wheel.

Abstract: An eyeglass lens processing apparatus includes: a marking unit forming a mark on a lens; a mark position detector detecting a position of the mark; a controller performing roughing process and finishing process after the roughing process; and a positional deviation detector detecting a rotational deviation of the lens after the roughing process. The controller obtains a roughing path which allows, even if the lens rotates with respect to the lens chuck shafts by an angle at the time of the roughing process, the controller to perform the finishing process. The controller obtains an area in a process in which the mark and the target lens shape rotate on a chuck center of the lens chuck shafts by the angle, and computes the roughing path based on the area. The controller performs the roughing process based on the roughing path.

Abstract: A chemical mechanical polishing aqueous dispersion of the invention includes (A) a first water-soluble polymer having a weight average molecular weight of 500,000 to 2,000,000 and including a heterocyclic ring in its molecule, (B) a second water-soluble polymer or its salt having a weight average molecular weight of 1000 to 10,000 and including one group selected from a carboxyl group and a sulfonic group, (C) an oxidizing agent, and (D) abrasive grains, and has a pH of 7 to 12.

Abstract: A manufacturing method of a slider includes steps of: (a) providing a row bar with a plurality of slider elements connecting together; (b) lapping surfaces of the row bar so as to obtain a predetermined requirement; (c) lowering the temperature of the surfaces lapped in the step (b) before and/or during lapping; and (d) cutting the row bar into a plurality of sliders. The present invention can prevent a local high temperature generated on the magnetic head during lapping so that the performance of the magnetic head is improved.

Abstract: A sandblasting apparatus includes a chamber defining a cavity, a support assembly received in the cavity, a first and a second sandblasting assemblies. The support assembly includes a number of pairs of elongated support plates for holding a plate-shaped workpiece therebetween. The support plates are moveable along a vertical direction and a first horizontal direction. The first sandblasting assembly is configured for spraying sand downwardly toward the plate-shaped workpiece so as to cut the plate-shaped workpiece into a number of workpiece strips. The second sandblasting assembly is configured for spraying sand toward the workpiece strips along a second horizontal direction perpendicular to the first horizontal direction so as to cut the workpiece strips into workpiece blocks.

Abstract: Methods of thinning a plurality of semiconductor wafers and apparatuses for carrying out the same are disclosed. A grinding module within a set of grinding modules receives and grinds a semiconductor wafer. A polishing module receives the semiconductor wafer from the grinding module and polishes the wafer. The polishing module is configured to polish the semiconductor wafer in less time than the grinding module is configured to grind the corresponding wafer.

Abstract: A wine-glass polisher includes a base unit having a frustoconical cleaning chamber removably fastened thereto. A steam generator, an air heater and a vacuum pump are each in fluid communication with the cleaning chamber. A portion of the steam and hot air is directed to a channel formed in the chamber outer wall. An annular, U-shaped baffle surrounding the open top is in fluid communication with the channel for projecting the steam and hot air downwardly toward a wine glass below. A remaining portion of the heated air and steam is delivered directly to the upper surface of the base unit to clean and dry the interior surface of the glass. A controller first initiates a polishing cycle by activating the vacuum pump and steam generator. Upon expiration of the predetermined duration, the controller activates the blower to dry the exterior and interior surfaces of the glass.

Abstract: An eyeglass lens processing apparatus for processing a peripheral edge of an eyeglass lens, includes: a processing unit including a plurality of processing tools that process the peripheral edge of the eyeglass lens held by a lens chuck shaft; a calibrating lens; a mode selector that selects a calibration mode; a memory that stores calibration processing data for processing the calibrating lens to a predetermined shape; a detecting unit that includes a tracing stylus that contacts a surface of the calibrating lens which is processed by the processing unit based on the calibration processing data to detect the shape of the processed calibrating lens in the calibration mode; and a calculating unit that obtain calibration data by comparing a detected result by the detecting unit with the calibration processing data in the calibration mode.

Abstract: A coating film peeling apparatus for resin material includes: a peeling cylinder, a peeling roll installed therein with a space for a peeling process along an inner wall of the peeling cylinder, a resistance lid disposed to block a discharge port of the peeling cylinder, and a pressure adjustment part for adjusting an outflow rate and internal pressure of the peeling cylinder. The peeling cylinder is constituted by a polygonal-shaped angular columnar body having, as coating film pass-through holes, rows K of small holes and rows L of small holes and projection rings (angular embossments) provided alternately in multiple rows along a direction perpendicular to a rotating direction of the peeling roll.

Abstract: A large-size synthetic quartz glass substrate is produced by measuring a flatness and parallelism of front and back surfaces of a synthetic quartz glass substrate stock having a diagonal length of at least 1,000 mm, and partially removing raised portions and thick portions of the substrate stock on the basis of the measured data of flatness and parallelism. The removing step includes abrasive working by a first working tool having a diameter of 15-50% of the diagonal length, and abrasive working by a second working tool having a smaller diameter.

Abstract: A polishing machine for lenses with at least one first polishing spindle having a polishing axis (K) and a tool holder disposed on the first polishing spindle for a first polishing disc designed as a tool, further comprising at least one first workpiece spindle having a rotary axis (C) and a workpiece holder disposed on the first workpiece spindle for a lens, wherein the workpiece holder and the tool holder are disposed so as to be movable in translation in the direction of a telescoping axis (Z) disposed parallel to the polishing axis (K) and in the direction of a translation axis (X) disposed at right angles to the rotary axis (C).

Abstract: The invention relates to a hard finish machine (1) for hard finishing of a workpiece (2), comprising at least two different hard finish tools (3, 4) which are arranged on a tool spindle (5), wherein the tool spindle (5) is arranged movable in the direction (Y) of its axis (6) on a tool carrier (7), wherein the tool carrier (7) is translational movable relatively to a machine bed (8) and wherein the hard finish machine furthermore comprises cooling lubricant supplying means (9) for the supply of cooling lubricant to the machining region between the workpiece (2) and the hard finish tool (2, 3).

Abstract: The invention relates to a hard finish machine (1) for hard finishing of a workpiece (2), comprising at least two different hard finish tools (3, 4) which are arranged on a tool spindle (5), wherein the tool spindle (5) is arranged movable in the direction (Y) of its axis (6) on a tool carrier (7), wherein the tool carrier (7) is translational movable relatively to a machine bed (8) and wherein the hard finish machine furthermore comprises cooling lubricant supplying means (9) for the supply of cooling lubricant to the machining region between the workpiece (2) and the hard finish tool (2, 3).

Abstract: Devices, systems and methods for the recycling and recovery of carpet are disclosed herein. Devices, systems and methods for disassembling carpet into the various components used for carpet construction by abrasive removal and separation of components are also disclosed herein.

Abstract: A brake disk braking surface processing device 1 includes a rotation driving device 11 that rotates a brake disk 2, a processing section 12 that processes braking surfaces 4 and 5 of the brake disk 2, and pressing rollers 13 and 14 that press the braking surfaces 4 and 5 of the brake disk 2. The brake disk braking surface processing device 1 includes the pressing rollers 13 and 14 that press the braking surfaces 4 and 5 of the brake disk 2. Therefore, even when tools are pressed against the braking surfaces 4 and 5 in a direction perpendicular to the braking surfaces 4 and 5, deformation of the braking surfaces 4 and 5 of the brake disk 2 can be suppressed with certainty. As a result, processing accuracy of the braking surfaces 4 and 5 of the brake disk 2 can be enhanced.

Abstract: A chemical mechanical polishing apparatus includes a container, a platen, first and second brushes, a polishing pad, a carrier, and a slurry supplier. The container has a bottom wall and a side wall. The side wall has an inwardly-extending upper portion. The platen is supported over the bottom wall. The platen is positioned lower than the inwardly-extending upper portion. The first brush brushes the side wall. The first brush is fixed to a side surface of the platen. The second brush brushes a side surface of the platen. The second brush is fixed to the bottom wall. The polishing pad is attached to the platen. The carrier presses a workpiece to be polished against the polishing pad. The slurry supplier supplies a slurry onto the polishing pad.

Abstract: A polishing apparatus, includes: a motor; and a controlling unit configured to control the motor, wherein: a glass substrate is polished by causing the controlling unit to control a driving of the motor; and the controlling unit executes a controlling operation for controlling a polishing of the glass substrate, based on an electric power or an electric energy required for the driving of the motor.

Abstract: A polishing device includes an outer barrel, an inner barrel, polishing members, and an actuator. The outer barrel defines a chamber and includes inner surfaces substantially parallel to a central axis of the outer barrel. Each of the inner surfaces defines a holding groove for holding a workpiece. The inner barrel is received in the chamber and includes a side surface substantially parallel to the central axis. The side surface defines installation grooves. Each polishing member includes an elastic piece, a polishing motor connected to a bottom of a corresponding installation groove by the elastic piece and received in the corresponding installation groove, and a polishing plate connected to the polishing motor and capable of being driven to rotate by the polishing motor. The actuator is configured for driving the outer barrel to spin and move back and forth along the central axis.

Abstract: Apparatus for removing remnants of debris from the exterior surface of cores includes an assembly moveable from a position spaced from the exterior surface of the cores to a position adjacent the exterior surface. One or more abrasion belts are looped around rotatable shafts which move the belts to abrade the exterior surface of the cores.

Abstract: An apparatus for performing both edge trimming and surface grinding includes two spindles for holding two workpieces, a bridge element laterally movable relative to the spindles, and two grinding wheels coupled to the bridge element. The apparatus may be a surface grinding apparatus that includes a system for enabling the surface grinding apparatus to additionally perform edge trimming. A method for processing the workpieces entails placing the two workpieces on the two spindles of the apparatus, directing the bridge element to move laterally to an edge trimming position to trim the outer edge of one workpiece using one of the grinding wheels, to move laterally to another edge trimming position to trim the outer edge of the other workpiece using one of the grinding wheels, and to move laterally to surface grinding positions to perform surface grinding on both of the workpieces using one or both of the grinding wheels.

Abstract: In accordance to an aspect of the disclosed embodiments, a substrate transport apparatus is provided. The substrate transport apparatus includes a frame defining a chamber, at least one stator module embedded at least partly into a peripheral wall of the chamber, the at least one stator module defining an axis of rotation. The substrate transport apparatus further includes at least one rotor substantially concentrically disposed relative to the at least one stator module about the axis of rotation, the at least one rotor being configured to interface with the at least one stator module and being suspended by a respective one of the at least one stator module substantially without contact within the chamber. The substrate transport apparatus further includes at least one substrate transport arm connected to the at least one rotor and having at least one end effector configured to hold at least one substrate.

Abstract: In order to be able to economically carry out machining of a turbine rotor having blades consisting of different materials, by a high-speed grinding machine, a magazine for the grinding wheels and an automatically operating grinding wheel changer are provided. A plurality of different grinding wheels to be held are made available, which different grinding wheels are adapted to the respective blade materials. A flat-construction coupling is developed in order to be able to couple the grinding wheels with the receiving devices in the grinding wheel changer.

Abstract: A chemical-mechanical polishing apparatus including a table top, a transfer station mounted on the table top, a plurality of polishing stations mounted on the table top, a plurality of washing stations, and a plurality of carrier heads supported by a support member rotatable about an axis. Each washing station is located between a first polishing station and either a second polishing station or the transfer station, and the transfer station and the plurality of polishing stations are arranged at approximately equal angular intervals about the axis.

Abstract: An operating method improves the running behavior of gearwheels negatively noticed upon gearwheel testing and is performed by a burnishing device. The gearwheels that were rejected from the production process may be optimized rapidly and in a targeted way so that they may be returned back into the production process. The tooth flanks of a gearwheel to be machined are, in a first method step, mechanically freed of particles adhering to the surfaces of the tooth flanks or slight protrusions protruding therefrom using a first gearwheel machining tool having a machining wheel coated with an abrasive agent. Subsequently, in a second method step in a second gearwheel machining tool known as a burnishing machine, the gearwheel is chucked between gearwheel-shaped rolling tools, the so-called burnishing wheels, and rolled without material abrasion.

Abstract: A method and system for tunable removal rates and selectivity of materials during chemical-mechanical polishing using a chemical slurry or solution with increased dissolved oxygen content. The slurry can optionally include additives to improve removal rate and/or selectivity. Further selectivity can be obtained by varying the concentration and type of abrasives in the slurry, using lower operating pressure, using different pads, or using other additives in the dispersion at specific pH values.

Abstract: The invention relates to a chemical mechanical polishing system, comprising: at least one polishing platens rotatably installed with a platen pad mounted on its upper surface; a guide rail disposed along a predetermined path; a substrate carrier unit including a rotary union to downwardly press a substrate during a polishing process, the substrate carrier unit moving along the guide rail with loading the substrate; and a docking unit installed to be docked to the substrate carrier unit so as to supply air pressure to the rotary union which downwardly presses the substrate held by the substrate carrier unit, when the substrate carrier unit is positioned over the polishing platen, whereby even though the substrate carrier unit is moved to consecutively polish the substrate on the plural polishing platens, it substantially removes a phenomenon of the twisting of air pressure supply tubes due to the movement of the substrate carrier unit.

Abstract: A method of grinding a wafer, including: a wafer holding step for holding a wafer on a conical holding surface of a chuck table having the holding surface; a rough grinding step for performing rough grinding of the wafer held on the holding surface of the chuck table by positioning a grinding surface of a rough grinding wheel at a predetermined inclination angle relative to the holding surface of said chuck table, and rotating the rough grinding wheel; and a finish grinding step for performing finish grinding of the wafer by positioning a grinding surface of a finish grinding wheel in parallel to the holding surface of the chuck table, and rotating the finish grinding wheel in a grinding region of the grinding wheel in a direction toward the vertex of the contact angle between the grinding surface of the finish grinding wheel and the surface to be ground of the wafer.

Abstract: A substrate transport apparatus including a peripheral wall having an inner surface that defines a substrate transport chamber capable of holding an isolated atmosphere, at least one substantially ring shaped motor having at least one stator module located within the peripheral wall, between the inner surface and an adjacent outer surface of the peripheral wall and at least one rotor suspended substantially without contact within the transport chamber such that a surface of the peripheral wall encompassed by the ring shaped motor is configured for attachment thereto of a predetermined device and at least one substrate transport arm connected to the at least one rotor and having at least one end effector configured to hold at least one substrate.

Abstract: A substrate processing system includes a processing module to process a substrate, a factory interface module configured to accommodate at least one cassette for holding the substrate, a spectrographic monitoring system positioned in or adjoining the factory interface module, and a substrate handler to transfer the substrate between the at least one cassette, the spectrographic monitoring system and the processing module.

Abstract: In the present invention, an insulating material is applied onto a substrate in a coating treatment unit to form a coating insulating film. The substrate is heated in the heating processing unit, whereby the coating insulating film is hardened partway. A brush is then pressed against the front surface of the coating insulating film in a planarization unit and moved along the front surface of the coating insulating film, thereby planarizing the coating insulating film. The substrate is then heated to completely harden the coating insulating film. According to the present invention, the coating film can be planarized without using the CMP technology.

Abstract: A method for manufacturing a microscale optical structure from a wafer, including: preparing the wafer with coatings of desired optical properties by depositing the coatings on an optically finished surface of the wafer; mounting the wafer on a supporting base having a releasable medium, with the optically finished surface adjacent the supporting base to protect the optically finished surface; forming additional surfaces of the optical structure at a desired angle and depth using a grinding blade having a cutting face at the angle, the grinding blade being configured to rotate about an axis; and polishing the additional surfaces of the optical structure by introducing a polishing material onto the wafer and using a polishing means to smooth the additional surfaces.

Abstract: A polishing apparatus, includes: a motor; and a controlling unit configured to control the motor, wherein: a glass substrate is polished by causing the controlling unit to control a driving of the motor; and the controlling unit executes a controlling operation for controlling a polishing of the glass substrate, based on an electric power or an electric energy required for the driving of the motor.