Abstract: A method is provided for removing iron oxide scale from sheet metal and producing a sheet metal surface with rust inhibitive properties. The sheet metal is advanced through the descaling cell and a slurry mixture is propelled against at least one of the top surface and bottom surface of the sheet metal across the sheet metal width as the material is advanced through the descaling cell. The rate of slurry impact against the at least one of the top surface and bottom surface of the sheet metal is controlled in a manner to remove substantially all of the scale from a surface of the sheet metal, and in a manner to create a passivation layer on the descaled surface of the sheet metal. The passivation layer comprises at least one of silicon, aluminum, manganese and chromium and inhibits oxidation of the descaled surface of the processed sheet metal.

Abstract: A surface treatment method that enables a surface of an electrostatic chuck to be smoothed, so as to improve the efficiency of heat transfer between the surface of the electrostatic chuck and a substrate. The electrostatic chuck is provided in an upper portion of a susceptor provided in a chamber of a substrate processing apparatus. In the surface treatment of the electrostatic chuck, a sprayed coating film is formed on the surface of the electrostatic chuck, next the surface of the electrostatic chuck is ground by bringing into contact therewith a grindstone, then the surface of the electrostatic chuck is ground flat by bringing into contact therewith a lapping plate onto a surface of which is sprayed a suspension, and then the surface of the electrostatic chuck is ground smooth by bringing into contact therewith a tape of a tape lapping apparatus.

Abstract: The vibratory polisher system of this embodiment comprises six sub-systems: casting, polish pan assembly, base assembly, vibrating table assy (not a part of this invention), pan bracket assembly, casting circulator system, and horizontal slide assembly. The casting is comprised of an assembly of flat-bottomed rocks cemented into a flat-bottomed disc having a propulsion attachment. The casting circulates in a polish pan having a flexible bottom containing raised areas which put pressure on isolated areas of the casting bottom. There is an area at the pan center that can be raised by means of a gearing system to put pressure on the center area of the casting. The base assembly supports the polish pan and provides the bolt-heads that cause the raised areas in the polish pan. The base assembly also provides attachment points for the pan bracket assemblies which pull the polish pan down onto the bolt-heads thus causing the raised areas in the pan bottom.

Abstract: A multi-head centerless belt grinder for removing material from a workpiece includes a common base and a plurality of grinding heads spaced apart from one another and mounted to the common base. Each grinding head includes a moveable work rest blade, a moveable regulating wheel and a moveable grinding belt positioned by servomotors to centerless grind the workpiece along a common axis of rotation. The grinder is programmable for rapid machine changeover and set-up typically within 2-5 minutes to accommodate a large range of workpiece diameters. This feature results in improved productivity and output as well as greater flexibility for scheduling numerous workpiece diameters within a normal eight-hour work shift. A trough may extend beneath and between each of the grinding heads to more efficiently collect and transfer grinding swarf generated during the grinding process to a filter operable to separate solids within the swarf from coolant.

Abstract: In a machine for processing the edges and outer surfaces of flat workpieces, including a machine frame with a workpiece support surface 12 and at least one dressing head 14 with a work tool carrier, which work tool carrier is rotatably supported on the machine frame for rotation about a first axis perpendicular to the workpiece support surface 12 and is driven by a drive, and which work tool carrier carries at least two work tools 32 rotatably supported eccentrically to the first axis on the work tool carrier each for rotation about a second axis perpendicular to the workpiece support surface 12, and each of which tools is connected with a planet gear 44 which stands in meshing drive engagement with a sun gear 26 coaxial to the first axis so that each circulating work tool carrier defines an effective circle 46 of its work tools 32, with at least two dressing heads 14 being so arranged next to one another that the effective circles 46 of their work tools 32 overlap, with the movement of the work tool carriers

Abstract: A polishing apparatus for polishing semiconductor wafers comprises a main polishing structure, which includes a plurality of polishing tables, a plurality of polishing heads and a plurality of load-and-unload stations, and an add-on polishing structure, which includes an additional polishing table and an additional polishing head. The add-on polishing structure can be attached to the main polishing structure to form a larger polishing structure with the additional polishing table and the additional polishing head.

Abstract: A polishing apparatus includes a cyclic mechanism moving cyclically in a certain direction, a holder moving cyclically by the cyclic mechanism in a direction parallel to an object to be polished, a plurality of polishing pins held on the holder, a magnet member including a first part which is exposed on a front face side of the polishing pin and a second part which is not exposed on the front face side of the polishing pin, a part of the second part being covered with a non-magnetic material, and a polishing member held on the polishing pin by magnetic force of the magnet member and polishing a tip of the object to be polished by the cyclic motion of the cyclic mechanism, wherein a contact area of the polishing member and the polishing pin includes a contact area of the magnet member and the polishing member.

Abstract: A vertically oscillating working device 2 has a body to be oscillated 23 having an inner space that is formed by a cover member 21 and a vehicle wheel 22, which is a body to be worked, and receives working materials 25 in it and also has oscillating means for vertically oscillating the body to be oscillated 23. The working materials 25 are allowed to collide with the vehicle wheel 22 by the oscillation, and thereby the vehicle wheel 22 is worked. With the working device 2, a casting can be oscillated together with hardening materials, and excellent mechanical properties can be uniformly added to a predetermined portion of the casting by the oscillation without changing the position of the casting.

Abstract: A chemical-mechanical polishing apparatus including a table top, a transfer station mounted on the table top, a plurality of polishing stations mounted on the table top, a plurality of washing stations, and a plurality of carrier heads supported by a support member rotatable about an axis. Each washing station is located between a first polishing station and either a second polishing station or the transfer station, and the transfer station and the plurality of polishing stations are arranged at approximately equal angular intervals about the axis.

Abstract: In a grinding machine with a grinding means for machining a workpiece surface which can be moved in a direction of conveyance relative to the grinding means and is arranged in a machining plane, wherein the grinding means has a large number of grinding heads with grinding elements (8) rotating about a respective shaft, and the grinding heads can be moved by means of an endlessly revolving transporting means (1) in a grinding region (3) by deflection about deflection rollers via rectilinear portions in a grinding region at an angle to the direction of conveyance, improved grinding results are facilitated as a result of increased degrees of freedom in the setting of the grinding parameters without high costs for drive motors if a drive means (13), with which the grinding elements (8) are driven in rotation by a common motor provided for rotationally driving these grinding elements (8), is provided for at least one group of a plurality of grinding elements (8), and in that the drive means (13) consists of a flex

Abstract: A chemical-mechanical polishing apparatus including a table top, a transfer station mounted on the table top, a plurality of polishing stations mounted on the table top, a plurality of washing stations, and a plurality of carrier heads supported by a support member rotatable about an axis. Each washing station is located between a first polishing station and either a second polishing station or the transfer station, and the transfer station and the plurality of polishing stations are arranged at approximately equal angular intervals about the axis.

Abstract: [Problem] To provide a blasting device for steel pipe inner surface with improved blast performance as well as the capability to sufficiently blast the inner surface of the steel pipe from the beginning portion to the end portion; a blasting method for steel pipe inner surface; and a method for producing a steel pipe with excellent inner surface texture. [Solution] A blasting device for blasting steel pipe inner surface includes a tubular carrier fluid inflow unit 21 connected to one end of a horizontal steel pipe 6, and a negative-pressure suction unit connected to the other end of the steel pipe 6, and is characterized in that a polishing material or a wiping material 5 is injected horizontally into the carrier fluid inflow unit along with a carrier fluid 20 from a hole 19 formed in the edge face of the tubular carrier fluid inflow unit 21.

Abstract: A chemical mechanical polishing aqueous dispersion of the invention includes (A) a first water-soluble polymer having a weight average molecular weight of 500,000 to 2,000,000 and including a heterocyclic ring in its molecule, (B) a second water-soluble polymer or its salt having a weight average molecular weight of 1000 to 10,000 and including one group selected from a carboxyl group and a sulfonic group, (C) an oxidizing agent, and (D) abrasive grains, and has a pH of 7 to 12.

Abstract: The present disclosure is directed to method, apparatus, and system for uniformly supporting flexible surface modifying articles during surface modification as well as enabling replacing and repositioning thereof for improving their useful service life as well as improving dust and debris control management.

Abstract: A pressure control system that controls the pressure of a fluid in a plurality of zones includes a distribution manifold, at least one main manifold connected to the distribution manifold, and at least one disposable manifold connected to the distribution manifold and the main manifold. The disposable manifold is adapted to be replaced independent of the distribution manifold and the main manifold, and is connected to each zone and to at least one vacuum source. The distribution manifold distributes the fluid to the plurality of zones, so as to cause flow of the fluid into and out of a measurement chamber located within each zone. The main manifold includes, for each zone, a pressure sensor configured to measure pressure in the measurement chamber in that zone, and a control valve configured to regulate the flow of the fluid through that zone.

Abstract: A bowling ball surface treatment device for abrading, polishing or cleansing a bowling ball includes a housing, a ball displacing unit movably mounted to the housing for holding the bowling ball in a rotatable manner and for reciprocatingly displacing the bowling ball between a temporary waiting region and a surface treatment region, a surface treatment disc for supporting and spinning the bowling ball in the surface treatment region, the surface treatment disc having a surface treatment element for making frictional contact with the bowling ball, a temporary support disc for temporarily supporting the bowling ball in the temporary waiting region when the bowling ball is moved out of the surface treatment region, and a disc drive unit for rotatingly driving the surface treatment disc and the temporary support disc.

Abstract: The present invention is a method for producing a semiconductor wafer, comprising: at least a double-side polishing step; and a chamfered-portion polishing step; wherein as a first chamfered-portion polishing step, at least, a chamfered portion of the wafer is polished so that a chamfered surface of each of main surface sides in the chamfered portion is in contact with a polishing pad; then the double-side polishing is performed; as a second chamfered-portion polishing step, at least, the chamfered portion of the wafer is polished so that an end surface of the chamfered portion is in contact with a polishing pad and so that both main surfaces of the wafer are not in contact with a polishing pad. Thereby, when a semiconductor wafer is produced, scratch and such generated in the chamfered portion in a double-side polishing process can be removed and, excessive polishing in a peripheral portion of a main surface can be prevented from being caused in polishing a chamfered portion.

Abstract: In a scrubber adapted to clean a semiconductor wafer, the torque of a brush rotation motor is monitored while a scrubber brush is in contact with the wafer and is being rotated by the motor. The position of the brush relative to the wafer may be adjusted based on the monitored torque to regulate the pressure applied to the wafer by the brush. Open loop positioning or closed loop control may be employed.

Abstract: A wafer transferring apparatus includes a top ring (60) for holding a wafer (W) on a lower end surface thereof and a pusher mechanism (10) for transferring the wafer (W) to and from the top ring (60). The pusher mechanism (10) has a wafer rest (40a) for placing the wafer (W) thereon and is arranged to allow the wafer (W) released from the lower end surface of the top ring (60) to be seated on the wafer rest (40a). The pusher mechanism (10) also has a sensor mechanism (50) for detecting when the wafer (W) is properly seated on the wafer rest (40a). The sensor mechanism (50) is adapted to block sensor light emitted from a light-emitting device (51) by the wafer (W) seated on the wafer rest (40a).

Abstract: An eyeglass lens processing system includes a main processing apparatus having a first lens chuck, a roughing tool, a first bevel-finishing tool, a lens edge measuring unit, and a first computing unit to obtain roughing data and first bevel-finishing data, and a sub processing apparatus, and having a second lens chuck, and a second bevel-finishing tool having a smaller diameter than the first bevel-finishing tool. The main processing apparatus has a means to set whether processing of the lens is performed by the first and second bevel-finishing tools, a transmission unit that transmits at least one of second bevel-finishing data or data for obtaining the second bevel-finishing data to the sub processing apparatus, a first control unit that performs roughing based on the roughing data and bevel-finishing based on the first bevel-finishing data. The sub processing unit has a second control unit that performs bevel-finishing based on the second bevel-finishing data.

Abstract: A polishing machine for optical elements, comprising:—a spindle arranged to rotationally drive an optical element;—a polishing tool mobile relative to the spindle; wherein the polishing machine further comprises a platform mounted on top of a work chamber, the work chamber comprising the spindle, and the platform holding a body on which is mounted the polishing tool.

Abstract: A wafer thinning system and method are disclosed that includes grinding away substrate material from a backside of a semiconductor device. A current change is detected in a grinding device responsive to exposure of a first set of device structures through the substrate material, where the grinding is stopped in response to the detected current change. Polishing repairs the surface and continues to remove an additional amount of the substrate material. Exposure of one or more additional sets of device structures through the substrate material is monitored to determine the additional amount of substrate material to remove, where the additional sets of device structures are located in the semiconductor device at a known depth different than the first set.

Abstract: There is provided a surface treated product that moves relatively in a fluid, wherein a surface of the surface treated product has continuous dimples, each dimple having a diameter of 10 to 2500 ?m and a depth of 50 ?m or less. The surface treated product significantly reduces resistance of a fluid to an object in the fluid, and significantly improves a flow state of the fluid.

Abstract: The present invention provides a polishing head 1 comprising a carrier 3, a guide ring 4, a dress ring 5, and a head body 2, wherein the head body 2 is rotatable, and holds the carrier 3, the guide ring 4, and the dress ring 5; the head body 2 has a reversed-bowl shape and has a hollow 8; the dress ring, and at least the guide ring or the carrier are held by being coupled to a lower brim of the head body via a diaphragm 6; the hollow of the head body is sealed. During polishing, the pressure of the sealed hollow is adjusted with a pressure regulating mechanism 9 communicating with the hollow, thereby elastically deforming the diaphragm. As a result, a wafer W can be polished while the wafer and the dress ring are pressed with a given pressing force against a polishing pad 11 on a turn table 12 with rotating the wafer held by the carrier and the dress ring.

Abstract: An embodiment relates generally to a chemical mechanical polishing apparatus. The apparatus includes a platen adapted to receive a wafer to be chemical-mechanically polished and a polishing pad configured to polish the wafer. The apparatus also includes a slurry feed line configured to provide slurry to the polishing pad and at least one slurry dispensing outlet coupled to the slurry feed line and configured to dispense slurry as a mist of small droplets ranging from submicron to about 500 microns.

Abstract: An abrasive element has a first surface region which coincides with an enveloping surface of the element, and a second surface region which does not. When the element is pressed against a planar surface, part of the second surface region, which is provided with abrasive material, comes into contact with the surface. Also disclosed are a system comprising at least two part-elements which can be connect to form an abrasive element, and methods for making and using the abrasive element.

Abstract: A polishing apparatus includes a polishing pad for polishing a wafer and a polishing head for holding the wafer. The polishing head includes a retainer ring, a membrane sheet, and a head body. The retainer ring retains the wafer in a horizontal direction. The membrane sheet depresses the wafer to the polishing pad. The head body supports the retainer ring and the membrane sheet. The retainer ring includes a fixed retainer ring and a released retainer ring. The released retainer ring is interposed between the inner periphery of the fixed retainer ring and the periphery of the wafer to retain the wafer in the horizontal direction.

Abstract: A retaining ring for a chemical mechanical polishing tool comprises a pad side surface. The pad side surface has an edge portion adjacent its outer circumference. A surface normal of the edge portion and a surface normal of the pad side surface include an acute angle. Additionally, or alternatively, the retaining ring may comprise at least one groove extending from an inner circumference of the pad side surface to the outer circumference of the pad side surface. The groove comprises at least one edge portion adjacent the pad side surface. A surface normal of the at least one edge portion and a surface normal of the pad side surface include an acute angle.

Abstract: A system and a method of operating a chemical mechanical polishing (CMP) system comprises a slurry delivering unit configured for locally varying the supply of slurry while polishing the substrate. To this end, the slurry delivering unit may comprise at least one slurry outlet over a polishing pad of the CMP system, wherein the at least one slurry outlet is controllably movable to distribute slurry over the polishing pad.

Abstract: The spacing between an abrasive type surface polishing tool and the surface of the work piece that is being polished is controlled dynamically so that variations in the area of the abrasive pad in contact with the surface of the work piece compensated, thereby eliminating size variations in this contact area and the accompanying variations in material removal that produce surface height fluctuations.

Abstract: An apparatus and method of removing scale from the surfaces of processed sheet metal employs a scale removing medium propelled by counter-rotating pairs of wheels positioned in close proximity to the sheet metal surfaces.

Abstract: An automated method for reconditioning a plurality of digital discs within a reconditioning apparatus is disclosed. The method comprises holding the digital discs in a load area, and then transferring each of the digital discs from the load area to at least one workstation with a disc transfer mechanism. The method also comprises reconditioning each of the digital discs transferred to the workstation with at least one worktool operable to remove a portion of the protective coating of each of the digital discs without removal of the data underlying the protective coating. The method further comprises transferring each of the digital discs from the workstation to an unload area with the disc transfer mechanism, and then holding the digital discs in the unload area for manual retrieval. Advantageously, the digital discs may be automatically reconditioned within the reconditioning apparatus without manual manipulation of the digital discs during the reconditioning process.

Abstract: A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished.

Abstract: The invention relates to a grinding machine for the edges of spectacles lenses, comprising at least one grindstone and one driven shaft for holding the spectacles lenses, said shaft being able to move radially and axially relatively to the grindstone. The inventive grinding machine comprises at least one operational support which is placed in such a way that it can rotate coaxially on a spindle designed for a shaft of the grinding machine or on at least one pivoting lever which is placed in a non-aligned position on a spindle designed for a shaft of the grinding machine, said operational support being free to pivot in the space between the grindstone and the shaft holding the spectacles glasses.

Abstract: In a first aspect, a first apparatus is provided for a chemical mechanical polishing (CMP) process. The first apparatus includes (1) a rotatable member; (2) an end effector adapted to receive and retain a conditioning disk; and (3) an elastic device disposed between the rotatable member and the end effector. The elastic device is (a) adapted to rotate the end effector via a torque from the rotatable member, and (b) flexibly extensible so as to impart a force to the end effector while permitting the end effector to deviate from a perpendicular alignment with the rotatable member in order for a conditioning surface of the conditioning disk to conform to an irregular polishing surface of a pad being conditioned. Numerous other aspects are provided, including methods and apparatus for using liquid or gas to deter polishing slurry or debris from entering the conditioning head.

Abstract: An end face polishing apparatus with improved polishing precision regardless of the length of ferrules when end faces of the ferrules are polished is provided. In an end face polishing apparatus polishing a rod-shaped member mounted at a polishing fixture by pressing the rod-shaped member against a lapping member on a lapping machine provided on a surface plate that is supported at the main body of the apparatus to rotate and rock, there are a plurality of rod-shaped guide members provided at the polishing fixture radially outwardly projecting and a tubular member capable of supporting the polishing fixture through the guide members on the surface plate. In this way, the guide members at the polishing fixture and the tubular member abut against each other so that the movement of the polishing fixture in the pressing direction is restricted.

Abstract: A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated, non-continuous polishing pad oriented at an angle relative to the horizontal to allow planarizing liquids and materials removed from the microelectronic substrate to flow off the polishing pad under the force of gravity. Two such polishing pads can be positioned opposite each other in a vertical orientation and can share either a common platen or a common substrate carrier. The polishing pads can be pre-attached to both a supply roll and a take-up roll to form a cartridge which can be easily removed from the apparatus and replaced with another cartridge.

Abstract: The invention relates to a grinding machine for the edges of spectacles lenses, comprising at least one grindstone and one driven shaft for holding the spectacles lenses, said shaft being able to move radially and axially relatively to the grindstone. The inventive grinding machine comprises at least one operational support which is placed in such a way that it can rotate coaxially on a spindle designed for a shaft of the grinding machine or on at least one pivoting lever which is placed in a non-aligned position on a spindle designed for a shaft of the grinding machine, said operational support being free to pivot in the space between the grindstone and the shaft holding the spectacles glasses.

Abstract: Methods, apparatuses and substrate assembly structures for mechanical and chemical-mechanical planarizing processes used in the manufacturing microelectronic-device substrate assemblies. One aspect of the invention is directed toward a method for planarizing a microelectronic-device substrate assembly by removing material from a surface of the substrate assembly, detecting a first change in drag force between the substrate assembly and a polishing pad indicating that the substrate surface is planar, and identifying a second change in drag force between the substrate assembly and the polishing pad indicating that the planar substrate surface is at the endpoint elevation. After the second change in drag force is identified, the planarization process is stopped.

Abstract: An end face polishing apparatus has a support member mounted on the main body for undergoing revolving and rotational movement during a polishing operation, a tubular member mounted on the support member for rotation and revolving movement therewith, a lapping member mounted on the support member for rotation and revolving movement therewith, and a polishing fixture for supporting at least one workpiece having an end face for pressure contact with the lapping member to polish the end face of the workpiece during rotation and revolving movement of the lapping member. The polishing fixture has radially outwardly projecting guide members for contacting the tubular member to limit the amount of polishing of the end face of the workpiece in a pressing direction during rotation and revolving movement of the lapping member.

Abstract: An apparatus and associated methods for polishing semiconductor wafers and other workpieces that includes polishing surfaces located at multiple polishing stations. Multiple wafer heads, preferably at least one greater in number than the number of polishing stations, can be loaded with individual wafers. The wafer heads are suspended from a rotatable support, which provides circumferential positioning of the heads relative to the polishing surfaces, and the wafer heads move linearly with respect to the polishing surface, thus providing relative linear motion between the wafer and the polishing station. A load/unload station may be located at a position symmetric with the polishing surfaces. The rotatable support can simultaneously position one of the heads over the load/unload station while the remaining heads are located over polishing stations for wafer polishing so that loading and unloading of wafers can be performed concurrently with wafer polishing.

Abstract: Conditioning apparatuses and methods for conditioning polishing pads used for mechanical and/or chemical-mechanical planarization of micro-device workpieces are disclosed herein. In one embodiment, a method for conditioning a polishing pad used for polishing a micro-device workpiece includes monitoring surface condition in a first region of the polishing pad and adjusting at least one of a rotational velocity of the polishing pad, a downforce on the polishing pad, and a sweep velocity of the end effector in response to the monitored surface condition to provide a desired texture in the first region. In another embodiment, an apparatus for conditioning the polishing pad includes an end effector, a monitoring device, and a controller operatively coupled to the end effector and the monitoring device. The controller has a computer-readable medium containing instructions to perform a conditioning method, such as the above-mentioned method.

Abstract: A stacked three head finishing apparatus is provided. The apparatus includes a base mountable to a floor, a first head mounted to the base, a second head mounted to the base above the first head, and a third head mounted to the base above the second head. Each of the first, second, and third heads includes a rotatable wheel. A motor imparts rotation to the wheel which may then be used for finishing operations. The height of each head above the floor and the position relative to one another is pre-selected to ensure that all of the heads are within reach of a robot arm and to ensure that nothing will interfere with the movement of the robot arm.

Abstract: A fixture for an automated connectorization system for processing fiber optic connectors. The fixture can include a first and second portions configured to hold the connectors. The first portion can include a plurality of clamps, each clamp being configured to clamp onto one of the connectors. The second portion can include a plurality of nests, each nest including an aperture configured to allow a ferrule of one of the connectors to extend therethrough. The second portion of the fixture is coupled to the first portion.

Abstract: The present invention relates to a polishing apparatus for polishing a workpiece such as a semiconductor wafer. The polishing apparatus has a processing section including a polishing section (1) for polishing a semiconductor wafer (6) and a cleaning section (10) for cleaning a polished semiconductor wafer, a receiving section (40) for supplying a semiconductor wafer (6) to be polished to the processing section and receiving a polished semiconductor wafer (6), and a cleaning chamber (20) disposed between the processing section and the receiving section and defined by partitions (102, 103) with shutters (22, 24) which separate the processing section and the receiving section from each other.

Abstract: A cutter foe making optical lenses has a main member with a connector base and a grinding assembly at an opposite ends thereof. The grinding assembly has two fixed devices having a cutting portion at a distal end thereof respectively and two movable devices having a grinding portion at a distal end thereof respectively. The grinding portions are finer than the cutting portions. An elastic member has opposite ends resting on the main member and the movable device to urge the movable device for movement along an axial orientation of the main member. A key is provided between the movable device and the main member to restrict the movable device from movement, whereby the grinding portion of the movable device is higher than the cutting portions of the fixed devices by the elastic member urging the movable device outward and the key fixing the movable device thereat.

Abstract: An apparatus for resurfacing and buffing the playable surface of an optical disc is provided. The apparatus includes a reciprocally mounted disc support having a rotatably mounted platen or turntable on which a disc may be received, a resurfacing wheel, a buffing wheel, and a power-driven and timed drive assembly for driving the disc support member between a loading/unloading station, a resurfacing station for engagement with the resurfacing wheel, and a buffing station for engagement with a buffing wheel.

Abstract: A workpiece such as a semiconductor wafer is polished by pressing the workpiece against a polishing surface under a predetermined pressure. A polished surface of the workpiece is processed by pressing the workpiece against a processing surface under a predetermined pressure while the processing surface makes circulatory translational motion along a predetermined path. The processing surface comprises a surface of a polishing cloth or a surface of an abrading plate, and the polished surface of the workpiece is further polished or cleaned.

Abstract: An end face polishing method provides an end face polishing apparatus having a main body, a jig board mounted on the main body and supporting at least one workpiece, a polishing board mounted on the main body for undergoing rotational and revolving movements relative to the main body, and abrasive members each removably connectable to the polishing board for rotational and revolving movements therewith. Each of the abrasive members has an abrasive surface with a hardness that is either higher or lower than the hardness of the abrasive surface of the others of the abrasive members. An end face of a workpiece is successively brought into pressure contact with the abrasive surface of each of the abrasive members in descending order of hardness of the abrasive surfaces while rotating and revolving the polishing board to thereby successively polish the end face of the workpiece.

Abstract: A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a turntable with an abrasive cloth mounted on an upper surface thereof and a top ring positioned above the turntable for supporting the workpiece to be polished and pressing the workpiece against the abrasive cloth, and a cleaning section disposed in the second chamber and cleaning the workpiece which has been polished. The polishing apparatus further includes a transferring device for transferring the workpiece which has been polished from the polishing section to the cleaning section through an opening and an exhaust system for exhausting ambient air from each of the polishing section and cleaning section separately and independently.